CN116347788A

CN116347788A - Circuit board with embedded element and manufacturing method thereof

Info

Publication number: CN116347788A
Application number: CN202111577601.5A
Authority: CN
Inventors: 高自强; 胡先钦
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2023-06-27
Also published as: TWI803114B; US20230199966A1; TW202327417A

Abstract

The invention provides a circuit board with embedded components and a manufacturing method thereof. Then, after the dielectric layer is arranged on the electronic element and the adhesive layer, the substrate and the adhesive layer are removed to form the buried layer. Then, a wiring layer is formed on the electronic component and a conductive connection is formed in the dielectric layer. Then, a cover film is attached to the dielectric layer and the wiring layer. Therefore, the buried layer which enables the electronic element to be buried in the dielectric layer can be obtained, and the circuit layer which is electrically connected with the electronic element can be accurately positioned on the surface of the buried layer.

Description

Circuit board with embedded element and manufacturing method thereof

Technical Field

The invention relates to a circuit board with embedded components and a manufacturing method thereof.

Background

In recent years, development of electronic devices has been rapid, and multifunctionality, high wiring density, and miniaturization have been main research directions. Therefore, in order to meet the above requirements, it is necessary to design a higher line density on a substrate with limited space and to provide more electronic devices, such as passive devices (passive component) and active devices (active components). In order to achieve the above object, a technology of embedding an electronic device into a dielectric layer of a substrate is one of the technical means for satisfying the above requirements.

Disclosure of Invention

One aspect of the present invention provides a circuit board with embedded components, which includes electronic components embedded in a dielectric layer.

Another aspect of the present invention provides a method for manufacturing the above-mentioned embedded component circuit board.

According to one aspect of the present invention, a method for manufacturing a circuit board with embedded components is provided, which includes providing a substrate, and then coating a glue layer on a top surface of the substrate. Then, a plurality of electronic components are arranged on the adhesive layer. Each electronic element is provided with a functional surface and a plurality of connecting pads exposed on the functional surface, and the adhesive layer covers the functional surface. Then, a dielectric layer is arranged on the electronic component and the adhesive layer. After the dielectric layer is arranged, the substrate and the adhesive layer are removed to form an embedded layer, and the functional surface is exposed. After the buried layer is formed, a wiring layer is formed on the functional surface. The circuit layer is electrically connected with the electronic element. A plurality of conductive connections are formed within the dielectric layer. The buried layer has a bottom surface opposite to the functional surface, and the conductive connecting piece is connected with the circuit layer, and one end of the conductive connecting piece is exposed at the bottom surface of the buried layer. After the conductive connection member is formed, a cover film is attached to the dielectric layer and the wiring layer.

According to an embodiment of the present invention, the adhesive layer is an ultraviolet adhesive layer. The above-mentioned operation of disposing the electronic component on the adhesive layer further comprises irradiating ultraviolet light from the bottom surface of the substrate to cure the ultraviolet adhesive layer and fix the electronic component. The bottom surface is opposite to the top surface of the substrate.

According to an embodiment of the present invention, the operation of forming the conductive connection member includes disposing a plurality of conductive pillars on the glue layer and between the electronic components before disposing the dielectric layer.

According to an embodiment of the invention, the operation of forming the conductive connection member includes forming a plurality of via holes in the dielectric layer before removing the substrate and the glue layer. The via hole penetrates through the dielectric layer and the adhesive layer. Then, the conductive material is filled in the via hole.

According to an embodiment of the present invention, the method for manufacturing a circuit board with embedded components further includes disposing a carrier on a bottom surface of the substrate before disposing the dielectric layer on the electronic component and the adhesive layer. The bottom surface is opposite to the top surface of the substrate. Then, the operation of removing the substrate and the adhesive layer includes removing the carrier.

According to an embodiment of the present invention, the disposing the circuit layer includes printing a conductive material on the buried layer. Then, the conductive material is cured.

According to an embodiment of the present invention, the dielectric layer includes a resin material. The resin material is selected from the group consisting of polyimide, modified polyimide, perfluoroalkoxy resin and soluble liquid crystal polymer resin.

According to an embodiment of the present invention, the dielectric layer further includes a plurality of hollow glass beads, and the hollow glass beads are mixed with the resin material.

