CN116949401B

CN116949401B - Mask manufacturing method and mask

Info

Publication number: CN116949401B
Application number: CN202311078017.4A
Authority: CN
Inventors: 王广成; 甘帅燕
Original assignee: Jiangsu Gaoguang Semiconductor Materials Co ltd
Current assignee: Jiangsu Gaoguang Semiconductor Materials Co ltd
Priority date: 2023-08-25
Filing date: 2023-08-25
Publication date: 2025-11-21
Anticipated expiration: 2043-08-25
Also published as: CN116949401A

Abstract

The invention relates to the technical field of display, in particular to a mask manufacturing method and a mask. The mask manufacturing method comprises the following steps of processing a preset opening on a mask substrate, wherein the size of the preset opening is smaller than that of an actual opening, tensioning and fixing the mask substrate processed with the preset opening on a supporting frame, and further processing the mask substrate fixed on the supporting frame to enlarge the preset opening to the actual opening. The mask manufacturing method reduces deviation generated in the mask manufacturing process, improves the manufacturing precision of the mask, meets the requirements of high-precision display products and narrow-frame display products, and is simple and convenient. The mask plate provided by the invention is manufactured by adopting the mask plate manufacturing method, so that the manufacturing precision of the mask plate is improved, the requirements of high-precision display products and narrow-frame display products are met, and the manufacturing is simple and convenient.

Description

Mask manufacturing method and mask

Technical Field

The invention relates to the technical field of display, in particular to a mask manufacturing method and a mask.

Background

In the process of processing and manufacturing the display panel, a mask plate is required to be used for participating in the processing and manufacturing of the display panel, and the mask plate plays a role in defining an effective display area in the evaporation process.

In the traditional mask plate manufacturing process, the mask plate substrate is required to be sequentially subjected to processes such as cleaning, film pressing, exposure, development, etching, film withdrawal and the like to manufacture a mask plate sheet, then tension is applied to the mask plate sheet through a screen tensioning machine, the position accuracy of the mask plate sheet is continuously adjusted, and finally the mask plate sheet is welded with a metal frame. The mask sheet is welded and fixed on the metal frame after tension is applied to the mask sheet, so that the mask sheet is prevented from deforming due to sagging under the action of gravity of the mask sheet, and the manufacturing precision of the mask sheet is ensured. However, when tension is applied to the mask sheet, the position accuracy of the mask sheet needs to be continuously adjusted to ensure the accuracy of the welding position of the mask sheet on the metal frame, so that the process is complex. In addition, the mask plate is superimposed with the manufacturing error of the mask plate sheet and the deviation of the mask plate sheet in the process of applying tension in the manufacturing process, so that the manufacturing precision of the mask plate is greatly reduced, and the requirements of high-precision display products and narrow-frame display products cannot be met.

Therefore, there is a need for a mask manufacturing method and a mask to solve the above problems.

Disclosure of Invention

The invention aims to provide a mask manufacturing method and a mask, which are used for improving the manufacturing precision of the mask, meeting the requirements of high-precision display products and narrow-frame display products and being simple and convenient to manufacture.

To achieve the purpose, the invention adopts the following technical scheme:

A mask manufacturing method comprises the following steps:

processing a preset opening on a mask plate substrate, wherein the size of the preset opening is smaller than that of an actual opening;

Tensioning and fixing the mask plate substrate with the preset opening on a supporting frame;

And further processing the mask plate substrate fixed on the supporting frame to enlarge the preset opening to the actual opening.

As a preferred scheme, the mask plate base plate is divided into an opening area and a connection area which are connected, the connection area is enclosed on the periphery of the opening area, the opening area is provided with the preset opening, and the mask plate base plate with the preset opening is tensioned and fixed on a supporting frame, and the method specifically comprises the following steps:

Tensioning and fixing the silk screen on the supporting frame;

fixing the connection area of the mask plate substrate on the silk screen;

And cutting the silk screen to remove the silk screen overlapped on the opening area of the mask plate substrate.

Preferably, when the connection area is fixed on the silk screen, glue is coated on the part, facing the connection area, of the silk screen so as to fix the connection area on the silk screen in a pasting mode.

Preferably, after the connection area is stuck and fixed on the silk screen and the glue applied on the connection area is dried, the silk screen is subjected to cutting operation.

