CN116259593A - Heat dissipation plate structure, integrated circuit module and manufacturing method thereof - Google Patents

Abstract

The invention discloses a heat radiation plate structure, an integrated circuit module and a manufacturing method thereof, relating to the technical field of circuit board manufacturing, wherein the heat radiation plate structure comprises: the ceramic substrate, the upper surface of the said ceramic substrate has conductive lines; a plurality of first heat conduction metal blocks are arranged on the lower surface of the ceramic substrate at intervals, and spacing grooves are formed between the first heat conduction metal blocks; the area corresponding to the spacing groove is provided with a plurality of second heat conduction metal blocks, and the upper surfaces of the second heat conduction metal blocks are in the same horizontal plane with the lower surfaces of the first heat conduction metal blocks and are in contact connection; the first heat conduction metal blocks and the second heat conduction metal blocks are arranged in a staggered mode, so that the contact area between the first heat conduction metal blocks and a heat dissipation medium is increased, and the heat dissipation performance and the integration level of the ceramic substrate are effectively improved.

Description

Heat dissipation plate structure, integrated circuit module and manufacturing method thereof

technical field

The invention relates to the technical field of circuit board production, in particular to a radiator plate structure, an integrated circuit module and a production method thereof.

Background technique

In today's society, various power equipment and electronic equipment are used more and more widely. These equipment need power management and power control to ensure their high-efficiency, high-precision and high-reliability operation; power chips, as an integrated circuit, have a variety of The power control function can meet the needs of different electronic equipment and power systems.

For the packaging of power chips, chip heat dissipation is a very challenging reliability issue, especially for ultra-high power scenarios such as high-performance computing; at present, the use of micro-channel heat sinks with ceramic substrates is the solution to the problem of high-power chip heat dissipation The mainstream solution, the specific method is to integrate the micro-channel heat sink and the ceramic substrate packaged with the device in the later stage. Although this method can improve the heat dissipation effect, because the chip is packaged in the way of splicing components in the later stage, the ceramic substrate The overall thermal performance and integration are low.

Contents of the invention

Based on this, it is necessary to provide a cooling plate structure, an integrated circuit module and a manufacturing method for the above technical problems, so as to solve the problem of integrating the microchannel radiator with the ceramic substrate packaged with the device in the prior art. This leads to the problem of low overall heat dissipation performance and low integration of the ceramic substrate.

In a first aspect, an embodiment of the present invention provides a heat dissipation plate structure, including:

A ceramic substrate, the upper surface of the ceramic substrate is provided with conductive lines;

A plurality of first heat-conducting metal blocks are arranged at intervals on the lower surface of the ceramic substrate, and interval grooves are arranged between each of the first heat-conducting metal blocks;

The area corresponding to the interval groove is provided with several second heat-conducting metal blocks, and the upper surface of the second heat-conducting metal block is at the same level as the lower surface of the first heat-conducting metal block and is in contact with each other.

Said scheme has the following beneficial effects:

In the heat dissipation plate structure of the present invention, a plurality of first heat-conducting metal blocks arranged at intervals are arranged on the lower surface of the ceramic base material, interval grooves are formed between each first heat-conducting metal blocks, and second heat-conducting metal blocks are arranged in the corresponding area below the interval grooves , so that the first heat-conducting metal blocks and the second heat-conducting metal blocks are alternately arranged, so as to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

Optionally, the first heat-conducting metal blocks have a rectangular structure, and the interval grooves are arranged in the first direction or the second direction between each of the first heat-conducting metal blocks.

Optionally, the first heat-conducting metal blocks have a square structure, and the interval grooves are provided between each of the first heat-conducting metal blocks in both the first direction and the second direction.

Optionally, both ends of the interval groove communicate with edges of the ceramic substrate respectively.

Optionally, the heat dissipation plate structure also includes:

a heat dissipation box, the heat dissipation box is arranged on the lower surface of the ceramic substrate, and the heat dissipation box wraps the first heat conduction metal block and the second heat conduction metal block;

One end of the radiator box is provided with a coolant inlet, and the other end of the radiator box is provided with a coolant outlet.

