CN116417785A - Electronic package and method for manufacturing the same - Google Patents

Abstract

The invention relates to an electronic package and its manufacturing method. A first antenna structure and a second antenna structure are integrated on a package module, and the radio frequency of the first antenna structure is different from that of the second antenna structure, so that the electronic package The component can send/receive different antenna signals according to requirements, so that the electronic product using the electronic package can send and receive signals of the required frequency, and improve the antenna function of the electronic product.

Description

Electronic package and its manufacturing method

technical field

The invention relates to an electronic package, in particular to an electronic package with an antenna structure and a manufacturing method thereof.

Background technique

At present, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to facilitate receiving or sending various wireless signals. In addition, in order to meet the convenience of portability and Internet access of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size and light in weight. It is widely used in wireless communication modules of electronic products due to its characteristics of easy manufacture and so on.

At present, 5G-related application technologies will be fully commercialized in the future. Its application frequency range is about 1GHz to 1000GHz. Indoor small base stations, so 5G mobile communications will use a large number of antennas in the base station to meet the requirements of the 5G system for large-capacity, fast transmission and low latency.

FIG. 1 is a three-dimensional schematic diagram of a known wireless communication module. As shown in FIG. 1 , the wireless communication module 1 includes: a substrate 10 , a plurality of electronic components 11 disposed on the substrate 10 , an antenna structure 12 and packaging material 13 . The substrate 10 is a circuit board and has a rectangular shape. The electronic component 11 is disposed on the substrate 10 and electrically connected to the substrate 10 . The antenna structure 12 is planar and has an antenna body 120 and a wire 121 , the antenna body 120 is electrically connected to the electronic component 11 through the wire 121 . The encapsulation material 13 covers the electronic components 11 and part of the wires 121 .

However, in the known wireless communication module 1, only a single antenna structure 12 can be configured, thereby limiting the antenna function of the wireless communication module 1, causing the wireless communication module 1 to be unable to provide the electrical functions required for running the 5G system, and it is difficult to achieve the 5G system. Antenna operation requirements.

Therefore, how to overcome the problems of the above-mentioned known technologies has become an urgent problem to be solved.

Contents of the invention

In view of the various defects of the above-mentioned known technologies, the present invention provides an electronic package, including: a packaging module, which is internally equipped with a plurality of feeding lines, wherein the multiple feeding lines define a first antenna layer and a second antenna layer. Antenna layer; an insulating spacer, which is arranged on a part of the surface of the packaging module; a first antenna body, which is arranged on the insulating spacer at a position corresponding to the first antenna layer, and makes the first antenna body and the first antenna Layers are located on opposite sides of the insulating spacer, so that the first antenna body and the first antenna layer form a first antenna structure; and a second antenna body, corresponding to the position of the second antenna layer, is provided on the part of the packaging module on the surface, and keep a distance between the second antenna body and the second antenna layer, so that the second antenna body and the second antenna layer form a second antenna structure.

The present invention also provides a method for manufacturing an electronic package, including: providing a packaging module, in which a plurality of feed-in lines are configured, wherein the multiple feed-in lines define a first antenna layer and a second antenna layer; An insulating spacer is arranged on a part of the surface of the packaging module; a first antenna body is formed on the insulating spacer corresponding to the position of the first antenna layer, and the first antenna body and the first antenna layer are located on the opposite sides of the insulating spacer, so that the first antenna body and the first antenna layer form a first antenna structure; and a second antenna body is formed on a part of the surface of the packaging module corresponding to the position of the second antenna layer, And keep a distance between the second antenna body and the second antenna layer, so that the second antenna body and the second antenna layer form a second antenna structure.

In the aforementioned electronic package and its manufacturing method, the applicable frequency of the first antenna structure is 24-52 GHz.

In the aforementioned electronic package and its manufacturing method, the first antenna body and the first antenna layer transmit signals in a coupled manner.

