CN116825731A - Radiating element and radiating system - Google Patents

Abstract

The application relates to the technical field of chip heat dissipation, and provides a heat dissipation element and a heat dissipation system, wherein a plurality of heat dissipation elements are configured to be arranged on a substrate to form a heat dissipation layer, and the heat dissipation layer is arranged on a chip interconnection layer, and the plurality of heat dissipation elements are configured to have different structures so as to have different heat dissipation capacities. The application can well solve the heat dissipation problem of the high heat source area of the chip, and the heat dissipation elements are arranged according to the gradient ordering of the heat dissipation capability, so that the temperature uniformity problem of the chip can be solved.

Description

A kind of heat dissipation element and heat dissipation system

Technical field

The present invention generally relates to the technical field of chip heat dissipation. Specifically, the present invention relates to a heat dissipation component and a heat dissipation system.

Background technique

As the integration scale of chips becomes larger and larger, the power required per unit area of the chip is also increasing. The increase in the power per unit area of the chip will lead to an increase in the heat flow density (heat flux) on the chip, which will increase the heat generated by the chip, thereby causing the chip's heat dissipation problem to become more serious. Especially for multi-chip interconnected wafer-level chips, since multiple chips are connected to each other, when the chip heats up severely and the temperature distribution is uneven, it is easy to cause damage to devices and equipment.

Contents of the invention

In order to at least partially solve the above-mentioned problems in the prior art, the present invention proposes a heat dissipation element, which is characterized in that a plurality of heat dissipation elements are configured to be arranged on a substrate to form a heat dissipation layer, and the heat dissipation layer is arranged on the chip interconnect layer. , wherein the plurality of heat dissipation elements are configured to have different structures to have different heat dissipation capabilities.

In one embodiment of the present invention, the heat dissipation element includes:

a first area located at the center of the heat dissipation element; and

A second area is located around the first area, wherein the heat dissipation element is configured such that the heat dissipation capacity in the first area is greater than or equal to the heat dissipation capacity in the second area.

In one embodiment of the present invention, it is specified that the heat dissipation element includes a plurality of fins, wherein a plurality of the fins are arranged in parallel to form a flow channel.

In one embodiment of the present invention, it is specified that the fins include linear fins, wavy fins or zigzag fins, wherein the heat dissipation capacity of the zigzag fins is greater than the heat dissipation capacity of the wavy fins, And the heat dissipation capacity of the wavy fins is greater than the heat dissipation capacity of the linear fins.

In one embodiment of the present invention, the heat dissipation element includes a plurality of fin pins, wherein the heat dissipation capacity of the fin pins is greater than the heat dissipation capacity of the fins.

In one embodiment of the present invention, the shape of the fin pins includes a cylindrical shape and a square cylindrical shape, wherein the heat dissipation capacity of the square cylindrical fin pins is greater than the heat dissipation capacity of the cylindrical fin pins.

In one embodiment of the present invention, it is specified that the fin pins are configured to have different sizes, wherein the heat dissipation capacity of the plurality of first size fin pins is greater than the heat dissipation capacity of the plurality of second size fin pins, and the first size is smaller than the second size; and\or

The fin pins have different spacings, wherein the heat dissipation capacity of the fin pins at a first spacing is greater than the heat dissipation capacity of the fin pins at a second spacing, and the first spacing is smaller than the second spacing.

In one embodiment of the present invention, it is specified that the plurality of fin pins are arranged in alignment or staggered, wherein the heat dissipation capacity of the plurality of staggered fin pins is greater than the heat dissipation capacity of the plurality of aligned fin pins.

In one embodiment of the invention, it is provided that the heat dissipation element is configured as a microfluidic structure; or

The heat dissipation element is constructed as a laminar single-phase structure.

The invention also proposes a heat dissipation system, which is characterized in that it includes:

a chip interconnect layer, which includes a plurality of dies; and

a heat dissipation layer disposed on the chip interconnect layer, the heat dissipation layer comprising a plurality of heat dissipation elements, at least one of the plurality of heat dissipation elements being disposed on one of the plurality of dies, wherein the heat dissipation element is The heat dissipation element described in one of the above embodiments.

