CN116321688A - A circuit board, circuit board assembly and electronic equipment - Google Patents

Abstract

The application provides a circuit board, a circuit board assembly and electronic equipment. The circuit board assembly comprises a heating device and a circuit board, and the heating device is arranged on the surface of the circuit board. The circuit board comprises a substrate and a circuit layer arranged on the substrate, and the circuit layer is in conductive connection with the heating device. The substrate comprises an insulating substrate and a metal substrate, and the insulating substrate and the metal substrate are fixedly arranged. The metal substrate is internally provided with a cooling liquid channel for transmitting cooling liquid, and the metal substrate is in heat conduction connection with the heating device, so that the metal substrate can be used for radiating heat for the heating device. According to the method, the cooling liquid channel is directly prepared in the metal substrate of the circuit board, so that the distance between the cooling liquid and the heating device is short, the thermal resistance in the heat conduction link is small, and the heat dissipation capacity of the heating device is improved. In addition, the scheme is beneficial to simplifying the assembly of the electronic equipment, reducing the volume of the electronic equipment and further improving the integration level of the electronic equipment.

Description

A circuit board, circuit board assembly and electronic equipment

technical field

The present application relates to the technical field of electronic equipment, in particular to a circuit board, a circuit board assembly and electronic equipment.

Background technique

With the continuous improvement of the power density of electronic products, the power of electronic devices is gradually increasing, and the heat generation of high-power devices and other heating devices is also increasing; the volume of electronic products is gradually miniaturized, and the integration of electronic devices is also increasing. Less cooling space. Therefore, the heat dissipation capability of high-power devices and other heat-generating devices has become a bottleneck for increasing the power density of electronic products. The traditional printed circuit board (PCB) relying on dense holes, heat-conducting plates or metal substrates for heat dissipation has been difficult to meet the requirements. The heat dissipation scheme Gradually develop from self-cooling/air-cooling solutions to liquid-cooling solutions.

In the prior art, a circuit board assembly includes a PCB and a heat generating device disposed on the PCB, in order to dissipate heat from the heat generating device in the above circuit board assembly. A cold plate can be provided in the electronic equipment, and the cold plate is connected to the heat-generating device through heat conduction. The above-mentioned cold plate has a cooling liquid channel, and the cooling liquid flows through the above-mentioned cooling liquid channel, so that the heat of the heat-generating device can be taken away. However, when the above-mentioned cold plate is connected to the heat-generating device through heat conduction, if the cold plate is in contact with the heat-generating device or a heat-conducting structure is provided between the cold plate and the heat-generating device, the thermal resistance in the heat-conducting link is large and the heat dissipation capacity is limited.

Contents of the invention

The present application provides a circuit board, a circuit board assembly and electronic equipment, which can improve the heat dissipation efficiency of a heating device, reduce the volume of the circuit board assembly, and improve the integration degree of the electronic equipment.

In a first aspect, the present application provides a circuit board assembly, which includes a heat generating device and a circuit board. The above-mentioned heating element is arranged on the surface of the circuit board. Specifically, the above-mentioned circuit board includes a substrate and a circuit layer disposed on the substrate, and the circuit layer is electrically connected to the heating device. The substrate includes an insulating substrate and a metal substrate, and the insulating substrate and the metal substrate are fixedly arranged. The circuit layer is arranged on the side of the insulating substrate away from the metal substrate, or in other words, an insulating substrate is arranged between the circuit layer and the metal substrate, for example, the insulating substrate can be an adhesive layer, so that the insulation between the circuit layer and the metal substrate is realized. A cooling liquid channel is provided in the metal base plate, and the cooling liquid channel is used to transmit cooling liquid, and the metal base plate is thermally connected to the heat-generating device, so that the metal base plate can be used to dissipate heat for the heat-generating device. In the technical solution of the present application, the cooling liquid channel is directly prepared in the metal substrate of the circuit board, which can make the distance between the cooling liquid and the heat-generating device shorter, and does not need to set up an additional heat-conducting layer, and the thermal resistance in the heat-conducting link is small , which is conducive to improving the heat dissipation capability of the heating device. In addition, the solution is also conducive to simplifying the assembly of the electronic equipment, reducing the volume of the electronic equipment, and further improving the integration degree of the electronic equipment.

