CN117359483A

CN117359483A - Four curved equal-height microcrystal cover plate polishing equipment

Info

Publication number: CN117359483A
Application number: CN202311567440.0A
Authority: CN
Inventors: 陈宁; 肖子健; 王孟杰
Original assignee: BOE Technology Group Co Ltd; BOE JNTC Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; BOE JNTC Technology Co Ltd
Priority date: 2023-11-22
Filing date: 2023-11-22
Publication date: 2024-01-09

Abstract

The four-curve equal-height microcrystalline cover plate polishing device comprises: the vacuum system is used for providing negative pressure and fixing the product on the surface of the jig through the negative pressure; the grinding system comprises a jig and a grinding piece positioned above the jig, wherein the jig and the grinding piece rotate relatively during grinding, and the grinding piece rotates automatically. The polishing device provided by the invention has the advantages that the grinding piece and the jig product rotate positively and reversely during grinding, and the grinding piece rotates simultaneously, so that the grinding mode is more beneficial to the concave surface of the four-curve equal-height microcrystalline cover plate, and the four dead angles can be ground, so that the surface of the product has no orange-peel defect and no poor PV value.

Description

Four curved equal-height microcrystal cover plate polishing equipment

Technical Field

The invention relates to polishing equipment in the cover plate industry, in particular to large disc polishing equipment suitable for high microcrystalline cover plates such as four curved plates and the like.

Background

The polishing equipment of the large disc is initially used for polishing a 2.5D cover plate, but with the development of glass cover plate technology and the improvement of the attractive requirements of people on a touch screen, a 3D mobile phone display screen appears, the cover plate also appears in a 3D form, with the higher requirements of people on the falling resistance and the vision of the cover plate, a four-curve equal-height microcrystalline cover plate also appears, and the cover plate of the type needs to be subjected to surface polishing after being subjected to hot working, so that orange marks and scratches on the surface are removed.

The polishing of the existing equipment of the high microcrystalline cover plate with the four curves and the like uses a hairbrush slightly larger than the width of the cover plate, the hairbrush is pressed down on the concave side of the cover plate, the jig and a product are parallel to the hairbrush for revolution polishing, the surface hardness of the material is 10 times higher than that of a normal product because the product is microcrystalline, the inner R angles of the high short side and the four angles with the four curves and the like are very small, and the polishing is difficult to achieve the position, so that orange marks are easy to remain at the corresponding position and the PV value is poor, and a novel polishing equipment is needed for solving the problem to meet the use requirement.

Disclosure of Invention

In order to solve or at least alleviate the technical problems, the invention provides polishing equipment for high microcrystalline cover plates such as four curves and the like, so that a brush of a grinding piece can grind four corners of a product, and the surface of the product has no defects of poor orange peel and poor PV value.

The invention relates to a four-curve equal-height microcrystalline cover plate polishing device, which comprises: the vacuum system is used for providing negative pressure and fixing the product on the surface of the jig through the negative pressure; the grinding system comprises a jig and a grinding piece positioned above the jig, wherein the jig and the grinding piece rotate relatively during grinding, and the grinding piece rotates automatically.

In one embodiment, the jig and the grinding member perform intermittent forward and reverse relative rotation during grinding, and the grinding member itself performs intermittent rotation.

In one embodiment, the grinding system comprises a pneumatic transmission device, a motor, a grinding piece adapter plate, a grinding piece and a jig, wherein the grinding piece adapter plate can move downwards under the action of the pneumatic transmission device, the grinding piece is fixed below the grinding piece adapter plate, the grinding piece is electrically connected with the first motor and performs autorotation under the action of the first motor, and the jig performs circumferential movement along the center of the polishing equipment under the action of the second motor.

In one embodiment, the vacuum system comprises:

the negative pressure pump is used for generating negative pressure so as to fix the product on the surface of the jig;

the negative pressure vacuum cavity is connected with the negative pressure pump and the bottom plate through pipelines respectively; and

the bottom plate is provided with a preformed hole for connecting an adsorption groove of the jig;

and the cavity body is formed in the center of the bottom plate and is connected with the negative pressure vacuum cavity body through a pipeline.

