CN117241926B - Semiconductor power module and method and tool for manufacturing such a module - Google Patents
Semiconductor power module and method and tool for manufacturing such a module Download PDFInfo
- Publication number
- CN117241926B CN117241926B CN202280031617.2A CN202280031617A CN117241926B CN 117241926 B CN117241926 B CN 117241926B CN 202280031617 A CN202280031617 A CN 202280031617A CN 117241926 B CN117241926 B CN 117241926B
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- sleeve
- contact pin
- substrate
- power module
- longitudinal axis
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229920003023 plastic Polymers 0.000 claims abstract description 106
- 239000004033 plastic Substances 0.000 claims abstract description 106
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000000465 moulding Methods 0.000 claims description 33
- 150000001875 compounds Chemical class 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 description 23
- 238000004806 packaging method and process Methods 0.000 description 21
- 238000007789 sealing Methods 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14418—Sealing means between mould and article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/84—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by moulding material on preformed parts to be joined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14139—Positioning or centering articles in the mould positioning inserts having a part extending into a positioning cavity outside the mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14934—Preventing penetration of injected material between insert and adjacent mould wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Ceramic Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
Abstract
公开了一种半导体功率模块(10)，包括放置在基板(7)上的一个或多个半导体(4)。功率模块(10)包括由接触引脚(6)形成的触点，该接触引脚设置有具有中心部分(13)的塑料套管(5)。其中，接触引脚(6)包括纵向轴线(Y)。塑料套管(5)包封接触引脚(6)的一部分。套管(5)的远侧部分包括塑性变形区(8)。套管(5)包封接触引脚(6)的近侧部分，其中，套管(5)从其远侧部分到其近侧部分是连续的，并且近侧部分与基板(7)或与基板(7)直接接触的结构(9)直接接触。
A semiconductor power module (10) is disclosed, comprising one or more semiconductors (4) placed on a substrate (7). The power module (10) comprises a contact formed by a contact pin (6), the contact pin being provided with a plastic sleeve (5) having a central portion (13). The contact pin (6) comprises a longitudinal axis (Y). The plastic sleeve (5) encloses a portion of the contact pin (6). The distal portion of the sleeve (5) comprises a plastic deformation zone (8). The sleeve (5) encloses a proximal portion of the contact pin (6), wherein the sleeve (5) is continuous from its distal portion to its proximal portion, and the proximal portion is in direct contact with the substrate (7) or a structure (9) in direct contact with the substrate (7).
Description
Technical Field
The invention relates to a plastic packaging tool for plastic packaging of a semiconductor power module. The invention also relates to a semiconductor power module and a method for producing such a semiconductor power module.
Background
Framed and encapsulated modules are well known in the field of power electronics. Such a module comprises semiconductor components, such as semiconductor switches in the form of, for example, IGBTs or MOSFETs. Such components may use silicon-based semiconductors, or as is increasingly common, wide bandgap semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) based semiconductors. In power modules, it is known to use load and control pins that extend out of a plastic housing through openings provided in the plastic housing.
For power modules that use high switching frequencies in operation, especially in the case of wide bandgap semiconductor technology, it is crucial that the contact pins extend along the shortest possible path while connecting the components and controlling electronics or loads. However, plastic packaged power modules with top contact pins are rare because the required production steps are difficult to implement.
Contact pins having the same height as the molding compound are known, wherein the contact pins are fastened to the substrate prior to the molding.
It is also known to have contact pins that are higher than the molding compound and thus extend beyond the molding compound in the finished module. These contact pins are secured to the substrate prior to the molding process. To implement the plastic encapsulation process, it is necessary to apply a sealing element that is firmly or semi-firmly connected to the contact pins. These sealing elements need to be fixed to the contact pins before they are attached to the substrate.
One of the drawbacks of the prior art solutions is that the sealing element is connected to the contact pins before they are attached to the substrate. Therefore, ultrasonic welding of the contact pins is difficult and requires complex tools. Therefore, methods for attaching contact pins to a substrate, such as soldering or adhesive bonding, are rarely used. If the mounting of the sealing element is performed after the attachment of the contact pins (while using prior art solutions), the sealing element will not exert any pressure towards the sealing point of the opening in the upper mould. This has the undesirable consequence that molding compound may enter the openings in the upper die tool. This may lead to problems such as overflow of molding compound during the molding process, contamination of the mold or contact pins, etc.