The present invention at least has the following beneficial effects: The present invention proposes a heat dissipation element and a heat dissipation system. Each heat dissipation element can be arranged above one of the plurality of dies in the chip interconnection layer, and the heat dissipation element can have different structures. With different heat dissipation capabilities, the heat dissipation problem in the high heat source area of the chip can be well solved, and the heat dissipation components are arranged according to the gradient of the heat dissipation ability to solve the temperature uniformity problem of the chip.

Description of the drawings

To further elucidate the advantages and features of various embodiments of the invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It will be understood that the drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. In the drawings, the same or corresponding parts will be labeled with the same or similar reference numerals, for purposes of clarity and clarity.

FIG. 1 shows a schematic diagram of the hierarchical structure of a heat dissipation system for a multi-chip interconnection structure in one embodiment of the present invention.

FIG. 2A shows a schematic structural diagram of a heat dissipation layer in an embodiment of the present invention.

FIG. 2B shows a schematic plan view of a heat dissipation layer in one embodiment of the present invention.

FIG. 3A shows a schematic structural diagram of a heat dissipation element in an embodiment of the present invention.

Figure 3B shows a schematic plan view of a heat dissipation element in one embodiment of the present invention.

Figure 4 shows a schematic diagram of heat dissipation elements with different structures in one embodiment of the present invention.

FIG. 5A shows a schematic diagram of a heat dissipation element with different structures in another embodiment of the present invention.

FIG. 5B shows a schematic plan view of a heat dissipation element with different structures in another embodiment of the present invention.

Figure 6 shows a schematic diagram of a heat dissipation element with different structures in another embodiment of the present invention.

7A-G show a schematic diagram of an array of heat dissipation elements from the first side to the second side of the heat dissipation system in one embodiment of the present invention.

Detailed ways

It should be noted that components in the various figures may be exaggerated for illustration and are not necessarily proportionally correct. In the various figures, identical or functionally identical components are assigned the same reference numerals.

In the present invention, unless otherwise specified, “arranged on,” “arranged on,” and “arranged on” do not exclude the presence of intermediates between the two. In addition, "arranged on or above" only indicates the relative positional relationship between the two components. Under certain circumstances, such as after reversing the product direction, it can also be converted to "arranged on or below", and vice versa. Of course.

In the present invention, each embodiment is only intended to illustrate the solution of the present invention and should not be construed as limiting.

In the present invention, unless otherwise specified, the quantifiers "a" and "一" do not exclude the scenario of multiple elements.

It should also be noted here that in the embodiments of the present invention, for the sake of clarity and simplicity, only some parts or assemblies may be shown. However, those of ordinary skill in the art can understand that under the teachings of the present invention, they may be modified according to specific The scene needs to add the required parts or components. In addition, features of different embodiments of the invention may be combined with each other unless stated otherwise. For example, a certain feature in the second embodiment can be used to replace a corresponding feature in the first embodiment or a feature with the same or similar function, and the resulting embodiment also falls within the disclosure scope or recording scope of the present application.

It should also be noted here that within the scope of the present invention, terms such as "the same", "equal", and "equal to" do not mean that the two values are absolutely equal, but allow a certain reasonable error. That is to say, the The wording also covers "substantially the same", "substantially equal", and "substantially equal to". By analogy, in the present invention, the terms "perpendicular to", "parallel to", etc. indicating directions also include the meanings of "substantially perpendicular to" and "substantially parallel to".

In addition, the numbering of the steps of each method of the present invention does not limit the execution order of the method steps. Unless otherwise stated, method steps may be performed in a different order.

The present invention will be further described below in conjunction with specific embodiments and with reference to the accompanying drawings.

FIG. 1 shows a schematic diagram of the hierarchical structure of a heat dissipation system for a multi-chip interconnection structure in one embodiment of the present invention. As shown in FIG. 1 , the heat dissipation system includes a cover layer 101 , a heat dissipation layer 102 and a chip interconnection layer 103 .

