CN117015137A - Power module and motor driver - Google Patents

Abstract

The invention discloses a power module and a motor driver, wherein the power module comprises: the circuit board is provided with a first surface and a second surface which are oppositely arranged, the surface of the circuit board is provided with a terminal conductive pattern and an inter-board conductive pattern, and the circuit board is provided with a circuit wiring and at least one chip; the power chip comprises a substrate, a first substrate and a second substrate, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged; the first surface of the substrate is fixed with the second surface of the circuit board through an inter-board conductive pattern and is electrically connected with the second surface of the circuit board, and the first surface of the substrate and the first surface of the circuit board are arranged on the same side; the power chip is electrically connected to the terminal conductive pattern via the inter-board conductive pattern and the circuit wiring of the circuit board. The technical scheme of the invention aims to improve the integration level of the power module.

Description

Power module and motor driver

Technical Field

The invention relates to the field of power electronic power semiconductor devices, in particular to a power module and a motor driver.

Background

IGBTs (Insulated Gate Bipolar Transistor, insulated gate bipolar transistors) are key components of servo and variable frequency drive systems, with a heavy impact on motor drive cost and reliability.

The power module in the existing driving system adopts standard packaging modules such as integrated PIM and pack series, or standard discrete packaging devices, the power chips in the packaging modules and the packaging devices are electrically interconnected with an external circuit by adopting a metal frame or a metal needle seat, and when the power terminal is led out by the metal frame or the metal needle seat, the limitation of the structure and the process of the metal frame or the metal needle seat can be influenced, the distance and the current carrying capacity between pins serving as the power terminal are influenced, and the space utilization rate of the power module is further influenced.

Disclosure of Invention

The invention mainly aims to provide a power module and a motor driver, and aims to improve the integration level of the power module.

In order to achieve the above object, the present invention provides a power module, including:

the circuit board is provided with a first surface and a second surface which are oppositely arranged, the surface of the circuit board is provided with a terminal conductive pattern and an inter-board conductive pattern, and the circuit board is provided with a circuit wiring and at least one chip;

the power chip comprises a substrate, a first electrode and a second electrode, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the substrate is provided with a power chip and an inter-plate conductive pattern;

the first surface of the substrate and the second surface of the circuit board are fixed and electrically connected through the inter-board conductive pattern, and the first surface of the substrate and the first surface of the circuit board are arranged on the same side;

the power chip is electrically connected with the terminal conductive pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

Optionally, the terminal conductive pattern comprises a power terminal pattern for transmitting power input and power output;

the power chip is electrically connected with the power terminal pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

Optionally, the terminal conductive pattern further comprises a signal terminal pattern for transmitting a control signal and/or an auxiliary power signal and/or a detection signal;

the power chip is electrically connected to the signal terminal pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

Optionally, on the circuit board, the chip is electrically connected to the circuit wiring.

Optionally, the power chip is electrically connected to the circuit board through a conductive member.

Optionally, the chip on the circuit board includes at least one of a control chip, a driving chip, and a power management chip.

Optionally, the number of the circuit boards is multiple, the multiple circuit boards are arranged at intervals, and the second surface of each circuit board is fixed with the first surface of the substrate through the inter-board conductive pattern and electrically connected with the first surface of the substrate.

Optionally, the circuit board is provided with a chip avoiding hole, and the power chip on the substrate is arranged corresponding to the chip avoiding hole.

Optionally, the terminal conductive pattern is disposed on the first surface and/or the second surface of the circuit board, and the inter-board conductive pattern is disposed on the second surface of the circuit board.

Optionally, at least one side of the circuit board is provided with the terminal conductive pattern.

Optionally, the power module further comprises a plastic package body;

the plastic package body covers the chip on the circuit board and the power chip on the substrate;

the terminal conductive pattern on the circuit board is exposed outside the plastic package body.

Optionally, at least part of the second surface of the substrate is exposed outside the plastic package.

The invention also provides a motor driver comprising the power module.

