CN116249307A

CN116249307A - Heat radiation structure and electronic device

Info

Publication number: CN116249307A
Application number: CN202111481671.0A
Authority: CN
Inventors: 何铭祥; 黄汉璋; 黄军凯
Original assignee: Henan Sili New Material Technology Co ltd
Current assignee: Henan Sili New Material Technology Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2023-06-09

Abstract

The invention provides a heat dissipation structure and an electronic device. The heat dissipation structure comprises a metal layer, a heat dissipation protection layer and a first adhesion layer. The heat dissipation protection layer is arranged on the metal layer and comprises a laminated structure of a high polymer material layer and a heat dissipation coating. The first adhesion layer is arranged between the metal layer and the heat dissipation protection layer; the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nano-tubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof. The invention can quickly dissipate the heat energy generated by the heat source to the outside, and improves the heat dissipation efficiency of the electronic device.

Description

Heat radiation structure and electronic device

Technical Field

The present invention relates to a heat dissipation structure, and more particularly to a heat dissipation structure with good heat dissipation effect and reduced thickness, and an electronic device having the same.

Background

With the development of technology, no priority is given to the design and development of electronic devices, such as thinning and high efficiency. Under the circumstances of high-speed operation and thin-type electronic devices, more heat is inevitably generated by the electronic components of the electronic devices than ever before, and therefore "heat dissipation" is an essential function of these components or devices. Particularly, for high power devices, the temperature of the electronic product increases rapidly due to the large increase of heat energy generated during operation, and when the electronic product is subjected to an excessively high temperature, the device may be damaged permanently or the service life may be reduced greatly.

Most of the prior art uses heat dissipation fins, fans, or heat dissipation members (e.g., heat pipes) disposed on the device or component to conduct away the waste heat generated during operation. The heat dissipation fins or the heat dissipation fins generally have a certain thickness, and are made of a metal material with high heat conductivity or an inorganic material with high heat conductivity by doping. However, although the heat conduction effect of the metal material is good, the density is high, and the weight and thickness of the heat dissipation fin or the whole heat dissipation fin are increased. The polymer composite material doped with the inorganic material has poor structural strength and may not be suitable for some products.

Therefore, how to develop a heat dissipation structure more suitable for the requirements of high-power devices or apparatuses, which can be applied to different product fields to meet the requirements of thinning, has been one of the continuous pursuits of related manufacturers.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a heat dissipation structure and an electronic device using the same, which can quickly conduct and dissipate waste heat generated by operation of electronic components to the outside, thereby improving heat dissipation efficiency of the electronic device. The invention can be applied to different product fields to achieve the requirement of thinning.

The invention provides a heat dissipation structure, which comprises a metal layer, a heat dissipation protection layer and a first adhesion layer. The heat dissipation protection layer is arranged on the metal layer and comprises a laminated structure of a high polymer material layer and a heat dissipation coating. The first adhesion layer is arranged between the metal layer and the heat dissipation protection layer; the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nano-tubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof.

In one embodiment, the material of the metal layer comprises copper, aluminum, a copper alloy, an aluminum alloy, or a combination thereof.

In one embodiment, the first adhesive layer is double sided tape or thermally conductive double sided tape.

In one embodiment, the heat dissipation coating has a thickness between 5 microns and 100 microns.

In one embodiment, the polymer material layer is located between the heat dissipation coating and the first adhesive layer.

In one embodiment, the heat dissipation coating is located between the polymer material layer and the first adhesive layer.

In one embodiment, the material of the adhesive member comprises acrylic, epoxy, polyurethane, or a combination thereof.

In one embodiment, the heat dissipation structure further includes a thermally conductive coating disposed on a surface of the metal layer facing or away from the first adhesion layer, the thermally conductive coating material including graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, or a combination thereof.

In one embodiment, the heat dissipation structure further includes a second adhesive layer disposed on a side of the metal layer away from the heat dissipation protection layer.

The invention also provides a heat dissipation structure which comprises a heat conduction piece and a heat dissipation coating. The heat conductive member has a surface. The heat dissipation coating is arranged on the surface of the heat conduction piece; the material of the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof.

In one embodiment, the surface of the heat conducting member includes a plurality of protruding portions, and the heat dissipation coating covers both side surfaces of the protruding portions and the heat conducting member.