Accordingly, there is a need for a plastic packaging tool, a method, a semiconductor power module and a contact pin unit that reduce or even eliminate the above-mentioned drawbacks of the prior art.
It is an object of the present invention to provide a plastic encapsulation tool and a method in which a sufficiently tight seal of an opening in a top mold tool can be established. It is also an object to provide a semiconductor power module which can be manufactured without the above-mentioned disadvantages.
It is a further object of the present invention to provide a contact pin unit suitable for use in the above plastic packaging tool and method for manufacturing a power module having the above-mentioned advantages.
Disclosure of Invention
The object of the invention is achieved by a plastic encapsulation tool as defined in claim 1, a method as defined in claim 5, a semiconductor power module as defined in claim 10 and a contact pin unit as defined in claim 15. Preferred embodiments are defined in the dependent claims, explained in the following description and shown in the drawings.
A plastic packaging tool according to the present invention is a plastic packaging tool for plastic packaging a semiconductor power module, wherein the power module comprises a substrate and electrical contact pins electrically connected to the substrate, wherein the plastic packaging tool comprises an upper and a lower mold tool configured to engage and thereby form a mold cavity to be filled with a packaging plastic for packaging an electrical component of the semiconductor power module, wherein the upper mold tool is provided with an opening configured to receive a distal portion of the electrical contact pins, wherein the opening comprises:
-a centrally arranged cylindrical portion having a longitudinal axis and a width, and
-An inclined portion at an angle in the range of 20 to 70 degrees with respect to the longitudinal axis, wherein the width of the inclined portion exceeds 1.5 times the width of the cylindrical portion.
Thus, a plastic sealing tool may be provided by which a sufficiently tight seal of the opening in the upper die tool may be provided. Thus, during plastic encapsulation, the contact pins may remain completely devoid of molding compound, such that the pins provide good electrical conductivity when connected to the electrical component.
The substrate may be a direct copper bond (Direct Copper Bonding, DCB) substrate. It may be advantageous to use DCB substrates due to their good thermal conductivity.
The electrical contact pins are electrically connected to the substrate. The pins may be soldered pins. In one embodiment, the pins are press-fit pins adapted to be inserted into holes in a printed circuit board (printed circuit board, PCB). In one embodiment, the pins include holes or threaded bores formed to connect using a threaded connection.
The molding tool includes an upper mold tool and a lower mold tool configured to engage and thereby form a mold cavity to be filled with an encapsulating molding compound.
The upper die tool is provided with an opening configured to receive a distal portion of the electrical contact pin. Thus, the molding compound may be prevented from contacting the distal portions of the electrical contact pins during the molding process.
The opening comprises:
-a centrally arranged cylindrical portion having a longitudinal axis and a width, and
-An inclined portion at an angle in the range of 20 to 70 degrees with respect to the longitudinal axis, wherein the width of the inclined portion exceeds 1.5 times the width of the cylindrical portion.
In one embodiment, the inclined portion is arranged adjacent to the cylindrical portion.
In one embodiment, the intermediate portion may be disposed between the inclined portion and the cylindrical portion.
In a preferred embodiment, the inclined portion extends in an extension of the cylindrical portion such that the inclined portion protrudes from the cylindrical portion.
In one embodiment, the angle relative to the longitudinal axis of the cylindrical portion is in the range of 30 to 60 degrees.
In one embodiment, the angle relative to the longitudinal axis of the cylindrical portion is in the range of 35 to 55 degrees.
In one embodiment, the angle relative to the longitudinal axis of the cylindrical portion is in the range of 40 to 50 degrees.
In one embodiment, the surface of the inclined portion is conical.
In one embodiment, the cross-section of the surface of the inclined portion comprises a planar segment.
In one embodiment, the surface of the inclined portion is convex. This may be advantageous when a concave surface of the plastic encapsulated area surrounding the pins is desirable.
