CN116995048B - Copper strip bonding power module for vehicle - Google Patents
Copper strip bonding power module for vehicle Download PDFInfo
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- CN116995048B CN116995048B CN202311243972.9A CN202311243972A CN116995048B CN 116995048 B CN116995048 B CN 116995048B CN 202311243972 A CN202311243972 A CN 202311243972A CN 116995048 B CN116995048 B CN 116995048B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the field of semiconductors, in particular to a copper strip bonded power module for a vehicle, which comprises: the chip set comprises a plurality of power chips, a DBC plate for fixing the power chips through solder, a first substrate adhered to the bottom of the DBC plate and a second substrate arranged on the top of the power chips, wherein the power chips are bonded to the DBC plate through copper strips, and potting agent is filled between the first substrate and the second substrate; the cooling group comprises a cooling plate and a cover body which is sealed and adhered on the cooling plate, a cavity is formed in the cooling plate, two main flow channels are formed on two sides of the cavity, a plurality of micro flow channels are distributed between the two main flow channels, and the main flow channels are also communicated with the pump body; and a frame for enclosing the chip set and the two cooling sets therein. The invention can keep the internal devices of the chip set in a stable state so as to adapt to the use scene of the automobile; the cooling plate is provided with the main runner and a plurality of micro runners, and after the cooling liquid enters the main runner, the cooling liquid can be equally distributed to each micro runner, so that the cooling plate is uniformly cooled.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a copper strip bonded power module for a vehicle.
Background
A power module is an electronic device that converts electrical energy from a power source into a desired form of electrical power for supply to an electronic device or circuit. These modules typically contain various electronic components such as power semiconductors, inductors, capacitors, heat sinks, and packages, etc. to effect the conversion, control, and distribution of electrical energy. The power module is widely applied to various application fields including industry, electronics, communication, automobiles, solar energy and wind energy systems, etc. to meet different power requirements.
When the power module is applied to an automobile, the power module is extremely serious in heat emission due to high requirements on power density, switching loss caused by frequent switching of a power semiconductor device, conduction loss caused by high current and the like. In the prior art, in order to solve the heat dissipation problem, heat sinks are integrated in the power module, but the heat sinks rely on air cooling or natural cooling, so that the heat dissipation efficiency is not high. In other fields of heat sinks, such as computer motherboard heat sinks, a part of the heat sinks adopt a water cooling mode with higher efficiency, namely heat dissipation channels are arranged in the heat sinks, heat is taken away through cooling water flowing, but the heat dissipation channels are arranged in series, so that the cooling efficiency at an inlet is high, the cooling efficiency at an outlet is low, and the problem of uneven heat dissipation is caused.
In addition, in the existing power module, the electronic components are usually bonded by metal materials, such as gold, silver, aluminum, copper and the like, and more manufacturers adopt a copper strip bonding mode due to excellent performance and economy of copper. However, due to the high hardness of copper, a higher bonding force and ultrasonic energy are required to complete bonding, which means that a higher mechanical stress is born between the copper strip and the electronic component, and when the power module is applied to a new energy vehicle, the instability caused by running of the vehicle, such as jolt, high temperature and impact, easily causes the copper strip to drop, thereby damaging the power module.
Disclosure of Invention
The invention aims to provide a copper strip bonded power module for a vehicle, which provides a scheme for efficiently radiating and keeping the connection of power chips stable.
In order to achieve the above purpose, the following technical scheme is adopted:
a copper tape bonded automotive power module, the automotive power module comprising:
the chip set comprises a plurality of power chips, a DBC plate for fixing the power chips through solder, a first substrate adhered to the bottom of the DBC plate through solder, and a second substrate arranged on the top of the power chips, wherein the power chips are bonded to the DBC plate through copper strips, and potting agent is filled between the first substrate and the second substrate;
the cooling group is arranged at the top or/and the bottom of the chip group and comprises a cooling plate and a cover plate which is sealed and adhered to the cooling plate, a cavity is formed in the cooling plate, two main channels are formed on two sides of the cavity, a plurality of mutually isolated independent areas are distributed between the two main channels, a plurality of micro-channels communicated with the two main channels are arranged in each independent area, and the main channels are also communicated with a pump body;
a frame for enclosing the chipset and the two cooling groups therein.
