CN116182470A - Horizontal semiconductor refrigerator - Google Patents
Horizontal semiconductor refrigerator Download PDFInfo
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- CN116182470A CN116182470A CN202310413090.6A CN202310413090A CN116182470A CN 116182470 A CN116182470 A CN 116182470A CN 202310413090 A CN202310413090 A CN 202310413090A CN 116182470 A CN116182470 A CN 116182470A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000005057 refrigeration Methods 0.000 claims abstract description 104
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims description 87
- 238000001816 cooling Methods 0.000 claims description 77
- 238000007599 discharging Methods 0.000 claims description 18
- 230000009471 action Effects 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 238000009825 accumulation Methods 0.000 abstract description 12
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000002537 cosmetic Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001877 deodorizing effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The application provides a horizontal semiconductor refrigerator, including box and thermoelectric refrigeration module, the top of box is the open end, thermoelectric refrigeration module set up in the side of box, through with refrigeration piece fin set up in the inner wall of box, with refrigeration piece bottom plate with refrigeration piece fin connection, the outer end of refrigeration piece bottom plate runs through the lateral wall of box, with the semiconductor refrigeration piece set up in the outer end of refrigeration piece, the radiating block set up in the outer wall of box, the radiating block with the semiconductor refrigeration piece is connected to do benefit to the control of high size, and, because of thermoelectric refrigeration module set up in the side of box, reduce the accumulation risk of refrigeration piece fin surface comdenstion water, improve the heat exchange efficiency of refrigeration piece, guarantee that the incasement temperature is even.
Description
Technical Field
The application relates to the technical field of semiconductor refrigeration refrigerators, in particular to a horizontal semiconductor refrigerator.
Background
The semiconductor refrigerator is a refrigerator which utilizes the Peltier effect to obtain the refrigerating effect and comprises a door body, a refrigerator body and a thermoelectric refrigerating module, wherein the refrigerator with the door body opened upwards is called a horizontal refrigerator. The horizontal refrigerator has good stability for storing articles, is reliable to take, is mainly used for storing fragile and shattered high-value articles, is not suitable for being too high in general in order to improve the visibility and convenience of storing articles, and particularly, the cosmetic refrigerator is generally placed on a dressing table, and the use convenience of a user can be influenced to a certain extent due to the fact that the top door is too high.
The thermoelectric refrigeration module comprises a heat dissipation block, a semiconductor refrigeration sheet and a refrigeration block, wherein the heat dissipation block is positioned on the outer side of the box body heat preservation layer, one surface of the heat dissipation block, which faces the box body heat preservation layer, is clung to the hot end of the semiconductor refrigeration sheet, one part of the refrigeration block is positioned on the inner side of the box body heat preservation layer, and the other part of the refrigeration block penetrates through the box body heat preservation layer to be clung to the cold end of the semiconductor refrigeration sheet.
The existing top uncapping type semiconductor refrigerator is characterized in that a semiconductor refrigeration module is arranged in a cosmetic refrigerator at the bottom, a cold guide block is tightly attached to an inner container, a sunken groove is formed in a bottom plate of the inner container, and the cold guide block is fixed on the lower surface of the groove.
The disadvantage of this design is that the semiconductor refrigeration module is placed at the bottom, which is not beneficial to control of the height dimension of the refrigerator, resulting in low capacity of the refrigerator; on the other hand, the refrigerating module is arranged at the bottom, the cold guide block is clung to the inner container, particularly, condensed water accumulation is easy to occur at the groove position, the heat exchange efficiency is affected, and the temperature in the box is uneven.
Disclosure of Invention
The embodiment of the application provides a horizontal semiconductor refrigerator, has solved current semiconductor refrigerator, and semiconductor refrigeration module is arranged in the bottom, is unfavorable for the control of refrigerator high dimension, leads to the refrigerator volume rate low, simultaneously, the inner bag bottom produces the comdenstion water easily and piles up, influences heat exchange efficiency, leads to the inhomogeneous problem of incasement temperature.