In one embodiment, the cross-section of the surface of the inclined portion comprises a concave portion.
In one embodiment, the surface of the inclined portion is concave. This may be advantageous when a convex surface of the plastic encapsulated area around the pins is desirable.
In one embodiment, the opening includes a substantially cylindrical proximal portion. This is advantageous because the substantially cylindrical proximal portion is easy to insert into the distal portion of the pin.
In one embodiment, the cross-section of the surface of the inclined portion comprises a convex portion.
In one embodiment, the width of the cylindrical portion is greater than the width of the distal portion of the contact pin and less than the width of the proximal portion of the contact pin.
In one embodiment, the width of the maximum width inclined portion of the inclined portion is equal to the width of the cylindrical portion of the contact pin or 2 times the width of the cylindrical portion of the contact pin.
The method according to the invention is a method of manufacturing a semiconductor power module having a substrate and electrical contact pins electrically connected to the substrate, wherein the contact pins have a longitudinal axis, wherein the contact pins are provided with a plastic sleeve having a central portion, wherein the method comprises the steps of:
-arranging the sleeve in a position where the sleeve encloses a portion of the contact pin, wherein the sleeve is continuous from its distal portion to its proximal portion and the proximal portion is in direct contact with the substrate or a structure in direct contact with the substrate;
-providing a plastically deformable region in the distal portion of the sleeve, wherein the sleeve transmits a force for plastically deforming the plastically deformable region along the longitudinal axis of the contact pin to the substrate or to a structure in direct contact with the substrate.
Thus, the method makes it possible to provide a sufficiently tight seal of the opening in the upper die tool. Thus, during plastic encapsulation, the contact pins may remain completely devoid of molding compound, such that the pins provide good electrical conductivity when connected to the electrical component.
The use of a plastic cannula makes it possible to provide a plastically deformable region at the distal portion of the cannula. The geometry of the sleeve should be chosen according to the geometry of the contact pins and the openings.
The method comprises the step of arranging the sleeve at a position where the sleeve encloses a portion of the contact pin, wherein the sleeve is continuous from its distal portion to its proximal portion and the proximal portion is in direct contact with the substrate or a structure in direct contact with the substrate. This step makes it possible to provide a sufficiently tight seal of the opening in the upper die tool. This may be accomplished by maintaining the proximal portion of the cannula in direct contact with the substrate or a structure in direct contact with the substrate. As an example, the structure in direct contact with the substrate may be a proximal structure of the contact pins.
When the upper and lower die tools are pressed together, a plastic deformation zone is created in the distal portion of the cannula. This can be achieved in that the sleeve transmits forces for plastically deforming the plastic deformation zone along the longitudinal axis of the contact pin to the substrate or to a structure in direct contact with the substrate.
In one embodiment, the plastic deformation zone is made by using a plastic sealing tool according to the invention.
In one embodiment, the sleeve has a central portion, wherein the plastically deformable region protrudes from the central portion of the sleeve. This will make it easier for the plastically deformed region to seal against the opening.
In one embodiment, the contact pin comprises a foot arranged at a proximal end of the contact pin, wherein the foot protrudes from a central portion of the contact pin, wherein the foot extends perpendicular to a longitudinal axis of the contact pin. When the upper and lower die tools are pressed together, a plastic deformation zone is created in the distal portion of the sleeve, as the sleeve transfers forces (for plastically deforming the plastic deformation zone) along the longitudinal axis of the contact pin to the foot in direct contact with the substrate.
In one embodiment, the sleeve comprises a protruding portion arranged at the proximal end of the sleeve, wherein the protruding portion protrudes from a central portion of the sleeve, wherein the protruding portion extends perpendicular to the longitudinal axis of the contact pin. When the upper and lower die tools are pressed together, a plastic deformation zone is created in the distal portion of the sleeve, as the sleeve transfers forces (for plastically deforming the plastic deformation zone) along the longitudinal axis of the contact pin to the protruding portion in direct contact with the substrate.
