CN116406139A - Wave microchannel radiator with microneedle fin array - Google Patents

Abstract

The invention discloses a wave microchannel radiator with a microneedle fin array, which comprises a heat conducting bottom plate and a heat conducting cover plate, wherein at least two vertical fins are fixedly connected to the upper part of the heat conducting bottom plate, the tops of the fins are fixedly connected with the heat conducting cover plate, two adjacent fins, the heat conducting bottom plate and the heat conducting cover plate connected with the two adjacent fins form an independent microchannel heat transfer unit, and two ends of the microchannel heat transfer unit are respectively provided with a working medium outlet and a working medium inlet; the micro-channel heat transfer unit comprises a micro-needle fin array and a wave channel, and when the micro-needle fin array is fixedly arranged on the upper surface of the heat conducting base plate and the lower surface of the heat conducting cover plate, the opposite surfaces of two adjacent fins are all wave-shaped, so that the wave channel is formed between the micro-needle fin array and the heat conducting base plate and between the micro-needle fin array and the heat conducting cover plate; when the microneedle fin array is fixedly arranged on the side surface of the fin, the upper end face of the heat conducting bottom plate and the lower end face of the heat conducting cover plate are provided with wavy grooves, so that wavy channels are formed between the wavy grooves and the fin, heat dissipation efficiency is improved, and heat resistance and flow resistance are reduced.

Description

A wavy microchannel heat sink with a microneedle fin array

technical field

The invention relates to a heat sink for electronic devices, in particular to a wave microchannel heat sink with a microneedle fin array.

Background technique

In recent years, with the rapid development of information, medicine, materials, energy and other industries, as well as the wide application of highly integrated microelectronic devices, modern nano-manufacturing technology, and micro-processing technology in engineering, the demand for strengthening the cooling system has become increasingly urgent . In addition, since the number of transistors per unit area is increasing in a manner consistent with Moore's Law, and this trend will continue, this indicates that integrated circuits are developing towards high density, small volume, and high integration, and consequently The heat dissipation problem has become an important factor restricting the development of electronic products. Since the total power of highly integrated electronic components is increasing at a high speed, this leads to a significant increase in the heat flux applied per unit area, and each device has a certain operating temperature range. Exceeding the upper limit of the operating temperature range will cause microelectronics The reliability and security of system operation are reduced, or even invalidated. The reliability of microelectronic systems is very sensitive to temperature. The increase in operating temperature will lead to an exponential increase in its failure rate, and more than 55% of electronic device failures are caused by its operating temperature exceeding the rated temperature. Studies have shown that when the operating temperature of electronic components is between 70°C and 80°C, the reliability will decrease by 5% for every 1°C increase. Therefore, in order to control the operating temperature of electronic devices within the allowable range to ensure their safety and reliability, it is urgent to conduct a reasonable heat dissipation design and adopt a safe and effective cooling method.

In view of the continuous shrinking of the packaging size of microelectronic devices and the further improvement of the integration of systems and components, resulting in a significant increase in heat flux, effective thermal management is crucial to the normal and stable operation of microelectronic devices and chips, while traditional cooling Technology cannot meet the above requirements, which poses a great challenge in terms of cooling requirements for water-cooled micro-channel heat sinks with simple structures. In addition to the channel structure, the thermal performance of microchannel radiators is also limited by the thermal conductivity and specific heat of the working fluid, so it is necessary to use functional thermal fluids that mix different substances or different phases (solid/liquid/gas) of substances for cooling. A very promising and effective heat transfer enhancement technology. Currently, as described by H. Inaba in a document entitled "New challenge in advanced thermal energy transportation using functionally thermal fluids" (International Journal of Thermal Sciences, Vol.39, pp.991-1003, 2000), functional thermal fluids It is a mixture of heat transfer medium such as water and substances with or without phase change such as paraffin, and introduces the classification, characteristics and applications of functional thermal fluids, although functional thermal fluids will increase flow resistance compared with base fluids and frictional pressure drop, but it still has significant advantages in applying it to advanced thermal energy transport and heat exchange systems, which provides attractive opportunities for heat energy transport and enhanced heat transfer in heat exchangers. Specifically, the functional thermal fluid is a cooling fluid produced by adding particles such as micro-nanoscale metal/non-metal/phase-change capsules to the base fluid, which mainly includes fluid types such as nanofluids and phase-change microcapsule suspensions, among which : Nanofluid is a new type of heat-conducting fluid that is uniform, stable, and high in thermal conductivity formed by dispersing nanoscale metal or non-metallic particles into the base fluid through related technologies; unlike nanofluids, phase-change microcapsules are suspended The liquid can absorb and release a large amount of heat through the melting and solidification of the phase change material in the shell without losing fluidity, while the wall material of the microcapsule particles ensures its certain stability. Based on the phase change latent heat effect and micro-mixing, the functional thermal fluid utilizes a larger effective specific heat capacity and thermal conductivity to enhance the heat transfer of the fluid.