In the aforementioned electronic package and its manufacturing method, the insulating spacer is a dielectric layer.

In the aforementioned electronic package and its manufacturing method, the dielectric constant of the insulating spacer is less than 3.

In the aforementioned electronic package and its manufacturing method, the applicable frequency of the second antenna structure is 410-7125 MHz.

In the aforementioned electronic package and its manufacturing method, the second antenna body and the second antenna layer transmit signals in a coupled manner.

In the aforementioned electronic package and its manufacturing method, the package module includes at least one electronic component and a cladding layer covering the electronic component, so that the second antenna body and the second antenna layer are located opposite to the cladding layer. sides. For example, the cladding layer has a dielectric constant less than 3.7. Alternatively, the packaging module further includes a plurality of conductive pillars embedded in the cladding layer, and a carrying structure and a circuit structure arranged on opposite sides of the cladding layer to be electrically connected to each other through the plurality of conductive pillars, so that The carrying structure is provided with the first antenna layer, and the line structure is provided with the second antenna layer, and the insulating spacer and the second antenna body are arranged on a surface of the carrying structure.

It can be seen from the above that in the electronic package and its manufacturing method of the present invention, the first antenna structure and the second antenna structure are mainly integrated on the packaging module by using an insulating spacer, and the radio frequency of the first antenna structure is in contact with the The radio frequency of the second antenna structure is different, so that the electronic component can send/receive different antenna signals according to requirements, so that the electronic product using the electronic package can transmit the signal of the required frequency, so compared with the known technology, the The electronic package is equipped with multiple sets of antenna structures, so that the antenna function of the electronic product can be improved, so that the electronic product can provide the electrical functions required to operate the 5G system, so as to meet the requirements of the antenna operation of the 5G system.

Description of drawings

FIG. 1 is a three-dimensional schematic diagram of a known wireless communication module.

2A to 2E are schematic cross-sectional views of the manufacturing method of the electronic package of the present invention.

FIG. 2F is a schematic top plan view of FIG. 2E .

Explanation of reference signs

1: Wireless communication module

10: Substrate

11,21: Electronic components

12: Antenna structure

120: Antenna body

121: wire

13: Encapsulation material

2: Electronic package

2a: Encapsulation module

20: Bearing structure

20a: First side

20b: Second side

200: first insulating layer

201: The first line layer

21a: Action surface

21b: Non-active surface

210: electrode pad

211: Protective film

212: solid layer

22: Conductor

23: Conductive column

24: Insulation spacer

25: cladding layer

26: Line structure

260: second insulating layer

261: Second line layer

27: Conductive element

270: metal layer under the bump

28: The first antenna structure

28a: The first antenna layer

28b: The first antenna body

29: Second Antenna Structure

29a: Second antenna layer

29b: Second antenna body

9: Support plate

90: release layer

91: adhesive layer.

Detailed ways

Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content described in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to match the content described in the specification for the understanding and reading of those skilled in the art, and are not used to limit the conditions for the implementation of the present invention , so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the description of the present invention without affecting the functions and objectives of the present invention. within the range covered by the technical content. At the same time, terms such as "above", "first", "second" and "a" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall be regarded as the implementable scope of the present invention without substantive change in the technical content.

2A to 2E are schematic cross-sectional views of the manufacturing method of the electronic package 2 of the present invention.

As shown in Figure 2A, on a support plate 9, a load-bearing structure 20 is combined, the load-bearing structure 20 has an opposite first side 20a and a second side 20b, and the load-bearing structure 20 is bonded to the support plate 9 with its second side 20b . Next, a plurality of conductive pillars 23 electrically connecting the carrying structure 20 are formed on the first side 20 a of the carrying structure 20 , and at least one electronic component 21 is disposed on the first side 20 a of the carrying structure 20 .