The power module provided by the technical scheme of the invention comprises a circuit board and a substrate to form the power module, wherein the circuit board is provided with a first surface and a second surface which are oppositely arranged, the surface of the circuit board is provided with a terminal conductive pattern and an inter-board conductive pattern, and the circuit board is provided with a circuit wiring and at least one chip; the substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the substrate is provided with a power chip and an inter-plate conductive pattern; the first surface of the substrate is fixed with the second surface of the circuit board through an inter-board conductive pattern and is electrically connected with the second surface of the circuit board, and the first surface of the substrate and the first surface of the circuit board are arranged on the same side; the power chip is electrically connected with the terminal conductive patterns on the circuit board through the inter-board conductive patterns and the circuit wiring of the circuit board; the signal of the power chip is realized by utilizing the terminal conductive pattern on the circuit board, the lead frame is omitted, the transmission distance between the signals can be reduced, the number of terminals which can be allowed to be transmitted is increased, the occupied area of the power module is reduced, and the integration level of the power module is further improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a power module according to an embodiment of the invention;

FIG. 2 is a schematic diagram of another embodiment of a power module according to the present invention;

FIG. 3 is an exploded view of an embodiment of a power module according to the present invention;

FIG. 4 is a schematic diagram of a power module according to another embodiment of the present invention;

FIG. 5 is an exploded view of another embodiment of a power module according to the present invention;

FIG. 6 is a top view of an embodiment of a power module of the present invention;

FIG. 7 is a perspective view of an embodiment of a power module according to the present invention;

fig. 8 is a perspective view of another embodiment of a power module according to the present invention.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				10	Circuit board	50	Inter-plate conductive pattern
20	Substrate board	60	Power chip
				30	Chip	70	Conductive member
40	Terminal conductive pattern	80	Plastic package body

The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.

The invention provides a power module. The power module may be a modular assembly integrating a plurality of power electronics and associated drive circuitry. The specific composition of the power module may vary depending on the application requirements, but generally includes: a power semiconductor device such as a power transistor (IGBT), or a Metal Oxide Semiconductor Field Effect Transistor (MOSFET) or a Silicon Controlled Rectifier (SCR), etc. These power semiconductor devices can perform switching, regulation, and conversion functions of electric energy. The power module also requires matched drive circuits and protection circuits during operation, the drive circuits are used for providing appropriate voltage and current signals to drive the power semiconductor devices, the protection circuits are used for protecting the power module and connected circuits, such as an overcurrent protection circuit, an overtemperature protection circuit, an overvoltage protection circuit, a short-circuit protection circuit and the like, and the protection circuits help ensure safe operation of the module and the system and prevent damage and faults.

Referring to fig. 1, in an embodiment of the present invention, a power module includes:

the circuit board 10, the circuit board 10 has a first surface and a second surface disposed opposite to each other, the surface of the circuit board 10 is provided with a terminal conductive pattern 40 and an inter-board conductive pattern 50, and the circuit board 10 is provided with a circuit wiring, at least one chip 30.

Optionally, the circuit board is a multi-layer circuit board, and the circuit wiring includes a circuit wiring on a surface of the circuit board and a multi-layer wiring disposed inside the circuit board.

The inter-board conductive patterns and the terminal conductive patterns on the circuit board 10 may be electrically connected by circuit wiring, and the circuit board 10 may include a plurality of circuit wiring lines, and the different circuit wiring lines may be insulated from each other.

The substrate 20, the substrate 20 has a first surface and a second surface disposed opposite to each other, and the first surface of the substrate 20 is provided with the power chip 60 and the inter-board conductive pattern 50.

The positions of the inter-plate conductive patterns on the second surface of the circuit board 10 and the inter-plate conductive patterns on the first surface of the substrate correspond to each other.

The first surface of the substrate 20 is fixed and electrically connected with the second surface of the circuit board 10 through the inter-board conductive pattern 50, and the first surface of the substrate 20 and the first surface of the circuit board 10 are disposed on the same side;

the power chip 60 is electrically connected to the terminal conductive pattern 40 through the inter-board conductive pattern 50 and the circuit wiring of the circuit board 10.

In the present embodiment, the first and second surfaces of the circuit board 10 disposed opposite to each other are provided with the terminal conductive pattern 40 and the inter-board conductive pattern 50, the circuit wiring and the chip 30; the conductive pattern may be a conductive area formed by a metal layer on the surface of the circuit board, such as a pad, and the shape and size of the conductive pattern are determined according to practical situations, and the conductive pattern is used for connecting electronic components and transmitting current and signals.

The circuit board 10 of the present embodiment may be a multi-layer PCB board.