In addition, microchannels filled with porous materials rely on large surface contact area and strong local fluid mixing ability to enhance convective heat transfer, which is considered as a promising alternative for high heat density applications. The types of porous structures mainly include sintered porous media, metal foams, nanorod arrays, and microneedle fin arrays. Among them, structural types such as sintered porous media and metal foams are limited by their own pore sizes, and in order to avoid potential pore blockage. The weakening of heat transfer and the increase of flow resistance make it have higher requirements on the particle size and volume fraction of micro-nano-scale metal/non-metal/phase change capsules, and the micro-needle fin array structure takes into account both Reducing flow resistance while enhancing heat transfer can alleviate this contradiction, thereby increasing the threshold value of particle size and volume fraction of micro-nano-scale particles in functional thermal fluids. However, the coolant flow line almost parallel to the channel in straight channel configuration leads to poor fluid mixing and thicker thermal boundary layer, and the regular flow of coolant must result in reduced heat transfer along the flow direction. It can be seen that under the background of increasing power density and integration of electronic components, it is necessary to further improve the radiator body using functional thermal fluid as the coolant, so as to give full play to the cooling effect of the coolant, and then improve the micro Channel heat sink cooling performance and reduce thermal resistance and flow resistance.

Contents of the invention

Aiming at the deficiencies in the prior art, the object of the present invention is to provide a wave microchannel radiator with a microneedle fin array, so as to improve the heat dissipation efficiency of the radiator and reduce thermal resistance and flow resistance.

In order to achieve the above object, the present invention adopts the following technical solutions to achieve:

A wave microchannel radiator with a microneedle fin array, comprising a heat conduction base plate and a heat conduction cover plate, at least two vertical fins are fixedly connected to the upper part of the heat conduction base plate, and the tops of the fins are fixedly connected to the heat conduction cover plate. The two adjacent fins and the heat-conducting bottom plate and heat-conducting cover plate connected to them form an independent micro-channel heat transfer unit, and the two ends of the micro-channel heat transfer unit are the working fluid outlet and the working fluid inlet;

The microchannel heat transfer unit includes a microneedle fin array and a wavy channel. When the microneedle fin array is fixedly arranged on the upper surface of the heat conduction bottom plate and the lower surface of the heat conduction cover plate, the opposite surfaces of the two adjacent fins are wave-shaped so that Between it and the heat conduction bottom plate and the heat conduction cover plate, a wave channel for the circulation of functional thermal fluid is formed; There are wavy grooves to form wavy passages for functional heat fluid circulation between the fins and the fins.

Further, the microneedle fin array includes several pillars, the cross-section of which is circular, square, rhombus, triangular or polygonal.

Further, the columns of the microneedle fin array are evenly arranged on the upper surface of the heat conduction bottom plate and the lower surface of the heat conduction cover plate or the side surfaces of the fins, and the porosity of the microneedle fin array is 0.27-0.9.

Further, the cylinders of the microneedle fin array and the waves of the wave channel present alternating regular triangles and inverted triangles, or alternate rows of regular triangles and regular triangles are arranged on the upper surface of the heat conduction bottom plate and the lower surface of the heat conduction cover plate or side surface of the fin.

Further, the cylinders of the microneedle fin array increase or decrease linearly or gradiently along the direction of the corrugated channel, so that the porosity is arranged on the upper surface of the heat conduction base plate and the heat conduction cover in a row. The lower surface of the plate or the side surface of the fins, and the porosity ratio of the microneedle fin array is 0.3-3.3.

Further, the wave channel has a height of 0.2-30 mm and a width of 0.05-5 mm.

Further, the wave amplitude of the wave channel is 0.01-1.5 mm, and the wavelength is 0.1-15 mm.