Specifically, the above-mentioned circuit layer may be electrically connected to the heating device by welding. Alternatively, the above-mentioned circuit layer may also be electrically connected to the heating device through a connector, which is not limited in the present application.

The present application does not limit the setting of the layer structure of the circuit board. In one technical solution, the above-mentioned metal substrate may be arranged on the surface of the insulating substrate facing away from the circuit layer.

In another technical solution, the insulating substrate includes a first insulating substrate and a second insulating substrate, and the metal substrate is disposed between the first insulating substrate and the second insulating substrate. That is, the substrate is buried inside the insulating substrate.

In order to improve the heat dissipation capability of the metal substrate, heat dissipation fins may be arranged in the cooling liquid channel. The heat dissipation fins make the heat exchange area between the metal substrate and the cooling liquid larger, and the heat dissipation capability of the metal substrate is stronger.

The cooling liquid channel is formed on the metal substrate, which itself has certain corrosion resistance. However, in order to improve the corrosion resistance of the cooling channel, the inner wall of the cooling liquid channel may also be provided with an anti-corrosion layer.

The above-mentioned heating element is thermally connected to the metal substrate through the metal hole. The thermal conductivity of the metal hole is higher than that of the insulating substrate, which is beneficial to improving the heat exchange efficiency between the heating device and the metal substrate.

When specifically setting the metal substrate, the thickness of the metal substrate is made to be less than or equal to 4 mm. Making the thickness of the metal substrate thinner is beneficial to reducing the volume of the circuit board assembly. In addition, the thinner metal substrate has less rigidity, which can reduce the difference in thermal expansion coefficient between the metal substrate and the solder joint, so that the metal substrate and the solder joint are closer to the degree of deformation with temperature, which is conducive to improving the reliability of the solder joint of the metal substrate. Sex is higher.

In order to improve the heat conduction effect between the metal substrate and the heat generating device, the thermal conductivity of the insulating substrate is greater than or equal to 1W/m·K.

In an optional technical solution, the material of the metal substrate is not limited. For example, the metal substrate is a copper substrate, an aluminum substrate or a steel substrate.

In order to improve the heat dissipation capability of the circuit board, the circuit board includes at least two layers of metal substrates, and each layer of metal substrates is provided with a cooling liquid channel. In this solution, the circuit board can dissipate heat for the heating device through the two-layer metal substrate, and the heat dissipation capability is relatively strong. Especially for the scenario where heating devices are arranged on both sides of the circuit board.

In the second aspect, the present application also provides a circuit board, which includes a substrate and a circuit layer arranged on the substrate, and the circuit layer is electrically connected to the heating device; the substrate includes an insulating substrate and a metal substrate, and the insulating substrate and the metal substrate are fixedly arranged . A cooling liquid channel is arranged in the metal base plate, and the cooling liquid channel is used to transmit the cooling liquid, and the metal base plate is thermally connected to the heating device for dissipating heat from the heating device. The cooling liquid channel is directly prepared in the metal substrate of the circuit board, which can make the distance between the cooling liquid and the heat-generating device shorter, and does not need to set up an additional heat-conducting layer, and the thermal resistance in the heat-conducting link is small, which is conducive to improving the heat-generating device cooling capacity. In addition, the solution is also conducive to simplifying the assembly of the electronic equipment, reducing the volume of the electronic equipment, and further improving the integration degree of the electronic equipment.

In a third aspect, the present application further provides an electronic device, which includes a housing, a liquid cooling system, and the circuit board assembly provided in the first aspect. The circuit board assembly is arranged in the casing, and the liquid cooling system communicates with the cooling liquid channel of the circuit board, and drives the cooling liquid to flow through the cooling liquid channel to dissipate heat for the heat-generating components of the circuit board assembly. In this solution, the heat dissipation effect of the heating device is better, which can improve the working efficiency and service life of the electronic equipment. In addition, the circuit board assembly is small in size, which is conducive to improving the integration of electronic devices.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a circuit board assembly in an embodiment of the present application;

Fig. 3 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application;

Fig. 4 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application;

Fig. 5 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application;

Fig. 6 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application;

Fig. 7 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of a metal substrate in an embodiment of the present application;

FIG. 9 is another schematic cross-sectional view of the metal substrate in the embodiment of the present application;

FIG. 10 is another structural schematic diagram of the circuit board assembly in the embodiment of the present application.