In one embodiment, the polishing apparatus further comprises a polishing liquid circulation system including:

a tank body tub for accommodating a polishing liquid;

the diversion center is respectively connected with the tank body barrel through pipelines and diverts the polishing solution to the surface of the product;

and the reflux groove is used for recycling the polishing solution remained on the surface of the product and is communicated with the tank body barrel through a reflux pipeline.

In one embodiment, the polishing solution circulation system further comprises a polishing solution receiving disc, the polishing solution receiving disc is communicated with the distribution center through a pipeline, the polishing solution receiving disc is fixedly connected with the corresponding polishing member adapter plate, through holes for passing polishing solution are formed in the polishing solution receiving disc, and the through holes of the polishing solution receiving disc correspond to the through holes in the polishing member adapter plate one by one.

In one embodiment, the slurry receiving plate is coupled to the first motor via a split coupling.

In one embodiment, the jig is mounted on the bottom plate in a double-row concentric circle mode, a second motor is arranged at the bottom of the bottom plate, and the bottom plate, the jig and products in the jig perform circular motion around the center of the polishing device under the action of the second motor.

In one embodiment, the bottom plate is provided with a blocking device, and the height of the blocking device is higher than that of the jig, so that the inflow amount of the polishing solution on the bottom plate is larger than the outflow amount of the polishing solution, and the product is soaked in the polishing solution.

In one embodiment, the polishing solution receiving disc and the polishing member adapter plate are respectively provided with a plurality of polishing solution receiving discs, the polishing solution receiving discs are fixedly connected with the polishing member adapter plate in one-to-one correspondence, and the polishing solution receiving discs and the polishing member adapter plate are uniformly distributed along the circumferential direction of the polishing equipment.

In one embodiment, the bottom plates are provided with a plurality of bottom plates, the bottom plates are in one-to-one correspondence with the grinding piece adapter plates, each bottom plate is provided with a baffle, and gaps are formed between adjacent baffles to allow the polishing solution to pass through.

In one embodiment, the surface of the jig is provided with an adsorption groove, and the adsorption groove is in a double-king shape.

In one embodiment, the grinding part is a brush, a group of brushes are uniformly arranged below the grinding part adapter plate, and a plurality of jigs are correspondingly arranged on each bottom plate.

In one embodiment, the polishing solution circulation system further comprises a filter, the filter is communicated with the reflux groove, and the refluxed polishing solution is recovered to the tank body barrel after being filtered by the filter.

In one embodiment, the grinding member is removably coupled to the grinding member adapter plate.

In one embodiment, the polishing apparatus further comprises a frame for supporting the polishing apparatus.

In one embodiment, the brush is detachably connected to the grinding member adapter plate through a velcro.

In an embodiment, the polishing solution circulation system comprises 12 polishing solution receiving discs, the 12 polishing solution receiving discs are uniformly distributed along the circumference of the polishing device, the 12 polishing solution receiving discs are fixedly connected with 12 polishing member adapter plates in one-to-one correspondence, each polishing solution receiving disc is provided with 2 through holes, the through holes of the polishing solution receiving discs are in one-to-one correspondence with the through holes on the polishing member adapter plates, each polishing member adapter plate is correspondingly provided with one polishing member, a bottom plate is correspondingly arranged below each polishing member adapter plate, 8 jigs are correspondingly arranged on each bottom plate, and each jig is correspondingly provided with one product.

In one embodiment, each polishing solution receiving disc is correspondingly connected with a first motor through a separate coupler, a plurality of bottom plates are uniformly distributed along the circumference of the polishing equipment to form a chassis, a second motor is arranged under the chassis, and the chassis drives the jig and the product to do circular motion under the action of the second motor.