In order to facilitate the fixation and electrical connection between the circuit board and the substrate, the inter-board conductive pattern on the circuit board is disposed on the second surface of the circuit board.

The terminal conductive patterns on the circuit board are disposed on the first surface and the second surface of the circuit board, and the terminal conductive patterns 40 may be input terminals or output terminals.

Alternatively, when the terminal conductive pattern on the first surface corresponds to the position of the terminal conductive pattern on the second surface, the terminal conductive pattern on the first surface and the terminal conductive pattern on the second surface are insulated from each other, i.e., the two terminal conductive patterns of the first surface and the second surface corresponding in position are used for transmitting different signals, or the terminal conductive pattern on the first surface is electrically connected with the terminal conductive pattern on the second surface, i.e., the two terminal conductive patterns of the first surface and the second surface corresponding in position are used for transmitting the same signals.

The circuit wiring arranged on the PCB can be used for connecting electronic elements and the chip 30, such as an integrated circuit, a resistor, a capacitor, a control chip 30 and the like, and the layout of the circuit wiring has important influence on the performance and the reliability of the integrated module, and the reasonable circuit wiring layout can reduce signal interference, cross coupling and electromagnetic interference and improve the working efficiency and the stability of the circuit.

In this embodiment, the circuit wiring on the PCB board may be set according to the function of the chip 30 and the function integrally implemented by the power module, for example, the corresponding chip 30 and the electronic component are connected through the circuit wiring, so as to implement the corresponding circuit function.

In this embodiment, the number of layers of the multilayer circuit board is determined according to the functional requirement of the power module, so that when the power module needs to integrate a plurality of chips 30, the multilayer circuit board is ensured to have enough wiring space and higher integration level, electromagnetic interference can be reduced, and better signal integrity is achieved. For example, the multi-layered PCB board may be provided with a plurality of internal layers in a vertical direction, thereby providing more wiring space, which enables the same-sized multi-layered PCB board to accommodate more circuit elements and connection circuits, and the high integration of the multi-layered PCB board contributes to the reduction of the size of the circuit board 10, and the improvement of the compactness of the power module.

Alternatively, the inner layers of the multi-layer PCB board may also be used as a ground plane or power plane to provide good electromagnetic shielding and noise suppression. This helps to reduce the effect of electromagnetic interference on the circuit and improve the anti-interference capability and stability of the system. In addition, the multilayer PCB board can also use the internal layer as the signal layer, separates the overall arrangement with signal line and power cord, reduces the mutual interference, and this helps improving signal transmission's integrality, reduces signal distortion and clock jitter, improves the performance and the reliability of system.

The connection parts between the multi-layer circuit boards can be copper foil, copper wires or other metal wires, and users can select the connection parts according to actual demands.

The substrate 20 may be a ceramic substrate, or may be made of other materials having insulation and heat dissipation functions. The heat dissipation function of the substrate 20 can better dissipate heat generated in the power transmission process into the air, so that the phenomenon that the chip 30 and the power chip 60 are affected due to the fact that the temperature of the substrate 20 or the circuit board 10 is too high is avoided.

Optionally, the surface of the substrate is provided with circuit wiring to enable electrical connection between the plurality of power chips 60 on the substrate.

The first surface of the substrate 20 and the second surface of the circuit board 10 fix the positions of the substrate 20 and the circuit board 10 by soldering with the inter-plate conductive pattern 50, and electrical connection is achieved by the inter-plate conductive pattern.

The inter-board conductive pattern 50 on the surface of the circuit board 10 is electrically connected to the circuit wiring, so that the electrical connection of the substrate 20 and the circuit board 10 can be achieved after the substrate 20 and the inter-board conductive pattern 50 on the circuit board 10 are soldered; the inter-board conductive patterns 50 of the circuit board 10 are electrically connected to the chips 30 through circuit wiring, so that the chips 30 on the circuit board 10 can be electrically connected to the power chips 60 on the substrate 20. After the conductive patterns on the circuit board 10 are electrically connected with the conductive patterns on the substrate 20, the power chip 60 on the substrate 20 can perform power transmission through the terminal conductive patterns 40 on the circuit board 10.