The semiconductor power module according to the present invention is a semiconductor power module including:
One or more semiconductors(s) and(s), the one or more semiconductors are placed on a substrate;
-a contact formed by a contact pin provided with a plastic sleeve having a central portion, wherein the contact pin comprises a longitudinal axis, wherein the plastic sleeve encloses a portion of the contact pin and a distal portion of the sleeve comprises a plastic deformation zone, wherein the sleeve encloses a portion of the contact pin, wherein the sleeve is continuous from its distal portion to its proximal portion and the proximal portion is in direct contact with the substrate or a structure in direct contact with the substrate, wherein the sleeve is adapted to transfer a force along the longitudinal axis to the substrate or the structure in direct contact with the substrate, the force being sufficiently large to plastically deform the plastic deformation zone.
Thus, the plastic deformation zone is arranged and configured to act as a sealing element during the molding process and to prevent molding compound from flowing into the opening in the upper mold tool. Thus, during the plastic encapsulation process, the contact pins may remain completely devoid of molding compound, such that the pins provide good electrical conductivity when connected to the electrical component.
The semiconductor power module may comprise several semiconductors. In one embodiment, the substrate is a DCB substrate.
The semiconductor power module may comprise several electrical contact pins each electrically connected to the substrate.
In one embodiment, the contact pin includes a foot having a width that is greater than a width of a distal portion of the contact pin. Thus, by transmitting a force for plastically deforming the plastically deformable region along the longitudinal axis of the contact pin to the foot of the contact pin attached to the substrate, the plastically deformable region may be provided in the distal portion of the sleeve.
In one embodiment, the sleeve comprises a protruding portion arranged at the proximal end of the sleeve, wherein the protruding portion protrudes from a central portion of the sleeve, wherein the protruding portion extends perpendicular to the longitudinal axis of the contact pin. Thus, the force required to plastically deform the plastically deformable region in the distal portion of the cannula may be transferred to the substrate via the cannula through the protruding portion provided in the proximal end of the cannula.
In one embodiment, the plastically deformable region protrudes from a central portion of the sleeve. Thus, the plastic deformation zone can be sealed against the inclined portion of the opening in an efficient manner.
It may be advantageous to manufacture the power module by using the method according to the invention.
The contact pin unit according to the invention comprises:
an electrical contact pin having a longitudinal axis,
Wherein the contact pin is provided with a plastic sleeve having a central portion,
Wherein the sleeve encloses a portion of the contact pin,
Wherein the sleeve is continuous from its distal portion to its proximal portion and the proximal portion is adapted to be in direct contact with the substrate or a structure in direct contact with the substrate, and
Wherein the distal portion of the cannula has a plastically deformable region,
Wherein the sleeve is capable of transmitting a force for plastically deforming the plastically deformable region along the longitudinal axis of the contact pin to the substrate or to a structure in direct contact with the substrate. Such a contact pin unit is adapted to form an electrical connection with the substrate.
In one embodiment, the plastically deformable region protrudes from a central portion of the sleeve.
In another embodiment, the contact pin comprises a foot arranged at a proximal end of the contact pin, wherein the foot protrudes from a central portion of the contact pin, wherein the foot extends perpendicular to a longitudinal axis of the contact pin.
In a further embodiment, the sleeve comprises a protruding portion arranged at the proximal end of the sleeve, wherein the protruding portion protrudes from a central portion of the sleeve, wherein the protruding portion extends perpendicular to the longitudinal axis of the contact pin.
In further embodiments, the sleeve comprises a material that shrinks significantly at the temperatures used during the plastic encapsulation process.
