CN115460865A - Cooling plate, circuit board assembly and liquid cooling server - Google Patents

Abstract

The embodiment of the application provides a cooling plate, a circuit board assembly and a liquid cooling server, and belongs to the technical field of cooling. The cooling plate comprises a snake-shaped flow passage, a liquid inlet and a liquid outlet; the serpentine flow channel is arranged in the cooling plate, is communicated with the liquid inlet and the liquid outlet and comprises a plurality of sub-flow channels which are arranged at intervals, and the cooling liquid enters the serpentine flow channel from the liquid inlet, flows through the sub-flow channels of the serpentine flow channel and is discharged from the liquid outlet; at least two sub-flow channels are arranged in parallel in the sub-flow channel close to the liquid inlet, and at least two sub-flow channels are arranged in series in the sub-flow channel close to the liquid outlet. The embodiment of the application aims at realizing the uniform cooling of the cooling plate to each heating element, reducing the maximum temperature of the heating element and improving the temperature control capability of the heating element, thereby prolonging the service life of the circuit board assembly and ensuring the safety of electronic products.

Description

Cooling plates, circuit board assemblies and liquid-cooled servers

technical field

The present application relates to the technical field of cooling, in particular to a cooling plate, a circuit board assembly and a liquid-cooled server.

Background technique

When using electronic products, heating elements (such as chips or batteries) in electronic products will continuously generate heat, and the accumulation of these heat will affect the performance of electronic products, so the heat dissipation of heating elements is particularly important. At present, cooling plates are usually used to dissipate heat from heating elements, but existing cooling plates cannot achieve uniform cooling of all heating elements in electronic products. The closer to the liquid inlet, the lower the temperature of the cooling liquid, and the better the cooling effect. The closer to the liquid outlet, the higher the temperature of the coolant, the worse the cooling effect.

Contents of the invention

In order to overcome the deficiencies of the prior art, the present application provides a cooling plate, a circuit board assembly and a liquid-cooled server, so as to solve the problem that the existing cooling plate cannot evenly lower the temperature of multiple heating elements.

In the first aspect, the present application provides a cooling plate, the cooling plate includes a serpentine flow channel, a liquid inlet and a liquid outlet; the serpentine flow channel is arranged inside the cooling plate, and the serpentine flow channel and the The liquid inlet and the liquid outlet are connected, and the serpentine flow channel includes a plurality of sub-channels arranged at intervals. The cooling liquid enters the serpentine flow channel from the liquid inlet, and flows through the The sub-channel of the serpentine channel is discharged from the liquid outlet;

Wherein, at least two sub-channels in the sub-channel near the liquid inlet are connected in parallel, and at least two sub-channels in the sub-channel near the liquid outlet are connected in series.

In a second aspect, the present application provides a circuit board assembly, including:

circuit board;

a plurality of chips arranged on the circuit board;

a cooling plate as described above;

The cooling plate is in thermal contact with the chip.

In a third aspect, the present application provides a liquid-cooled server, including the above-mentioned circuit board assembly.

The application provides a cooling plate, a circuit board assembly, and a liquid-cooled server. The cooling plate provided by the application includes a serpentine flow channel, a liquid inlet and a liquid outlet; by arranging the serpentine flow channel inside the cooling plate, the serpentine The flow channel is connected with the liquid inlet and the liquid outlet, and includes a plurality of sub-channels arranged at intervals, and at least two sub-channels are arranged in parallel in the sub-channels near the liquid inlet, and in the sub-channels near the liquid outlet There are at least two sub-channels connected in series. In this way, the flow velocity of the cooling liquid in the sub-channel near the liquid inlet and the sub-channel near the liquid outlet can be changed to change the flow velocity of the cooling liquid in each sub-channel to change the Reynolds number and heat transfer coefficient of the cooling liquid to achieve The cooling plate cools each heating element evenly, reduces the maximum temperature of the heating element, improves the temperature control ability of the heating element, thereby prolonging the service life of the circuit board components and ensuring the safety of electronic products.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application. Ordinary technicians can also obtain other drawings based on these drawings on the premise of not paying creative work.