Compared with the prior art, the four-curve equal-height microcrystal cover plate polishing device has the following advantages:

1. the grinding part and the jig product rotate positively and reversely during grinding, and the grinding part rotates simultaneously, so that the grinding mode is more beneficial to the concave surface of the four-curve equal-height microcrystalline cover plate, the hairbrush can deform and stretch into four dead corners on the surface of the product, the hairbrush can grind into the four dead corners of the product, the surface of the product is free of orange peel defect and poor PV value, and meanwhile, the processing efficiency of the product is increased by 50%;

2. the product is always soaked in the polishing solution in the grinding process, so that the dry grinding generated in a non-soaking mode is solved, the grinding of the surface of the product piece is more uniform, and the surface scratch of the product is reduced;

3. the polishing mode is changed from parallel to spiral, so that polishing can be more uniform at the short side of the product, thereby solving the problem of poor orange-peel and PV value of the product and improving the yield of the product;

4. the automatic constant-proportion pressing machine can automatically finish equal-proportion pressing, prolongs the service life of grinding parts, such as a hairbrush, reduces the consumable cost of products, increases the competitiveness of the products, and simultaneously enables the hairbrush to deform and stretch into four dead corners on the surface of the products so that the grinding is more uniform.

The above technical features can be combined in various technically feasible ways to create new embodiments as long as the object of the invention is achieved.

Drawings

The invention will be described in more detail hereinafter on the basis of an embodiment which is only non-limiting and with reference to the accompanying drawings. Wherein:

FIG. 1 shows a schematic top view of a four curve isomicrocrystalline cover plate polishing apparatus according to the present invention;

FIG. 2 shows a schematic top view of the vacuum system of the polishing apparatus of FIG. 1;

FIG. 3 is a schematic top view showing a polishing liquid circulation system of the polishing apparatus of FIG. 1;

FIG. 4 is a schematic view showing the structure of an abrasive system of the polishing apparatus of FIG. 1;

fig. 5 shows a schematic diagram of a skeleton structure of the polishing apparatus in fig. 1.

In the drawings, like components are denoted by like reference numerals. The figures are not drawn to scale.

Wherein, the reference numerals are as follows:

1. a vacuum system; 11. a negative pressure pump; 12. a negative pressure pipeline; 13. a negative pressure vacuum chamber; 14. a partial pressure pipeline; 15. a bottom plate; 16. a preformed hole; 17. a return line; 18. a reflow center; 19. a filter; 2. a polishing solution circulation system; 21. a tank body barrel; 22. a liquid pump; 23. a return line; 24. a transmission pipeline; 25. a split center; 26. a shunt pipeline; 27. a polishing liquid receiving plate; 28. blocking the polder; 29. a reflux groove; 3. a grinding system; 31. a pneumatic transmission device; 32. a first motor; 33. a split coupling; 35. an abrasive article adapter plate; 36. a grinding member; 37. a jig; 4. a skeleton; 41. a cylinder; 42. a chassis; 43. a cross beam; 44. a second motor; 45. and a control panel.

Detailed Description

The invention will be described in further detail with reference to the drawings and the specific examples. It should be noted that, as long as no conflict is formed, each embodiment of the present invention and each feature of each embodiment may be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

The parts not described in the invention can be realized by adopting or referring to the prior art.

The existing polishing method for the high microcrystalline cover plate product with the four curves is to use a hairbrush with the width slightly larger than that of the cover plate, press down on the concave side of the cover plate, and polish the jig and the product in a revolution manner parallel to the hairbrush, wherein the surface hardness of the material is 10 times higher than that of a normal product because the product is microcrystalline, and the high short side with the four curves and the inner R angle of the four corners are very small and are difficult to polish to the position, so that orange marks are easy to remain at the corresponding positions and the PV value is poor.

As shown in fig. 1, the four-curve equal-height microcrystal cover plate polishing device comprises a vacuum system 1 and a grinding system 3, wherein the vacuum system 1 is used for providing negative pressure and fixing a product on the surface of a jig 37 through the negative pressure; the grinding system 3 comprises a jig 37 and a grinding piece 36 positioned above the jig, wherein the jig 37 and the grinding piece 36 rotate relatively during grinding, and the grinding piece rotates.

