CN117067413B - Silicon powder collecting and processing device for monocrystalline silicon piece cutting processing - Google Patents
Silicon powder collecting and processing device for monocrystalline silicon piece cutting processingInfo
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Abstract
The invention discloses a silicon powder collecting and processing device and method for monocrystalline silicon wafer cutting processing, and in particular relates to the field of silicon powder collecting devices, which comprises a cutting workbench, a cutting machine and a silicon powder collecting box, wherein the silicon powder collecting box is communicated with one side of the cutting workbench, a first guide plate bent downwards and a second guide plate bent upwards are respectively arranged on the inner walls of the top and the bottom of the cutting workbench, a supporting frame is fixedly connected inside the silicon powder collecting box, a transmission rotating roller is rotatably connected on the inner wall of the supporting frame, a rotating motor and a suction pump are respectively connected at two ends of the transmission rotating roller, the suction pump is used for sucking silicon powder generated by monocrystalline silicon wafers in the cutting workbench, and a liquid storage tank and a dust storage tank are respectively and fixedly connected at the top and the bottom of the silicon powder collecting box, so that the silicon powder on a dust baffle plate finally falls into the dust storage tank.
Description
Technical Field
The invention belongs to the technical field of silicon powder collecting devices, and particularly relates to a silicon powder collecting and processing device and method for monocrystalline silicon wafer cutting processing.
Background
Monocrystalline silicon generally refers to a substance in which silicon atoms are formed in an arrangement. Monocrystalline silicon is taken as a relatively active nonmetallic element crystal, is an important component of a crystal material, and is at the front edge of new material development. The monocrystalline silicon material is manufactured through the following processes of quartz sand-metallurgical grade silicon-purification and refining-deposition polycrystalline silicon ingot-monocrystalline silicon-silicon wafer cutting, and silicon powder is generated in the cutting process of the monocrystalline silicon wafer.
The silicon powder collecting device is equipment for collecting and processing silicon powder, is mainly applied to the silicon powder collection generated in the monocrystalline silicon wafer cutting process in the industries of semiconductors, solar cells and the like, generally adopts a closed structure, and avoids the overflow of the silicon powder and the pollution of air.
In the existing production process of silicon powder collection or metal silicon generated by monocrystalline silicon cutting, although the silicon powder can be collected in a silicon powder collection box, in order to ensure that leakage occurs during silicon powder collection, the sealing performance of a silicon powder collection device is good, and a worker needs to disassemble the silicon powder collection device every time when taking out the silicon powder, so that the working time of the worker is wasted.
Therefore, in the prior art, although the sealing performance of the silicon powder collecting device is too good and cannot be disassembled, the silicon powder collecting device which does not have the reinforced circulation of gas is not provided, in the silicon powder collecting process, the silicon powder can be detonated due to electric spark generated by cutting, static electricity and/or heat conduction generated by cutting, and the silicon powder collecting device which is formed by taking oxygen in the air as a combustion supporting oxygen supply component explodes, even if the device which utilizes wind power to recover the silicon powder, such as the device of the Chinese utility model CN205926311U, CN218014797U, the risk of detonating can not be known, so that the gas circulation in the silicon powder collecting space cannot be controlled in the silicon powder collecting process, the gas density of mixed silicon powder particle gas formed by mixing the silicon powder and the gas is within the detonated range, and the floating silicon powder in the mixed silicon powder particle gas is further reduced, so that the floating silicon powder is also collected together with the silicon powder which is not floating, the escape is prevented, and the collected silicon powder collecting processing device and the method for cutting the single crystal silicon powder are the current problems to be solved.
Disclosure of Invention
The invention provides a silicon powder collecting and processing device and method for monocrystalline silicon wafer cutting processing aiming at the defects. According to the invention, the on-off of the cutting machine, the suction pump, the rotating motor and the propping cylinder are controlled in real time by utilizing the singlechip, so that the gas density of the mixed silicon powder particle gas of the air mixed with silicon powder in the silicon powder collecting box reaches the optimal mixed silicon powder particle gas under the maximum condition according to the gas viscosity saturation, the movement of the cutting machine, the suction pump and the rotating motor can be stopped when the gas density of the mixed silicon powder particle gas reaches the detonation critical value, the silicon powder group which is collected in the silicon powder collecting box 3 by gravity and blocked by the dust blocking plate enters the dust storage box, and the propping cylinder is controlled by the singlechip to move upwards to discharge water or liquid carbon dioxide from the liquid discharge pipe to absorb heat generated by the cutting machine, so that the temperature in the silicon powder collecting box is reduced, and floating silicon powder is further collected in the dust storage box, so that the silicon powder collecting device is prevented from being detonated, and the collection efficiency of the silicon powder is further improved.
The invention provides a silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing, which comprises a cutting workbench for placing monocrystalline silicon wafers to be cut, a cutting machine fixed in the cutting workbench and a silicon powder collecting box of front and rear hollowed-out plates, wherein the silicon powder collecting box is communicated with the right side of the cutting workbench, a first downward bent guide plate and a second upward bent guide plate are respectively arranged on the top and bottom inner walls of the cutting workbench, a supporting frame is arranged in the silicon powder collecting box, a transmission rotary roller is rotationally connected to the inner wall of the supporting frame, a rotary motor is rotationally connected to the right end of the transmission rotary roller, a suction pump is arranged at the left end of the transmission rotary roller, the suction pump is used for sucking silicon powder generated by monocrystalline silicon wafers in the cutting workbench when being started, a liquid storage box and a dust storage box are respectively fixedly connected to the top and the bottom of the silicon powder collecting box, a temperature sensor, a gas density sensor and an ultrasonic sensor are respectively arranged at the top bottom of the silicon powder collecting box, two pipes are communicated with the bottom of the liquid storage box, a suction pipe is fixedly connected with the top collecting motor, a gas pipe is fixedly connected with the top end of the suction rotary motor, a gas transmission pipe is connected with the suction pump, and the suction pump is connected with the suction pump and the suction pump in a singlechip, and the cutting machine is in real-time air cylinder is connected with the cutting machine through the rotary compressor, and the suction pump is in real-time, and the air is connected with the suction pump is in the rotary compressor and the air cylinder and the rotary compressor is connected with the rotary compressor and the air pump and the air sensor is simultaneously used for controlling and the suction pump And the suction pump and the rotating motor are restarted, and the jacking cylinder is stopped to return to the initial position at the same time, so that silicon powder during monocrystalline silicon wafer cutting processing is collected into the dust storage box.