In one embodiment, the material of the thermally conductive member comprises copper, aluminum, a copper alloy, an aluminum alloy, or a combination thereof.

The invention also provides an electronic device which comprises an electronic element and the heat dissipation structure of the embodiment, wherein waste heat is generated when the electronic element operates, and the heat dissipation structure is contacted with the electronic element.

In one embodiment, the electronic component includes a battery, a chip, an image processor, a memory, a motherboard, a display card, a display panel, a light emitting element, a light emitting module, or a lighting module.

As described above, in the heat dissipation structure of the present invention, the heat dissipation protective layer is provided on the metal layer, the heat dissipation protective layer includes a laminated structure of the polymer material layer and the heat dissipation coating; the first adhesion layer is arranged between the metal layer and the heat dissipation protection layer; the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof; or the heat dissipation coating is arranged on the surface of the heat conduction piece; the material of the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof. Through the structural design, when the heat dissipation structure is in contact with the electronic component generating waste heat during operation, the waste heat generated by the electronic component can be quickly and effectively conducted and dissipated to the outside, so that the heat dissipation efficiency of the electronic device can be improved. In some embodiments, the heat dissipation structure has good heat dissipation effect even in some airtight and high-temperature environments. In addition, the heat dissipation structure of the invention can be applied to different product fields to enable the electronic device to achieve the requirement of thinning.

Drawings

Fig. 1 is a schematic diagram of a heat dissipation structure according to an embodiment of the invention.

Fig. 2A to fig. 2F are schematic diagrams of heat dissipation structures according to different embodiments of the invention.

Fig. 3A and fig. 3B are schematic diagrams of a heat dissipation structure according to different embodiments of the invention.

Fig. 4 is a schematic diagram of an electronic device according to an embodiment of the invention.

Detailed Description

The heat dissipation structure and the electronic device according to some embodiments of the present invention will be described below with reference to the accompanying drawings, wherein like elements will be described with like reference numerals. The elements of the following examples are presented solely to illustrate their relative relationship and do not represent the proportions or dimensions of the actual elements.

The heat radiation structure of the invention can be applied to different product fields to achieve the requirement of thinning, and can improve the heat radiation efficiency of the electronic device. Electronic devices such as cell phones, tablets, notebook computers, lighting devices or illumination devices, the electronic components within the run generate waste heat. The electronic components may include, but are not limited to, a battery, a control chip (e.g., a Central Processing Unit (CPU)), a driver chip, an image processor, a memory (e.g., without limitation, SSD, solid state drive), a motherboard, a graphics card, a display panel, a light emitting element (e.g., LED), a light emitting module, or a lighting module, or other elements, units, or modules that generate heat.

Fig. 1 is a schematic diagram of a heat dissipation structure according to an embodiment of the invention. As shown in fig. 1, the heat dissipation structure 1 of the present embodiment includes a metal layer 11, a heat dissipation protection layer 12, and a first adhesive layer 13.

The metal layer 11 comprises a metal sheet, foil, layer or film of high thermal conductivity material such as, but not limited to, copper, aluminum, copper alloys (alloys of copper and other metals), aluminum alloys (alloys of aluminum and other metals), or combinations thereof. The metal layer 11 of the present embodiment is exemplified by aluminum foil.

The heat dissipation protection layer 12 is disposed on the metal layer 11, and the heat dissipation protection layer 12 can protect the metal layer 11, and can enhance heat radiation and heat exchange, thereby increasing heat dissipation effect. The heat dissipation protection layer 12 includes a laminated structure of a polymer material layer 121 and a heat dissipation coating 122. The polymer material layer 121 may include, for example, but not limited to, a film made of Polyimide (PI), polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), or a combination thereof, or a film made of other polymer materials.