According to the polishing equipment disclosed by the invention, the grinding part and the jig product relatively rotate during grinding, and the grinding part rotates at the same time, so that the grinding mode is particularly beneficial to grinding the concave surfaces of the high microcrystalline cover plates such as the four curves and the like, and the four dead angles of the product can be ground, so that the phenomenon of poor orange peel and poor PV value on the surface of the product is avoided.

In an alternative embodiment, as shown in fig. 4, the polishing system 3 includes a pneumatic transmission device 31, a motor, a polishing member adapter plate 35, a polishing member 36 and a jig 37, where the polishing member adapter plate 35 can move downward under the action of the pneumatic transmission device 31, the polishing member 36 is fixed under the polishing member adapter plate 35, the polishing member 36 is electrically connected to the first motor 32 and rotates under the action of the first motor 32, and the jig 37 moves (revolves) circumferentially along the center of the polishing apparatus under the action of the second motor, so that the polishing member 36 grinds at a fixed point position, and the polishing member 36 is electrically connected to the first motor 32 and rotates under the action of the first motor.

Specifically, when the polishing system is started, the pneumatic transmission device 31 starts to work, and controls the whole polishing system to perform polishing by pressing down in equal proportion, so that the service life of the polishing piece 36 can be prolonged, and meanwhile, the product can be tightly attached to the surface of the jig 37, and the stress is uniform. The first motor 32 drives the grinding member adapter plate 35 to drive the grinding member 36 to perform autorotation, and meanwhile, the jig 37 performs circumferential movement along the center of the polishing system under the action of the second motor 44, so that during grinding, the grinding member 36, the jig 37 and the product perform forward and reverse relative rotation, and simultaneously, the grinding member 36 performs autorotation.

As shown in fig. 2, in an alternative embodiment, the vacuum system 1 comprises:

a negative pressure pump 11 for generating negative pressure to fix the product on the surface of the jig 37;

the negative pressure vacuum cavity 13 is respectively connected with the negative pressure pump 11 and the bottom plate 15 through a negative pressure pipeline 12, and the bottom plate 15 is provided with a preformed hole 16 above for connecting an adsorption groove of the jig 37; and

and the reflux center 18 is a cavity formed in the center of the bottom plate and is connected with the negative pressure vacuum cavity 13 through a reflux pipeline 17.

Specifically, the negative pressure pump 11 is used for generating negative pressure, the negative pressure is transmitted to the negative pressure vacuum cavity 13 through the negative pressure pipeline 12 and is split in the negative pressure vacuum cavity 13, the negative pressure is transmitted to the bottom plate through the partial pressure pipeline 14, the bottom plate 15 is provided with the preformed hole 16, and the negative pressure is transmitted to the adsorption groove on the surface of the jig through the preformed hole 16, so that the product is firmly adsorbed on the surface of the jig.

Because polishing liquid is needed in the polishing process, in order to avoid the phenomenon that the negative pressure pump 11 is damaged by the vacuum system due to the suction of the polishing liquid in the grinding process, the vacuum system is further provided with a backflow center 18, and the backflow center 18 is communicated with a backflow pipeline 17 arranged at the lower end of the negative pressure vacuum cavity 13 so as to backflow the polishing liquid to the backflow center 18.

As shown in fig. 3, in an alternative embodiment, the polishing apparatus further includes a polishing liquid circulation system 2, and the polishing liquid circulation system 2 includes:

a tank 21 for containing a polishing liquid,

a distribution center 25 connected to the tank 21 through pipes, respectively, and distributing the polishing liquid to the product surface,

and a return pipe 23 for returning the polishing liquid remaining on the surface of the product to a return groove 29, wherein the return groove 29 is communicated with the tank 21.