Fig. 1 is a schematic top view of the structure of a cooling plate provided in the embodiment of the present application;

FIG. 2 is a schematic top view of another cooling plate provided in the embodiment of the present application;

FIG. 3 is a schematic top view of another cooling plate provided in the embodiment of the present application;

FIG. 4 is a schematic structural diagram of a cross-section of a sub-channel provided in an embodiment of the present application;

FIG. 5 is a schematic top view of another cooling plate provided in the embodiment of the present application;

FIG. 6 is a schematic structural diagram of a cross-section of a cooling plate provided in an embodiment of the present application;

Fig. 7 is a schematic structural diagram of a second rib provided in the embodiment of the present application;

Fig. 8 is a schematic top view of another cooling plate provided by the embodiment of the present application;

Fig. 9 (a) is a schematic diagram of the highest surface temperature of a circuit board chip provided by the prior art;

Fig. 9 (b) is a schematic diagram of the highest surface temperature of a circuit board chip provided by the embodiment of the present application;

Fig. 10 (a) is a schematic diagram of the pressure distribution of a circuit board chip provided by the prior art;

Figure 10(b) is a schematic diagram of the pressure distribution of a circuit board chip provided by the embodiment of the present application;

Reference signs:

100, cooling plate;

10. Liquid inlet;

20. Liquid outlet;

30. Serpentine runner; 31. Sub-runner; 32. First rib; 33. Second rib; 330. First rib area; 331. Second rib area

40. Thermal surface;

50, positioning hole.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between the various components in a certain posture , if the specific posture changes, the directional indication also changes accordingly.

It should also be noted that when an element is referred to as being “fixed” or “disposed on” another element, it can be directly on the other element or intervening elements may also exist. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element through intervening elements.

In addition, the descriptions involving "first", "second" and so on in the present application are only for the purpose of description, and should not be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present application.

Some implementations of the present application will be described in detail below in conjunction with the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

Please refer to Fig. 1, Fig. 1 is a schematic top view of the structure of the cooling plate 100 provided by the embodiment of the present application, the cooling plate 100 includes a serpentine flow channel 30, a liquid inlet 10 and a liquid outlet 20; the serpentine flow channel 30 is set Inside the cooling plate 100, the serpentine channel 30 communicates with the liquid inlet 10 and the liquid outlet 20. The serpentine channel 30 includes a plurality of sub-channels 31 arranged at intervals. The flow channel 30 flows through the sub-channel 31 of the serpentine flow channel 30 and is discharged from the liquid outlet 20; wherein, in the sub-channel 31 near the liquid inlet 10, there are at least two sub-channels 31 connected in parallel, close to the liquid outlet There are at least two sub-channels 31 in series in the sub-channels 31 of 20 .

Exemplarily, as shown in FIG. 1, the serpentine flow channel 30 in the cooling plate 100 may include a plurality of parallel linear sub-channels 31, and the plurality of parallel linear sub-channels 31 are connected in sequence to form a There are two sub-channels 31 connected in parallel in the sub-channel 31 near the liquid inlet 10, and there are three sub-channels 31 in series in the sub-channel 31 near the liquid outlet 20; and the liquid inlet 10 and the liquid outlet 20 can be provided at one end of the cooling plate 100 at the same time.

Exemplarily, as shown in FIG. 2, FIG. 2 is a schematic top view of another cooling plate structure provided by the embodiment of the present application; the serpentine flow channel 30 in the cooling plate 100 may include a plurality of parallel straight lines Flow channel 31, a plurality of parallel linear sub-channels 31 are sequentially connected to form a zigzag serpentine flow channel 30, there are two sub-channels 31 connected in parallel in the sub-channel 31 near the liquid inlet 10, and the two A parallel sub-flow channel 31 is also communicated with other two parallel sub-flow channels 31, and at the same time, there are two sub-flow channels 31 connected in series near the sub-flow channel 31 of the liquid outlet 20; and the liquid inlet 10 and the liquid outlet 20 may be disposed at one end of the cooling plate 100 at the same time.

