CN116682761A - Glue removing device - Google Patents

Abstract

The application relates to a photoresist removing device, which comprises a photoresist removing working cavity formed in a photoresist removing working table, wherein the photoresist removing working cavity is used for accommodating a chip to be photoresist removed; a controller; the photoresist removing execution device is arranged on the photoresist removing workbench and can output photoresist removing light beams into the photoresist removing working cavity, and the photoresist removing execution device is electrically connected with the controller; the thickness measuring and transmitting device is arranged on the photoresist stripping workbench and is used for generating thickness measuring light rays to the chip; and the thickness measuring receiving equipment is arranged on the photoresist stripping workbench and is used for receiving thickness measuring light reflected by the chip, and the thickness measuring transmitting equipment and the thickness measuring receiving equipment are respectively and electrically connected with the controller. The whole process of the photoresist removing device work of this scheme need not the manpower and intervenes, can effectively promote photoresist removing operation efficiency and chip thickness measurement efficiency, and can guarantee thickness measurement precision, makes photoresist get rid of thoroughly when guaranteeing chip safety, avoids causing the influence to the processingquality of chip follow-up process flow.

Description

Glue removal device

technical field

The present application relates to the technical field of chip processing, in particular to a glue removing device.

Background technique

As the control center, the chip is widely equipped in various intelligent interactive devices or automatic processing equipment, and its performance will greatly affect the working performance and stability of intelligent interactive devices and automatic processing equipment. In the chip manufacturing process, it involves a process of etching with photoresist. After the etching process is completed, the excess photoresist is no longer needed. At this time, it is necessary to remove the excess photoresist before removing the chip. It is sent to the subsequent process flow to avoid the photoresist from interfering with the processing quality of the subsequent process flow.

At present, the removal of photoresist is usually completed by automatic processing with deglue equipment, but the degree of photoresist removal and whether it is completely removed still needs to be manually judged based on the experience of the process engineer and frequent shutdowns to test the thickness of the chip. The operation is cumbersome, time-consuming and labor-intensive, which affects the efficiency of the glue removal operation. Second, the length of the glue removal cannot be accurately grasped. If the time is too long, it will cause damage to the chip surface. If the time is too short, the photoresist will not be removed cleanly and thoroughly.

Contents of the invention

Based on this, it is necessary to provide a glue removal device for the problems that the operation is time-consuming and labor-intensive, affects the efficiency of the glue removal operation, easily causes chip damage, and does not remove the photoresist cleanly.

The application provides a glue removal device, which includes:

A glue-removing workbench, the inside of the glue-removing workbench is formed with a glue-removing working chamber, and the glue-removing working chamber is used to accommodate chips to be glued;

controller;

Glue removal execution equipment, the glue removal execution equipment is installed on the glue removal workbench and can output glue removal light beams into the glue removal working chamber, and the glue removal execution equipment is electrically connected with the controller ;

Thickness measuring and transmitting equipment, the thickness measuring and transmitting equipment is installed on the deglue workbench, and the thickness measuring and transmitting equipment is used to generate thickness measuring light to the chip; and,

Thickness measurement receiving device, the thickness measurement receiving device is installed on the glue removal workbench, the thickness measurement receiving device is used to receive the thickness measurement light reflected by the chip, and the thickness measurement emits The device and the thickness measuring receiving device are respectively electrically connected to the controller.

The deglue device of the above scheme is applied to the processing occasion of removing the photoresist on the chip. When working, first put the chip to be deglue into the deglue working chamber of the degumming workbench, and then turn on the degumming execution equipment. At the same time or after a period of time, start the thickness measurement transmitting device and the thickness measurement receiving device. The glue removal execution device can emit a glue removal beam to the chip, so as to ablate and remove the photoresist on the chip surface. During this process, the thickness measurement The transmitting device emits thickness measuring light to the surface of the chip synchronously. The thickness measuring light is reflected after touching the chip and returns to the thickness measuring receiving device. The time of the equipment can calculate the real-time thickness value of the chip at this time. When the real-time thickness value is equal to the pre-stored chip thickness value in the controller, the controller will immediately send a stop command to the glue removal execution device, thereby immediately shutting down the glue removal execution The equipment continues to emit glue-removing light beams to the chip surface to avoid damage caused by the glue-removing beam touching the chip surface. Compared with the existing manual thickness measurement operation method, the glue-removing device of this solution does not require human intervention throughout the work, which can effectively improve The efficiency of deglue operation and the efficiency of chip thickness measurement can ensure the accuracy of thickness measurement, ensure the safety of the chip and completely remove the photoresist, so as to avoid affecting the processing quality of the subsequent process of the chip.