The embodiment of the application provides a horizontal semiconductor refrigerator, which comprises a refrigerator body and a thermoelectric refrigeration module, wherein the top end of the refrigerator body is an open end, and the thermoelectric refrigeration module is arranged on the side surface of the refrigerator body;
the thermoelectric refrigeration module comprises a refrigeration block, a semiconductor refrigeration piece and a heat dissipation block, wherein the refrigeration block comprises a refrigeration block fin and a refrigeration block bottom plate, the refrigeration block fin and the refrigeration block bottom plate are of an integrated structure, the refrigeration block fin is arranged on the inner wall of the box body, the first end of the refrigeration block bottom plate is connected with the refrigeration block fin, the second end of the refrigeration block bottom plate penetrates through the side wall of the box body, the semiconductor refrigeration piece is arranged at the second end of the refrigeration block, the heat dissipation block is arranged on the outer wall of the box body, and the heat dissipation block is connected with the semiconductor refrigeration piece.
In one possible implementation, the horizontal semiconductor refrigerator further includes a cold air discharge assembly and a hot air discharge assembly;
the cold air discharge assembly is arranged in the box body, and surrounds the inner wall of the box body to form a refrigerating cavity, the refrigerating block fins are positioned in the refrigerating cavity, and the cold air discharge assembly is provided with a refrigerating air inlet and a refrigerating air outlet which are communicated with the refrigerating cavity;
the hot air discharging assembly is arranged outside the box body and surrounds a heat dissipation cavity with the outer wall of the box body, the heat dissipation blocks are all positioned in the heat dissipation cavity, and the hot air discharging assembly is provided with a heat dissipation air inlet and a heat dissipation air outlet which are communicated with the heat dissipation cavity.
In one possible implementation manner, the outer wall of the cooling block fin is parallel to the side wall of the cooling block bottom plate, and the cooling block fin and the side, close to the cooling air inlet, of the cooling block bottom plate are inclined towards the top end of the box body so as to guide the cool air flowing into the cooling cavity downwards, and condensed water on the cooling block flows to the bottom end of the cooling cavity under the action of gravity and wind force.
In one possible implementation manner, a fin is disposed at a position, close to the refrigerating air outlet, of the refrigerating cavity, and an end, far away from the refrigerating air outlet, of the fin is inclined towards the top end of the box body so as to guide cold air discharged from the refrigerating cavity towards the top end of the box body.
In one possible implementation, the cool air discharge assembly includes a volute cover plate and a refrigeration fan;
the spiral case cover plate is fixedly arranged on the inner wall of the case body, the spiral case cover plate and the case body are encircled to form the refrigerating cavity, the refrigerating air inlet and the refrigerating air outlet are oppositely arranged on the spiral case cover plate, and the fins are arranged on the spiral case cover plate;
the refrigerating fan is arranged on the inner wall of the box body and is positioned in the refrigerating cavity, and the refrigerating fan is used for discharging cold air in the refrigerating cavity from the refrigerating air outlet to the box body and sucking warm air in the box body from the refrigerating air inlet into the refrigerating cavity.
The hot air discharging assembly comprises a volute rear cover and a heat dissipation fan;
the volute rear cover is fixedly arranged on the outer wall of the box body, the volute rear cover and the box body are encircled to form the heat dissipation cavity, and the heat dissipation air inlet and the heat dissipation air outlet are oppositely arranged on the volute cover plate;
the heat dissipation fan is fixedly arranged on the outer wall of the box body and is positioned in the heat dissipation cavity, and the heat dissipation fan is used for exhausting warm air in the heat dissipation cavity to the outside of the refrigerator through the heat dissipation air outlet and sucking cold air outside the refrigerator into the heat dissipation cavity through the heat dissipation air inlet.
In one possible implementation manner, the heat dissipation fan and the refrigeration fan are respectively located at two sides of the thermoelectric refrigeration module, and the heat dissipation fan outside the box and the refrigeration fan in the box are centrifugal fans.
In one possible implementation, the cooling block is close to the cooling air inlet side, and the cooling block fin is flush with the cooling block bottom plate;
and/or the side, far away from the refrigerating air inlet, of the refrigerating block is shorter than the bottom plate of the refrigerating block by a millimeter, and a is more than or equal to 0.5mm.
