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CN116199211A - A kind of two-dimensional monolayer dendritic graphene film and preparation method thereof - Google Patents

A kind of two-dimensional monolayer dendritic graphene film and preparation method thereof Download PDF

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CN116199211A
CN116199211A CN202310295975.0A CN202310295975A CN116199211A CN 116199211 A CN116199211 A CN 116199211A CN 202310295975 A CN202310295975 A CN 202310295975A CN 116199211 A CN116199211 A CN 116199211A
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英敏菊
张霞
戚源
颜培烨
陈琳
廖斌
张旭
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Abstract

本发明属于石墨烯薄膜制备技术领域,本发明公开了一种二维单层枝晶石墨烯薄膜及其制备方法。本发明采用化学气相沉积两步生长法,即在合成石墨烯连续单层膜后,继续通入氢气,利用氢气刻蚀效应,获得高质量大面积连续单层石墨烯枝晶薄膜。拉曼光谱图证实石墨烯为单层,石墨烯的2D峰强度大于G峰,并具有完美的单洛伦兹峰型。本发明所得二维单层枝晶石墨烯薄膜的稳定性和连续性好,且具有优异的传感性能和催化性能,在传感以及光催化领域具有重要的应用前景。

Figure 202310295975

The invention belongs to the technical field of graphene film preparation and discloses a two-dimensional single-layer dendritic graphene film and a preparation method thereof. The invention adopts a two-step growth method of chemical vapor deposition, that is, after synthesizing a graphene continuous single-layer film, hydrogen gas is continuously introduced to obtain a high-quality large-area continuous single-layer graphene dendrite film by utilizing the hydrogen gas etching effect. The Raman spectrum confirms that graphene is a single layer, the 2D peak intensity of graphene is greater than the G peak, and it has a perfect single Lorentzian peak type. The two-dimensional single-layer dendritic graphene film obtained by the invention has good stability and continuity, excellent sensing performance and catalytic performance, and has important application prospects in the fields of sensing and photocatalysis.

Figure 202310295975

Description

一种二维单层枝晶石墨烯薄膜及其制备方法A kind of two-dimensional monolayer dendritic graphene film and preparation method thereof

技术领域technical field

本发明涉及石墨烯薄膜制备技术领域,尤其涉及一种二维单层枝晶石墨烯薄膜及其制备方法。The invention relates to the technical field of graphene film preparation, in particular to a two-dimensional single-layer dendritic graphene film and a preparation method thereof.

背景技术Background technique

石墨烯(Graphene)是一种碳原子以sp2杂化方式构成的六角蜂巢状的二维材料,其单原子层厚度仅为0.35nm。石墨烯作为碳族材料的新成员,一系列新奇的物理化学特性使其在透明导电薄膜、复合材料、光电器件、催化储能等领域发挥出巨大的优势。研究者们尝试利用石墨烯与光电催化材料进行复合,催化分解酸性或水溶液制氢,此复合方法可有效提升催化性能,进而提高能量转化效率,这对于当今社会倡导的可持续、可再生、清洁的氢能源的研究发展具有重大意义,也已成为新型光电催化材料及其复合材料的研究热点之一。Graphene is a hexagonal honeycomb-shaped two-dimensional material composed of carbon atoms in sp 2 hybridization mode, and its single atomic layer thickness is only 0.35nm. As a new member of the carbon family of materials, graphene has a series of novel physical and chemical properties that make it play a huge advantage in the fields of transparent conductive films, composite materials, optoelectronic devices, and catalytic energy storage. Researchers have attempted to combine graphene with photocatalytic materials to catalyze the decomposition of acidic or aqueous solutions to produce hydrogen. This composite method can effectively improve catalytic performance, thereby improving energy conversion efficiency. The research and development of hydrogen energy is of great significance, and it has become one of the research hotspots of new photocatalytic materials and their composite materials.