In a second aspect, an embodiment of the present invention provides a method for manufacturing a heat sink, including:

providing a ceramic substrate;

making a first metal seed layer on the upper surface of the ceramic substrate, and making a second metal seed layer on the lower surface of the ceramic substrate;

making conductive lines on the outer surface of the first metal seed layer;

Making a plurality of first heat-conducting metal blocks on the outer surface of the second metal seed layer, each of the first heat-conducting metal blocks is arranged at intervals to form interval grooves;

A plurality of second heat-conducting metal blocks are fabricated in the area corresponding to the interval groove, and the upper surface of the second heat-conducting metal block is at the same level as the lower surface of the first heat-conducting metal block and is in contact with each other.

Said scheme has the following beneficial effects:

In the manufacturing method of the heat dissipation plate structure of the present invention, a metal seed layer is made on the lower surface of the ceramic base material, and first heat-conducting metal blocks are made at intervals on the outer surface of the metal seed layer, and interval grooves are formed between each first heat-conducting metal block, and the interval The second heat conduction metal block is made under the groove, so that the first heat conduction metal block and the second heat conduction metal block form a staggered arrangement, so as to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance of the ceramic substrate and Integration.

Optionally, several first heat-conducting metal blocks are fabricated on the outer surface of the second metal seed layer, including:

Making a first photoresist layer on the surface of the metal seed layer on the lower surface of the ceramic substrate, exposing and developing the first photoresist layer;

In the first direction and/or the second direction of the edge of the first photoresist layer, a plurality of first electroplating tanks spaced at a first preset distance are sequentially fabricated, and metal is electroplated in the first electroplating tanks to form the The first thermally conductive metal block.

Optionally, several second heat-conducting metal blocks are made in the area corresponding to the interval groove, including:

making a second photoresist layer on the plane where the lower surface of each of the first heat-conducting metal blocks is located, and exposing and developing the second photoresist layer;

Make several second electroplating grooves on the lower surface of the second photoresist layer corresponding to the intervals or intersecting areas of the first electroplating grooves, and electroplate metal in the second electroplating grooves to form the second heat-conducting metal piece.

Optionally, after making several second heat-conducting metal blocks in the area corresponding to the interval groove, including:

Make a heat dissipation box on the lower surface of the ceramic substrate, and make a coolant inlet and a coolant outlet at both ends of the heat dissipation box, so that the heat dissipation box wraps the first heat-conducting metal block and the second Thermally conductive metal block.

In a third aspect, an embodiment of the present invention provides an integrated circuit module, comprising the heat dissipation plate structure described in the first aspect and an integrated chip, the integrated chip being mounted on the upper surface of the ceramic substrate.

Said scheme has the following beneficial effects:

In the integrated circuit module of the present invention, the integrated chip is mounted on the upper surface of the heat dissipation substrate, the lower surface of the ceramic substrate is provided with a first heat-conducting metal block and a second heat-conducting metal block, and interval grooves are formed between each first heat-conducting metal block, A second heat-conducting metal block is provided in the area corresponding to the lower part of the interval groove, so that the first heat-conducting metal block and the second heat-conducting metal block are alternately arranged, so as to increase the contact area with the heat-dissipating medium, thereby effectively generating integrated chips. The heat is conducted out through the first heat-conducting metal block and the second heat-conducting metal block, so as to improve the overall heat dissipation performance of the integrated circuit module.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention , for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.

Fig. 1 is a schematic diagram of a first heat dissipation plate structure provided in an embodiment of the present invention;

Fig. 2 is a schematic diagram of a second cooling plate structure provided in an embodiment of the present invention;

Fig. 2 (a) is a top view of the first heat-conducting metal block structure provided in an embodiment of the present invention;

Fig. 2 (b) is a side view of the first heat-conducting metal block structure provided in an embodiment of the present invention;

Fig. 2 (c) is a top view of the second heat-conducting metal block structure provided in an embodiment of the present invention;

Fig. 2 (d) is the side view of the structure of the second heat-conducting metal block provided in an embodiment of the present invention;

Fig. 2 (e) is the top view of the structure of the third heat-conducting metal block provided in an embodiment of the present invention;

Fig. 2 (f) is the side view of the structure of the third heat-conducting metal block provided in an embodiment of the present invention;

Fig. 3 is a schematic diagram of an integrated circuit module provided in an embodiment of the present invention;