Reference signs:

1 - shell;

2- Liquid cooling system;

3- Circuit board assembly;

31 - circuit board;

311 - Substrate;

3111-insulating substrate;

3112-metal substrate;

3113-coolant channel;

3114-radiating fins;

3115-separation partition;

312-circuit layer;

313 - metal hole;

32 - heating device.

Detailed ways

In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

The terms used in the following examples are for the purpose of describing particular examples only, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.

Reference to "one embodiment" or "a particular embodiment" or the like described in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.

In order to facilitate understanding of the circuit board, the circuit board assembly and the electronic device provided by the embodiments of the present application, the application scenarios thereof are firstly introduced below. The electronic devices in this application can be computing devices (such as servers), network devices (such as switches), and storage devices (such as storage arrays), or the above-mentioned electronic devices can also be electronic devices in energy storage systems or vehicle-mounted electronic devices. Equipment, such as energy storage cabinets, etc., as long as it is an electronic device that includes a heat-generating device, any electronic device that requires heat dissipation for the heat-generating device can adopt the technical solution in this application.

Fig. 1 is a schematic structural diagram of an electronic device in an embodiment of the present application. As shown in Fig. 1, in an embodiment of the present application, the above-mentioned electronic device includes a housing 1, a liquid cooling system 2 and a circuit board assembly 3, wherein, The circuit board assembly 3 is disposed on the casing 1 , and the liquid cooling system 2 is used for dissipating heat from the circuit board assembly 3 . In a specific embodiment, the above-mentioned liquid cooling system 2 may include structures such as a liquid storage tank, a liquid pump, or a heat exchanger, which will be described in detail here.

FIG. 2 is a schematic structural diagram of a circuit board assembly in an embodiment of the present application. The circuit board assembly 3 includes a circuit board 31 and a heating element 32 , and the heating element 32 is arranged on the circuit board 31 . Specifically, the circuit board 31 includes a substrate 311 and a circuit layer 312 , and the circuit layer 312 is disposed on the substrate 311 . The heating element 32 is electrically connected to the circuit layer 312 . Specifically, the above-mentioned heating element 32 is disposed on the surface of the circuit board 31 , and the connection method between the heating element 32 and the circuit layer 312 is not limited. The above-mentioned circuit board 31 can be provided with a plurality of electronic devices, and the heating device 32 is one of the electronic devices. The above-mentioned electronic devices are electrically connected to the circuit layer 312, and the electrical connection between different electronic devices can be realized through the above-mentioned circuit layer 312; or the above-mentioned The circuit board assembly 3 also includes a connector, which is also conductively connected to the circuit layer 312, so that the connector is electrically connected to the above-mentioned electronic device, and the above-mentioned connector is connected to other circuit board modules or electronic equipment, so that the above-mentioned electronic device can It is conductively connected with electronic devices other than the circuit board assembly 3 where it is located.

Please continue to refer to FIG. 2 , in a specific embodiment, the substrate 311 includes an insulating substrate 3111 and a metal substrate 3112 , and the insulating substrate 3111 and the metal substrate 3112 are fixedly arranged. In a specific implementation manner, the insulating substrate 3111 and the metal substrate 3112 may be fixedly arranged by pressing or embedding. The metal substrate 3112 is provided with a cooling liquid channel 3113, and the cooling liquid channel 3113 communicates with the liquid cooling system 2. Specifically, the cooling liquid channel 3113 and the liquid cooling system 2 can be connected by a liquid pipeline, so that the cooling liquid channel 3113 Forming a liquid cooling circuit with the liquid cooling system 2 , the metal substrate 3112 can be used to dissipate heat for the heat generating device 32 . Specifically, the heat-generating device 32 can be thermally connected to the metal substrate 3112 , so that the heat generated by the heat-generating device 32 can be transmitted to the metal substrate 3112 and then taken away by the cooling liquid, thereby dissipating heat for the heat-generating device 32 .