It can be understood that the design of the metal frame is not adopted in the scheme, but a circuit from the power chip to the inter-board conductive pattern and to the terminal conductive pattern is formed through the conductive patterns and the circuit wiring of the circuit board and the substrate, and the terminal conductive pattern on the circuit board 10 is used for transmitting power transmission and signals of the power chip 60 and is used as a pin of the power chip, so that the pin is not limited by the thickness of the metal frame, the distance between the pins is reduced, and the current carrying capacity of the pins is improved, thereby enabling the layout of the power module to be more compact, the volume to be reduced and the integration level to be higher.

The power module formed by the circuit board 10 and the substrate 20 can also realize the function expansion of the power module, for example, a control chip 30 or a detection chip 30 is arranged on the circuit board 10, and control signals or detection signals are transmitted; the high-power chip 60 is arranged on the substrate 20, heat dissipation is carried out on the high-power chip 60, the power section of the power module is expanded, for example, a current divider, a driving and sampling circuit and the like are arranged on a circuit board, and the corresponding chip 30 can be arranged according to actual conditions, so that the functional partition design is realized, and the whole circuit wiring layout is convenient.

The power module is formed by the circuit board and the base plate, related functional circuits can be matched according to the overall design condition of the motor driver, functional circuit partition arrangement is defined on the circuit board, each module is not required to be independently designed and matched with the motor driver, and the matching degree of the power module and the motor driver is improved.

The technical scheme of the invention comprises a power module formed by a circuit board 10 and a substrate 20, wherein the circuit board 10 is provided with a first surface and a second surface which are oppositely arranged, the surface of the circuit board 10 is provided with a terminal conductive pattern 40 and an inter-board conductive pattern 50, and the circuit board 10 is provided with circuit wiring and at least one chip 30; the substrate 20 has a first surface and a second surface disposed opposite to each other, and the first surface of the substrate 20 is provided with a power chip 60 and an inter-board conductive pattern 50; the first surface of the substrate 20 is fixed and electrically connected with the second surface of the circuit board 10 through the inter-board conductive pattern 50, and the first surface of the substrate 20 and the first surface of the circuit board 10 are disposed on the same side; the power chip 60 is electrically connected to the terminal conductive pattern 40 through the inter-board conductive pattern 50, the circuit wiring of the circuit board 10; the signal of the power chip is realized by utilizing the terminal conductive pattern on the circuit board, the lead frame is omitted, the transmission distance between the signals can be reduced, the number of terminals which can be allowed to be transmitted is increased, the occupied area of the power module is reduced, and the integration level of the power module is further improved.

When the heat generated by the circuit board is larger due to the transmission of power to the substrate, the heat on the circuit board can be quickly transferred to the substrate through the conductive patterns between the boards, the substrate is utilized for assisting in heat dissipation, the heat dissipation efficiency is improved, and the circuit board is prevented from being damaged due to overheating.

Referring to fig. 1 to 5, in an embodiment, the terminal conductive pattern 40 includes a power terminal pattern for transmitting power input and power output;

the power chip 60 is electrically connected to the power terminal pattern through the inter-board conductive pattern 50 and the circuit wiring of the circuit board 10.

In the present embodiment, the terminal conductive patterns 40 and the inter-board conductive patterns 50 on the circuit board 10 and the inter-board conductive patterns 50 on the substrate 20 may be pads.

The power chip 60 on the substrate 20 may be electrically connected to the circuit wiring on the circuit board 10 through the inter-board conductive pattern 50, and the circuit wiring on the circuit board 10 is electrically connected to the power terminal pattern, so that the power chip 60 on the substrate 20 is electrically connected to the power terminal pattern.

The terminal conductive patterns 40 on the circuit board 10 may be further divided into a power input terminal and a power output terminal, and the terminal conductive patterns may be pads.

When the power terminal pattern is a power input, an external power source may be connected to the circuit to provide power input to the power chip on the substrate 20, in which case the power terminal pattern is typically required to have sufficient current carrying capacity and good electrical conductivity to ensure stable current transfer and low resistance connection.

When the power terminal pattern is a power output terminal, the power output provided by the power chip on the substrate 20 can be transmitted to an external load or an external circuit; in this case, the power terminal pattern needs to be able to provide a stable current output and a good current distribution capability to meet the load requirements.