Further, the method for controlling the opening and closing of the jacking cylinder, the cutting machine, the suction pump and the rotating motor by the singlechip in real time comprises the following steps of:
1) The method comprises the steps of monitoring the real-time silicon powder mixed gas density rho in the silicon powder collecting box by adopting the gas density sensor, monitoring the real-time temperature T of the silicon powder collecting box by adopting the temperature sensor, and monitoring the real-time r-axis movement speed in a polar coordinate system of silicon powder mixed gas particles mixed with the air of silicon powder by adopting the ultrasonic sensor in real time Real-time motion speed of theta axisAnd z-axis real-time motion speed;
2) Constructing a gas viscous saturation model in the silicon powder collecting box:
;
wherein, the Is a real-time motion velocity vector of the silicon powder mixed gas particles,Is thatIs provided with a die for the mold,,The viscosity of the silicon powder mixed gas is the viscosity; c is the air specific heat capacity, t is the real-time moment of collecting data in the step 1);
the model constructed in the step 2) is used for solving the maximum silicon powder mixed gas density for avoiding the condition that the air containing silicon powder explodes due to the heating and density increase of heat generated by cutting monocrystalline silicon wafers by the cutting machine (2) and the silicon powder collecting box (3) ;
3) The maximum silicon powder mixed gas density obtained by adopting the particle swarm optimization algorithm to continuously optimizeIth maximum silicon powder mixed gas density in particle swarm optimization processThe update rate of (2) is:
;
wherein, the Is the ith-1 st maximum silicon powder mixed gas densityIs updated at a rate of update of (a); As a result of the first learning factor, As a result of the second learning factor,=1.5,= 2;N is the optimization of the maximum silicon powder mixed gas density using particle swarm optimization algorithmIs a sample number of (a);
At an update rate Updating the obtained (i+1) th maximum silicon powder mixed gas densityThe value of (2) is;
4) Constructing an optimal value of the maximum silicon powder mixed gas densityParticle-optimized convergence value of (2)And (3) calculating a model:
;
Wherein lambda is the average value of the density of the collected N maximum silicon powder mixed gases, =;
5) Judging the particle optimizing convergence value obtained in the step 4)If the density of the mixed gas is larger than 0.86, outputting the obtained optimal value of the maximum silicon powder mixed gas densityOtherwise, repeating the steps 1) -4), and continuing updating iteration;
6) Judging the optimal value of the maximum silicon powder mixed gas density obtained in the step 5) And if the silicon powder detonation threshold value is greater than 100, controlling the opening of the jacking cylinder, and simultaneously controlling the cutting machine, the suction pump and the rotating motor to stop.
Further, the viscosity of the silicon powder mixed gasThe calculation formula of (2) is as follows:
;
wherein eta is the viscosity coefficient of the silicon powder mixed gas,
;
Wherein, the Is the air viscosity coefficient at 25 ℃,=1.85×10-5,To monitor the initial temperature in the silicon powder collection tank at the beginning.
Further, the cylindric outer wall fixedly connected with dust collection flabellum of transmission commentaries on classics roller, the transmission commentaries on classics roller in the inboard tip fixedly connected with of silica flour collection box is first gear, the bottom meshing of first gear has first rack, one side fixedly connected with screw thread post of first rack, the outer wall of screw thread post is through threaded connection having the screw thread commentaries on classics cover, the screw thread changes one side of cover through bearing connection at the silica flour collection box, the outer wall fixedly connected with second gear of screw thread commentaries on classics cover, the bottom meshing of second gear has the second rack, the bottom fixedly connected with of second rack is in the movable support of vertical plane, one side fixedly connected with of movable support is in the dust board that the level set up, the dust board is in one side fixedly connected with first spring of vertical plane of movable support place, fixedly connected with loose scraper blade on the outer wall upper portion fixedly connected with movable scraper blade of the transmission commentaries on classics roller is kept away from on the outer wall of rotating electrical machines one side, the movable scraper blade is towards being close to the side of flabellum and is connected with cleaning brush on the side of collection flabellum.
Further, the inner wall fixedly connected with alarm device of dust storage case, alarm device's top fixedly connected with alarm switch, alarm switch's top is equipped with corresponding formula extrusion post.
Further, the inner walls of the front side and the rear side of the dust storage box are slidably connected with bearing plates, the bearing plates are fixedly connected to the tops of the corresponding extrusion columns, four second springs are fixedly connected to the bottoms of the bearing plates, and the lower ends of the second springs are fixedly connected to the inner walls of the dust storage box.
Further, the bottom intercommunication of liquid reserve tank is equipped with two fluid-discharge tubes, the top of propping up the cylinder is equipped with circular fly leaf, the top fixedly connected with fly leaf of circular fly leaf, the fly leaf that the top fixedly connected with front and back direction of fly leaf set up, the fly leaf is located the lower part in the mid point position of fly leaf, the bottom of fly leaf front end and rear end is all fixedly connected with a shutoff piece, every shutoff piece sliding connection is at the inner wall of corresponding fluid-discharge tube.
Further, the silicon powder collecting box is fixedly connected with a supporting seat at the lower end of the top of one side, far away from the movable rod, of the liquid discharge pipe at the rear side, a warning bell is fixedly connected to the bottom of the supporting seat, a corresponding collision column is arranged on one side, close to the movable rod, of the warning bell, a supporting piece is fixedly connected to the inner wall of the liquid discharge pipe at the rear side of the silicon powder collecting box, a transmission rotating rod is rotatably connected to the inner wall of the supporting piece, a plurality of rotating fan blades are fixedly connected to the top of the transmission rotating rod, each rotating fan blade is obliquely arranged relative to the horizontal plane, a movable extrusion block is fixedly connected to the bottom of the transmission rotating rod, a movable push plate is arranged on one side, far away from the movable rod, of the movable extrusion block, and the movable push plate is fixedly connected to one end of the corresponding collision column.
Further, the top lower extreme of silica flour collecting box in the supporting seat with fixedly connected with backup pad between the fluid-discharge tube of rear side, the backup pad is close to one side bottom fixedly connected with third spring of activity push pedal, the other end fixedly connected with of third spring is in one side of activity push pedal.