Fig. 4 is a schematic flow chart of a manufacturing method of a heat sink provided in an embodiment of the present invention;

Fig. 5 (a) is a schematic diagram of making a metal layer provided in an embodiment of the present invention;

Fig. 5 (b) is a schematic diagram of making a photoresist pattern provided in an embodiment of the present invention;

Figure 5(c) is a schematic diagram of making the first heat-conducting metal block provided in an embodiment of the present invention;

Figure 5(d) is another schematic diagram of making a photoresist pattern provided in an embodiment of the present invention;

Figure 5(e) is a schematic diagram of making a second heat-conducting metal block provided in an embodiment of the present invention;

FIG. 5(f) is a schematic diagram of removing a photoresist pattern provided in an embodiment of the present invention;

Fig. 5 (g) is the schematic diagram of making heat dissipation box provided in an embodiment of the present invention;

The symbols are explained as follows:

100. Ceramic substrate; 110. First metal seed layer; 120. Second metal seed layer; 200. First photoresist layer; 210. Conductive circuit; 300. Second photoresist layer; 310. First heat-conducting metal block 311, spacer groove; 320, third photoresist layer; 330, second heat-conducting metal block; 400, cooling box; 410, coolant inlet; 420, coolant outlet; 500, integrated chip; 510, pin.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

It is to be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of carrying out the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

It will also be understood that, although the terms first, second etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

It should also be understood that the terms "upper", "lower", "left", "right", "front", "rear", "bottom", "middle", "middle", "top", etc. may be used herein For describing various elements, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, construction and operation in a particular orientation, and therefore these elements should not be limited by these terms.

These terms are only used to distinguish one element from another. For example, a first element could be termed an "upper" element, and, similarly, a second element could be termed an "upper" element depending on the relative orientation of the elements, without departing from the scope of the present disclosure.

It is further to be understood that the terms "comprises", "comprises", "comprises" and/or "comprises" when used herein specify the presence of stated features, integers, steps, operations, elements and/or components but do not exclude the presence of Or add one or more other characteristics, integers, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted to have a meaning consistent with their meaning in the context of this specification and related art, and not to be interpreted in an idealized or overly formal sense unless expressly so defined herein.

As shown in FIG. 1 , it is a heat dissipation plate structure provided in Embodiment 1 of the present application. The heat dissipation plate structure includes: a ceramic substrate 100, wherein a conductive circuit 210 is provided on the upper surface of the ceramic substrate 100; The lower surface of the material 100 is provided with a number of first heat-conducting metal blocks 310 at intervals, and interval grooves 311 are arranged between each first heat-conducting metal blocks 310; The upper surfaces of the second heat-conducting metal block 330 and the lower surface of the first heat-conducting metal block 310 are at the same level and connected in contact.

In the heat dissipation plate structure of this embodiment, a plurality of first heat-conducting metal blocks are arranged at intervals on the lower surface of the ceramic base material, interval grooves are formed between each first heat-conducting metal block, and second heat-conducting metal blocks are arranged in the corresponding area below the interval groove. The first heat conduction metal blocks and the second heat conduction metal blocks are alternately arranged to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate.

As shown in Figure 2, it is a heat dissipation plate structure provided in Embodiment 2 of the present application. The difference between the heat dissipation plate structure and the heat dissipation plate structure in Embodiment 1 is that the heat dissipation plate structure also includes a heat dissipation box 400, which The cooling box 400 is arranged on the lower surface of the ceramic substrate 100, and the cooling box 400 completely wraps each first heat-conducting metal block 310 and each second heat-conducting metal block 330; one end of the cooling box 400 is provided with a coolant inlet 410, and the other end A coolant outlet 420 is provided, and the radiating coolant enters from the coolant inlet 410, and flows out from the coolant outlet 420 after passing through the metal microchannel heat dissipation structure composed of the first heat-conducting metal block 310 and the second heat-conducting metal block 330, thereby improving The heat dissipation effect of the heat sink.