然而普通石墨烯表面呈惰性,与传统电极复合用于催化领域时,虽然能保护金属免受腐蚀但石墨烯也会抑制其化学活性。通过引入缺陷,在保有本征石墨烯优异性能的同时,增加活性反应位点,可以提高其催化能力。日本筑波大学研究人员开发了基于“多孔”石墨烯的电极,可以在酸性电解质中更高效地进行析氢反应。与普通石墨烯相比,多孔石墨烯材料更亲水,同时更容易吸附单个H原子,这为析氢反应提供了额外的表面积。然而多孔石墨烯的制备比较复杂,一般采用模板法,光刻法,催化刻蚀法等。Yi等将合成的二氧化硅微球覆载到铜箔表面,利用化学气相沉积法(CVD)法在铜箔表面生长出Gr,再经氢氟酸清洗除去无定型SiOx,即可得到多孔形石墨烯。Safron等使用图案化的氧化铝对铜箔掩模,采用无障碍引导CVD刻蚀法,在铜箔表面生成Gr。Fischbein等先用SF6对无定型SiNx进行离子刻蚀,形成1μm2的方形孔,再把经过机械剥离的Gr转移到SiNx上,用TEM的电子束对其烧蚀得到纳米孔洞。上述方法虽然可以得到高质量的石墨烯孔结构,但是操作成本较高,而且刻蚀过程往往会伴随着污染物的产生。However, the surface of ordinary graphene is inert. When it is combined with traditional electrodes and used in the field of catalysis, although it can protect the metal from corrosion, graphene will also inhibit its chemical activity. By introducing defects, while maintaining the excellent properties of intrinsic graphene, increasing active reaction sites can improve its catalytic ability. Researchers at the University of Tsukuba in Japan have developed "porous" graphene-based electrodes that allow for more efficient hydrogen evolution reactions in acidic electrolytes. Compared with ordinary graphene, the porous graphene material is more hydrophilic, and at the same time it is easier to adsorb a single H atom, which provides an additional surface area for the hydrogen evolution reaction. However, the preparation of porous graphene is relatively complicated, and template methods, photolithography methods, and catalytic etching methods are generally used. Yi et al. covered the synthesized silica microspheres on the surface of copper foil, grown Gr on the surface of copper foil by chemical vapor deposition (CVD), and then cleaned amorphous SiO x with hydrofluoric acid to obtain porous shaped graphene. Safron et al. used patterned aluminum oxide to mask copper foil, and used barrier-free guided CVD etching to generate Gr on the surface of copper foil. Fischbein first used SF 6 to ion-etch amorphous SiNx to form a square hole of 1 μm 2 , then transferred the mechanically stripped Gr to SiNx , and ablated it with TEM electron beam to obtain nanopores. Although the above method can obtain a high-quality graphene pore structure, the operation cost is relatively high, and the etching process is often accompanied by the generation of pollutants.

枝晶石墨烯的边界为一种线缺陷,按照热力学定律,为了达到稳定,形成边界是一个自发的过程,合理的设计石墨烯的不平衡边界及其边界缺陷,就可获得枝晶石墨烯。枝晶石墨烯具有更多的纳米边缘,相比于致密石墨烯增加了边缘反应位点,电子可以快速迁移,催化活性也更高。中国专利CN103834993A公开了一种石墨烯枝晶制备方法,在氧化石墨烯溶液的两端施加方波电信号,当电流密度超过极限电流密度,电极附近将严重缺乏氧化石墨烯粒子,只有部分晶面须状的枝晶继续长大,即为石墨烯枝晶。该方法枝晶容易堆积,形成三维结构,同时不可避免氢,氧等杂质元素对石墨炸枝品样品的污染。中国专利CN108910868A公开了一种绝缘衬底上制备石墨烯枝晶制备方法,石墨烯先形成球型,在球型的顶端长出分支,在枝干上长成树枝状,本质上也是一种三维的石墨烯枝晶结构。目前还缺乏二维单层枝晶石墨烯枝晶的制备。基于此,发展具有更高的催化或者传感性能的二维单层枝晶石墨烯成为本领域亟需。The boundary of dendritic graphene is a kind of line defect. According to the law of thermodynamics, in order to achieve stability, the formation of the boundary is a spontaneous process. Reasonable design of the unbalanced boundary of graphene and its boundary defects can obtain dendritic graphene. Dendritic graphene has more nano-edges, which increases the edge reaction sites compared to dense graphene, electrons can move quickly, and the catalytic activity is also higher. Chinese patent CN103834993A discloses a method for preparing graphene dendrites. A square wave electrical signal is applied at both ends of the graphene oxide solution. When the current density exceeds the limit current density, there will be a serious lack of graphene oxide particles near the electrode, and only some crystal faces The whisker-like dendrites continue to grow, which are graphene dendrites. In this method, dendrites are easy to pile up to form a three-dimensional structure, and at the same time, impurity elements such as hydrogen and oxygen are unavoidable to pollute the graphite fried branch sample. Chinese patent CN108910868A discloses a method for preparing graphene dendrites on an insulating substrate. Graphene first forms a spherical shape, then grows branches at the top of the spherical shape, and grows dendrites on the branches, which is essentially a three-dimensional graphene dendrite structure. The preparation of two-dimensional monolayer dendritic graphene dendrites is still lacking. Based on this, the development of two-dimensional single-layer dendritic graphene with higher catalytic or sensing performance has become an urgent need in this field.

发明内容Contents of the invention

有鉴于此,本发明提供了一种二维单层枝晶石墨烯薄膜及其制备方法,以解决现有的石墨烯薄膜为三维的石墨烯枝晶,对二维单层枝晶石墨烯的研究存在空白的问题。In view of this, the invention provides a kind of two-dimensional single-layer dendrite graphene film and preparation method thereof, to solve the problem that the existing graphene film is a three-dimensional graphene dendrite, and the problem of two-dimensional single-layer dendrite graphene There are gaps in the research.

