CN116961610A - sonic components - Google Patents

Abstract

An acoustic wave assembly comprising: the substrate is provided with an upper surface and a lower surface, and a plurality of welding pads are arranged on the periphery of the upper surface; at least one electronic component disposed on the upper surface of the substrate such that a plurality of pads at a periphery of the upper surface of the substrate surround the electronic component; the cover body structure is arranged above the substrate with the electronic component, and forms a closed cavity with the substrate so that the electronic component is arranged in the closed cavity; a first protection layer covering part of the surface of the substrate and part of the surfaces of the plurality of welding pads; the conductor layer is arranged on part of the first protection layer, the plurality of welding pads, the outer side surface of the cover body structure and part of the upper surface of the cover body structure; and a plurality of bumps disposed on the conductor layer on the upper surface of the cover structure.

Description

sonic components

Technical field

The present invention relates to the field of semiconductor technology, and in particular, to an acoustic wave component that can improve frequency response performance.

Background technique

A surface acoustic wave component (SAW) can excite sound waves by applying power to comb electrodes of an interdigital transducer (IDT) formed on a substrate. Surface acoustic wave components are widely used in various circuits that process radio signals within a bandwidth of, for example, 45 MHz to 2 GHz. Examples of these circuits are band pass filters for transmission, band pass filters for reception, local side oscillator filters, antenna duplexers, IF filters, and FM modulators ( FM, FrequencyModulation).

Surface acoustic wave components require a cavity located above the functional components of the sonic component consisting of comb electrodes, such as the electrode fingers of an interdigital transducer, to ensure the performance of the surface acoustic wave component. Conventional surface acoustic wave devices use ceramic joints with grooves in which surface acoustic wave components are mounted to establish electrical connections between the surface acoustic wave components and interconnects disposed on ceramic packages.

However, the use of wires in the wire bonding process hinders the size reduction of surface acoustic wave devices. In order to reduce the size of surface acoustic wave devices, flip-chip bonding was further developed. Because flip-chip bonding does not use wires for mounting, surface acoustic wave device size reduction is achieved.

In recent years, there have been stricter requirements for reducing the size of surface acoustic wave devices. In some cases, even flip-chip bonding cannot achieve the desired size reduction. Therefore, it is proposed to arrange the surface acoustic wave component on a substrate, and a covering layer is provided on the surface of the substrate to define a cavity above the functional components of the surface acoustic wave component. The above-mentioned covering layer serves as a package. This type of packaging is called a chip-level package (WLP, wafer level package), and this packaging method enables the miniaturization of surface acoustic wave components.

Contents of the invention

The main purpose of the present invention is to provide an acoustic wave component in which a conductor layer is formed on the soldering pad to increase the strength between the bump and the soldering pad, so as to solve the problem of the bumps breaking due to stress when the acoustic wave component is packaged in a flip-chip manner. The soldering pads are also pulled up from the substrate, causing damage to the entire package structure.

Another object of the present invention is to provide an acoustic wave component that increases design feasibility, adds power bumps or ground bumps, and improves electrical performance.

According to the above object, the present invention discloses an acoustic wave component, which includes: a substrate having an upper surface and a lower surface, with a plurality of soldering pads provided on the periphery of the upper surface; and at least one electronic component disposed on the upper surface of the substrate so that A plurality of soldering pads around the upper surface of the substrate surround the electronic components; the cover structure is arranged above the substrate with the electronic components, and the space between the cover structure and the substrate is defined as a closed cavity, allowing the electronic components to be placed In this closed cavity, the first protective layer covers part of the upper surface of the substrate and part of the surfaces of the plurality of soldering pads, and exposes part of the surfaces of the plurality of soldering pads that are not covered by the first protective layer. ; The conductor layer is provided on part of the surface of the first protective layer, part of the surfaces of the plurality of pads not covered by the first protective layer, the outer surface of the cover structure and part of the upper surface of the cover structure; and a plurality of bumps, Disposed on the conductor layer located on the upper surface of the cover structure.