In the technical solution of the present application, the cooling liquid channel 3113 is directly prepared in the metal substrate 3112 of the circuit board 31, so that the distance between the cooling liquid and the heat generating device 32 can be shortened, and there is no need to set up an additional heat conducting layer. The thermal resistance is small, which is beneficial to improve the heat dissipation capability of the heating device 32 . In addition, the cooling liquid channel 3113 is prepared on the metal substrate 3112 of the circuit board 31 without setting an additional cold plate in the electronic device, which is conducive to simplifying the assembly of the electronic device, reducing the volume of the electronic device, and further improving the electronic device. level of integration.

In a specific implementation manner, the above-mentioned liquid cooling system 2 includes a liquid storage tank, a liquid pump, and a heat exchanger, and the above-mentioned liquid storage tank, liquid pump, heat exchanger, and cooling liquid channel 3113 are communicated through a liquid pipeline. Among them, the liquid storage tank can be used to store the cooling liquid, and the heat exchanger is used to exchange heat for the cooling liquid, so that the cooling liquid cools down; the liquid pump drives the cooling liquid to circulate between the above-mentioned cooling liquid channel 3113, the heat exchanger and the liquid storage tank , so that when the cooling liquid is in the cooling liquid channel 3113 , it can dissipate heat for the heating element 32 .

In the embodiment of the present application, the insulating substrate 3111 can be made of an insulating substrate 3111 with a high thermal conductivity, so as to further improve the heat dissipation efficiency of the heating device 32 . Specifically, the thermal conductivity of the insulating substrate 3111 is greater than or equal to 1W/m·K. For example, the thermal conductivity of the insulating substrate 3111 can also be 1.2W/m·K, 1.5W/m·K, 1.8W/m·K, 2W/m·K, 2.2W/m·K, 2.5W/m ·K, 3W/m·K or 3.5W/m·K, etc.

In a specific embodiment, the position of the metal substrate 3112 in the circuit board 31 is not limited. FIG. 3 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application. As shown in FIGS. 2 and 3 , in one embodiment, the metal substrate 3112 is located inside the insulating substrate 3111 . In other words, the circuit board 31 includes at least two layers of insulating substrates 3111 and at least one layer of metal substrate 3112 , and the metal substrate 3112 is located between the two layers of insulating substrates 3111 . In the embodiment shown in FIG. 3 , the insulating substrate 3111 may specifically include a first insulating substrate and a second insulating substrate, and the metal substrate 3112 is disposed between the first insulating substrate and the second insulating substrate. In this embodiment, the circuit board 31 can be provided with conductive layers on both sides of the metal substrate 3112 , and the circuit board 31 can be connected with heating devices 32 or electronic devices on both sides of the metal substrate 3112 . In this embodiment, both sides of the circuit board 31 are provided with heat-generating devices 32, and the cooling liquid channels 3113 in the metal substrate 3112 of the circuit board 31 can be fully used to dissipate heat for the heat-generating devices 32 on both sides. More heat-generating devices 32 dissipate heat, which is conducive to improving the working efficiency of the cooling liquid channel 3113 . In addition, the number of heating devices 32 or electronic devices arranged on the circuit board 31 is relatively large, which is beneficial to improve the integration degree of the circuit board assembly 3 . Certainly, in other embodiments, only one side of the circuit board 31 may be provided with the heat generating device 32 , as shown in FIG. 2 , which is not limited in the present application.

Fig. 4 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application. As shown in Fig. 4, in another embodiment, the above-mentioned metal substrate 3112 is arranged on one side surface of the insulating substrate 3111, and the heating element 32 can be It is arranged on the side of the insulating plate away from the above-mentioned metal substrate 3112 . In this embodiment, it is beneficial to simplify the manufacturing process of the circuit board 31 .

In another embodiment, when the metal substrate 3112 is disposed on one side surface of the insulating substrate 3111 , the coolant channel 3113 in the metal substrate 3112 may be a slotted flow channel. Fig. 5 is another schematic diagram of the structure of the circuit board assembly in the embodiment of the present application. As shown in Fig. 5, when the circuit board assembly 3 is formed, the grooved flow channel of the above-mentioned metal substrate 3112 can cover the upper cover to form a closed confluence. In a specific implementation manner, the above-mentioned upper cover may be connected to the above-mentioned grooved flow channel by welding.