Drawings
The present invention will be more fully understood from the detailed description given hereinafter. The drawings are given by way of illustration only and thus they are not limiting of the invention. In the drawings:
Fig. 1 shows a schematic cross-sectional view of a side view of a semiconductor power module arranged in a plastic encapsulation tool according to the invention;
fig. 2 shows a schematic cross-sectional view of the semiconductor power module shown in fig. 1 in a configuration in which a plastic deformation zone has been created at the distal end of the plastic sleeve, wherein the power module is arranged in the plastic packaging tool shown in fig. 1;
Fig. 3 shows a schematic cross-sectional view of a semiconductor power module manufactured by using the plastic encapsulation tool shown in fig. 1 and 2;
fig. 4 shows a schematic cross-sectional view of another further semiconductor power module according to the invention;
fig. 5 shows a schematic cross-sectional view of a further semiconductor power module according to the invention;
Fig. 6 shows a schematic cross-sectional view of a side view of a semiconductor power module arranged in a plastic encapsulation tool according to the invention;
fig. 7 shows a schematic cross-sectional view of the semiconductor power module shown in fig. 6 in a configuration in which a plastic deformation zone has been created at the distal end of a plastic sleeve placed on the substrate of the power module, wherein the power module is arranged in the plastic packaging tool shown in fig. 6;
Fig. 8 shows a schematic cross-sectional view of a semiconductor power module arranged in a plastic encapsulation tool according to the invention;
Fig. 9 shows a schematic cross-sectional view of a semiconductor power module manufactured by using the plastic encapsulation tool shown in fig. 8;
fig. 10 shows a flow chart illustrating the method steps for manufacturing a semiconductor power module according to the invention;
fig. 11 shows a schematic cross-sectional view of a side view of a semiconductor power module arranged in a plastic packaging tool according to the invention, and
Fig. 12 shows a schematic cross-sectional view of the semiconductor power module shown in fig. 11 in a configuration in which a plastic deformation zone has been created at the distal end of a plastic sleeve placed on the substrate of the power module, wherein the power module has been removed from the plastic encapsulation tool.
Detailed Description
For purposes of illustrating the preferred embodiments of the present invention, referring now in detail to the drawings, there is shown in fig. 1 a schematic cross-sectional view of a side view of a semiconductor power module 10 arranged in a plastic encapsulation tool in accordance with the present invention.
The semiconductor power module 10 comprises a substrate 7. The substrate may be a Direct Copper Bond (DCB) substrate formed by a ceramic wafer sandwiched between two pieces of copper. The electrical contact pins 6 are attached to the upper surface of the substrate 7 to electrically connect the contact pins 6 to the surface. The contact pins 6 extend from the surface of the substrate 2 and are positioned to be inserted into the openings 3 of the upper die tool 1. The longitudinal axis Y of the contact pin 6 extends parallel to the longitudinal axis X of the opening 3. The longitudinal axis Y of the contact pin 6 extends perpendicular to the longitudinal axis Z of the substrate 7. The semiconductor 4 is placed on a substrate 7.
The substrate 7 is placed in the lower die tool 2. The upper die tool 1 and the lower die tool 2 are configured to engage and thereby form a mold cavity to be filled with molding compound in order to encapsulate an electrical component (semiconductor) 4. The openings 3 of the upper die tool 1 are configured to receive distal portions of the electrical contact pins 6.
The contact pin 6 comprises a foot 9 arranged in the proximal end of the contact pin 6. The foot 9 is electrically connected to the upper surface of the substrate 7. The width L 6 of the foot 9 is indicated. It can be seen that the width L 1 of the distal portion of the contact pin 6 is smaller than the width L 6 of the foot 9, because the foot 9 extends perpendicular to the longitudinal axis Y of the contact pin 6.
The opening 3 comprises a proximal, centrally arranged cylindrical portion having a width L 2 which is larger than the width L 1 of the distal portion of the contact pin 6. Thus, the distal portion of the contact pin 6 may be inserted into and received by the cylindrical portion in the opening 3.
A plastic sleeve 5 encloses a portion of the contact pin 6. The sleeve 5 rests on the foot 9 of the contact pin 6.
The opening 3 comprises an inclined portion 11. The angle alpha between the longitudinal axis X of the opening and the inclined portion 11 is about 45 degrees. The angle alpha may be different from 45 degrees. In one embodiment, the angle α is in the range of 30 to 60 degrees.
The width L 7 of the inclined portion 11 is twice as large as the width L 2 of the cylindrical portion. The inclined portion 11 is arranged adjacent to the cylindrical portion and is designed to provide a plastic deformation zone in the distal portion of the cannula 5. The sleeve 5 is arranged in a position where the sleeve 5 encloses a proximal part of the portion of the contact pin 6 extending from the foot 9. The sleeve 5 is continuous from its distal portion to its proximal portion and the proximal portion of the sleeve 5 is in direct contact with the foot 9 which is in direct contact with the upper surface of the base plate 7.