为了达到上述目的,本发明采用如下技术方案:In order to achieve the above object, the present invention adopts following technical scheme:

本发明提供了一种二维单层枝晶石墨烯薄膜的制备方法,包括如下步骤:The invention provides a method for preparing a two-dimensional single-layer dendrite graphene film, comprising the steps of:

(1)在H2和Ar的混合气体下,对衬底进行退火处理,得到处理后的衬底;(1) Under the mixed gas of H 2 and Ar, the substrate is annealed to obtain the processed substrate;

(2)在H2和CH4的混合气体下,对处理后的衬底进行热处理生长,得到初始的石墨烯薄膜;(2) under the mixed gas of H2 and CH4 , heat treatment growth is carried out to the processed substrate, obtain initial graphene thin film;

(3)在H2和Ar的混合气体下,对初始的石墨烯薄膜进行刻蚀,得到二维单层枝晶石墨烯薄膜。(3) Under the mixed gas of H2 and Ar, the initial graphene film is etched to obtain a two-dimensional single-layer dendritic graphene film.

作为优选,所述步骤(1)中,Ar的流量为280~340sccm,H2和Ar的流量之比为1:14~17;衬底为铜箔或铜膜。Preferably, in the step (1), the flow rate of Ar is 280-340 sccm, the flow ratio of H 2 and Ar is 1:14-17; the substrate is copper foil or copper film.

作为优选,所述步骤(1)中,退火处理的升温速率为12~18℃/min,退火处理的温度为1020~1080℃,退火处理的时间为30~40min。Preferably, in the step (1), the heating rate of the annealing treatment is 12-18° C./min, the temperature of the annealing treatment is 1020-1080° C., and the annealing treatment time is 30-40 minutes.

作为优选,所述步骤(2)中,CH4的流量为3~5sccm,H2和CH4的流量之比为18~22:1。Preferably, in the step (2), the flow rate of CH 4 is 3-5 sccm, and the flow ratio of H 2 and CH 4 is 18-22:1.

作为优选,所述步骤(2)中,热处理生长的温度为1045~1055℃,热处理生长的时间为50~80min。Preferably, in the step (2), the temperature for heat treatment growth is 1045-1055° C., and the time for heat treatment growth is 50-80 minutes.

作为优选,所述步骤(3)中,H2的流量为10~30sccm,H2和Ar的流量之比为1:14~17。Preferably, in the step (3), the flow rate of H 2 is 10-30 sccm, and the flow ratio of H 2 and Ar is 1:14-17.

作为优选,所述步骤(3)中,刻蚀为在降至室温处理的过程中对初始的石墨烯薄膜进行H2刻蚀;刻蚀的时间为25~40min。As a preference, in the step (3), etching is carried out H 2 etching to the initial graphene film during the process of cooling down to room temperature; the etching time is 25-40min.

作为优选,所述步骤(3)中,刻蚀结束后停通H2和Ar的混合气体,之后通入Ar得到二维单层枝晶石墨烯薄膜。As preferably, in described step (3), after etching finishes, stop H2 and the mixed gas of Ar, pass into Ar afterwards to obtain two-dimensional single-layer dendritic graphene film.

本发明还提供了所述二维单层枝晶石墨烯薄膜的制备方法制备得到的二维单层枝晶石墨烯薄膜。The present invention also provides the two-dimensional single-layer dendrite graphene film prepared by the preparation method of the two-dimensional single-layer dendrite graphene film.

经由上述的技术方案可知,与现有技术相比,本发明有益效果如下:It can be seen through the above-mentioned technical solution that, compared with the prior art, the beneficial effects of the present invention are as follows:

本发明采用化学气相沉积两步生长法,获得高质量大面积连续单层石墨烯枝晶薄膜。拉曼光谱图证实石墨烯为单层,石墨烯的2D峰强度大于G峰,并具有完美的单洛伦兹峰型,即本发明所得二维单层枝晶石墨烯薄膜具有更高的传感及催化性能,在传感以及光催化领域具有重要的应用前景。The invention adopts a chemical vapor deposition two-step growth method to obtain a high-quality large-area continuous single-layer graphene dendrite film. The Raman spectrogram confirms that graphene is a single layer, and the 2D peak intensity of graphene is greater than the G peak, and has a perfect single Lorentzian peak type, that is, the two-dimensional single-layer dendritic graphene film of the present invention has higher transmission Sensitive and catalytic performance, has important application prospects in the field of sensing and photocatalysis.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.