In a more preferred embodiment of the present invention, the cover structure includes in order from the substrate upward: a part of the second protective layer covers part of the surface of the plurality of solder pads adjacent to the electronic component, and is disposed on the substrate adjacent to the electronic component. upper surface; a first insulating layer disposed on part of the surface of the second protective layer, and the second protective layer and the first insulating layer do not cover the electronic components on the substrate; and a second insulating layer covering the first insulating layer On part of the surface, the structure composed of the second protective layer and the first insulating layer is defined as the side wall of the cover structure and the second insulating layer is defined as the top wall of the cover structure.

In a more preferred embodiment of the present invention, the cover structure includes in order from the substrate upward: a part of the second protective layer covering part of the surface of the plurality of solder pads adjacent to the electronic component, and a part of the second protective layer is disposed adjacent to the electronic component. the upper surface of the substrate of the component; the first insulating layer is disposed on part of the surface of the second protective layer and covers part of the surface of the plurality of soldering pads to expose part of the surface of the plurality of soldering pads that are not covered by the first insulating layer, and The second protective layer and the first insulating layer do not cover the electronic components on the substrate; and the second insulating layer covers part of the surface of the first insulating layer, so that the structure formed by the second protective layer and the first insulating layer defines The side walls are the cover structure and the second insulation layer is the top wall of the cover structure.

According to the above object, the present invention also discloses another acoustic wave component, including: a substrate having an upper surface and a lower surface, with a plurality of soldering pads provided on the periphery of the upper surface; and at least one electronic component disposed on the upper surface of the substrate, so that A plurality of soldering pads around the upper surface of the substrate surround the electronic components; the cover structure is disposed above the substrate with the electronic components, and the space between the cover structure and the substrate is defined as a closed cavity, so that the electronic components is disposed in a closed cavity; a first protective layer covers part of the upper surface of the substrate and a part of the surface of the plurality of soldering pads; a first insulating layer is provided on part of the surface of the first protective layer and covers a plurality of soldering pads Part of the surface of the soldering pad is to expose part of the surface of the multiple soldering pads that are not covered by the first protective layer; the conductor layer is covering part of the surface of the first insulating layer and is not covered by the first protective layer. A portion of the surface, an outer surface of the cover structure, and a portion of the upper surface of the cover structure; and a plurality of bumps disposed on the conductor layer located on the upper surface of the cover structure.

In a more preferred embodiment of the present invention, the second insulating layer and the first insulating layer of the cover structure have a stepped structure.

In a more preferred embodiment of the present invention, the height of the first insulating layer disposed on part of the surface of the first protective layer and covering the plurality of bonding pads is the same as the height of the first insulating layer of the cover structure.

In a more preferred embodiment of the present invention, the conductor layer is composed of an under ball metallurgy (UBM) and a redistribution layer (RDL), where the redistribution layer is disposed on the under ball metal layer.

In a preferred embodiment of the present invention, the electronic component may be a filter, an oscillator or a sensor.

In a preferred embodiment of the present invention, the bumps may be copper pillar bumps, copper pillars or C4 bumps.

Description of the drawings

FIG. 1 is a schematic cross-sectional view showing an embodiment of an acoustic wave component according to the technology disclosed in the present invention.

2 is a schematic cross-sectional view showing another embodiment of an acoustic wave assembly according to the technology disclosed in the present invention.

FIG. 3 is a schematic cross-sectional view showing yet another embodiment of an acoustic wave assembly according to the technology disclosed in the present invention.

Detailed ways

In order to enable those in the relevant technical field to better understand the purpose, technical features and advantages of the present invention and implement the present invention, the technical features and implementation modes of the present invention are specifically explained and enumerated in conjunction with the attached drawings. Preferred embodiments are further described. The drawings contrasted below are schematic representations related to the features of the present invention, and are not and need not be completely drawn based on the actual situation. The description of the implementation mode of this case involves technical contents that are well known to those skilled in the art and will not be described again.

