CN116685090A - Waterproof fingerprint module - Google Patents
Waterproof fingerprint module Download PDFInfo
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- CN116685090A CN116685090A CN202310672241.XA CN202310672241A CN116685090A CN 116685090 A CN116685090 A CN 116685090A CN 202310672241 A CN202310672241 A CN 202310672241A CN 116685090 A CN116685090 A CN 116685090A
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- substrate
- chip
- bulge
- groove
- reinforcing layer
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- 239000000758 substrate Substances 0.000 claims abstract description 143
- 238000007789 sealing Methods 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims description 63
- 230000003014 reinforcing effect Effects 0.000 claims description 49
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 238000007790 scraping Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application discloses a waterproof fingerprint module, which comprises a sealing ring, a chip and a shell, wherein a first bulge and a second bulge are arranged on the left side and the right side of the shell, the chip is of a convex structure, a second groove is formed in the sealing ring, a first positioning bulge and a second positioning bulge are arranged in the second groove, and a third positioning bulge is arranged between the first positioning bulge and the second positioning bulge; the upper end of the third positioning protrusion is provided with a key, the upper end of the key is provided with a substrate, the key is used for supporting the substrate, the substrate comprises a first substrate, a second substrate and a third substrate, and the first substrate, the second substrate and the third substrate are sequentially connected at first positions to form a left end opening right end closing structure. According to the application, the third bulge and the fourth bulge are formed by cutting the two ends of the chip through CNC, so that the chip integrally forms a convex structure, and the requirement of thinner thickness or narrower width of the chip in the whole machine assembly structure is met.
Description
Technical Field
The application relates to the technical field of fingerprint modules, in particular to a waterproof fingerprint module.
Background
Along with the gradual acceptance of fingerprint identification technology by masses under the lead of the times, the fingerprint identification technology has become the standard of products such as mobile phones, lock bodies and the like, and meanwhile, the requirements of terminals and users on the waterproof performance of the products such as mobile phones, lock bodies and the like are gradually improved, the metal ring is cancelled, the cost is saved, and meanwhile, the thickness requirement on the whole machine is thinner and the width requirement is narrower.
Disclosure of Invention
The application aims to solve the problems that a fingerprint module without metal and with keys realizes a waterproof function and the requirement of thinner thickness or narrower width in the whole machine assembly structure, the structural base material only needs one group of base plates, and components and parts are arranged on the same surface of the base plates after the base plates are unfolded so as to facilitate production, and the complex structure of a traditional soft and hard combined plate, a switching hard plate and screw fixation is solved, so that the waterproof fingerprint module is provided;
in order to solve the technical problems, the application provides the following technical scheme:
the application provides a waterproof fingerprint module group,
the sealing ring, the chip and the shell are arranged on the shell in a penetrating manner, a first groove is formed in the shell in a penetrating manner, a first bulge is formed at the left end of the shell close to the first groove, a first plane section is formed at the lower surface of the first bulge, a second bulge is formed at the right end of the shell close to the first groove, a second plane section is formed at the lower surface of the second bulge, the chip is arranged on the shell through the first groove, a third bulge is formed at the left end of the chip, a third plane section is formed at the upper surface of the third bulge, a fourth bulge is formed at the right end of the chip, a fourth plane section is formed at the upper surface of the fourth bulge, the first bulge is attached to the third plane section through the first plane section, and the second bulge is attached to the fourth bulge through the second plane section;
the sealing ring is arranged at the lower end of the shell, a second groove is formed in the sealing ring, a positioning protrusion is arranged in the second groove, the positioning protrusion comprises a first positioning protrusion and a second positioning protrusion, a third groove is formed between the first positioning protrusion and the inner side wall of the left end of the sealing ring, a fourth groove is formed between the second positioning protrusion and the inner side wall of the right end of the sealing ring, a fifth groove is formed between the first positioning protrusion and the second positioning protrusion, and a third positioning protrusion is arranged in the fifth groove;
the upper end of the third positioning protrusion is provided with a key, the upper end of the key is provided with a substrate, the key is used for supporting the substrate, the substrate comprises a first substrate, a second substrate and a third substrate, the first substrate, the second substrate and the third substrate are sequentially connected at first positions to form a left end opening right end closing structure, a first filling adhesive layer is arranged between the upper end of the key and the lower surface of the third substrate, a first reinforcing layer, a second reinforcing layer and a third reinforcing layer are arranged between the first substrate and the third substrate, the first reinforcing layer and the second reinforcing layer are arranged up and down, and the third reinforcing layer is arranged on one side of the first reinforcing layer;
the lower surface of the chip is arranged at the upper end of the first substrate, and a second filling adhesive layer is arranged between the lower surface of the chip and the upper end of the first substrate.