The tank body barrel 21 is used for containing the debugged polishing solution and the recovered polishing solution, the liquid pump 22 is used for transmitting the debugged polishing solution in the tank body barrel 21 to the distribution center 25 through the transmission pipeline 24, and transmitting the debugged polishing solution to the polishing solution receiving disc 27 through the distribution pipeline 26 at the distribution center 25, and the polishing solution flows into the product surface at the polishing solution receiving disc 27.

With continued reference to fig. 3, in an alternative embodiment, the polishing solution circulation system 2 further includes polishing solution receiving trays 27, where the polishing solution receiving trays 27 are connected to the distribution center 25 through distribution pipes 26, and preferably, each polishing solution receiving tray 27 is connected to the distribution center 25 through 2 distribution pipes 26, the polishing solution receiving trays 27 are fixedly connected to the corresponding polishing member adapter plates 35, and through holes through which the polishing solution passes are uniformly provided on the polishing solution receiving trays 27, and the through holes of the polishing solution receiving trays 27 are in one-to-one correspondence with the through holes on the polishing member adapter plates 35, so that the polishing solution can circulate uniformly.

During grinding, the liquid pump 22 is used for transmitting the debugged polishing liquid in the tank body barrel 21 to the diversion center 25 of the polishing liquid through the transmission pipeline 24, the diversion center 25 is used for diverting the polishing liquid, the polishing liquid flows into the polishing liquid receiving disc 27 through the diversion pipeline 26, and then flows into the grinding part through the through hole of the polishing liquid receiving disc 27 and the through hole of the grinding part adapter plate 35 to reach the surface of a product adsorbed by the jig 37.

Preferably, the jig 37 is a product-imitating jig, the preferred jig is mounted on the bottom plate 15 by screws in a double-row concentric circle manner, a second motor is arranged at the bottom of the bottom plate 15, and the bottom plate 15, the jig 37 and the product in the jig perform circular motion around the center of the polishing device under the action of the second motor, so that relative motion is generated with a grinding member, such as a brush, to perform surface grinding.

The jig 37 is arranged in a double-channel inclined manner, so that the settable number of the jigs is increased, the productivity of products is increased, and the polishing efficiency of the products is improved.

Be provided with the fender polder 28 on the bottom plate 15, the high of fender polder 28 is higher than the height of tool 37, because the existence of fender polder, when polishing, the polishing solution inflow on the bottom plate 15 can be greater than the outflow, and the polishing solution can flow on the bottom plate 15 for the product can soak in the polishing solution, makes the polishing more even. When the liquid pump 22 is turned off, the inflow amount of the polishing liquid on the bottom plate 15 is smaller than the outflow amount, the polishing liquid on the bottom plate 15 can completely flow into the reflux groove 29, so that the product is convenient to take out, and the refluxed polishing liquid flows back to the tank body 21 after being filtered twice through the reflux pipeline 23 and the filter 19.

By the method, not only is dry grinding generated in a product polishing and non-soaking mode solved, but also the surface grinding of the product is more uniform, and the surface scratch of the product is reduced.

In an alternative embodiment, the polishing liquid receiving disc 27 is connected to the first motor 32 by a coupling, preferably by a split coupling 33, in particular, two fixing pins are provided in the middle of the split coupling 33 for increasing the stability of the polishing liquid receiving disc 27, and the polishing liquid receiving disc 27 is connected to the polishing member adapter plate 35 by screws.

Preferably, the first motor is a 1500W motor, and the first motor rotates a rotating shaft through a 1:10 speed reducer, and the rotating shaft is connected with the polishing solution receiving disc 27 through a split coupling 33.

In a preferred embodiment, a plurality of polishing solution receiving discs 27 and polishing member adapter plates 35 are respectively provided, the polishing solution receiving discs 27 and the polishing member adapter plates 35 are fixedly connected in one-to-one correspondence, and the polishing solution receiving discs 27 and the polishing member adapter plates 35 are uniformly distributed along the circumferential direction of the polishing apparatus.