The invention also provides a silicon powder collecting and processing method for monocrystalline silicon wafer cutting processing, which is realized by adopting the silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing, and comprises the following steps:
s1, the singlechip controls the rotary motor and the suction pump to be started, and the rotary motor drives the transmission rotary roller to rotate so as to drive the dust baffle plate to move towards the direction close to the cutting workbench, and finally, the dust baffle plate is completely covered on the upper part of the dust storage box;
S2, the suction pump simultaneously sucks silicon powder generated by cutting monocrystalline silicon pieces by the cutting machine, and the silicon powder enters the silicon powder collecting box through the diversion of the first diversion plate and the second diversion plate;
s3, judging whether the gas density of the silicon powder mixed air of the silicon powder in the silicon powder collecting box sucked by the suction pump to the silicon powder collecting box is larger than a silicon powder detonation critical value or not according to data acquired by the temperature sensor, the gas density sensor and the ultrasonic sensor in real time, if so, controlling the cutting machine, the suction pump and the rotating motor to stop working, returning the dust baffle to an initial position, collecting and collecting the silicon powder by the dust baffle to fall into the dust collecting box, controlling the jacking cylinder to move upwards, and enabling liquid in the liquid collecting box to fall from top to bottom through two liquid discharge pipes to clean floating silicon powder remained in the air in the silicon powder collecting box;
s4, starting the cutter, the suction pump and the rotating motor again and controlling the jacking cylinder to return to the initial position.
The beneficial effects of the invention are as follows:
1. according to the invention, the on-off of the cutting machine, the suction pump, the rotating motor and the propping cylinder are controlled in real time by utilizing the singlechip, so that the gas density of the mixed silicon powder particle gas of the air mixed with silicon powder in the silicon powder collecting box reaches the optimal mixed silicon powder particle gas under the maximum condition according to the gas viscosity saturation, the movement of the cutting machine, the suction pump and the rotating motor can be stopped when the gas density of the mixed silicon powder particle gas reaches the detonation critical value, the silicon powder group which is collected in the silicon powder collecting box 3 by gravity and blocked by the dust blocking plate enters the dust storage box, and the propping cylinder is controlled by the singlechip to move upwards to discharge water or liquid carbon dioxide from the liquid discharge pipe to absorb heat generated by the cutting machine, so that the temperature in the silicon powder collecting box is reduced, and floating silicon powder is further collected in the dust storage box, so that the silicon powder collecting device is prevented from being detonated, and the collection efficiency of the silicon powder is further improved.
2. The singlechip in the silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing provided by the invention firstly builds a gas viscous saturation model when controlling the gas density of mixed silicon powder particle gas of air mixed with silicon powder entering the singlechip: fully considers the motion speed of the real-time motion of the gas particles and the viscosity of the silicon powder mixed gas caused by the friction generated by mutual collision And then can calculate the biggest silica flour mixed gas density when gas viscosity saturation reaches the biggest to judge whether it is greater than silica flour and detonate the critical value, if gas density is again big, will take place the danger of being detonated, consequently singlechip control cutting machine, suction pump and rotating electrical machines stop the motion, and then effectively avoided silica flour collection device to be detonated.
3. When the gas density of the optimal mixed silicon powder particle gas when the gas viscosity saturation reaches the maximum is calculated, a particle swarm optimization algorithm is adopted, the gas density of the optimal mixed silicon powder particle gas obtained by calculating the constructed gas viscosity saturation model is collected to form a sample data set of N samples, and an ith sample (namely the ith maximum silicon powder mixed gas density is constructed) According to the updated iterative model and the obtained optimal value of the maximum silicon powder mixed gas densityParticle-optimized convergence value of (2)The calculation model is used for training the data set, and when the maximum silicon powder mixed gas density is obtained according to various data acquired in real time and the constructed gas viscosity saturation model, the calculation accuracy and accuracy are improved, and the situation of control errors of the singlechip is avoided.
4. According to the invention, the threaded rotating sleeve and the dust baffle are arranged, when silicon powder is collected, the first gear is driven by the transmission rotating roller to be meshed with the first rack, the threaded column is driven by the first rack to enable the threaded rotating sleeve to rotate, the second gear is driven by the threaded rotating sleeve to be meshed with the second rack, the dust baffle is driven by the second rack to move the movable support, the silicon powder in the silicon powder collecting box can fall onto the dust baffle, the dust baffle is reset by the first spring after cutting, the silicon powder on the dust baffle can fall into the dust storage box, so that the silicon powder collecting and sorting are convenient for staff, and the problem that the silicon powder can be taken out only by disassembling the silicon powder collecting device every time by the staff is solved.
5. According to the invention, the propping cylinder and the blocking block are arranged, when the density of the silicon powder mixed gas in the silicon powder collecting box reaches the silicon powder detonation critical value, the singlechip controls the propping cylinder to move upwards, the propping cylinder can extrude the circular movable plate, the circular movable plate can drive the movable rod to move, the movable rod can drive the movable plate to move, the blocking block can be driven by the movable plate to move, the liquid discharge pipe can not be blocked any more, and the liquid discharge pipe can discharge water or liquid carbon dioxide in the liquid storage box into the silicon powder collecting box to absorb heat and cool and simultaneously further collect floating silicon powder into the dust storage box.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a cross-sectional view of the dust box structure of the present invention.
Fig. 3 is an enlarged view of the structure of the portion a of fig. 2 according to the present invention.
Fig. 4 is an enlarged view of the B-section structure of fig. 2 according to the present invention.
FIG. 5 is a cross-sectional view of the silicon powder collection box of the present invention.
Fig. 6 is an enlarged view of the C-section structure of fig. 5 according to the present invention.
Fig. 7 is an enlarged view of the D portion structure of fig. 5 according to the present invention.
Fig. 8 is a sectional view of the structure of the liquid storage tank of the present invention.
Fig. 9 is an enlarged view of the E-section structure of fig. 8 according to the present invention.
Fig. 10 is an enlarged view of the F-section structure of fig. 8 according to the present invention.
FIG. 11 is a flow chart of a method for controlling a cutting machine, a suction pump, a rotating motor and a jacking cylinder by a singlechip according to the invention.