Optionally, a first double-sided waterproof adhesive layer is disposed at the junction of the sealing ring and the housing, and the first double-sided waterproof adhesive layer is used for connecting the sealing ring and the housing, and sealing the junction of the sealing ring and the housing.
Optionally, a second double-sided waterproof glue layer is arranged between the upper surface of the first substrate and the lower surface of the shell, and the second double-sided waterproof glue layer is used for connecting the first substrate and the shell and sealing the junction of the first substrate and the shell;
a third double-sided waterproof adhesive layer is arranged between the lower surface of the third substrate and the upper surface of the sealing ring, and is used for connecting the third substrate with the sealing ring and sealing the joint of the third substrate and the sealing ring.
Optionally, a fourth double-sided waterproof glue layer is disposed between the lower surface of the first reinforcing layer and the upper surface of the second reinforcing layer, and the fourth double-sided waterproof glue layer is used for connecting the first reinforcing layer with the second reinforcing layer and sealing the junction of the first reinforcing layer and the second reinforcing layer.
Optionally, a sixth groove is formed in the lower end of the sealing ring in a penetrating manner, the sixth groove is communicated with the fourth groove, a heightening connector is arranged in the sixth groove, the upper end of the heightening connector is connected with the surface of the third substrate, and the lower end of the heightening connector extends to the outer surface of the sealing ring.
Optionally, a first extension section is disposed on the first substrate in the fourth groove, a second extension section is disposed on the third substrate in the fourth groove, the chip is pressed to drive the first substrate below the chip and the third substrate to move downwards, and then the key is driven to move downwards, the key is pressed to press the third positioning protrusion, the first substrate below the chip and the third substrate move downwards to pull the first extension section and the second extension section to extend, so that the first substrate and the third substrate at the upper end and the lower end of the third reinforcing layer are prevented from being pulled, and the first substrate and the third substrate at the upper end and the lower end of the third reinforcing layer are prevented from moving leftwards.
Optionally, the upper surface of chip is less than the upper surface of casing, the casing with the junction surface of chip is provided with first chamfer structure, first chamfer structure is used for preventing the casing scrapes the hand, the upper end surface of chip is provided with the second chamfer structure, the second chamfer structure is used for preventing the chip scrapes the hand.
Optionally, the first substrate, the second substrate and the third substrate are arranged as an integrated structure, or the first substrate and the third substrate are fixedly welded at the upper end and the lower end of the second substrate.
The application provides electronic equipment, which comprises an equipment body and the fingerprint module structure, wherein the fingerprint module is arranged on the equipment body.
The application has the beneficial effects that
(1) The assembly steps of the traditional waterproof fingerprint module without the metal ring are influenced by the thickness of the chip, and the assembly steps can only determine the assembly thickness by the height from the FPC to the surface of the chip, so that the assembly steps are limited from being thinned.
(2) The traditional waterproof fingerprint module without metal rings and with keys needs a soft and hard combined plate, a switching hard plate and screw fixation, is complex in structure, only needs one base plate, after the base plate is unfolded, the fingerprint chip and the electronic material are on the same surface of the base plate, and only needs one SMT welding so as to facilitate production, thereby solving the complex structure of the traditional soft and hard combined plate, the switching hard plate and screw fixation.
(3) In the prior art, the bottom of a second groove on a sealing ring is usually flat, a pressing chip drives a substrate and a key to integrally descend, the key is used for further pressing the sealing ring in the second groove, the structure can only press the center of the chip in the process of pressing the chip, when the end part of the chip is pressed and the pressing force is overlarge, one end of the chip is stressed and continuously pressed to cause the phenomenon that one end of the chip is sunken and the other end of the chip is tilted, the phenomenon is damaged on one hand, and the loosening is easily caused on the other hand.
Drawings
Fig. 1 is a cross-sectional view of the structure of the present application.
Fig. 2 is a structural cross-sectional view of the housing of the present application.
FIG. 3 is a cross-sectional view of a seal ring structure of the present application.
Fig. 4 is a cross-sectional view of a substrate structure according to the present application.