In this embodiment, three kinds of shapes and relative setting positions of the first heat-conducting metal block and the second heat-conducting metal block are provided; The top view of the metal block, Fig. 2 (b) is a side view of the first heat-conducting metal block and the second heat-conducting metal block, as can be seen from Fig. 2 (a) and Fig. 2 (b), the first heat-conducting metal block 310 and The second heat-conducting metal blocks 330 are all rectangular structures, and each first heat-conducting metal block 310 is arranged at a certain distance, and an interval groove is formed between each first heat-conducting metal block 310, and the distance between each first heat-conducting metal block 310 Can be equal or not equal; each second heat-conducting metal block 330 is located on the surface of the first heat-conducting metal block 310, vertically interlaced with each first heat-conducting metal block 310, and the distance between each second heat-conducting metal block 330 can be equal , can also be unequal; the width and thickness of the first heat-conducting metal block 310 and the second heat-conducting metal block 330 can be equal or unequal, and there is no limitation here.

Fig. 2(c) is a top view of the second type of the first heat-conducting metal block and the second heat-conducting metal block provided in this embodiment, and Fig. 2(d) is the side view of the second type of the first heat-conducting metal block and the second heat-conducting metal block 2(c) and 2(d), it can be seen that the first heat-conducting metal block 310 and the second heat-conducting metal block 330 are rectangular structures, and each first heat-conducting metal block 310 is arranged at a certain distance. Interval grooves are formed between the first heat-conducting metal blocks 310, and the distances between the first heat-conducting metal blocks 310 can be equal or not equal; above the interval groove, and the lower surface of the second heat conduction metal block 330 is in contact with the upper surface of the first heat conduction metal block 310; the width of the second heat conduction metal block 330 is greater than the width of the interval groove between the first heat conduction metal block 310 , so that the lower surface of the second heat-conducting metal block 330 can effectively contact and connect with the upper surface of the first heat-conducting metal block 310 .

Fig. 2(e) is a top view of the third first heat-conducting metal block and the second heat-conducting metal block provided in this embodiment, and Fig. 2(f) is a side view of the third kind of first heat-conducting metal block and the second heat-conducting metal block 2(e) and 2(f), it can be seen that the first heat-conducting metal block 310 and the second heat-conducting metal block 330 are square or rectangular in structure, and each first heat-conducting metal block 310 is placed under the ceramic substrate 100. The first direction and the second direction of the surface are arranged at a certain distance, so as to form the intersecting grooves. In the first direction and the second direction, the distances between the first heat-conducting metal blocks 310 can be equal. , can also be different; each second heat-conducting metal block 330 is arranged in the area where the interval groove crosses, and the lower surface of the second heat-conducting metal block 330 is in contact with the upper surface of the first heat-conducting metal block 310, and the second heat-conducting metal block 330 is also square or rectangular.

In this embodiment, the interval grooves between the first heat-conducting metal blocks 310 and the second heat-conducting metal blocks 330 communicate with the edge of the ceramic substrate 100, that is, the external air, so as to maintain good ventilation and improve the heat dissipation of the heat sink. cooling effect.

In this embodiment, the metal material may be copper or other metal materials with better thermal conductivity.

As another embodiment, N layers of heat-conducting metal blocks are arranged on the lower surface of the ceramic substrate 100, and N is an integer greater than 2; the heat-conducting metal blocks of each layer can be rectangular, square, circular or other arbitrary shapes, and the heat-conducting metal blocks of each layer can be Interval grooves communicating with the outside air are formed between the metal blocks to further increase the contact area with the heat dissipation medium and improve the heat dissipation effect of the heat dissipation plate.

The cooling plate structure of this embodiment has the following characteristics:

(1) The first heat-conducting metal blocks and the second heat-conducting metal blocks are alternately arranged to increase the overall heat dissipation area, thereby effectively improving the heat dissipation performance and integration of the ceramic substrate;

(2) The interval groove is set to communicate with the external air, so that the air can flow freely on the surface of the heat-conducting metal block, thereby improving the heat dissipation effect of the heat dissipation plate;

(3) A heat dissipation box is arranged on the lower surface of the ceramic substrate, so that the first heat conduction metal block and the second heat conduction metal block are placed in the heat dissipation box, and the coolant flows in the heat dissipation box to take away the heat conducted by the heat conduction metal block, Further improve the cooling effect.