The power terminal pattern is used as a port for power transmission, can be directly electrically connected with external equipment, outputs power to the external equipment or receives the output power of the external equipment, a metal frame is not required to be arranged, the current carrying capacity and the distance of the power terminal pattern are not limited by the structure of the metal frame, corresponding specifications can be set on the circuit board according to corresponding power requirements, and more terminals/pins can be arranged on the circuit board relative to the same area, so that the number of terminals/pins which can be allowed to be transmitted is increased, and the integration level of the power module is improved.

Taking the pad as a power input or output, the size of the pad can be designed to match the power of the power module to accommodate the required power transfer. Because larger pads provide better current carrying and heat dissipation capabilities, thereby reducing pad temperature rise and resistive losses, the specific dimensions of the pads can be set according to the magnitude of the transmitted power. The material of the bonding pad can be selected to be a material with good conductivity and high temperature resistance, and common materials include copper or copper alloy. The pads should be reasonably arranged to ensure sufficient spacing and safe distance to prevent electrical shorting and arcing when designing the circuit board 10.

Referring to fig. 1 to 5, in an embodiment, the terminal conductive pattern 40 further includes a signal terminal pattern for transmitting a control signal and/or an auxiliary power signal and/or a detection signal;

in this embodiment, the terminal conductive patterns 40 on the circuit board 10 may be further divided into signal terminal patterns for transmitting various signals, and the specific signal transmitted by the signal terminal patterns may be determined by the functions of the chip 30 disposed on the circuit board 10, for example, the circuit board 10 is provided with a control chip, a power supply chip and a detection chip, and the terminal conductive patterns 40 may be divided into signal terminal patterns for transmitting control signals, auxiliary power supply signals and detection signals; the power chip 60 on the substrate 20 is electrically connected with the circuit wiring on the circuit board 10 through the inter-board conductive pattern 50, and the signal terminal pattern on the circuit board is electrically connected with the circuit wiring, so that the power chip 60 on the substrate 20 is electrically connected with the signal terminal pattern, and signal transmission between the power chip 60 and different functional chips 30 on the circuit board 10 can be completed; if the circuit board 10 is further provided with chips 30 having other functions, corresponding signal terminal patterns may be provided for transmitting signals thereof.

In one embodiment, the chip 30 is electrically connected to the circuit wiring on the circuit board 10.

The chip 30 on the circuit board 10 is electrically connected to the power terminal pattern and/or the signal terminal pattern through circuit wiring.

The signal terminal pattern on the circuit board 10 may also be used to transmit signals and/or power of chips provided on the circuit board.

In this embodiment, the chip 30 on the circuit board 10 can be electrically connected with the circuit wiring, the first surface of the substrate 20 is fixed to and electrically connected with the second surface of the circuit board 10 through the inter-board conductive patterns 50, the power chip 60 on the substrate 20 is also electrically connected with the inter-board conductive patterns 50, and the circuit wiring is also electrically connected with the inter-board conductive patterns 50, so that the power chip 60 on the substrate 20 can be electrically connected with the chip 30 on the circuit board 10, and the power chip 60 on the substrate 20 can perform signal transmission with the chip 30 on the circuit board 10 to achieve the corresponding function.

Since the power chip 60 disposed on the first surface of the substrate 20 may be electrically connected to the inter-board conductive pattern 50 on the second surface of the circuit board 10, or may be directly electrically connected to the chip 30 on the first surface of the circuit board 10; the power chip 60 on the substrate 20 is connected to the chip 30 on the circuit board 10 to achieve functional expansion, data transmission or co-operation.

The connection between the power chip 60 on the substrate 20 and the inter-board conductive pattern 50 of the circuit board 10 or the chip 30 can be determined according to the function of the chip 30 and the function requirement of the whole power module.

Referring to fig. 1 to 5, in one embodiment, the power chip 60 is electrically connected to the circuit board 10 through a conductive member 70.

In this embodiment, the power chip 60 on the first surface of the substrate 20 may be directly electrically connected to the chip 30 on the circuit board 10 through the conductive member 70, or may be electrically connected to the circuit wiring on the circuit board 10 through the conductive member 70.

The conductive member 70 may be a binding wire, i.e. a conductive wire such as a wire or a metal strip (clip), or may be a wire-bonding connection. The power chip 60 on the substrate 20 and the chip 30 or circuit wiring on the circuit board 10 can be electrically connected by wire bonding, so that the wiring on the circuit board 10 and the substrate 20 can be reduced, and the overall wiring layout is simplified. Various signals of the chip 30 may be transmitted through the wire bond connection.

