CN116818534A - Wave soldering quality detection method and device - Google Patents
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Abstract
The application discloses a wave-soldering quality detection method and device, comprising the steps of fixedly mounting a PCBA board after wave-soldering on a workpiece fixer; the welding legs of the components on the PCBA board are hooked by the drag hook, and the lifter moves to the pin leg of the component device to be pulled out; the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency to form a curve F (x); calculate X k The tension value of the point and the area S of the closed graph area; judging whether the area S of the closed graph area is larger than the minimum area X k The tension value of the point is larger than the minimum acceptance value, if the tension value is satisfied, the welding quality of the wave-soldering is qualified, and the method can be used as a supplement to the existing wave-soldering welding quality detection method and can be used as a detection method of a PV or pattern test of the wave-soldering welding quality; the method can judge the graph through quantization, and can rapidly and accurately judge whether the quality of the wave-soldering leg is qualified.
Description
Technical Field
The application relates to the technical field of electronic manufacturing detection, in particular to a wave soldering quality detection method and device.
Background
Wave soldering is an important process method in PCBA electronic manufacturing, common wave soldering and selective wave soldering mainly exist in the industry, but all detection needs to be carried out on soldering legs of PCBA, and the detection of the welding quality of the wave soldering legs is an important item in all detection;
in the prior art, methods such as manual direct visual inspection, visual inspection by using se:Sub>A magnifying glass, visual inspection by AOI, welding spot slicing and the like are mainly adopted for detecting the welding quality of the PCBA welding leg, but the methods depend on IPC-A-610 'acceptability of electronic components' and J-STD-001E 'welding materials and process specifications', and can not completely detect common quality failures such as welding spot cavities, false welding, incomplete filling, welding spot pinholes, poor tin penetration, blowholes and the like, and se:Sub>A quantized welding leg quality detection method can not be provided.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a wave soldering quality detection method and device.
According to an embodiment of the first aspect of the application, a wave soldering quality detection method comprises the following steps:
step S1: fixedly mounting the PCBA after wave soldering on a workpiece fixer;
step S2: the controller controls the drag hook on the tension device to hook the welding leg of the component on the PCBA board, and controls the lifter to move along the direction vertical to the PCBA board until the pin leg of the component is pulled out, and then the lifter is stopped;
step S3: the tension sensor and the displacement sensor record a tension value and a displacement value respectively according to a set sampling frequency, and after pin pins of the components are pulled out, the tension sensor and the displacement sensor stop sampling;
step S4: the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency, points are drawn in two-dimensional coordinates of the computer, and finally a tension-displacement relation curve F (x) is formed;
step S5: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k Calculate X k The tension value of the point, calculate the displacement from 0 to X k The tension value between the two and the area S of a closed graph area formed by the X axis;
step S6: judging whether the area S of the closed graph area is larger than the minimum area, and judging that the pull force value with the slope of 0 is larger than the minimum acceptance value, if so, judging that the wave soldering quality is qualified, otherwise, judging that the wave soldering quality is unqualified.
According to the wave-soldering quality detection method, a drag hook on a tension device is controlled by a controller to hook the welding feet of components on a PCBA board, the controller controls a lifter to move along the direction vertical to the PCBA board until pin feet of the components are pulled out, and then the lifter is stopped; the tension sensor and the displacement sensor record a tension value and a displacement value respectively according to a set sampling frequency, and after pin pins of the components are pulled out, the tension sensor and the displacement sensor stop sampling;
the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency, points are drawn in two-dimensional coordinates of the computer, and finally a tension-displacement relation curve F (x) is formed; calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k Calculate X k The tension value of the point, calculate the displacement from 0 to X k The tension value between the two and the area S of a closed graph area formed by the X axis; judging whether the area S of the closed graph area is larger than the minimum area, and if the pull value with the slope of 0 is larger than the minimum acceptance value, the wave-soldering quality is qualified, and if the pull value is satisfied, the pull value is used as a supplement to the existing wave-soldering quality detection method, and can be used as a detection method of the wave-soldering quality PV or type test; the method can judge the graph through quantization, and can rapidly and accurately judge whether the quality of the wave-soldering leg is consistent or notA grid; fills the industry blank; meanwhile, the corresponding device has the advantages of simple structure, accurate and feasible measurement, low manufacturing cost and easy popularization and use.