图1为本发明实施例1所得二维单层枝晶石墨烯薄膜不同放大倍数下的扫描电镜图,其中,a的放大倍数为100倍,b的放大倍数为500倍;Fig. 1 is the scanning electron microscope picture under different magnifications of the obtained two-dimensional single-layer dendritic graphene film of the embodiment 1 of the present invention, wherein, the magnification of a is 100 times, and the magnification of b is 500 times;

图2为本发明实施例1所得二维单层枝晶石墨烯薄膜的光学显微镜图;Fig. 2 is the optical microscope picture of the obtained two-dimensional monolayer dendritic graphene film of the embodiment of the present invention 1;

图3为本发明实施例1所得二维单层枝晶石墨烯薄膜在空气中氧化后的光学显微镜图;Fig. 3 is the optical microscope picture of the obtained two-dimensional single-layer dendritic graphene film of the embodiment of the present invention 1 after being oxidized in air;

图4为本发明实施例1所得二维单层枝晶石墨烯薄膜的拉曼光谱图,其中,ID=34.7,IG=93.0,I2D=159.5,I2D/IG=1.72,I=28.0;Fig. 4 is the Raman spectrum of the two-dimensional single-layer dendritic graphene film obtained in Example 1 of the present invention, wherein, ID = 34.7, I G = 93.0, I2 D = 159.5, I 2D /I G = 1.72, I D = 28.0;

图5为本发明实施例2所得二维单层枝晶石墨烯薄膜的拉曼光谱图,其中,ID=98.2,IG=209.4,I2D=371.1,I2D/IG=1.77,I=89.2;Fig. 5 is the Raman spectrum of the two-dimensional single-layer dendritic graphene film obtained in Example 2 of the present invention, wherein, ID = 98.2, I G = 209.4, I 2D = 371.1, I 2D /I G = 1.77, I D =89.2;

图6为本发明对比例1所得连续石墨烯单层膜不同放大倍数下的的扫描电镜图,其中,a的放大倍数为83倍,b的放大倍数为123倍;Fig. 6 is the scanning electron microscope picture under the different magnifications of the obtained continuous graphene monolayer film of comparative example 1 of the present invention, wherein, the magnification of a is 83 times, and the magnification of b is 123 times;

图7为本发明对比例2和3所得石墨烯枝晶的扫描电镜图,其中,a为对比例1所得石墨烯枝晶的扫描电镜图,b为对比例3所得石墨烯枝晶的扫描电镜图;Fig. 7 is the scanning electron microscope picture of the graphene dendrite obtained in Comparative Example 2 and 3 of the present invention, wherein, a is the scanning electron microscope picture of the graphene dendrite obtained in Comparative Example 1, and b is the scanning electron microscope of the graphene dendrite obtained in Comparative Example 3 picture;

图8为本发明所述二维单层枝晶石墨烯薄膜的制备过程示意图,其中,阶段Ⅰ为退火阶段,阶段Ⅱ为生长阶段,阶段Ⅲ为刻蚀阶段。8 is a schematic diagram of the preparation process of the two-dimensional single-layer dendritic graphene film of the present invention, wherein, stage I is an annealing stage, stage II is a growth stage, and stage III is an etching stage.

具体实施方式Detailed ways

本发明提供了一种二维单层枝晶石墨烯薄膜的制备方法,包括如下步骤:The invention provides a method for preparing a two-dimensional single-layer dendrite graphene film, comprising the steps of:

(1)在H2和Ar的混合气体下,对衬底进行退火处理,得到处理后的衬底;(1) Under the mixed gas of H 2 and Ar, the substrate is annealed to obtain the processed substrate;

(2)在H2和CH4的混合气体下,对处理后的衬底进行热处理生长,得到初始的石墨烯薄膜;(2) under the mixed gas of H2 and CH4 , heat treatment growth is carried out to the processed substrate, obtain initial graphene thin film;

(3)在H2和Ar的混合气体下,对初始的石墨烯薄膜进行刻蚀,得到二维单层枝晶石墨烯薄膜。(3) Under the mixed gas of H2 and Ar, the initial graphene film is etched to obtain a two-dimensional single-layer dendritic graphene film.

在本发明中,进行退火处理前对衬底进行预处理,所述预处理的步骤为:将衬底顺次在乙醇和丙酮中分别超声清洗10~20min,之后用N2吹干,得到预处理后的衬底;In the present invention, the substrate is pretreated before the annealing treatment. The steps of the pretreatment are: the substrate is ultrasonically cleaned in ethanol and acetone respectively for 10-20 minutes, and then dried with N2 to obtain the pretreated substrate. Treated substrate;

超声清洗的时间优选为12~18min,进一步优选为14~16min;超声清洗可以去除衬底表面的杂质和有机物。The time for ultrasonic cleaning is preferably 12-18 minutes, more preferably 14-16 minutes; ultrasonic cleaning can remove impurities and organic matter on the surface of the substrate.