The reference sign is 1, a cutting workbench; 101, a first guide plate, 102, a second guide plate, 2, a cutting machine, 3, a silicon powder collecting box, 4, a supporting frame, 5, a transmission rotary roller, 501, a suction pump, 6, a rotary motor, 7, a dust collecting fan blade, 8, a first gear, 9, a first rack, 10, a threaded column, 11, a threaded sleeve, 12, a second gear, 13, a second rack, 14, a movable bracket, 15, a dust baffle, 16, a first spring, 17, a dust storage box, 18, a movable ring, 19, a movable scraping plate, 20, a cleaning brush, 21, an alarm device, 22, an alarm switch, 23, a corresponding type extrusion column, 24, a bearing plate, 25, a second spring, 26, a liquid storage box, 27, a liquid discharge pipe, 28, a ventilation pipe, 29, a top supporting cylinder, 30, a round movable plate, 301, a hollow plate, 302, a right side plate, 31, a movable rod, 32, a movable plate, 33, a sealing block, 34, a supporting seat, 35, a warning ring, 36, a corresponding type collision column, 37, a supporting piece, 38, a transmission device, a warning push plate, 39, a rotary push plate, 40, a movable push plate, 41, a third push plate and a movable push plate.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-10, the silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing provided by the invention comprises a cutting workbench 1 for placing monocrystalline silicon wafers to be cut, a cutting machine 2 fixed in the cutting workbench 1 and a silicon powder collecting box 3 of front and rear hollowed-out plates, wherein the silicon powder collecting box 3 is communicated with the right side of the cutting workbench 1, a first guide plate 101 bent downwards and a second guide plate 102 bent upwards are respectively arranged on the inner walls of the top and the bottom of the cutting workbench 1, the arch-shaped bending cambered surfaces of the first guide plate 101 and the second guide plate 102 face one side of the cutting workbench 1 so as to form a guide channel for guiding cut silicon powder, a support frame 4 is arranged in the silicon powder collecting box 3, and the support frame 4 is transversely fixed between the hollowed-out plate 301 in the middle of the silicon powder collecting box 3 and a right side plate 302 with a plurality of parallel equidistant gaps; the inner wall of the support frame 4 is rotationally connected with a transmission rotary roller 5 arranged in the left-right direction, the right end of the transmission rotary roller 5 is rotationally connected with a rotary motor 6, the rotary motor 6 is HG-JR2034 series servo rotary motor equipment, the left end of the transmission rotary roller 5 is provided with a suction pump 501, the suction pump 501 is used for sucking silicon powder generated by cutting monocrystalline silicon wafers in the workbench 1 when being opened, the top and the bottom of the silicon powder collecting box 3 are respectively fixedly connected with a liquid storage box 26 and a dust storage box 17, the bottom of the top of the silicon powder collecting box 3 is provided with a temperature sensor, a gas density sensor and an ultrasonic sensor, the bottom of the liquid storage box 26 is communicated with two liquid discharge pipes 27, the lower end of the top of the silicon powder collecting box 3 is fixedly connected with a gas permeability pipe 28, the inner bottom of the gas permeability pipe 28 is provided with a top support cylinder 29, and the cutting machine 2, the suction pump 501, the rotary motor 6 and the top support cylinder 29 are respectively The temperature sensor, the gas density sensor and the ultrasonic sensor are all in remote communication connection with the singlechip, and the singlechip is used for controlling the upward movement of the propping cylinder 29 in real time according to the gas density of the silicon powder mixed air sucked into the silicon powder collecting box 3, stopping restarting the cutting machine 2, the suction pump 501 and the rotating motor 6 and simultaneously stopping returning the propping cylinder 29 to the initial position so as to collect the silicon powder in the silicon single crystal wafer cutting process into the dust storage box 17.
The dust box 17 is arranged at the left side of the hollowed-out plate 301 and at the lower part of the silicon powder collecting box 3 between the right side end parts of the cutting workbench 1, the first guide plate 101 and the second guide plate 102 extend to the vertical space range between the top plate of the silicon powder collecting box 3 and the upper part of the dust box 17 from the right side end parts of the cutting workbench 1 in an arc-shaped curved surface track, the dust baffle 15 is arranged at the upper part of the dust box 17, the area of the dust baffle 15 is consistent with the upper surface of the dust box 17, so that the sucked silicon powder can be gradually covered and completely prevented from falling into the dust box 17 when being pushed to the upper part of the dust box 17, the silicon powder is collected firstly and then uniformly fallen into the dust box 17, and the singlechip is used for carrying out the gas density of the air mixed with silicon powder in the silicon powder collecting box 3 according to the data collected by each sensor, so that explosion can be generated after the gas density of the air mixed with silicon powder in the silicon powder collecting box 3 due to heat generated by cutting of a single crystal by the cutter 2 reaches a certain degree, and explosion can be generated, therefore, when the gas density mixed with silicon powder reaches a critical value: when 100g/m 3, the single chip machine controls the cutting machine 2, the suction pump 501 and the rotary motor 6 to stop moving, controls the top supporting cylinder 29 to open and then move upwards, so that the liquid in the liquid storage tank 26 is discharged from the two liquid discharge pipes 27, and further, the silicon powder sucked by the suction pump 501 falls into the dust storage tank 17 due to the action of gravity, and then the floating silicon powder in the silicon powder collecting tank 3 is further removed by the liquid discharged from the liquid discharge pipes 27, so that the technical effect of thoroughly removing and collecting the silicon powder is achieved, the production safety accidents caused by that the silicon powder reaches a certain density and concentration in the silicon powder collecting box 3 and is detonated under the heating ignition of electric sparks and/or heat generated by cutting are avoided.