According to some embodiments of the application, step S3 is specifically:
step S31: the number of samples is calculated according to a preset sampling frequency,
，
wherein, N represents the sampling times, t represents the sampling time, and f represents the sampling frequency;
step S32: the method comprises the steps of obtaining a tension value and a displacement value corresponding to each sampling, wherein the tension value is as follows: l (L) 1 、L 2 、L 3 、...、L i 、L i+1 、...、L N Displacement value: x is X 1 、X 2 、X 3 、...、X i 、X i+1 、...、X N The accuracy of multiple sampling is high.
According to some embodiments of the application, step S4 is embodied as,
step S41: drawing a rectangular coordinate system by taking the displacement value as an x axis and the tension value as a y axis, and drawing the tension value and the displacement value corresponding to each sampling in the rectangular coordinate system;
step S42: successive connection (X) 1 ，L 1 ）、（X 2 ，L 2 ）、（X 3 ，L 3 ）、...、（X i ，L i ）、（X i+1 ，L i+1 ）、...、（X N ，L N ) Points and forms a curve F (x).
According to some embodiments of the application, step S5 is embodied as,
step S51: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k The displacement point X with the slope of the curve being 0 can be obtained according to the following formula k ，
；
Step S52: obtain a point X with a slope of 0 k Tension value of (2)；
Step S53: calculating displacement from 0 to X k The tension value between the two and the area S of the closed graph formed by the X axis,
。
according to some embodiments of the application, step S6 is specifically: judging whether the area S of the closed graph area is larger than the minimum area, and the pull force value with the slope of 0 is larger than the minimum acceptance value,
，
if the areas S and X of the pattern area are closed k Tension value of (2)And if the equation is satisfied, the wave soldering quality is qualified.
According to some embodiments of the application, the sampling frequency is adjusted according to the size of the wave soldering area of the components on the PCBA board, so that the detection progress can be reasonably accelerated under the condition of ensuring the detection precision.
According to a second aspect of the present application, a wave soldering quality detection apparatus includes:
the base workbench is provided with a mounting base, the base workbench is connected with the mounting base through bolts, the mounting base is provided with a workpiece fixer, and the workpiece fixer is connected with the mounting base through bolts; a PCBA board is fixed on the workpiece fixer, and components welded by wave soldering are fixed on the PCBA board;
the machine body is fixedly connected with the base workbench, a lifter capable of moving along the direction perpendicular to the base workbench is arranged in the middle of the machine body, and a displacement sensor is fixedly arranged on the lifter;
one end of the tension device is fixedly connected with the lifter, a tension sensor is fixedly arranged on the tension device, a draw hook is fixedly arranged at one end of the tension device, which is far away from the lifter, and the draw hook is used for hooking components welded on the PCBA board in a wave soldering manner;
the controller is fixedly arranged on one side of the machine body, the controller is electrically connected with the lifter, the controller is electrically connected with the displacement sensor, the controller is electrically connected with the tension sensor, and the controller is externally connected with a power supply.
According to the wave-soldering quality detection device disclosed by the application, the PCBA board is fixed on the workpiece fixer, the drag hook in the tension device hooks the welding legs of the wave-soldering components on the PCBA board, the sampling frequency is set, the sampling times are calculated according to the sampling time and the sampling frequency, the lifting of the lifter is regulated by the controller, the drag hook on the tension device is controlled by the controller, the welding legs of the components on the PCBA board are hooked, the lifter is controlled by the controller to move along the direction vertical to the PCBA board until the pin of the component is pulled out, the lifter is stopped again, the displacement of each lifting of the lifter and the tension value measured by the tension sensor are recorded, the tension value and the displacement value are controlled by the controller to be vertical to the PCBA board at a certain speed and gradually far away from the workbench, the tension value and the displacement value are continuously collected by the sensor and the vertical direction sensor, a group of graphs of the tension value and the displacement are formed in a two-dimensional coordinate system, and whether the graph of the quality of the wave-soldering can be judged by the graph.
According to some embodiments of the application, the controller is provided with a liquid crystal display screen, the liquid crystal display screen is embedded and arranged on the surface of the controller, the liquid crystal display screen is electrically connected with the controller, and the liquid crystal display screen can observe curve patterns more intuitively.
According to some embodiments of the present application, the controller is provided with a tension adjusting button, the tension adjusting button is fixedly disposed on one side of the liquid crystal display, and the tension adjusting button is electrically connected with the controller, so that a tension value can be set more conveniently.
According to some embodiments of the application, the controller is provided with a displacement adjusting button, the displacement adjusting button is fixedly arranged on one side of the liquid crystal display screen, which is close to the tension adjusting button, and the displacement adjusting button is electrically connected with the controller, so that the movement of the lifter can be conveniently adjusted manually through the button.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for detecting the welding quality of wave soldering in an embodiment of the application;
FIG. 2 is a diagram showing a structure of a wave soldering quality detecting device according to an embodiment of the present application;
fig. 3 is a graph of tension versus displacement for an embodiment of the present application.