According to another aspect of the present invention, there is provided a circuit board with embedded components, which includes a dielectric layer, a plurality of electronic components embedded in the dielectric layer, a circuit layer on a top surface of the dielectric layer, a plurality of conductive connectors penetrating the dielectric layer, and a cover film. Each electronic component is provided with a functional surface and a plurality of connecting pads exposed on the functional surface. The circuit layer is electrically connected with the electronic element. The conductive connecting piece is arranged between the electronic components and is electrically connected with the circuit layer. One end of the conductive connecting piece is exposed out of the bottom surface of the dielectric layer. The covering film is arranged on the dielectric layer, the circuit layer and the conductive connecting piece.

According to an embodiment of the present invention, the dielectric layer includes a resin material, and the resin material is selected from the group consisting of polyimide, modified polyimide, perfluoroalkoxy resin, and soluble liquid crystal polymer resin.

According to an embodiment of the present invention, the hollow glass microspheres have an average particle size of 5 μm to 100 μm.

After the electronic element is embedded in the dielectric layer, the circuit layer is formed on the dielectric layer, the circuit layer is electrically connected with the electronic element, and the circuit layer can be accurately positioned on the surface of the embedded layer.

Drawings

The aspects of the invention are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that as is standard in the industry, many features are not drawn to scale. In fact, the dimensions of many of the features may be arbitrarily scaled for clarity of discussion.

Fig. 1 is a schematic cross-sectional view of a device after providing a substrate and a glue layer, which is a method for manufacturing a circuit board with embedded components according to some embodiments of the invention.

Fig. 2 is a schematic partial cross-sectional view of an apparatus after an operation of disposing electronic components according to some embodiments of the present invention.

Fig. 3 is a schematic partial cross-sectional view of an apparatus after a carrier is disposed in a manufacturing method of a circuit board with embedded components according to some embodiments of the invention.

Fig. 4 is a schematic partial cross-sectional view of an apparatus after an operation of disposing a dielectric layer in a method for manufacturing a circuit board with embedded components according to some embodiments of the invention.

Fig. 5 is a schematic partial cross-sectional view of the device of fig. 4 after fabrication of a via.

Fig. 6 is a schematic partial cross-sectional view of an apparatus after removing a substrate and a glue layer, respectively, according to some embodiments of the invention.

Fig. 7 is a schematic partial cross-sectional view illustrating an apparatus for forming a circuit layer on a functional surface of an electronic component according to a method for manufacturing a circuit board with embedded components according to some embodiments of the invention.

Fig. 8 is a schematic partial cross-sectional view illustrating a circuit board with embedded components according to some embodiments of the invention.

Fig. 9 is a schematic partial cross-sectional view of an apparatus after disposing electronic components and conductive pillars, respectively, illustrating methods of manufacturing a circuit board with embedded components according to other embodiments of the invention.

Fig. 10 is a schematic partial cross-sectional view of an apparatus after the operation of disposing a dielectric layer in accordance with the manufacturing method of the embedded component circuit board according to other embodiments of the present invention.

Fig. 11 is a schematic partial cross-sectional view of an apparatus for removing a substrate and a glue layer in accordance with another embodiment of the invention.

[ symbolic description ]

100 buried layer

110 substrate

112 top surface

114 bottom surface

120 glue layer

130 electronic component

132 functional surface

135 joint pad

140 carrier

150 dielectric layer

152 upper surface

154 bottom surface

160 line layer

162 via hole

165 conductive post

167 conductive connector

170 electrical pad

180 cover film

200, embedding element circuit board.

Detailed Description

The invention is capable of many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, descriptions of first features being formed on or over second features include embodiments where the first and second features are in direct contact, and also include embodiments where other features are formed between the first and second features such that the first and second features are not in direct contact. In addition, the present invention repeats the reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as "below (beacon)", "below (below)", "below (lower)", "above (above)", "above (upper)", and the like, may be used for ease of description of the relationship of the parts or features and other parts or features depicted in the drawings. Spatially relative terms may be intended to encompass different orientations of the element in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatially relative descriptions used in the present invention may be interpreted as such.

In view of the foregoing, the present invention provides a circuit board with embedded components and a method for manufacturing the same, wherein after an electronic component is embedded in a dielectric layer, a circuit layer is formed on the dielectric layer, and the circuit layer is electrically connected to the electronic component, and the circuit layer can be accurately positioned on the surface of the embedded layer.