It should be noted that the serpentine flow channel 30 in the cooling plate 100 of the present application can be any one of the curved serpentine flow channel 30, the zigzagging serpentine flow channel 30 and the combination of the curved flow channel and the zigzag flow channel The liquid inlet 10 and the liquid outlet 20 can be set at one end of the cooling plate 100 at the same time or at both ends of the cooling plate 100 respectively. The present application does not limit the type of the serpentine flow channel 30 and the specific arrangement of the liquid inlet 10 and the liquid outlet 20 , as long as the use effect of the cooling plate 100 is not affected.

The cooling plate 100 provided by the present application is mainly used for dissipating heat from heating elements in electronic equipment. The cooling plate 100 includes a serpentine flow channel 30, a liquid inlet 10 and a liquid outlet 20; Inside the plate 100 , the serpentine channel 30 communicates with the liquid inlet 10 and the liquid outlet 20 , and includes a plurality of sub-channels 31 arranged at intervals. Because the temperature of the cooling liquid in the sub-flow channel 31 near the liquid inlet 10 is relatively low, the lower flow rate can realize temperature control well, and the cooling liquid flows to the cooling liquid in the sub-flow channel 31 near the liquid outlet 20. The liquid temperature is relatively high, so it can be set that there are at least two sub-channels 31 in parallel in the sub-channel 31 near the liquid inlet 10, and there are at least two sub-channels 31 in series in the sub-channel 31 near the liquid outlet 20. Thereby, the flow velocity of the cooling liquid in the sub-flow channel 31 close to the liquid inlet 10 and the sub-flow channel 31 close to the liquid outlet 20 can be changed, so as to change the flow velocity of the cooling liquid in each sub-flow channel 31 to change the Reynolds number of the cooling liquid and heat transfer coefficient, thereby solving the problem that the cooling plate 100 has a poor cooling effect on the heating elements in the downstream flow channel due to the temperature of the cooling liquid in the downstream flow channel being higher than the temperature of the upstream flow channel, and realizing that the cooling plate 100 can control each heating element Uniform cooling and reduce the maximum temperature of the heating element, improve the temperature control ability of the heating element, thereby prolonging the service life of the circuit board components and ensuring the safety of electronic products.

In some embodiments, as shown in FIG. 3 , FIG. 3 is a schematic top view of another cooling plate structure provided by the embodiment of the present application; multiple sub-flow channels 31 are divided into upstream flow channels by the centerline of the cooling plate 100 and the downstream channel, the upstream channel includes sub-channels 31 arranged in parallel, and the downstream channel includes sub-channels 31 arranged in series. Thus, the flow velocity of the cooling liquid in the upstream flow channel and the downstream flow channel can be changed to change the flow velocity of the cooling liquid in the upstream flow channel and the downstream flow channel to change the Reynolds number and heat transfer coefficient of the cooling liquid, and realize the cooling plate 100 to each heating element uniform cooling.

Wherein, the upstream flow channel communicates with the liquid inlet 10 , and the downstream flow channel communicates with the liquid outlet 20 , and the cooling liquid enters the upstream flow channel from the liquid inlet 10 , flows through the downstream flow channel and is discharged from the liquid outlet 20 .

It should be noted that the dotted line in Fig. 3 is the midline, and the midline in this application does not refer to the line in the middle of the cooling plate 100 in a strict sense, as long as it can separate the liquid cooling plate into an upstream channel and a downstream channel. That is, the number of sub-channels 31 in the upstream channel and the number of sub-channels 31 in the downstream channel may be the same or different.