Detailed Description
The following detailed description of embodiments of the application, with reference to the accompanying drawings, is illustrative of the embodiments described herein, and it is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Example 1
Referring to fig. 1 and 3, a wave soldering quality detection method includes the following steps:
step S1: fixedly mounting the PCBA after wave soldering on a workpiece fixer;
step S2: the controller controls the drag hook on the tension device to hook the welding leg of the component on the PCBA board, and controls the lifter to move along the direction vertical to the PCBA board until the pin leg of the component is pulled out, and then the lifter is stopped;
step S3: the tension sensor and the displacement sensor record a tension value and a displacement value respectively according to a set sampling frequency, and after pin pins of the components are pulled out, the tension sensor and the displacement sensor stop sampling;
step S4: the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency, points are drawn in two-dimensional coordinates of the computer, and finally a tension-displacement relation curve F (x) is formed;
step S5: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k Calculate X k The tension value of the point, calculate the displacement from 0 to X k The tension value between the two and the area S of a closed graph area formed by the X axis;
step S6: judging whether the area S of the closed graph area is larger than the minimum area, and judging that the pull force value with the slope of 0 is larger than the minimum acceptance value, if so, judging that the wave soldering quality is qualified, otherwise, judging that the wave soldering quality is unqualified;
wherein, step S3 specifically comprises:
step S31: the number of samples is calculated according to a preset sampling frequency,
，
wherein N represents the sampling times, t represents the sampling time, and f represents the sampling frequency;
step S32: the method comprises the steps of obtaining a tension value and a displacement value corresponding to each sampling, wherein the tension value is as follows: l (L) 1 、L 2 、L 3 、...、L i 、L i+1 、...、L N Displacement value: x is X 1 、X 2 、X 3 、...、X i 、X i+1 、...、X N The accuracy of multiple sampling is high;
the step S4 is specifically performed by,
step S41: drawing a rectangular coordinate system by taking the displacement value as an x axis and the tension value as a y axis, and drawing the tension value and the displacement value corresponding to each sampling in the rectangular coordinate system;
step S42: successive connection (X) 1 ，L 1 ）、（X 2 ，L 2 ）、（X 3 ，L 3 ）、...、（X i ，L i ）、（X i+1 ，L i+1 ）、...、（X N ，L N ) Points and forms a curve F (x);
the step S5 is specifically performed by,
step S51: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k The displacement point X with the slope of the curve being 0 can be obtained according to the following formula k ，
；
Step S52: obtain a point X with a slope of 0 k Tension value of (2)；
Step S53: calculating displacement from 0 to X k The tension value between the two and the area S of the closed graph formed by the X axis,
step S6 is specifically to determine whether the area S of the closed graph area is larger than the minimum area, and the pull force value with the slope of 0 is larger than the minimum acceptance value,
，
if the areas S and X of the pattern area are closed k Tension value of (2)If the equation is satisfied, the wave soldering quality is qualified;
the controller controls the drag hook on the tension device to hook the welding leg of the component on the PCBA board, and controls the lifter to move along the direction vertical to the PCBA board until the pin leg of the component is pulled out, and then the lifter is stopped; the tension sensor and the displacement sensor record a tension value and a displacement value respectively according to a set sampling frequency, and after pin pins of the components are pulled out, the tension sensor and the displacement sensor stop sampling;
the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency, points are drawn in two-dimensional coordinates of the computer, and finally a tension-displacement relation curve F (x) is formed; calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k Calculate X k The tension value of the point, calculate the displacement from 0 to X k The tension value between the two and the area S of a closed graph area formed by the X axis; judging whether the area S of the closed graph area is larger than the minimum area, and if the pull value with the slope of 0 is larger than the minimum acceptance value, the wave-soldering quality is qualified, and if the pull value is satisfied, the pull value is used as a supplement to the existing wave-soldering quality detection method, and can be used as a detection method of the wave-soldering quality PV or type test; the method can judge the graph through quantization, and can rapidly and accurately judge whether the quality of the wave-soldering leg is qualified. Fills the industry blank; meanwhile, the corresponding device has the advantages of simple structure, accurate and feasible measurement, low manufacturing cost and easy popularization and use.