As shown in FIG. 3 , it is an integrated circuit module provided in Embodiment 3 of the present application. The integrated circuit module includes: the heat dissipation plate structure in Embodiment 1 or Embodiment 2 and an integrated chip 500 , wherein the integrated chip 500 is mounted On the upper surface of the ceramic substrate 100 , the pins 510 of the integrated chip 500 are connected to the conductive lines on the upper surface of the ceramic substrate 100 .

In an application scenario, the integrated chip 500 generates a certain amount of heat during operation, and the heat is conducted to the heat-conducting metal block on the lower surface through the ceramic substrate; It can be gaseous air or liquid coolant. The coolant flows out from the coolant outlet 420. When the coolant flows, it takes away heat from the surface of the heat-conducting metal block, thereby improving the overall heat dissipation performance of the integrated circuit module.

As shown in Figure 4, a method for manufacturing a heat sink provided in Embodiment 4 of the present application may include the following steps:

Step S100: providing a ceramic substrate.

In this embodiment, a ceramic substrate with a preset size is used; according to the heat dissipation requirements of the product, the material of the ceramic substrate can be one of alumina, aluminum nitride, silicon nitride, silicon carbide, and zirconia toughened alumina , can also be diamond; as a preferred solution, the ceramic substrate is selected as aluminum nitride.

The ceramic substrate can be square (rectangular or square) or circular; when the minimum line of the conductive circuit pattern is ≤ 10 μm, a circular ceramic substrate is preferred, and it is processed based on wafer platform equipment.

Step S200: making a first metal seed layer on the upper surface of the ceramic substrate, and making a second metal seed layer on the lower surface of the ceramic substrate.

Referring to Fig. 5 (a), the first metal seed 110 is made on the upper surface of the ceramic substrate 100 by sputtering or vapor deposition, and the second metal seed layer 120 is made on the lower surface; the optional composition of the metal seed layer is titanium tungsten/tungsten One of copper, titanium/copper, stainless steel/copper, so as to realize the metallization of the upper and lower surfaces of the ceramic substrate 100 .

Step S300: making conductive lines on the outer surface of the first metal seed layer.

Referring to Fig. 5(b), the first photoresist layer 200 is made on the upper surface of the ceramic substrate 100, exposed and developed, and a window pattern is formed at a preset position; when the minimum size of the conductive circuit pattern or the microchannel pattern is ≤ 10 μm When , the photoresist layer is preferably photoresist, otherwise it is preferably dry film; see FIG.

Step S400: Fabricate a plurality of first heat-conducting metal blocks on the outer surface of the second metal seed layer, and arrange the first heat-conducting metal blocks at intervals to form interval grooves.

Referring to Fig. 5(b), the second photoresist layer 300 is fabricated on the lower surface of the ceramic substrate 100, exposed and developed, and then the first heat-conducting metal block is fabricated. In this embodiment, the first heat-conducting metal block is fabricated The method is as follows:

On the first direction of the edge of the second photoresist layer 300, a number of first electroplating tanks with a certain distance are sequentially fabricated, as shown in FIG. a) and the first thermally conductive metal block 310 shown in FIG. 2( b ).

The second method of making the first thermally conductive metal block is as follows:

In the second direction on the edge of the second photoresist layer 300, several first electroplating tanks with a certain distance are made sequentially, as shown in FIG. c) and the first heat-conducting metal block 310 shown in FIG. 2( d ).

The third method of making the first heat-conducting metal block is as follows:

On the first direction and the second direction of the edge of the second photoresist layer 300, a number of first electroplating tanks with a certain distance are sequentially fabricated, as shown in FIG. 5(c), metal copper is electroplated in the first electroplating tanks to form The first thermally conductive metal block 310 is shown in FIG. 2( e ) and FIG. 2( f ).

Step S500: Fabricate several second heat-conducting metal blocks in the area corresponding to the interval groove, the upper surface of the second heat-conducting metal block is at the same level as the lower surface of the first heat-conducting metal block and is in contact with each other.

Referring to Fig. 5 (d), the photoresist layer is made on the surface of the conductive circuit on the upper surface of the ceramic substrate 100 to cover the conductive circuit; the third photoresist layer 320 is made on the surface of the first heat-conducting metal block 310, and exposed and Developing, forming a window pattern at the preset position of the third photoresist layer to make the second heat-conducting metal block; when the minimum size of the window in the window pattern≤10 μm, the photoresist layer is preferably photoresist, otherwise it is preferably dry membrane.