For example, in a specific embodiment, 12 polishing liquid receiving discs 27 and polishing member adapter plates 35 are respectively provided and uniformly distributed along the circumferential direction of the polishing apparatus, the 12 polishing liquid receiving discs are fixedly connected with the 12 polishing member adapter plates in one-to-one correspondence, each polishing liquid receiving disc 27 is provided with 2 through holes, and the through holes of the polishing liquid receiving discs 27 are in one-to-one correspondence with the through holes of the polishing member adapter plates so as to uniformly circulate the polishing liquid. Each grinding member adapter plate 35 is correspondingly provided with a grinding member 36, each grinding member 36 is a brush, a bottom plate 15 is correspondingly arranged below each grinding member adapter plate 35, 8 reserved holes 16 are correspondingly formed in each bottom plate 15 (namely, 12 bottom plates 15 in total), each reserved hole 16 adsorbs a jig 37, the shape of the jig 37 is matched with that of a product, each jig 37 is correspondingly provided with a product, and polishing liquid flows into the brush through the through holes and reaches the surface of the product adsorbed by the jig 37.

More specifically, the distribution center 25 distributes the polishing liquid into 24 equal parts, and uniformly distributes the polishing liquid into 12 polishing liquid receiving trays 27.

More specifically, the negative pressure vacuum chamber 13 equally divides the negative pressure into 12 parts, and each part of negative pressure is transferred into the chamber of the bottom plate 15 through the pressure dividing pipe 14 and transferred to the adsorption groove of each jig through the preformed hole 16 on the bottom plate 15, and adsorbed to each jig 37.

In an alternative embodiment, the bottom plates 15 are also provided in plural, the bottom plates 15 are in one-to-one correspondence with the grinding member adapter plates 35, each bottom plate 15 is provided with a stopper 28, and a gap is provided between adjacent stoppers 28 to allow the polishing liquid to pass through so that the polishing liquid flows back to the return groove.

In a preferred embodiment, the adsorption groove on the surface of the jig 37 is preferably in a shape of double-king, so that the product can be more firmly adsorbed on the surface of the jig 37.

In a more specific embodiment, the grinding members 36 are preferably brushes, a group of brushes is uniformly arranged below each grinding member adapter plate 35, and a plurality of jigs 37 are correspondingly arranged on each bottom plate 15.

In a more preferred embodiment, the polishing solution circulation system 2 further comprises a filter 19, wherein the filter 19 is communicated with the reflux tank 29 through a reflux pipe 23 and is communicated with the reflux center 18 through a reflux pipe 17, and the refluxed polishing solution is filtered by the filter 19 and then is returned to the tank 21.

The polishing solution circulation system 2 of the invention adopts the modes of liquid pumping, flow dividing, temporary retention, backflow and filtration, can save the polishing solution, ensure the purity of the polishing solution, thoroughly solve the brush printing problem caused by dry grinding of the product surface, and ensure the grinding of the product surface to be more stable.

In a more specific embodiment, the abrasive article 36 is removably coupled to the abrasive article adapter plate 35. More specifically, the grinding member 36, such as a brush, is connected to the grinding member adapter plate 35 by way of a velcro, the lower side of the grinding member adapter plate being a velcro hook surface, and the upper side of the brush being a velcro loop surface. The detachable connection mode is convenient for the replacement of the hairbrush, and improves the utilization rate of the machine of the equipment.

In a more specific embodiment, each polishing solution receiving disc 27 is correspondingly connected with one first motor 32 through a separate coupling 33, the plurality of bottom plates 15 are uniformly distributed along the circumferential direction of the polishing device to form a bottom plate 42, a second motor 44 is arranged under the bottom plate 42, and the bottom plate 42 drives the jig 37 and the product to do circular motion under the action of the second motor 44.