First please refer to Figure 1. FIG. 1 is a schematic cross-sectional view showing an embodiment of an acoustic wave component according to the technology disclosed in the present invention. In FIG. 1 , the acoustic wave component 1 is composed of a substrate 10 , an electronic component 20 , a cover structure 30 a , a first protective layer 40 , a conductor layer 50 a and a plurality of bumps 60 . The substrate 10 has an upper surface 102 and a lower surface 104, and a plurality of bonding pads 106 are provided around the upper surface 102. In one embodiment, the substrate 10 is made of piezoelectric material, such as quartz, lithium tantalate (LT, LiTaO ₃ ), lead titanate (PTO, PbTiO ₃ ) or lead zirconate titanate (PZT, Pb(Zr,Ti)O ₃ ). Bonding pad 106 may be an aluminum pad. The electronic component 20 is disposed on the upper surface 102 of the substrate 10 so that a plurality of soldering pads 106 around the upper surface 102 of the substrate 10 surround the electronic component 20 . In the embodiment of the present invention, the electronic component 20 may be a filter, an oscillator or a sensor.

Please continue to refer to Figure 1. A cover structure 30a is provided above the substrate 10 with the electronic component 20. The space between the cover structure 30a and the substrate 10 can be defined as a closed cavity 32a. Therefore, the electronic component 20 on the upper surface 102 of the substrate 10 It is arranged in this closed cavity 32a. The cover structure 30a can prevent moisture in the external environment from entering the closed cavity 32a, thereby increasing the service life of the electronic component 20 and the reliability of the entire sonic component 1 through the cover structure 30a.

In an embodiment of the present invention, the cover structure 30a includes: a second protective layer 302a, a first insulating layer 304a and a second insulating layer 306a in order from the substrate 10 upward, wherein the second protective layer 302a covers adjacent areas Partial surfaces of the plurality of bonding pads 106 of the electronic component 20 and the second protective layer 302 a are disposed on a part of the upper surface 102 of the substrate 10 adjacent to the electronic component 20 . The first insulating layer 304a is disposed on part of the surface of the second protective layer 302a, and the second protective layer 302a and the first insulating layer 304a above the substrate 10 do not cover the electronic component 20 on the substrate 10. The second insulating layer 306a covers part of the surface of the first insulating layer 304a, so that the structure composed of the second protective layer 302a and the first insulating layer 304a can be defined as the side walls of the cover structure 30a and the second insulating layer 306a. It is the top wall of the cover structure 30a. In one embodiment, the second insulating layer 306a and the first insulating layer 304a in the cover structure 30a have a stepped structure.

Please continue to refer to Figure 1 as well. The acoustic wave component 1 also includes a first protective layer 40, which simultaneously covers part of the upper surface 102 of the substrate 10 and part of the surfaces of the plurality of solder pads 106, and exposes other parts of the surfaces of the plurality of solder pads 106, that is, is not exposed. The first protective layer 40 covers part of the surfaces of the plurality of bonding pads 106 . It should be noted that the first protective layer 40 and the cover structure cover part of the upper surface 102 of the substrate 10 and part of the surface of the plurality of soldering pads 106, and expose other parts of the surfaces of the plurality of soldering pads 106. The second protective layer 302a in 30a is formed simultaneously using a semiconductor process. Next, the conductor layer 50a covers part of the surface of the first protective layer 40, part of the surfaces of the plurality of bonding pads 106 that are not covered by the first protective layer 40, and the outer surface 34a of the cover structure 30a and the part of the cover structure 30a. Upper surface 36a. In one embodiment, the conductor layer 50a is composed of an under bump metallurgy (UBM) 502a and a redistribution layer (RDL) 504a, where the redistribution layer 504a is disposed on the under bump metallurgy 502a superior. Specifically, the under-bump metal layer 502a as the conductor layer 50a covers part of the surface of the first protective layer 40, part of the surfaces of the plurality of bonding pads 106 that are not covered by the first protective layer 40, and the outside of the cover structure 30a. The surface 34a and part of the upper surface 36a of the cover structure 30a are then disposed on the under-bump metal layer 502a as the redistribution layer 504a as the conductor layer 50a. Finally, a plurality of bumps 60 are disposed on the conductor layer 50a covering the upper surface 36a of the cover structure 30a to complete the acoustic wave component 1. In one embodiment, the bumps 60 may be copper pillar bumps (Copper Pillar Bump). , copper pillars or C4 bumps. In addition, it should be noted that the acoustic wave component 1 in the present invention is formed by using existing semiconductor process technology. The process flow and the materials constituting the acoustic wave component 1 are not included in the technical solution to be discussed in the present invention, so they are not included in the technical solutions discussed in the present invention. Make more statements.