In one embodiment, the chip 30 on the circuit board 10 includes at least one of a control chip, a driving chip, and a power management chip.

In this embodiment, the power module may integrate multiple functions, so as to achieve a higher integration level, and the circuit board 10 may be correspondingly provided with multiple functional chips, and may generally be provided with one or more of a control chip, a driving chip and a power management chip; in particular, other functional chips, such as a power supply chip or a temperature and humidity detection chip, can be arranged on the circuit board 10 according to the requirements of users.

Referring to fig. 2 to 3, in an embodiment, the number of the circuit boards 10 is plural, the plural circuit boards 10 are disposed at intervals, and the second surface of each circuit board 10 is fixed and electrically connected to the first surface of the substrate 20 by the inter-board conductive pattern 50.

In this embodiment, the circuit boards 10 may be plural, the second surfaces of the plural circuit boards 10 are all fixed and electrically connected with the first surface of the substrate 20 through the inter-board conductive patterns 50, and the plural circuit boards 10 may be fixedly disposed on the first surface of the substrate 20 at certain intervals; the specific intervals between the circuit boards 10 can be determined according to the number of the circuit boards 10 and the number of the arranged chips 30, and the circuit boards 10 can be connected and fixed through metal conductors such as copper foil or elastic connectors. The circuit board 10 is divided into a plurality of settings to be better partitioned, for example, the chip 30 comprises a main control chip, a driving chip, a power management chip and a chip for realizing functions of electric/temperature signal detection and the like, so that the chips 30 with different functions can be arranged on different circuit boards 10, the chips 30 with the same functions are arranged on one circuit board 10, and the chips 30 can be arranged on the corresponding circuit boards 10 according to actual circuit function requirements, so that the circuit wiring on the circuit board 10 is simpler and more convenient. Each of the circuit boards 10 may be soldered with the conductive pattern on the first surface of the substrate 20 through the conductive pattern on the second surface, thereby fixing the plurality of circuit boards 10 to the substrate 20.

Referring to fig. 4 to 5, in an embodiment, the circuit board 10 is provided with chip escape holes, and the power chips 60 on the substrate 20 are disposed corresponding to the chip escape holes.

In this embodiment, a chip avoidance hole may be provided on the circuit board 10, and a power chip 60 is provided on the substrate 20 at a position corresponding to the chip avoidance hole on the circuit board 10, where the chip avoidance hole is provided, so that the chip 30 on the circuit board 10 can pass through the circuit board 10, and heat dissipation and ventilation capability may be increased, and an area occupied by the power module may be reduced; the power chip on the substrate can directly penetrate through the circuit board 10 to be electrically connected with the chip wire on the first surface of the circuit board, and the overall wiring of the circuit board 10 can be further reduced. The position of specific hollowed-out on the circuit board 10 can also be set according to actual conditions, and in practical application, a user can also specifically set a plurality of chip avoidance holes on the circuit board 10 corresponding to the position of the power chip on the substrate 20.

In another embodiment, a plurality of circuit boards 10 may be further disposed, and chip avoidance holes are correspondingly disposed on the plurality of circuit boards 10, so that the functional partition of the chip 30 can be better performed, the overall wiring of the circuit boards 10 can be reduced, and the specific setting can be determined by the actual situation and the user requirement.

In one embodiment, the terminal conductive patterns 40 are disposed on the first surface and/or the second surface of the circuit board 10, and the inter-board conductive patterns 50 are disposed on the second surface of the circuit board 10.