Further, the first substrate and the second substrate are one of copper plates and gold germanium plates.
Further, the chipset further includes a plurality of heat conductive pillars, one ends of the plurality of heat conductive pillars are directly or indirectly connected to the plurality of power chips, and the other ends of the plurality of heat conductive pillars are directly or indirectly connected to the first substrate after passing through the DBC board.
Further, the heat conducting column is one of a molybdenum column and a copper column.
Further, the potting agent is in contact with at least the first substrate and the second substrate such that the power chip, the DBC board, are potted therein.
Further, the micro flow channels in the independent areas are formed in one or more heat sinks, a plurality of heat dissipation fins are formed on the heat sinks, and the micro flow channels are channels between two adjacent heat dissipation fins.
Further, two main flow channels are separated by two main partition plates formed in the cavity, a plurality of independent areas are separated by a plurality of auxiliary partition plates arranged between the two main partition plates, buffer intervals exist between the radiator and the two main partition plates, a main inlet and a main outlet are respectively arranged on two side walls of the cooling plate, and a plurality of secondary inlets and secondary outlets are arranged on the two main partition plates.
Further, a plurality of the auxiliary partition plates, the secondary inlets and the secondary outlets are distributed at equal intervals, and the main inlet and the main outlet are positioned at a center point corresponding to the main partition plates.
Furthermore, the pump body is arranged inside or outside the cooling group, and the liquid inlet and the liquid outlet of the pump body are respectively communicated with the two main runners.
Further, the pump body is arranged outside the power module for the vehicle, and a plurality of pump bodies corresponding to the power module for the vehicle are communicated with the same cooling device.
By adopting the scheme, the invention has the beneficial effects that:
based on the chip set packaged by the potting agent, a power chip, a DBC board and the like in the chip set can be kept in a stable state so as to adapt to the use scene of an automobile;
the main components of the chip set, such as the power chip and the DBC board, are arranged between the first substrate and the second substrate, and the first substrate and the second substrate are contacted with the cooling board, so that the heat dissipation efficiency can be improved by large-area contact;
be provided with sprue and a plurality of micro-channel in the cooling plate, after the coolant liquid enters into the sprue, can equally distribute into every micro-channel for every region in the cooling plate can cool off as far as possible evenly, avoids the uneven condition of cooling.
Drawings
Fig. 1 is an exploded view of a copper tape bonded automotive power module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the overall structure of a chipset according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional structure of a chipset according to an embodiment of the present invention;
FIG. 4 is a schematic view of a cooling unit according to an embodiment of the present invention;
FIG. 5 is a schematic view of the structure of FIG. 4 omitting the cover;
FIG. 6 is a schematic illustration of the structure of FIG. 5 omitting a heat sink;
fig. 7 is a schematic structural diagram of a heat sink according to an embodiment of the invention.
Wherein, the attached drawings mark and illustrate:
1. a chipset; 11. a power chip; 12. a DBC plate; 13. a first substrate; 14. a second substrate; 15. copper strips; 16. a potting agent; 17. a heat conducting column; 2. a cooling group; 21. a cooling plate; 211. a main flow passage; 212. an independent area; 213. a heat sink; 2131. a microchannel; 2132. a heat radiation fin; 214. a main partition; 2141. a secondary inlet; 2142. a secondary outlet; 215. an auxiliary separator; 216. a main inlet; 217. a main outlet; 22. a cover plate; 3. a frame; 4. a pump body.
Detailed Description
Exemplary embodiments that embody features and advantages of the present invention will be described in detail in the following description. It will be understood that the invention is capable of various modifications in various embodiments, all without departing from the scope of the invention, and that the description and illustrations herein are intended to be by way of illustration only and not to be construed as limiting the invention.