In one possible implementation, the cooling block fin forms an angle β with the horizontal, the angle β being 0-45 °.
In a possible implementation, the surface of the refrigeration block is provided with a hydrophilic film, and the hydrophilic angle of the hydrophilic film is smaller than 10 degrees.
In one possible implementation manner, a bottom air outlet communicated with the heat dissipation cavity is arranged at the bottom end of the box body.
The embodiment of the application provides a horizontal semiconductor refrigerator, through with the refrigeration piece fin set up in the inner wall of box, with refrigeration piece bottom plate with refrigeration piece fin connection, the outer end of refrigeration piece bottom plate runs through the lateral wall of box, with the semiconductor refrigeration piece set up in the outer end of refrigeration piece, the radiating block set up in the outer wall of box, the radiating block with the semiconductor refrigeration piece is connected to do benefit to the control of high size, and, because of thermoelectric refrigeration module set up in the side of box, reduce the accumulation risk of refrigeration piece fin surface comdenstion water, improve the heat exchange efficiency of refrigeration piece, guarantee that the incasement temperature is even.
Drawings
Fig. 1 is a condensed water accumulation schematic diagram of a conventional semiconductor refrigerator;
fig. 2 is a schematic view of a structure of a semiconductor refrigerator provided in the present application;
FIG. 3 is a schematic diagram of a thermoelectric refrigeration module of the semiconductor refrigerator provided by the present application;
fig. 4 is a schematic diagram of forced convection of a fan motor of a semiconductor refrigerator provided by the present application;
FIG. 5 is a cross-sectional view taken along the A-A plane of FIG. 4;
FIG. 6 is a schematic diagram of the refrigeration block of FIG. 5;
FIG. 7 is a schematic view of the volute housing of FIG. 5;
fig. 8 is a schematic diagram of the position of the bottom air outlet of the semiconductor refrigerator provided by the application.
Reference numerals illustrate:
the heat-dissipating type solar heat-dissipating type refrigerator comprises a door body 1, a box body 2, a thermoelectric refrigerating module 3, a volute casing 4, a heat-dissipating fan 5, a refrigerating fan 6, a back cover 7, a volute casing 8, a bottom air outlet 201, a refrigerating block 301, a semiconductor refrigerating sheet 302, a heat-dissipating block 303, a wing sheet 801, a refrigerating block fin 3011 and a refrigerating block bottom plate 3012.
Detailed Description
In order to better understand the technical solutions in the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
The semiconductor refrigerator is a refrigerating device for obtaining a refrigerating effect by utilizing the Peltier effect, and has the advantages of compact structure, no moving parts, small vibration and low noise, and the defects of small cooling capacity of a semiconductor module, small overall size of the refrigerator and very high requirement on volume rate in the aspect of product design.
The current top uncaps, and make-up refrigerator of bottom is arranged in to semiconductor refrigeration module, because semiconductor refrigeration module arranges the bottom in, leads to there to have following problem:
1. the semiconductor refrigeration module is arranged at the bottom, which is not beneficial to controlling the height and the size of the refrigerator, so that the capacity rate of the refrigerator is low;
2. referring to FIG. 1, condensed water is easily accumulated at the bottom of the liner, particularly at the groove position, at the position where the cold guide block is tightly attached to the liner, so that the heat exchange efficiency is affected, and the temperature in the tank is uneven; the heat conductivity coefficient of water at normal temperature is 0.59W/(m.K), the heat conductivity coefficient of an aluminum alloy refrigerating block is 201W/(m.K), condensed water is accumulated on the surface of the refrigerating block to influence the heat transfer performance of the heat conducting block, and the bottom refrigerating structure limits the convection of air, so that the bottom temperature of the refrigerator is too low, and the upper temperature of the refrigerator is too high.
The application provides a horizontal semiconductor refrigerator, through set up thermoelectric refrigeration module 3 in the side of box 2, refrigeration piece fin 3011 sets firmly in the inside wall of box 2, and radiating block 303 sets firmly in the lateral wall of box 2 to do benefit to the control of high size, and, because of thermoelectric refrigeration module 3 sets up in the side of box 2, reduce the accumulation risk of refrigeration piece fin surface comdenstion water, improve the heat exchange efficiency of refrigeration piece, guarantee that the incasement temperature is even.