In some embodiments, the cross-sectional area of the serpentine flow channel 30 decreases continuously along the flow direction of the cooling liquid. By arranging a serpentine flow channel 30 with a decreasing cross-sectional area in the flow direction of the cooling liquid, the flow velocity of the cooling liquid in the downstream flow channel can also be increased to change the Reynolds number and heat transfer coefficient of the cooling liquid, thereby better solving the problem of Because the temperature of the cooling liquid in the downstream flow channel is higher than the temperature in the upstream flow channel, the effect of the cooling plate 100 on cooling the heating elements in the downstream flow channel is poor, and the cooling plate 100 can uniformly cool each heating element.

In some embodiments, among the two adjacent sub-channels 31, the cross-sectional area of the sub-channel 31 near the liquid inlet 10 is S1, and the cross-sectional area of the sub-channel 31 near the liquid outlet 20 is S2, Wherein, S2=(0.6-0.9)S1, when S2<0.6S1, the flow resistance of the sub-flow channel 31 near the liquid outlet 20 may be too large, increasing the power consumption of the water pump, when S2>0.9S1, It may cause that the liquid flow rate in the sub-channel 31 close to the liquid outlet 20 does not increase significantly, and it is difficult to achieve uniform cooling of each heating element.

In some embodiments, as shown in FIG. 4, FIG. 4 is a schematic structural diagram of the cross-section of the sub-channel provided by the embodiment of the present application; the sub-channel 31 located in the downstream channel is provided with at least one first rib 32, the second The height of a rib 32 is the same as that of the sub-channel 31 , and the first rib 32 divides the sub-channel 31 into several sub-channels. As a result, the flow velocity of the downstream channel is further increased, and the cooling effect of the cooling plate 100 on the heating element in the downstream channel is improved.

Exemplarily, the first rib 32 may not be provided on the sub-channel 31 located in the upstream channel, and only the first rib 32 may be provided on the sub-channel 31 located in the downstream channel; it may also be provided on the sub-channel 31 located in the upstream channel and the sub-channel 31 located in the downstream channel are all provided with first ribs 32 , but it is necessary to arrange fewer first ribs 32 on the upstream channel and more first ribs 32 on the downstream position.

Specifically, the serpentine flow channel can be provided with an increasing number of first ribs 32 in the cooling liquid flow direction, and the height of the first ribs 32 is the same as that of the serpentine flow channel. The flow velocity of the downstream channel improves the cooling effect of the cooling plate 100 on the heating element in the downstream channel.

It should also be noted that the sub-channel 31 located in the downstream channel is provided with at least one first rib 32 extending along the extending direction of the sub-channel 31 means that at least one first rib 32 is provided in each sub-channel 31 of the downstream channel. The first ribs 32 extending along the extending direction of the sub-runners 31, the number of the first ribs 32 in each sub-runner 31 in the downstream runner can be the same or different, and the height of the first ribs 32 is the same as that of the sub-runners 31 It means that the height of the first rib 32 is the same as the height of the sub-channel 31 where it is located.

Exemplarily, the serpentine channel 30 may include seven sub-channels 31 arranged at intervals, the upstream channel includes two sets of sub-channels 31 arranged in parallel, and the downstream channel includes three sub-channels 31 arranged in series. No first rib 32 is provided in the sub-channels 31 of the upstream channel; each sub-channel 31 of the downstream channel is provided with a first rib 32 extending along the extending direction of the sub-channel 31 .

Exemplarily, the serpentine channel 30 includes eight sub-channels 31 arranged at intervals, the upstream channel includes two sets of sub-channels 31 arranged in parallel, and the downstream channel includes four sub-channels 31 arranged in series. The sub-channels 31 of the upstream channel are not provided with first ribs 32; the sub-channels 31 of the downstream channel are respectively provided with one, two, three and four first ribs 32 in sequence along the cooling liquid flow direction.