Fig. 5 is an enlarged view of a portion of a substrate according to the present application.
Fig. 6 is a cross-sectional view of a chip structure according to the present application.
Fig. 7 is a schematic diagram of an electronic device according to the present application.
Reference numerals illustrate: 1-sealing ring, 2-chip, 3-shell, 4-first groove, 5-first protrusion, 6-first planar segment, 7-second protrusion, 8-second planar segment, 9-third protrusion, 10-third planar segment, 11-fourth protrusion, 12-fourth planar segment, 13-second groove, 14-first positioning protrusion, 15-second positioning protrusion, 16-third groove, 17-fourth groove, 18-fifth groove, 19-third positioning protrusion, 20-key, 21-substrate, 22-first substrate, 23-second substrate, 24-third substrate, 25-first filled adhesive layer, 26-first reinforcing layer, 27-second reinforcing layer, 28-third reinforcing layer, 29-second filled adhesive layer, 30-first waterproof adhesive layer, 31-second double-sided waterproof adhesive layer, 32-third double-sided waterproof adhesive layer, 33-fourth double-sided waterproof adhesive layer, 34-sixth groove, 35-high extension connector, 36-first double-sided waterproof layer, 37-second double-sided waterproof segment.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Examples
As shown in fig. 1-7, the present application provides a waterproof fingerprint module,
the chip 2 is arranged on the shell 3 through the first groove 4, a first bulge 5 is arranged at the left end of the shell 3 near the first groove 4, a first plane section 6 is arranged on the lower surface of the first bulge 5, a second bulge 7 is arranged at the right end of the shell 3 near the first groove 4, a second plane section 8 is arranged on the lower surface of the second bulge 7, a third bulge 9 is arranged at the left end of the chip 2 through the first groove 4, a third plane section 10 is arranged on the upper surface of the third bulge 9, a fourth bulge 11 is arranged at the right end of the chip 2, a fourth plane section 12 is arranged on the upper surface of the fourth bulge 11, the first bulge 5 is attached to the third bulge 9 through the first plane section 6 and the third plane section 10, and the second bulge 7 is attached to the fourth bulge 11 through the second plane section 8 and the fourth plane section 12;
the sealing ring 1 is arranged at the lower end of the shell 3, a second groove 13 is formed in the sealing ring 1, a positioning protrusion is arranged in the second groove 13, the positioning protrusion comprises a first positioning protrusion 14 and a second positioning protrusion 15, a third groove 16 is formed between the first positioning protrusion 14 and the inner side wall at the left end of the sealing ring 1, a fourth groove 17 is formed between the second positioning protrusion 15 and the inner side wall at the right end of the sealing ring 1, a fifth groove 18 is formed between the first positioning protrusion 14 and the second positioning protrusion 15, and a third positioning protrusion 19 is arranged in the fifth groove 18;
the upper end of the third positioning protrusion 19 is provided with a key 20, the upper end of the key 20 is provided with a substrate 21, the key 20 is used for supporting the substrate 21, the substrate 21 comprises a first substrate 22, a second substrate 23 and a third substrate 24, the first substrate 22, the second substrate 23 and the third substrate 24 are sequentially connected at first positions to form a left end opening right end closing structure, a first filling adhesive layer 25 is arranged between the upper end of the key 20 and the lower surface of the third substrate 24, a first reinforcing layer 26, a second reinforcing layer 27 and a third reinforcing layer 28 are arranged between the first substrate 22 and the third substrate 24, a first reinforcing layer 26 and a second reinforcing layer 27 are arranged up and down, and the third reinforcing layer 28 is arranged on one side of the first reinforcing layer 26; the first reinforcing layer 26, the second reinforcing layer 27, and the third reinforcing layer 28 facilitate improvement of the structural strength of the entire substrate 21;
the lower surface of the chip 2 is arranged at the upper end of the first substrate 22, a second filling glue layer 29 is arranged between the lower surface of the chip 2 and the upper end of the first substrate 22,
in the use process, the two ends of the chip 2 are cut through CNC to form the third bulge 9 and the fourth bulge 11, so that the chip 2 integrally forms a convex structure, and the requirement of the chip 2 for realizing thinner thickness or narrower width in the whole machine assembly structure is met;
in the mounting process of the chip 2, due to the arrangement of the third groove 16, the chip 2 is firstly inserted into the third groove 16 through the third bulge 9, then the fourth bulge 11 is inserted into the lower end of the second bulge 7, the shell 3 and the chip 2 are attached to the third bulge 10 through the first plane section 6 and the first bulge 5 and the third bulge 9 through the first plane section 6, the second bulge 7 and the fourth bulge 11 are attached to the fourth plane section 12 through the second plane section 8, the arrangement of the third groove 16 is convenient for mounting the chip 2, and the arrangement of the first plane section 6, the second plane section 8, the third plane section 10 and the fourth plane section 12 is convenient for improving the tightness of the joint, preventing impurities and water from passing through the joint and then in the shell 3, and improving the overall protection;