在本发明中,所述步骤(1)中,H2和Ar的混合气体的通入方式为:待反应器腔室内真空度降低至0.7Pa以下时,通入Ar并加热,待温度达到退火处理温度时,保持Ar的引入,通入H2In the present invention, in the step (1), the mixed gas of H and Ar is introduced in the following manner: when the vacuum degree in the reactor chamber is reduced to below 0.7 Pa, Ar is introduced and heated until the temperature reaches annealing When processing the temperature, keep the introduction of Ar and feed H 2 .

在本发明中,所述步骤(1)中,Ar的流量优选为280~340sccm,进一步优选为290~320sccm;H2和Ar的流量之比优选为1:14~17,进一步优选为1:15~16;衬底优选为铜箔或铜膜,进一步优选为铜箔。In the present invention, in the step (1), the flow rate of Ar is preferably 280-340 sccm, more preferably 290-320 sccm; the ratio of the flow rate of H and Ar is preferably 1:14-17, more preferably 1: 15-16; the substrate is preferably copper foil or copper film, more preferably copper foil.

在本发明中,所述步骤(1)中,退火处理的升温速率优选为12~18℃/min,进一步优选为13~16℃/min;退火处理的温度优选为1020~1080℃,进一步优选为1030~1060℃;退火处理的时间优选为30~40min,进一步优选为34~38min。In the present invention, in the step (1), the heating rate of the annealing treatment is preferably 12-18°C/min, more preferably 13-16°C/min; the temperature of the annealing treatment is preferably 1020-1080°C, more preferably 1030-1060° C.; the annealing treatment time is preferably 30-40 minutes, more preferably 34-38 minutes.

在本发明中,所述步骤(2)中,CH4的流量优选为3~5sccm,进一步优选为4sccm;H2和CH4的流量之比优选为18~22:1,进一步优选为19~21:1。In the present invention, in the step (2), the flow rate of CH 4 is preferably 3-5 sccm, more preferably 4 sccm; the ratio of the flow rates of H 2 and CH 4 is preferably 18-22:1, more preferably 19-2 sccm 21:1.

在本发明中,所述步骤(2)中,热处理生长的温度优选为1045~1055℃,进一步优选为1048~1050℃;热处理生长的时间优选为50~80min,进一步优选为60~70min。In the present invention, in the step (2), the heat treatment growth temperature is preferably 1045-1055°C, more preferably 1048-1050°C; the heat treatment growth time is preferably 50-80min, more preferably 60-70min.

在本发明中,所述步骤(3)中,H2的流量优选为10~30sccm,进一步优选为15~25sccm;H2和Ar的流量之比优选为1:14~17,进一步优选为1:15~16。In the present invention, in the step (3), the flow rate of H2 is preferably 10-30 sccm, more preferably 15-25 sccm; the ratio of the flow rates of H2 and Ar is preferably 1:14-17, more preferably 1 : 15-16.

在本发明中,所述步骤(3)中,刻蚀为在降至室温处理的过程中对初始的石墨烯薄膜进行H2刻蚀;降至室温处理的具体步骤为:停止电源供给,随炉自然冷却;刻蚀的时间优选为25~40min,进一步优选为30~35min。In the present invention, in described step (3), etch is carried out H2 etching to initial graphene film in the process of being lowered to room temperature processing; The furnace is naturally cooled; the etching time is preferably 25-40 minutes, more preferably 30-35 minutes.

在本发明中,所述步骤(3)中,刻蚀结束后停通H2和Ar的混合气体,之后通入Ar得到二维单层枝晶石墨烯薄膜;所述Ar的通入量优选为使真空腔内达到大气压能够打开。In the present invention, in the step (3), after the etching finishes, stop H2 and the mixed gas of Ar, then feed Ar to obtain the two-dimensional single-layer dendritic graphene film; the feeding amount of the Ar is preferably In order to make the vacuum chamber reach atmospheric pressure, it can be opened.

本发明还提供了所述二维单层枝晶石墨烯薄膜的制备方法制备得到的二维单层枝晶石墨烯薄膜。The present invention also provides the two-dimensional single-layer dendrite graphene film prepared by the preparation method of the two-dimensional single-layer dendrite graphene film.

下面结合实施例对本发明提供的技术方案进行详细的说明,但是不能把它们理解为对本发明保护范围的限定。The technical solutions provided by the present invention will be described in detail below in conjunction with the examples, but they should not be interpreted as limiting the protection scope of the present invention.

实施例1Example 1

(1)对铜箔衬底进行预处理:将铜箔顺次放入乙醇与丙酮中分别超声清洗15min,以去除铜箔表面的杂质和其他沾染有机物。超声清洗完成后,用N2吹干铜箔,完成生长前对衬底的预处理。(1) Pretreatment of the copper foil substrate: Put the copper foil in ethanol and acetone in sequence for ultrasonic cleaning for 15 minutes to remove impurities and other contaminated organic matter on the surface of the copper foil. After the ultrasonic cleaning is completed, the copper foil is blown dry with N2 to complete the pretreatment of the substrate before growth.