The following describes in detail the specific structure of the horizontal semiconductor refrigerator provided in the present application with reference to the accompanying drawings.
Referring to fig. 2-6, an embodiment of the present application provides a horizontal semiconductor refrigerator, including a box 2 and a thermoelectric refrigeration module 3, where the top end of the box 2 is an open end, and the thermoelectric refrigeration module 3 is disposed on a side surface of the box 2;
the thermoelectric refrigeration module 3 comprises a refrigeration block 301, a semiconductor refrigeration sheet 302 and a heat dissipation block 303, wherein the refrigeration block 301 comprises a refrigeration block fin 3011 and a refrigeration block bottom plate 3012, the refrigeration block fin 3011 and the refrigeration block bottom plate 3012 are of an integrated structure, the refrigeration block fin 3011 is arranged on the inner wall of the box body 2, the inner end of the refrigeration block bottom plate 3012 is connected with the refrigeration block fin 3011, the outer end of the refrigeration block bottom plate 3012 penetrates through the side wall of the box body 2, the semiconductor refrigeration sheet 302 is arranged at the outer end of the refrigeration block 301, the heat dissipation block 303 is arranged on the outer wall of the box body 2, and the heat dissipation block 303 is connected with the semiconductor refrigeration sheet 302;
the cooling block fins 3011, the cooling block bottom plate 3012, the semiconductor cooling fins 302 and the cooling block 303 are sequentially connected, so that heat conduction is realized, heat in the box body 2 is absorbed through the cooling block fins 3011, and is sequentially transferred to the cooling block 303 through the cooling block bottom plate 3012 and the semiconductor cooling fins 302, and the cooling block 303 releases the heat to the outside of the box body 2, so that the refrigerator cooling is realized.
According to the horizontal semiconductor refrigerator provided by the embodiment of the application, the refrigerating block fins 3011 are arranged on the inner wall of the box body 2, the refrigerating block bottom plate 3012 is connected with the refrigerating block fins 3011, the outer end of the refrigerating block bottom plate 3012 penetrates through the side wall of the box body 2, the semiconductor refrigerating sheet 302 is arranged at the outer end of the refrigerating block 301, the radiating block 303 is arranged on the outer wall of the box body 2, and the radiating block 303 is connected with the semiconductor refrigerating sheet 302, so that the control of the height dimension is facilitated, and in addition, the accumulation risk of condensed water on the surface of the refrigerating block fins is reduced, the heat exchange efficiency of the refrigerating block is improved, and the uniformity of the temperature in the box is ensured.
Referring to fig. 2 and 3, in some embodiments, the horizontal semiconductor refrigerator further includes a cool air discharging assembly and a hot air discharging assembly;
the cold air discharging assembly is arranged in the box body 2 and surrounds the inner wall of the box body 2 to form a refrigerating cavity, the refrigerating block fins 3011 are positioned in the refrigerating cavity, the cold air discharging assembly is provided with a refrigerating air inlet and a refrigerating air outlet which are communicated with the refrigerating cavity, hot air in the box body enters the refrigerating cavity through the refrigerating air inlet, the refrigerating block fins 3011 absorb heat to enable the hot air to be converted into cold air, the cold air is discharged out of the refrigerating cavity through the refrigerating air outlet and enters the box body 2, so that the box body is refrigerated, and the air flow direction in the box body 2 is conveniently controlled through the arrangement of the refrigerating air inlet and the refrigerating air outlet, and the temperature of different positions in the box body 2 is conveniently controlled;
the hot air discharging assembly is arranged outside the box body 2 and surrounds a heat dissipation cavity with the outer wall of the box body 2, the heat dissipation blocks 303 are all located in the heat dissipation cavity, the hot air discharging assembly is provided with a heat dissipation air inlet and a heat dissipation air outlet which are communicated with the heat dissipation cavity, cold air outside the refrigerator enters the heat dissipation cavity through the heat dissipation air inlet, heat of the cold air absorbing heat dissipation blocks 303 is converted into hot air, the hot air is discharged to the outside of the refrigerator through the heat dissipation cavity, heat dissipation is conducted on the heat dissipation blocks 303, and the heat dissipation air inlet and the heat dissipation air outlet are arranged at positions so as to conveniently control the flow direction of hot air discharged by the refrigerator and use the refrigerator by a user.
