CN116709642B - Circuit board assembly, electronic equipment, frame plate and component integration method - Google Patents

Abstract

The application relates to the technical field of terminals, and discloses a circuit board assembly, electronic equipment, a frame plate and an integration method of components. The circuit board assembly comprises a circuit board, a frame plate and components. The circuit board and the frame plate are arranged in a stacked mode, components are integrated on the frame plate, and at least one connecting end of each component extends to the plate surface, facing the circuit board, of the frame plate. The components are electrically connected with the circuit board through the connecting end facing the board surface of the circuit board. In the circuit board assembly, the components are integrated on the frame plate, and the connection ends of the components extend to the plate surface of the frame plate facing the circuit board, so that the connection ends of the components can be electrically and mechanically connected with the circuit board at positions opposite to the solid parts of the frame plate. The connection area of frame board and circuit board also can realize the components and parts overall arrangement, increases the face area of overall arrangement components and parts on the circuit board, can optimize the connection scheme between circuit board, frame board and the components and parts, improves space effective utilization.

Description

Circuit board assembly, electronic device, frame board and component integration method

Technical Field

The present application relates to the field of terminal technology, and in particular to a circuit board assembly, an electronic device, a frame board, and an integration method of components.

Background Art

With the development of the economy, the role of electronic devices in application scenarios such as modern life and work communication is becoming more and more important. Smart watches, mobile phones, laptops and other mobile terminals are becoming necessities of modern people's lives. The following will take a mobile phone as an example to describe the basic components of electronic devices: the mobile phone includes a middle frame and a circuit board assembly, a battery and a screen assembly arranged on the middle frame, and the circuit board assembly includes a circuit board and components arranged on the circuit board. Functionally, components include but are not limited to processors, antenna modules, Bluetooth modules, Wi-Fi (Wireless Fidelity) modules, GPS (Global Positioning System) modules, power supplies and charging modules or screen display and operation modules. The basic components in electronic devices are electrically connected to each other to realize corresponding functions. For example, the screen assembly is electrically connected to the circuit board and the operation module respectively to realize the display and operation functions of the screen assembly.

However, as the functions of electronic devices increase, the number of components gradually increases, the size of circuit boards also gradually increases, and the difficulty of designing electronic devices to be thin and light increases. Based on this, it is necessary to optimize the structure of the circuit board assembly in the electronic device to reduce the space occupied by the circuit board assembly. At present, the components can be centrally arranged by stacking multiple circuit boards to reduce the space occupied by the circuit board assembly, thereby making full use of the internal space of the electronic device.

Summary of the invention

In view of this, the present application provides a circuit board assembly, an electronic device, and a method for integrating a frame board and components. Among them, the circuit board assembly includes a circuit board, a frame board and components. The circuit board and the frame board are stacked, the components are integrated on the frame board, and at least one connection end of the component extends to the board surface of the frame board facing the circuit board and is electrically connected to the circuit board. In the above-mentioned circuit board assembly, the components are integrated on the frame board, and the connection end of the component extends to the board surface of the frame board facing the circuit board, so that the connection end of the component can be electrically and mechanically connected to the circuit board at a position relative to the physical part of the frame board. The above-mentioned circuit board assembly can reduce the number of solder joints on the circuit board and save 7% to 16% of the layout area of the circuit board. In summary, the connection area between the frame board and the circuit board can also realize the layout of components, which can actually increase the effective board area on the circuit board where components can be laid out. Therefore, the above-mentioned circuit board assembly can reduce the difficulty of layout of components on the circuit board, facilitate the improvement of the layout density of components on the circuit board, and facilitate the realization of lightweight design.

The first aspect of the present application provides a circuit board assembly. The circuit board assembly includes a first circuit board, a first frame board and a first component. The first circuit board and the first frame board are stacked, and the first component is integrated on the first frame board. At least one connection end of the first component extends to the board surface of the first frame board facing the first circuit board, and is electrically connected to the first circuit board. That is, in the circuit board assembly, the first component is integrated on the frame board, and the connection end of the component extends to the board surface of the frame board facing the circuit board, so that the connection end of the component can be electrically and mechanically connected to the circuit board at a position opposite to the physical part of the frame board. Therefore, the electrical connection and mechanical connection schemes between the circuit board, the frame board and the components can be optimized, and the effective utilization rate of space can be improved.

It can be understood that the present application does not make any specific limitations on the connection method of components on the circuit board, nor on the extension method of the connection ends of the components to the frame board surface. Any technical solution that can achieve the first two functions is within the scope of protection of the present application, and the present application does not make any specific limitations on this.

In some of the implementations, the first circuit board may be a printed circuit board. In some of the implementations, the first frame board may be a printed circuit board. In some of the implementations, the first component may be a surface mount component.

Based on this, in the above-mentioned circuit board assembly, the connection end of the components can realize the electrical connection between the components and the circuit board on the one hand, and can also realize the mechanical connection between the frame plate and the circuit board on the other hand, which can increase the density of components on the first circuit board, reduce the number of solder joints on the first circuit board, and save 7% to 16% of the layout area of the first circuit board. In summary, the connection area between the frame plate and the circuit board can also realize the layout of components, which can actually increase the effective board area on the circuit board where components can be laid out. Therefore, the above-mentioned circuit board assembly can reduce the difficulty of layout of components on the circuit board, facilitate the improvement of the layout density of components on the circuit board, and facilitate the realization of lightweight design.

In some possible implementations of the first aspect of the present application, the circuit board assembly further includes a second circuit board. The second circuit board is located on a side of the first frame board facing away from the first circuit board. At least one connection end of the first component extends to a surface of the first frame board facing the second circuit board and is electrically connected to the second circuit board.

That is, in the present application, the first circuit board, the first frame board and the second circuit board are stacked in sequence to form a sandwich structure. Part of the connecting ends of the first component extend to the board surface of the first frame board facing the first circuit board and are electrically connected to the first circuit board. The remaining connecting ends of the first component extend to the board surface of the first frame board facing the second circuit board and are electrically connected to the second circuit board. The final implementation is: the first component is arranged on the first frame board, and the connecting end of the first component is electrically connected to the first circuit board through the board surface of the first frame board, and the connecting end of the first component is electrically connected to the second circuit board through the board surface of the first frame board.

The above circuit board assembly presents a sandwich structure as a whole. Based on this, the above circuit board assembly can realize a multi-layer circuit board stacking layout, can increase the circuit board surface area, facilitate the high-density arrangement of components in the circuit board assembly, and can optimize the layout plan of the circuit board assembly.

In some possible implementations of the first aspect of the present application, all connection ends of the first component extend to the board surface of the first frame board facing the first circuit board, and are all electrically connected to the first circuit board.

In some possible implementations of the first aspect of the present application, the relative position relationship between the first component and the first frame plate can be that the first component is integrated inside the first frame plate.

In the above circuit board assembly, since the first component is integrated inside the first frame plate, that is, the first component does not need to occupy other space except the first frame plate, the layout scheme of the circuit board assembly is further optimized, and the space occupied by the circuit board assembly is further reduced. The above circuit board assembly can improve reliability and reduce stress damage caused by external force.

In some possible implementations of the first aspect of the present application, the relative position relationship between the first component and the first frame plate may also be that the first component is integrated into the side of the first frame plate, wherein the side refers to the side of the frame plate where the surface perpendicular to the frame plate surface is located.

In the above circuit board assembly, since the first component is integrated on the side of the first frame board, the first component does not need to occupy additional area on the surface of the first circuit board, which optimizes the layout of the circuit board assembly and reduces the space occupied by the circuit board assembly. In addition, since the first component is integrated on the side of the first frame board, the integration method of the first component on the frame board is relatively simple, which reduces the difficulty of installing the circuit board assembly.

In some possible implementations of the first aspect of the present application, the relative position relationship between the first component and the first frame plate can also be that a part of the first component is integrated inside the first frame plate, and another part of the first component is integrated on the side of the first frame plate.

In the above circuit board assembly, since the first component is partially integrated on the side of the first frame board, the first component does not need to occupy additional area on the surface of the first circuit board, which optimizes the layout of the circuit board assembly and reduces the space occupied by the circuit board assembly. In addition, the first component is partially integrated on the side of the first frame board and partially integrated inside the first frame board, which reduces the additional space occupied by the first component on the one hand, and reduces the difficulty of integrating the first component on the first frame board to a certain extent on the other hand.

In some possible implementations of the first aspect of the present application, at least one connection end of the first component passes through the first frame plate and extends to the board surface of the first frame plate facing the first circuit board. In the above-mentioned circuit board assembly, at least one connection end of the first component is arranged inside the first frame plate to prevent at least one connection end of the first component from being hit by the outside, thereby improving the strength of the circuit board assembly.

In some possible implementations of the first aspect of the present application, at least one connection end of the first component extends along the surface of the first frame plate to the board surface of the first frame plate facing the first circuit board. In the above-mentioned circuit board assembly, at least one connection end of the first component extends along the surface of the first frame plate, which reduces the difficulty of molding at least one connection end of the first component.

In some possible implementations of the first aspect of the present application, the circuit board assembly further includes a second frame board and a second component. The second frame board is located on a side of the first circuit board facing away from the first frame board, and the second component is integrated on the second frame board. At least one connection end of the second component extends to a board surface of the first frame board facing the first circuit board, and is electrically connected to the first circuit board.

The above-mentioned circuit board assembly includes multiple circuit boards and multiple frame boards, so it is possible to achieve layered composite of multiple frame boards and multiple circuit boards, further improve the layout scheme of the circuit board assembly and improve the high density of the circuit board assembly, thereby further realizing the lightweight design of the electronic device using the circuit board assembly in this application.

In some possible implementations of the first aspect of the present application, the circuit board assembly further includes a third circuit board. The third circuit board is located on a side of the second frame board facing away from the first circuit board. At least one connection end of the second component extends to a board surface of the second frame board facing the third circuit board and is electrically connected to the third circuit board.