The heat sink coating 122 may be an aqueous or oily formulation and may include a filler 1221 and a binder 1222, the filler 1221 being mixed in the binder 1222. The filler 1221 may include, for example, graphene, carbon nanotubes, boron Nitride (BN), silicon carbide (SiC), aluminum nitride (AlN), ceramic nitride, or a combination thereof. By mixing the filling members 1221 (i.e., graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, or ceramic nitride) with different dimensions, a complete three-dimensional (3D) heat conducting network can be stacked with different morphologies and different particle sizes, enhancing heat radiation and heat exchange, and increasing heat dissipation efficiency. In some embodiments, the preferred material combinations (and proportions thereof) of the filler 1221 are: 20-60% of graphene, 20-40% of boron nitride and/or carbon black and 20-40% of carbon nanotubes. Wherein, the sheet diameter (D50) of the graphene can be between 1 micrometer (mum) and 30μm, and the thickness can be between 1 nanometer (nm) and 70 nm; the particle size (D50) of the boron nitride or carbon black may be, for example, between 0.01 μm and 0.5 μm; the diameter of the single-wall or multi-wall carbon nanotubes may be, for example, between 5nm and 30nm, and the length may be, for example, between 5 μm and 30 μm.

The adhesive 1222 may be, for example, a resin, and the material may include one or a combination of acrylic, epoxy, and polyurethane. In addition, the heat dissipation coating 122 may further include a hardener and other materials. The hardener, such as melamine resin or isocyanate, can increase the crosslink density to improve the adhesion, hardness, and chemical resistance of the heat sink coating 122.

The thickness of the heat-dissipating coating 122 may be, for example, between 5 μm and 100 μm. In some embodiments, the heat dissipation coating 122 may be formed by disposing a slurry containing materials such as the filler 1221, the binder 1222, and the hardener on the polymer material layer 121 through a coating process, and baking and curing the slurry to form the heat dissipation protection layer 12. The coating process may be, for example, but not limited to, spray coating (spin coating), spin coating (spin coating), or precision coating. In some embodiments, a preferred material combination for the heat sink coating 122 may be, for example: adhesive 1222 (such as resin) 20-30%, filler 1221 0.5-1.5%, neutralizer (pH regulator) 0.5-1%, defoamer 0.1-0.5%, leveling agent 0.1-0.5%, adhesive <0.5%, acid catalyst <0.1%, thickener <0.1%, retarder 0.5-1.5%, hardener 5-10%.

The first adhesive layer 13 is disposed between the metal layer 11 and the heat dissipation protective layer 12. In this embodiment, the heat dissipation coating 122 is disposed on the surface of the polymer material layer 121 away from the first adhesive layer 13, such that the polymer material layer 121 is located between the heat dissipation coating 122 and the first adhesive layer 13, and the heat dissipation protection layer 12 is adhered to the metal layer 11 through the first adhesive layer 13. The first adhesive layer 13 may be a double sided adhesive or a heat conductive double sided adhesive. The heat-conducting double-sided adhesive tape can comprise a glue material and a heat-conducting material, wherein the heat-conducting material is mixed in the glue material. The heat-conducting double-sided adhesive tape has viscosity and can also assist the conduction of heat energy through a heat-conducting material. The thermally conductive material may include, for example, graphene, reduced graphene oxide, a ceramic material, or a combination thereof. The ceramic material is not limited and may be, for example, but not limited to, a ceramic material having a high thermal conductivity such as boron nitride, aluminum oxide, aluminum nitride, silicon carbide, or the like, or a combination thereof. In addition, the glue material may be, for example but not limited to, a pressure sensitive glue (pressure sensitive adhesive, PSA), the material of which may for example comprise rubber, acryl, silvicon or a combination thereof; the chemical composition may be rubber, acrylic, silicone, or a combination thereof. In some embodiments, the thermally conductive double-sided tape is, for example, graphene double-sided tape.

In some embodiments, the heat dissipation structure may further include two release layers (not shown) disposed on the upper and lower sides of the heat dissipation structure (e.g., the lower surface of the metal layer 11 and the upper surface of the heat dissipation coating 122 in fig. 1). When the heat dissipation structure is to be used, the heat dissipation structure can be attached to and contacted with a heat source (electronic component) through double faced adhesive tape or heat conducting double faced adhesive tape by removing the two release layers. The release layer may be made of, for example, but not limited to, paper, cloth, polyester (e.g., polyethylene terephthalate, PET), or combinations thereof. It should be noted that the upper and lower surfaces of the heat dissipation structure have release layers, and the present invention can also be applied to other embodiments.

Fig. 2A to 2F are schematic diagrams of heat dissipation structures according to different embodiments of the invention.