In this embodiment, the terminal conductive patterns 40 on the circuit board 10 may be disposed on one surface or on both surfaces; when the terminal conductive patterns 40 are disposed on the two surfaces, the terminal conductive patterns 40 located at the same projection position on the first surface and the second surface of the circuit board 10 may be electrically connected, for example, a through hole is disposed on the circuit board 10 to electrically connect the terminal conductive patterns 40 on both sides, or a metal wire in the circuit board is used to electrically connect the terminal conductive patterns 40 on both sides; thus, after the terminal conductive pattern 40 on the first surface is electrically connected with the terminal conductive pattern 40 on the second surface, an electrical signal or a power signal can be transmitted between different layers, and the terminal conductive pattern 40 is electrically connected to provide a reliable electrical connection path, so that the signal or the power can be effectively transmitted from one side to the other side. And the terminal conductive patterns 40 electrical connection may be used for signal transmission across the circuit board 10; for example, in the design of the multi-layer circuit board 10, if a circuit needs to transmit signals between different layers, the signal can be realized through the electrical connection of the terminal conductive patterns 40, and the connection mode can reduce the length and impedance variation of the signal wires, so as to reduce the loss and interference in signal transmission. The electrical connection of the terminal conductive patterns 40 may also be used to transmit power signals on both sides of the circuit board 10. In addition, by electrically connecting the terminal conductive patterns 40, a low-impedance power path can be provided, voltage drop of the power line and power noise can be reduced, and stability and reliability of the power signal can be ensured. And the electrical connection of the terminal conductive patterns 40 may also be used to improve the thermal conductivity of the circuit board 10, the electrical connection of the terminal conductive patterns 40 may provide a better thermal conduction path to transfer heat from one side to the other when a heat source or a heat sink is present on both sides of the electrical connection of the terminal conductive patterns 40. This helps to equalize the temperature distribution and improve the thermal management effect of the entire circuit board 10. In another embodiment, the terminal conductive pattern 40 on the first surface of the circuit board 10 and the terminal conductive pattern 40 on the second surface may alternatively not be electrically connected in the case where it is not necessary; the terminal conductive patterns 40 on both surfaces of the specific circuit board 10 can be selected according to the actual situation whether or not to be electrically connected.

Referring to fig. 1 to 6, in an embodiment, at least one side of the circuit board 10 is provided with a terminal conductive pattern 40.

In this embodiment, taking the rectangular circuit board 10 as an example for illustration, the rectangular circuit board 10 generally has four sides, and the terminal conductive patterns 40 can be set on any one side, so that a user can select to set one side, two sides, three sides or four sides according to actual situations to set the terminal conductive patterns so as to facilitate the welding of the patches of the power module, for example, the power module is further integrated with other more functions, the number of chips 30 set on the circuit board 10 is more, the number of external devices to be connected can be more, the welding of the patches of three sides or four sides can be selected, if the number of functions of the integrated power module is less, the number of chips 30 set on the circuit board 10 is less, the number of external devices to be connected can be less, and the welding of the patches of one side or two sides can be selected. In addition, if desired for application to irregularly shaped circuit boards 10, terminal conductive patterns 40 may be provided on the smoother sides.

In an embodiment, a heat dissipation layer may be disposed on a first surface of the substrate 20, and at least one heat dissipation device may be disposed on a second surface of the substrate 20. The heat dissipation layer provided on the first surface of the substrate 20 may be made of copper foil, and the user may select other materials, such as aluminum foil and graphite material, as the heat dissipation layer according to practical situations. The heat dissipation device provided on the second surface of the substrate 20 may be a heat sink, or may be a material such as silica gel for dissipating heat. The heat dissipation layer on the first surface of the substrate 20 has good heat conduction capability, and can conduct heat generated on the circuit board 10 to the heat dissipation device on the second surface of the substrate 20, and the heat is dissipated through the heat dissipation device, so that the chip 30 in the power module is prevented from being damaged or not working normally due to overhigh overall temperature of the power module. The ceramic substrate 20 also has a certain heat dissipation capability, so that when the power chips 60 arranged on the substrate 20 are more and the heat productivity is larger, the whole power module can be ensured to have a better heat dissipation capability.

Referring to fig. 5 to 8, in an embodiment, the power module further includes a plastic package 80;

the plastic package 80 covers the chip 30 on the circuit board 10 and the power chip 60 on the substrate 20;

the terminal conductive pattern 40 on the circuit board 10 is exposed outside the plastic package 80.

In this embodiment, the plastic package 80 is generally made of plastic material, and has good insulation performance, abrasion resistance and corrosion resistance; the plastic package body 80 can be used for fixing the positional relationship between the circuit board 10 and the substrate 20, and the chip 30 on the circuit board 10 and the power chip 60 on the substrate 20 are arranged in the accommodating cavity formed by the plastic package body 80, so that the plastic package body can play a role in protecting against dust or water drops falling on the chip 30, and the chip 30 is damaged. It will be appreciated that the power module needs to be electrically connected to an external device after being packaged, and the circuit board 10 needs to expose the portion provided with the terminal conductive pattern 40 outside the plastic package 80, so as to be electrically connected to the external device. Taking the rectangular circuit board 10 as an example, the rectangular circuit board 10 has four sides, the plastic package body 80 may be correspondingly configured as a cuboid to accommodate the circuit board 10 and the substrate 20, so that the four sides of the plastic package body 80 corresponding to the circuit board 10 have four side surfaces, and the sides of the circuit board 10 having pads may be exposed from the corresponding sides of the plastic package body 80, thereby being electrically connected with external devices.