When the refrigerator works, the surface temperature of the refrigerating block 301 is relatively low, condensed water accumulation easily occurs on the surface of the refrigerating block fin 3011, and even under the condition of moist environment, a water bridge can be formed between the fins to influence the forced convection air quantity of the fan motor.
6-7, in one embodiment, the outer walls of the cooling block fins 3011 are parallel to the side walls of the cooling block bottom plate 3012, and the cooling block fins 3011 and the cooling block bottom plate 3012 are inclined towards the top end of the box 2 on the side close to the cooling air inlet, so as to guide the cool air flowing into the cooling cavity downwards, and the condensed water on the cooling block 301 flows to the bottom end of the cooling cavity under the action of gravity and wind force;
referring to fig. 5, under the diversion effect of the cooling block fins 3011, air flow blows downwards from a high position, namely, hot air in the box body 2 flows from the upper right to the lower left after entering the cooling cavity, condensed water on the cooling block 301 is on an inclined plane, and the condensed water flows to the bottom end of the cooling cavity under the action of self gravity and hot air wind force, so that the accumulation risk of condensed water on the surface of the cooling block fins is reduced, and the heat exchange efficiency of the cooling block 301 is improved;
a wing plate 801 is arranged at the position, close to the refrigerating air outlet, of the refrigerating cavity, and the end, far away from the refrigerating air outlet, of the wing plate 801 is inclined towards the top end of the box body 2 so as to guide cold air discharged by the refrigerating cavity towards the top end of the box body 2;
referring to fig. 5, a plurality of fins 801 are obliquely arranged, hot air in the box body 2 flows from the upper right to the lower left after entering the refrigerating cavity, in the process, heat is absorbed by the refrigerating block fins 3011, the hot air is converted into cold air after passing through the refrigerating block fins 3011, the cold air continuously flows to the left side to cool the air outlet, the cold air flows to the upper left under the diversion effect of the plurality of fins 801 until being discharged into the box body 2, the air flow path in the refrigerating cavity is in a V shape, and the fins 801 are beneficial to the uniformity of the upper and lower temperatures in the box;
in practical application, the horizontal semiconductor refrigerator also has the function of sterilizing bacteria, and the ion generator is arranged in the refrigerating cavity in the refrigerator body, so that the uniform wind field is beneficial to the improvement of the sterilizing and deodorizing effects of the ion generator in the refrigerator body.
Referring to fig. 6 and 7, fig. 6 illustrates a three-dimensional state, a front view state and a side view state of the cooling block 301, and in some embodiments, the cooling block fins 3011 are arranged transversely and form an angle beta with respect to the horizontal direction, and the angle beta is 0-45 degrees, so that condensate water can flow downwards under the action of gravity, and the heat exchange efficiency is ensured.
In some embodiments, the surface of the refrigeration block 301 is provided with a hydrophilic film, the hydrophilic angle of the hydrophilic film is smaller than 10 degrees, the thickness of the water film is reduced, and the formation of a 'water bridge' between fins is avoided to obstruct the circulation of air.
In some embodiments, the refrigeration block 301 is inclined toward the top of the case 2 near the refrigeration intake side, with the refrigeration block fins 3011 flush with the refrigeration block base 3012;
the side of the refrigerating block 301 far away from the refrigerating air inlet is provided with refrigerating block fins 3011 which are shorter than the refrigerating block bottom plate 3012 by a millimeter, wherein a is more than or equal to 0.5mm, and condensed water flows to the lowest position of the refrigerating block fins in a homeotropic manner, so that the phenomenon of accumulation is not easy to occur, and the heat exchange efficiency is ensured.
The invention reduces the problem of heat exchange efficiency reduction caused by condensed water accumulation by the methods of inclination of the refrigerating block fins 3011, length steps of the end parts of the refrigerating block fins 3011 and the refrigerating block bottom plate 3012, hydrophilic films on the surfaces of the refrigerating blocks 301 and the like.