The technical scheme of the present application is described further below:

In one of the embodiments, the thickness measurement emitting device includes a thickness measurement light transmitter, and the thickness measurement receiving device includes a thickness measurement light receiver, and the thickness measurement light transmitter and the thickness measurement light receiver are respectively set The thickness-measuring light transmitter and the thickness-measuring light receiver are arranged on opposite sides of the glue-removing execution device and are inclined to the table top of the glue-removing workbench.

In one of the embodiments, the thickness measuring and transmitting device further includes a first vacuum isolation valve, and the first vacuum isolation valve is installed on the thickness measuring light transmitter.

In one of the embodiments, the thickness measurement receiving device further includes a second vacuum isolation valve, and the second vacuum isolation valve is installed on the thickness measurement light receiver.

In one of the embodiments, the glue removal workbench includes a carrier and a workbench body, the carrier is movably arranged on the top surface of the workbench body, the glue removal execution equipment, the thickness measuring The transmitting device and the thickness-measuring receiving device are installed on the carrier respectively.

In one of the embodiments, the top surface of the main body of the workbench is provided with a first track and a second track, the first track and the second track are rubber arranged and connected to each other, and the bottom of the carrier is installed There is a moving block, and the moving block is movably installed on the first track or the second track.

In one of the embodiments, the carrier is provided with an annular track surrounding the carrier and parallel to the table surface of the workbench body, and the first rotating assembly and the second rotating assembly are movably installed on the annular track. A rotating assembly, the thickness measuring transmitting device is installed on the first rotating assembly and can rotate in a vertical plane, and the thickness measuring receiving device is installed on the second rotating assembly and can rotate in a vertical plane .

In one of the embodiments, both the first rotating assembly and the second rotating assembly include a seat body, a damping sleeve and a rotating body, the seat body is installed on the carrier, and the seat body is provided There is a rotating hole, the rotating body is provided with a rotating shaft part, and the rotating shaft part is rotatably inserted in the rotating hole, and the damping sleeve is sleeved between the rotating shaft part and the wall of the rotating hole.

In one of the embodiments, the glue removal device further includes a support table and a clamp, the support table is installed in the glue removal working chamber, and the clamp is arranged on the table of the support table and used for clamping and fixing The chips to be glued.

In one of the embodiments, the deglue performing device adopts a plasma generator.

Description of drawings

The drawings constituting a part of the application are used to provide further understanding of the application, and the schematic embodiments and descriptions of the application are used to explain the application, and do not constitute an improper limitation to the application.

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is an axonometric structural view of a glue removing device according to an embodiment of the present application.

FIG. 2 is a front structural view of FIG. 1 .

FIG. 3 is a top structural view of FIG. 2 .

Explanation of reference signs:

100. Degumming device; 10. Degumming workbench; 11. Degumming working chamber; 12. Carrier; 13. Workbench main body; 20. Degumming execution equipment; Transmitter; 32. First vacuum isolating valve; 40. Thickness measuring receiving device; 41. Thickness measuring light receiver; 42. Second vacuum isolating valve; 50. Support platform; 60. Fixture; 200. Chip.

Detailed ways

In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

In the description of the present application, it should be understood that if any of these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", " Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the application.

In addition, if these terms "first" and "second" appear, these terms are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

In this application, unless otherwise clearly specified and limited, if any terms such as "mounted", "connected", "connected" and "fixed" appear, these terms should be interpreted in a broad sense. For example, it can be a fixed connection, or a detachable connection, or integrated; it can be a mechanical connection, or it can be an electrical connection; it can be a direct connection or an indirect connection through an intermediary, or it can be the internal communication of two components Or the interaction relationship between two elements, unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise clearly specified and limited, if there is a similar description that the first feature is "on" or "under" the second feature, the meaning may be that the first and second features are in direct contact, or The first and second features are in indirect contact through an intermediary. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

It should be noted that, if an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions are used for purposes of illustration only and are not intended to be exclusive implementation.