As shown in fig. 2A, the heat dissipation structure 1a of the present embodiment is substantially the same as the element composition and the connection relationship of the elements of the heat dissipation structure 1 of the foregoing embodiment. The difference is that the heat dissipation coating 122 of the heat dissipation structure 1a of the present embodiment is located between the polymer material layer 121 and the first adhesive layer 13. The feature of the heat dissipation coating 122 between the polymer material layer 121 and the first adhesive layer 13 can also be applied in other embodiments of the present invention.

As shown in fig. 2B and 2C, the heat dissipation structures 1B and 1C of the present embodiment have substantially the same element composition and connection relationship with the elements of the heat dissipation structure 1 of the foregoing embodiment. The difference is that the heat dissipation structures 1b, 1c of the present embodiment may further include a heat conductive coating 14, and the heat conductive coating 14 is disposed on a surface of the metal layer 11 facing or away from the first adhesive layer 13. Here, the heat conductive coating 14 in fig. 2B is exemplified as being disposed on the surface of the metal layer 11 facing the first adhesive layer 13 (the heat conductive coating 14 is disposed between the metal layer 11 and the first adhesive layer 13), and the heat conductive coating 14 in fig. 2C is exemplified as being disposed on the surface of the metal layer 11 away from the first adhesive layer 13 (the metal layer 11 is disposed between the heat conductive coating 14 and the first adhesive layer 13). The thermally conductive coating 14 may include fillers, bonding elements, hardeners, and other materials. The filling member may include graphene, carbon nanotubes, ceramic material (such as boron nitride, silicon carbide, aluminum nitride) or a combination thereof, and is disposed on the metal layer 11 by a coating process, and then connected to the heat dissipation protection layer 12 through the first adhesion layer 13. The layered structure of the metal layer 11 and the heat conductive coating 14 is referred to herein as a heat conductive composite layer.

As shown in fig. 2D, the heat dissipation structure 1D of the present embodiment is substantially identical to the heat dissipation structure 1a of the previous embodiment in element composition and connection relationship between the elements. The difference is that the heat dissipating structure 1d of the present embodiment may further include a heat conductive coating 14, the heat conductive coating 14 is located between the first adhesion layer 13 and the metal layer 11, and the heat dissipating coating 122 is located between the polymer material layer 121 and the first adhesion layer 13.

As shown in fig. 2E, the heat dissipation structure 1E of the present embodiment is substantially identical to the heat dissipation structure 1 of the previous embodiment in terms of element composition and connection relationship between the elements. The difference is that the heat dissipating structure 1e of the present embodiment further includes a second adhesive layer 15, and the second adhesive layer 15 is disposed on a side of the metal layer 11 away from the heat dissipating protection layer 12. The second adhesive layer 15 is used for connecting a heat source of the electronic device. The second adhesive layer 15 may be the same as the first adhesive layer 13, and may be a double sided adhesive tape or a heat conductive double sided adhesive tape. The second adhesive layer 15 can be applied to other embodiments of the present invention.

As shown in fig. 2F, the heat dissipation structure 1F of the present embodiment has substantially the same element composition and connection relationship between the elements as the heat dissipation structure 1b of the foregoing embodiment. The difference is that the heat dissipation structure 1f of the present embodiment further includes a second adhesive layer 15, and the second adhesive layer 15 is disposed on a side of the metal layer 11 away from the heat dissipation protection layer 12. The second adhesive layer 15 can be used to connect to a heat source of an electronic device.

Fig. 3A and fig. 3B are schematic diagrams of a heat dissipation structure according to different embodiments of the invention. As shown in fig. 3A, the heat dissipation structure 2a includes a heat conductive member 21 and a heat dissipation coating 22. The heat conductive member 21 has a surface 211. Here, the surface 211 may be an upper surface of the heat conductive member 21, and the heat dissipation coating 22 may be disposed on the surface 211 of the heat conductive member 21 by spraying, for example. The heat conductive member 21 may be a heat conductive substrate, and the material thereof includes, but is not limited to, copper, aluminum, copper alloy, aluminum alloy, or a combination thereof. In some embodiments, the heat conducting member 21 may be other types of heat conducting/dissipating structures, such as a heat conducting film or a heat dissipating film. The heat dissipation coating 22 at least includes a filling member 221 and a bonding member 222, and the filling member 221 is mixed in the bonding member 222. The heat dissipation coating 22 may have the same technical content as the heat dissipation coating 122 described above, and specific reference is made to the above description, and will not be described again.