The inclined portion 11 is configured to provide a plastic deformation zone in the distal portion of the cannula 5 when the upper die tool 1 and the lower die tool 2 are pressed together. When the upper and lower die tools 1,2 are pressed together, the sleeve 5 transmits a force for plastically deforming the plastically deformable region to the foot 9 along the longitudinal axis Y of the contact pin 6. Because the foot 9 is in direct contact with the upper surface of the base plate 7. The force will be transferred to the base plate 7 via the foot 9.
The length L 5 of the cylindrical portion and the length L 4 (along the longitudinal axis X) of the inclined structure 11 of the opening 3 are shown in fig. 1. Likewise, the width L 3 of the inclined structure of the inclined portion 11 is indicated. It can be seen that the cross section of the inclined portion 11 shown in fig. 1 comprises a planar segment. In fact, the surface of the cross section of the inclined portion 11 shown in fig. 1 is planar. However, the surface of the inclined portion 11 shown in fig. 1 may be conical.
It is important to emphasize that the power module 10 may comprise more electrical components 4 than the single semiconductor 4 shown in fig. 1.
Fig. 2 shows a schematic cross-sectional view of the semiconductor power module 10 shown in fig. 1 in a configuration in which a plastic deformation zone 8 has been created in the distal end of the plastic sleeve 5. The power module 10 is arranged in a plastic packaging tool shown in fig. 1. The upper die tool 1 and the lower die tool 2 have been pressed together. The sleeve 5 has thus transmitted a force for plastically deforming the plastically deformable region 8 along the longitudinal axis Y of the contact pin 6. The plastic deformation zone 8 tightly seals the mold cavity 14 of the lower mold tool 2 against the opening 3 of the upper mold tool 1. Thus, molding compound may be injected into the mold cavity 14 in a manner in which no molding compound enters the opening 3.
Fig. 3 illustrates a schematic cross-sectional view of the packaged semiconductor power module 10 manufactured by using the packaging tool shown in fig. 1 and 2. The molding compound has been injected into the mold cavity of the lower mold tool (see fig. 2).
Fig. 4 shows a schematic cross-sectional view of another further semiconductor power module 10 according to the invention. The power module 10 corresponds to the power module shown in fig. 3 except for a sleeve 5, which is divided into an upper sheet member 5 'and a lower sheet member 5' arranged one above the other.
Fig. 5 shows a schematic cross-sectional view of a further semiconductor power module 10 according to the invention. The power module 10 substantially corresponds to the power module shown in fig. 3. However, the contact pin 6 does not comprise a foot, and the sleeve 5 is provided with a protruding portion 12. When force is transmitted through the sleeve 5 to provide the plastic deformation zone 8, the protrusions 12 distribute the force to a larger area of the upper surface of the substrate.
Fig. 6 shows a schematic cross-sectional view of a side view of a semiconductor power module 10 arranged in a plastic encapsulation tool according to the present invention. The semiconductor power module 10 and the plastic packaging tool substantially correspond to fig. 1. However, the contact pins 6 do not comprise feet and the sleeve 5 has protruding portions 12, similar to the semiconductor power module 10 shown in fig. 5. In fact, the semiconductor power module 10 shown in fig. 5 is manufactured by using the plastic packaging tools 1,2 shown in fig. 6 and 7.
Fig. 7 shows a schematic cross-sectional view of the semiconductor power module 10 shown in fig. 6 in a configuration in which a plastic deformation zone 8 has been created in the distal end of the cannula 5. The sleeve 5 is placed on the upper surface of the base plate 7 of the power module 10. The power module 10 is arranged in a plastic packaging tool corresponding to the plastic packaging tool shown in fig. 6.
