CN1170748A - High-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation - Google Patents

Abstract

The resin glue is comounded with n-ethyl silicate modified epoxy phenol aldehyde resin, bisphenol A epoxy resin, bimaleic imide resin, biphenyl anhydrous acid bromide, polyamide mixed coupling agent and other compounds in certain proportion and through proper technological process. It has excellent property in heat, fire and shock resistance and electrical insulation and use performance, and it may be used widely for encapsulation of specific transformer as well as impregnation of various windings for motor, power generator and high voltage choke to suit the needs in heat resistance of these high power and high voltage devices.

Description

A kind of high-grade heat-resistant and fire-retardant embedding dipping glue

The preparation that the present invention relates to the gelling binding agent is a kind of high-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation.

High power transformer, high pressure choke coil and high-voltage electrical apparatus element are very easy under working condition to cause contact short circuit, overheatedly burns out circuit even causes fire thereby cause.

At present, traditional high-tension transformer great majority adopt transformer oil to play insulation and conductive force, but the use of transformer oil easily causes the seepage and the fire of oil, and need frequent maintenance and repair; Though having, electrical element such as minority high pressure choke coil and part high power transformer adopt cast solvent impregnated resin glue, but all be to adopt single epoxy or the not good enough system of thermotolerances such as unsaturated polyester and poly-ammonia, its Ma Tengsi heat resisting temperature is all below 90 ℃, thereby it is supporting usually to need cooling recirculation system, also will be furnished with blowing cooling auxiliary temperature-reducing.Chinese patent CH1102846A has proposed a kind of fill-sealing glue for cross network resin electrical equipment, this glue has characteristics such as good toughness, resistance to impact shock height, but poor heat resistance, the embedding that can not be used for high power transformer, high pressure choke coil and the contour heating element electrical equipment of high-voltage electrical apparatus element is flooded.

The purpose of this invention is to provide a kind of resin glue for encapsulation and impregnation that can be used for high power transformer, high pressure choke coil and the contour heating element electrical part of high-voltage electrical apparatus element, make thermotolerance, fire-retardant toughness, shock resistance and use processing performance all reach good standard.

To achieve the above object of the invention, resin glue for encapsulation and impregnation proposed by the invention is made up of ternary heat stable resin and flame-proof impact resistant solidifying agent and mixing coupling agent etc.Wherein the ternary heat stable resin comprises tetraethoxy modified epoxy resol, bisphenol A epoxide resin and bimaleimide resin, and their parts by weight in glue are respectively 30-50 part, 32-45 part, 10-20 part; The flame-proof impact resistant solidifying agent comprises bromination biphenyl anhydrous acid, polymeric amide, and their parts by weight in glue are respectively 20-30 part, 42-76 part; Mix coupling agent and comprise organo-silicon coupling agent and titanate coupling agent, their shared parts by weight in glue are respectively 1-3 part, 2-4 part.The main component of its bonding resistance toheat of decision is the ternary heat stable resin in this heat-resistant and fire-retardant resin glue for encapsulation and impregnation.Adopting tetraethoxy modified epoxy phenolic aldehyde, bismaleimides and bisphenol-A epoxy among the present invention is main body material, has improved the resistance toheat of colloid system greatly.In conventional formulation, usefulness be the binary system of single epoxy or urethane/unsaturated polyester, do not see in prescription tetraethoxy modified epoxy phenolic aldehyde, bisphenol-A epoxy and bimaleimide resin coupling.There is the strong and phenyl ring of a large amount of heat-resisting group Si-C in the tetraethoxy modified epoxy phenolic aldehyde molecule, has a large amount of heat-resisting group imides in the bismaleimides, have the bonding group epoxy group(ing) of a large amount of polarity in the bisphenol-A epoxy molecule, have good cementability.Based on above these considerations, make whole resin system have good heat endurance.Having adopted bromination biphenyl anhydrous acid and polymeric amide among the present invention is dual cure agent system, thereby has improved the flame retardant resistance and the shock resistance of Resin adhesive system greatly.In conventional formulation, usefulness be single polymeric amide, this material molecule chain length, though good impact resistance, thermotolerance is relatively poor, and does not have flame retardant resistance.Adopt bromination biphenyl anhydrous acid and polymeric amide coupling among the present invention.Have flame retardant resistance owing to contain a large amount of halogen bromines in the bromination biphenyl anhydrous acid, the Heat stability is good of biphenyl makes the colloid cording that flame-retardance and thermal endurance be arranged in addition, in addition, introduces toughness molecular chain polymeric amide in system, and the system that makes has good shock resistance simultaneously.What use in the conventional formulation is single coupling agent.Adopt among the present invention and mix organo-silicon coupling agent and titanate coupling agent, improved the manufacturability of prescription Resin adhesive, make bubble collapse.