Next, the present invention also discloses another acoustic wave component, as shown in FIG. 2 . FIG. 2 is a schematic cross-sectional view showing another embodiment of an acoustic wave component according to the technology disclosed in the present invention. In FIG. 2 , the acoustic wave component 2 is composed of a substrate 10 , an electronic component 20 , a cover structure 30 b , a first protective layer 40 , a conductor layer 50 b and a plurality of bumps 60 . The substrate 10 has an upper surface 102 and a lower surface 104, and a plurality of bonding pads 106 are provided around the upper surface 102. The materials of the substrate 10 , the bonding pads 106 and the electronic components 20 are the same as those mentioned above and will not be further described. The electronic component 20 is disposed on the upper surface 102 of the substrate 10 such that the plurality of bonding pads 106 at the periphery of the upper surface 102 of the substrate 10 surround the electronic component 20 .

Please continue to refer to Figure 2. A cover structure 30b is provided above the substrate 10 with the electronic component 20. The space between the cover structure 30b and the substrate 10 can be defined as a closed cavity 32b. Therefore, the electronic component 20 on the upper surface 102 of the substrate 10 It is arranged in this closed cavity 32b. The cover structure 30b can prevent moisture in the external environment from entering the closed cavity 32b, thereby increasing the service life of the electronic component 20 and the reliability of the entire sonic component 2 through the cover structure 30b.

In another embodiment of the present invention, the cover structure 30b sequentially includes: a second protective layer 302b, a first insulating layer 304b and a second insulating layer 306b from the substrate 10 upward, wherein the second protective layer 302b covers adjacent A portion of the surface of the plurality of bonding pads 106 of the electronic component 20 and the second protective layer 302b are disposed on a portion of the upper surface 102 of the substrate 10 adjacent to the electronic component 20 . The first insulating layer 304b is disposed on part of the surface of the second protective layer 302b and covers part of the plurality of bonding pads 106, and the second protective layer 302b and the first insulating layer 304b above the substrate 10 are not covered on the substrate 10. electronic components 20. The second insulating layer 306b covers part of the surface of the first insulating layer 304b, so that the structure composed of the second protective layer 302b and the first insulating layer 304b is defined as the side wall of the cover structure 30b and the second insulating layer 306b. The top wall of the cover structure 30b. Similarly, in one embodiment, the second insulating layer 306b and the first insulating layer 304b in the cover structure 30b have a stepped structure.