(2)衬底的退火处理:将预处理后的铜箔放入石英舟内,以推杆置于生长腔的恒温区域,关闭腔门,开启机械泵,待腔室内真空度降低至0.65Pa时,通入320sccmAr,开始加热环节,升温速度15℃/分钟。至温度达到1050℃后,保持Ar的引入,通入20sccmH2,保温30min,对衬底进行生长前退火。(2) Annealing treatment of the substrate: Put the pretreated copper foil into the quartz boat, place the push rod in the constant temperature area of the growth chamber, close the chamber door, turn on the mechanical pump, and wait until the vacuum degree in the chamber is reduced to 0.65Pa When 320sccmAr was introduced, the heating phase was started, and the heating rate was 15°C/min. After the temperature reaches 1050° C., the introduction of Ar is kept, 20 sccmH 2 is introduced, and the temperature is kept for 30 minutes, and the substrate is annealed before growth.

(3)石墨烯的生长:退火完毕后,在1045℃下通入80sccmH2与4sccmCH4,生长石墨烯60min。(3) Growth of graphene: After the annealing is completed, 80 sccmH 2 and 4 sccm CH 4 are passed through at 1045° C. to grow graphene for 60 min.

(4)石墨烯的刻蚀:生长完毕后,关闭CH4流量,H2流量保持为20sccm,通入320sccmAr,并停止电源供给随炉自然冷却,进行30min的刻蚀,之后降至室温,切断H2和Ar混合气的供给,关闭机械泵。最后冲入Ar(Ar的通入量保证真空腔内的压力与外界大气压相同使得真空腔可以打开),取出制备的样品,即二维单层枝晶石墨烯薄膜。(4) Etching of graphene: after the growth is completed, close the flow of CH 4 , keep the flow rate of H 20sccm , feed 320sccmAr, stop the power supply and cool naturally with the furnace, etch for 30min, then cool down to room temperature, and cut off For the supply of H2 and Ar gas mixture, turn off the mechanical pump. Finally, Ar is injected (the amount of Ar input ensures that the pressure in the vacuum chamber is the same as the external atmospheric pressure so that the vacuum chamber can be opened), and the prepared sample is taken out, that is, the two-dimensional single-layer dendritic graphene film.

实施例2Example 2

(1)对铜膜衬底进行预处理:将铜膜顺次放入乙醇与丙酮中分别超声清洗12min,以去除铜箔表面的杂质和其他沾染有机物。超声清洗完成后,用N2吹干铜箔,完成生长前对衬底的预处理。(1) Pretreatment of the copper film substrate: put the copper film in sequence in ethanol and acetone and ultrasonically clean it for 12 minutes to remove impurities and other contaminated organic matter on the surface of the copper foil. After the ultrasonic cleaning is completed, the copper foil is blown dry with N2 to complete the pretreatment of the substrate before growth.

(2)衬底的退火处理:将预处理后的铜箔放入石英舟内,以推杆置于生长腔的恒温区域,关闭腔门,开启机械泵,待腔室内真空度降低至0.7Pa时,通入300sccmAr,开始加热环节,升温速度12℃/分钟。至温度达到1040℃后,保持Ar的引入,通入20sccmH2,保温35min,对衬底进行生长前退火。(2) Annealing treatment of the substrate: Put the pretreated copper foil into the quartz boat, place the push rod in the constant temperature area of the growth chamber, close the chamber door, turn on the mechanical pump, and wait until the vacuum degree in the chamber is reduced to 0.7Pa When 300sccmAr was introduced, the heating phase was started, and the heating rate was 12°C/min. After the temperature reaches 1040° C., the introduction of Ar is kept, 20 sccmH 2 is passed through, and the temperature is kept for 35 minutes, and the substrate is annealed before growth.

(3)石墨烯的生长:退火完毕后,在1050℃下通入60sccmH2与3sccmCH4,生长石墨烯70min。(3) Growth of graphene: After the annealing is completed, 60 sccmH 2 and 3 sccm CH 4 are passed through at 1050° C. to grow graphene for 70 min.