In some embodiments, the thickness of the heat-dissipating coating 22 may be, for example, between 5 microns and 100 microns. In some embodiments, the heat dissipation coating 22 may be disposed on both side surfaces of the heat conductive member 21 in addition to the upper surface (surface 211) of the heat conductive member 21, increasing heat radiation efficiency. In some embodiments, the surface of the heat conducting member 21 away from the heat dissipating coating 22 (i.e. the lower surface of the heat conducting member 21 in fig. 3A) can be connected with an electronic component (heat source) to guide the waste heat generated by the electronic component and dissipate the waste heat to the outside. The heat dissipation coating 22 may be coated on a surface of the heat conductive member 21 having an arbitrary shape, which is far from the heat source, for example, to increase heat radiation efficiency and improve cooling effect.

As shown in fig. 3B, the heat dissipation structure 2B of the present embodiment is substantially identical to the heat dissipation structure 2a of the previous embodiment in element composition and connection relationship between the elements. The difference is that the surface 211 of the heat conducting member 21 of the heat dissipating structure 2b of the present embodiment includes a plurality of protruding portions P, and the heat dissipating coating 22 covers the protruding portions P, the surface between the protruding portions P, and both side surfaces of the heat conducting member 21. In some embodiments, the protruding portion P may be, for example, a heat dissipation fin, so as to increase the heat dissipation area, and then heat radiation and heat exchange may be increased by the heat dissipation coating 22, so as to improve the cooling effect.

In some test cases, the heat dissipation structure 2 or 2b has good heat dissipation effect under airtight and high environmental temperature. In some application examples, the heat dissipation structure 2 or 2b may be applied to a component (heat source) such as a light source module of a light emitting diode, a lighting module, or a heat dissipation of a high-temperature electronic component (e.g. CPU, SSD), a module or a device.

Fig. 4 is a schematic diagram of an electronic device according to an embodiment of the invention. As shown in fig. 4, the present invention further provides an electronic device 3, the electronic device 3 includes an electronic component 31 and a heat dissipation structure 32, the electronic component generates waste heat during operation, and the heat dissipation structure 32 is in contact with and connected to the electronic component 31. In some embodiments, the heat dissipation structure 32 may be connected to the electronic component 31 through an adhesive layer 33 (e.g., double sided tape or thermally conductive double sided tape). Here, the heat dissipation structure 32 may be one of the above-described heat dissipation structures 1, 1a to 1f, 2a or 2b, or a variation combination thereof. The specific technical content of the heat dissipation structures 1, 1a to 1f, 2a, 2b is described in detail in the foregoing, and will not be described here again. It is understood that the heat dissipation structure 32 itself does not need to be provided with the adhesive layer 33 if it has the second adhesive layer.

The electronic device 3 is for example but not limited to a flat panel display, a light emitting device or a lighting device, such as but not limited to a mobile phone, a notebook computer, a tablet computer, a television, a display, a backlight module, a light emitting or lighting device, or other electronic device. The heat source may be a battery of an electronic device, a control chip (e.g. a Central Processing Unit (CPU)), a driving chip, an image processor, a memory (e.g. but not limited to SSD, solid state disk), a motherboard, a display card, a display panel, a light emitting or lighting module with light emitting diodes, or other elements, modules or units that generate high heat without limitation. In some embodiments, when the electronic device 3 is a flat panel display, such as but not limited to a Light Emitting Diode (LED) display, an Organic Light Emitting Diode (OLED) display, or a Liquid Crystal Display (LCD), the electronic component 31 may be a display panel with a display surface, and the heat dissipation structure 32 may be directly or indirectly attached to an opposite surface of the display surface, so as to assist in heat conduction and dissipation, and improve the heat dissipation efficiency of the flat panel display. In other embodiments, when the electronic device 3 is a light emitting device or a lighting device, such as but not limited to a backlight module, an LED lighting or illumination (LED) module, or an OLED lighting or illumination (OLED) module, the electronic component 31 may include a light emitting element such as an LED or an OLED and have a light emitting surface, and the heat dissipating structure 32 may be directly or indirectly attached to a surface opposite to the light emitting surface, so as to assist in heat conduction and heat dissipation, and improve heat dissipation efficiency.