Exemplarily, the serpentine channel 30 includes six sub-channels 31 arranged at intervals, the upstream channel includes a group of sub-channels 31 arranged in parallel, and the downstream channel includes four sub-channels 31 arranged in series. The sub-channels 31 of the upstream channel are not provided with first ribs 32; the sub-channels 31 of the downstream channel are respectively provided with two, two, three and three first ribs 32 along the cooling liquid flow direction.

In some embodiments, the thickness of the first rib 32 is 1.0-3.0 mm. When the thickness of the first rib 32 is less than 1.0 mm, it will bring inconvenience to the processing of the cooling plate 100. When the thickness of the first rib 32 is greater than 3.0 mm mm, the heat exchange area between the cooling liquid and the heating element will be reduced, thereby reducing the cooling effect of the cooling plate 100 on the heating element.

In some embodiments, as shown in FIG. 5, FIG. 5 is a schematic top view of another cooling plate structure provided by the embodiment of the present application; the sub-channel 31 located in the upstream channel and away from the liquid inlet 10 is provided with multiple There are two second ribs 33, and the sub-channels 31 located in the downstream channel are all provided with a plurality of second ribs 33; wherein, the height of the second ribs 33 is smaller than the height of the sub-channels 31. Therefore, the second rib 33 can be provided to increase the flow velocity of the corresponding sub-channel 31 , thereby improving the cooling effect of the heat-generating element in the corresponding sub-channel 31 of the cooling plate 100 .

Since the cooling liquid passes through the sub-channel 31 of the upstream flow channel near the liquid inlet 10, the temperature of the cooling liquid will become higher, so it can pass through the sub-channel 31 of the upstream flow channel away from the liquid inlet 10 and the downstream The sub-channels 31 of the flow channel are provided with second ribs 33 to increase the flow velocity of the corresponding sub-channels 31 , thereby improving the cooling effect of the heating element of the corresponding sub-channels 31 of the cooling plate 100 .

Specifically, the sub-channel 31 located in the downstream channel is provided with at least one second rib 33 extending along the extending direction of the sub-channel 31 means that each sub-channel 31 of the downstream channel is provided with at least one second rib 33 extending along the sub-channel 31. The second rib 33 extending in the extending direction of the channel 31, the number of the second rib 33 in each sub-channel 31 in the downstream flow channel can be the same or different, and the height of the second rib 33 is smaller than the height of the sub-channel 31 means that the second The height of the rib 33 is smaller than the height of the sub-channel 31 where it is located.

It should be noted that the second ribs 33 may extend along the extending direction of the sub-channel 31 at different inclination angles, and the inclination angle may be any angle, which is not specifically limited here.

Exemplarily, the serpentine channel 30 includes eight sub-channels 31 arranged at intervals, the upstream channel includes two sets of sub-channels 31 arranged in parallel, and the downstream channel includes four sub-channels 31 . There is no second rib 33 in the sub-channel 31 close to the liquid inlet 10 in the upstream flow channel; multiple second ribs 33 are provided in the sub-channel 31 away from the liquid inlet 10 in the upstream flow channel; A plurality of second ribs 33 are arranged in each channel 31 .

In some implementations, as shown in FIG. 6, FIG. 6 is a schematic structural diagram of the cross-section of the cooling plate provided by the embodiment of the present application; the cooling plate 100 includes a heat conducting surface 40 for contacting the heating element, and the second rib 33 is arranged on The inner wall of the sub-runner 31 is close to the side of the heat conducting surface 40 .

It should be noted that the second rib 33 can also be provided on the inner wall of the sub-runner 31 on the side away from the heat-conducting surface 40. If the second rib 33 is arranged on the inner wall of the sub-runner 31 near the heat-conducting surface 40, the corresponding The heat exchange area between the cooling liquid and the heat-generating element in the sub-runner 31 further improves the cooling effect of the cooling plate 100 on the corresponding heat-generating element in the sub-runner 31 .