The above-mentioned circuit board assembly includes multiple circuit boards and multiple frame boards, so it is possible to achieve layered composite of multiple frame boards and multiple circuit boards, further optimize the layout scheme of the circuit board assembly and improve the high density of the circuit board assembly, thereby further realizing the lightweight design of the electronic device using the circuit board assembly in this application.

In some possible implementations of the first aspect of the present application, the orthographic projection of the first frame plate in the first projection plane and the orthographic projection of the second frame plate in the first projection plane at least partially do not overlap, wherein the first projection plane is perpendicular to the stacking direction of the first frame plate and the first component. In the above-mentioned circuit board assembly, the orthographic projection of the first frame plate in the first projection plane and the orthographic projection of the second frame plate in the first projection plane at least partially do not overlap, which increases the structural mode and layout mode of the circuit board assembly and expands the application range of the circuit board assembly.

In some possible implementations of the first aspect of the present application, a third component is further included, and the third component is disposed on the surface of the first circuit board and is electrically connected to the first circuit board. That is, the third component is integrated on the circuit board, which expands the application range of the circuit board assembly.

In some possible implementations of the first aspect of the present application, the orthographic projection of the third component in the second projection plane does not overlap with the orthographic projection of the first frame plate in the second projection plane. The second projection plane is perpendicular to the stacking direction of the first frame plate and the first component. In the above-mentioned circuit board assembly, the orthographic projection of the third component in the second projection plane does not overlap with the orthographic projection of the first frame plate in the second projection plane, that is, the layout position of the third component on the first circuit board is staggered with the layout position of the first frame plate on the first circuit board, which increases the structural mode and layout mode of the circuit board assembly.

In some possible implementations of the first aspect of the present application, a receiving space is provided on the first frame plate, and the third component is provided on the surface of the first circuit board facing the first frame plate and is located in the receiving space. The above circuit board assembly further optimizes the layout of each component in the circuit board assembly.

In some possible implementations of the first aspect of the present application, the number of first components is two, the two first components are stacked along the stacking direction of the first circuit board and the first frame board, and the connection ends of the two first components that are arranged opposite to each other are electrically connected. The two first components may be the same or different, and the present application does not specifically limit this.

In some possible implementations of the first aspect of the present application, the number of first components is two, and the two first components are arranged side by side along a vertical direction perpendicular to the stacking direction of the first circuit board and the first frame board. The two first components may be the same or different, and the present application does not make any specific limitation on this.

In some possible implementations of the first aspect of the present application, the first component includes at least one of a resistor, a capacitor, an inductor, a converter, a gradienter, a matching network, a resonator, a filter, a mixer, a switch, an amplifier, an overcurrent branch distributor, a feed amplifier, an optical transmitter and a receiver.

A second aspect of the present application provides an electronic device, wherein the electronic device includes a circuit board assembly in the aforementioned first aspect and any possible implementation manner of the first aspect.

The third aspect of the present application provides a method for integrating a frame plate and components, wherein the integration method includes forming a mounting hole on the board surface of the frame plate. Arrange the components in the mounting hole. Fill the surrounding area of the components in the mounting hole with filler and solidify it into a filling portion. Form a connecting hole in the filling portion and/or the frame plate, and the connecting hole extends from the electrical connection area of the component to the board surface of the frame plate. Form an electrical connection portion in the connecting hole, one end of the electrical connection portion is electrically connected to the electrical connection area of the component, and the other end extends to the board surface of the frame plate. The above-mentioned method for integrating the frame plate and components has a simple integration method and relatively low operating difficulty.

In some possible implementations of the third aspect of the present application, the electrical connection portion is formed by metallizing a connection hole, and the metallization structure in the connection hole is used as the electrical connection portion.

In some possible implementations of the third aspect of the present application, the frame plate includes a first frame plate surface and a second frame plate surface arranged opposite to each other along a first direction, a first mounting hole is formed on the first frame plate surface of the frame plate, and some components are arranged in the first mounting hole, and a second mounting hole is formed on the second frame plate surface of the frame plate, and some components are arranged in the second mounting hole.

That is, in this application, the mounting holes on the frame board can be distributed on the board surfaces on both sides of the frame board. On the one hand, the integration density of components in the frame board is improved, and on the other hand, different components can be integrated on the two sides of the frame board respectively, which is not easy to be confused, and reduces the difficulty of integrating components in the frame board.

In some possible implementations of the third aspect of the present application, the frame plate includes a first frame plate surface and a second frame plate surface disposed opposite to each other along a first direction, and the first mounting hole includes a first stepped hole and a second stepped hole that are interconnected. The first stepped hole extends to the first frame plate surface, and the second stepped hole extends to the second frame plate surface. In the second direction, the aperture of the first stepped hole is larger than the size of the component, and the aperture of the second stepped hole is smaller than the size of the component, and the second direction intersects with the first direction.

In some possible implementations of the third aspect of the present application, the second direction is perpendicular to the first direction.

In some possible implementations of the third aspect of the present application, the first stepped hole includes a first sub-stepped hole and a second sub-stepped hole that are interconnected. The first sub-stepped hole is a tapered hole, and the large end aperture of the tapered hole extends to the first frame plate surface, and the second sub-stepped hole is interconnected with the second stepped hole.

In some possible implementations of the third aspect of the present application, the taper range of the tapered hole is 30º~60º.

In some possible implementations of the third aspect of the present application, arranging the components in the mounting hole includes: placing the components flat on the first frame plate surface of the frame plate. The components are translated along the first frame plate surface so that the first end of the component is suspended above the first mounting hole. The component has a second end extending in the opposite direction from the first end, and the distance between the center point of the component and the edge of the first mounting hole close to the second end is greater than 0.3 times the end dimension of the component. The end dimension is the dimension of the component extending from the first end to the second end.

In some possible implementations of the third aspect of the present application, the distance between the first end of the component and the edge of the first mounting hole close to the second end is greater than 0.6 times the end dimension of the component.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solution of the present application, the drawings used in the description of the implementation methods are briefly introduced below.

FIG. 1 ( a ) shows a schematic diagram of the structure of a mobile phone M;

FIG. 1( b ) shows a schematic structural diagram of a circuit board assembly 1 in a mobile phone M;

FIG. 2 ( a ) shows a perspective view of a circuit board assembly 1 ;

FIG. 2( b ) shows a perspective view of the circuit board assembly 1 in the A area in FIG. 2( a );

FIG. 2( c ) shows a three-dimensional view of the circuit board assembly 1 in the B area in FIG. 2( b );

FIG. 2( d ) shows a three-dimensional view of the circuit board assembly 1 in the C area in FIG. 2( c );

FIG3 shows a schematic structural diagram of a circuit board assembly 1' in some technical solutions of the present application;

FIG. 4 ( a ) shows a schematic structural diagram of a circuit board assembly 1 ′ in some implementations of the present application;

FIG. 4 ( b ) shows a schematic structural diagram of a circuit board assembly 1 ′ in some other implementations of the present application;

FIG. 5( a ) shows a schematic diagram of the distribution of solder balls on a circuit board 100 in some embodiments of the present application;

FIG. 5( b ) shows a schematic diagram of the distribution of solder balls on a circuit board 100 in some embodiments of the present application;

FIG. 5( c ) shows a schematic diagram of the distribution of solder balls on the frame plate 200 in some embodiments of the present application;

FIG6 shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 7 ( a ) shows one implementation of the component 300 in the present application;

FIG. 7 ( b ) shows another implementation method in which the component 300 in the present application is replaceable;

FIG. 7 ( c ) shows another implementation method in which the component 300 in the present application is replaceable;

FIG8 is a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG9 shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG10 is a schematic diagram showing the structure of a circuit board assembly 1 in some embodiments of the present application;

FIG11 is a schematic diagram showing the structure of a circuit board assembly 1 in some embodiments of the present application;

FIG. 12 ( a ) shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 12 ( b ) shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 13 ( a ) shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 13 ( b ) shows the relative positional relationship between the first frame board 200 a and the first component 300 a in the circuit board assembly 1 in some embodiments of the present application;

FIG. 14 ( a ) shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 14 ( b ) shows a schematic structural diagram of a circuit board assembly 1 in some embodiments of the present application;

FIG. 15 is a schematic diagram showing the structure of a circuit board assembly 1 in some embodiments of the present application;

FIG16 is a schematic diagram showing the structure of a circuit board assembly 1 in some embodiments of the present application;

FIG. 17 is a schematic diagram showing the structure of a circuit board assembly 1 in some embodiments of the present application;

FIG. 18 is a flow chart showing a molding solution for a circuit board assembly in some embodiments of the present application;

FIG19 is a flow chart showing a solution for integrating components in a frame board in some embodiments of the present application;

FIG. 20 ( a ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( b ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( c ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( d ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( e ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( f ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( g ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( h ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 (i) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( j ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 20 ( k ) is a schematic diagram showing an integration scheme of components in a frame board in some embodiments of the present application;

FIG. 21 ( a ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 21 ( b ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 21 ( c ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 21 ( d ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG22 shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 23 ( a ) shows a schematic diagram of an integration scheme of components and a frame plate when two components are arranged side by side in the same mounting hole on the same side of the frame plate in some embodiments of the present application;

FIG. 23 ( b ) shows a schematic diagram of an integration scheme of components and a frame plate when two components are arranged side by side in the same mounting hole on the same side of the frame plate in some embodiments of the present application;

FIG. 23 ( c ) shows a schematic diagram of an integration scheme of components and a frame plate when two components are arranged side by side in the same mounting hole on the same side of the frame plate in some embodiments of the present application;

FIG. 24 ( a ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board in some embodiments of the present application;

FIG. 24 ( b ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board in some embodiments of the present application;

FIG. 24 ( c ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board in some embodiments of the present application;

FIG. 24 ( d ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board in some embodiments of the present application;

FIG. 24 ( e ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board in some embodiments of the present application;

FIG. 25 ( a ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in parallel and two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 25 ( b ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in parallel or in series on the same side of the frame board in some embodiments of the present application;

FIG. 25 ( c ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in parallel and two components are arranged in series on the same side of the frame board in some embodiments of the present application;

FIG. 26 ( a ) shows a schematic diagram of an integration scheme of components and a frame board in some embodiments of the present application, when two components are arranged in parallel on the same side of the frame board, two components are arranged in parallel in the same mounting hole, and two components are arranged in series;

FIG. 26 ( b ) shows a schematic diagram of an integration scheme of components and a frame board when two components are arranged in parallel on the same side of the frame board, two components are arranged in parallel in the same mounting hole, and two components are arranged in series in some embodiments of the present application;

26 ( c ) shows a schematic diagram of the integration scheme of components and a frame board when two components are arranged side by side on the same side of the frame board, two components are arranged side by side in the same mounting hole, and two components are arranged in series in some embodiments of the present application.