Referring to FIG. 1 to FIG. 3 , a glue removal device 100 shown in an embodiment of the present application includes a glue removal workbench 10 , a controller, a glue removal execution device 20 , a thickness measurement transmitting device 30 and a thickness measurement receiving device 40 .

The glue-removing workbench 10 adopts a box-shaped structure design, the structure is simple and regular, and the manufacturing cost is low. Therefore, a glue-removing work chamber 11 is formed inside the glue-removing workbench 10. Chip 200. Generally speaking, only one chip 200 is usually installed in the glue-removing working chamber 11 once or in one processing cycle; of course, two or more chips 200 can also be installed at the same time, thereby improving the single processing cycle of the glue-removing device 100. processing capacity, reduce downtime for frequent loading and unloading of the chip 200, and improve the processing efficiency of the chip 200.

It is easy to understand that the installation and removal of the chip 200 can be done manually, or automatically by automatic loading and unloading equipment (such as loading and unloading manipulators, etc.), which can be flexibly selected according to actual needs.

The glue removal execution device 20 is installed on the glue removal workbench 10 and can output the glue removal light beam into the glue removal working chamber 11 , and the glue removal execution device 20 is electrically connected with the controller. For example, the deglue performing device 20 in this embodiment adopts a plasma generator. That is, the above-mentioned glue-removing beam is specifically a plasma beam. The plasma generator can emit a plasma beam to the chip 200 , and the plasma beam has a good effect on photoresist removal, which helps to improve photoresist removal efficiency and removal cleanliness.

Please continue to refer to FIG. 2 , in addition, the thickness measuring transmitting device 30 is installed on the glue removing workbench 10, and the thickness measuring emitting device 30 is used to generate thickness measuring light to the chip 200; the thickness measuring receiving device 40 is installed on the glue removing workbench 10 , the thickness measurement receiving device 40 is used to receive the thickness measurement light reflected by the chip 200 , and the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 are respectively electrically connected to the controller.

It should be noted that the thickness measuring light emitted by the film thickness emitting device and received by the film thickness receiving device is specifically X-rays. Therefore, the working principle for measuring the thickness of the chip 200 can be briefly described as: using the penetrating ability of X-rays to detect substances. When X-rays pass through a material, they interact with atoms inside the material, including scattering and absorption. Atoms near the surface of the material interact strongly with X-rays and scatter, and the impact is relatively small, while atoms in the depths scatter less and mainly absorb. Therefore, using the energy absorbed by the X-rays inside the material and the resulting attenuation and scattering, the thickness of the material can be determined.

In summary, the implementation of the technical solution of this embodiment will have the following beneficial effects: the adhesive removal device 100 of the above solution is applied to the processing occasion of removing the photoresist on the chip 200, and the chip 200 to be removed is first put into the In the glue removal working chamber 11 of the glue workbench 10, the glue removal execution device 20 is started immediately, and at the same time or after a period of time, the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 are started. 200 emits a glue-removing light beam to ablate and remove the photoresist on the surface of the chip 200. During this process, the thickness measuring and emitting device 30 synchronously emits a thickness measuring light to the surface of the chip 200, and the thickness measuring light is reflected after touching the chip 200 and Returning to the thickness measuring receiving device 40, the controller can calculate the real-time thickness value of the chip 200 at this time according to the time when the thickness measuring emitting device 30 emits the thickness measuring light and the time when the thickness measuring light reaches the thickness measuring receiving device 40. When the thickness value is equal to the chip 200 thickness value pre-stored in the controller, the controller immediately sends a stop command to the glue removal execution device 20, thereby immediately shutting down the glue removal execution device 20 and continuing to emit glue removal beams to the surface of the chip 200 to avoid glue removal The light beam touches the surface of the chip 200 to cause damage, and compared with the existing manual thickness measurement operation method, the deglue device 100 of this solution does not require human intervention throughout the work, which can effectively improve the efficiency of the deglue operation and the thickness measurement efficiency of the chip 200. Moreover, the thickness measurement accuracy can be guaranteed, and the photoresist can be completely removed while ensuring the safety of the chip 200 , so as to avoid affecting the processing quality of the chip 200 subsequent process flow.