In some embodiments, as shown in FIG. 7, FIG. 7 is a schematic structural diagram of a second rib 33 provided in the embodiment of the present application; a plurality of second ribs 33 form a first rib area 330 and a second rib area 331 In other words, the first rib area 330 and the second rib area 331 may form an included angle, and the direction of the included angle is opposite to the flow direction of the cooling liquid. The first rib area 330 and the second rib area 331 form an intersection point, and the intersection point is in contact with the cooling liquid before other parts of the first rib area 330 and the second rib area 331 . Thus, the intersection of the first rib area 330 and the second rib area 331 can be in direct contact with the cooling liquid, so that the intersection of the first rib area 330 and the second rib area 331 can destroy the boundary layer of the cooling liquid, thereby strengthening the Coolant heat exchange, therefore, even if the coolant temperature is slightly higher, the enhanced heat transfer improves the surface heat transfer coefficient to ensure better temperature control.

It should be noted that the direction of the included angle is the smaller angle formed by the first rib region 330 and the second rib region 331 , and the direction of the included angle is opposite to the flow direction of the cooling liquid.

Exemplarily, the first rib area 330 and the second rib area 331 may also form an arc, and the arc opening direction of the arc is the same as the flow direction of the cooling liquid. The first rib area 330 and the second rib area 331 form a rounded corner, and the rounded corner is in contact with the coolant before other parts of the first rib area 330 and the second rib area 331 . It is also possible to make the intersection of the first rib area 330 and the second rib area 331 directly contact with the cooling liquid, so that the intersection of the first rib area 330 and the second rib area 331 can destroy the boundary layer of the cooling liquid, thereby strengthening the cooling Therefore, even if the coolant temperature is slightly higher, the enhanced heat transfer improves the surface heat transfer coefficient and ensures better temperature control.

Wherein, both the first rib area 330 and the second rib area 331 may be composed of a plurality of second ribs 33 .

In some embodiments, the angle formed by the first rib area 330 and the second rib area 331 ranges from 30° to 80°.

By setting the included angle within 30°-80°, the heat exchange area between the cooling liquid and the heating element in the sub-channel 31 can be increased to the greatest extent, and the cooling effect of the cooling plate 100 on the heating element in the sub-channel 31 can be further improved. If the included angle is less than 30°, the effect of increasing the flow velocity of the corresponding sub-channel 31 is not obvious; if the included angle is greater than 80°, most of the coolant in the sub-channel 31 will be blocked, thereby affecting the flow rate of the sub-channel 31 .

In some embodiments, the height of the second rib 33 is 0.3-1.5 mm. When the height of the second rib 33 is less than 0.3 mm, the distance between the cooling liquid and the heating element in the sub-channel 31 provided with the second rib 33 is increased. The effect of the heat exchange area is not significant, and when the height of the second rib 33 is greater than 1.5mm, it will affect the flow rate of the cooling liquid in the sub-channel 31 provided with the second rib 33 .

In some embodiments, the distance between the second ribs 33 is 0.3-1.5 mm. When the distance between the second ribs 33 is less than 0.3 mm, the flow rate of the cooling liquid in the sub-channel 31 provided with the second ribs 33 will be affected. , when the distance between the second ribs 33 is greater than 1.5mm, the effect of increasing the heat exchange area between the cooling liquid and the heating element in the sub-channel 31 provided with the second ribs 33 is not significant.

Understandably, in order to further increase the heat exchange area between the cooling liquid and the heating element, the inner wall surface near the heat conducting surface 40 without the second rib 33 can be designed as an inwardly concave curved surface.

In some embodiments, the cross-sectional profile of the serpentine flow channel 30 is rectangular, and the manufacturing process of the liquid cooling plate in this embodiment is relatively simple.

It should be noted that the cross-sectional shapes of the multiple sub-channels 31 arranged at intervals in the serpentine channel 30 can be the same or the same, as long as the cross-sectional area of the sub-channels 31 is continuously reduced along the cooling liquid flow direction. Can.