DETAILED DESCRIPTION

The technical solution of the present application will be further described in detail below in conjunction with the accompanying drawings.

The present application provides a circuit board assembly and an electronic device integrated with the circuit board assembly. The circuit board assembly includes but is not limited to a chip package, an electronic module or a single board, and the present application does not make specific restrictions on this. The aforementioned chip package refers to a circuit board assembly provided with a chip, and the circuit board assembly is packaged as a whole into an integral structure to form a chip package. The aforementioned electronic module refers to the use of a multi-layer circuit board to connect electronic devices to form an electronic module. The aforementioned single board refers to a printed circuit board (PCB) and a frame plate (FB). In addition, the present application also provides an electronic device, which is integrated with a circuit board assembly. The electronic device includes but is not limited to at least one of electronic devices having a circuit board assembly such as a mobile terminal, a server, an optical module and a switch, and the present application does not make specific restrictions on this. The mobile terminal includes but is not limited to at least one of mobile electronic devices such as a mobile phone, a tablet, an electronic watch, and the present application does not make specific restrictions on this. For the convenience of understanding and description below, the following description will be taken as an example of a mobile phone and a circuit board assembly in a mobile phone.

The mobile phone and the circuit board assembly in the mobile phone in the present application will be described in detail below with reference to the accompanying drawings.

FIG1 (a) shows a schematic diagram of the structure of a mobile phone M. FIG1 (b) shows a schematic diagram of the structure of a circuit board assembly 1 in a mobile phone M. Combining FIG1 (a) and FIG1 (b), it can be seen that in some technical solutions of the present application, the mobile phone M includes a circuit board assembly 1, a middle frame 2 and a functional module 3. Among them, the circuit board assembly 1 is installed on the middle frame 2, and the circuit board assembly 1 surrounds a plurality of notches, and the functional module 3 is arranged at the notches and installed on the circuit board assembly 1 or the middle frame 2.

In some implementations, the functional module 3 includes but is not limited to a processor, an antenna module, a Bluetooth module, a Wi-Fi module, a GPS module, a power supply and a charging module, or a screen display and operation module, etc. This application does not make specific limitations on this.

In some technical solutions of the present application, the circuit board assembly 1 includes at least two layers of circuit boards, and a frame plate is arranged between the two circuit boards, and the frame plate and the adjacent circuit boards are soldered together by solder. The following is a detailed description in conjunction with the specific structure in the circuit board assembly. FIG. 2 (a) shows a stereoscopic view of a circuit board assembly 1. FIG. 2 (b) shows a stereoscopic view of the circuit board assembly 1 in the A area of FIG. 2 (a). FIG. 2 (c) shows a stereoscopic view of the circuit board assembly 1 in the B area of FIG. 2 (b). FIG. 2 (d) shows a stereoscopic view of the circuit board assembly 1 in the C area of FIG. 2 (c).

In conjunction with Figures 2 (a) to 2 (d), it can be seen that in some technical solutions of the present application, the circuit board assembly 1 includes a circuit board 100 and a frame board 200 that are stacked. The circuit board 100 and the frame board 200 are soldered together by solder (such as solder balls), and the thickness of the frame board 200 is about 2 to 3 times the thickness of the circuit board 100. It can be understood that in the present application, the board thickness refers to the size of the circuit board in the direction perpendicular to the board surface. In addition, the circuit board assembly 1 includes not only the circuit board 100 and the frame board 200, but also components integrated on the circuit board 100. The components can be ordinary electronic components or modules integrated with electronic components, and the present application does not make specific restrictions on this.

The layout scheme of components on the circuit board and the frame board in the present application will be described in detail below with reference to the accompanying drawings.

FIG3 shows a schematic diagram of the structure of a circuit board assembly 1' in some technical solutions of the present application. As shown in FIG3, in some embodiments of the present application, the circuit board assembly 1' includes a circuit board 100, a frame plate 200 and a component 300'. The circuit board 100 and the frame plate 200 are stacked, and the circuit board 100 and the frame plate 200 are soldered together by solder. The frame plate 200 is connected to a first area on the surface of the circuit board 100 by solder. The connecting end of the component 300' is connected to a second area on the surface of the circuit board 100. The first area does not overlap with the second area.

In some embodiments of the present application, the circuit board 100 and the frame board 200 are connected via a connecting portion 400. The connecting portion 400 may be a solder pad, a solder ball or solder paste, which is not specifically limited in the present application.

In some embodiments of the present application, some connection ends of the component 300' are connected to the connection wire 500 in the circuit board 100. The other connection ends of the component 300' are electrically connected to the connection part 400 between the frame board 200 and the circuit board 100 through the connection wire 500 in the circuit board 100, and then the component 300' is electrically connected to other components through the frame board 200.

For example, another component 300 ′ is integrated on the circuit board 100 , and part of the connecting ends of the component 300 ′ are electrically connected to the other component 300 ′ through the connecting wires 500 in the circuit board 100 .

FIG4 (a) shows a schematic diagram of the structure of a circuit board assembly 1' in some implementations of the present application. As shown in FIG4 (a), in some embodiments of the present application, the circuit board assembly 1' includes two stacked circuit boards 100, a frame board 200 is arranged between the two circuit boards 100, and the frame board 200 is soldered to the circuit board 100 by solder. The circuit board assembly 1' also includes components 300', wherein the number of components 300' can be multiple, and can be distributed on any one of the two circuit boards 100, and the present application does not make specific restrictions on this.

FIG4 (b) shows a schematic diagram of the structure of a circuit board assembly 1' in some other implementations of the present application. As shown in FIG4 (b), in some embodiments of the present application, in the circuit board assembly 1', the component 300' can be any one of a radio frequency integrated circuit (RFIC) 301', a radio frequency power amplifier (RFPA) 302', a phasor measurement unit (PMU) 303', a universal flash storage (UFS) 304' and a system in package (SiP) 305'.

Although the above-mentioned circuit board assembly 1' realizes the layout of the components 300', the frame board 200 and the components 300' are misplaced on the circuit board 100, resulting in a small effective area on the board surface of the circuit board 100 that can be used to layout the components 300'. In addition, the connection strength between the frame board 200 and the circuit board is relatively low.

In some embodiments of the present application, a first outer pad is provided on the surface of the frame plate 200. The first outer pad can be used to fix the first circuit board on the surface of the frame plate 200, and realize the electrical connection between the circuit board 100 and the frame plate 200. A first inner pad is provided on the first step surface of the frame plate 200. Therefore, the circuit board 100 can be fixed on the first step surface through the first inner pad, and realize the electrical connection between the circuit board 100 and the frame plate 200.

The above-mentioned circuit board assembly 1' cannot achieve effective connection in the case of narrow width, and the pads require minimum size due to shielding and welding process. In addition, the multiple welding processes in the multi-layer sandwich scenario are complicated, and the device needs to withstand multiple high-temperature reflows. In addition, the risk of cracking in the lower layer is high in the drop test, and it is necessary to increase the bottom filler (underfill) for reinforcement.

Figure 5 (a) shows a schematic diagram of the distribution of solder balls on the circuit board 100 in some embodiments of the present application. Figure 5 (b) shows a schematic diagram of the distribution of solder balls on the circuit board 100 in some embodiments of the present application. Figure 5 (c) shows a schematic diagram of the distribution of solder balls on the frame board 200 in some embodiments of the present application.

As shown in FIG. 5 (a) to FIG. 5 (c), the above-mentioned circuit board assembly 1', on the one hand, among the solder balls between the circuit board 100 and the frame board 200, the first solder ball _B1 is used to realize the welding between the circuit board 100 and the frame board 200, and the second solder ball _B2 can be used to electrically connect the components 300. Based on this, the number of solder balls used to electrically connect the components 300 is relatively small, which increases the difficulty of layout of the components 300 on the circuit board. On the other hand, among the solder balls between the circuit board 100 and the frame board 200, the external solder ball B _out is used to realize the mechanical connection between the circuit board 100 and the frame board 200, and the internal solder ball B _in is used to realize the electrical connection between the circuit board 100 and the frame board 200. Therefore, it is not easy to meet the mechanical connection strength and electrical connection strength between the circuit board 100 and the frame board 200.

In order to solve the above problems, the present application provides a circuit board assembly. The circuit board assembly includes a circuit board, a frame board and components. The circuit board and the frame board are stacked, and the components are integrated on the frame board. In addition, at least one connection end on the component extends to the board surface of the frame board facing the circuit board and is electrically connected to the circuit board.

FIG6 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG6, in some embodiments of the present application, the circuit board assembly 1 includes a circuit board 100, a frame board 200 and a component 300. The circuit board 100 and the frame board 200 are stacked, and the component 300 is integrated on the frame board 200. At least one connection end of the component 300 extends to the board surface of the frame board 200 facing the circuit board 100, and is electrically connected to the circuit board 100.

In some embodiments of the present application, the circuit board 100 and the frame board 200 are connected via a connecting portion 400. The connecting portion 400 may be a solder pad, a solder ball or solder paste, which is not specifically limited in the present application.

In some embodiments of the present application, when the number of components 300 integrated on the frame board 200 is two or more, the two or more components 300 may be the same or different, and the present application does not make any specific limitation on this.