In this embodiment, the first method of making the second heat-conducting metal block is as follows:

This method corresponds to the above-mentioned first method of making the first heat-conducting metal block. In the second direction on the edge of the third photoresist layer 320, several second electroplating tanks at a certain distance are sequentially made, as shown in FIG. 5(e) As shown, metal copper is electroplated in the second electroplating tank to form a second heat-conducting metal block 330 as shown in FIG. 2(a) and FIG. 2(b).

The second method of making the second thermally conductive metal block is as follows:

This method corresponds to the above-mentioned second method of manufacturing the first heat-conducting metal block. In the second direction on the edge of the third photoresist layer 320, several second electroplating tanks are sequentially fabricated at a certain distance, so that the second electroplating tank is located at the first The area above the interval groove between a heat-conducting metal block, and the width of the second electroplating groove is greater than the width of the interval groove between the first heat-conducting metal block, as shown in Figure 5 (e), electroplating in the second electroplating groove Metal copper, forms the second heat conduction metal block 330 as shown in Fig. 2 (c) and Fig. 2 (d); The width of the second heat conduction metal block of making is greater than the width of the first heat conduction metal block, so that the second heat conduction metal block The metal block is in good contact with the first heat-conducting metal block.

The third method of making the second heat-conducting metal block is as follows:

This method corresponds to the above-mentioned third method of making the first heat-conducting metal block. In the first direction and the second direction of the edge of the third photoresist layer 320, a number of second electroplating tanks are sequentially made at a certain distance, so that the second The electroplating groove is located in the upper area where the interval grooves intersect between the first heat-conducting metal blocks, and the length and width of the second electroplating groove are greater than the length and width of the interval groove intersecting area between the first heat-conducting metal blocks, as shown in Figure 5 ( As shown in e), metal copper is electroplated in the second electroplating tank to form the second heat-conducting metal block 330 as shown in Figure 2 (e) and Figure 2 (f); the length and width of the second heat-conducting metal block made greater than the length and width of the first heat-conducting metal block, so that the second heat-conducting metal block is in good contact with the first heat-conducting metal block.

As another embodiment, it is also possible to manufacture heat-conducting metal blocks of any shape, and to form interval grooves between each heat-conducting metal block, all of which can achieve a better heat dissipation effect.

In this embodiment, the interval grooves between the heat-conducting metal blocks manufactured by the above method are all communicated with the outside air, so that the heat-conducting metal blocks maintain a better heat dissipation effect.

Referring to Figure 5(f), after making the second thermally conductive metal block, remove the photoresist layer on the surface of the conductive circuit and the metal seed layer not covered by the conductive circuit, remove the third photoresist layer and the metal not covered by the first thermally conductive metal block Seed layer, get heat sink structure.

As another embodiment, it is also possible to continue to make several layers of heat-conducting metal blocks on the surface of the second heat-conducting metal block to form a heat dissipation plate structure with N layers of heat-conducting metal blocks, where N is an integer greater than 2 to further improve the heat dissipation effect of the heat dissipation plate .

Referring to Fig. 5 (g), make radiator box 400 on the lower surface of ceramic substrate 100, and make coolant inlet 410 and coolant outlet 420 respectively at the two ends of radiator box 400, make radiator box 400 wrap the first heat-conducting metal block 310 and the second heat-conducting metal block 330; the coolant (air or cooling liquid) enters from the coolant inlet 410, and passes through the metal copper microchannel heat dissipation structure formed by the first heat-conducting metal block 310 and the second heat-conducting metal block 330, from The coolant outlet 420 flows out, thereby improving the heat dissipation effect of the heat dissipation plate.

The manufacturing method of the radiator plate structure of this embodiment has the following characteristics:

(1) The first heat-conducting metal block and the second heat-conducting metal block are staggered on the lower surface of the ceramic substrate to increase the contact area with the heat dissipation medium, thereby effectively improving the heat dissipation performance of the ceramic substrate;

(2) Make a heat-conducting metal block on the lower surface of the ceramic substrate by electroplating to form a heat dissipation structure integrated with the ceramic substrate and improve the integration of the heat dissipation plate;

(3) A heat dissipation box wrapped with a heat-conducting metal block is made on the lower surface of the ceramic base material, and the coolant flows in the heat-dissipating box to take away the heat conducted by the heat-conducting metal block to further improve the heat dissipation effect.