it should be noted that, the assembly steps of the waterproof fingerprint module without metal rings in the past are affected by the thickness of the chip 2, the assembly steps can only determine the assembly thickness by the height from the FPC to the surface of the chip 2, thus the assembly steps are limited from being thinned, the two ends of the chip 2 are cut into the third bulge 9 and the fourth bulge 11 by CNC, so that the chip 2 integrally forms a convex structure, and the requirement of realizing thinner thickness or narrower width of the chip 2 in the whole machine assembly structure is met;
the traditional waterproof fingerprint module without metal rings and with keys 20 needs to be fixed by a soft and hard combined plate, a transfer hard plate and screws, has a complex structure, and the substrate only needs one substrate 21, after the substrate 21 is unfolded, the fingerprint chip 2 and the electronic material are on the same surface of the substrate 21, and the production is convenient only through one SMT welding, so that the complex structure of the traditional soft and hard combined plate, the transfer hard plate and the screws is solved;
it should be further noted that in the prior art, the bottom of the second groove 13 on the sealing ring 1 is usually flat, the pressing chip 2 drives the substrate 21 and the pressing key 20 to integrally descend, the pressing key 20 is further used for pressing the sealing ring 1 in the second groove 13, the structure can only press the center of the chip 2 in the process of pressing the chip 2, when the end of the chip 2 is pressed and the pressing force is overlarge, one end of the chip 2 is continuously pressed to cause the phenomenon that one end is sunk and the other end is tilted, the phenomenon causes damage to the chip 2, and on the other hand, looseness is easy to cause, and the first positioning protrusion 14, the second positioning protrusion 15 and the third positioning protrusion 19 are arranged to form support for the lower surface of the substrate 21, the third positioning protrusion 19 is used for forming support for the pressing key 20, no matter any position of the pressing chip 2, the first positioning protrusion 14, the second positioning protrusion 15 and the third positioning protrusion 19 can uniformly stress the substrate 21 and the whole chip 2, and the phenomenon that one end is sunk and the other end of the chip 2 are prevented from being tilted, and the phenomenon of loosening and abrasion is solved;
the joint of the sealing ring 1 and the shell 3 is provided with a first double-sided waterproof adhesive layer 30, the first double-sided waterproof adhesive layer 30 is used for connecting the sealing ring 1 and the shell 3 and sealing the joint of the sealing ring 1 and the shell 3, and the first double-sided waterproof adhesive layer 30 prevents external water sources from entering the shell 3 through the joint to damage internal components, so that the overall waterproof performance is improved;
a second double-sided waterproof glue layer 31 is disposed between the upper surface of the first substrate 22 and the lower surface of the housing 3, and the second double-sided waterproof glue layer 31 is used for connecting the first substrate 22 and the housing 3, and sealing the junction between the first substrate 22 and the housing 3;
a third double-sided waterproof glue layer 32 is arranged between the lower surface of the third substrate 24 and the upper surface of the sealing ring 1, the third double-sided waterproof glue layer 32 is used for connecting the third substrate 24 and the sealing ring 1, and sealing the junction of the third substrate 24 and the sealing ring 1 to improve the waterproof property;
a fourth double-sided waterproof glue layer 33 is disposed between the lower surface of the first reinforcing layer 26 and the upper surface of the second reinforcing layer 27, and the fourth double-sided waterproof glue layer 33 is used for connecting the first reinforcing layer 26 and the second reinforcing layer 27, and sealing the junction of the first reinforcing layer 26 and the second reinforcing layer 27;
the lower end of the sealing ring 1 is provided with a sixth groove 34 in a penetrating way, the sixth groove 34 is communicated with the fourth groove 17, a heightening connector 35 is arranged in the sixth groove 34, the upper end of the heightening connector 35 is connected with the surface of the third substrate 24, the lower end of the heightening connector 35 extends to the outer surface of the sealing ring 1, and the heightening connector is connected with a BTB female seat of the whole machine;
the first substrate 22 located in the fourth groove 17 is provided with a first extension section 36, the third substrate 24 located in the fourth groove 17 is provided with a second extension section 37, the first substrate 22 and the third substrate 24 below the chip 2 are driven to move downwards by pressing the chip 2, the key 20 is driven to move downwards, the key 20 contacts the third positioning protrusion 19, the first substrate 22 and the third substrate 24 below the chip 2 pull the first extension section 36 and the second extension section 37 to extend in the descending process, the first substrate 22 and the third substrate 22 at the upper end and the lower end of the third reinforcement layer are prevented from being pulled to move leftwards by pressing the first substrate 22 and the third substrate 24 at the upper end and the lower end of the third reinforcement layer, the first extension section 36 and the second extension section 37 are relatively to a straight structure, the straight structure drives the whole substrate 21 to move downwards in the descending process, the whole extension section 21 is driven to loosen, the whole substrate 21 is prevented from being loosened by the whole extension section 21, and the whole substrate 21 is prevented from being loosened due to the whole tensile force of the whole substrate 21 is prevented from being set, and the whole tensile force of the whole substrate 21 is prevented from being loosened due to the whole installation of the whole substrate 21 is left-length is prevented;