As a preferred embodiment of the present invention, as shown in fig. 11, in order to provide a flowchart of a method for controlling the opening of the jacking cylinder 29 in real time and simultaneously stopping the opening of the rotating electric machine 6 and restarting the rotating electric machine 6 by the singlechip in order to collect silicon powder in the dust storage tank 17 during the cutting process of monocrystalline silicon wafers, in order to improve the accurate time for controlling the cutting machine 2, the suction pump 501 and the rotating electric machine to stop working by the singlechip, the density of the air mixed with silicon powder in the silicon powder collecting tank 3 needs to be monitored in real time, so as to ensure that the air mixed with silicon powder cannot be in a gas viscous saturation state caused by the excessive concentration of the silicon powder in the air mixed with silicon powder, and the concentration of the silicon powder further reduces the temperature condition required by detonation while affecting the circulation rate of the gas, the method for controlling the opening and closing of the jacking cylinder 29, the cutting machine 2, the suction pump 501 and the rotating electric machine 6 in real time provided by the singlechip in the present invention comprises the following steps:
1) Monitoring the real-time silicon powder mixed gas density rho in the silicon powder collecting box 3 by adopting a gas density sensor, monitoring the real-time temperature T of the silicon powder collecting box 3 by adopting a temperature sensor and monitoring the r-axis real-time movement speed in a polar coordinate system of silicon powder mixed gas particles mixed with the air of silicon powder by adopting an ultrasonic sensor in real time Real-time motion speed of theta axisAnd z-axis real-time motion speed;
2) Constructing a gas viscous saturation model in the silicon powder collecting box 3:
;
wherein, the Is a real-time motion velocity vector of the silicon powder mixed gas particles,Is thatIs provided with a die for the mold,,The viscosity of the silicon powder mixed gas is the viscosity; the gradient operator is c is the air specific heat capacity, T is the real-time moment of collecting data in the step 1), namely the density rho of the real-time four silicon powder mixed gas collected in the step 1) is rho (T), the density rho of the real-time silicon powder mixed gas by adopting various corresponding sensors in the step 1) is rho (T), the real-time temperature T of the silicon powder collecting box 3 is T (T), and the r-axis real-time movement speed in the polar coordinate system of the silicon powder mixed gas particles of the air mixed with silicon powder is obtained Namely, isReal-time motion speed of theta axisNamely, isReal-time motion speed of z-axisNamely, is;
The model constructed in the step 2) is used for obtaining the maximum silicon powder mixed gas density of the silicon powder mixed air containing silicon powder, which is pumped up by the suction pump 501 in the silicon powder collecting box 3, so that under the condition that the heat of the monocrystalline silicon wafer cut by the cutting machine 2 is heated by heat conduction, the condition that the silicon powder mixed air containing silicon powder is exploded due to the heating of the heat generated by the monocrystalline silicon wafer cut by the cutting machine 2 and the increase of the density is avoided;
3) The maximum silicon powder mixed gas density obtained by adopting the particle swarm optimization algorithm to continuously optimizeIth maximum silicon powder mixed gas density in particle swarm optimization processThe update rate of (2) is:
;
wherein, the Is the ith-1 st maximum silicon powder mixed gas densityIs updated at a rate of update of (a); As a result of the first learning factor, As a result of the second learning factor,=1.5,= 2;N is the optimization of the maximum silicon powder mixed gas density using particle swarm optimization algorithmIs a sample number of (a);
At an update rate Updating the obtained (i+1) th maximum silicon powder mixed gas densityThe value of (2) is;
4) Constructing an optimal value of the maximum silicon powder mixed gas densityParticle-optimized convergence value of (2)And (3) calculating a model:
;
Wherein lambda is the average value of the density of the collected N maximum silicon powder mixed gases, =;
5) Judging the particle optimizing convergence value obtained in the step 4)If the density of the mixed gas is larger than 0.86, outputting the obtained optimal value of the maximum silicon powder mixed gas densityOtherwise, repeating the steps 1) -4), and continuing updating iteration;
6) Judging the optimal value of the maximum silicon powder mixed gas density obtained in the step 5) Whether the unit is g/m 3 is larger than the silicon powder detonation critical value 100, if yes, the top support cylinder 29 is controlled to be opened, and meanwhile, the cutting machine 2, the suction pump 501 and the rotating motor 6 are controlled to be stopped.
Further preferably, the viscosity of the silicon powder mixed gasThe calculation formula of (2) is as follows:
;
wherein eta is the viscosity coefficient of the silicon powder mixed gas,
;
Wherein, the Is the air viscosity coefficient at 25 ℃,=1.85×10-5,To monitor the initial temperature in the silicon powder collection tank 3 at the beginning.
As another preferred embodiment of the invention, a dust collecting fan blade 7 is fixedly connected to the cylindrical outer wall of a transmission rotary roller 5, a first gear 8 is fixedly connected to the inner side end part of the silicon powder collecting box 3, a first rack 9 arranged in the front-rear direction is meshed with the bottom of the first gear 8, a threaded column 10 is fixedly connected to one side of the first rack 9, a threaded rotary sleeve 11 is connected to the outer wall of the threaded column 10 through threads, the threaded rotary sleeve 11 is connected to one side of the silicon powder collecting box 3 through a bearing, a second gear 12 is fixedly connected to the outer wall of the threaded rotary sleeve 11, as shown in fig. 6, a second rack 13 is meshed to the bottom of the second gear 12, the second gear 12 is positioned on a rear vertical box plate of the silicon powder collecting box 3, the first rack 9 is positioned on the outer wall of the rear vertical box plate of the silicon powder collecting box 3, a movable bracket 14 positioned in the left-right direction is fixedly connected to the bottom of the second rack 13, a dust baffle 15 positioned in the horizontal direction is fixedly connected to one side of the movable bracket 14, one side of the movable bracket 14 is fixedly connected to a first spring 16 positioned on the side of the vertical plane of the movable bracket 14, a dust collecting ring 16 is positioned on the side of the movable bracket 16, a dust collecting ring 19 is positioned on the rear vertical side of the movable ring 19 and is positioned on the rear vertical side of the movable ring 18, and is positioned on the rear side of the movable ring 18 and is positioned on the movable ring 18.
It should be noted that, when the single-chip microcomputer controls the cutting machine 2 to cut the monocrystalline silicon piece, and at the same time, the rotating motor 6 is turned on, the rotating motor 6 rotates the dust collecting fan blade 7 through the transmission rotating roller 5, the dust collecting fan blade 7 further cooperates with the suction pump 501 to generate suction force to suck the silicon powder into the silicon powder collecting box 3, further, the suction force generated by the dust collecting fan blade 7 to keep the silicon powder escaping from the left side of the hollow plate 301 in the middle of the silicon powder collecting box 3 when the suction force of the suction pump 501 is not sucked is avoided, the setting of the dust collecting fan blade 7 improves the effect of collecting the silicon powder, the phenomenon that excessive silicon powder is not collected and escapes is avoided, meanwhile, the transmission rotating roller 5 drives the first gear 8 to rotate, the first gear 8 can mesh the first rack 9, the first rack 9 can drive the threaded column 10 to move, the screw thread post 10 can rotate the screw thread rotating sleeve 11 through screw threads, the screw thread rotating sleeve 11 can drive the second gear 12 to rotate, the second gear 12 can be meshed with the second rack 13, the second rack 13 can drive the movable support 14 to move, the movable support 14 can drive the dust baffle 15 to move, the silicon powder in the silicon powder collecting box 3 can fall onto the dust baffle 15, when the rotating motor 6 is closed by a worker after or during cutting, or the single chip microcomputer judges that the gas density of the air mixed with the silicon powder in the silicon powder collecting box 3 reaches the silicon powder detonation critical value on the basis of all acquired data, the rotating motor 6 is controlled to stop, when the rotating motor 6 stops, the first spring 16 can reset the dust baffle 15, the silicon powder on the dust baffle 15 can fall into the dust storage box 17, thereby facilitating the collection and arrangement of the silicon powder by the worker, the problem that the staff needs to disassemble the silicon powder collecting device every time to take out the silicon powder is solved.