The carrying structure 20 is a circuit structure or a substrate structure, and the substrate structure is in the form of a core layer or without a core layer, for example, a packaging substrate (substrate) with a core layer and a circuit structure or a circuit substrate without a core layer (coreless) structure, wherein the carrying structure 20 includes at least one first insulating layer 200 and a first circuit layer 201 disposed on the first insulating layer 200 , such as a circuit redistribution layer (redistribution layer, RDL for short).

In this embodiment, the material for forming the first wiring layer 201 is copper, and the material for forming the first insulating layer 200 is, for example, polybenzoxazole (Polybenzoxazole, PBO for short), polyimide (Polyimide, PI for short). , prepreg material (Prepreg, PP for short) and other dielectric materials.

Furthermore, the carrying structure 20 is further configured with a first antenna layer 28 a electrically connected to the first circuit layer 201 . For example, the first antenna layer 28a and the first wiring layer 201 are fabricated together by RDL process.

The support plate 9 is, for example, a semiconductor material (such as silicon or glass) plate, on which a release layer 90 and an adhesive layer 91 are sequentially formed by coating, so that the carrying structure 20 is arranged on the adhesive layer 91 superior.

The conductive column 23 is, for example, a columnar body, a linear body or a spherical body, which stands upright on the first circuit layer 201 and is electrically connected to the first circuit layer 201 .

In this embodiment, the material forming the conductive pillar 23 is a metal material such as copper or gold or a solder material, but is not limited to the above.

The electronic component 21 is an active component, a passive component or a combination thereof, and the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

In this embodiment, the electronic component 21 is a semiconductor chip, which has an opposite active surface 21a and a non-active surface 21b, and the electronic component 21 is bonded to the first surface of the carrying structure 20 through a crystal-bonding layer 212 with its non-active surface 21b. On the side 20a, and the active surface 21a has a plurality of electrode pads 210, and a plurality of conductors 22 and a protective film 211 covering the plurality of electrode pads 210 and the plurality of conductors 22 are formed on the plurality of electrode pads 210. For example, the protective film 211 is an insulating material such as polybenzoxazole (PBO), and the conductor 22 is a spherical shape such as a conductive line, a solder ball, or a columnar shape of a metal material such as a copper pillar or a solder bump, or a solder ball. A stud made by a wire machine, but not limited thereto.

As shown in FIG. 2B, a cladding layer 25 is formed on the first side 20a of the carrying structure 20, so that the cladding layer 25 covers the electronic components 21 and a plurality of conductive pillars 23, and then through a leveling process, the cladding The upper surface of the layer 25 is coplanar with the upper surface of the protective film 211, the end faces of a plurality of conductive pillars 23 and the end faces of a plurality of conductors 22, so that the upper surface of the protective film 211, the end faces of the conductive pillars 23 and the end faces of the conductors 22 are coplanar. exposed to the cladding layer 25 .

In this embodiment, the cladding layer 25 is an insulating material, such as polyimide (referred to as PI), dry film (dryfilm), epoxy resin (epoxy) or packaging material (molding compound), which can be laminated It is formed on the first side 20 a of the carrying structure 20 by way of lamination or molding.

Furthermore, the leveling process is to remove the conductive pillars 23, the protective film 211, the conductor 22 and some materials of the coating layer 25 by grinding, so that the upper surface of the coating layer 25 and the upper surface of the protective film 211, The end faces of the conductive pillars 23 and the end faces of the conductors 22 are coplanar.

As shown in FIG. 2C, a circuit structure 26 is formed on the cladding layer 25, and the circuit structure 26 is stacked on the carrier structure 20 to form a packaging module 2a.

In this embodiment, the wiring structure 26 includes a plurality of second insulating layers 260, and a plurality of second wiring layers 261 such as RDLs disposed on the second insulating layers 260, so that the second wiring layers 261 are electrically connected to multiple A conductive pillar 23 and a plurality of conductors 22 on the electronic component 21. Alternatively, the wiring structure 26 may also only include a single second insulating layer 260 and a single second wiring layer 261 .