The heat dissipation layer 102 is arranged on the chip interconnection layer 103, and the cover layer 101 is arranged on the heat dissipation layer 102, wherein the heat dissipation layer 102 conducts the heat generated by the chip interconnection layer 103 to the Cover layer 101, and heat exchange is performed on the cover layer 101. The chip interconnect layer 103 includes a plurality of die 108, wherein the plurality of die 108 are connected to each other.

The cover layer 101 and the heat dissipation layer 102 can be integrally formed through a welding process to form a complete liquid cooling heat dissipation device. A coolant inlet 104 is provided on a first side of the cover layer 101 , and a coolant outlet 105 is provided on a second side of the cover layer 101 opposite to the first side. The coolant inlet 104 The coolant outlet 104 can be connected to a water inlet pipe, and the coolant outlet 104 can be connected to a water outlet pipe, wherein the coolant can flow from the first side to the second side of the cover layer 101 and take away the heat conducted to the cover layer 101 .

FIG. 2A shows a schematic structural diagram of a heat dissipation layer in an embodiment of the present invention. FIG. 2B shows a schematic plan view of a heat dissipation layer in one embodiment of the present invention. As shown in FIGS. 2A and 2B , the heat dissipation layer 102 includes a substrate 106 and a plurality of heat dissipation elements 107 , wherein a plurality of the heat dissipation elements 107 are arranged on the substrate 106 . At least one of the plurality of heat dissipation elements 107 is arranged above one of the plurality of die 108 . Preferably, as shown in FIG. 1 , the plurality of heat dissipation elements 107 are arranged together with the plurality of die 108 . One correspondence. The heat dissipation layer 102 is attached to the chip interconnection layer 103, and a thermal conductive layer can be provided between the substrate 106 and the chip interconnection layer 103 to conduct the heat generated when the die 108 is working to the chip interconnection layer 103. Heat dissipation element 107.

FIG. 3A shows a schematic structural diagram of a heat dissipation element in an embodiment of the present invention. Figure 3B shows a schematic plan view of a heat dissipation element in one embodiment of the present invention. As shown in FIGS. 3A and 3B , the heat dissipation element 107 is arranged on the substrate 106 , and the heat dissipation element 107 may include a first area and a second area, and the first area is located in the center of the heat dissipation element. , the second area is located around the first area, wherein the heat dissipation element is configured such that the heat dissipation capacity in the first area is greater than or equal to the heat dissipation capacity in the second area. For example, the heat dissipation element may include fin pins 301 and fins 302, wherein the fin pins 301 may be arranged on the first area, the fins 302 may be arranged on the second area, and a plurality of the fins may be arranged on the first area. Flow channels may be formed between the sheets 302.

In the first aspect, the heat dissipation effect of the heat dissipation system provided by the present invention can be determined by the flow rate of the coolant. Through simulation experiments, it was found that the faster the coolant flow rate, the better the heat dissipation effect of the heat dissipation system. However, when the coolant flow rate reaches a critical value, even if the coolant flow rate continues to be increased, it is difficult to continue to improve the heat dissipation effect of the heat dissipation system. According to the results of the simulation experiment, the flow rate of the coolant may preferably be 0.6m/s to 1.5m/s.

In addition, according to the results of the simulation experiment, the temperature of the heat dissipation system is lower on the first side close to the coolant inlet 104 and the temperature is higher on the second side close to the coolant outlet 104. This is because the coolant gradually flows during the flow process. This is caused by absorbing the heat generated by the crystal grains 108 . In the embodiment of the present invention, the temperature of the hot spot on the second side close to the coolant outlet 104 reaches a maximum of 70 degrees Celsius, which can well meet the heat dissipation requirements of a multi-chip interconnected wafer-level chip with a power density of 25 kW, and the hot spot The temperature does not exceed 70 degrees Celsius.