In some embodiments of the present application, some of the connection ends of the components 300 are connected through the connection wires 500 in the circuit board 100. The other connection ends of the components 300 are electrically connected to the connection portion 400 between the frame plate 200 and the circuit board 100 through the connection wires 500 in the circuit board 100, and then the electrical connection between the components 300 and other components is realized through the frame board 200. For example, another component 300 is also integrated on the circuit board 100 (it can be located on the side of the circuit board 100 facing the frame board 200, or it can be located on the side of the circuit board 100 facing away from the frame board 200), and some of the connection ends of the components 300 are electrically connected to another component 300 on the circuit board 100 through the connection wires 500 in the circuit board 100. For another example, another component (not shown) is also integrated on the frame board 200, and some of the connection ends of the components 300 are electrically connected to another component on the frame board 200 through the connection wires 500 in the circuit board 100.

It can be understood that the present application does not make any specific limitations on the connection method of the component 300 on the circuit board 100, nor on the extension method of the connection end of the component 300 to the board surface of the frame board 200. Any technical solution that can achieve the above two functions is within the protection scope of the present application, and the present application does not make any specific limitations on this.

That is, in the circuit board assembly 1 in the present application, the component 300 is integrated on the frame board 200, and the connecting end of the component 300 extends to the board surface of the frame board 200 facing the circuit board 100, so that the connecting end of the component 300 can be electrically and mechanically connected to the circuit board 100 at a position opposite to the physical part of the frame board 200.

Based on this, in the above-mentioned circuit board assembly 1, the connection end of the component 300 can realize the electrical connection between the component 300 and the circuit board 100 on the one hand, and can also realize the mechanical connection between the frame plate 200 and the circuit board 100 on the other hand, which can increase the density of components on the circuit board 100, reduce the number of solder joints on the circuit board 100, and save 7% to 16% of the layout area of the circuit board 100. In summary, the connection area between the frame plate 200 and the circuit board 100 can also realize the layout of the components 300, which can actually increase the effective board area on the circuit board 100 where the components 300 can be laid out. Therefore, the above-mentioned circuit board assembly 1 can reduce the difficulty of the layout of the components 300 on the circuit board 100, facilitate the improvement of the layout density of the components 300 on the circuit board 100, and facilitate the thin and light design of the mobile phone M.

Several possible components will be described below in conjunction with the accompanying drawings. FIG. 7 (a) shows one implementation of the component 300 in the present application. In some of the implementations, the component 300 may be the capacitor of FIG. 7 (a). FIG. 7 (b) shows another implementation in which the component 300 in the present application is replaceable. In some other replaceable implementations, the component 300 may be the inductor of FIG. 7 (b). FIG. 7 (c) shows another implementation in which the component 300 in the present application is replaceable. In some other replaceable implementations, the component 300 may be the resistor of FIG. 7 (c).

In some embodiments of the present application, the component 300 may be a surface mount component. The component surface mount cost is relatively low, which reduces the manufacturing cost of surface mount technology (SMT).

In order to clearly understand the technical solution of the present application, the technical solution of the present application will be described in detail below with reference to the accompanying drawings.

FIG8 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG8, in some embodiments of the present application, the circuit board assembly 1 includes a first circuit board 100a, a first frame plate 200a and a first component 300a. The first circuit board 100a and the first frame plate 200a are stacked. The first component 300a is integrated on the first frame plate 200a. The connection end 310a of the first component 300a extends to the board surface of the first frame plate 200a facing the first circuit board 100a, and is electrically connected to the first circuit board 100a.

In some embodiments of the present application, the first circuit board 100a and the first frame board 200a are connected via a connecting portion 400. The connecting portion 400 may be a solder pad, a solder ball or solder paste, which is not specifically limited in the present application.

In some embodiments of the present application, some connection ends of the first component 300a are connected through the connection line 500 in the first circuit board 100a. The other connection ends of the first component 300a are electrically connected to the connection portion 400 between the first frame plate 200a and the first circuit board 100a through the connection line 500 in the first circuit board 100a, and then the first component 300a is electrically connected to other components through the first frame plate 200a. For example, the first circuit board 100a is also integrated with a third component 300c (which can be located on the side of the first circuit board 100a facing the first frame plate 200a, or on the side of the first circuit board 100a facing away from the first frame plate 200a), and some connection ends of the first component 300a are electrically connected to the third component 300c on the first circuit board 100a through the connection line 500 in the first circuit board 100a. For another example, another component (not shown) is integrated on the first frame board 200a, and part of the connecting ends of the first component 300a are electrically connected to the other component on the first frame board 200a through the connecting wires 500 in the first circuit board 100a.

In some embodiments of the present application, the first circuit board 100a may be a radio frequency board. In some other embodiments of the present application, the first circuit board 100a may be an application processor board. It is understood that other circuit boards in the present application may also be radio frequency boards or application processing boards, which will not be described in detail below.

In some embodiments of the present application, the first component 300a includes at least one of a resistor, a capacitor, an inductor, a converter, a gradienter, a matching network, a resonator, a filter, a mixer, a switch, an amplifier, an overcurrent branch distributor, a feeding amplifier, an optical transmitter and a receiver, and the present application does not make any specific limitations on this.

In some embodiments of the present application, the connection end of the first component 300a is a Cu terminal or a Su-plated terminal, which is not specifically limited in the present application.

Table 1 Summary of the dimensions of the first component 300a

Table 1 shows a summary of the dimensions of the first component 300a in some implementations. Among them, the length refers to the maximum dimension in the three-dimensional dimensions of the first component 300a, the width refers to the middle dimension in the three-dimensional dimensions of the first component 300a, and the height refers to the minimum dimension in the three-dimensional dimensions of the first component 300a. It can be seen from Table 1 that the three-dimensional dimensions of the first component 300a can float within the range of 0.1mm~6mm. It can be understood that the first component 300a corresponding to Table 1 is only a partial implementation of the first component 300a in this application, and the first component 300a can be adjusted according to the size adaptability of the first frame plate 200a. In addition, for the first component 300a partially arranged outside the first frame plate 200a or the first component 300a arranged entirely outside the first frame plate 200a, the three-dimensional dimensions of the first component 300a are limited by the first frame plate 200a and the space around the first frame plate 200a.

After describing the specific method of the first component 300a, the connection scheme between the first component 300a and the circuit board in the present application will be described below with reference to the drawings.

It can be understood that the connection end 310a can be all the connection ends on the first component 300a, or can be part of the connection ends on the first component 300a. This application does not make any specific limitation on this, and will be described in detail below with reference to the drawings.

In some embodiments of the present application, some connecting ends of the components extend to the board surface of the frame board facing one side of the circuit board and are electrically connected to the circuit board, while the remaining connecting ends of the components extend to the board surface of the other circuit board on the frame board facing the other side and are electrically connected to the other circuit boards.

FIG9 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG9, in some embodiments of the present application, the circuit board assembly 1 further includes a second circuit board 100b, and the second circuit board 100b is located on the side of the first frame plate 200a facing away from the first circuit board 100a. At least one connection end of the first component 300a extends to the board surface of the first frame plate 200a facing the second circuit board 100b, and is electrically connected to the second circuit board 100b.

That is, the first circuit board 100a, the first frame board 200a and the second circuit board 100b are stacked in sequence to form a sandwich structure. Part of the connecting end 311a of the first component 300a extends to the board surface of the first frame board 200a facing the first circuit board 100a, and is electrically connected to the first circuit board 100a. The remaining connecting end 312a of the first component 300a extends to the board surface of the first frame board 200a facing the second circuit board 100b, and is electrically connected to the second circuit board 100b. Finally, it is achieved that the first component 300a is arranged on the first frame board 200a, and the connecting end 311a of the first component 300a is electrically connected to the first circuit board 100a through the board surface of the first frame board 200a, and the connecting end 312a of the first component 300a is electrically connected to the second circuit board 100b through the board surface of the first frame board 200a.

The above-mentioned circuit board assembly 1 presents a sandwich structure as a whole. Based on this, the above-mentioned circuit board assembly 1 can realize a multi-layer circuit board stacking layout, can increase the circuit board surface area, facilitate the high-density arrangement of components in the circuit board assembly 1, and can optimize the layout scheme of the circuit board assembly 1. It is worth noting that the circuit board assembly 1 in the present application, in addition to being able to realize the sandwich structure of the circuit board and the frame board, can also realize multi-layer sandwich stacking, as well as multi-layer land grid array (LGA) stacking scheme, which will not be described in detail here.

In some other embodiments of the present application, all connection ends of the components extend to the board surface of the frame board facing one side of the circuit board, and are all electrically connected to the circuit board.

In some embodiments of the present application, the first circuit board 100a and the first frame board 200a are connected via a connection portion 400, and the second circuit board 100b and the first frame board 200a are connected via a connection portion 400. The connection portion 400 may be a solder pad, a solder ball or solder paste, which is not specifically limited in the present application.

The following will take the case where the first circuit board 100a is also integrated with a third component 300c (which can be located on the side of the first circuit board 100a facing the first frame board 200a, or on the side of the first circuit board 100a facing away from the first frame board 200a) and the second circuit board 100b is also integrated with a third component 300c (which can be located on the side of the second circuit board 100b facing the first frame board 200a, or on the side of the second circuit board 100b facing away from the first frame board 200a) as an example to describe the connection method between the components, circuit boards, frame boards and connecting parts in the circuit board assembly 1.

As shown in Fig. 9, the connection end 311a of the first component 300a is electrically connected to the third component 300c on the first circuit board 100a through the connection part 400 and the connection line 500 in the first circuit board 100a. The connection end 312a of the first component 300a is electrically connected to the third component 300c on the second circuit board 100b through the connection part 400 and the connection line 500 in the second circuit board 100b.