Referring to fig. 2-5, in one embodiment, the cool air discharge assembly includes a volute cover 8 and a cooling fan 6;
the spiral case cover plate 8 is fixedly arranged on the inner wall of the case body 2, the spiral case cover plate 8 and the case body 2 are surrounded to form a refrigerating cavity, a refrigerating air inlet and a refrigerating air outlet are arranged on the spiral case cover plate 8, and the fins 801 are arranged on the spiral case cover plate 8;
the refrigerating fan 6 is arranged on the inner wall of the box body 2, the refrigerating fan 6 and the refrigerating block fins 3011 are both positioned in the refrigerating cavity, as shown in fig. 4, the refrigerating fan 6 is used for discharging cold air in the refrigerating cavity into the box body 2 from the refrigerating air outlet and sucking warm air in the box body 2 into the refrigerating cavity from the refrigerating air inlet;
the hot air discharging assembly comprises a volute rear cover 4 and a heat dissipation fan 5;
the spiral case back cover 4 is fixedly arranged on the outer wall of the case body 2, the spiral case back cover 4 and the case body 2 are surrounded to form a heat dissipation cavity, and a heat dissipation air inlet and a heat dissipation air outlet are oppositely arranged on the spiral case cover plate 8;
the heat dissipation fan 5 is fixedly arranged on the outer wall of the box body 2, and the heat dissipation fan 5 and the heat dissipation block 303 are both positioned in the heat dissipation cavity, as shown in fig. 4, the heat dissipation fan 5 is used for discharging warm air in the heat dissipation cavity to the outside of the refrigerator through the heat dissipation air outlet and sucking cold air outside the refrigerator into the heat dissipation cavity through the heat dissipation air inlet;
as shown in fig. 2, the right side of the thermoelectric refrigeration module 3 is provided with a avoidance position, the avoidance position is semicircular matched with the heat dissipation fan 5, and part of the heat dissipation fan 5 is positioned in the avoidance position, so that the refrigeration module is compact in structure, and the volume rate of the cosmetic product is improved.
The refrigerating fan 6 is positioned at the upper end of the refrigerating block fin 3011, air flow blows downwards from a high position, the accumulation risk of condensed water on the surface of the refrigerating block fin is reduced, and the heat exchange efficiency of the refrigerating block 301 is improved.
Referring to fig. 5-7, in some embodiments, the heat dissipation fan 5 and the cooling fan 6 are respectively located at two sides of the thermoelectric cooling module, the cooling fan 6 in the box and the cooling fan 5 outside the box are centrifugal fans to perform forced convection on the thermoelectric cooling module 3, and the heat dissipation fan 5 and the cooling fan 6 are respectively arranged at two sides of the thermoelectric cooling module, so that the heat dissipation fan is compact in structure (local heat preservation layer thickness is not too thin due to superposition of the inner fan and the outer fan) and can effectively reduce the heat load of the box.
In practical application, the horizontal semiconductor refrigerator has the characteristics of compact structure, high volume rate, flat bottom surface, thin heat insulation layer and low foot height, and in order to avoid the risk of condensation on the bottom surface, as shown in fig. 8, as a preferred technical scheme of the invention, a bottom air outlet 201 is arranged at the bottom of the refrigerator body 2, and the bottom air outlet 201 is communicated with the heat dissipation cavity, so that the air temperature and convection coefficient of the bottom surface of the refrigerator are improved, and the risk of condensation is reduced.
