CN106203404B - Fingerprint module and have its mobile terminal - Google Patents

Abstract

The invention discloses a fingerprint module and a mobile terminal with the same, wherein the fingerprint module comprises: the packaging layer is used for packaging the fingerprint identification component, and a first matching part is arranged on the rear wall surface of the packaging layer; and the decoration has an embedded groove, the packaging layer is embedded in the embedded groove, a second matching part is arranged in the embedded groove, and the first matching part and the second matching part are mutually embedded. According to the fingerprint module, the first matching part is arranged on the rear wall surface of the packaging layer, the second matching part which is mutually embedded with the first matching part is arranged in the embedding groove of the decorating part, and when the packaging layer is embedded in the embedding groove and the first matching part and the second matching part are mutually embedded, the thickness of the packaging layer and the decorating part along the front-back direction after being matched can be reduced, so that the thickness of the fingerprint module can be reduced, the ultra-thin design of the whole mobile terminal can be adapted, and the use requirements of users can be met.

Description

Fingerprint module and mobile terminal with same

technical field

The invention relates to the technical field of electronic equipment, in particular to a fingerprint module and a mobile terminal with the same.

Background technique

In related technologies, mobile terminals such as mobile phones are gradually becoming ultra-thin. However, if the thickness of each component in the fingerprint module of the mobile terminal cannot be reduced, it is difficult to reduce the thickness of mobile terminals such as mobile phones.

Contents of the invention

The present invention aims to solve one of the technical problems in the related art at least to a certain extent. For this reason, the present invention proposes a fingerprint module, and the fingerprint module has the advantage of small thickness.

The present invention also proposes a mobile terminal, which includes the above-mentioned fingerprint module.

The fingerprint module according to the embodiment of the present invention includes: an encapsulation layer for encapsulating the fingerprint recognition component, the rear wall of the encapsulation layer has a first matching portion; and a decoration, the decoration has an embedding groove, the The encapsulation layer is embedded in the embedding groove, and a second fitting part is arranged in the embedding groove, and the first fitting part and the second fitting part are fitted to each other.

According to the fingerprint module of the embodiment of the present invention, the first matching portion is provided on the rear wall surface of the packaging layer, and the second matching portion that is fitted with the first matching portion is provided in the embedding groove of the decoration, when the packaging layer is embedded It is arranged in the embedding groove, and when the first matching part and the second matching part are fitted with each other, the thickness of the encapsulation layer and the decorative part along the front and back directions can be reduced, thereby reducing the thickness of the fingerprint module, and further adapting to The ultra-thin design of the mobile terminal meets the needs of users.

According to some embodiments of the present invention, the first fitting portion is a protrusion formed on the rear wall of the encapsulation layer, the second fitting portion is a depression formed in the insertion groove, at least partially The raised portion is located in the recessed portion.

In some embodiments of the present invention, there is one raised portion.

In some embodiments of the present invention, one end of the circuit board assembly of the fingerprint module extends into the recess through the decoration, and the end of the circuit board assembly is attached to the raised portion on the free end face.

In some embodiments of the present invention, the circuit board assembly is provided with a ground terminal, the decoration is a conductive decoration, and the decoration is electrically connected to the ground terminal through the circuit board assembly.

In some embodiments of the present invention, a conductive member is interposed between the circuit board assembly and the inner bottom wall of the recessed portion.

In some embodiments of the present invention, an installation groove is provided on the bottom wall of the recess, and the conductive member is embedded in the installation groove.

In some embodiments of the present invention, the conductive member is conductive foam.

In some embodiments of the present invention, the circuit board assembly includes: a flexible circuit board, one end of the flexible circuit board protrudes into the recess, and the end of the flexible circuit board is connected to the protrusion The free end face of the flexible circuit board is bonded, the ground terminal is arranged on the flexible circuit board; and the reinforcing plate is bonded to the flexible circuit board and electrically connected to the flexible circuit board, and The reinforcement board is located on a side of the flexible circuit board away from the encapsulation layer, and the conductive member is electrically connected to the reinforcement board.

A mobile terminal according to an embodiment of the present invention includes the above-mentioned fingerprint module.