Please continue to refer to Figure 2. The acoustic wave component 2 also includes a first protective layer 40, which simultaneously covers part of the upper surface 102 of the substrate 10 and part of the surfaces of the plurality of solder pads 106, and exposes other parts of the surfaces of the plurality of solder pads 106, that is, is not exposed to the second protective layer 40. A protective layer 40 covers part of the surface of the plurality of bonding pads 106 . It should be noted that the first protective layer 40 and the cover structure cover part of the upper surface 102 of the substrate 10 and part of the surface of the plurality of soldering pads 106, and expose other parts of the surfaces of the plurality of soldering pads 106. The second protective layer 302b in 30b is formed simultaneously using a semiconductor process. Next, the conductor layer 50b covers part of the surface of the first protective layer 40, part of the surfaces of the plurality of bonding pads 106 that are not covered by the first protective layer 40, and the outer surface 34b of the cover structure 30b and the part of the cover structure 30b. Upper surface 36b. In one embodiment, the conductor layer 50b is composed of an under-bump metal layer 502b and a redistribution layer 504b, wherein the redistribution layer 504b is disposed on the under-bump metal layer 502b. Specifically, the under-bump metal layer 502b as the conductor layer 50b covers part of the surface of the first protective layer 40, part of the surfaces of the plurality of bonding pads 106 that are not covered by the first protective layer 40, and the outside of the cover structure 30b. The surface 34b and part of the upper surface 36b of the cover structure 30b are then disposed on the under-bump metal layer 502b as the redistribution layer 504b as the conductor layer 50b. Finally, a plurality of bumps 60 are disposed on the conductor layer 50b covering the upper surface 36b of the cover structure 30b to complete the acoustic wave component 2. In one embodiment, the bumps 60 may be copper pillar bumps, copper pillars or C4 bumps. . In addition, it should be noted that the acoustic wave component 2 in the present invention is formed by using existing semiconductor process technology. The process flow and the materials constituting the acoustic wave component 10 are not included in the technical solution to be discussed in the present invention, so they are not included in the technical solutions discussed in the present invention. Make more statements.

In addition, the present invention discloses an acoustic wave component, as shown in FIG. 3 . 3 is a schematic cross-sectional view showing yet another embodiment of an acoustic wave assembly according to the technology disclosed in the present invention. In FIG. 3 , the acoustic wave component 2 is composed of a substrate 10 , an electronic component 20 , a cover structure 30 c , a first protective layer 40 , a conductor layer 50 c and a plurality of bumps 60 . The substrate 10 has an upper surface 102 and a lower surface 104, and a plurality of bonding pads 106 are provided around the upper surface 102. The materials of the substrate 10 , the bonding pads 106 and the electronic components 20 are the same as those mentioned above and will not be further described. The electronic component 20 is disposed on the upper surface 102 of the substrate 10 such that the plurality of bonding pads 106 at the periphery of the upper surface 102 of the substrate 10 surround the electronic component 20 .

Please continue to refer to Figure 3. A cover structure 30c is provided above the substrate 10 with the electronic component 20. The space between the cover structure 30c and the substrate 10 can be defined as a closed cavity 32c. Therefore, the electronic component 20 on the upper surface 102 of the substrate 10 It is arranged in this closed cavity 32c. The cover structure 30c can prevent moisture in the external environment from entering the closed cavity 32c, thereby increasing the service life of the electronic component 20 and the reliability of the entire sonic component 3 through the cover structure 30c.

In another embodiment of the present invention, the cover structure 30c includes: a second protective layer 302c, a first insulating layer 304c and a second insulating layer 306c in order from the substrate 10 upward, wherein the second protective layer 302c covers adjacent A portion of the surface of the plurality of bonding pads 106 of the electronic component 20 and the second protective layer 302c are disposed on a portion of the upper surface 102 of the substrate 10 adjacent to the electronic component 20 . The first insulating layer 304c is disposed on part of the surface of the second protective layer 302c and covers part of the surfaces of the plurality of bonding pads 106, and the second protective layer 302c and the first insulating layer 304c above the substrate 10 are not covered on the substrate 10 electronic components 20. The second insulating layer 306c covers part of the surface of the first insulating layer 304c, so that the structure composed of the second protective layer 302c and the first insulating layer 304c is defined as the side wall of the cover structure 30c and the second insulating layer 306b. The top wall of the cover structure 30c. Similarly, in one embodiment, the second insulating layer 306c and the first insulating layer 304c in the cover structure 30c have a stepped structure.