the upper surface of the chip 2 is lower than the upper surface of the shell 3, so that the chip 2 is prevented from forming a bulge on the shell 3, the bulge is easy to cause abrasion and collision to the chip 2 to cause damage on one hand, and on the other hand, a hand scraping phenomenon is caused in the operation process of the fingerprint module, a first chamfering structure is arranged on the surface of the joint of the shell 3 and the chip 2 and is used for preventing the shell 3 from scraping hands, a second chamfering structure is arranged on the upper end surface of the chip 2 and is used for preventing the chip 2 from scraping hands;
the corner of the chip 2 is sprayed at the inverted C angle of the peripheral ring by using CNC, the corner forms an arc, the scraping hand feeling is solved, meanwhile, the side surface of the chip 2 is sprayed, the color of the side surface of the chip 2 is consistent with that of the whole machine after the whole machine is assembled, and the appearance is better;
the first substrate 22, the second substrate 23, and the third substrate 24 are configured as an integrally formed structure, or the first substrate 22 and the third substrate 24 are fixedly welded at the upper and lower ends of the second substrate 23, in this embodiment, the first substrate 22, the second substrate 23, and the third substrate 24 are configured as an integrally formed structure, which is convenient for improving the overall structural strength;
the electronic equipment comprises an equipment body and the fingerprint module structure, wherein the fingerprint module is arranged on the equipment body, the electronic equipment comprises, but is not limited to, a mobile phone, a tablet personal computer, a notebook computer and the like, the fingerprint module can be arranged on any plane or curved surface of the electronic equipment, and the fingerprint module is electrically connected with the equipment body so as to transmit information such as identified fingerprints to the equipment body.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present application, and although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present application.
Claims (9)
1. A waterproof fingerprint module is characterized in that,
the sealing ring, the chip and the shell are arranged on the shell in a penetrating manner, a first groove is formed in the shell in a penetrating manner, a first bulge is formed at the left end of the shell close to the first groove, a first plane section is formed at the lower surface of the first bulge, a second bulge is formed at the right end of the shell close to the first groove, a second plane section is formed at the lower surface of the second bulge, the chip is arranged on the shell through the first groove, a third bulge is formed at the left end of the chip, a third plane section is formed at the upper surface of the third bulge, a fourth bulge is formed at the right end of the chip, a fourth plane section is formed at the upper surface of the fourth bulge, the first bulge is attached to the third plane section through the first plane section, and the second bulge is attached to the fourth bulge through the second plane section;
the sealing ring is arranged at the lower end of the shell, a second groove is formed in the sealing ring, a positioning protrusion is arranged in the second groove, the positioning protrusion comprises a first positioning protrusion and a second positioning protrusion, a third groove is formed between the first positioning protrusion and the inner side wall of the left end of the sealing ring, a fourth groove is formed between the second positioning protrusion and the inner side wall of the right end of the sealing ring, a fifth groove is formed between the first positioning protrusion and the second positioning protrusion, and a third positioning protrusion is arranged in the fifth groove;
the upper end of the third positioning protrusion is provided with a key, the upper end of the key is provided with a substrate, the key is used for supporting the substrate, the substrate comprises a first substrate, a second substrate and a third substrate, the first substrate, the second substrate and the third substrate are sequentially connected at first positions to form a left end opening right end closing structure, a first filling adhesive layer is arranged between the upper end of the key and the lower surface of the third substrate, a first reinforcing layer, a second reinforcing layer and a third reinforcing layer are arranged between the first substrate and the third substrate, the first reinforcing layer and the second reinforcing layer are arranged up and down, and the third reinforcing layer is arranged on one side of the first reinforcing layer;
the lower surface of the chip is arranged at the upper end of the first substrate, and a second filling adhesive layer is arranged between the lower surface of the chip and the upper end of the first substrate.