Exemplarily, the cross-sectional shapes of the plurality of sub-channels 31 arranged at intervals are different, but the cross-sectional area of the sub-channels 31 decreases continuously in the cooling liquid flow direction.

In some embodiments, the cross-sectional profile of the serpentine channel 30 is rectangular, the width of the serpentine channel remains constant in the direction of coolant flow, and the height of the serpentine channel decreases continuously in the direction of coolant flow. The embodiment can accurately control the characteristic that the cross-sectional area of the serpentine flow channel decreases continuously along the cooling liquid flow direction.

In some embodiments, the height of the serpentine flow channel is 0.5-2.0 cm. When the height of the serpentine flow channel is less than 0.5 cm, the flow resistance in the serpentine flow channel 30 may be too large, which increases the power consumption of the water pump. , when the height of the serpentine flow channel is greater than 2.0 cm, it will cause waste of cooling liquid in the serpentine flow channel 30 .

In some embodiments, as shown in FIG. 8, FIG. 8 is a schematic top view of another cooling plate structure provided by the embodiment of the present application; the turning position at the junction of the two communicating sub-channels 31 is rounded. . In this way, the cooling effect of the cooling plate 100 on the heating element can be improved, and the fabrication is convenient.

In some embodiments, the cross-sectional profile of the serpentine flow channel 30 is a rectangle with rounded corners, and the radius of curvature of the rounded corners is 0.2-2 mm. When the radius of curvature of the rounded corners is less than 0.2 mm, it is difficult to process them into rounded corners. For a rectangle, when the radius of curvature of the rounded corners is greater than 2mm, the cooling effect of the cooling plate 100 on the heating element will be reduced.

In some embodiments, the cooling plate 100 includes a main body, a first end cover and a second end cover. The main body is provided with a plurality of sub-flow channels 31 arranged at intervals. The first end cover is arranged at one end of the main body, and the second end cover Located at the other end of the main body, the main body, the first end cover and the second end cover form a serpentine flow channel 30 , which improves the detachability of the cooling plate 100 and facilitates maintenance of the cooling plate 100 .

In some embodiments, the main body of the cooling plate 100 is made of aluminum material by drawing process, and the processing steps of the cooling plate 100 are reduced in this embodiment, and the production cost is reduced.

The embodiment of the present application also provides a circuit board assembly. The circuit board assembly includes a circuit board, a plurality of chips, and any cooling plate 100 described above. Understandably, the heat conduction contact between the cooling plate 100 and the chip means that the chip is disposed on the heat conduction surface 40 of the cooling plate 100 .

Wherein, the cooling plate 100 further includes a plurality of positioning holes 50, and these positioning holes 50 are used for fixedly connecting the cooling plate 100 with the circuit board provided with chips, so that the cooling plate 100 is in thermal contact with the chips.

Exemplarily, a plurality of chips can be packaged on a circuit board, and the cooling plate 100 and the circuit board can be connected by means of screw connection, etc., thereby improving the detachability of the cooling plate 100 and the circuit board, and facilitating replacement of the circuit board or cooling Plate 100.

From experiments, as shown in Figure 9(a), Figure 9(b), Figure 10(a) and Figure 10(b), the highest surface temperature of the circuit board chip in the circuit board assembly in the prior art generally reaches 63.5 ℃, while the highest surface temperature of the circuit board chip in the circuit board assembly in the embodiment of the present application is only 62.1 ℃, and the maximum temperature can be reduced by 1.4 ℃. At the same time, the temperature distribution on the chip surface is relatively uniform, and the pressure is basically consistent. In this way, the cooling plate 100 can uniformly lower the temperature of each chip, reduce the maximum temperature of the chip, and improve the temperature control capability of the chip, thereby prolonging the service life of the circuit board components and ensuring the safety of electronic products.