Example 2
Referring to fig. 2, a wave soldering quality detection device is characterized by comprising:
the base workbench 1 is provided with a mounting base 2, the base workbench 1 is connected with the mounting base 2 through bolts, the mounting base 2 is provided with a workpiece fixer 3, and the workpiece fixer 3 is connected with the mounting base 2 through bolts; a PCBA board is fixed on the workpiece fixer 3, and components for wave soldering are fixed on the PCBA board;
the machine body 4 is fixedly connected with the base workbench 1, a lifter 5 capable of moving along the direction vertical to the base workbench is arranged in the middle of the machine body 4, and a displacement sensor 6 is fixedly arranged on the lifter 5;
the device comprises a pulling device 7, wherein one end of the pulling device 7 is fixedly connected with a lifter 5, a pulling force sensor 8 is fixedly arranged on the pulling device 7, a draw hook 9 is fixedly arranged at one end of the pulling device 7 away from the lifter, and the draw hook 9 is used for hooking components welded by wave soldering on a PCBA board;
the controller 10 is fixedly arranged on one side of the machine body 4, the controller 10 is electrically connected with the lifter 5, the controller 10 is electrically connected with the displacement sensor 6, the controller 10 is electrically connected with the tension sensor 8, and the controller 10 is externally connected with a power supply;
the controller 10 is provided with a liquid crystal display screen, the liquid crystal display screen is embedded and arranged on the surface of the controller 10, the liquid crystal display screen is electrically connected with the controller 10, and the liquid crystal display screen can observe curve figures more intuitively;
the controller 10 is provided with a tension adjusting button which is fixedly arranged on one side of the liquid crystal display screen, and the tension adjusting button is electrically connected with the controller 10, so that the tension value can be more conveniently and automatically set;
the controller 10 is provided with a displacement adjusting button, the displacement adjusting button is fixedly arranged on one side of the liquid crystal display screen, which is close to the tension adjusting button, and the displacement adjusting button is electrically connected with the controller 10, so that the movement of the lifter can be conveniently adjusted manually through the button.
The device comprises a work piece fixer 3, a drawing hook 9 in a tension device 7 is fixed on the work piece fixer 3 to hook the welding leg of a component welded on the PCBA, sampling frequency is set, sampling times are calculated according to sampling time and sampling frequency, the lifting of a lifter 5 is regulated through a controller 10, the drawing hook 9 on the tension device 7 is controlled through the controller 10 to hook the welding leg of the component on the PCBA, the controller 10 controls the lifter 5 to move along the direction perpendicular to the PCBA until the pin of the component is pulled out, the lifter 5 is stopped again, the displacement of each lifting of the lifter 5 and the tension value measured by a tension sensor 8 are recorded, the controller 10 is used for controlling the PCBA to be perpendicular to the work table at a certain speed and gradually away from the work table, the tension value and the displacement value are recorded by a certain sampling frequency, the device continuously collects the tension value and the displacement value of the welding leg pulled out, a set of graphs of tension and displacement are formed in a two-dimensional coordinate system, whether the graph can be rapidly judged through the method, the quality of the graph can be rapidly judged, the quality of the automobile can be influenced by the vibration of the vibration during the assembly, and the assembly of the automobile can be verified, and whether the assembly of the automobile is influenced by the vibration or not is qualified, and the assembly of the vibration is influenced by the vibration. Giving quantitatively reliable data.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the application.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
It will be apparent that the described embodiments are only some, but not all, embodiments of the application. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application for the embodiment. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The wave soldering quality detection method is characterized by comprising the following steps of:
step S1: fixedly mounting the PCBA after wave soldering on a workpiece fixer;
step S2: the controller controls the drag hook on the tension device to hook the welding leg of the component on the PCBA board, and controls the lifter to move along the direction vertical to the PCBA board until the pin leg of the component is pulled out, and then the lifter is stopped;
step S3: the tension sensor and the displacement sensor record a tension value and a displacement value respectively according to a set sampling frequency, and after pin pins of the components are pulled out, the tension sensor and the displacement sensor stop sampling;
step S4: the controller outputs a group of tension values and displacement values according to the preset sampling frequency according to the sampling frequency, points are drawn in two-dimensional coordinates of the computer, and finally a tension-displacement relation curve F (x) is formed;
step S5: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k Calculate X k The tension value of the point, calculate the displacement from 0 to X k The tension value between the two and the area S of a closed graph area formed by the X axis;
step S6: judging whether the area S of the closed graph area is larger than the minimum area, and judging that the pull force value with the slope of 0 is larger than the minimum acceptance value, if so, judging that the wave soldering quality is qualified.