Fig. 8 shows a schematic cross-sectional view of a semiconductor power module 10 according to the present invention arranged in a plastic encapsulation tool. Fig. 9 illustrates a schematic cross-sectional view of a semiconductor power module 10 fabricated by using the plastic encapsulation tool shown in fig. 8. The upper die tool 1 and the lower die tool correspond to those shown in fig. 1,2, 6, and 7. The semiconductor power module 10 corresponds substantially to the semiconductor power module shown in fig. 1 and explained with reference to this figure. However, the contact pin 6 does not comprise a foot. The contact pin 6 is cylindrical and its distal portion has been received by the cylindrical portion of the opening 3. The sleeve 5 is in direct contact with the upper surface of the base plate 7. The compressive force provided while the upper and lower die tools 1,2 are engaged causes the angled portion 11 of the opening 3 to contact and press against the distal portion of the cannula 5. Thus, a plastic deformation zone 8 is created.
As shown in fig. 8 and 9, the geometry of the inclined portion 11 defines the geometry of the portion of the plastic deformation zone 8 that contacts the inclined portion 11 at the end of the formation of the plastic deformation zone 8.
Fig. 10 shows a flow chart illustrating the method steps for manufacturing a semiconductor power module according to the invention.
In a first step, the plastic sleeve 5 is arranged outside a part of the contact pins 6 of the semiconductor power module 10. The position of the sleeve 5 depends on the geometry of the contact pins 6 and the sleeve 5. If the contact pin 6 comprises a foot (as shown in fig. 1 and 2), the sleeve 5 will be placed on the foot. However, if the contact pins 6 do not comprise feet, but are cylindrical (as shown in fig. 5, 6, 7, 8 and 2), the sleeve 5 will be placed on the upper surface of the substrate or on a structure (e.g. a sheet) in direct contact with the upper surface of the substrate.
In a next step, the power module 10 is inserted into a plastic packaging tool comprising an upper mould tool 1 with an opening 3 provided with an inclined distal portion 11. Such a plastic encapsulation tool is shown in fig. 1,2, 6, 7, 8 and 11.
In a next step, the upper die tool 1 and the lower die tool 2 are pushed together, bringing the distal portion of the plastic sleeve 5 into contact with the inclined distal portion 11, causing plastic deformation of the distal portion of the plastic sleeve 5.
In a next step, molding compound is injected into the mold cavity of the molding tool. Thus, the power module 10 is molded while inside the molding tool.
Finally, the mold is opened (by moving the upper mold tool 1 and the lower mold tool 2 away from each other) and the molded module 10 is removed from the molding tool.
In an alternative method, the contact pin unit is first formed. Such a contact pin unit comprises:
an electrical contact pin having a longitudinal axis,
Wherein the contact pin is provided with a plastic sleeve having a central portion,
Wherein the sleeve encloses a portion of the contact pin,
Wherein the sleeve is continuous from its distal portion to its proximal portion and the proximal portion is adapted to be in direct contact with the substrate or a structure in direct contact with the substrate, and
Wherein the distal portion of the cannula has a plastically deformable region,
Wherein the sleeve is capable of transmitting a force for plastically deforming the plastically deformable region along the longitudinal axis of the contact pin to the substrate or to a structure in direct contact with the substrate.
Once assembled, such contact pin units may be placed in place on a substrate, such as a semiconductor power module. The power module may then be inserted into a plastic encapsulation tool as described in the method above. The use of such a contact pin unit enables the production of a power module after plastic encapsulation without the step of arranging a plastic sleeve 5 over the already mounted contact pins.
In a further alternative method, the sleeve 5 may comprise a material that shrinks significantly at the temperatures used during the plastic encapsulation process. Such materials are known as "shrink tubing," "heat shrink" or "heat shrink tubing," and may be made from thermoplastic materials such as silicone elastomers, fluoropolymers, PVC, neoprene or polyolefin. Thus, such a sleeve 5 can fit relatively loosely over the contact pins and form a much tighter fit when the power module 10 is inserted into a molding tool and subjected to a molding process. As a result, a sufficient seal is achieved after plastic encapsulation, so that moisture cannot penetrate into the module.