Further, as shown in fig. 3, the inner wall of the dust box 17 is fixedly connected with an alarm device 21, the alarm device 21 is SCDC0940 series passive buzzer alarm equipment, the top of the alarm device 21 is fixedly connected with an alarm switch 22, the top of the alarm switch 22 is provided with a corresponding extrusion column 23, the inner walls of the front side and the rear side of the dust box 17 are slidably connected with a bearing plate 24, the bearing plate 24 is fixedly connected with the top of the corresponding extrusion column 23, the bottom of the bearing plate 24 is fixedly connected with four second springs 25, the bearing plate 24 is respectively provided with a second spring 25 at the lower parts of the left end and the right end of the front side, the lower parts of the left end and the right end of the rear side of the bearing plate are respectively provided with a second spring 25, and the lower end of each second spring 25 is fixedly connected to the inner wall of the dust box 17.
It should be noted that, when the silicon powder in the dust bin 17 is collected fully, the bearing plate 24 will move downwards due to the weight of a large amount of silicon powder, the bearing plate 24 will drive the corresponding extrusion column 23 to move, the corresponding extrusion column 23 will extrude the alarm switch 22 to open the alarm device 21, and the alarm device 21 will sound to remind the staff to take out the silicon powder in the dust bin 17.
Further preferably, the alarm switch 22 and the alarm device 21 are also in remote communication with the single chip microcomputer.
Further, as shown in fig. 1, two liquid discharge pipes 27 are connected to the bottom of the liquid storage tank 26, it is to be noted that, normal temperature water can be stored in the liquid storage tank 26, the discharged water is used to remove floating silicon powder which cannot fall due to the action of gravity from the silicon powder collection tank 3, or liquid carbon dioxide which can be stored in the liquid storage tank 26 in a cold manner can be additionally provided outside the liquid storage tank 26, at this time, a refrigerating device or a cold and heat insulation device can be additionally provided outside the liquid storage tank 26, when the liquid carbon dioxide is discharged from the liquid discharge pipes 27 from top to bottom into the silicon powder collection tank 3, the heat generated by the cutting machine 2 cutting the silicon wafers can be absorbed due to heat exchange, and on the basis of heat exchange, the gas volume of the silicon powder collection tank 3 is gradually increased from top to bottom due to continuous release of the liquid carbon dioxide, therefore, the floating silicon powder can be promoted to be pushed into the dust storage tank 17 by the carbon dioxide converted into the gas state after the liquid heat absorption, the top of the top support cylinder 29 is provided with a circular movable plate 30, the circular movable plate 30 has the same area as the circular cross section area of the circular tube 28, the movable plate 30 is fixedly connected with the movable plate 31 at the top of the front end of the movable plate 32, and the movable plate 33 is fixedly connected to the corresponding movable block 32 at the bottom end 32, and the front end of the movable plate 33 is fixedly connected to the movable block 33.
It should be noted that, when the gas density of the air mixed with the silicon powder in the silicon powder collecting box 3 reaches the critical value of silicon powder detonation, under the control of the singlechip, the propping cylinder 29 will move upwards to squeeze the circular movable plate 30, the circular movable plate 30 will drive the movable rod 31 to move, the movable rod 31 will drive the movable plate 32 to move, the movable plate 32 will drive the blocking block 33 to move, the drain pipe 27 will not be blocked any more, the drain pipe 27 will discharge the liquid carbon dioxide in the liquid storage box 26 into the silicon powder collecting box 3 to absorb the heat generated by redundant cutting, and at the same time, the floating silicon powder is further pressed into the dust storage box 17.
As another preferred embodiment of the invention, as shown in FIG. 9, a supporting seat 34 is fixedly connected to the lower end of the top of one side, far away from the movable rod 31, of the liquid discharge tube 27 at the rear side of the silicon powder collecting box 3, a warning bell 35 is fixedly connected to the bottom of the supporting seat 34, a corresponding collision post 36 is arranged on one side, close to the movable rod 31, of the warning bell 35, a supporting piece 37 is fixedly connected to the inner wall of the liquid discharge tube 27 at the rear side of the silicon powder collecting box 3, a transmission rotating rod 38 is rotatably connected to the inner wall of the supporting piece 37, a plurality of rotating fan blades 39 are fixedly connected to the top of the transmission rotating rod 38, each rotating fan blade 39 is obliquely arranged relative to the horizontal plane, a movable extrusion block 40 is fixedly connected to the bottom of the transmission rotating rod 38, a movable push plate 41 is arranged on one side, far away from the movable rod 31, of the movable push plate 41 is fixedly connected to one end of the corresponding collision post 36. A supporting plate 42 is fixedly connected between the supporting seat 34 and the liquid discharge pipe 27 at the rear side at the lower end of the top of the silicon powder collecting box 3, a third spring 43 is fixedly connected to the bottom of one side of the supporting plate 42 close to the movable push plate 41, and the other end of the third spring 43 is fixedly connected to one side of the movable push plate 41.
It should be noted that, when the gas density of the air mixed with the silicon powder in the silicon powder collecting box 3 reaches the critical value of silicon powder detonation, under the control of the singlechip, the liquid carbon dioxide in the liquid storage box 26 is released by the driving of the jacking cylinder 29, the liquid carbon dioxide impacts the rotating fan blade 39 to rotate the rotating fan blade 39, the rotating fan blade 39 drives the transmission rotating rod 38 to rotate, the transmission rotating rod 38 drives the movable extrusion block 40 to rotate, the movable extrusion block 40 extrudes the movable push plate 41, the movable push plate 41 drives the corresponding collision column 36 to move, the movable push plate 41 resets through the third spring 43, the corresponding collision column 36 is continuously driven by the movable push plate 41 to strike the warning bell 35, the warning bell 35 continuously sounds to remind surrounding staff, and the staff is prevented from approaching the silicon powder collecting box 3.