By the technical characteristics record, the working principle of the horizontal semiconductor refrigerator in the practical application scene is as follows:
referring to fig. 3 and 4, during operation, the cooling block fins 3011 absorb heat of air in the cooling cavity, so that the air in the cooling cavity is cold air, and heat is sequentially transferred from the cooling block bottom plate 3012 and the semiconductor cooling fins 302 to the cooling block 303, the cooling fan 6 discharges the cold air in the cooling cavity into the box 2 through the cooling air outlet, and warm air in the box 2 is sucked into the cooling cavity through the cooling air inlet, so that air circulation cooling is realized;
the heat dissipation block 303 releases heat into the heat dissipation cavity, the heat dissipation fan 5 discharges warm air in the heat dissipation cavity to the outside of the refrigerator through the heat dissipation air outlet, and cold air outside the refrigerator is sucked into the heat dissipation cavity through the heat dissipation air inlet, so that the heat dissipation block 303 can quickly dissipate heat;
the cooling fan 6 in the box and the cooling fan 5 outside the box are centrifugal fans to force convection to the thermoelectric cooling module 3, the heat dissipation fan 5 and the cooling fan 6 are respectively arranged on two sides of the thermoelectric cooling module, the structure is compact, the heat load of the box can be effectively reduced, the problem of heat exchange efficiency reduction caused by condensed water accumulation is reduced through methods of inclination of the cooling block fins 3011, length steps of the end parts of the cooling block fins 3011 and the cooling block bottom plate 301, hydrophilic films on the surface of the cooling block and the like.
It is to be understood that, based on the several embodiments provided in the present application, those skilled in the art may combine, split, reorganize, etc. the embodiments of the present application to obtain other embodiments, where none of the embodiments exceed the protection scope of the present application.
The foregoing detailed description of the embodiments of the present application has further described the objects, technical solutions and advantageous effects thereof, and it should be understood that the foregoing is merely a specific implementation of the embodiments of the present application, and is not intended to limit the scope of the embodiments of the present application, and any modifications, equivalent substitutions, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of the embodiments of the present application.
Claims (10)
1. A horizontal semiconductor refrigerator is characterized in that: the thermoelectric refrigerating device comprises a box body (2) and a thermoelectric refrigerating module (3), wherein the top end of the box body (2) is an open end, and the thermoelectric refrigerating module (3) is arranged on the side surface of the box body (2);
the thermoelectric refrigeration module (3) comprises a refrigeration block (301), a semiconductor refrigeration sheet (302) and a heat dissipation block (303), the refrigeration block (301) comprises a refrigeration block fin (3011) and a refrigeration block bottom plate (3012), the refrigeration block fin (3011) and the refrigeration block bottom plate (3012) are of an integrated structure, the refrigeration block fin (3011) is arranged on the inner wall of the box body (2), the first end of the refrigeration block bottom plate (3012) is connected with the refrigeration block fin (3011), the second end of the refrigeration block bottom plate (3012) penetrates through the side wall of the box body (2), the semiconductor refrigeration sheet (302) is arranged at the second end of the refrigeration block (301), the heat dissipation block (303) is arranged on the outer wall of the box body (2), and the heat dissipation block (303) is connected with the semiconductor refrigeration sheet (302).
2. The horizontal semiconductor refrigerator according to claim 1, wherein:
the horizontal semiconductor refrigerator further comprises a cold air discharge assembly and a hot air discharge assembly;
the cold air discharge assembly is arranged in the box body (2) and surrounds the inner wall of the box body (2) to form a refrigerating cavity, the refrigerating block fins (3011) are positioned in the refrigerating cavity, and the cold air discharge assembly is provided with a refrigerating air inlet and a refrigerating air outlet which are communicated with the refrigerating cavity;
the hot air discharging assembly is arranged outside the box body (2) and surrounds a heat dissipation cavity with the outer wall of the box body (2), the heat dissipation blocks (303) are all located in the heat dissipation cavity, and the hot air discharging assembly is provided with a heat dissipation air inlet and a heat dissipation air outlet which are communicated with the heat dissipation cavity.
3. The horizontal semiconductor refrigerator according to claim 2, wherein:
the outer wall of the refrigerating block fin (3011) is parallel to the side wall of the refrigerating block bottom plate (3012), the refrigerating block fin (3011) and the refrigerating block bottom plate (3012) are close to the refrigerating air inlet side and incline to the top end of the box body (2), so that cold air flowing into the refrigerating cavity is downwards guided, and condensed water on the refrigerating block (301) flows to the bottom end of the refrigerating cavity under the action of gravity and wind force.