As shown in fig. 1-7, a copper tape bonded power module for a vehicle, the power module for a vehicle comprising:
a chip set 1, wherein the chip set 1 comprises a plurality of power chips 11, a DBC board 12 for fixing the power chips 11 through solder, a first substrate 13 adhered to the bottom of the DBC board 12 through solder, and a second substrate 14 arranged on the top of the power chips 11, the power chips 11 are bonded to the DBC board 12 through copper strips 15, and a potting agent 16 is filled between the first substrate 13 and the second substrate 14;
one or two cooling groups 2, the cooling groups 2 are arranged at the top or/and the bottom of the chip group 1, and comprise a cooling plate 21 and a cover plate 22 which is sealed and adhered on the cooling plate 21, a cavity is formed in the cooling plate 21, two main channels 211 are formed at two sides of the cavity, a plurality of mutually isolated independent areas 212 are distributed between the two main channels 211, a plurality of micro channels 2131 which are communicated with the two main channels 211 are arranged in each independent area 212, and the main channels 211 are also communicated with the pump body 4;
a frame 3, the frame 3 being used to enclose the chip package 1 and the two cooling packages 2 therein.
Wherein, based on the chip set 1 packaged by the potting agent 16, the power chip 11, the DBC board 12 and the like in the chip set 1 can be kept in a stable state so as to adapt to the use scene of the automobile; the main components of the chipset 1, such as the power chip 11 and the DBC board 12, are disposed between the first substrate 13 and the second substrate 14, and the first substrate 13 and the second substrate 14 are in contact with the cooling plate 21, so that the large-area contact can improve heat dissipation efficiency; the cooling plate 21 is provided with the main flow channel 211 and the micro flow channels 2131, and after the cooling liquid enters the main flow channel 211, the cooling liquid can be equally distributed to each micro flow channel 2131, so that each area in the cooling plate 21 can be cooled uniformly as much as possible, and the condition of uneven cooling is avoided.
In an embodiment, the first substrate 13 and the second substrate 14 are one of copper plates and gold germanium plates, when the copper plates are adopted, better heat transfer efficiency can be obtained, cooling efficiency is improved, and when the gold germanium plates are adopted, service life, performance and the like can be more stable. The chipset 1 further comprises a plurality of heat conductive pillars 17, wherein one ends of the plurality of heat conductive pillars 17 are directly or indirectly connected to the plurality of power chips 11, and the other ends of the plurality of heat conductive pillars are directly or indirectly connected to the first substrate 13 after passing through the DBC board 12; the heat of the power chip 11 can be further and rapidly transferred to the first substrate 13 by adopting the heat conduction column 17, so that the cooling efficiency is accelerated, and meanwhile, the mechanical strength of the inside of the chip set 1 can be improved; in addition, when the indirect connection mode is adopted, solder can be arranged between the heat conduction column 17 and the power chip 11 and between the heat conduction column 17 and the first substrate 13 for connection, when the direct connection mode is adopted, the heat conduction column 17 and the first substrate 13 are directly connected, the first substrate 13 can be used as the uniform grounding of the circuit of the DBC board 12, namely, the uniform grounding of a plurality of power chips 11 is the first substrate 13, so that the electrical reliability is improved; the heat conducting column 17 may be one of a molybdenum column and a copper column.
In addition, the potting agent 16 is at least in contact with the first substrate 13 and the second substrate 14, so that the power chip 11 and the DBC board 12 are encapsulated therein, that is, the first substrate 13, the second substrate 14 and the potting agent 16 encapsulate the power chip 11 and the DBC board 12 therein, so as to improve the stability of the structure, and simultaneously the upper and lower surfaces of the first substrate 13 and the second substrate 14 are exposed respectively, so that the cooling board 21 can be contacted respectively for cooling.
In an embodiment, the plurality of micro flow channels 2131 in the independent area 212 are formed in one or more heat sinks 213, a plurality of heat dissipating fins 2132 are formed on the heat sink 213, and the micro flow channels 2131 are channels between two adjacent heat dissipating fins 2132; the radiator 213 with the radiating fins 2132 is adopted as the micro-flow channel 2131 in the independent area 212, so that the radiator 213 and the cooling plate 21 can be separated to reduce the processing difficulty; of course, the heat sink 213 and the cooling plate 21 may be integrally formed to ensure heat transfer efficiency, and in this case, the cooling plate 21 and the cover plate 22 may be made of aluminum.