Preferably, the step of increasing the preset opening to the actual opening specifically includes the following steps:

coating a photoresist film on the upper surface and the lower surface of the mask plate substrate fixed on the supporting frame;

Exposing, namely irradiating UV light to the mask plate substrate after film pressing through a photomask, wherein the photomask blocks part of the mask plate substrate, and the photoresist film irradiated by the UV light undergoes photopolymerization;

spraying a developing solution onto the exposed mask plate substrate to enable the photoresist film which is not irradiated by UV light to react with the developing solution, and leaking out of the mask plate substrate;

spraying etching solution on the developed mask plate substrate to etch the actual opening on the mask plate substrate;

And film stripping, namely spraying film stripping solution onto the etched mask plate substrate to remove the residual photoresist film.

Preferably, after the preset opening is increased to the actual opening, the mask substrate with the support frame and the metal frame are subjected to counterpoint welding.

Preferably, after the mask substrate with the support frame is welded and fixed on the metal frame, the support frame and the rest silk screen are removed.

Preferably, the size of the actual opening is 0.5 mm-2 mm larger than the size of the preset opening.

Preferably, the preset opening is processed on the mask plate substrate by adopting a laser or etching mode.

A mask plate is manufactured by adopting the mask plate manufacturing method.

The invention has the beneficial effects that:

The invention provides a mask manufacturing method, which comprises the steps of firstly processing a preset opening on a mask substrate, then tensioning and fixing the mask substrate processed with the preset opening on a support frame, and then enlarging the preset opening to an actual opening, so that the tensioning of the mask substrate is realized, the mask substrate is prevented from deforming due to sagging, and the manufacturing method only needs to ensure the position precision of the enlarged actual opening, so that the tensioning and fixing of the mask substrate on the support frame are simpler and more convenient, and the whole mask manufacturing method is simple and convenient. In addition, after the mask substrate is tensioned and fixed on the supporting frame, the preset opening is increased to the actual opening, so that deviation of the mask in the tensioning process is eliminated, the manufacturing precision of the mask is improved, and the requirements of high-precision display products and narrow-frame display products are met.

The invention also provides a mask plate which is manufactured by adopting the mask plate manufacturing method, improves the manufacturing precision of the mask plate, meets the requirements of high-precision display products and narrow-frame display products, and is simple and convenient to manufacture.

Drawings

FIG. 1 is a main flow chart of a mask manufacturing method according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a mask manufacturing process according to an embodiment of the present invention;

fig. 3 is a detailed flowchart of a mask manufacturing method according to an embodiment of the present invention.

In the figure:

1. the mask plate comprises a mask plate substrate, a preset opening, a practical opening, a supporting frame, a screen, a photoresist film, a photomask, a metal frame and a mask.

Detailed Description

In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings.

In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

In order to solve the above problems, as shown in fig. 1 and 2, the present embodiment provides a mask manufacturing method, which includes the steps of processing a preset opening 11 on a mask substrate 1, wherein the size of the preset opening 11 is smaller than that of an actual opening 12, tensioning and fixing the mask substrate 1 processed with the preset opening 11 on a support frame 2, and further processing the mask substrate 1 fixed on the support frame 2 to enlarge the preset opening 11 to the actual opening 12.

According to the mask manufacturing method provided by the embodiment, the preset opening 11 is processed on the mask substrate 1, then the mask substrate 1 with the processed preset opening 11 is tensioned and fixed on the support frame 2, and then the preset opening 11 is increased to the actual opening 12, so that the tensioning of the mask substrate 1 is realized, the mask substrate 1 is prevented from being deformed due to sagging, the position accuracy of the increased actual opening 12 is ensured, the tensioning and fixing of the mask substrate 1 on the support frame 2 are simpler and more convenient, and the whole mask manufacturing method is simple and convenient. In addition, after the mask substrate 1 is tensioned and fixed on the supporting frame 2, the preset opening 11 is increased to the actual opening 12, so that deviation of the mask in the tensioning process is eliminated, the mask manufacturing precision is improved, and the requirements of high-precision display products and narrow-frame display products are met.

It should be noted that, if the mask substrate 1 has isotropic characteristics, and the actual opening 12 is directly processed on the mask substrate 1 after the mask substrate 1 is tensioned and fixed on the support frame 2, the isotropic characteristics of the mask substrate 1 are greatly affected, the processed actual opening 12 is easily deformed under the action of the tensioning force, and the manufacturing accuracy of the whole mask is seriously affected.