Furthermore, the material for forming the second wiring layer 261 is copper, and the material for forming the second insulating layer 260 is a medium such as polybenzoxazole (PBO), polyimide (PI), prepreg material (PP), etc. electrical material.

Moreover, the circuit structure 26 is further configured with a second antenna layer 29 a electrically connected to the second circuit layer 261 . For example, the second antenna layer 29a and the second circuit layer 261 are fabricated by RDL process together.

In addition, a plurality of conductive elements 27 such as solder balls are formed on the outermost second circuit layer 261 . For example, an under bump metallurgy (UBM) 270 may be formed on the outermost second circuit layer 261 to facilitate the bonding of the conductive element 27 . It should be understood that there are various types of the packaging module 2a, which are not limited to the above, and are hereby described.

As shown in FIG. 2D , the support plate 9 and the release layer 90 are removed, and then turned over to form an insulating spacer 24 on a part of the surface of the adhesive layer 91 on the second side 20 b of the carrying structure 20 .

In this embodiment, the insulating spacer 24 is a dielectric layer, such as polyimide (polyimide, referred to as PI), dry film (dry film) or packaging material (molding compound) and other dielectric materials, but not limited to the above-mentioned . For example, a dielectric layer is coated on the entire surface of the adhesive layer 91 first, and then part of the material of the dielectric layer is removed by etching to form the insulating spacers 24 .

As shown in FIG. 2E, a first antenna body 28b corresponding to the configuration of the first antenna layer 28a is formed on the insulating spacer 24, so that the first antenna body 28b and the first antenna layer 28a are located on opposite sides of the insulating spacer 24. The first antenna structure 28 is formed, and a second antenna body 29b corresponding to the second antenna layer 29a is formed on a part of the surface of the adhesive layer 91 on the second side 20b of the carrier structure 20, so that the second antenna body 29b The second antenna structure 29 is formed by keeping a distance from the second antenna layer 29a, and the second antenna body 29b surrounds the first antenna body 28b, as shown in FIG. 2F .

In this embodiment, with the 6 GHz frequency band as the boundary, the first antenna structure 28 is a high-frequency band antenna, that is, higher than 6 GHz, and the second antenna structure 29 is a low-frequency band antenna, that is, below 6 GHz (commonly known as Sub- 6GHz). For example, the electronic component 21 transmits and receives a high-frequency 5G millimeter wave (mmWave) signal at a frequency of 24-53 gigahertz (GHz) through the first antenna structure 28, and the electronic component 21 transmits and receives Sub-6 GHz (about 410-GHz) signals through the second antenna structure 29. 7125 megahertz (MHz) low-frequency 5G millimeter-wave signals.

Furthermore, the first antenna body 28b and the first antenna layer 28a transmit signals in a coupled manner, and the first antenna layer 28a is used as the feed line of the first antenna structure 28, and the second antenna body 29b and the second antenna layer 29a Signals are also transmitted in a coupled manner, and the second antenna layer 29 a is used as a feed line for the second antenna structure 29 . For example, the antenna layer and the antenna body can generate radiant energy by alternating voltage, alternating current or radiation change, and the radiant energy is an electromagnetic field, so that the antenna layer and the antenna body can be electromagnetically coupled to each other, so that the antenna signal can be transmitted in the transmission between the antenna layer and the antenna body. In addition, there is no other metal layer between the second antenna layer 29a and the second antenna body 29b.

Moreover, the dielectric region (such as the insulating spacer 24 and the first insulating layer 200) that cooperates with the high-frequency antenna must have a dielectric constant less than 3, for example, SiLK, MSQ, PI (containing nano-air, fluorine groups) or other Appropriate material; On the other hand, cooperate with the dielectric region of this low-frequency band antenna (such as the first insulating layer 200, cladding layer 25 and second insulating layer 260), its dielectric constant needs to be less than 3.7, for example, epoxy resin, PI or other suitable materials.