FIG10 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG10, in some embodiments of the present application, all the connection ends 313a of the first component 300a extend to the board surface of the first frame plate 200a facing the first circuit board 100a, and are all electrically connected to the first circuit board 100a. It can be understood that the above embodiment does not specifically limit the layout scheme of the circuit boards on both sides of the frame plate. In some implementations of the present application, a circuit board is arranged on one side of the frame plate. In some other replaceable implementations, circuit boards are arranged on both sides of the frame plate. The above technical solutions are all within the protection scope of the present application.

In some embodiments of the present application, the first circuit board 100a and the first frame board 200a are connected via a connecting portion 400. The connecting portion 400 may be a solder pad, a solder ball or solder paste, which is not specifically limited in the present application.

The following will take the case where the third component 300c is also integrated on the first circuit board 100a (which can be located on the side of the first circuit board 100a facing the first frame board 200a, or on the side of the first circuit board 100a facing away from the first frame board 200a) as an example to describe the connection method between the components, circuit board, frame board and connecting parts in the circuit board assembly 1.

As shown in FIG. 10 , the connection end 313 a of the first component 300 a is electrically connected to the third component 300 c on the first circuit board 100 a through the connection portion 400 and the connection line 500 in the first circuit board 100 a .

After introducing the corresponding relationship between the connection end of the first component 300a and the circuit board corresponding to the first frame board 200a, the extension scheme of the connection end from the component to the frame board surface in the present application will be described in detail with reference to the accompanying drawings.

In some embodiments of the present application, the connection end of the component can extend from the inside of the frame plate to the surface of the frame plate. Continuing to refer to FIG. 8 , it can be seen that in some embodiments of the present application, the connection end 310a of the first component 300a passes through the first frame plate 200a and extends to the surface of the first frame plate 200a facing the first circuit board 100a.

In some embodiments of the present application, the connection end of the component can extend from the outside of the frame plate to the surface of the frame plate, that is, the connection end of the component extends along the outer surface of the frame plate to the surface of the frame plate. Figure 11 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in Figure 11, in some embodiments of the present application, the connection end 314a of the first component 300a extends along the surface of the first frame plate 200a to the surface of the first frame plate 200a facing the first circuit board 100a. And, the connection end 315a of the first component 300a extends along the surface of the first frame plate 200a to the surface of the first frame plate 200a facing away from the first circuit board 100a.

It can be understood that the aforementioned Figures 8 and 11 show two basic extension schemes of the connection end to the frame board surface. However, it is worth noting that a component may correspond to multiple connection ends, and each of the multiple connection ends can respectively adopt any one of the aforementioned extension schemes of the connection end to the frame board surface, and the present application does not make specific limitations on this.

After describing the extension manner of the connection end of the first component 300a on the first frame plate 200a, the relative positional relationship between the first component 300a and the first frame plate 200a will be described below with reference to the accompanying drawings.

In some embodiments of the present application, components are integrated inside the frame plate. Continuing to refer to FIG. 8, it can be seen that in some embodiments of the present application, the first component 300a is integrated inside the first frame plate 200a. The first component is integrated inside the second component, which means that the first component cannot be observed from the outside of the second component. That is, the first component 300a cannot be observed from the outside of the first frame plate 200a.

In the above circuit board assembly 1, since the first component 300a is integrated inside the first frame plate 200a, that is, the first component 300a does not need to occupy other space except the first frame plate 200a, the layout scheme of the circuit board assembly 1 is further optimized, and the space occupied by the circuit board assembly 1 is further reduced. The above circuit board assembly 1 can improve reliability and reduce stress damage caused by external forces.

In some embodiments of the present application, components are integrated on the side of the frame plate. The side refers to the side of the frame plate where the surface perpendicular to the frame plate surface is located. FIG. 12 (a) shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG. 12 (a), in some other embodiments of the present application, the first component 300a is integrated on the side of the first frame plate 200a. The first component is integrated on the side (outside) of the second component, which means that the entire first component can be observed from the outside of the second component. That is, the entire first component 300a can be observed from the outside of the first frame plate 200a.

The connection method among the components, circuit board, frame board and connection parts in the circuit board assembly 1 in FIG. 12 ( a ) can be specifically referred to the relevant description in FIG. 9 , which will not be described in detail here.

In the above-mentioned circuit board assembly 1, since the first component 300a is integrated on the side of the first frame board 200a, the first component 300a does not need to occupy an additional area on the surface of the first circuit board 100a, thereby optimizing the layout of the circuit board assembly 1 and reducing the space occupied by the circuit board assembly 1. In addition, since the first component 300a is integrated on the side of the first frame board 200a, the integration method of the first component 300a on the first frame board 200a is relatively simple, thereby reducing the difficulty of installing the circuit board assembly 1.

FIG12 (b) shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG12 (b), in some other embodiments of the present application, a portion of the first component 300a is integrated into the first frame plate 200a, and another portion of the first component 300a is integrated into the side of the first frame plate 200a. Among them, the first component is partially integrated into the second component, and the first component is partially integrated into the side (outside) of the second component, which means that part of the first component can be observed from the outside of the second component, but the entire first component cannot be observed. That is, part of the first component 300a can be observed from the outside of the first frame plate 200a, but the entire first component 300a cannot be observed.

The connection method among the components, circuit board, frame board and connection parts in the circuit board assembly 1 in FIG. 12 ( b ) can be specifically referred to the relevant description in FIG. 9 , which will not be described in detail here.

In the above-mentioned circuit board assembly 1, since the first component 300a is integrated on the side of the first frame board 200a, the first component 300a does not need to occupy an additional area on the surface of the first circuit board 100a, thereby optimizing the layout of the circuit board assembly 1 and reducing the space occupied by the circuit board assembly 1. In addition, the first component 300a is partially integrated on the side of the first frame board 200a and partially integrated inside the first frame board 200a, which, on the one hand, reduces the additional space occupied by the first component 300a, and on the other hand, can also reduce the integration difficulty of the first component 300a on the first frame board 200a to a certain extent.

In addition, in some embodiments of the present application, a frame board in the circuit board assembly is provided with a storage space. Components in the circuit board assembly can be arranged in the storage space, wherein the components can be components integrated on the frame board or components integrated on the circuit board, and the present application does not specifically limit this. Continuing to refer to FIG. 8 to FIG. 12 (b), it can be seen that in some embodiments of the present application, a storage space 201a is provided on the first frame board 200a, and the first component 300a is arranged in the storage space 201a.

The above-mentioned circuit board assembly 1 arranges the first component 300 a in the accommodating space 201 a, which can achieve a reasonable layout of the first component 300 a and further optimize the layout scheme of the circuit board assembly 1 .

In addition, in some embodiments of the present application, when a receiving space is provided on the frame plate, the components can be distributed around the receiving space around the frame plate or on the frame plate.

FIG. 13 (a) shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. FIG. 13 (b) shows the relative positional relationship between the first frame plate 200a and the first component 300a in the circuit board assembly 1 in some embodiments of the present application. As shown in FIG. 13 (a) and FIG. 13 (b), in some embodiments of the present application, a receiving space 201a is provided on the first frame plate 200a, and the surface of the first frame plate 200a is in a square shape. The first component 300a is distributed in the first frame plate 200a, and the first component 300a is distributed on two opposite sides of the receiving space 201a.

The connection method among the components, circuit board, frame board and connection parts in the circuit board assembly 1 in FIG. 13 ( a ) can be specifically referred to the relevant description in FIG. 9 , which will not be described in detail here.

In some other embodiments of the present application, a receiving space 201a is provided on the first frame plate 200a, and the first frame plate 200a is in a square shape. The first components 300a are distributed in the receiving space 201a, and the first components 300a are distributed on a pair of surfaces opposite to each other on the receiving space 201a.

In the above-mentioned circuit board assembly 1, a sandwich high-density technology is adopted to bury the first components 300a around the first frame plate 200a, and the first components 300a are evenly distributed in the first frame plate 200a or the accommodating space 201a, which facilitates the stable connection between the first circuit board 100a and the first frame plate 200a, thereby improving the connection strength between the first circuit board 100a and the first frame plate 200a and improving the mechanical strength of the circuit board assembly 1. In addition, the layout area of the first circuit board 100a can be saved.

FIG14 (a) shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG14 (a), two first components 300a (specifically including first components 300a-1 and first components 300a-2) are arranged side by side along the vertical direction of the stacking direction on the same side of the first frame plate 200a. The connection method between the components, circuit board, frame plate and connecting part in the circuit board assembly 1 in FIG14 (a) can be specifically referred to the relevant description of FIG9, which will not be described in detail here.

FIG14 (b) shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG14 (b), two first components 300a (specifically including first components 300a-1 and first components 300a-2) are arranged in series along the stacking direction on the same side of the first frame plate 200a, and the ends of the two first components 300a are connected. The connection method between the components, circuit board, frame plate and connecting part in the circuit board assembly 1 in FIG14 (b) can be specifically referred to the relevant description of the aforementioned drawings, and will not be described in detail here.

In some application scenarios, there may be multiple frame plates in the circuit board assembly, and the multiple frame plates and the multiple circuit boards are alternately stacked. This will be described in detail below with reference to the accompanying drawings.

FIG15 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG15, in some embodiments of the present application, the circuit board assembly 1 also includes a second frame plate 200b and a second component 300b. Among them, the second frame plate 200b is located on the side of the first circuit board 100a facing away from the first frame plate 200a, and the second component 300b is integrated on the second frame plate 200b. At least one connection end of the second component 300b extends to the board surface of the first frame plate 200a facing the first circuit board 100a, and is electrically connected to the first circuit board 100a. It can be understood that the integration method of the second component 300b on the second frame plate 200b can be specifically referred to the integration method of the first component 300a on the first frame plate 200a mentioned above, and will not be described in detail here.

In addition, referring to FIG. 15 , in some embodiments of the present application, the circuit board assembly 1 further includes a third circuit board 100c. The third circuit board 100c is located on the side of the second frame board 200b facing away from the first circuit board 100a. At least one connection end of the second component 300b extends to the board surface of the second frame board 200b facing the third circuit board 100c, and is electrically connected to the third circuit board 100c.