According to the mobile terminal of the embodiment of the present invention, by setting the above-mentioned fingerprint module, the thickness of the mobile terminal can be reduced to meet the ultra-thin requirement of the mobile terminal.

Description of drawings

Fig. 1 is a schematic structural diagram of a fingerprint module according to an embodiment of the present invention;

Fig. 2 is an exploded diagram of a fingerprint module according to an embodiment of the present invention;

Fig. 3 is an exploded view of a fingerprint module according to an embodiment of the present invention;

Fig. 4 is a cross-sectional view of a fingerprint module according to an embodiment of the present invention.

Reference signs:

fingerprint module 100,

Encapsulation layer 1, raised portion 11,

Decorative part 2, embedding groove 21, recessed part 22, via hole 23, installation groove 24, sealing groove 25,

circuit board assembly 3, flexible circuit board 31, reinforcement board 32,

Conductive element 4, cover plate 5, fingerprint pressing plate 6, sealing element 7.

Detailed ways

Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "transverse", "thickness", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", "axial", "radial", and "circumferential" are based on the orientation or positional relationship shown in the drawings, and are only In order to facilitate the description of the present invention and simplify the description, it does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless specifically defined otherwise.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; can be mechanically connected, can also be electrically connected or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediary, can be the internal communication of two components or the interaction relationship between two components, Unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The following describes a fingerprint module 100 according to an embodiment of the present invention with reference to FIGS. 1-4 .

As shown in FIGS. 1-4 , a fingerprint module 100 according to an embodiment of the present invention includes an encapsulation layer 1 and a decoration 2 .

Specifically, the encapsulation layer 1 is used for encapsulating the fingerprint recognition component, and the rear wall surface (rear side as shown in FIG. There is an embedding groove 21 in which the encapsulation layer 1 is embedded. A second matching portion (a recessed portion 22 as described below) is provided in the embedding groove 21 . The first engaging portion and the second engaging portion are engaged with each other. Thus, when the encapsulation layer 1 is embedded in the embedding groove 21, and the first mating portion and the second mating portion are engaged with each other, it is possible to reduce the mating of the encapsulation layer 1 and the decorative part 2 along the front and rear directions (as shown in FIG. 4 ). The thickness of the fingerprint module 100 can be reduced, thereby adapting to the ultra-thin design of the mobile terminal and meeting the needs of users.

According to the fingerprint module 100 of the embodiment of the present invention, a first matching portion is provided on the rear wall surface of the encapsulation layer 1, and a second matching portion is provided in the embedding groove 21 of the decoration 2 to fit with the first matching portion. When the encapsulation layer 1 is embedded in the embedding groove 21, and the first mating part and the second mating part are engaged with each other, the thickness of the encapsulation layer 1 and the decorative part 2 along the front and back direction after mating can be reduced, thereby reducing fingerprints The thickness of the module 100 can further adapt to the ultra-thin design of the mobile terminal and meet the needs of users.

In some embodiments of the present invention, as shown in FIGS. 2-4 , the first matching portion is a raised portion 11 formed on the rear wall surface of the encapsulation layer 1 (rear as shown in FIG. 4 ), and the second matching portion The part is a recessed part 22 formed in the insertion groove 21, and at least part of the protruding part 11 is located in the recessed part 22. Therefore, when assembling the encapsulation layer 1 and the decorative part 2, at least part of the raised part 11 is embedded in the recessed part 22, the thickness of the decorative part 2 and the encapsulation layer 1 along the front and rear direction can be reduced after assembly, thereby reducing the The thickness of the small fingerprint module 100 can further adapt to the ultra-thin design of the mobile terminal and meet the needs of users.

For example, in the example shown in FIG. 3 and FIG. 4 , the rear wall surface of the encapsulation layer 1 has a first fitting portion, the first fitting portion is formed as a raised portion 11, the decorative part 2 has an embedding groove 21, and the encapsulation layer 1 is arranged on Embedding in the groove 21, the bottom wall of the embedding groove 21 is provided with a second matching portion, the second matching portion is formed as a concave portion 22, the convex portion 11 is located in the concave portion 22, the side wall surface of the convex portion 11 is in contact with the surface of the packaging layer 1 The rear wall surface forms a first stepped surface, the bottom wall of the insertion groove 21 and the side wall of the recessed part 22 form a second stepped surface, and the first stepped surface and the second stepped surface are engaged, thereby limiting the direction of the packaging layer 1 in the backward direction. Displacement, so as to ensure the reliability of the fingerprint module 100 work. And when the thickness of the protruding portion 11 along the front-back direction is a, the overall thickness of the fingerprint module 100 can be reduced by a.