In a specific embodiment, the manner of forming the cooling liquid channel 3113 on the metal substrate 3112 is not limited. For example, the metal substrate 3112 with the cooling liquid channel 3113 can be formed by sintering, machining, welding and other processes. For example, a metal substrate 3112 with an integral structure can be formed by adopting a sintering process, which is less prone to leakage and the like. Alternatively, the groove milling process can be used to form the slotted flow channel, and the upper cover can be welded to the notch of the above-mentioned slotted flow channel by a welding process to form a closed flow channel.

Figure 6 is another structural schematic diagram of the circuit board assembly in the embodiment of the present application. The efficiency of heat exchange between the substrate 3112 and the cooling liquid improves the heat dissipation capability of the circuit board assembly 3 .

In a specific embodiment, in order to increase the service life of the cooling liquid channel 3113, the inner wall of the cooling liquid channel 3113 may be provided with an anti-corrosion layer. The formation method of the anti-corrosion layer is not limited. For example, the anti-corrosion layer may be an oxide layer formed on the surface of the coolant channel 3113 of the metal substrate 3112. The oxide layer is equivalent to a passivation layer and is not easily corroded. Specifically, an anodic oxidation process may be used to form the above-mentioned oxide layer on the surface of the cooling liquid channel 3113 of the metal substrate 3112 . In other embodiments, an anti-corrosion layer can also be formed on the inner wall of the cooling liquid channel 3113 by electroplating. Specifically, a less active metal layer can be electro-plated on the inner wall of the cooling liquid channel 3113 as the anti-corrosion layer.

In a specific embodiment, the specific material of the above-mentioned metal substrate 3112 is not limited, for example, the above-mentioned metal substrate may be a copper substrate, an aluminum substrate or a steel substrate. The thermal conductivity of the metal substrate 3112 is relatively high. Therefore, this solution is conducive to improving the efficiency of heat exchange between the metal substrate 3112 and the heat-generating device 32 , and improving the heat dissipation effect of the heat-generating device 32 .

FIG. 7 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application. As shown in FIG. The metal hole 313 is thermally connected. The thermal conductivity of the metal hole 313 is relatively high, which is beneficial to improve the heat conduction efficiency between the heating element 32 and the cooling liquid channel 3113 . Specifically, the metal hole 313 may be a hollow cylinder formed by a metal layer, or may also be a metal pillar formed by a metal, which is not limited in the present application. When the metal hole 313 is a metal pillar, the heat conduction effect is higher.

When specifically setting the above-mentioned metal hole 313, the metal hole 313 can be directly located between the heating element 32 and the metal substrate 3112, such as the first metal hole shown in FIG. The projection completely covers the orthographic projection of the first metal hole on the substrate 311 , and this solution is beneficial to the heat conduction efficiency of the first metal hole. Alternatively, the metal hole 313 may not be located between the heating element 32 and the metal substrate 3112, such as the second metal hole shown in FIG. Orthographic projection of the metal hole on the substrate 311 , the second metal hole is connected between the conductive layer and the metal substrate 3112 . The conductive layer, the second metal hole and the metal substrate 3112 are all made of metal with high thermal conductivity. The heat-generating device 32 is thermally connected to the conductive layer, which can also improve the heat conduction efficiency between the heat-generating device 32 and the cooling liquid channel 3113 .

In a specific embodiment, the thickness of the metal substrate 3112 is less than or equal to 4 millimeters. For example, the thickness of the metal substrate 3112 may be 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.5 mm, 2.8 mm, 3 mm, 3.4 mm or 3.7 mm and so on. This embodiment can make the thickness of the metal substrate 3112 thinner, which is beneficial to reducing the volume of the circuit board assembly 3 and improving the integration of the circuit board assembly 3 and electronic equipment. In addition, in this embodiment, the rigidity of the metal substrate 3112 is small, which can reduce the difference in thermal expansion coefficient between the metal substrate 3112 and the solder joints, so that the degree of deformation of the metal substrate 3112 and the solder joints with temperature is relatively close, and the solder joints and the metal substrate Warping is not easy to occur between 3112. It is beneficial to improve the reliability of the solder joints of the metal substrate 3112 and is convenient for processing and manufacturing.