In some embodiments of the present application, the first circuit board 100a is connected to the first frame board 200a through the connection part 400, the second circuit board 100b is connected to the first frame board 200a through the connection part 400, the first circuit board 100a is connected to the second frame board 200b through the connection part 400, and the third circuit board 100c is connected to the second frame board 200b through the connection part 400. The connection part 400 may be a pad, a solder ball or solder paste, which is not specifically limited in the present application.

The following will take the case where the number of second components 300b integrated in the second frame board 200b is two (specifically including second components 300b-1 and second components 300b-2), the first circuit board 100a also has a third component 300c integrated thereon (which can be located on the side of the first circuit board 100a facing the first frame board 200a, or on the side of the first circuit board 100a facing away from the first frame board 200a), the second circuit board 100b also has a third component 300c integrated thereon (which can be located on the side of the first circuit board 100a facing the first frame board 200a, or on the side of the first circuit board 100a facing away from the first frame board 200a), and the third circuit board 100c also has a third component 300c integrated thereon (which can be located on the side of the first circuit board 100a facing the first frame board 200a, or on the side of the first circuit board 100a facing away from the first frame board 200a) as an example to describe the connection method among components, circuit boards, frame boards and connecting parts in the circuit board assembly 1.

As shown in FIG15 , the connection end 318a of the first component 300a is electrically connected to the third component 300c on the first circuit board 100a through the connection part 400 and the connection line 500 in the first circuit board 100a, and the connection end 319a of the first component 300a is electrically connected to the third component 300c on the second circuit board 100b through the connection part 400 and the connection line 500 in the second circuit board 100b. The connection end 311b-1 of the second component 300b-1 is electrically connected to the third component 300c on the second circuit board 100b through the connection part 400, the connection line 500 in the first frame plate 100a, and the connection line 500 in the second circuit board 100b, and the connection end 312b-1 of the second component 300b-1 is electrically connected to the third component 300c on the third circuit board 100c through the connection part 400 and the connection line 500 in the third circuit board 100c. The connection end 311b-2 of the second component 300b-2 is electrically connected to the third component 300c on the first circuit board 100a through the connection part 400 and the connection line 500 in the first circuit board 100a, and the connection end 312b-2 of the second component 300b-2 is electrically connected to the third component 300c on the third circuit board 100c through the connection part 400 and the connection line 500 in the third circuit board 100c. It can be understood that the intersecting connection lines shown in FIG. 15 are not really intersecting, and can be staggered in the circuit board.

FIG16 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG16, in some embodiments of the present application, the circuit board assembly includes a first circuit board 100a, a first frame plate 200a, a second frame plate 200b, a first component 300a and a second component 300b. In addition, the first frame plate 200a, the first circuit board 100a and the second frame plate 200b are stacked in sequence. The first component 300a is integrated on the first frame plate 200a, and at least part of the connecting end 310a on the first component 300a extends to the board surface of the first frame plate 200a facing the first circuit board 100a, and is electrically connected to the first circuit board 100a. The second component 300b is integrated on the second frame plate 200b, and at least part of the connecting end 310b on the second component 300b extends to the board surface of the second frame plate 200b facing the first circuit board 100b, and is electrically connected to the first circuit board 100a.

The above-mentioned circuit board assembly 1 includes multiple circuit boards and multiple frame boards, so it is possible to achieve layered composite of multiple frame boards and multiple circuit boards, further optimize the layout scheme of the circuit board assembly 1 and improve the high density of the circuit board assembly 1, thereby further realizing the lightweight design of the mobile phone M using the circuit board assembly 1 in this application.

The following will take the example that the number of first components 300a integrated in the first frame board 200a is two (specifically including the second component 300a-1 and the first component 300a-2) and the number of second components 300b integrated in the second frame board 200b is two (specifically including the second component 300b-1 and the second component 300b-2) to describe the connection method between the components, circuit board, frame board and connecting parts in the circuit board assembly 1.

As shown in Fig. 16, the connection end 310a-2 of the first component 300a-2 is electrically connected to the connection end 310b-1 of the second component 300b-1 on the second frame plate 200b through the connection part 400 and the connection line 500 in the first circuit board 100a. It can be understood that the connection method of other connection ends of the components in Fig. 16 can refer to the connection method in the aforementioned figures, and will not be described in detail here.

It can be understood that, in addition to the components integrated on the frame board, the circuit board assembly can also include components directly disposed on the circuit board. Continuing to refer to Figures 8 to 16, it can be seen that in some embodiments of the present application, the circuit board assembly 1 also includes a third component 300c. Among them, the third component 300c is disposed on the board surface of the first circuit board 100a and is electrically connected to the first circuit board 100a. It can be understood that the above description is only based on the third component 300c on the first circuit board 100a as an example. The third components on the second circuit board 100b and the third circuit board 100c can specifically refer to the third component 300c on the first circuit board 100a, and will not be described in detail here.

In some embodiments of the present application, a receiving space is provided on the frame plate in the circuit board assembly 1. Continuing to refer to Figures 8 to 16, it can be seen that in some embodiments of the present application, in the circuit board assembly 1 of the present application, a receiving space is provided on the first frame plate 200a, and the third component 300c is provided on the board surface of the first circuit board 100a facing the first frame plate 200a, and is located in the receiving space.

In some embodiments of the present application, the circuit board assembly includes a plurality of staggered frame plates, and the plurality of staggered frame plates are positioned relative to each other. Continuing to refer to FIG. 15 , it can be seen that in some embodiments of the present application, the orthographic projection of the first frame plate 200a in the first projection plane and the orthographic projection of the second frame plate 200b in the first projection plane at least partially do not overlap, wherein the first projection plane is perpendicular to the stacking direction of the first frame plate 200a and the first component 300a. For example, the first projection plane can be one of the board surfaces of the circuit board or one of the board surfaces of the frame plate.

In some other embodiments of the present application, the circuit board assembly includes a plurality of frame plates arranged in an interlaced stack, and the positions of the plurality of frame plates are staggered. FIG. 17 shows a schematic diagram of the structure of the circuit board assembly 1 in some embodiments of the present application. As shown in FIG. 16 and FIG. 17, in some embodiments of the present application, in the circuit board assembly 1 in the present application, the orthographic projection of the third component 300c in the second projection plane does not overlap with the orthographic projection of the first frame plate 200a in the second projection plane, wherein the second projection plane is perpendicular to the stacking direction of the first frame plate 200a and the first component 300a. For example, the first projection plane can be one of the board surfaces of the circuit board or one of the board surfaces of the frame plate. It can be understood that the second projection plane can be parallel to or overlap with the aforementioned first projection plane.

The following will take the example that the number of first components 300a integrated in the first frame board 200a is two (specifically including the first component 300a-1 and the first component 300a-2), the number of second components 300b integrated in the second frame board 200b is two (specifically including the second component 300b-1 and the second component 300b-2), the third component 300c is also integrated on the second circuit board 100b (which can be located on the side of the second circuit board 100b facing the first frame board 200a, or on the side of the second circuit board 100b facing away from the first frame board 200a), and the third component 300c is also integrated on the third circuit board 100c (which can be located on the side of the third circuit board 100c facing the second frame board 200b, or on the side of the third circuit board 100c facing away from the second frame board 200b) as an example to describe the connection method among the components, circuit boards, frame boards and connecting parts in the circuit board assembly 1.

As shown in FIG. 17 , the connection end 312a-1 of the first component 300a-1 is electrically connected to the third component 300c on the second circuit board 100b through the connection portion 400 and the connection line 500 in the second circuit board 100b. The connection end 312a-2 of the first component 300a-2 is electrically connected to the third component 300c on the second circuit board 100b through the connection portion 400 and the connection line 500 in the second circuit board 100b. The connection end 311a-2 of the first component 300a-2 is electrically connected to the connection end 311b-1 of the second component 300b-1 on the second frame plate 200b through the connection portion 400 and the connection line 500 in the first circuit board 100a. The connection end 312b-1 of the second component 300b-1 is electrically connected to the third component 300c on the third circuit board 100c through the connection portion 400. It can be understood that the connection method of other connection terminals of the components in Figure 17 can refer to the connection method in the aforementioned drawings and will not be described in detail here.

In addition, the present application also provides an electronic device, which includes any of the above-mentioned circuit board assemblies. It can be understood that the electronic device in the present application includes but is not limited to any of the devices having circuit board assemblies such as mobile terminals, servers, optical modules and switches.

In addition, the present application also provides a frame board integration, wherein the frame board integration includes a frame board and components integrated on the frame board, and at least part of the connecting ends of the components extend to the board surface of the frame board.

Continuing to refer to FIG. 8 to FIG. 17 , it can be seen that the frame plate integration may include a first frame plate 200a and a first component 300a. The first component 300a is integrated on the first frame plate 200a. At least one connection end of the first component 300a extends to the board surface of the first frame plate 200a and is used to be electrically connected to the corresponding circuit board.

It can be understood that the specific structure of the frame board integration in the present application can be specifically referred to the specific structure of the frame board and the components integrated on the frame board in the aforementioned circuit board assembly, and will not be described in detail here.

After describing the specific structure of the circuit board assembly, electronic device and frame board integration in this application, this application will continue to describe the molding scheme of the circuit board assembly in conjunction with the accompanying drawings.

In some application scenarios, components are integrated on both the circuit board and the frame board in the circuit board assembly. FIG. 18 shows a flow chart of a molding scheme of the circuit board assembly in some embodiments of the present application. The molding scheme of the circuit board assembly in some embodiments of the present application will be described in detail below in conjunction with FIG. 18. As shown in FIG. 18, the molding scheme of the circuit board assembly may include the following steps:

S1801: Complete the installation of components on the circuit board surface to obtain a circuit board prefabricated part.

The circuit board preform refers to a circuit board with integrated components. In some embodiments of the present application, components are soldered to the circuit board surface by solder to achieve electrical connection between the components and the circuit board. It can be understood that the components in S1801 refer to components directly arranged on the circuit board surface, not components integrated on the frame board.