Specifically, before starting the equipment, firstly, the product is placed on the jig 37, after the material is completely loaded, the vacuum system 1 is opened, the product is tightly adsorbed on the jig 37, the product is prevented from being thrown and broken in the grinding process, then the polishing solution circulation system 2 is opened, the product is soaked in the polishing solution, the grinding uniformity of the product is improved, the grinding system is opened, when the grinding system is started, the pneumatic transmission device 31 starts to work, the whole grinding system is controlled to be pressed downwards in equal proportion to grind, the service life of the brush can be prolonged, the product can be tightly attached to the surface of the jig 37, the stress is uniform, the brush is deformed and stretches into four dead corners on the surface of the product, the first motor 32 drives the grinding piece adapter plate 35 to drive the brush to conduct autorotation, the second motors 44 of the bottom plates 15, the jig 37 and the product on the surface of the jig 37 conduct circular motion (revolution) along the center of the polishing equipment, and the brush and the jig 37 and the product conduct autorotation simultaneously when the brush and the product conduct forward and reverse rotation.

More preferably, the grinding member 36, i.e. the brush, rotates intermittently with respect to the jig 37 and the product, and the brush itself rotates intermittently at the same time, thereby achieving thorough grinding.

Intermittent motion refers to a process of performing forward motion for a certain period of time and then performing reverse motion for a certain period of time, and the process is performed circularly.

In a more specific embodiment, as shown in fig. 5, the polishing apparatus further comprises a frame for supporting the polishing apparatus. Specifically, the skeleton includes a plurality of, for example, 8 column brackets for supporting the weight of the entire apparatus. Preferably, the lower part of the frame is used for supporting the chassis 42 and the second motor 44, the bottom plate 15 performs circular motion, and the upper part of the frame is used for supporting the vacuum system 1, the polishing solution circulation system 2, the grinding system 3, a control panel 45 for controlling polishing equipment, and the like.

In a more specific embodiment, the through holes of the slurry receiving plate 27 and the through holes of the polishing member adapter plate 35 have diameters of 15mm to 20mm, preferably 16mm, or preferably 16mm to 19mm, and more preferably 18mm.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. In the description of the present invention, the azimuth or positional relationship indicated by the terms "vertical", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and the relative positional relationship may be changed accordingly when the absolute position of the object to be described is changed, and thus the limitation of the present invention cannot be construed.

By now it will be appreciated by those skilled in the art that while the invention has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1. A four curved contour microcrystalline cover plate polishing apparatus, comprising: the vacuum system is used for providing negative pressure and fixing the product on the surface of the jig through the negative pressure; the grinding system comprises a jig and a grinding piece positioned above the jig, wherein the jig and the grinding piece rotate relatively during grinding, and the grinding piece rotates automatically.

2. The apparatus of claim 1, wherein the jig and the grinding member perform intermittent forward and reverse relative rotation during grinding, and the grinding member itself performs intermittent rotation.

3. The four-curve isomicrocrystalline cover plate polishing device according to claim 2, wherein the polishing system comprises a pneumatic transmission device, a motor, a polishing piece adapter plate, a polishing piece and a jig, wherein the polishing piece adapter plate can move downwards under the action of the pneumatic transmission device, the polishing piece is fixed below the polishing piece adapter plate, is electrically connected with a first motor and performs autorotation under the action of the first motor, and the jig performs circumferential movement along the center of the polishing device under the action of a second motor.

4. A four-curve isomicrocrystalline cover plate polishing device according to claim 3, wherein said vacuum system comprises:

5. The four-curve isomicrocrystalline cover plate polishing device according to claim 4, further comprising a polishing liquid circulation system, the polishing liquid circulation system comprising:

a tank body tub for accommodating a polishing liquid;

6. The four-curve equal-height microcrystal cover plate polishing device according to claim 5, wherein the polishing solution circulating system further comprises a polishing solution receiving disc, the polishing solution receiving disc is communicated with the distribution center through a pipeline and fixedly connected with the corresponding grinding piece adapter plate, through holes through which polishing solution passes are uniformly formed in the polishing solution receiving disc, and the through holes of the polishing solution receiving disc correspond to the through holes in the grinding piece adapter plate one by one.