Please continue to refer to FIG. 2 , on the basis of the above-mentioned embodiment, the thickness measuring transmitting device 30 includes a thickness measuring light emitter 31, the thickness measuring receiving device 40 includes a thickness measuring light receiver 41, the thickness measuring light emitter 31 and the thickness measuring light The receivers 41 are respectively arranged on opposite sides of the glue removal execution device 20 , and the thickness measurement light emitter 31 and the thickness measurement light receiver 41 are both arranged obliquely to the surface of the glue removal workbench 10 . After such setting, the thickness-measuring light emitter 31 emits X-rays to the chip 200, and the X-rays are more likely to be reflected at a suitable angle on the surface of the chip 200, so that the X-rays can return to the thickness-measuring light receiver 41 more accurately, so as to accurately and The real-time measurement of the thickness of the chip 200 is quickly completed.

Further, the thickness measuring and emitting device 30 also includes a first vacuum isolation valve 32 , and the first vacuum isolation valve 32 is installed on the thickness measuring light transmitter 31 . Similarly, the thickness measurement receiving device 40 further includes a second vacuum isolation valve 42 installed on the thickness measurement light receiver 41 . When it is detected that the real-time thickness value of the chip 200 is equal to the pre-stored chip 200 thickness value, the controller, in addition to shutting down the plasma generator, will also synchronously send instructions to the first vacuum isolation valve 32 and the second vacuum isolation valve 42 to control the first vacuum isolation valve 32 and the second vacuum isolation valve 42. A vacuum isolating valve 32 and a second vacuum isolating valve 42 are closed, so that the optical path of the thickness measuring light transmitter 31 and the thickness measuring light receiver 41 can be cut off, and the X-rays are stopped to continue to emit, so as to prevent the inspector from being subjected to X rays when taking out the chip 200. Ray damage.

Please continue to refer to FIGS. 1 to 3. In addition, on the basis of any of the above-mentioned embodiments, the glue removal workbench 10 includes a carrier 12 and a workbench main body 13, and the carrier 12 is movably arranged on the top of the workbench main body 13. On the surface, the glue removal execution device 20 , the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 are installed on the carrier 12 respectively. During work, the operation carrier 12 moves relative to the main body 13 of the workbench, and the positions of the deglue execution device 20, the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 can be flexibly changed, so that the photoresist on different parts of the surface of the chip 200 can be removed. Complete removal and complete thickness measurement of the chip 200 ensure the cleanliness of photoresist removal and the thickness measurement accuracy of the chip 200 .

Specifically, in the above embodiment, the top surface of the workbench main body 13 is provided with a first track and a second track, the first track and the second track are rubber arranged and connected to each other, and the bottom of the carrier 12 is equipped with a moving block, The moving block can be movably installed on the first track or the second track. Therefore, the moving block can move flexibly on the intersecting first track or second track, so that the glue removal execution device 20, the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 can be aligned with different parts of the chip 200 and the photoresist, ensuring Processability and detectability.

Or, as an alternative to the above-mentioned embodiments, in some other embodiments, the carrier 12 is provided with an annular track that surrounds the carrier 12 and is parallel to the table surface of the workbench main body 13, and the annular track is movably installed with a first The rotating assembly and the second rotating assembly, the thickness measuring transmitting device 30 is installed on the first rotating assembly and can rotate in the vertical plane, and the thickness measuring receiving device 40 is installed on the second rotating assembly and can rotate in the vertical plane. By moving along the circular track extending in the horizontal direction, the thickness measuring transmitting device 30 and the thickness measuring receiving device 40 can obtain different circumferential relative positions from the chip 200. On this basis, the thickness measuring transmitting device 30 and the thickness measuring receiving device 40 through the corresponding vertical rotation of the first rotating assembly and the second rotating assembly, the thickness measuring light can reach different parts of the chip 200 to complete the real-time measurement of the thickness of different parts of the chip 200.

In some embodiments, both the first rotating assembly and the second rotating assembly include a seat body, a damping sleeve and a rotating body, the seat body is installed on the carrier 12, and the seat body is provided with a rotating hole, and the rotating body is provided with a rotating shaft portion, The rotating shaft part is rotatably inserted in the rotating hole, and the damping sleeve is sleeved between the rotating shaft part and the wall of the rotating hole. Therefore, the rotating shaft part of the rotating body rotates in the rotating hole, so that the first rotating assembly and the second rotating assembly can provide the required rotational degrees of freedom for the thickness measuring transmitting device 30 and the thickness measuring receiving device 40; further, the damping sleeve increases the rotating shaft. The frictional resistance between the hole wall diameter of the head and the rotating hole enables the thickness-measuring transmitting device 30 and the thickness-measuring receiving device 40 to be fixed at the angular position after the rotation without random rotation, which helps to ensure the accuracy of the thickness measurement of the chip 200.