S1802: Complete the installation of components on the frame board surface to obtain the frame board prefabricated part.

The frame plate prefabricated part refers to a frame plate with integrated components. It can be understood that the components in S1802 refer to components directly arranged on the frame plate surface, not components integrated on the circuit board. The integration method of components on the frame plate will be described in detail below and will not be described in detail here.

S1803: Install the frame plate preform onto the circuit board preform to obtain a circuit board assembly.

In some embodiments of the present application, when the frame plate preform is mounted on the circuit board preform, the connection ends of the components on the frame plate are electrically connected to the circuit board.

In some of these implementations, the connection end of the connector on the frame board is plugged into the circuit board. In some other replaceable implementations, the connection end of the connector on the frame board is soldered to the circuit board by conductive solder.

It can be understood that the execution order of S1801 and S1802 in the present application can be adaptively adjusted according to the specific application scenario, and the present application does not make any specific limitation on this.

In some application scenarios, components are integrated on both the circuit board and the frame board in the circuit board assembly, and at least some of the components on the circuit board can be installed on the circuit board after the frame board is assembled on the circuit board. In some embodiments of the present application, the molding scheme of the circuit board assembly may include completing the installation of some components on the circuit board surface to obtain a circuit board prefabricated part. Complete the installation of components on the frame board surface to obtain a frame board prefabricated part. Install the frame board prefabricated part on the circuit board prefabricated part to obtain a prefabricated circuit board assembly. Complete the installation of the remaining components on the circuit board prefabricated part in the prefabricated circuit board assembly.

In some application scenarios, there are no other components on the circuit board in the circuit board assembly. In some embodiments of the present application, the molding scheme of the circuit board assembly may include: completing the installation of components on the frame board to obtain a frame board prefabricated part. Subsequently, the frame board prefabricated part is installed on the circuit board to obtain the circuit board assembly.

In some application scenarios, there are no other components on the circuit board in the circuit board assembly, and the components on the frame board can be integrated inside and/or on the side of the frame board. In some embodiments of the present application, the molding scheme of the circuit board assembly may include: completing the installation of components on the frame board to obtain a frame board prefabricated part. Subsequently, the frame board prefabricated part is installed on the circuit board to obtain the circuit board assembly.

In some application scenarios, there are no other components on the circuit board in the circuit board assembly, and the components on the frame board are integrated on the side of the frame board. In some embodiments of the present application, the molding scheme of the circuit board assembly may include: installing the frame board on the circuit board to obtain a prefabricated circuit board assembly. Subsequently, the components are installed on the side of the frame board to obtain the circuit board assembly.

In some application scenarios, there are no other components on the board surface of the circuit board in the circuit board assembly facing the frame board. In some embodiments of the present application, the molding scheme of the circuit board assembly may include: completing the installation of components on the board surface of the frame board to obtain a frame board prefabricated part. Subsequently, the frame board prefabricated part is installed on the circuit board to obtain a prefabricated circuit board assembly. Finally, the components are installed on the circuit board in the prefabricated circuit board assembly.

The molding scheme of the circuit board assembly 1 is described below by taking Figure 15 as an example. In some embodiments of the present application, a third component 300c is welded on the surface of the third circuit board 100c. Subsequently, the third circuit board 100c and the second frame plate 200b are welded. Subsequently, the first circuit board 100a and the first frame plate 200a are welded. Subsequently, the second frame plate 200b and the first circuit board 100a are welded. Subsequently, the third component 300c is molded on the second circuit board 100b. Subsequently, the second circuit board 100b and the first frame plate 200a are welded. It can be understood that the installation order of the circuit board, the frame plate and the components in the aforementioned circuit board assembly 1 can be adaptively adjusted according to the needs, and the present application does not make specific limitations on this.

After describing the molding scheme of the circuit board assembly, the present application will continue to describe the integration scheme of components in the frame board in conjunction with the accompanying drawings. In some application scenarios, the components are integrated on the frame board. Figure 19 shows a flow chart of the integration scheme of components in the frame board in some embodiments of the present application. The integration scheme of components in the frame board in some embodiments of the present application will be described in detail below in conjunction with Figure 19. As shown in Figure 19, the integration scheme of components in the frame board may include the following steps:

S1901: Forming mounting holes on the frame plate 200.

In some embodiments of the present application, the frame plate includes a first frame plate surface and a second frame plate surface disposed opposite to each other along a first direction. The mounting hole includes a first stepped hole and a second stepped hole that are interconnected. The first stepped hole extends to the first frame plate surface, and the second stepped hole extends to the second frame plate surface. In the second direction, the aperture of the first stepped hole is larger than the size of the component, and the aperture of the second stepped hole is smaller than the size of the component, and the second direction intersects the first direction. In some implementations, the first direction is perpendicular to the second direction.

In some embodiments of the present application, the first stepped hole includes a first sub-stepped hole and a second sub-stepped hole that are interconnected. The first sub-stepped hole is a tapered hole, and the large end aperture of the tapered hole extends to the first frame plate surface, and the second sub-stepped hole is interconnected with the second stepped hole. In some implementations, the taper P of the tapered hole ranges from 30° to 60°.

For example, as shown in FIG20(a), the second step hole is firstly drilled by depth control. Then, as shown in FIG20(b), the second sub-step hole is drilled by depth control. Finally, as shown in FIG20(c), the first sub-step hole is drilled by countersunk drilling.

S1902: Arrange the component 300 in the mounting hole. As shown in FIG20( d ), the height of the component is L, and the width of the component 300 is K.

As shown in FIG. 20 (e) to FIG. 20 (g), in some embodiments of the present application, the component is placed flat on the first frame plate surface of the frame plate. The component is translated along the first frame plate surface so that the first end of the component is suspended above the mounting hole. The component has a second end extending in the opposite direction from the first end, and the distance between the center point of the component and the edge of the mounting hole close to the second end is greater than 0.3 times the end dimension of the component. The end dimension is the dimension of the component extending from the first end to the second end.

In some embodiments of the present application, the distance between the first end of the component and the edge of the mounting hole close to the second end is greater than 0.6 times the end dimension of the component.

S1903: Filling the surrounding of the component 300 in the mounting hole with a filler and solidifying it into a filling portion 600. The filler may be a resin.

As shown in FIG. 20( h ), in some embodiments of the present application, resin is filled around the components in the mounting holes and cured to fix the components and expel air bubbles.

S1904 : forming connection holes on the filling portion 600 and/or the frame plate 200 , wherein the connection holes extend from the electrical connection area of the component 300 to the board surface of the frame plate 200 , as shown in FIG. 20 ( i ).

S1905 : forming the electrical connection portion 700 of the component 300 in the connection hole, wherein one end of the electrical connection portion 700 of the component 300 is electrically connected to the electrical connection area of the component 300 , and the other end extends to the board surface of the frame board 200 .

As shown in FIG. 20 ( j ) and FIG. 20 ( k ), in some embodiments of the present application, the electrical connection portion 700 is formed by metallizing a connection hole, and the metallization structure in the connection hole serves as the electrical connection portion 700 .

FIG. 21 (a) to FIG. 21 (d) show the integration scheme of the component 300 and the frame plate 200 when two components 300 (specifically including component 300-1 and component 300-2) are arranged in series along the stacking direction on the same side of the frame plate 200 in some embodiments of the present application. As shown in FIG. 21 (a) to FIG. 21 (d), the component 300-1 is arranged in the mounting hole of the frame plate 200, and the component 300-2 is arranged in the mounting hole of the frame plate 200, and the component 300-1 and the component 300-2 are electrically connected. Filler is filled around the component 300 in the mounting hole and cured into a filling portion 600. The subsequent steps can be specifically referred to the aforementioned embodiment, and will not be described in detail here. In addition, the electrical connection method of the component 300-1 and the component 300-2 can be directly bonded or connected by a conductive component (such as a conductive adhesive).

FIG22 shows a schematic diagram of the integration scheme of the components 300 and the frame plate 200 when two components 300 (specifically, the components 300-1 and the components 300-2) are arranged in series along the stacking direction on the same side of the frame plate 200 in some embodiments of the present application. As shown in FIG22, the difference from the integration scheme illustrated in FIG21 (a) to FIG21 (d) is that the components 300-1 and the components 300-2 are arranged in sequence in the mounting holes of the frame plate 200. That is, there is no need to arrange the components 300-2 after the components 300-1 are arranged, which shortens the arrangement time and improves the assembly efficiency.

FIG. 23 (a) to FIG. 23 (c) show schematic diagrams of the integration scheme of the component 300 and the frame plate 200 when two components 300 (specifically including component 300-1 and component 300-2) are arranged side by side in the same mounting hole on the same side of the frame plate 200 in the vertical direction of the stacking direction in some embodiments of the present application. As shown in FIG. 23 (a) to FIG. 23 (c), the component 300-1 is slid from the right side toward the mounting hole and then arranged in the mounting hole of the frame plate 200, and the component 300-1 is slid from the left side toward the mounting hole and then arranged in the mounting hole of the frame plate 200. Filler is filled around the components 300 (300-1 and 300-2) in the mounting hole and solidified into a filling portion 600. The subsequent steps can be specifically referred to the aforementioned embodiment and will not be described in detail here. In addition, the electrical connection between the components 300 - 1 and 300 - 2 may be directly bonded or connected by a conductive component (such as conductive glue).

It can be understood that the arrangement order of the components 300 - 1 and the components 300 - 2 in the mounting holes in FIG. 23 ( a ) to FIG. 23 ( c ) can be simultaneous, or one after the other, and the present application does not make any specific limitation on this.