An embodiment of the present application further provides a liquid-cooled server, and the liquid-cooled server includes the circuit board assembly described above. The circuit board assembly is provided with components such as data interfaces and power interfaces to ensure the normal operation of the liquid-cooled server.

The above is only a specific embodiment of the application, but the scope of protection of the application is not limited thereto. Any person familiar with the technical field can easily think of various equivalents within the scope of the technology disclosed in the application. Modifications or replacements, these modifications or replacements shall be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (14)

1. A cooling plate, characterized in that the cooling plate comprises: Liquid inlet and outlet; A serpentine flow channel is arranged inside the cooling plate, the serpentine flow channel communicates with the liquid inlet and the liquid outlet, and the serpentine flow channel includes a plurality of sub-flow channels arranged at intervals, Cooling liquid enters the serpentine flow channel from the liquid inlet, flows through the sub-channels of the serpentine flow channel, and is discharged from the liquid outlet; Wherein, at least two sub-channels in the sub-channel near the liquid inlet are connected in parallel, and at least two sub-channels in the sub-channel near the liquid outlet are connected in series. 2. The cooling plate according to claim 1, wherein the plurality of sub-flow channels are divided into an upstream flow channel and a downstream flow channel by the center line of the cooling plate, and the upstream flow channel includes sub-flow channels arranged in parallel. A flow channel, the downstream flow channel includes sub-channels arranged in series. 3 . The cooling plate according to claim 1 , wherein the cross-sectional area of the serpentine flow channel decreases continuously along the flow direction of the cooling liquid. 4 . 4. The cooling plate according to claim 3, characterized in that, among the two adjacent sub-channels, the cross-sectional area of the sub-channel close to the liquid inlet is S1, and the cross-sectional area of the sub-channel close to the liquid outlet is S1. The cross-sectional area of the sub-channel of the liquid port is S2, wherein, S2=(0.6-0.9)S1. 5. The cooling plate according to claim 2, wherein the sub-channel located in the downstream channel is provided with at least one first rib, and the height of the first rib is the same as that of the sub-channel. The heights are the same, and the first rib divides the sub-channel into several sub-channels. 6. The cooling plate according to claim 2, wherein the sub-channel located in the upstream channel away from the liquid inlet is provided with a plurality of second ribs; and located in the downstream channel Each of the sub-channels is provided with a plurality of second ribs; wherein, the height of the second ribs is smaller than the height of the sub-channels. 7. The cooling plate according to claim 6, characterized in that, the cooling plate comprises a heat conducting surface for contacting heating elements, and the second rib is provided on the side of the sub-runner close to the heat conducting surface inner wall. 8. The cooling plate according to claim 6, wherein a plurality of the second ribs form a first rib area and a second rib area, and the first rib area and the second rib area form an included angle , the direction of the included angle is opposite to the flow direction of the cooling liquid. 9. The cooling plate according to claim 8, characterized in that, the angle range of the included angle is 30°-80°. 10 . The cooling plate according to claim 1 , characterized in that, the turning positions of the two joints communicating with the sub-channels are rounded. 11 . 11. The cooling plate according to claim 10, characterized in that, the width of the sub-channel is constant in the direction of coolant flow, and the height of the sub-channel is in the direction of flow of coolant in the sub-channel Gradually decreases. 12. The cooling plate according to any one of claims 1 to 11, wherein the cooling plate comprises: The main body has a plurality of sub-runners arranged at intervals inside; a first end cap, arranged at one end of the main body; a second end cap disposed at the other end of the main body; Wherein, the main body, the first end cap and the second end cap enclose the serpentine flow channel. 13. A circuit board assembly, characterized in that it comprises: circuit board; a plurality of chips arranged on the circuit board; The cooling plate according to any one of claims 1 to 12, which is in thermal contact with the chip. 14. A liquid-cooled server, comprising the circuit board assembly according to claim 13.

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