In the present embodiment, the size of the actual opening 12 is 0.5mm to 2mm larger than the size of the preset opening 11. Under the limitation of the size, the mask substrate 1 is convenient to be tensioned and fixed on the supporting frame 2, the deviation generated in the tensioning process of the mask is eliminated, the deformation of the actual opening 12 under the action of the tensioning force when the preset opening 11 is increased to the actual opening 12 is avoided, and the manufacturing precision of the mask is ensured. Illustratively, the actual opening 12 is 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.5mm or 2mm larger than the preset opening 11.

Preferably, the actual opening 12 has a size greater than the size of the preset opening 11 by 1mm. Under the limitation of the size, the deviation of the mask plate in the tensioning process can be eliminated better, and the manufacturing precision of the mask plate is ensured.

It should be noted that, in the present embodiment, when the actual opening 12 and the preset opening 11 are both rectangular, the size of the actual opening 12 is 0.5mm to 2mm larger than the size of the preset opening 11, which means that the length and the width of the actual opening 12 are both 0.5mm to 2mm larger than the length and the width of the preset opening 11. When the actual opening 12 and the preset opening 11 are both circular, the inner diameter of the actual opening 12 is 0.5 mm-2 mm larger than the inner diameter of the preset opening 11. When the actual opening 12 and the preset opening 11 are both irregular images, the numerical value for performing size constraint on the actual opening 12 is only required to be 0.5 mm-2 mm larger than the numerical value for performing size constraint on the preset opening 11.

Optionally, in this embodiment, the mask substrate 1 is divided into an opening area and a connection area, the connection area is surrounded on the periphery of the opening area, and a preset opening 11 is processed on the opening area, as shown in fig. 2 and 3, and the mask substrate 1 processed with the preset opening 11 is fastened and fixed on the support frame 2 specifically includes the following steps:

Tensioning and fixing the screen 3 to the support frame 2;

fixing the connection area of the mask substrate 1 on the silk screen 3;

the screen 3 is subjected to a cutting operation to remove the screen 3 superimposed on the opening area of the reticle base plate 1.

Through tensioning and fixing the silk screen 3 on the braced frame 2 earlier, then be fixed in on the silk screen 3 with the connection region of mask base plate 1, after cutting the silk screen 3 that stacks on the opening area of mask base plate 1, can guarantee that mask base plate 1 is fixed by the tensioning on braced frame 2 under the effect of silk screen 3 tensioning force, need not directly to carry out the tensioning to mask base plate 1 to need not to consider the problem of position accuracy to the in-process of silk screen 3 tensioning, make the simple operation, also greatly reduced the degree of difficulty of mask base plate 1 in fixed in-process.

Specifically, in the present embodiment, when the connection region is fixed to the screen 3, glue is applied to the portion of the screen 3 facing the connection region to paste and fix the connection region to the screen 3. The fixing of the connecting area on the silk screen 3 is realized in an adhesive mode, so that the stability and reliability of the fixing of the mask substrate 1 on the silk screen 3 are ensured, and the operation is simple and convenient.

Preferably, in this embodiment, the cutting operation is performed on the screen 3 after the attachment areas are affixed to the screen 3 and the applied glue is dried. This mode of operation avoids that the connection region separates from the wire mesh 3 under the action of the pulling force when the wire mesh 3 is cut, ensuring the stability and reliability of the structure.

In this embodiment, as shown in fig. 2 and 3, the step of enlarging the preset opening 11 to the actual opening 12 specifically includes the steps of:

The method comprises the steps of film pressing, namely coating a photoresist film 4 on the upper surface and the lower surface of a mask substrate 1 fixed on a supporting frame 2, exposing, namely irradiating UV light to the mask substrate 1 after film pressing through a photomask 5, blocking light of the photomask 5 on part of the mask substrate 1, enabling the photoresist film 4 irradiated by the UV light to undergo photopolymerization, developing, namely spraying a developing solution to the exposed mask substrate 1 to enable the photoresist film 4 which is not irradiated by the UV light to react with the developing solution and leak out of the mask substrate 1, etching, namely spraying an etching solution to the developed mask substrate 1 to etch an actual opening 12 in the mask substrate 1, and stripping, namely spraying a stripping solution to the etched mask substrate 1 to remove the residual photoresist film 4.

By the etching step, the etching of the preset opening 11 is increased to the actual opening 12, and the accuracy of processing the actual opening 12 is ensured. Preferably, before the photoresist film 4 is coated on the upper surface and the lower surface of the mask substrate 1, the mask substrate 1 may be cleaned, so as to remove greasy dirt on the surface of the mask substrate 1, and ensure the etching precision of the actual opening 12.