Please continue to refer to Figure 3. The acoustic wave component 3 also includes a first protective layer 40 that covers part of the upper surface 102 of the substrate 10 and part of the surfaces of the plurality of soldering pads 106, and exposes other parts of the surfaces of the plurality of soldering pads 106. Partial surfaces of the plurality of bonding pads 106 are covered by the first protective layer 40 . It should be noted that the first protective layer 40 and the cover structure cover part of the upper surface 102 of the substrate 10 and part of the surface of the plurality of soldering pads 106, and expose other parts of the surfaces of the plurality of soldering pads 106. The second protective layer 302c in 30c is formed simultaneously using a semiconductor process. Next, the first insulating layer 304c is disposed on part of the surface of the first protective layer 40 and covers part of the surfaces of the plurality of soldering pads 106 to expose part of the surfaces of the plurality of soldering pads 106 that are not covered by the first protective layer 40 . It should be noted that the first insulating layer 304c disposed on part of the surface of the first protective layer 40 and covering part of the surfaces of the plurality of bonding pads 106 is made of the same material as the first insulating layer 304c in the cover structure 30c. Semiconductor processes are formed simultaneously, and both have the same height.

Next, the conductor layer 50c is covered on part of the surface of the first insulating layer 304c, part of the surfaces of the plurality of bonding pads 10 that are not covered by the first protective layer 40, the outer surface 34c of the cover structure 30c and part of the cover structure 30c. Upper surface 36c. In one embodiment, the conductor layer 50c is composed of an under-bump metal layer 502c and a redistribution layer 504c, where the redistribution layer 504c is disposed on the under-bump metal layer 502c. Specifically, the under-bump metal layer 502c of the conductor layer 50c is first formed on part of the surface of the first insulating layer 304c, part of the surface of the plurality of bonding pads 106 not covered by the first protective layer 40, and part of the cover structure 30c. The outer surface 34c and part of the upper surface 36c of the cover structure 30c are then disposed on the redistribution layer 504c of the conductor layer 5c0 on the under-bump metal layer 502c. Finally, a plurality of bumps 60 are disposed on the conductor layer 50c covering the upper surface 36c of the cover structure 30c to complete the acoustic wave component 3. In one embodiment, the bumps 60 can be copper pillar bumps, copper pillars or C4 bump.

In summary, according to the acoustic wave components 1, 2, and 3 disclosed in the present invention, in the subsequent flip-chip assembly process, the conductor layers 50a, 50b, and 50c are used to add bumps 60 and solder joints during the mold flow process. The strength between the pads 106 is to solve the problem that when the acoustic wave components 1, 2, and 3 are packaged in a flip-chip manner, when the bumps 60 break due to stress, the soldering pads 106 will be pulled up from the substrate 10 together, causing The entire packaging structure is damaged. In addition, the cover structures 30a and 30b in FIGS. 1 and 2 and the cover structure 30c in FIG. 3 are disposed on part of the surface of the first protective layer 40 and cover part of the surface of the plurality of bonding pads 106 . An insulating layer 304c can block moisture from the external environment from entering the cavities 32a, 32b, and 32c to increase the overall reliability of the sonic components 1, 2, and 3 during operation.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the scope of rights of the present invention. At the same time, the above descriptions should be understood and implemented by those skilled in the relevant technical fields. Therefore, other aspects do not deviate from the disclosure of the present invention. Equivalent changes or modifications made in the spirit of the invention shall be included in the scope of the patent application.

Claims (10)

1. An acoustic wave assembly, comprising:

the substrate is provided with an upper surface and a lower surface, and a plurality of welding pads are arranged on the periphery of the upper surface;

an electronic component disposed on the upper surface of the substrate such that the bonding pad at the periphery of the upper surface of the substrate surrounds the electronic component;

a cover structure disposed above the substrate with the electronic component, and a space between the cover structure and the substrate defining a closed cavity such that the electronic component is disposed within the closed cavity;

a first protection layer covering part of the upper surface of the substrate and part of the surface of the bonding pad, and exposing part of the surface of the bonding pad which is not covered by the first protection layer;

a conductor layer covering a part of the surface of the first protective layer, a part of the surface of the bonding pad uncovered by the first protective layer, an outer side surface of the cover structure and a part of the upper surface of the cover structure; and

and the plurality of bumps are arranged on the conductor layer positioned on the upper surface of the cover body structure.