In addition, the first antenna body 28b and the second antenna body 29b can be fabricated by sputtering, vapor deposition, electroplating, electroless plating, electroless plating, or foiling.

Therefore, the manufacturing method of the present invention mainly uses the configuration of the insulating spacer 24 to facilitate the integration of the first antenna structure 28 and the second antenna structure 29 on the package module 2a without mutual interference, so that the electronic package 2 can be released as required. /Receive different antenna signals, so compared to the known technology, the electronic package 2 can be configured with an antenna structure including multiple frequencies, so that a single electronic package 2 can meet the needs of radio frequency products with multiple frequencies, thus improving The antenna function of the electronic product can provide the electrical functions required to operate the 5G system, so as to meet the requirements of the antenna operation of the 5G system.

The present invention further provides an electronic package 2, which includes: a package module 2a, an insulating spacer 24, a first antenna body 28b and a second antenna body 29b.

The encapsulation module 2a is internally configured with a plurality of feeder lines, wherein the plurality of feeder lines define a first antenna layer 28a and a second antenna layer 29a.

The insulating spacer 24 is disposed on a part of the surface of the packaging module 2a.

The first antenna body 28b is arranged on the insulating spacer 24 corresponding to the position of the first antenna layer 28a, and the first antenna body 28b and the first antenna layer 28a are located on opposite sides of the insulating spacer 24, so that the first The antenna body 28b and the first antenna layer 28a form the first antenna structure 28 .

The second antenna body 29b is arranged on a part of the surface of the packaging module 2a corresponding to the position of the second antenna layer 29a, and the second antenna body 29b and the second antenna layer 29a are separated from each other by keeping a distance, so that the second The antenna body 29 b and the second antenna layer 29 a form a second antenna structure 29 .

In one embodiment, the applicable frequency of the first antenna structure 28 is 24-52 GHz.

In one embodiment, the first antenna body 28b and the first antenna layer 28a transmit signals in a coupled manner.

In one embodiment, insulating spacers 24 are dielectric layers.

In one embodiment, insulating spacers 24 have a dielectric constant less than three.

In one embodiment, the applicable frequency of the second antenna structure 29 is 410-7125 MHz.

In one embodiment, the second antenna body 29b and the second antenna layer 29a transmit signals in a coupled manner.

In one embodiment, the packaging module 2a includes at least one electronic component 21 and a cladding layer 25 covering the electronic component 21, so that the second antenna body 29b and the second antenna layer 29a are located on opposite sides of the cladding layer 25 . For example, the dielectric constant of cladding layer 25 is less than 3.7. Further, the packaging module 2a further includes a plurality of conductive pillars 23 embedded in the cladding layer 25, and a carrying structure 20 and a circuit structure arranged on opposite sides of the cladding layer 25 to be electrically connected to each other through the plurality of conductive pillars 23. 26, so that the carrying structure 20 is provided with the first antenna layer 28a, and the circuit structure 26 is provided with the second antenna layer 29a, and the insulating spacer 24 and the second antenna body 29b are both arranged on one surface of the carrying structure 20.

In summary, the electronic package and its manufacturing method of the present invention integrate the first antenna structure and the second antenna structure into the packaging module through the design of the insulating spacer, and the radio frequency and the second antenna structure of the first antenna structure The radio frequency of the second antenna structure is different, so that the electronic package includes signal receiving capabilities of two frequency bands (Sub-6G or mmWave), so electronic products using the electronic package can meet the needs of radio frequency products of various frequencies.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be listed in the claims.