Two main partition plates 214 formed in the cavity separate two main channels 211, a plurality of auxiliary partition plates 215 are arranged between the two main partition plates 214 to separate a plurality of independent areas 212, buffer intervals exist between the radiator 213 and the two main partition plates 214, two side walls of the cooling plate 21 are respectively provided with a main inlet 216 and a main outlet 217, a plurality of secondary inlets 2141 and secondary outlets 2142 are arranged on the two main partition plates 214, the plurality of auxiliary partition plates 215, the secondary inlets 2141 and the secondary outlets 2142 are distributed at equal intervals, and the main inlet 216 and the main outlet 217 are positioned at a center point corresponding to the main partition plates 214. The primary channels 211 are used for secondary distribution, i.e. buffering and storing, of the cooling liquid, so that the flow rate of the liquid in the micro channels 2131 is uniform, i.e. cooling is uniform, and therefore, the equally distributed secondary inlets 2141 and secondary outlets 2142, the centrally arranged primary inlets 216 and primary outlets 217 can further make the flow rate of the cooling liquid uniform.
In one embodiment, the pump body 4 is installed inside or outside the cooling group 2, and its liquid inlet and liquid outlet are respectively connected to the two main channels 211. Specifically, when the pump body 4 needs to be integrated with the power module, the pump body 4 may be mounted on the cover plates 22, one may be mounted on each cover plate 22, or one pump body 4 may be connected to two cooling groups 2; the pump body 4 may be a micro piezoelectric pump, which may be a displacement reciprocating diaphragm pump, and relies on the electromechanical properties of piezoelectric ceramics to respond to an applied voltage to deform the diaphragm, thereby implementing liquid pumping and liquid discharging, and dissipating heat carried out from the cooling plate 21 when the cooling liquid moves along the pipeline.
The pump body 4 is provided outside the power module for vehicles, and a plurality of pump bodies 4 corresponding to the power modules for vehicles communicate with the same cooling device. The pump body 4 can also be linked with the automobile, a cooling device is arranged in the cabin of the automobile to cool the heated cooling liquid carried out from the cooling plate 21, so that the cooling efficiency can be greatly improved,
working principle:
the circuit formed by the plurality of power chips 11 works to realize a grid trigger switch, when the switch is frequently switched, the generated loss is converted into heat energy, the heat energy is transferred to the first substrate 13 through the DBC plate 12 and the heat conduction column 17, and is transferred to the second substrate 14 through the potting agent 16 or/and the direct top of the power chips 11, the first substrate 13 and the second substrate 14 are respectively connected with the two cooling plates 21, the heat energy is transferred to the cooling plates 21, the pump body 4 injects cooling liquid into the main flow channel 211 through the pipeline and the main inlet 216, the cooling liquid is redistributed in the main flow channel 211 and respectively flows to the plurality of secondary inlets 2141, in the process, if the main flow channel 211 is kept full, the speed of the cooling liquid flowing to each secondary inlet 2141 is uniform, after the cooling liquid enters the independent area 212 along the secondary inlet 2141, the heat energy of the cooling fins 2132 is absorbed by the cooling liquid, and flows along the secondary outlet 2142 and the main outlet 217, and circulation is completed.
While the present disclosure has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration rather than of limitation. As the present disclosure may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (7)
1. A copper tape bonded automotive power module, the automotive power module comprising: the chip set comprises a plurality of power chips, a DBC plate for fixing the power chips through welding flux, a first substrate adhered to the bottom of the DBC plate through welding flux, and a second substrate arranged on the top of the power chips, wherein the power chips are bonded to the DBC plate through copper strips, potting agents are filled between the first substrate and the second substrate, the first substrate and the second substrate are one of copper plates and gold germanium plates, the chip set further comprises a plurality of heat conducting columns, one ends of the heat conducting columns are directly or indirectly connected to the power chips, the other ends of the heat conducting columns are directly or indirectly connected to the first substrate after penetrating through the DBC plate, and the heat conducting columns are one of molybdenum columns and copper columns; the cooling group is arranged at the top or/and the bottom of the chip group and comprises a cooling plate and a cover plate which is sealed and adhered to the cooling plate, a cavity is formed in the cooling plate, two main channels are formed on two sides of the cavity, a plurality of mutually isolated independent areas are distributed between the two main channels, a plurality of micro-channels communicated with the two main channels are arranged in each independent area, and the main channels are also communicated with a pump body; a frame for enclosing the chipset and the two cooling groups therein.