2. The acoustic wave assembly of claim 1 wherein the cover structure comprises, in order from the base plate:

a second protective layer simultaneously covering a part of a surface of the bonding pad adjacent to the electronic component and disposed on the upper surface of the substrate adjacent to the electronic component;

a first insulating layer disposed on a portion of a surface of the second protective layer, wherein the second protective layer and the first insulating layer do not cover the electronic component on the substrate; and

the second insulating layer covers part of the surface of the first insulating layer, so that the structure formed by the second protective layer and the first insulating layer is defined as a side wall body of the cover body structure and the second insulating layer is a top wall body of the cover body structure.

3. The acoustic wave assembly of claim 1 wherein the cover structure comprises, in order from the base plate:

a second protective layer simultaneously covering a part of a surface of the bonding pad adjacent to the electronic component and disposed on the upper surface of the substrate adjacent to the electronic component;

the first insulating layer is arranged on part of the surface of the second protective layer and part of the surface of the welding pad, so that part of the surface of the welding pad which is not covered by the first insulating layer is exposed, and the second protective layer and the first insulating layer do not cover the electronic component on the substrate; and

the second insulating layer covers part of the surface of the first insulating layer, so that the structure formed by the second protective layer and the first insulating layer is defined as a side wall body of the cover body structure and the second insulating layer is a top wall body of the cover body structure.

4. An acoustic wave assembly, comprising:

the substrate is provided with an upper surface and a lower surface, and a plurality of welding pads are arranged on the periphery of the upper surface;

an electronic component disposed on the upper surface of the substrate such that the bonding pad at the periphery of the upper surface of the substrate surrounds the electronic component;

a cover structure disposed above the substrate with the electronic component, and a space between the cover structure and the substrate defining a closed cavity such that the electronic component is disposed within the closed cavity;

a first protection layer covering part of the upper surface of the substrate and part of the surface of the welding pad;

a first insulating layer disposed on a portion of the surface of the first protective layer and covering a portion of the surface of the pad to expose a portion of the surface of the pad not covered by the first protective layer;

a conductor layer covering part of the surface of the first insulating layer, part of the surface of the bonding pad uncovered by the first protective layer, an outer side surface of the cover structure and part of the upper surface of the cover structure; and

and the plurality of bumps are arranged on the conductor layer positioned on the upper surface of the cover body structure.

5. The acoustic wave assembly of claim 4 wherein the cover structure comprises, in order from the base plate:

a second protective layer simultaneously covering a part of a surface of the bonding pad adjacent to the electronic component and disposed on the upper surface of the substrate adjacent to the electronic component;

the first insulating layer is arranged on a part of the surface of the second protective layer and covers a part of the surface of the welding pad so as to expose a part of the surface of the welding pad which is not covered by the first insulating layer, the second protective layer and the first insulating layer do not cover the electronic component on the substrate, and the second protective layer and the first insulating layer do not cover the electronic component on the substrate; and

the second insulating layer covers part of the surface of the first insulating layer, so that the structure formed by the second protective layer and the first insulating layer is defined as a side wall body of the cover body structure and the second insulating layer is a top wall body of the cover body structure.

6. The acoustic wave assembly of claims 2, 3, or 5 wherein the second insulating layer and the first insulating layer of the cover structure are in a stepped configuration.

7. The acoustic wave assembly of claim 5 wherein the height of the first insulating layer disposed on a portion of the surface of the first protective layer and covering a portion of the surface of the bond pad is the same as the height of the first insulating layer of the cover structure.

8. The acoustic wave assembly of claim 1 or 4 wherein the conductor layer is comprised of an under bump metal layer and a rewiring layer, wherein the rewiring layer is disposed on the under bump metal layer.

9. An acoustic wave assembly as claimed in claim 1 or 4, wherein the electronic assembly is a filter, an oscillator or a sensor.

10. The acoustic wave assembly of claim 1 or 4 wherein the bump is a copper pillar bump, a copper pillar, or a C4 bump.