The steps of some embodiments of the method for manufacturing a circuit board with embedded components of the present invention are described below with reference to fig. 1 to 8. First, referring to fig. 1, a substrate 110 is provided, and a glue layer 120 is coated on a top surface 112 of the substrate. In some embodiments, the substrate 110 may be a transparent substrate or an opaque substrate for visible light, and the glue layer 120 may be an Ultraviolet (UV) glue layer. If the adhesive layer 120 is an ultraviolet adhesive layer, the substrate 110 is made of a material that is relatively transparent to ultraviolet light, such as polyethylene terephthalate (polyethylene terephthalate, PET), wherein the substrate 110 may be opaque to visible light but transparent to ultraviolet light.

Fig. 2 is a schematic partial cross-sectional view illustrating an operation of disposing the electronic component 130 according to some embodiments of the invention. In some embodiments, at least one electronic component 130 is disposed on the glue layer 120. Taking fig. 2 as an example, a plurality of electronic components 130 may be disposed on the glue layer 120. In some embodiments, these electronic components 130 may include active components (e.g., transistors, integrated circuits, etc.), passive components (e.g., resistors, capacitors, inductors, etc.), or a combination of the foregoing. Each electronic component 130 includes a functional surface 132 and a pad (pad) 135 exposed from the functional surface 132. The pads 135 are used to electrically connect the electronic device 130 to the circuit. In some embodiments, the glue layer 120 covers the functional surface 132, as shown in fig. 2.

In the above embodiment, if the glue layer 120 is an ultraviolet glue layer, after the electronic component 130 is mounted on the glue layer 120, ultraviolet light can be irradiated from the bottom surface 114 of the substrate 110 to cure the ultraviolet glue layer, so as to fix the electronic component 130. The bottom surface 114 of the substrate 110 is opposite the top surface 112 of the substrate 110.

Fig. 3 is a schematic partial cross-sectional view illustrating an operation of disposing the carrier 140 according to some embodiments of the invention. After the electronic components 130 are disposed on the glue layer 120, a carrier 140 may optionally be disposed on the bottom surface 114 of the substrate 110. That is, the substrate 110 carrying the electronic components 130 may be disposed on the carrier 140. The substrate 110 may be placed on the carrier 140 to improve the surface flatness of the substrate 110, which is beneficial to the subsequent operation of disposing the dielectric layer 150.

Fig. 4 is a schematic partial cross-sectional view illustrating an operation of disposing the dielectric layer 150 according to some embodiments of the invention. As shown in fig. 4, a dielectric layer 150 is disposed on the electronic component 130 and the glue layer 120, wherein the dielectric layer 150 covers the electronic component 130 and the glue layer 120, so that the electronic component 130 is embedded in the dielectric layer 150. In some embodiments, the dielectric layer 150 includes a resin material selected from the group consisting of Polyimide (PI), modified PI (MPI), perfluoroalkoxy resin (perfluoroalkoxy alkane, PFA), and soluble liquid crystal polymer resin (liquid crystal polymer, LCP).

In other embodiments, the dielectric layer 150 may further comprise a plurality of hollow glass beads, wherein the resin material is doped with the hollow glass beads such that the hollow glass beads are distributed in the resin material. Thus, the amount of resin material used is reduced, and shrinkage and warpage of the resulting embedded component circuit board are reduced. In addition, the dielectric constant of the hollow glass beads can be 1.2 to 2.2, so that the dielectric property of the dielectric layer 150 can be improved, and the transmission of high-frequency signals is facilitated. In some examples, the hollow glass microspheres may have an average particle size of 5 μm to 100 μm with a maximum compressive strength of 30000psi, which may increase the rigidity of the dielectric layer 150.

Referring to fig. 5, a schematic partial cross-sectional view of the via 162 after fabrication is shown. The via 162 is used to fabricate a subsequent conductive connection. In some embodiments, the via 162 may be formed by a laser or plasma.

Fig. 6 is a schematic partial cross-sectional view illustrating an operation of removing the substrate 110 and the glue layer 120 (and the optional carrier 140) according to some embodiments of the invention. In some embodiments, the operations shown in FIG. 6 are performed after the operations shown in FIG. 5. In the step shown in fig. 6, the substrate 110 in fig. 5 may be flipped over, and the substrate 110, the glue layer 120 and the carrier 140 are removed to form the buried layer 100 including the electronic device 130 and the dielectric layer 150, and the functional surface 132 of the electronic device 130 is exposed, wherein the functional surface 132 of the electronic device 130 is flush with the upper surface 152 of the buried layer 100. In addition, the step of flipping as described above may be omitted.