7. The four-curve isomicrocrystalline cover plate polishing device according to claim 6, wherein the polishing liquid receiving disc is connected with the first motor through a separate coupling.

8. The four-curve equal-height microcrystal cover plate polishing device according to claim 7, wherein the jig is mounted on the bottom plate in a double-row concentric circle mode, a second motor is arranged at the bottom of the bottom plate, and the bottom plate, the jig and products in the jig perform circular motion around the center of the polishing device under the action of the second motor.

9. The four-curve isomicrocrystalline cover plate polishing device according to claim 8, wherein a blocking device is arranged on the bottom plate, and the height of the blocking device is higher than that of the jig, so that the inflow amount of polishing solution on the bottom plate is larger than the outflow amount, and the product is soaked in the polishing solution.

10. The four-curve isomicrocrystalline cover plate polishing device according to claim 9, wherein a plurality of polishing liquid receiving discs and the grinding member adapter plates are respectively arranged, the polishing liquid receiving discs are fixedly connected with the grinding member adapter plates in one-to-one correspondence, and the polishing liquid receiving discs and the grinding member adapter plates are uniformly distributed along the circumferential direction of the polishing device.

11. The four-curve isomicrocrystalline cover plate polishing device according to claim 10, wherein a plurality of base plates are provided, the base plates are in one-to-one correspondence with the grinding member adapter plates, each base plate is provided with a baffle correspondingly, and a gap is provided between adjacent baffles to allow polishing liquid to pass through.

12. The four-curve isoaltitude microcrystal cover plate polishing device according to claim 8, wherein an adsorption groove is formed in the surface of the jig, and the adsorption groove is in a double-king shape.

13. The four-curve equal-height microcrystal cover plate polishing device according to claim 11, wherein the grinding piece is a brush, a group of brushes are uniformly arranged below the grinding piece adapter plate, and a plurality of jigs are correspondingly arranged on each base plate.

14. The four-curve isomicrocrystalline cover plate polishing device according to claim 5, wherein the polishing solution circulating system further comprises a filter, the filter is respectively communicated with the reflux tank and the reflux center through a reflux pipeline, and the refluxed polishing solution is recovered to the tank after being filtered by the filter.

15. The four-curve isomicrocrystalline cover plate polishing device according to claim 13, wherein the polishing piece and the polishing piece adapter plate are detachably connected.

16. The four-curve isomicrocrystalline cover plate polishing device according to claim 2, further comprising a skeleton for supporting the polishing device.

17. The four-curve isomicrocrystalline cover plate polishing device according to claim 15, wherein the brush is detachably connected with the grinding member adapter plate through a velcro.

18. The four-curve equal-height microcrystal cover plate polishing device according to claim 11, wherein the polishing solution circulating system comprises 12 polishing solution receiving discs in total, the 12 polishing solution receiving discs are uniformly distributed along the circumference of the polishing device, the 12 polishing solution receiving discs are fixedly connected with 12 polishing member adapter plates in one-to-one correspondence, each polishing solution receiving disc is provided with 2 through holes, the through holes of the polishing solution receiving discs are in one-to-one correspondence with the through holes on the polishing member adapter plates, each polishing member adapter plate is correspondingly provided with one polishing member, a bottom plate is correspondingly arranged below each polishing member adapter plate, 8 jigs are correspondingly arranged on each bottom plate, and each jig is correspondingly provided with one product.

19. The four-curve isomicrocrystalline cover plate polishing device according to claim 18, wherein each polishing liquid receiving disc is correspondingly connected with a first motor through a separate coupler, a plurality of bottom plates are uniformly distributed along the circumferential direction of the polishing device to form a bottom disc, a second motor is arranged under the bottom disc, and the bottom disc drives the jig and the product to do circular motion under the action of the second motor.

20. The four-curve isomicrocrystalline cover plate polishing device according to claim 6, wherein the diameter of the through hole is 15mm to 20mm.