In this embodiment, the support frame 2 belongs to a jig frame. As shown in fig. 2 and 3, after the preset opening 11 is increased to the actual opening 12, the mask substrate 1 with the support frame 2 and the metal frame 6 are subjected to alignment welding, so that the mask substrate 1 is fixed on the metal frame 6, and the stability and reliability of the fixing of the mask substrate 1 on the metal frame 6 are ensured.

Preferably, as shown in fig. 2 and 3, after the mask substrate 1 with the support frame 2 is welded and fixed on the metal frame 6, the support frame 2 and the rest of the silk screen 3 are removed, so that the machined mask is more attractive and tidy. In addition, the detached supporting frame 2 can be reused, so that the resource utilization rate is improved, and the manufacturing cost is reduced.

In this embodiment, the preset opening 11 is processed on the reticle substrate 1 by laser. The preset opening 11 is processed on the mask substrate 1 by laser, so that the processing flow is simplified. It should be noted that, in other embodiments, the preset opening 11 may also be processed by etching. It should be noted that, when the preset opening 11 is processed by etching, the specific operation steps for enlarging the preset opening 11 to the actual opening 12 are substantially the same, and will not be described herein.

The embodiment also provides a mask plate, which is manufactured by adopting the mask plate manufacturing method, so that the manufacturing precision of the mask plate is improved, the requirements of high-precision display products and narrow-frame display products are met, and the manufacturing is simple and convenient.

It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.

Claims

1. A method for fabricating a photomask, characterized by comprising the following steps:

A preset opening (11) is processed on the photomask substrate (1), wherein the size of the preset opening (11) is smaller than the size of the actual opening (12);

The mask substrate (1) with the preset opening (11) is tensioned and fixed onto the support frame (2);

The mask substrate (1) fixed on the support frame (2) is further processed to enlarge the preset opening (11) to the actual opening (12).

The photomask substrate (1) is divided into an open area and a connecting area. The connecting area surrounds the outer periphery of the open area. The open area has a preset opening (11). The step of tensioning and fixing the photomask substrate (1) with the preset opening (11) onto the support frame (2) specifically includes the following steps:

Tension the wire mesh (3) and fix it to the support frame (2);

The connecting area of the mask substrate (1) is fixed onto the screen (3);

The screen (3) is cut to remove the screen (3) that is stacked on the opening area of the mask substrate (1).

Enlarging the preset opening (11) to the actual opening (12) specifically includes the following steps:

Film pressing: The photoresist film (4) is coated onto the upper and lower surfaces of the photomask substrate (1) fixed on the support frame (2);

Exposure: UV light is irradiated onto the photomask substrate (1) after lamination through the photomask (5). The photomask (5) blocks light at a part of the photomask substrate (1), and the photoresist film (4) irradiated by UV light undergoes a photopolymerization reaction.

Development: The developing solution is sprayed onto the exposed photomask substrate (1) so that the photoresist film (4) that has not been exposed to UV light reacts with the developing solution and exposes the photomask substrate (1).

Etching: The etching solution is sprayed onto the developed photomask substrate (1) to etch the actual opening (12) on the photomask substrate (1).

Photoresist removal: Spray the photoresist solution onto the etched photomask substrate (1) to remove the residual photoresist film (4).

After the preset opening (11) is enlarged to the actual opening (12), the mask substrate (1) with the support frame (2) is aligned and welded to the metal frame (6).

After the mask substrate (1) with the support frame (2) is welded and fixed to the metal frame (6), the support frame (2) and the remaining wire mesh (3) are removed.

2. The method for manufacturing a photomask according to claim 1, characterized in that, when fixing the connecting area onto the screen (3), adhesive is applied to the part of the screen (3) facing the connecting area to stick and fix the connecting area onto the screen (3).

3. The method for making a mask according to claim 2, characterized in that, after the connecting area is pasted and fixed on the screen (3) and the applied glue dries, the screen (3) is cut.

4. The method for manufacturing a photomask according to any one of claims 1 to 3, wherein the size of the actual opening (12) is 0.5 mm to 2 mm larger than the size of the preset opening (11).

5. The method for manufacturing a photomask according to any one of claims 1 to 3, characterized in that the preset opening (11) is processed on the photomask substrate (1) by laser or etching.

6. A photomask, characterized in that it is manufactured using the photomask manufacturing method according to any one of claims 1 to 5.