FIG. 24 (a) to FIG. 24 (e) show schematic diagrams of the integration scheme of the components 300 and the frame plate 200 when two components 300 (specifically, the component 300-1 and the component 300-2) are arranged side by side along the vertical direction of the stacking direction on the same side of the frame plate 200 in some embodiments of the present application. As shown in FIG. 24 (a) to FIG. 24 (e), the component 300-1 is arranged in a mounting hole of the frame plate 200 from one side of the plate surface of the frame plate 200a, and the filler is filled around the component 300-1 in the mounting hole and solidified into a filling portion 600. Subsequently, the component 300-2 is arranged in another mounting hole of the frame plate 200 from the other side of the plate surface of the frame plate 200a, and the filler is filled around the component 300-2 in the mounting hole and solidified into a filling portion 600. The above integration method can increase the number of integrated components 300 on the frame board 200 and improve the integration density of the components 300 by integrating some components on the two side surfaces of the frame board 200. In addition, different components can be integrated on the two side surfaces of the frame board, which is not easy to be confused, and reduces the difficulty of integrating components in the frame board.

FIG. 25 (a) to FIG. 25 (c) show schematic diagrams of the integration scheme of the components 300 and the frame plate 200 in some embodiments of the present application, when two components 300 (specifically including component 300-1 and component 300-2) are arranged side by side in a direction perpendicular to the stacking direction on the same side of the frame plate 200 and two components 300 (specifically including component 300-2 and second component 300-3) are arranged in series in the stacking direction. It can be understood that the integration scheme corresponding to FIG. 25 (a) to FIG. 25 (c) can be a fusion of the scheme of arranging two components side by side in a direction perpendicular to the stacking direction and arranging two components in series in the stacking direction, which will not be described in detail here.

FIG. 26 (a) to FIG. 26 (c) show schematic diagrams of the integration scheme of the components 300 and the frame plate 200 in some embodiments of the present application, when two components 300 (specifically including component 300-1 and component 300-2) are arranged side by side along the vertical direction of the stacking direction on the same side of the frame plate 200, two components 300 (specifically including component 300-2 and second component 300-3) are arranged in series along the stacking direction, and two components 300 (specifically including component 300-3 and second component 300-4) are arranged side by side along the vertical direction of the stacking direction in the same mounting hole. It can be understood that the integration scheme corresponding to FIG. 26 (a) to FIG. 26 (c) can be a fusion of the aforementioned schemes of arranging two components side by side along the vertical direction of the stacking direction, arranging two components in series along the stacking direction, and arranging two components side by side along the vertical direction of the stacking direction in the same mounting hole, which will not be described in detail here.

Table 2 shows the dimensions and dimensional relationships of the frame board 200 and the components 300 in the circuit board assembly 1 in some embodiments of the present application.

Table 2 Summary of the dimensions of the frame plate 200 and the components 300

The above-mentioned solution for integrating components in the frame board reduces the difficulty of integrating the components 300 on the frame board 200 by reasonably setting the relative sizes of the frame board 200 and the components 300 .

In some other application scenarios, the components 300 may also be integrated on the side of the frame plate 200, or the components 300 may be partially integrated on the side of the frame plate 200 and the rest integrated inside the frame plate 200. It is understood that the specific integration method of the components 300 on the frame plate 200 may refer to the aforementioned integration solution of the components 300 integrated inside the frame plate 200, which will not be described in detail here.

The above is a description of the implementation mode of the present application by specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", "connection" and "fitting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims (22)

1. The circuit board assembly is characterized by comprising a first circuit board, a second circuit board, a first frame plate, a first component and a third component;

The first circuit board, the first frame board and the second circuit board are sequentially stacked, the first circuit board is connected with the first frame board through a first connecting part, the second circuit board is connected with the first frame board through a second connecting part, and the first connecting part and the second connecting part are both solder; the plate thickness of the first frame plate is 2-3 times of the plate thickness of the first circuit board or the second circuit board;

the first component is integrated on the first frame plate;

at least one connecting end of the first component extends to the surface of the first frame plate, which faces the first circuit board, and is electrically connected with the first circuit board through the first connecting part;

the relative positional relationship of the first component and the first frame plate includes:

The first component is integrated inside the first frame plate; or alternatively

The first component is integrated on the side part of the first frame plate; or alternatively

A part of the first components is integrated inside the first frame plate, and another part of the first components is integrated on a side of the first frame plate;

The third component is arranged on the surface of the first circuit board and is electrically connected with the first circuit board;

And part of the connecting ends of the first component are electrically connected with the third component through the first connecting part and the connecting wire in the first circuit board.

2. The circuit board assembly of claim 1, wherein at least one connection end of the first component extends to a face of the first frame plate that faces the second circuit board and is electrically connected to the second circuit board.

3. The circuit board assembly of claim 1, wherein all of the connection ends of the first component extend to the face of the first frame plate toward the first circuit board and are all electrically connected to the first circuit board.

4. A circuit board assembly according to any one of claims 1 to 3, wherein,

At least one connecting end of the first component penetrates through the first frame plate and extends to the surface of the first circuit board, which faces the first frame plate; or alternatively

At least one connection end of the first component extends along the surface of the first frame plate to a plate surface of the first frame plate facing the first circuit board.

5. The circuit board assembly of claim 4, further comprising a second frame plate and a second component;

the second frame plate is positioned on one side of the first circuit board, which is opposite to the first frame plate, and the second component is integrated on the second frame plate;

at least one connecting end of the second component extends to the first frame plate to face the plate surface of the first circuit board and is electrically connected with the first circuit board.

6. The circuit board assembly of claim 5, further comprising a third circuit board;

the third circuit board is positioned on one side of the second frame board, which is opposite to the first circuit board;

at least one connecting end of the second component extends to the second frame plate to face the third circuit board and is electrically connected with the third circuit board.

7. The circuit board assembly of claim 5 or 6, wherein the orthographic projection of the first frame plate in a first plane of projection is at least partially misaligned with the orthographic projection of the second frame plate in the first plane of projection, wherein the first plane of projection is perpendicular to the direction of lamination of the first frame plate and the first component.

8. The circuit board assembly of claim 7, wherein an orthographic projection of the third component in a second plane of projection is not coincident with an orthographic projection of the first frame plate in the second plane of projection, wherein the second plane of projection is perpendicular to a stacking direction of the first frame plate and the first component.

9. The circuit board assembly of claim 8, wherein the first frame plate is provided with an accommodating space, and the third component is disposed in the accommodating space and faces the first circuit board to the first frame plate.

10. The circuit board assembly according to any one of claims 1 to 3, 5, 6, 8 and 9, wherein the number of first components is two, two of the first components are stacked along the stacking direction of the first circuit board and the first frame plate, and the connection terminals of the two first components disposed opposite to each other are electrically connected.

11. The circuit board assembly according to any one of claims 1 to 3, 5, 6, 8 and 9, wherein the number of the first components is two, and two of the first components are juxtaposed in a vertical direction perpendicular to a stacking direction of the first circuit board and the first frame plate.

12. The circuit board assembly of any of claims 1-3, 5, 6, 8, and 9, wherein the first component comprises at least one of a resistor, a capacitor, an inductor, a converter, a graduating device, a matching network, a resonator, a filter, a mixer, a switch, an amplifier, an over-current branch distributor, a feed amplifier, an optical transmitter, and a receiver.

13. An electronic device comprising the circuit board assembly of any one of claims 1 to 3, 5, 6, 8 and 9.

14. A method of integrating a frame plate and a component, wherein the frame plate comprises the first frame plate of any one of claims 1 to 3, 5,6, 8 and 9, and the component comprises the first component of any one of claims 1 to 3, 5,6, 8 and 9, the method comprising:

forming mounting holes on the plate surface of the frame plate;

Disposing the component within the mounting hole;

Filling filler around the component in the mounting hole and solidifying the filler into a filling part;

Forming connecting holes on the filling part and/or the frame plate, wherein the connecting holes extend from the electric connecting area of the component to the plate surface of the frame plate;

And forming an electric connection part in the connection hole, wherein one end of the electric connection part is electrically connected with the electric connection area of the component, and the other end of the electric connection part extends to the plate surface of the frame plate.

15. The method of integrating a frame plate and a component according to claim 14, wherein the forming of the electrical connection portion includes metallizing the connection hole with a metallization structure in the connection hole as the electrical connection portion.

16. The method of integrating a frame plate and a component according to claim 14 or 15, wherein the frame plate includes a first frame plate face and a second frame plate face disposed opposite to each other in a first direction, a first mounting hole is formed in the first frame plate face of the frame plate, a part of the component is arranged in the first mounting hole, and a second mounting hole is formed in the second frame plate face of the frame plate, and a part of the component is arranged in the second mounting hole.

17. The method of integrating a frame plate and a component according to claim 16, wherein the first mounting hole includes a first stepped hole and a second stepped hole that communicate with each other;

The first stepped hole extends to the first frame plate surface, and the second stepped hole extends to the second frame plate surface;

In a second direction, the aperture of the first stepped hole is larger than the size of the component, the aperture of the second stepped hole is smaller than the size of the component, and the second direction intersects with the first direction.

18. The method of integrating a frame plate with a component according to claim 17, wherein the second direction is perpendicular to the first direction.

19. The method of integrating a frame plate and a component according to claim 17 or 18, wherein the first stepped hole includes a first sub-stepped hole and a second sub-stepped hole which are communicated with each other;

The first sub-step hole is a conical hole, the large end hole diameter of the conical hole extends to the first frame plate surface, and the second sub-step hole is communicated with the second step hole.

20. A method of integrating a frame plate with a component as claimed in claim 19, wherein the taper of the tapered holes is in the range 30 ° to 60 °.

21. The method of integrating a frame plate and a component according to any one of claims 17, 18 and 20, wherein the disposing the component within the mounting hole comprises:

the components are horizontally arranged on the first frame plate surface of the frame plate;

translating the component along the first frame plate surface so that a first end of the component is suspended above the first mounting hole;

the component has a second end extending in opposite directions from the first end, and a distance between a center point of the component and an edge of the first mounting hole near the second end is greater than 0.3 times an end-to-end dimension of the component, wherein the end-to-end dimension is a dimension of the component extending from the first end to the second end.

22. The method of integrating a frame plate and a component of claim 21 wherein a distance between the first end of the component and an edge of the first mounting hole proximate the second end is greater than 0.6 times an end-to-end dimension of the component.