Compared with the prior art, the present invention has the following technical effects:

Based on the principle that the curved interface can induce Dean vortices, the present invention adopts the configuration design of the wave channel instead of the existing straight channel, which increases the convection surface area of the functional thermal fluid in the wave channel and prolongs the residence time, which can improve cooling performance. The problem of poor mixing of the thermal working fluid enhances the secondary disturbance of the working fluid, makes the temperature distribution inside the wave channel more uniform, and shortens the cooling time of the functional thermal fluid; moreover, under the same cross-section, the wave channel is more conducive to heat The transmission makes the heat exchange more sufficient and improves the heat dissipation efficiency of the radiator; in addition, the use of functional thermal fluid as the working medium, combined with the wave channel with micro-needle fin array, can significantly improve the heat transfer capacity of the micro-channel radiator, Compared with traditional radiators, it has a smaller temperature gradient and more uniform temperature distribution, and obtains greater heat transfer enhancement and lower pressure drop loss. It can be seen that the wave microchannel heat sink with microneedle fin array of the present invention not only has simple structure, small weight and volume, is easy to manufacture, but also has high heat dissipation efficiency, low thermal resistance and low flow resistance.

The use of micro-needle fin arrays can effectively avoid the clogging of micro-nanoscale metal particles, non-metallic particles, and phase change capsules in the functional thermal fluid, ensuring the circulation performance of micro-nanoscale particles in the channel, and effectively reducing the radiator body. The specific surface area is significantly increased while the overall volume is increased, and the conflict that the flow and heat transfer performance cannot be improved at the same time is effectively balanced, the cooling effect of the micro-channel radiator is improved, and the cooling time to the predetermined temperature is shortened. In addition, the efficient heat transport of micro-nano particles with high thermal conductivity/high specific heat in the functional thermal fluid enables the working fluid to absorb and transmit a large amount of heat in a short time, which solves the difficulty of heat collection and the heat capacity/conduction of the coolant. The problem of low efficiency and low heat dissipation efficiency.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

Fig. 2 is the structural representation of microchannel heat transfer unit of the present invention;

Fig. 3 (a) is the microchannel heat transfer unit of the present invention without the structural representation of heat conduction cover plate;

Fig. 3 (b) is the structural representation of the fin of the present invention;

Fig. 4 is a sectional view one of the microchannel heat transfer unit of the present invention;

Fig. 5 is the second cross-sectional view of the microchannel heat transfer unit of the present invention;

Fig. 6 is a sectional view three of the microchannel heat transfer unit of the present invention;

7 is a cross-sectional view four of the microchannel heat transfer unit of the present invention;

Figure 8 is a cross-sectional view five of the microchannel heat transfer unit of the present invention;

Fig. 9 is a cross-sectional view six of the microchannel heat transfer unit of the present invention;

Fig. 10 is a sectional view seven of the microchannel heat transfer unit of the present invention;

Figure 11 is a cross-sectional view eight of the microchannel heat transfer unit of the present invention;

Figure 12 is a cross-sectional view nine of the microchannel heat transfer unit of the present invention;

In the figure: 1. heat conduction bottom plate; 2. fins; 3. heat conduction cover plate; 4. microchannel heat transfer unit; 5. microneedle fin array.

Detailed ways

The specific content of the present invention will be further explained in detail below in conjunction with the examples.

As shown in Figures 1 to 3, a wave microchannel radiator with a microneedle fin array includes a heat conduction bottom plate 1 and a heat conduction cover plate 3 arranged horizontally and parallel to each other, and the upper part of the heat conduction bottom plate 1 is fixedly connected with at least two Parallel vertical fins 2, two adjacent fins 2 and the heat conduction bottom plate 1 and heat conduction cover plate 3 connected thereto form an independent microchannel heat transfer unit 4, and the two ends of the microchannel heat transfer unit 4 are respectively Working fluid export and working fluid import;

As shown in Figure 2, the upper surface of the heat conduction bottom plate 1 and the lower surface of the heat conduction cover plate 3 are provided with wavy grooves, and the side surfaces of the fins 2 are fixedly arranged with a microneedle fin array 5, so that the fins 2 and The heat-conducting cover plate 3 and the heat-conducting bottom plate 1 form a wave channel for the circulation of functional thermal fluid;