In one embodiment, at least a portion of the second surface of the substrate 20 is exposed outside the plastic package 80.

In this embodiment, the second surface portion of the substrate 20 may be exposed outside the plastic package body 80, so that the heat on the substrate 20 can be conveniently dissipated into the air, compared with the case that the substrate 20 is disposed inside the accommodating cavity formed by the plastic package body 80, the second surface portion of the substrate 20 is exposed outside the plastic package body 80, thereby increasing the overall heat dissipation capability; therefore, the substrate 20 can be completely arranged in the plastic package body 80 or partially exposed outside the plastic package body 80 according to specific requirements and practical situations of users.

The invention also provides a motor driver.

In an embodiment, the motor driver comprises a power module as described above. The specific structure of the power module refers to the above embodiments, and since the motor driver adopts all the technical solutions of all the embodiments, the power module at least has all the beneficial effects brought by the technical solutions of the embodiments, and the details are not repeated here. In this embodiment, the power module may convert dc into ac to provide to the power device in the motor driver, and in addition, the power module may further integrate functions such as driving, sampling, and temperature detection, so that the overall matching degree between the power module and the motor driver is improved, and the overall performance of the motor driver is increased.

The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.

Claims (13)

1. A power module, comprising:

the circuit board is provided with a first surface and a second surface which are oppositely arranged, the surface of the circuit board is provided with a terminal conductive pattern and an inter-board conductive pattern, and the circuit board is provided with a circuit wiring and at least one chip;

the power chip comprises a substrate, a first electrode and a second electrode, wherein the substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface of the substrate is provided with a power chip and an inter-plate conductive pattern;

the first surface of the substrate and the second surface of the circuit board are fixed and electrically connected through the inter-board conductive pattern, and the first surface of the substrate and the first surface of the circuit board are arranged on the same side;

the power chip is electrically connected with the terminal conductive pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

2. The power module of claim 1, wherein the terminal conductive pattern comprises a power terminal pattern for transmitting power input and power output;

the power chip is electrically connected with the power terminal pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

3. The power module according to claim 1, characterized in that the terminal conductive pattern further comprises a signal terminal pattern for transmitting control signals and/or auxiliary supply signals and/or detection signals;

the power chip is electrically connected to the signal terminal pattern through the inter-board conductive pattern and the circuit wiring of the circuit board.

4. A power module according to any one of claims 1 to 3, wherein the chip is electrically connected to the circuit wiring on the circuit board.

5. A power module according to any one of claims 1 to 3, wherein the power chip is electrically connected to the circuit board by a conductive member.

6. A power module according to any one of claims 1 to 3, wherein the chip on the circuit board comprises at least one of a control chip, a driver chip, and a power management chip.

7. A power module according to any one of claims 1 to 3, wherein the number of circuit boards is plural, the plural circuit boards are arranged at intervals, and the second surface of each circuit board is fixed to and electrically connected with the first surface of the substrate by the inter-board conductive pattern.

8. A power module according to any one of claims 1 to 3, wherein the circuit board is provided with a chip avoidance hole, and the power chip on the substrate is provided corresponding to the chip avoidance hole.

9. A power module according to any one of claims 1 to 3, wherein the terminal conductive pattern is provided on the first surface and/or the second surface of the circuit board, and the inter-board conductive pattern is provided on the second surface of the circuit board.

10. A power module according to any one of claims 1 to 3, wherein at least one side of the circuit board is provided with the terminal conductive pattern.

11. A power module according to any one of claims 1 to 3, further comprising a plastic package;

the plastic package body covers the chip on the circuit board and the power chip on the substrate;

the terminal conductive pattern on the circuit board is exposed outside the plastic package body.

12. The power module of claim 11, wherein at least a portion of the second surface of the substrate is exposed outside the plastic package.

13. A motor drive comprising a power module as claimed in any one of claims 1 to 12.