2. The copper tape bonded automotive power module of claim 1, wherein the encapsulant contacts at least the first and second substrates such that the power chip, the DBC board, are encapsulated therein.
3. The copper tape bonded automotive power module of claim 1, wherein the plurality of micro-fluidic channels in the independent region are formed in one or more heat sinks having a plurality of heat dissipating fins formed thereon, the micro-fluidic channels being channels between two adjacent heat dissipating fins.
4. The copper tape bonded automotive power module as recited in claim 3 wherein two primary dividers formed in the cavity separate two of the primary channels, a plurality of secondary dividers are disposed between the two primary dividers to separate a plurality of independent areas, a buffer space is provided between the radiator and the two primary dividers, a primary inlet and a primary outlet are disposed on both side walls of the cooling plate, and a plurality of secondary inlets and secondary outlets are disposed on both of the primary dividers.
5. The copper tape bonded automotive power module of claim 4, wherein a plurality of the secondary baffles, secondary inlets, secondary outlets are equally spaced, the primary inlets and primary outlets being located at a center point corresponding to the primary baffles.
6. The copper strip bonded power module for a vehicle according to claim 1, wherein the pump body is mounted inside or outside the cooling group, and a liquid inlet and a liquid outlet of the pump body are respectively communicated with the two main runners.
7. The copper strip bonded automotive power module of claim 1, wherein the pump body is disposed outside the automotive power module, and a plurality of pump bodies corresponding to a plurality of automotive power modules are communicated with the same cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311243972.9A CN116995048B (en) | 2023-09-26 | 2023-09-26 | Copper strip bonding power module for vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311243972.9A CN116995048B (en) | 2023-09-26 | 2023-09-26 | Copper strip bonding power module for vehicle |
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| Publication Number | Publication Date |
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| CN116995048A CN116995048A (en) | 2023-11-03 |
| CN116995048B true CN116995048B (en) | 2023-12-29 |
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| CN202311243972.9A Active CN116995048B (en) | 2023-09-26 | 2023-09-26 | Copper strip bonding power module for vehicle |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238949B (en) * | 2023-11-13 | 2024-02-06 | 苏州中瑞宏芯半导体有限公司 | Copper bridge welded silicon carbide power module |
| CN118398581B (en) * | 2024-06-21 | 2024-10-29 | 苏州中瑞宏芯半导体有限公司 | High-efficiency cooling multi-chip power module |
| CN118398568B (en) * | 2024-06-27 | 2024-10-25 | 苏州中瑞宏芯半导体有限公司 | High-durability silicon carbide power device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1672692A1 (en) * | 2004-12-16 | 2006-06-21 | ABB Research Ltd | Power semiconductor module |
| CN104393162A (en) * | 2014-11-05 | 2015-03-04 | 共青城超群科技股份有限公司 | Copper column type substrate-encapsulated LED |
| CN205069616U (en) * | 2015-09-29 | 2016-03-02 | 比亚迪股份有限公司 | Power module and vehicle that has it |
| CN116544201A (en) * | 2023-06-21 | 2023-08-04 | 西安电子科技大学 | IGBT thermal control system with double-sided structure |
-
2023
- 2023-09-26 CN CN202311243972.9A patent/CN116995048B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1672692A1 (en) * | 2004-12-16 | 2006-06-21 | ABB Research Ltd | Power semiconductor module |
| CN104393162A (en) * | 2014-11-05 | 2015-03-04 | 共青城超群科技股份有限公司 | Copper column type substrate-encapsulated LED |
| CN205069616U (en) * | 2015-09-29 | 2016-03-02 | 比亚迪股份有限公司 | Power module and vehicle that has it |
| CN116544201A (en) * | 2023-06-21 | 2023-08-04 | 西安电子科技大学 | IGBT thermal control system with double-sided structure |
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