According to the results of the simulation experiment, the temperature of the die 108 on the first side close to the heat dissipation system is lower, and the temperature of the die 108 close to the second side of the heat dissipation system is higher. Therefore, in another embodiment of the present invention, in order to improve the temperature uniformity of the chip, heat dissipation elements 107 with different heat dissipation capabilities can be arranged at different positions above the chip. Specifically, heat dissipation elements 107 are arranged close to the second side of the heat dissipation system. The heat dissipation capacity of the heat dissipation element 107 at the position is higher than the heat dissipation capacity of the heat dissipation element 107 at the position close to the first side of the heat dissipation system, thereby improving the temperature uniformity of the chip.

In the present invention, the heat dissipation capability of the heat dissipation element 107 is determined by the structure of the heat dissipation element 107 . Figure 4 shows a schematic diagram of heat dissipation elements with different structures in one embodiment of the present invention. As shown in FIG. 4 , the heat dissipation element 107 may only include fins 302 , or the heat dissipation element 107 may include fin pins 301 and fins 302 , or the heat dissipation element 107 may only include fin pins 301 , which only include The heat dissipation capacity of the heat dissipation element 107 of the fin pins 301 is higher than that of the heat dissipation element 107 including the fin pins 301 and fins 302, and the heat dissipation capacity of the heat dissipation element 107 including the fin pins 301 and fins 302 is higher than that of the heat dissipation element 107 including only the fins. The heat dissipation capacity of the heat dissipation element 107 is 302.

FIG. 5A shows a schematic diagram of heat dissipation elements with different structures in another embodiment of the present invention. FIG. 5B shows a schematic plan view of a heat dissipation element with different structures in another embodiment of the present invention. As shown in FIG. 5A-B, in the heat dissipation element 107 including only fins 302, the fins 302 can be linear fins 501, wavy fins 502 or zigzag fins 503, wherein there are zigzag fins. The heat dissipation capacity of the heat dissipation element 107 with the fins 503 is higher than that of the heat dissipation element 107 with the corrugated fins 502, and the heat dissipation capacity of the heat dissipation element 107 with the corrugated fins 502 is higher than that of the heat dissipation element with the straight fins 501 107 heat dissipation capacity.

Figure 6 shows a schematic diagram of a heat dissipation element with different structures in another embodiment of the present invention. As shown in FIG. 6 , in the heat dissipation element 107 that only includes fin pins 301 , the fin pins 301 can be arranged in an aligned or staggered arrangement. The heat dissipation capacity of the heat dissipation element 107 in which the fin pins 301 are staggered is higher than that of the fin pins. 301 The heat dissipation capability of the symmetrically arranged heat dissipation elements 107. Furthermore, the shape of the fin pins 301 can also be replaced from a cylinder to a square pillar or other structure, where the heat dissipation capacity of the square column fin pins is higher than that of the cylindrical fin pins. Further, the heat dissipation capacity of the heat dissipation element can be adjusted by adjusting the diameter of the fin pins 301 and the spacing between the plurality of fin pins 301. The smaller the diameter of the fin pins 301, the smaller the spacing between the plurality of fin pins 301. , the higher the heat dissipation capacity of the cooling element.

Furthermore, the heat dissipation capacity of the heat dissipation element can be adjusted by adjusting the diameter of the fin pins 301 and the spacing between the plurality of fin pins 301 . 7A-G show a schematic diagram of an array of heat dissipation elements from the first side to the second side of the heat dissipation system in one embodiment of the present invention. As shown in Figures 7A-G, in the heat dissipation system provided with 7×7 heat dissipation elements 107 as shown in Figure 1, the seven heat dissipation elements in a row are the first heat dissipation element 701 from the first side to the second side. , the second heat dissipation element 702...the seventh heat dissipation element 707. Among them, the first heat dissipation element 701 also has the weakest heat dissipation ability. From the first heat dissipation element 701 to the seventh heat dissipation element 707, by adjusting the diameter, spacing, shape, and arrangement of the fin pins 301 on the heat dissipation element, the heat dissipation of the heat dissipation element can be improved. The ability is getting higher and higher.