Specifically, as shown in FIG. 3 , there is one raised portion 11 . Thus, the structure and processing technology of the encapsulation layer 1 can be simplified, the production cycle can be saved, and the production cost can be reduced. For example, in the example shown in FIG. 3 , the rear wall surface of the encapsulation layer 1 is provided with a raised portion 11, and the raised portion 11 is one and is located at the center of the encapsulation layer 1. When processing the encapsulation layer 1, it can be processed first. The encapsulation layer 1 with uniform thickness is then processed with a circle of steps along the circumferential direction on the rear wall of the encapsulation layer 1 .

In some embodiments of the present invention, as shown in FIG. 4 , one end of the circuit board assembly 3 of the fingerprint module 100 extends into the concave portion 22 through the decoration 2 , and the end of the circuit board assembly 3 is attached to the protrusion. On the free end surface of the raised portion 11 (the rear end surface of the raised portion 11 as shown in FIG. 4 ). For example, in the examples shown in FIGS. 2-4 , a through hole 23 is provided on the bottom wall of the recessed part 22 , and one end of the circuit board assembly 3 extends into the recessed part through the through hole 23 on the decorative part 2 22 , the circuit board assembly 3 protruding into the recessed portion 22 is attached to the free end surface of the raised portion 11 . When the circuit board assembly 3 is attached to the free end surface of the raised portion 11, on the one hand, the raised portion 11 can protect the circuit board assembly 3 to a certain extent, and can prevent impurities in the air from corroding the circuit and causing electric shock. On the other hand, it can also ensure the tight connection between the fingerprint recognition component in the packaging layer 1 and the circuit board component 3 , and ensure the reliability of the fingerprint module 100 .

Optionally, the circuit board assembly 3 is provided with a ground terminal, the decoration 2 is a conductive decoration 2 , and the decoration 2 is electrically connected to the ground terminal through the circuit board assembly 3 . Thus, the decorative part 2 can be grounded through the grounding terminal on the circuit board assembly 3 , preventing adverse effects of the static electricity of the decorative part 2 on the fingerprint module 100 . It should be noted that static electricity will be generated when the decorative part 2 touches or rubs with external objects, and the static electricity in the decorative part 2 will have a bad influence on the fingerprint module 100 .

Further, as shown in FIGS. 2-4 , a conductive member 4 is interposed between the circuit board assembly 3 and the inner bottom wall of the recessed portion 22 . Thus, the circuit board assembly 3 and the decorative part 2 can be electrically connected indirectly through the conductive part 4, which can make the structural arrangement between the circuit board assembly 3 and the decorative part 2 more reasonable.

Furthermore, as shown in FIG. 2 and FIG. 4 , an installation groove 24 is formed on the bottom wall of the recessed portion 22 , and the conductive member 4 is embedded in the installation groove 24 . The installation groove 24 can play a position-limiting effect on the conductive part 4, preventing the conductive part 4 from moving on the bottom wall of the recessed part 22, thereby ensuring that the conductive part 4 and the inner bottom wall of the recessed part 22 and the conductive part 4 and the circuit board Reliability of connections between components 3.

Specifically, the conductive member 4 may be conductive foam. Conductive foam is a conductive cloth wrapped on a flame-retardant sponge. After a series of treatments, it has good surface conductivity and can be easily fixed on the device to be shielded with adhesive tape. The cost of using conductive foam is low, the processing technology is simple, and the reliability of grounding can be guaranteed at the same time. When the circuit board assembly 3 and the decorative part 2 are assembled, the conductive foam between the circuit board assembly 3 and the decorative part 2 has a certain amount of compression, which can ensure that between the conductive foam and the decorative part 2 and between the conductive foam and the decorative part 2 The reliable connection between the circuit board components 3 ensures a good grounding of the decorative part 2 and prevents the static electricity of the decorative part 2 from adversely affecting the fingerprint module 100 .