In addition, referring to table one, the cooling experiments were performed using three different heat dissipation structures under the same heat source and the same heat dissipation structure size (e.g. 12mm×26 mm). Wherein #1 is a heat dissipation structure of an embodiment, and #2 and #3 are heat dissipation structures according to the present invention. As can be seen from the first table, the heat dissipation protection layer is arranged on the metal layer, and the heat dissipation protection layer comprises a laminated structure of the high polymer material layer and the heat dissipation coating, so that waste heat generated by the electronic element can be effectively and rapidly conducted and dissipated to the outside, and compared with the heat dissipation structure of #1, the heat dissipation protection layer can further improve the cooling effect by 3-3.5 degrees. If the size of the heat dissipation structure is increased to, for example, 18mm by 29mm, the cooling effect can be further improved to 7-8 degrees.

List one

In addition, referring to table two, under the condition of the same heat source and the same size of the heat dissipation structure (for example, 12mm×26 mm), the cooling experiment is performed by using three different heat dissipation structures. Wherein #1 is a heat dissipation structure of an embodiment, and #2 and #3 are heat dissipation structures with a heat conductive composite layer (metal layer, heat conductive coating) according to the present invention. As can be seen from Table II, compared with #1, the heat dissipation structure of the heat conduction composite layer and the heat dissipation coating provided by the invention can truly improve the cooling effect by 1-1.7 degrees.

Watch II

In addition, referring to table three, under the condition of the same heat source (for example, SSD) and the same heat dissipation structure size (for example, 20mm×68 mm), five different heat dissipation structures were used for cooling experiments. Wherein #1 is a heat dissipation structure of an embodiment, and #2 to #5 are heat dissipation structures (graphene composite materials are the above heat-conducting composite layers) according to the present invention. It can also be proved from Table III that, compared with #1, the heat dissipation structure of the different embodiments provided by the invention can actually improve the cooling effect by 0.2-1.3 degrees.

Watch III

In addition, referring to table four, under the same heat source, heat dissipation experiments were performed using heat dissipation coatings of four different fillers. Wherein, the #1 is only an aluminum plate, and the #2 to #4 are heat dissipation coatings of different filling pieces sprayed on the aluminum plate. It can also be demonstrated from Table IV that the heat dissipation coating of the different filling members provided by the invention can actually improve the cooling effect by 8.0-10.1 degrees compared with the pure aluminum plate of # 1.

Table four

In addition, referring to table five, in the heat dissipation structure 2b with the protruding portion P, heat dissipation experiments were performed on three heat sources with different temperatures. The temperatures of the heat sources are set to be 80 ℃, 90 ℃ and 100 ℃ respectively, but the measured temperatures after the heat dissipation of the heat dissipation structure 2b are 68.3 ℃, 79.3 ℃ and 88 ℃ respectively, and the heat conduction coating is proved to cover the protruding part of the heat conduction member and the surfaces of the two sides of the protruding part, so that the cooling effect can be improved by 10.7-12 degrees.

TABLE five

Heat source set temperature	80℃	90℃	100℃
				Measured temperature	68.3℃	79.3℃	88℃
Temperature difference	11.7℃	10.7℃	12℃

In addition, referring to table six, it is a heat dissipation experiment performed on the heat source LED lamp in the sealed oven under the high temperature (heat balance 60 ℃) environment in the heat dissipation structure 2b having the protrusion portion P. Here, "blank lamp" refers to an LED lamp in which the heat radiation structure 2b is not provided, "anodic treatment" refers to anodic treatment (protection, rust prevention) of the heat conductive member 21 (including the plurality of protrusions P) of the LED lamp in which the heat radiation structure 2b is provided, and "spray coating" refers to spraying the heat radiation coating 22 in addition to anodic treatment of the heat conductive member 21 (including the plurality of protrusions P) of the LED lamp in which the heat radiation structure 2b is provided. The sixth table shows that the cooling effect (the maximum cooling temperature is 18 ℃ 4 ℃) can be greatly improved through the heat dissipation structure 2b of the scheme even if the LED lamp is in a high-temperature environment (for example, 60 ℃).

TABLE six

In addition, referring to table seven, in the heat dissipation structure 2b with the protruding portion P, heat dissipation experiments were performed on the LED lamp as the heat source in a sealed oven under a high temperature (heat balance 80 ℃) environment. The seventh embodiment proves that the cooling effect (the maximum cooling temperature is 14 ℃ 9 ℃) can be greatly improved through the heat dissipation structure 2b of the present invention even if the LED lamp is in a high temperature environment (for example, 80 ℃).