2. The method for detecting the welding quality of wave soldering according to claim 1, wherein the step S3 is specifically:
step S31: the number of samples is calculated according to a preset sampling frequency,
，
wherein, N represents the sampling times, t represents the sampling time, and f represents the sampling frequency;
step S32: the method comprises the steps of obtaining a tension value and a displacement value corresponding to each sampling, wherein the tension value is as follows: l (L) 1 、L 2 、L 3 、...、L i 、L i+1 、...、L N Displacement value: x is X 1 、X 2 、X 3 、...、X i 、X i+1 、...、X N 。
3. The method for detecting the quality of wave soldering according to claim 1, wherein the step S4 is specifically,
step S41: drawing a rectangular coordinate system by taking the displacement value as an x axis and the tension value as a y axis, and drawing the tension value and the displacement value corresponding to each sampling in the rectangular coordinate system;
step S42: successive connection (X) 1 ，L 1 ）、（X 2 ，L 2 ）、（X 3 ，L 3 ）、...、（X i ，L i ）、（X i+1 ，L i+1 ）、...、（X N ，L N ) Points and forms a curve F (x).
4. The method for detecting the quality of wave soldering according to claim 1, wherein step S5 is specifically,
step S51: calculating derivative F' (X) of curve F (X), and obtaining displacement point X with slope of 0 k The displacement point X with the slope of the curve being 0 can be obtained according to the following formula k ，
；
Step S52: obtain a point X with a slope of 0 k Tension value of (2)；
Step S53: calculating displacement from 0 to X k The tension value between the two and the area S of the closed graph formed by the X axis,
，
，
。
5. the method for detecting the quality of wave soldering according to claim 1, wherein step S6 specifically comprises: judging whether the area S of the closed graph area is larger than the minimum area, and the pull force value with the slope of 0 is larger than the minimum acceptance value,
，
if the areas S and X of the pattern area are closed k Is of (2)
Force valueAnd if the equation is satisfied, the wave soldering quality is qualified.
6. The method for detecting the quality of wave soldering according to claim 2, wherein the sampling frequency is adjusted according to the size of the wave soldering area of the components on the PCBA board.
7. A wave soldering quality inspection device employing the method of any one of claims 1-6, comprising:
the base workbench (1) is provided with a mounting base (2), the base workbench (1) is connected with the mounting base (2) through bolts, the mounting base (2) is provided with a workpiece fixer (3), and the workpiece fixer (3) is connected with the mounting base (2) through bolts; a PCBA board is fixed on the workpiece fixer (3), and components for wave soldering and welding are fixed on the PCBA board;
the machine body (4) is fixedly connected with the base workbench (1), a lifter (5) capable of moving along the direction perpendicular to the base workbench is arranged in the middle of the machine body (4), and a displacement sensor (6) is fixedly arranged on the lifter;
the device comprises a pull device (7), wherein one end of the pull device (7) is fixedly connected with a lifter (5), a pull sensor (8) is fixedly arranged on the pull device, a draw hook (9) is fixedly arranged at one end, far away from the lifter (5), of the pull device (7), and the draw hook (9) is used for hooking components welded by wave soldering on the PCBA board;
the controller (10), controller (10) set up in fuselage (4) one side, controller (10) with riser (5) electricity is connected, controller (10) with displacement sensor (6) electricity is connected, controller (10) with tension sensor (8) electricity is connected, controller (10) external power supply.
8. The device for detecting the quality of wave soldering according to claim 7, wherein the controller (10) is provided with a liquid crystal display, the liquid crystal display is embedded and arranged on the surface of the controller (10), and the liquid crystal display is electrically connected with the controller (10).
9. The device for detecting the quality of wave soldering according to claim 8, wherein a tension adjusting button is arranged on the controller (10), the tension adjusting button is fixedly arranged on one side of the liquid crystal display screen, and the tension adjusting button is electrically connected with the controller (10).
10. The device for detecting the quality of wave soldering according to claim 9, wherein a displacement adjusting button is arranged on the controller (10), the displacement adjusting button is fixedly arranged on one side of the liquid crystal display screen, which is close to the tension adjusting button, and the displacement adjusting button is electrically connected with the controller (10).
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| CN202311104053.3A CN116818534A (en) | 2023-08-30 | 2023-08-30 | Wave soldering quality detection method and device |
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| CN202311104053.3A CN116818534A (en) | 2023-08-30 | 2023-08-30 | Wave soldering quality detection method and device |
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| CN202311104053.3A Pending CN116818534A (en) | 2023-08-30 | 2023-08-30 | Wave soldering quality detection method and device |
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Application publication date: 20230929 |