The invention also provides a silicon powder collecting and processing method for monocrystalline silicon wafer cutting processing, which is realized by adopting the silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing provided by any embodiment, and comprises the following steps:
S1, a single chip microcomputer controls a rotary motor 6 and a suction pump 501 to be started, the rotary motor 6 drives a transmission rotary roller 5 to rotate, and then drives a dust baffle 15 to move towards the direction close to a cutting workbench 1, and finally, the dust baffle is completely covered on the upper part of a dust storage box 17;
S2, a suction pump 501 simultaneously sucks silicon powder generated by cutting monocrystalline silicon pieces by a cutting machine 2, and the silicon powder enters a silicon powder collecting box 3 through diversion of a first diversion plate 101 and a second diversion plate 102;
S3, judging whether the gas density of the silicon powder mixed air of the silicon powder in the silicon powder collecting box 3 sucked by the suction pump 501 is larger than a silicon powder detonation critical value according to data acquired in real time by the temperature sensor, the gas density sensor and the ultrasonic sensor, if so, controlling the cutting machine 2, the suction pump 501 and the rotating motor 6 to stop working, returning the dust baffle 15 to an initial position, and collecting the collected silicon powder by the dust baffle 15 to fall into the dust storage box 17, and simultaneously controlling the jacking cylinder 29 to move upwards, and enabling liquid in the liquid storage box 26 to fall from top to bottom through two liquid discharge pipes 27 to remove floating silicon powder remained in the air in the silicon powder collecting box 3;
s4, the cutter 2, the suction pump 501 and the rotary motor 6 are turned on again and the jack cylinder 29 is controlled to return to the initial position.
In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, where "up," "down," "left," "right," etc. are merely used to indicate relative positional relationships, and when the absolute position of an object to be described changes, the relative positional relationships may change;
In the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other without conflict;
finally, the foregoing description of the preferred embodiment of the invention is provided for the purpose of illustration only, and is not intended to limit the invention to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (9)
1. The silicon powder collecting and processing device for monocrystalline silicon wafer cutting processing comprises a cutting workbench (1) for placing monocrystalline silicon wafers to be cut, a cutting machine (2) and a silicon powder collecting box (3) which are arranged inside the cutting workbench (1) and hollow plates in front and back, wherein the silicon powder collecting box (3) is communicated with the right side of the cutting workbench (1), the device is characterized in that a first guide plate (101) which bends downwards and a second guide plate (102) which bends upwards are respectively arranged on the top and bottom inner walls of the cutting workbench (1), a supporting frame (4) is arranged inside the silicon powder collecting box (3), the inner wall of the supporting frame (4) is rotationally connected with a transmission rotating roller (5), the right end of the transmission rotating roller (5) is rotationally connected with a rotary motor (6), the left end of the transmission rotating roller (5) is provided with a suction pump (501), the suction pump (501) is used for sucking silicon powder generated in the cutting workbench (1) when being started, the top and the bottom of the silicon powder collecting box (3) are respectively and fixedly connected with a supporting frame (4), the top and the bottom of the silicon powder collecting box (3) are respectively provided with a liquid storage tank (26) and a liquid discharge tube (27), the bottom of the silicon wafer is provided with a liquid discharge tube (27), the top lower extreme fixedly connected with ventilation pipe (28) of silica flour collecting box (3), the inside bottom of ventilation pipe (28) is equipped with jack-up cylinder (29), cutting machine (2), suction pump (501), rotating electrical machines (6) and jack-up cylinder (29), temperature sensor gas density sensor with ultrasonic sensor all with singlechip remote communication connection, singlechip is used for stopping when being sucked to the gaseous density real-time control jack-up cylinder (29) of silica flour mixed air in silica flour collecting box (3) upward movement cutting machine (2), suction pump (501) with rotating electrical machines (6) and cutting machine (2), suction pump (501) with in the time of the restarting of rotating electrical machines (6) stop jack-up cylinder (29) and resume initial position to collect silica flour when monocrystalline silicon wafer cutting process in dust bin (17);
The method for controlling the opening and closing of the jacking cylinder (29), the cutting machine (2), the suction pump (501) and the rotating motor (6) by the singlechip in real time comprises the following steps of:
1) Monitoring the real-time silicon powder mixed gas density rho in the silicon powder collecting box (3) by adopting the gas density sensor, monitoring the real-time temperature T of the silicon powder collecting box (3) by adopting the temperature sensor, and monitoring the r-axis real-time movement speed in a polar coordinate system of silicon powder mixed gas particles mixed with the air of silicon powder by adopting the ultrasonic sensor in real time Real-time motion speed of theta axisAnd z-axis real-time motion speed;
2) Constructing a gas viscous saturation model in the silicon powder collecting box (3):
;
wherein, the Is a real-time motion velocity vector of the silicon powder mixed gas particles,Is thatIs provided with a die for the mold,,The viscosity of the silicon powder mixed gas is the viscosity; c is the air specific heat capacity, t is the real-time moment of collecting data in the step 1);
the model constructed in the step 2) is used for solving the maximum silicon powder mixed gas density for avoiding the condition that the air containing silicon powder explodes due to the heating and density increase of heat generated by cutting monocrystalline silicon wafers by the cutting machine (2) and the silicon powder collecting box (3) ;
3) The maximum silicon powder mixed gas density obtained by adopting the particle swarm optimization algorithm to continuously optimizeIth maximum silicon powder mixed gas density in particle swarm optimization processThe update rate of (2) is:
;
wherein, the Is the ith-1 st maximum silicon powder mixed gas densityIs updated at a rate of update of (a); As a result of the first learning factor, As a result of the second learning factor,=1.5,= 2;N is the optimization of the maximum silicon powder mixed gas density using particle swarm optimization algorithmIs a sample number of (a);
At an update rate Updating the obtained (i+1) th maximum silicon powder mixed gas densityThe value of (2) is;
4) Constructing an optimal value of the maximum silicon powder mixed gas densityParticle-optimized convergence value of (2)And (3) calculating a model:
;
Wherein lambda is the average value of the density of the collected N maximum silicon powder mixed gases, =;
5) Judging the particle optimizing convergence value obtained in the step 4)If the density of the mixed gas is larger than 0.86, outputting the obtained optimal value of the maximum silicon powder mixed gas densityOtherwise, repeating the steps 1) -4), and continuing updating iteration;
6) Judging the optimal value of the maximum silicon powder mixed gas density obtained in the step 5) And if the silicon powder detonation threshold value is greater than 100, controlling the opening of the propping cylinder (29) and simultaneously controlling the cutting machine (2), the suction pump (501) and the rotating motor (6) to stop.