(4)石墨烯的刻蚀:生长完毕后,关闭CH4流量,H2流量保持为20sccm,通入300sccmAr,并停止电源供给随炉自然冷却,进行30min的刻蚀,之后降至室温,切断H2和Ar混合气的供给,关闭机械泵。最后冲入Ar(Ar的通入量保证真空腔内的压力与外界大气压相同使得真空腔可以打开),取出制备的样品,即二维单层枝晶石墨烯薄膜。(4) Etching of graphene: after the growth is completed, close the flow of CH 4 , keep the flow rate of H 20sccm , feed 300sccmAr, and stop the power supply to cool naturally with the furnace, perform etching for 30min, then cool down to room temperature, and cut off For the supply of H2 and Ar gas mixture, turn off the mechanical pump. Finally, Ar is injected (the amount of Ar input ensures that the pressure in the vacuum chamber is the same as the external atmospheric pressure so that the vacuum chamber can be opened), and the prepared sample is taken out, that is, the two-dimensional single-layer dendritic graphene film.

实施例3Example 3

(1)对铜箔衬底进行预处理:将铜箔顺次放入乙醇与丙酮中分别超声清洗18min,以去除铜箔表面的杂质和其他沾染有机物。超声清洗完成后,用N2吹干铜箔,完成生长前对衬底的预处理。(1) Pretreatment of the copper foil substrate: Put the copper foil in ethanol and acetone in sequence for ultrasonic cleaning for 18 minutes to remove impurities and other contaminated organic matter on the surface of the copper foil. After the ultrasonic cleaning is completed, the copper foil is blown dry with N2 to complete the pretreatment of the substrate before growth.

(2)衬底的退火处理:将预处理后的铜箔放入石英舟内,以推杆置于生长腔的恒温区域,关闭腔门,开启机械泵,待腔室内真空度降低至0.6Pa时,通入350sccmAr,开始加热环节,升温速度16℃/分钟。至温度达到1050℃后,保持Ar的引入,通入20sccmH2,保温32min,对衬底进行生长前退火。(2) Annealing treatment of the substrate: Put the pretreated copper foil into the quartz boat, place the push rod in the constant temperature area of the growth chamber, close the chamber door, turn on the mechanical pump, and wait until the vacuum degree in the chamber is reduced to 0.6Pa When 350sccmAr was introduced, the heating phase was started, and the heating rate was 16°C/min. After the temperature reaches 1050° C., the introduction of Ar is kept, 20 sccmH 2 is passed through, and the temperature is kept for 32 minutes, and the substrate is annealed before growth.

(3)石墨烯的生长:退火完毕后,在1055℃下通入100sccmH2与5sccmCH4,生长石墨烯40min。(3) Growth of graphene: After the annealing is completed, 100 sccmH 2 and 5 sccm CH 4 are passed through at 1055° C. to grow graphene for 40 min.

(4)石墨烯的刻蚀:生长完毕后,关闭CH4流量,H2流量保持为20sccm,通入350sccmAr,并停止电源供给随炉自然冷却,进行30min的刻蚀,之后降至室温,切断H2和Ar混合气的供给,关闭机械泵。最后冲入Ar(Ar的通入量保证真空腔内的压力与外界大气压相同使得真空腔可以打开),取出制备的样品,即二维单层枝晶石墨烯薄膜。(4) Etching of graphene: after the growth is completed, turn off the flow of CH 4 , keep the flow rate of H 20 sccm, feed 350 sccmAr, stop the power supply and let the furnace cool naturally, perform etching for 30 minutes, then cool down to room temperature, and cut off For the supply of H2 and Ar gas mixture, turn off the mechanical pump. Finally, Ar is injected (the amount of Ar input ensures that the pressure in the vacuum chamber is the same as the external atmospheric pressure so that the vacuum chamber can be opened), and the prepared sample is taken out, that is, the two-dimensional single-layer dendritic graphene film.

对比例1Comparative example 1

与实施例1的区别为:石墨烯的刻蚀阶段不通入H2,其它同实施例1,最终得到连续石墨烯单层膜。The difference from Example 1 is that H 2 is not introduced in the etching stage of graphene, and the others are the same as in Example 1, and finally a continuous graphene monolayer film is obtained.

对比例2Comparative example 2

与实施例1的区别为:石墨烯的生长阶段CH4的流量为1sccm、H2流量为20sccm,其它同实施例1,最终得到石墨烯枝晶。The difference from Example 1 is: the flow of CH in the growth stage of graphene is 1 sccm, and the flow of H is 20 sccm. Others are the same as in Example 1, and graphene dendrites are finally obtained.

对比例3Comparative example 3

与实施例1的区别为:石墨烯的生长阶段CH4的流量为2sccm、H2流量为40sccm,其它同实施例1,最终得到石墨烯枝晶。The difference from Example 1 is: the flow of CH in the growth stage of graphene is 2 sccm, and the flow of H is 40 sccm. Others are the same as in Example 1, and graphene dendrites are finally obtained.