According to simulation experiments, the change of hot spot temperature in the direction from the first side to the second side of the heat dissipation system has a symmetrical periodicity. Therefore, during the processing process, multiple rows of identical heat dissipation elements 107 can be processed first and then combined in parallel. into a whole with the same heat dissipation effect. Taking the heat dissipation system provided with 7×7 heat dissipation elements 107 shown in FIG. 1 as an example, a unit with a size of, for example, 196 mm×196 mm×9 mm can be split into seven units of 196 mm×28 mm×9 mm and then combined together.

In addition, for chips with higher power density, such as chips with a power density of 50W/ ^cm2 to 500W/cm2, the heat dissipation element 107 can use a microfluidic structure. For chips with a power density of 1000W/cm2 or above, the heat dissipation element 107 The heat dissipation element 107 may use a multi-phase, air bubble convection structure.

Although various embodiments of the present invention are described above, it should be understood that they are presented by way of example only and not by way of limitation. It is obvious to those skilled in the relevant art that various combinations, modifications and changes can be made without departing from the spirit and scope of the invention. Accordingly, the breadth and scope of the invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined solely in accordance with the appended claims and their equivalents.

Claims (10)

1. A heat dissipation element, characterized in that a plurality of heat dissipation elements are configured to be arranged on a substrate to form a heat dissipation layer, and the heat dissipation layer is arranged on a chip interconnect layer, wherein the plurality of heat dissipation elements are configured to have different The structures have different heat dissipation capabilities. 2. The heat dissipation element according to claim 1, characterized in that it includes: a first area located at the center of the heat dissipation element; and A second area is located around the first area, wherein the heat dissipation element is configured such that the heat dissipation capacity in the first area is greater than or equal to the heat dissipation capacity in the second area. 3. The heat dissipation element according to claim 2, wherein the heat dissipation element includes a plurality of fins, wherein a plurality of the fins are arranged in parallel to form a flow channel. 4. The heat dissipation element according to claim 3, wherein the fins comprise linear fins, wavy fins or zigzag fins, wherein the heat dissipation capacity of the zigzag fins is greater than that of the wavy fins. The heat dissipation capacity of the wavy fins is greater than the heat dissipation capacity of the linear fins. 5. The heat dissipation element according to claim 3, wherein the heat dissipation element includes a plurality of fin pins, wherein the heat dissipation capacity of the fin pins is greater than the heat dissipation capacity of the fins. 6. The heat dissipation element according to claim 5, wherein the shape of the fin pins includes a cylindrical shape and a square cylindrical shape, wherein the heat dissipation capacity of the square cylindrical fin pins is greater than the heat dissipation capacity of the cylindrical fin pins. 7. The heat dissipation element according to claim 6, wherein the fin pins are configured to have different sizes, wherein the heat dissipation capacity of the plurality of first size fin pins is greater than the heat dissipation capacity of the plurality of second size fin pins. , the first size is smaller than the second size; and\or The fin pins have different spacings, wherein the heat dissipation capacity of the fin pins at a first spacing is greater than the heat dissipation capacity of the fin pins at a second spacing, and the first spacing is smaller than the second spacing. 8. The heat dissipation element according to claim 5, wherein the plurality of fin pins are arranged in alignment or staggered, wherein the heat dissipation capacity of the plurality of staggered fin pins is greater than that of the plurality of aligned fins. The heat dissipation ability of the needle. 9. The heat dissipation element according to claim 2, wherein the heat dissipation element is configured as a microfluidic structure; or The heat dissipation element is configured as a multi-phase, air bubble convection structure. 10. A cooling system, characterized by comprising: a chip interconnect layer, which includes a plurality of dies; and a heat dissipation layer disposed on the chip interconnect layer, the heat dissipation layer comprising a plurality of heat dissipation elements, at least one of the plurality of heat dissipation elements being disposed on one of the plurality of dies, wherein the heat dissipation element is The heat dissipation element according to one of claims 1-9.