In some embodiments of the present invention, as shown in FIGS. 2-4 , the circuit board assembly 3 includes a flexible circuit board 31 and a reinforcing board 32 . One end of the flexible circuit board 31 extends into the recessed portion 22 , and the end of the flexible circuit board 31 is attached to the free end surface of the raised portion 11 (the rear end surface of the raised portion 11 as shown in FIG. 4 ). On the one hand, the protruding part 11 can protect the flexible circuit board 31 to a certain extent, preventing impurities in the air from corroding the circuit and causing electrical performance degradation; The tight connection of the flexible circuit board 31 ensures the reliability of the fingerprint module 100 . The ground terminal is arranged on the flexible circuit board 31, the reinforcement board 32 is attached to the flexible circuit board 31 and is electrically connected with the flexible circuit board 31, and the reinforcement board 32 is located on the side of the flexible circuit board 31 away from the packaging layer 1 ( As shown in the rear side of FIG. 4 ), the conductive member 4 is electrically connected to the reinforcing plate 32 (that is, the reinforcing plate 32 is a conductive component). The reinforcement board 32 can enhance the structural strength of the flexible circuit board 31, prevent the flexible circuit board 31 from bending, etc., thereby ensuring the reliability of the operation of the flexible circuit board 31, and at the same time, the reinforcement board 32 and the flexible circuit board 31 can be electrically connected, The conductive element 4 is electrically connected to the reinforcing plate 32 to realize the electrical connection between the decorative element 2 and the flexible circuit board 31 . Therefore, the electrical connection between the decoration part 2 and the ground terminal through the flexible circuit board 31 can be realized, thereby avoiding the bad influence of the static electricity of the decoration part 2 on the fingerprint module 100 .

In some embodiments of the present invention, as shown in FIG. 4 , a sealing member 7 is sleeved on the outer peripheral wall of the decoration member 2 . When the fingerprint module 100 is installed on a mobile terminal such as a mobile phone, it can prevent sweat or other liquids from intruding into the mobile terminal and damaging components inside the mobile terminal, thereby ensuring the reliability of the mobile terminal.

Further, as shown in FIG. 4 , a sealing groove 25 is provided on the outer peripheral wall of the decoration part 2 , and the sealing part 7 is embedded in the sealing groove 25 . Therefore, it is possible to prevent the sealing member 7 from moving along the axial direction of the decorative member 2 (the front-rear direction as shown in FIG. 4 ), thereby ensuring the reliability of the sealing.

In some embodiments of the present invention, as shown in FIGS. 2-4 , the fingerprint module 100 further includes a cover plate 5, which is arranged in the embedding groove 21 and is located on the front side of the encapsulation layer 1 (as shown in FIG. 4 ). front side shown). On the one hand, the cover plate 5 can further protect the fingerprint recognition component and the circuit board component 3 , and on the other hand, the cover plate 5 can also increase the aesthetics of the fingerprint module 100 .

Optionally, the cover plate 5 can be a glass cover plate 5 or a ceramic cover plate 5 , the glass cover plate 5 or the ceramic cover plate 5 has high gloss, which can improve the aesthetics of the fingerprint module 100 .

The following describes a fingerprint module 100 according to a specific embodiment of the present invention with reference to FIGS. 1-4 . The following description is only exemplary and intended to explain the present invention, but should not be construed as a limitation of the present invention.

As shown in FIGS. 1-4 , a fingerprint module 100 according to an embodiment of the present invention includes an encapsulation layer 1 , a decoration 2 , a circuit board assembly 3 , and a cover 5 .