Next, fig. 7 is a schematic partial cross-sectional view illustrating an operation of forming the circuit layer 160 according to some embodiments of the invention. The circuit layer 160 is formed on the functional surface 132 of the electronic device 130 to electrically connect the pads 135 of the electronic device 130. Since the pads 135 of the electronic device 130 are exposed on the surface of the dielectric layer 150 after the above-mentioned operation of removing the substrate 110 and the glue layer 120, the circuit layer 160 can be precisely positioned on the surface of the dielectric layer 150. In some embodiments, the wiring layer 160 may be formed by a sputtering method or an inkjet printing method. For example, the inkjet printing method includes first printing a conductive material on the buried layer 100. Then, sintering is performed to cure the conductive material, and thus a circuit layer 160 is formed on the functional surface 132. The circuit layer 160 prepared by the invention can be a thin line, and the depth accuracy can be controlled below 1 mu m. In some embodiments, the wiring layer 160 (or the conductive material described above) may comprise copper, silver, nickel, chromium, titanium, and/or other metals and/or alloys comprising the foregoing metals.

The formation of the circuit layer 160 includes filling the via 162 with a conductive material to form the conductive connection 167, and may be formed simultaneously with the formation of the circuit layer 160. In some embodiments, the method of filling the conductive material in the via 162 may include electroplating, electroless plating, sputtering, and copper paste filling techniques. In some embodiments, the conductive material may comprise copper, silver, nickel, chromium, titanium, and/or alloys comprising the foregoing metals. The conductive connection 167 connects the wiring layer 160. Furthermore, one end of the conductive connecting member 167 is exposed at the bottom surface 154 of the buried layer 100, and the bottom surface 154 is opposite to the functional surface 132. In some embodiments, the electrical pads 170 may also be formed on the bottom 154 of the buried layer 100 to electrically connect to an external circuit board, such as a printed circuit board or a flexible circuit board.

Referring to fig. 8, a schematic partial cross-sectional view of a circuit board 200 with embedded components according to some embodiments of the invention is shown. A cover film 180 is attached to the buried layer 100 shown in fig. 7. To this end, a buried component circuit board 200 is substantially manufactured. The cover film 180 covers the dielectric layer 150 and the circuit layer 160 of the buried layer 100 to serve as a protective film for protecting the components (e.g., the electronic component 130, the circuit layer 160 and the conductive connection member 167) from external contamination and oxidation.

In other embodiments, the conductive posts 165 may be optionally provided together as conductive connectors during operation of the electronic component 130, as described below with reference to fig. 9-11. Fig. 9 is a schematic partial cross-sectional view illustrating an operation of disposing the electronic component 130 on the adhesive layer 120 shown in fig. 1 according to another embodiment of the invention. As shown in fig. 9, the electronic component 130 and the conductive post 165 are disposed on the adhesive layer 120, wherein the conductive post 165 can be manufactured as a subsequent conductive connection member, such as the conductive connection member 167 in the previous embodiment. The embodiment shown in fig. 9 to 11 has the advantage that the number of drilling operations can be reduced or the drilling process omitted to help simplify the process. In some embodiments, the conductive posts 165 comprise copper, silver, nickel, chromium, titanium, and/or alloys comprising the foregoing metals.

After the electronic components 130 and the conductive pillars 165 are disposed on the glue layer 120, the carrier 140 may be optionally disposed on the bottom surface 114 of the substrate 110. Then, as shown in fig. 10, a dielectric layer 150 is disposed on the electronic component 130, the conductive pillars 165, and the glue layer 120. Next, referring to fig. 11, the substrate 110, the glue layer 120 and the carrier 140 are removed to form a buried layer 300 including the electronic device 130, the conductive pillars 165 and the dielectric layer 150, wherein the functional surface 132 of the electronic device 130 is flush with the upper surface 152 of the buried layer 100.

Thereafter, the steps disclosed in fig. 7 and 8 may be sequentially performed to form the circuit layer 160 on the functional surface 132 of the electronic device 130. In some embodiments, the electrical pads 170 may also be formed on the bottom surface (not shown) of the buried layer 300 to electrically connect to an external circuit board, such as a printed circuit board or a flexible circuit board. Then, the cover film 180 is attached, thereby substantially completing the manufacture of the embedded component circuit board. It should be understood that the substrate 110 shown in fig. 4, 5 and 10 is disposed on the carrier 140, but the present invention is not limited to disposing the carrier 140.