As shown in Figure 3(a) and Figure 3(b), the opposite surfaces of two adjacent fins 2 in the microchannel heat transfer unit 4 are all wave-shaped, and the lower surface of the heat conduction cover plate 3 and the heat conduction bottom plate The upper surface of 1 is fixedly arranged with a microneedle fin array 5, so that the fins 2, the heat conduction cover plate 3 and the heat conduction bottom plate 1 form a wave channel for the circulation of functional thermal fluid;

Compared with conventional channels, the convective surface area of the functional thermal fluid in the wavy channel is larger and the residence time is longer, and the curved interface can induce the generation of Dean vortices, thereby enhancing the mixing of the coolant in the radiator channel, and Thinning the thickness of the boundary layer of the radiator strengthens the heat transfer of the coolant along the flow path, so under the same channel cross-section, the wave channel can obtain better thermal performance than the conventional channel; in addition, attached to the fin 2 or The microneedle fin array 5 on the heat conduction bottom plate 1 and the heat conduction cover plate 3 forms a structure similar to a porous medium inside the channel. While improving the effective thermal conductivity of the working medium in the channel cavity, the heat sink and the cooling process are increased interstitial contact area, thereby enhancing the heat transfer in the channel, reducing the thermal resistance and the overall temperature; moreover, the microneedle fin array effectively reduces the flow resistance of the cooling working fluid at the same thickness/width, and is aimed at For functional thermal fluids represented by nanofluids, it can effectively avoid problems such as clogging and agglomeration of particles. The column structure of the microneedle fin array can strengthen the disturbance and mixing of fluid microgroups. The process of vortex is accompanied by the generation and shedding of vortex, which strengthens the chaotic convection in the channel, and then improves the temperature uniformity of the heat sink. Therefore, the combination of micro-needle fin array and wave channel has both the above technical advantages. While improving heat dissipation efficiency, thermal resistance and flow resistance are reduced.

Preferably, the wave amplitude of the wave channel is 0.01-1.5 mm, the wavelength range is 0.1-15 mm, the height of the wave channel is 0.2-30 mm, and the width of the wave micro-channel is 0.05-5 mm; the microneedle fin array 5 It consists of several solid or hollow cylinders. The functional thermal fluid is evenly distributed inside the radiator through the wave channel and the cylinders of the microneedle fin array 5. The functional thermal fluid of metal, non-metal and phase change capsule particles, the mass concentration range of the functional thermal fluid is 1-35%, and the velocity range is 0.01-3m/s, so as to realize the efficient heat transfer of the functional thermal fluid.

The metal particles of the functional thermal fluid are copper, aluminum, titanium and their oxides, etc.; the non-metallic particles are silicon, carbon nanotubes or graphene; the phase change capsule particles are microencapsulated n-hexadecane , n-octadecane or n-eicosane and its derivatives; the base fluid of the functional thermal fluid is water, ethylene glycol, toluene, glycerol or ammonia water;

The heat-conducting bottom plate 1 , the fins 2 and the heat-conducting cover plate 3 are all made of metal or non-metal (such as copper, aluminum, silicon) with relatively high thermal conductivity.

As shown in Fig. 4 and Fig. 7 to Fig. 12, the pillars of the microneedle fin array 5 are cylindrical, wherein: as shown in Fig. 4, the pillars are evenly arranged in parallel in the heat conduction On the upper surface of the bottom plate 1 and the lower surface of the heat conduction cover plate 3 or the side walls of the fins 2; The principle of "high heat transfer efficiency and low flow resistance" increases or decreases linearly along the direction of the corrugated channel, or increases or decreases with a gradient, so that the front is dense and then sparse (first small and then large) or the front is sparse and then dense ( First large and then small) porosities are arranged in a row on the lower surface of the heat conduction base plate 1 and the upper surface of the heat conduction cover plate 3 or on the inner sidewall of the fins 2; as shown in Figure 11, the columns of the microneedle fin array 5 and the The trend of the waves in the wave channel presents a regular triangular pattern and an inverted triangular pattern alternately and evenly arranged on the lower surface of the heat conduction bottom plate 1 and the upper surface of the heat conduction cover plate 3 or the inner side wall of the fin 2; as shown in Figure 12, The cylinders of the microneedle fin array 5 and the wave channel are arranged in an alternating and uniform arrangement of regular triangles and regular triangles at the same period;