Please continue to refer to FIG. 7, the inner diameter of the above-mentioned cooling liquid channel 3113 is 1 mm to 3 mm, so that the cooling liquid flowing through the cooling liquid channel 3113 can meet the heat dissipation requirements of the circuit board assembly 3, and the metal substrate 3112 will not be too thick .

In addition, please continue to refer to FIG. 7 , the wall thickness of the metal substrate 3112 on both sides of the cooling liquid channel 3113 is greater than or equal to 0.5 mm, for example, 1 mm or 2 mm and so on. In this solution, the wall thickness of the metal substrate 3112 can make the metal substrate 3112 have a better resistance to compression, and is less likely to be deformed or damaged.

In the embodiment of the present application, there is no limitation on the arrangement of the cooling liquid channels 3113 in the metal substrate 3112 , as long as the cooling liquid can flow through. Figure 8 is a schematic cross-sectional view of the metal substrate in the embodiment of the present application. As shown in Figure 8, in a possible implementation, the above-mentioned cooling liquid channel 3113 can be a strip-shaped flow channel, and the above-mentioned strip-shaped flow channel can be in the form of Serpentine arrangement, this solution is beneficial to increase the path length of the cooling liquid flowing in the cooling liquid channel 3113 and improve the heat exchange effect.

FIG. 9 is another schematic cross-sectional view of the metal substrate in the embodiment of the present application. As shown in FIG. 9 , in another possible implementation manner, the above-mentioned cooling liquid channel 3113 may also be a cavity flow channel. That is to say, the metal substrate 3112 may have a cooling cavity, and the cooling cavity may be used as a cooling liquid channel. In one embodiment, the above-mentioned cooling cavity may also be provided with a divider partition 3115. On the one hand, the divider divider 3115 may divide the cooling cavity into multiple parts, so that the cooling liquid flows evenly in the cooling cavity. On the other hand, the splitter plate 3115 can also support the top and bottom walls of the cooling cavity, so that when the metal substrate 3112 and the insulating substrate 3111 are pressed together, the cooling cavity is not easily deformed, and the metal substrate 3112 has better strength. In another possible implementation manner, a plurality of support columns may also be provided in the above cooling chamber, and the support columns may play a role of turbulence on the one hand and improve the heat exchange efficiency between the cooling liquid and the metal substrate 3112 . On the other hand, the support column can also support the top wall and the bottom wall of the above-mentioned cooling chamber, so that when the metal substrate 3112 and the insulating substrate 3111 are pressed together, the cooling chamber is not easily deformed, and the metal substrate 3112 has better strength. Specifically, when the above-mentioned flow divider 3115 or support column is arranged, the above-mentioned flow divider 3115 or support column can be arranged on the periphery and center of the cooling chamber, or evenly distributed in the above-mentioned cooling chamber. Thereby, a better supporting effect can be achieved.

Certainly, in other embodiments, the above-mentioned coolant channels may also be arranged in other ways, which are not listed in this application.

In addition, the shape of the cross section of the cooling liquid channel 3113 is not limited, for example, it can be circular, semicircular or square, which can be selected and designed according to actual needs.

Fig. 10 is another schematic structural diagram of the circuit board assembly in the embodiment of the present application. As shown in Fig. 10, in one embodiment, the above-mentioned circuit board 31 includes at least two layers of the above-mentioned metal substrates 3112, and each layer of metal substrates 3112 is provided with The above-mentioned coolant channel 3113. In this embodiment, more cooling liquid can be used to dissipate heat for the heat-generating device 32 and improve the heat dissipation capability of the circuit board assembly 3 . Alternatively, in the embodiment shown in FIG. 10, when both sides of the circuit board 31 are provided with heat generating devices 32, the circuit board 31 is provided with two layers of metal substrates 3112, and two coolant passages 3113 are used to heat the heat on both sides respectively. Device 32 dissipates heat. Therefore, the heat dissipation effect of the heating device 32 can be improved, and the service life of the electronic equipment can be improved.