Optionally, the damping sleeve adopts a rubber sleeve.

Please continue to refer to Fig. 2, in addition, on the basis of any of the above-mentioned embodiments, the glue removal device 100 also includes a support table 50 and a clamp 60, the support table 50 is installed in the glue removal working chamber 11, and the clamp 60 is arranged on the support table 50 and is used for clamping and fixing the chip 200 to be glued. The clamp 60 can clamp and fix the chip 200, so that the position of the chip 200 can be kept stable during the whole process of glue removal and thickness measurement.

Optionally, the clamp 60 may be a mechanical clamp 60, or a vacuum adsorption device, etc., which can be flexibly selected according to actual needs.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is relatively specific and detailed, but should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. A photoresist remover, comprising:

a photoresist removing working chamber is formed in the photoresist removing working table, and the photoresist removing working chamber is used for accommodating a chip to be photoresist removed;

a controller;

the photoresist removing execution device is arranged on the photoresist removing workbench and can output photoresist removing light beams into the photoresist removing working cavity, and the photoresist removing execution device is electrically connected with the controller;

the thickness measuring and transmitting device is arranged on the photoresist removing workbench and is used for generating thickness measuring rays to the chip; the method comprises the steps of,

the thickness measuring receiving device is arranged on the photoresist stripping workbench and is used for receiving the thickness measuring light reflected by the chip, and the thickness measuring transmitting device and the thickness measuring receiving device are respectively and electrically connected with the controller.

2. The photoresist stripping apparatus according to claim 1, wherein the thickness measuring and transmitting device comprises a thickness measuring light emitter, the thickness measuring and receiving device comprises a thickness measuring light receiver, the thickness measuring light emitter and the thickness measuring light receiver are respectively arranged on two opposite sides of the photoresist stripping device, and the thickness measuring light emitter and the thickness measuring light receiver are obliquely arranged with a table top of the photoresist stripping workbench.

3. The photoresist stripper apparatus of claim 2, wherein the thickness measuring emitter device further comprises a first vacuum shut-off valve mounted on the thickness measuring light emitter.

4. The photoresist stripper apparatus of claim 2, wherein the thickness measuring receiving device further comprises a second vacuum shut-off valve mounted on the thickness measuring light receiver.

5. The photoresist stripper according to claim 1, wherein the photoresist stripper comprises a carriage and a main body, the carriage is movably disposed on a top surface of the main body, and the photoresist stripping device, the thickness measuring device and the thickness measuring device are respectively mounted on the carriage.

6. The photoresist stripper according to claim 5, wherein the top surface of the table body is provided with a first rail and a second rail, the first rail and the second rail are arranged in rubber and are mutually communicated, the bottom of the carriage is provided with a moving block, and the moving block is movably arranged on the first rail or the second rail.

7. The photoresist stripper according to claim 5, wherein the carrier is provided with an annular track surrounding the carrier and parallel to the table surface of the table main body, a first rotating assembly and a second rotating assembly are movably mounted on the annular track, the thickness measuring transmitting device is mounted on the first rotating assembly and can rotate in a vertical plane, and the thickness measuring receiving device is mounted on the second rotating assembly and can rotate in a vertical plane.

8. The photoresist stripper according to claim 7, wherein the first and second rotating assemblies each comprise a base, a damping sleeve and a rotator, the base is mounted on the carrier, the base is provided with a rotating hole, the rotator is provided with a rotating shaft, the rotating shaft is rotatably inserted into the rotating hole, and the damping sleeve is sleeved between the rotating shaft and the wall of the rotating hole.

9. The photoresist stripper according to any one of claims 1 to 8, further comprising a support table and a clamp, wherein the support table is mounted in the photoresist stripping working chamber, and the clamp is disposed on a table top of the support table and is used for clamping and fixing the chip to be stripped.

10. The photoresist stripper according to claim 9, wherein the photoresist stripper performing apparatus employs a plasma generator.