Details are as follows for the invention process: when preparing Resin adhesive of the present invention, when at first tetraethoxy modified epoxy phenolic aldehyde being heated to 60 ℃, add bisphenol-A epoxy and bimaleimide resin rise to 68-70 ℃ of continuously stirring reaction after 4 hours discharging promptly get the first component; Polymeric amide is heated to 50 ℃, added bromination biphenyl anhydrous acid and organosilicon KH550 and titanate coupling agent stirring reaction 3 hours, promptly get component B.

During use, with first component and component B with weight ratio: 100 to 100 mix, and under 40-50 ℃ High-Voltage Electrical Appliances are carried out the embedding dipping.Condition of cure is 80 ℃/4hr+130 ℃/2hr+140 ℃/8hr.

Remarkable advantages such as resin glue for encapsulation and impregnation of the present invention compares with traditional glue that to have resistance toheat good, fire-retardant, shock resistance and use good manufacturability are a kind of good heat-proof combustion-resistant sealing resin glue.

Example formulations 1:

Method preparation in the by specification, the each component parts by weight are respectively:

The first component:

30 parts of tetraethoxy epoxy novolacs

32 parts of bisphenol-A epoxies

10 parts of bismaleimidess

Component B:

20 parts of bromination biphenyl anhydrous acids

42 parts of polymeric amide

1 part of organo-silicon coupling agent

2 parts of titanate coupling agents

Implement prescription 2:

The first component:

50 parts of tetraethoxy epoxy novolacs

45 parts of bisphenol-A epoxies

20 parts of bismaleimidess

Component B:

30 parts of bromination biphenyl anhydrous acids

76 parts of polymeric amide

3 parts of organo-silicon coupling agents

4 parts of titanate coupling agents

Implement prescription 3:

The first component:

40 parts of tetraethoxy epoxy novolacs

39 parts of bisphenol-A epoxies

15 parts of bismaleimidess

Component B:

15 parts of bromination biphenyl anhydrous acids

57 parts of polymeric amide

2 parts of organo-silicon coupling agents

3 parts of titanate coupling agents

Glue to above-mentioned three kinds of prescriptions carries out every Performance Detection, and it the results are shown in Table shown in 1:

Table 1: three kinds of performance formula parameters

Test event	Testing method	Unit	Test result
				Prescription 1 prescription 2 prescriptions 3
			100 ℃/30min of Ma Tengsi heat shock resistance intensity water absorption linear expansion coefficient breakdown voltage K dielectric loss tg specific insulation		?DIN53458 ?ISO/R179 ?ISO/R117 ?VOE03004 ?IEC243 ?DIN53483 ?DIN53453 ?DIN53282	?℃ ?KJ/m2 ?％ ?K-1 ?KV/mm ?％ ?Ω·cm	??13.7?????????????146????????????140 ??13.1?????????????12.5???????????12.3 ??0.2??????????????0.25???????????0.22 ??3.2×10 -5???????3.0×10 -5?????3.1×10 -5??23???????????????25?????????????22 ??3.5??????????????3.4????????????3.5 ??0.5??????????????0.7????????????0.9 ??10 16????????????10 16??????????10 16

Claims (2)

1. When 1, a kind of high-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation is characterized in that the present invention at first is heated to 60 ℃ with tetraethoxy modified epoxy phenolic aldehyde, add bisphenol-A epoxy and bimaleimide resin rise to 68-70 ℃ of continuously stirring reaction after 4 hours discharging promptly get the first component; Polymeric amide is heated to 50 ℃, and adding bromination biphenyl anhydrous acid and organosilicon KH550 and titanate coupling agent control reaction were also stirred 3 hours, promptly got component B.During use, first component and component B are mixed with weight part 100 to 100, under 40-50 ℃, the high voltage electric device is carried out the embedding dipping.Condition of cure is 80 ℃/4hr+130 ℃/2hr+140 ℃/8hr.
2. 2, a kind of high-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation according to claim 1 is characterized in that described composition ratio is respectively:

   The first component:

   Tetraethoxy epoxy novolac 30-50 part

   Bisphenol-A epoxy 32-45 part

   Bismaleimides 10-20 part

   Component B:

   Bromination biphenyl anhydrous acid 20-30 part

   Polymeric amide 42-76 part

   Organo-silicon coupling agent 1-3 part

   Titanate coupling agent 2-4 part.