2. A silicon powder collecting and processing apparatus for monocrystalline silicon piece cutting process as defined in claim 1, wherein the silicon powder mixture gas viscosity isThe calculation formula of (2) is as follows:
;
wherein eta is the viscosity coefficient of the silicon powder mixed gas,
;
Wherein, the Is the air viscosity coefficient at 25 ℃,=1.85×10-5,To monitor the initial temperature in the silicon powder collection box (3) at the beginning.
3. The silicon powder collecting and processing device for monocrystalline silicon piece cutting processing according to claim 1, wherein the cylindrical outer wall of the transmission rotary roller (5) is fixedly connected with a dust collecting fan blade (7), the transmission rotary roller (5) is fixedly connected with a first gear (8) at the inner side end part of the silicon powder collecting box (3), a first rack (9) is meshed at the bottom of the first gear (8), one side of the first rack (9) is fixedly connected with a threaded column (10), the outer wall of the threaded column (10) is connected with a threaded rotary sleeve (11) through threads, the threaded rotary sleeve (11) is connected to one side of the silicon powder collecting box (3) through a bearing, the outer wall of the threaded rotary sleeve (11) is fixedly connected with a second gear (12), the bottom of the second gear (12) is meshed with a second rack (13), the bottom of the second rack (13) is fixedly connected with a movable support (14) in a vertical plane, one side of the movable support (14) is fixedly connected with a dust baffle (15) which is horizontally arranged, the motor (15) is connected with one side of the movable support (14) which is far away from the fixed side of the first spring (16) on the fixed side of the movable support (6), the upper part of the outer wall of the movable ring (18) is fixedly connected with a movable scraping plate (19), and a cleaning brush (20) is fixedly connected on the side surface of the movable scraping plate (19) which faces to the dust collecting fan blade (7).
4. Silicon powder collection and treatment device for monocrystalline silicon piece cutting processing according to claim 1, characterized in that the inner wall of the dust storage box (17) is fixedly connected with an alarm device (21), the top of the alarm device (21) is fixedly connected with an alarm switch (22), and the top of the alarm switch (22) is provided with a corresponding extrusion column (23).
5. Silicon powder collection and treatment device for monocrystalline silicon piece cutting processing according to claim 1, characterized in that the front and rear side inner walls of the dust storage box (17) are slidably connected with bearing plates (24), the bearing plates (24) are fixedly connected to the tops of the corresponding extrusion columns (23), the bottoms of the bearing plates (24) are fixedly connected with four second springs (25), and the lower ends of each second spring (25) are fixedly connected to the inner wall of the dust storage box (17).
6. Silicon powder collection and treatment device for monocrystalline silicon piece cutting processing according to claim 1, characterized in that the bottom of the liquid storage tank (26) is communicated with two liquid discharge pipes (27), the top of the top support cylinder (29) is provided with a circular movable plate (30), the top of the circular movable plate (30) is fixedly connected with a movable rod (31), the top of the movable rod (31) is fixedly connected with a movable plate (32) arranged in the front-back direction, the movable rod (31) is located at the lower part of the midpoint position of the movable plate (32), the bottoms of the front end and the rear end of the movable plate (32) are fixedly connected with a blocking block (33), and each blocking block (33) is slidably connected to the inner wall of the corresponding liquid discharge pipe (27).
7. The silicon powder collecting and processing device for monocrystalline silicon piece cutting processing according to claim 6, wherein the silicon powder collecting box (3) is fixedly connected with a supporting seat (34) at the lower end of the top of one side, far away from the movable rod (31), of the liquid discharge pipe (27) at the rear side, a warning bell (35) is fixedly connected to the bottom of the supporting seat (34), a corresponding collision post (36) is arranged on one side, close to the movable rod (31), of the warning bell (35), a supporting piece (37) is fixedly connected to the inner wall of the liquid discharge pipe (27) at the rear side of the silicon powder collecting box (3), a transmission rotating rod (38) is rotatably connected to the inner wall of the supporting piece (37), a plurality of rotating fan blades (39) are fixedly connected to the top of the transmission rotating rod (38), each rotating fan blade (39) is obliquely arranged relative to the horizontal surface, a movable pressing block (40) is fixedly connected to the bottom of the transmission rotating rod (38), a movable pushing plate (41) is arranged on one side, far away from the movable rod (31), of the movable pressing block (40) and is fixedly connected to one end of the corresponding collision post (36).
8. Silicon powder collection and treatment device for monocrystalline silicon piece cutting processing according to claim 7, characterized in that the top lower end of the silicon powder collection box (3) is fixedly connected with a support plate (42) between the support seat (34) and the rear side drain pipe (27), a third spring (43) is fixedly connected to the bottom of one side of the support plate (42) close to the movable push plate (41), and the other end of the third spring (43) is fixedly connected to one side of the movable push plate (41).
9. A silicon powder collecting and processing method for cutting monocrystalline silicon pieces, characterized in that the processing method is realized by the silicon powder collecting and processing device for cutting monocrystalline silicon pieces according to any one of claims 1-8, the method comprising the steps of:
S1, the singlechip controls the rotary motor (6) and the suction pump (501) to be started, the rotary motor (6) drives the transmission rotary roller (5) to rotate, and then drives the dust baffle (15) to move towards the direction close to the cutting workbench (1), and finally, the dust baffle is completely covered on the upper part of Chu Chenxiang (17);
s2, the suction pump (501) simultaneously sucks silicon powder generated by cutting monocrystalline silicon pieces by the cutting machine (2), and the silicon powder enters the silicon powder collecting box (3) through the diversion of the first diversion plate (101) and the second diversion plate (102);
S3, judging whether the gas density of the silicon powder mixed air in the silicon powder collecting box (3) sucked by the suction pump (501) to the silicon powder collecting box (3) is larger than a silicon powder detonation critical value or not according to data acquired by the temperature sensor, the gas density sensor and the ultrasonic sensor in real time, if so, controlling the cutter (2), the suction pump (501) and the rotating motor (6) to stop working, returning the dust baffle (15) to an initial position, enabling the dust baffle (15) to accept the collected silicon powder to fall into the dust storage box (17), controlling the jacking cylinder (29) to move upwards, and enabling liquid in the liquid storage box (26) to drop from top to bottom through two liquid discharge pipes (27) to remove floating silicon powder remained in the air in the silicon powder collecting box (3);
S4, starting the cutter (2), the suction pump (501) and the rotating motor (6) again and controlling the jacking cylinder (29) to return to the initial position.
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