2. The waterproof fingerprint module of claim 1, wherein,
the junction of sealing washer with the casing is provided with first two-sided waterproof glue film, first two-sided waterproof glue film is used for connecting the sealing washer with the casing, and seal the sealing washer with the junction of casing.
3. The waterproof fingerprint module of claim 1, wherein,
a second double-sided waterproof adhesive layer is arranged between the upper surface of the first substrate and the lower surface of the shell, and is used for connecting the first substrate and the shell and sealing the joint of the first substrate and the shell;
a third double-sided waterproof adhesive layer is arranged between the lower surface of the third substrate and the upper surface of the sealing ring, and is used for connecting the third substrate with the sealing ring and sealing the joint of the third substrate and the sealing ring.
4. The waterproof fingerprint module of claim 1, wherein,
a fourth double-sided waterproof adhesive layer is arranged between the lower surface of the first reinforcing layer and the upper surface of the second reinforcing layer, and is used for connecting the first reinforcing layer with the second reinforcing layer and sealing the joint of the first reinforcing layer and the second reinforcing layer.
5. A waterproof fingerprint module as defined in claim 3, wherein,
the lower extreme of sealing washer runs through and has seted up the sixth recess, the sixth recess with the fourth recess is linked together, be provided with in the sixth recess and increase the connector, increase the upper end of connector with the surface connection of third base plate, increase the lower extreme of connector and extend to the surface of sealing washer.
6. The waterproof fingerprint module of claim 5, wherein,
the first substrate in the fourth groove is provided with a first extension section, the third substrate in the fourth groove is provided with a second extension section, the chip is pressed to drive the first substrate below the chip and the third substrate to move downwards, the key is further driven to move downwards, the key is pressed to touch the third positioning protrusion, the first substrate below the chip and the third substrate move downwards, the first extension section and the second extension section are pulled to extend, the first substrate and the third substrate at the upper end and the lower end of the third reinforcing layer are prevented from being pulled, and the first substrate and the third substrate at the upper end and the lower end of the third reinforcing layer are prevented from moving leftwards.
7. The waterproof fingerprint module of claim 1, wherein,
the upper surface of chip is less than the upper surface of casing, the casing with the junction surface of chip is provided with first chamfer structure, first chamfer structure is used for preventing the casing scrapes the hand, the upper end surface of chip is provided with the second chamfer structure, the second chamfer structure is used for preventing the chip scrapes the hand.
8. A waterproof fingerprint module as defined in claim 3, wherein,
the first substrate, the second substrate and the third substrate are arranged into an integrated structure, or the first substrate and the third substrate are fixedly welded at the upper end and the lower end of the second substrate.
9. An electronic device, characterized in that,
the electronic equipment comprises an equipment body and the fingerprint module set according to any one of claims 1-8, wherein the fingerprint module set is arranged on the equipment body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310672241.XA CN116685090A (en) | 2023-06-07 | 2023-06-07 | Waterproof fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310672241.XA CN116685090A (en) | 2023-06-07 | 2023-06-07 | Waterproof fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116685090A true CN116685090A (en) | 2023-09-01 |
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ID=87780613
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310672241.XA Pending CN116685090A (en) | 2023-06-07 | 2023-06-07 | Waterproof fingerprint module |
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| Country | Link |
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| CN (1) | CN116685090A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117218690A (en) * | 2023-09-26 | 2023-12-12 | 赣州深奥科技有限公司 | Spring arm type light guide fingerprint module structure |
-
2023
- 2023-06-07 CN CN202310672241.XA patent/CN116685090A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117218690A (en) * | 2023-09-26 | 2023-12-12 | 赣州深奥科技有限公司 | Spring arm type light guide fingerprint module structure |
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