The invention relates to a circuit board with embedded element and a manufacturing method thereof, which is characterized in that an electronic element and a conductive connecting piece are embedded in a dielectric layer, then a substrate is removed to obtain an embedded layer, and a circuit layer electrically connected with the electronic element can be accurately positioned on the surface of the dielectric layer (or the embedded layer) because a connecting pad of the electronic element is exposed on the surface of the embedded layer.

While the present invention has been described with reference to several embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention, and it is intended that the invention be limited only by the terms of the appended claims.

Claims

1. A method of manufacturing a circuit board with embedded components, comprising:

providing a substrate;

a coating glue layer on the top surface of the substrate;

arranging a plurality of electronic elements on the adhesive layer, wherein each electronic element is provided with a functional surface and a plurality of connecting pads exposed on the functional surface, and the adhesive layer covers the functional surface;

a dielectric layer is arranged on the electronic element and the adhesive layer;

after the dielectric layer is arranged, removing the substrate and the adhesive layer to form an embedded layer and exposing the functional surface;

after the buried layer is formed, forming a circuit layer on the functional surface, wherein the circuit layer is electrically connected with the electronic element;

forming a plurality of conductive connecting pieces in the dielectric layer, wherein the buried layer is provided with a bottom surface opposite to the functional surface, the conductive connecting pieces are connected with the circuit layer, and one ends of the conductive connecting pieces are exposed out of the bottom surface of the buried layer; and

and attaching a cover film on the dielectric layer and the circuit layer after the conductive connecting piece is formed.

2. The method of claim 1, wherein the glue layer is an ultraviolet glue layer, and the disposing the electronic component on the glue layer further comprises:

ultraviolet light is irradiated from a bottom surface of the substrate to cure the ultraviolet glue layer and fix the electronic element, wherein the bottom surface is opposite to the top surface of the substrate.

3. The method of manufacturing a circuit board with embedded components of claim 1, wherein the operation of forming the conductive connection comprises:

before the dielectric layer is arranged, a plurality of conductive posts are arranged on the adhesive layer and between the electronic components.

4. The method of manufacturing a circuit board with embedded components of claim 1, wherein the operation of forming the conductive connection comprises:

before removing the substrate and the adhesive layer, forming a plurality of through holes in the dielectric layer, wherein the through holes penetrate through the dielectric layer and the adhesive layer; and

and filling conductive materials in the through holes.

5. The method of manufacturing a circuit board with embedded components of claim 1, further comprising:

before disposing the dielectric layer on the electronic component and the glue layer, disposing a carrier on a bottom surface of the substrate, wherein the bottom surface is opposite to the top surface of the substrate; and

the operation of removing the substrate and the glue layer includes removing the carrier.

6. The method of manufacturing a circuit board with embedded components according to claim 1, wherein the operation of disposing the wiring layer comprises:

printing a conductive material on the buried layer; and

curing the conductive material.

7. The method of manufacturing a circuit board of claim 1, wherein the dielectric layer comprises a resin material selected from the group consisting of polyimide, modified polyimide, perfluoroalkoxy resin, and soluble liquid crystal polymer resin.

8. The method of claim 7, wherein the dielectric layer further comprises a plurality of hollow glass beads, and wherein the hollow glass beads are mixed with the resin material.

9. A circuit board with embedded components is characterized by comprising

A dielectric layer;

a plurality of electronic elements embedded in the dielectric layer, wherein each electronic element is provided with a functional surface and a plurality of connecting pads exposed on the functional surface;

the circuit layer is arranged on the top surface of the dielectric layer, and the circuit layer is electrically connected with the electronic element;

the plurality of conductive connecting pieces penetrate through the dielectric layer and are arranged between the electronic elements, wherein the conductive connecting pieces are electrically connected with the circuit layer, and one ends of the conductive connecting pieces are exposed out of the bottom surface of the dielectric layer; and

and the covering film is arranged on the dielectric layer, the circuit layer and the conductive connecting piece.

10. The embedded component circuit board of claim 9, wherein the dielectric layer comprises a resin material selected from the group consisting of polyimide, modified polyimide, perfluoroalkoxy resin, and soluble liquid crystal polymer resin.

11. The embedded component circuit board of claim 10, wherein the dielectric layer further comprises a plurality of hollow glass beads, and wherein the hollow glass beads are mixed with the resin material.

12. The embedded component circuit board of claim 11, wherein the hollow glass microspheres have an average particle size of 5 μιη to 100 μιη.