In a specific embodiment, the above-mentioned cooling liquid channel 3113 includes a liquid inlet and a liquid outlet, and the above-mentioned liquid inlet and liquid outlet are used to communicate with the liquid cooling system 2, and the cooling liquid flows from the above-mentioned liquid inlet to the cooling of the metal substrate 3112 Liquid channel 3113, and flow out of the cooling liquid channel 3113 from the liquid outlet. Specifically, when the above-mentioned liquid inlet and liquid outlet are arranged, in one embodiment, the above-mentioned liquid inlet and liquid outlet can be located on the side wall of the metal substrate 3112, and directly communicate with the liquid cooling system 2, which is conducive to simplifying the circuit board 31 structure, as shown in Figure 7. Alternatively, in another embodiment, the above-mentioned liquid inlet and liquid outlet can also be arranged on at least one of the two side surfaces of the circuit board 31 through the above-mentioned insulating substrate 3111 and the circuit layer 312 . Alternatively, one of the above-mentioned liquid inlet or liquid outlet may be disposed on the side wall of the metal substrate 3112 , and the other may be disposed on at least one of the two side surfaces of the circuit board 31 . In a word, the positions of the above-mentioned liquid inlet and liquid outlet can be set according to actual needs.

The inventors of the present application performed mechanical simulations based on the thickness of the metal substrate 3112, the diameter of the cooling liquid channel 3113, and the distribution area of the cooling liquid channel 3113. The thickness of the metal substrate 3112 in the technical solution of this application can be less than or equal to 2.0mm. 3112 can meet the requirements of high temperature and high pressure resistance for more than 60 minutes and continuously greater than or equal to 300PSI&180℃.

The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the application, and should cover Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (12)

1. The circuit board assembly is characterized by comprising a heating device and a circuit board, wherein the heating device is arranged on the surface of the circuit board; wherein,,

the circuit board comprises a substrate and a circuit layer arranged on the substrate, and the circuit layer is in conductive connection with the heating device; the substrate comprises an insulating substrate and a metal substrate, and the insulating substrate and the metal substrate are fixedly arranged;

the metal substrate is internally provided with a cooling liquid channel, the cooling liquid channel is used for transmitting cooling liquid, and the metal substrate is in heat conduction connection with the heating device and used for radiating heat for the heating device.

2. The circuit board assembly of claim 1, wherein the metal substrate is disposed on a side surface of the insulating substrate facing away from the circuit layer.

3. The circuit board assembly of claim 1, wherein the insulating substrate comprises a first insulating substrate and a second insulating substrate, the metal substrate being disposed between the first insulating substrate and the second insulating substrate.

4. A circuit board assembly according to any one of claims 1 to 3, wherein heat radiating fins are provided in the coolant passage.

5. The circuit board assembly of any one of claims 1-4, wherein an inner wall of the coolant channel has an anti-corrosion layer.

6. The circuit board assembly of any one of claims 1-5, wherein the heat generating device is thermally conductively coupled to the metal substrate via a metal aperture.

7. The circuit board assembly of any one of claims 1-6, wherein the metal substrate has a thickness of less than or equal to 4 millimeters.

8. The circuit board assembly of any one of claims 1-7, wherein the insulating substrate has a thermal conductivity greater than or equal to 1W/m-K.

9. The circuit board assembly of any one of claims 1-8, wherein the metal substrate is a copper substrate, an aluminum substrate, or a steel substrate.

10. The circuit board assembly of any one of claims 1 to 8, comprising at least two layers of said metal substrates, each layer of said metal substrate being provided with said coolant channels.

11. The circuit board is characterized by comprising a substrate and a circuit layer arranged on the substrate, wherein the circuit layer is in conductive connection with the heating device; the substrate comprises an insulating substrate and a metal substrate, and the insulating substrate and the metal substrate are fixedly arranged;

the metal substrate is internally provided with a cooling liquid channel, the cooling liquid channel is used for transmitting cooling liquid, and the metal substrate is in heat conduction connection with the heating device and used for radiating heat for the heating device.

12. An electronic device comprising a housing, a liquid cooling system, and the circuit board assembly of any one of claims 1-10, the circuit board assembly disposed in the housing, the liquid cooling system in communication with the cooling fluid passage of the circuit board.

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