由实施例和对比例所得石墨烯膜层的对比可知,本发明获得高质量大面积连续单层石墨烯枝晶薄膜,拉曼光谱图证实石墨烯为单层,石墨烯的2D峰强度大于G峰,并具有完美的单洛伦兹峰型,本发明所得二维单层枝晶石墨烯薄膜具有优异的连续性和完整性,在传感以及光催化领域具有重要的应用前景。From the comparison of the graphene film layers obtained in the examples and comparative examples, it can be seen that the present invention obtains high-quality large-area continuous single-layer graphene dendrite films, and the Raman spectrum confirms that graphene is a single layer, and the 2D peak intensity of graphene is greater than G peak, and has a perfect single Lorentz peak type, the two-dimensional single-layer dendritic graphene film obtained in the present invention has excellent continuity and integrity, and has important application prospects in the fields of sensing and photocatalysis.

以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above is only a preferred embodiment of the present invention, it should be pointed out that, for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications can also be made. It should be regarded as the protection scope of the present invention.

Claims (9)

1. The preparation method of the two-dimensional single-layer dendrite graphene film is characterized by comprising the following steps of:
(1) At H 2 Annealing the substrate under the mixed gas of Ar to obtain a treated substrate;
(2) At H 2 And CH (CH) 4 Performing heat treatment growth on the treated substrate under the mixed gas to obtain an initial graphene film;
(3) At H 2 Under the mixed gas of Ar and the initial graphene filmAnd etching to obtain the two-dimensional single-layer dendrite graphene film.
2. The method for preparing a two-dimensional monolayer dendrite graphene film according to claim 1, wherein in the step (1), the flow rate of Ar is 280-340 sccm and H 2 And Ar is 1: 14-17; the substrate is copper foil or copper film.
3. The method for preparing a two-dimensional monolayer dendrite graphene film according to claim 2, wherein in the step (1), the temperature rise rate of the annealing treatment is 12-18 ℃/min, the annealing treatment temperature is 1020-1080 ℃, and the annealing treatment time is 30-40 min.
4. The method for preparing a two-dimensional monolayer dendrite graphene film according to claim 3, wherein in the step (2), CH 4 The flow rate of (3-5 sccm) H 2 And CH (CH) 4 The flow ratio of (2) is 18-22: 1.
5. the method for preparing a two-dimensional monolayer dendrite graphene film according to claim 1 or 4, wherein in the step (2), the temperature of the heat treatment growth is 1045 to 1055 ℃ and the time of the heat treatment growth is 50 to 80 minutes.
6. A method for producing a two-dimensional monolayer dendrite graphene film according to any one of claims 1 to 3, wherein in step (3), H 2 The flow rate of (C) is 10-30 sccm, H 2 And Ar is 1:14 to 17.
7. The method of preparing a two-dimensional monolayer dendrite graphene film according to claim 6, wherein in the step (3), the etching is performed by H on the initial graphene film during the process of cooling to room temperature 2 Etching; the etching time is 25-40 min.
8. The two-dimensional monolayer dendrite of claim 7The preparation method of the graphene film is characterized in that in the step (3), H is stopped after etching is finished 2 And introducing Ar into the mixed gas of Ar to obtain the two-dimensional monolayer dendrite graphene film.
9. The two-dimensional monolayer dendrite graphene film prepared by the method for preparing the two-dimensional monolayer dendrite graphene film according to any one of claims 1 to 8.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103834993A (en) * 2014-01-07 2014-06-04 同济大学 Preparation method of graphene dendritic crystals and graphene dendritic crystals thereof
CN104445164A (en) * 2014-11-18 2015-03-25 扬州大学 Universal method for controllable growth of nano structure on single-layer graphene film
CN106698408A (en) * 2016-12-30 2017-05-24 武汉理工大学 Concave structure monocrystalline graphene and preparation method thereof
CN108910868A (en) * 2018-08-09 2018-11-30 德州学院 A method of preparing graphene dendrite on an insulating substrate
CN109734079A (en) * 2019-03-12 2019-05-10 湖南医家智烯新材料科技股份有限公司 A kind of dendroid graphene and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103834993A (en) * 2014-01-07 2014-06-04 同济大学 Preparation method of graphene dendritic crystals and graphene dendritic crystals thereof
CN104445164A (en) * 2014-11-18 2015-03-25 扬州大学 Universal method for controllable growth of nano structure on single-layer graphene film
CN106698408A (en) * 2016-12-30 2017-05-24 武汉理工大学 Concave structure monocrystalline graphene and preparation method thereof
CN108910868A (en) * 2018-08-09 2018-11-30 德州学院 A method of preparing graphene dendrite on an insulating substrate
CN109734079A (en) * 2019-03-12 2019-05-10 湖南医家智烯新材料科技股份有限公司 A kind of dendroid graphene and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
XIA ZHANG等: "Etching-controlled preparation of large-area fractal graphene by lowpressure CVD on polycrystalline Cu substrate", 《MATERIALS TODAY COMMUNICATIONS》, vol. 24, 30 September 2020 (2020-09-30), pages 1 - 5 *

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