The uniform arrangement of the cylinders of the microneedle fin array 5 is suitable for occasions where the flow rate of the cooling working fluid is relatively low and the heat flux density is relatively uniform. Ideal temperature distribution; and the non-uniform arrangement of the columns of the microneedle fin array 5 is suitable for occasions that require a high flow rate of the cooling medium and uneven heat flux density, due to the effect of the boundary layer of the cooling medium at a lower flow rate Notably, the non-uniform arrangement of the microneedle fin array changes the flow area at the interface and changes the vortex shedding frequency, which can effectively thin or destroy the boundary layer, and at the same time induce a strong vortex near the microneedle fin to strengthen the flow in the channel. The chaotic convection of the heat sink improves the temperature uniformity of the heat sink at a lower flow rate; in addition, for applications with uneven heat flux distribution, compared with uniform arrangements, non-uniform arrangements with linear or gradient changes can be used in Under the same design size, the threshold of heat transfer is increased to obtain a more uniform temperature distribution.

Compared with the parallel arrangement, the cross-row arrangement of the columns of the microneedle fin array 5 is more conducive to the flow of the cooling medium in the relatively curved micro-pillar gaps, the disturbance and mixing process of the fluid is more severe, and the convection exchange The thermal coefficient and flow resistance are both larger, therefore, the fork row arrangement is suitable for occasions where the pumping power/flow resistance is limited and the heat transfer capacity is already strong. The uniform fork row arrangement showing alternating regular triangles and inverted triangles, or alternating regular triangles and regular triangles has the significant advantage of enhancing fluid turbulence to enhance heat transfer. However, the flow resistance of functional thermal fluid in the fork row arrangement is greater than that of the straight row arrangement. On the other hand, compared with the fork row arrangement that alternates with regular triangles and regular triangles, the alternate arrangement of regular triangles and inverted triangles makes the relationship between the micro-pillars and the heat sink The distance between the four walls is relatively constant, which can reduce the flow resistance of the fluid; moreover, the functional thermal fluid undergoes a gradual expansion-contraction flow process in the fork row arrangement in which regular triangles and regular triangles alternate, and has a strong dispersion The effect makes the thickness of the boundary layer on the wall of the radiator thinner, which increases the circulation resistance while strengthening the local mixing and disturbance of the coolant.

As shown in Figures 5 and 6, the cylinders of the microneedle fin array 5 are in the shape of regular quadrangular prisms or prisms with a rhombic cross-section, wherein: the cylinders are evenly arranged on the upper surface of the heat-conducting bottom plate 1 and the heat-conducting cover On the lower surface of the plate 3 or the inner side wall of the fins 2, there is either a non-uniform parallel arrangement as shown in Figures 7 to 10, or a synchronous arrangement with the wave trend of the wave channel as shown in Figures 11 to 12 It presents a uniform arrangement of alternating regular and inverted triangles, or alternating regular and regular triangles.

Preferably, the cross-sectional shape of the cylinder of the microneedle fin array 5 includes but not limited to circle, triangle, quadrilateral or polygon. When the cross-section of the cylinder is non-circular, the fluid flow can be changed by rotating the cylinder in situ. The angle of scour to the cylinder, that is, the angle of attack of incoming flow.

Preferably, the equivalent diameter of the cylinders of the microneedle fin array 5 ranges from 0.01 to 1 mm, the distance between the cylinders ranges from 0.02 to 5 mm, the height of the cylinders ranges from 0.02 to 2 mm, and the microneedle fin array 5 is evenly arranged When the porosity ranges from 0.27 to 0.9, the porosity ratio range of the non-uniformly arranged microneedle fin array 5 is from 0.3 to 3.3, and the microneedle fin array 5 is along the flow direction of the coolant (ie, functional thermal fluid). Above, the ratio of the length of the microneedle fin array at the inlet section of the working fluid to the length of the microneedle fin array at the outlet section of the working fluid ranges from 0.2 to 5.

The heat sink with the wave channel of the microneedle fin array in this embodiment can effectively avoid the clogging of particles such as micro-nano-scale metal/non-metal/phase-change capsules in the functional thermal fluid, and significantly increase the convective heat transfer area. The Dean vortex induced by the wave channel enhances the mixing and secondary disturbance of the working fluid (ie, coolant), improves the heat dissipation effect of the radiator, shortens the cooling time to the predetermined temperature, and effectively improves the heat dissipation of the radiator Speed and cooling efficiency, and the radiator of the present invention is reasonable in structure, easy to manufacture, high in reliability, light in weight and small in size, and has wide applicability.