Claims (20)

1. An electronic package, comprising: The encapsulation module is configured with a plurality of feeding lines inside, wherein the plurality of feeding lines define a first antenna layer and a second antenna layer; an insulating spacer provided on a part of the surface of the packaging module; The first antenna body is arranged on the insulating spacer at a position corresponding to the first antenna layer, and the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so that causing the first antenna body and the first antenna layer to form a first antenna structure; and The second antenna body is arranged on a part of the surface of the encapsulation module corresponding to the position of the second antenna layer, and keeps a distance between the second antenna body and the second antenna layer, so that the second antenna The body and the second antenna layer form a second antenna structure. 2. The electronic package according to claim 1, wherein the applicable frequency of the first antenna structure is 24-52 GHz. 3. The electronic package according to claim 1, wherein the first antenna body and the first antenna layer transmit signals in a coupled manner. 4. The electronic package of claim 1, wherein the insulating spacer is a dielectric layer. 5. The electronic package of claim 1, wherein the insulating spacer has a dielectric constant of less than 3. 6. The electronic package of claim 1, wherein the applicable frequency of the second antenna structure is 410-7125 MHz. 7. The electronic package according to claim 1, wherein the second antenna body and the second antenna layer transmit signals in a coupled manner. 8. The electronic package according to claim 1, wherein the packaging module comprises at least one electronic component and a cladding layer covering the electronic component, so that the second antenna body and the second antenna layers are located on opposite sides of the cladding. 9. The electronic package of claim 8, wherein the cladding layer has a dielectric constant less than 3.7. 10. The electronic package according to claim 8, wherein the packaging module further comprises a plurality of conductive pillars embedded in the cladding layer, and arranged on opposite sides of the cladding layer to pass through the plurality of conductive pillars. A load-bearing structure and a circuit structure electrically connected to each other by conductive posts, so that the load-carrying structure is provided with the first antenna layer, and the circuit structure is provided with the second antenna layer, and the insulating spacer is provided with and the second antenna body are arranged on a surface of the carrying structure. 11. A method for manufacturing an electronic package, comprising: A package module is provided, which is internally configured with a plurality of feeder lines, wherein the plurality of feeder lines define a first antenna layer and a second antenna layer; disposing an insulating spacer on a part of the surface of the packaging module; A first antenna body is formed on the insulating spacer corresponding to the position of the first antenna layer, and the first antenna body and the first antenna layer are located on opposite sides of the insulating spacer, so that causing the first antenna body and the first antenna layer to form a first antenna structure; and A second antenna body is formed on a part of the surface of the encapsulation module corresponding to the position of the second antenna layer, and a distance is kept between the second antenna body and the second antenna layer, so that the second antenna The body and the second antenna layer form a second antenna structure. 12. The method for manufacturing an electronic package according to claim 11, wherein the applicable frequency of the first antenna structure is 24-52 GHz. 13. The method for manufacturing an electronic package according to claim 11, wherein the first antenna body and the first antenna layer transmit signals in a coupled manner. 14. The method of manufacturing an electronic package according to claim 11, wherein the insulating spacer is a dielectric layer. 15. The method of manufacturing an electronic package according to claim 11, wherein the dielectric constant of the insulating spacer is less than 3. 16. The method of manufacturing an electronic package according to claim 11, wherein the applicable frequency of the second antenna structure is 410-7125 MHz. 17. The method for manufacturing an electronic package according to claim 11, wherein the second antenna body and the second antenna layer transmit signals in a coupled manner. 18. The method for manufacturing an electronic package according to claim 11, wherein the packaging module comprises at least one electronic component and a cladding layer covering the electronic component, so that the second antenna body and the The second antenna layer is located on opposite sides of the cladding layer. 19. The method of manufacturing an electronic package according to claim 18, wherein the dielectric constant of the cladding layer is less than 3.7. 20. The method for manufacturing an electronic package according to claim 18, wherein the packaging module further comprises a plurality of conductive pillars embedded in the cladding layer, and arranged on opposite sides of the cladding layer to pass through The plurality of conductive posts are electrically connected to the carrying structure and the circuit structure, so that the carrying structure is provided with the first antenna layer, and the circuit structure is provided with the second antenna layer, and the The insulating spacer and the second antenna body are disposed on a surface of the carrying structure.

Images