Watch seven

In summary, in the heat dissipation structure of the present invention, the heat dissipation protection layer is disposed on the metal layer, and the heat dissipation protection layer includes a laminated structure of a polymer material layer and a heat dissipation coating; the first adhesion layer is arranged between the metal layer and the heat dissipation protection layer; the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof; or the heat dissipation coating is arranged on the surface of the heat conduction piece; the material of the heat dissipation coating comprises a filling piece and a bonding piece, the filling piece is mixed in the bonding piece, the filling piece comprises a structural design of graphene, carbon nano-tubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination of the graphene, the carbon nano-tubes, the boron nitride, the silicon carbide, the aluminum nitride and the ceramic nitride, and when the heat dissipation structure is in contact with an electronic element generating waste heat during operation, the waste heat generated by the electronic element can be quickly and effectively conducted and dissipated to the outside, so that the heat dissipation efficiency of the electronic device can be improved. In some embodiments, the heat dissipation structure has good heat dissipation effect even in some airtight and high-temperature environments. In addition, the heat dissipation structure of the invention can be applied to different product fields to enable the electronic device to achieve the requirement of thinning.

The foregoing is by way of example only and is not limiting. Any equivalent modifications or variations to the present invention without departing from the spirit and scope thereof are intended to be included in the following claims.

Claims

1. A heat dissipating structure, comprising:

a metal layer;

the heat dissipation protection layer is arranged on the metal layer and comprises a laminated structure of a high polymer material layer and a heat dissipation coating; and

a first adhesive layer disposed between the metal layer and the heat dissipation protective layer;

the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nano-tubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof.

2. The heat spreading structure according to claim 1, wherein the material of the metal layer comprises copper, aluminum, a copper alloy, an aluminum alloy, or a combination thereof.

3. The heat dissipating structure of claim 1, wherein the first adhesive layer is a double sided adhesive or a thermally conductive double sided adhesive.

4. The heat dissipating structure of claim 1, wherein the heat dissipating coating has a thickness between 5 and 100 microns.

5. The heat dissipating structure of claim 1, wherein the polymeric material layer is located between the heat dissipating coating and the first adhesive layer.

6. The heat dissipating structure of claim 1, wherein the heat dissipating coating is located between the polymeric material layer and the first adhesive layer.

7. The heat dissipating structure of claim 1, wherein the material of the adhesive comprises an acrylic, an epoxy, a polyurethane, or a combination thereof.

8. The heat dissipation structure of claim 1, further comprising:

and the heat conduction coating is arranged on the surface of the metal layer facing or far away from the first adhesion layer, and the material of the heat conduction coating comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride or a combination thereof.

9. The heat dissipation structure of claim 1, further comprising:

the second adhesion layer is arranged on one side of the metal layer away from the heat dissipation protection layer.

10. A heat dissipating structure, comprising:

a heat conductive member having a surface; and

a heat dissipation coating layer disposed on the surface of the heat conductive member;

the material of the heat dissipation coating comprises a filling piece and a bonding piece, wherein the filling piece is mixed in the bonding piece, and the filling piece comprises graphene, carbon nanotubes, boron nitride, silicon carbide, aluminum nitride, ceramic nitride or a combination thereof.

11. The heat dissipation structure as recited in claim 10, wherein the surface of the heat conductive member includes a plurality of protruding portions, the heat dissipation coating covering both side surfaces of the heat conductive member and the plurality of protruding portions.

12. The heat dissipating structure of claim 10, wherein the material of the thermally conductive member comprises copper, aluminum, a copper alloy, an aluminum alloy, or a combination thereof.

13. The heat spreading structure according to claim 10, wherein the heat spreading coating has a thickness of between 5 and 100 microns.

14. The heat dissipating structure of claim 10, wherein the adhesive comprises an acrylic, an epoxy, a polyurethane, or a combination thereof.

15. An electronic device, comprising:

electronic components that generate waste heat when operated; and

the heat dissipation structure as recited in any one of claims 1-14, being in contact with the electronic element.

16. The electronic device of claim 15, wherein the electronic component comprises a battery, a chip, an image processor, a memory, a motherboard, a graphics card, a display panel, a light emitting element, a light emitting module, or a lighting module.