The above-described embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still carry out the foregoing embodiments Modifications to the technical solutions recorded in the examples, or equivalent replacement of some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should be included in within the protection scope of the present invention.

Claims (10)

1. A heat radiation plate structure, characterized by comprising:

the ceramic substrate, the upper surface of the said ceramic substrate has conductive lines;

a plurality of first heat conduction metal blocks are arranged on the lower surface of the ceramic substrate at intervals, and spacing grooves are formed between the first heat conduction metal blocks;

the area that the spacing groove corresponds is provided with a plurality of second heat conduction metal pieces, the upper surface of second heat conduction metal piece with the lower surface of first heat conduction metal piece is in same horizontal plane and contacts and be connected.

2. The heat sink structure of claim 1, wherein the first heat conductive metal blocks are rectangular structures, and the spacing grooves are disposed between the first heat conductive metal blocks in a first direction or a second direction.

3. The heat dissipating plate structure of claim 1, wherein the first heat conductive metal blocks have a square structure, and the spacing grooves are disposed between each of the first heat conductive metal blocks in both the first direction and the second direction.

4. The heat sink structure of claim 1, wherein the two ends of the spacer groove are respectively communicated with the edges of the ceramic substrate.

5. The heat sink structure of claim 1, wherein the heat sink structure further comprises:

the heat dissipation box is arranged on the lower surface of the ceramic substrate, and wraps the first heat conduction metal block and the second heat conduction metal block;

one end of the heat dissipation box is provided with a coolant inlet, and the other end of the heat dissipation box is provided with a coolant outlet.

6. A method for manufacturing a heat dissipating plate structure, comprising:

providing a ceramic substrate;

manufacturing a first metal seed layer on the upper surface of the ceramic substrate, and manufacturing a second metal seed layer on the lower surface of the ceramic substrate;

manufacturing a conductive circuit on the outer surface of the first metal seed layer;

manufacturing a plurality of first heat conduction metal blocks on the outer surface of the second metal seed layer, wherein the first heat conduction metal blocks are arranged at intervals to form interval grooves;

and manufacturing a plurality of second heat conduction metal blocks in the areas corresponding to the spacing grooves, wherein the upper surfaces of the second heat conduction metal blocks and the lower surfaces of the first heat conduction metal blocks are in the same horizontal plane and are in contact connection.

7. The method of fabricating a heat spreader structure according to claim 6, wherein fabricating a plurality of first thermally conductive metal blocks on an outer surface of the second metal seed layer comprises:

manufacturing a first photoresist layer on the surface of the metal seed layer on the lower surface of the ceramic substrate, and exposing and developing the first photoresist layer;

and sequentially manufacturing a plurality of first electroplating tanks with a first preset distance at intervals in a first direction and/or a second direction of the edge of the first photoresist layer, and electroplating metal in the first electroplating tanks to form the first heat conduction metal block.

8. The method of manufacturing a heat dissipating plate structure according to claim 7, wherein manufacturing a plurality of second heat conductive metal blocks in the region corresponding to the spacer grooves comprises:

manufacturing a second photoresist layer on a plane where the lower surface of each first heat conduction metal block is located, and exposing and developing the second photoresist layer;

and manufacturing a plurality of second electroplating tanks on the lower surface of the second photoresist layer, wherein the second electroplating tanks correspond to the interval or the intersected area of the first electroplating tanks, and electroplating metal in the second electroplating tanks to form the second heat conduction metal block.

9. The method of manufacturing a heat dissipating plate structure according to claim 6, wherein after manufacturing a plurality of second heat conductive metal blocks in the region corresponding to the spacer grooves, comprising:

and manufacturing a heat dissipation box on the lower surface of the ceramic substrate, and manufacturing a coolant inlet and a coolant outlet at two ends of the heat dissipation box respectively, so that the heat dissipation box wraps the first heat conduction metal block and the second heat conduction metal block.

10. An integrated circuit module comprising the heat spreader structure of any one of claims 1-5 and an integrated chip mounted to an upper surface of the ceramic substrate.

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