Specifically, as shown in FIG. 3 and FIG. 4 , the encapsulation layer 1 is used to encapsulate the fingerprint recognition component, and the rear wall surface of the encapsulation layer 1 is provided with a first mating portion, and the first mating portion is formed on the rear wall surface of the encapsulation layer 1. The raised portion 11 is one and is located in the middle of the encapsulation layer 1. When the raised portion 11 is processed, a circle of steps can be processed along the circumferential direction of the encapsulation layer 1. The encapsulation layer 1 and the rear wall surface and the raised portion The side wall surface of the raised portion 11 forms a first stepped surface. As shown in Fig. 2 and Fig. 4, the decorative part 2 has an embedding groove 21, the encapsulation layer 1 is arranged in the embedding groove 21, and a second fitting part is arranged in the embedding groove 21, and the second fitting part is formed in the embedding groove 21. The concave portion 22 , the protruding portion 11 is located in the concave portion 22 . The bottom wall of the insertion groove 21 and the side wall of the recessed portion 22 form a second stepped surface, and the first stepped surface engages with the second stepped surface. After the decoration part 2 and the encapsulation layer 1 are assembled, the thicknesses of the decoration part 2 and the encapsulation layer 1 in the front and back direction can be reduced, thereby reducing the thickness of the fingerprint module 100, which can further meet the requirements of ultra-thin mobile terminals.

It should be noted that when the thickness of the protruding portion 11 along the front-rear direction is a, the thickness of the decorative part 2 and the encapsulation layer 1 after assembly can be reduced by a in the front-rear direction. For example, when the thickness of the protruding portion 11 along the front-rear direction is 0.2 mm, the thickness of the decorative part 2 and the encapsulation layer 1 can be reduced by 0.2 mm in the front-rear direction after being assembled.

As shown in Figures 2-4, the circuit board assembly 3 includes a flexible circuit board 31 and a reinforcement board 32, and a via hole 23 is provided on the bottom wall of the recessed part 22 of the decorative part 2, through which one end of the flexible circuit board 31 passes. The hole 23 protrudes into the recessed portion 22 , and the end of the flexible circuit board 31 protruding into the recessed portion 22 is attached to the free end surface of the raised portion 11 (ie, the rear wall of the raised portion 11 ). On the one hand, the encapsulation layer 1 can protect the flexible circuit board 31, and can prevent impurities in the air from corroding the circuit and causing electrical performance degradation; The tight connection of the flexible circuit board 31 ensures the reliability of the fingerprint module 100 . The reinforcing plate 32 can be a reinforcing steel plate, and the reinforcing plate 32 is attached to the side of the flexible circuit board 31 away from the packaging layer 1 and is electrically connected to the flexible circuit board 31, that is, the reinforcing plate 32 is attached to the flexible circuit board 31 on the rear wall. The reinforcing plate 32 can strengthen the structural strength of the flexible circuit board 31 and prevent the flexible circuit board 31 from being bent and damaged.

In addition, as shown in Figures 2-4, the decorative part 2 is a conductive metal part, the other end of the flexible circuit board 31 (the end that does not extend into the recessed part 22) is provided with a grounding terminal, and the reinforcing plate 32 and the recessed part 22 A conductive piece 4 is provided between the inner bottom wall of the hood, and the decorative piece 2 is electrically connected to the ground terminal through the conductive piece 4, the reinforcing plate 32 and the flexible circuit board 31, so as to realize the purpose of grounding the decorative piece 2 and prevent the static electricity of the decorative piece 2. produce adverse effects on the fingerprint module 100 . Wherein, the conductive member 4 is conductive foam, the shape of the cross-section of the conductive foam is rectangular, and the bottom wall of the recess 22 is provided with a mounting groove 24 with a rectangular cross-section, and the conductive foam is embedded in the mounting groove 24, Thus, the conductive foam can be prevented from moving, thereby ensuring the reliability of the electrical connection between the decorative part 2 and the flexible circuit board 31 .

As shown in FIG. 4 , the cover plate 5 is a glass cover plate 5 . The cover plate 5 is disposed in the embedding groove 21 and is located on the front side of the encapsulation layer 1 . The cover plate 5 can block the front opening of the embedding groove 21 . The cover plate 5 can not only further protect the circuit board assembly 3 , but also increase the aesthetics of the fingerprint module 100 .

As shown in Figure 4, the outer peripheral wall of the decorative part 2 is covered with a sealing member 7, and the sealing member 7 is embedded in the sealing groove 25 on the outer peripheral wall of the decorative part 2. When the fingerprint module 100 is installed on a mobile terminal such as a mobile phone, During this time, sweat or other liquids on hands can be prevented from intruding into the interior of the mobile terminal and damaging components inside the mobile terminal, thereby ensuring the reliability of the operation of the mobile terminal.