Fig. 11 shows a schematic cross-sectional view of a side view of a semiconductor power module 10 according to the invention arranged in a plastic encapsulation tool 1, 2. Fig. 12 shows a schematic cross-sectional view of the semiconductor power module 10 shown in fig. 11 in a configuration in which a plastic deformation zone 8 has been created at the distal end of the plastic sleeve 5 placed on the substrate 7 of the power module 10, wherein the power module 10 has been removed from the plastic packaging tool 1, 2.
The plastic sealing tools 1, 2 correspond to the plastic sealing tools shown in fig. 1, 2, 6, 7 and 8 and explained with reference to these figures. The sleeve 5 has a width L 7 which substantially corresponds to the width of the inclined portion 11 of the opening 3. Thus, the plastic deformation zone 8 does not protrude from the cylindrical portion of the sleeve 5 in a direction perpendicular to the longitudinal axis Y of the contact pin 6. Nonetheless, the inclined portion 11 can be tightly sealed against the opening 3 so that no injected molding compound enters the opening during the molding process.
List of reference numerals
1. Upper die tool
2. Lower die tool
3. Opening in upper die tool
4. Semiconductor device
5. Casing pipe
5' Upper sleeve member
5' Lower sleeve member
6. Contact pin
7. Substrate board
8. Plastic deformation zone/plastic deformation zone
9. Foot portion
10. Semiconductor power module
11. Inclined portion
12. Protruding portion of sleeve
13. Central portion of sleeve
14. Mold cavity
X, Y longitudinal axis
Alpha angle
L 1、L2、L3、L6 width
Length of L 4、L5
Claims (9)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DKPA202100441 | 2021-04-30 | ||
| DKPA202100441 | 2021-04-30 | ||
| DE102021120935.8 | 2021-08-11 | ||
| DE102021120935.8A DE102021120935B4 (en) | 2021-04-30 | 2021-08-11 | Process for forming a semiconductor power module |
| PCT/EP2022/061244 WO2022229279A1 (en) | 2021-04-30 | 2022-04-27 | Semiconductor power module and method and tool for manufacturing such a module |
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| CN117241926A CN117241926A (en) | 2023-12-15 |
| CN117241926B true CN117241926B (en) | 2025-02-11 |
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| CN202280031617.2A Active CN117241926B (en) | 2021-04-30 | 2022-04-27 | Semiconductor power module and method and tool for manufacturing such a module |
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| CN118571845A (en) * | 2024-08-01 | 2024-08-30 | 常州芯动能半导体有限公司 | Power module, plastic package mold and manufacturing method thereof |
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| CN109727947A (en) * | 2018-11-19 | 2019-05-07 | 华为技术有限公司 | A pin, a pin combination structure, a package body and a manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE1589555B2 (en) * | 1967-10-31 | 1977-01-27 | Robert Bosch Gmbh, 7000 Stuttgart | SEMICONDUCTOR COMPONENT |
| JP5098440B2 (en) * | 2007-05-25 | 2012-12-12 | 三菱電機株式会社 | Method for manufacturing power semiconductor device |
| JP5082687B2 (en) * | 2007-08-30 | 2012-11-28 | オムロン株式会社 | Transfer mold type power module |
| JP5345017B2 (en) * | 2009-08-27 | 2013-11-20 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
| JP6623811B2 (en) * | 2016-02-16 | 2019-12-25 | 富士電機株式会社 | Semiconductor module manufacturing method and semiconductor module |
| DE102018219005B4 (en) * | 2018-11-07 | 2022-06-23 | Danfoss Silicon Power Gmbh | SUB-ASSEMBLY WITHIN A MOLDING TOOL FOR A TOP-PIN ENCLOSED SEMICONDUCTOR POWER MODULE TO BE FABRICATED, METHOD OF MANUFACTURE AND SEMICONDUCTOR POWER MODULE |
| DE102019111145A1 (en) * | 2019-04-30 | 2020-11-05 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and method for arranging this power semiconductor module on a motor |
| CN211428154U (en) * | 2020-03-23 | 2020-09-04 | 珠海格力电器股份有限公司 | Pin, power device and packaging mold |
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| CN109727947A (en) * | 2018-11-19 | 2019-05-07 | 华为技术有限公司 | A pin, a pin combination structure, a package body and a manufacturing method thereof |
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