The working principle of the present invention is as follows:

When in use, the heat-conducting bottom plate or the heat-conducting cover plate is attached to the heat-generating end of the electronic device, and the heat is transferred from the heat source to the inside of the radiator through heat conduction. The mass inlet flows into the wave channel, and the heat is quickly transferred to the heat conduction cover plate 3 at the top of the channel through the vertical fins 2, and the microneedle fin array 5 with a large convective heat exchange surface area conducts convection exchange with the functional thermal fluid in the cavity of the wave channel. The heat, through the shunting of the microneedle fin array and the induction of the corrugated wall surface, forms the Dean vortex, which makes the flow field of the functional thermal fluid in the microchannel heat transfer unit 4 significantly change and causes fluid disturbance and mixing, accompanied by vortex The generation and dissipation process, the functional thermal fluid absorbs more heat and then flows out of the wave channel from the working fluid outlet at the other end of the microchannel heat transfer unit 4, realizing the function of transferring heat from the heat source, so that the heat source continues to be stable at a suitable temperature Work, improve the cooling efficiency of the radiator.

Claims (7)

1. The utility model provides a wave microchannel radiator with microneedle fin array, which is characterized in that, including heat conduction bottom plate (1) and heat conduction apron (3), the upper portion fixedly connected with of heat conduction bottom plate (1) has two at least vertical fins (2), the top and the heat conduction apron (3) fixed connection of fin (2), adjacent two fins (2) and heat conduction bottom plate (1) and heat conduction apron (3) that are connected constitute an independent microchannel heat transfer unit (4), the both ends of microchannel heat transfer unit (4) are working medium export and working medium import respectively;

the micro-channel heat transfer unit (4) comprises a micro-needle fin array (5) and a wave channel, and when the micro-needle fin array (5) is fixedly arranged on the upper surface of the heat conducting base plate (1) and the lower surface of the heat conducting cover plate (3), opposite surfaces of two adjacent fins (2) are all wave-shaped, so that a wave channel for circulating functional hot fluid is formed between the micro-needle fin array and the heat conducting base plate (1) and the heat conducting cover plate (3); when the microneedle fin array (5) is fixedly arranged on the side surface of the fin (2), the upper end face of the heat conducting bottom plate (1) and the lower end face of the heat conducting cover plate (3) are provided with wavy grooves, so that a wavy channel for circulating functional hot fluid is formed between the microneedle fin array and the fin (2).

2. The wave microchannel heat sink with microneedle fin array according to claim 1, characterized in that the microneedle fin array (5) comprises a number of cylinders with circular, square, diamond, triangular or polygonal cross-section.

3. The wavy micro-channel heat sink with micro-needle fin array according to claim 2, wherein the columns of the micro-needle fin array (5) are uniformly arranged on the upper surface of the heat conducting base plate (1) and the lower surface of the heat conducting cover plate (3) or the side surfaces of the fins (2), and the porosity of the micro-needle fin array (5) is 0.27-0.9.

4. A wavy micro-channel heat sink with micro-needle fin array according to claim 3, characterized in that the columns of the micro-needle fin array (5) show regular and inverted triangular alternation or staggered rows of regular and inverted triangular alternation with the waves of the wavy channel at the same period, and are arranged on the upper surface of the heat conducting bottom plate (1) and the lower surface of the heat conducting cover plate (3) or the side surfaces of the fins (2).

5. The corrugated micro-channel heatsink with micro-needle fin array according to claim 2, wherein the columns of the micro-needle fin array (5) increase or decrease linearly or in gradient along the corrugated channel direction, the micro-needle fin array (5) is arranged on the upper surface of the heat conducting bottom plate (1) and the lower surface of the heat conducting cover plate (3) or the side surface of the fin (2) in a front-back-thinning or front-back-thinning porosity parallel manner, and the porosity ratio of the micro-needle fin array (5) is 0.3-3.3.

6. The corrugated microchannel heat sink with microneedle fin array according to any one of claims 1 to 5, wherein the height of the corrugated channels is 0.2 to 30mm and the width is 0.05 to 5mm.

7. The corrugated microchannel heat sink with microneedle fin array according to any one of claims 1 to 5, wherein the amplitude of the waves of the corrugated channels is 0.01 to 1.5mm and the wavelength is 0.1 to 15mm.

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