As shown in FIGS. 2-4 , the fingerprint module 100 also includes a fingerprint pressing plate 6 , which is arranged on the rear side of the decorative part 2 .

In the process of processing the fingerprint module 100, the cover plate 5, the packaging layer 1, the flexible circuit board 31 and the reinforcing plate 32 can be processed together, and then the conductive foam is pasted into the installation groove 24 of the decorative part 2, and the The processed cover plate 5 , encapsulation layer 1 , flexible circuit board 31 and reinforcing plate 32 are assembled together with the processed decorative part 2 by dispensing around a circle of glue and maintained under pressure. At the same time, through dispensing assembly, the conductive foam between the reinforcing plate 32 and the decorative part 2 passes a certain amount of compression, and after dispensing and maintaining pressure for a certain period of time, the glue is cured to ensure good grounding between the two.

According to the fingerprint module 100 of the embodiment of the present invention, a circle of steps is processed on the rear wall surface of the encapsulation layer 1 to form a raised portion 11, and the raised portion 11 is glued to the recessed portion 22 of the decoration 2 to fix it, so that the packaging can be reduced. The thickness of the layer 1 and the decorative part 2 in the front-back direction after assembly reduces the thickness of the fingerprint module 100 .

A mobile terminal according to an embodiment of the present invention includes the above-mentioned fingerprint module 100 .

According to the mobile terminal of the embodiment of the present invention, by setting the above fingerprint module 100, the thickness of the mobile terminal can be reduced to meet the ultra-thin requirement of the mobile terminal.

In some embodiments of the present invention, the mobile terminal can be a mobile phone, a tablet computer, or a notebook computer, etc. After the mobile phone, tablet computer, or notebook computer adopts the above-mentioned fingerprint module 100, its thickness can be reduced to meet its ultra-thin requirements. Require.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Claims (7)

1. A kind of 1. fingerprint module, it is characterised in that including：

   For encapsulating the encapsulated layer of fingerprint recognition component, there is the first auxiliary section on the rear surface of the encapsulated layer, described first Auxiliary section is the lug boss to be formed on the rear surface of the encapsulated layer；With

   Decoration, the decoration have embedded groove, and the encapsulated layer is embedded in the embedded groove, is provided with the embedded groove Second auxiliary section, second auxiliary section are the depressed part to be formed in the embedded groove, at least partly the boss in In the depressed part, the side wall of the lug boss and the rear surface of the encapsulated layer form First terrace, the embedded groove Bottom wall and the side wall of the depressed part form second step face, the First terrace and second step face engaging, institute The one end for stating the circuit board assemblies of fingerprint module is stretched in the depressed part through the decoration, the circuit board assemblies End is sticked in the free end end face of the lug boss, and the circuit board assemblies are provided with ground terminal, and the decoration is Conductive decoration, the decoration are electrically connected by the circuit board assemblies with the ground terminal.
2. 2. fingerprint module according to claim 1, it is characterised in that the lug boss is one.
3. 3. fingerprint module according to claim 1, it is characterised in that the interior bottom of the circuit board assemblies and the depressed part Electric-conductor is folded between wall.
4. 4. fingerprint module according to claim 3, it is characterised in that the bottom wall of the depressed part is provided with mounting groove, institute Electric-conductor is stated to be embedded in the mounting groove.
5. 5. fingerprint module according to claim 3, it is characterised in that the electric-conductor is conducting foam.
6. 6. fingerprint module according to claim 3, it is characterised in that the circuit board assemblies include：

   Flexible PCB, one end of the flexible PCB is stretched in the depressed part, and the end of the flexible PCB It is bonded with the free end end face of the lug boss, the ground terminal is located on the flexible PCB；With

   Stiffening plate, the stiffening plate is fitted on the flexible PCB and electrically connected with the flexible PCB, and the benefit Strong plate is located at the side of the remote encapsulated layer of the flexible PCB, and the electric-conductor electrically connects with the stiffening plate.
7. 7. a kind of mobile terminal, it is characterised in that including the fingerprint module according to any one of claim 1-6.