4. The horizontal semiconductor refrigerator according to claim 2, wherein:
the refrigerating cavity is provided with a fin (801) close to the refrigerating air outlet, and the end, far away from the refrigerating air outlet, of the fin (801) is inclined towards the top end of the box body (2) so as to guide cold air exhausted from the refrigerating cavity to the top end of the box body (2).
5. The horizontal semiconductor refrigerator of claim 4, wherein:
the cold air discharge assembly comprises a volute cover plate (8) and a refrigerating fan (6);
the spiral case cover plate (8) is fixedly arranged on the inner wall of the case body (2), the spiral case cover plate (8) and the case body (2) are surrounded to form the refrigerating cavity, the refrigerating air inlet and the refrigerating air outlet are oppositely arranged on the spiral case cover plate (8), and the wing pieces (801) are arranged on the spiral case cover plate (8);
the refrigerating fan (6) is arranged on the inner wall of the box body (2) and is positioned in the refrigerating cavity, and the refrigerating fan (6) is used for discharging cold air in the refrigerating cavity into the box body (2) from the refrigerating air outlet and sucking warm air in the box body (2) into the refrigerating cavity from the refrigerating air inlet;
the hot air discharging assembly comprises a volute rear cover (4) and a heat dissipation fan (5);
the spiral case back cover (4) is fixedly arranged on the outer wall of the case body (2), the spiral case back cover (4) and the case body (2) are surrounded to form the heat dissipation cavity, and the heat dissipation air inlet and the heat dissipation air outlet are oppositely arranged on the spiral case cover plate (8);
the cooling fan (5) is fixedly arranged on the outer wall of the box body (2) and is positioned in the cooling cavity, and the cooling fan (5) is used for discharging warm air in the cooling cavity to the outside of the refrigerator through the cooling air outlet and sucking cold air outside the refrigerator into the cooling cavity through the cooling air inlet.
6. The horizontal semiconductor refrigerator of claim 5, wherein:
the heat dissipation fan (5) and the refrigerating fan (6) are respectively positioned at two sides of the thermoelectric refrigerating module, and the heat dissipation fan (5) outside the box and the refrigerating fan (6) in the box are centrifugal fans.
7. The horizontal semiconductor refrigerator according to claim 2, wherein:
the side, close to the refrigerating air inlet, of the refrigerating block (301), and the refrigerating block fins (3011) are flush with the refrigerating block bottom plate (3012);
and/or the side, far away from the refrigerating air inlet, of the refrigerating block (301), wherein the refrigerating block fin (3011) is shorter than the refrigerating block bottom plate (3012) by a millimeter, and a is more than or equal to 0.5mm.
8. The horizontal semiconductor refrigerator according to claim 1, wherein:
the cooling block fin (3011) forms an angle beta with the horizontal direction, and the angle beta is 0-45 degrees.
9. The horizontal semiconductor refrigerator according to claim 1, wherein:
the surface of the refrigerating block (301) is provided with a hydrophilic film, and the hydrophilic angle of the hydrophilic film is smaller than 10 degrees.
10. The horizontal semiconductor refrigerator according to claim 2, wherein:
the bottom of the box body (2) is provided with a bottom air outlet (201) communicated with the heat dissipation cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310413090.6A CN116182470B (en) | 2023-04-12 | 2023-04-12 | Horizontal semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310413090.6A CN116182470B (en) | 2023-04-12 | 2023-04-12 | Horizontal semiconductor refrigerator |
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| Publication Number | Publication Date |
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| CN116182470A true CN116182470A (en) | 2023-05-30 |
| CN116182470B CN116182470B (en) | 2024-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310413090.6A Active CN116182470B (en) | 2023-04-12 | 2023-04-12 | Horizontal semiconductor refrigerator |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
| WO2015144080A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Refrigerator |
| CN107300282A (en) * | 2017-06-30 | 2017-10-27 | 青岛海尔特种电冰箱有限公司 | Refrigerating device |
| CN111765704A (en) * | 2020-07-09 | 2020-10-13 | 长虹美菱股份有限公司 | Air-cooled refrigerating system and semiconductor refrigerator |
| KR20210010058A (en) * | 2019-07-19 | 2021-01-27 | 엘지전자 주식회사 | Refrigerator installed at an entrance of the place |
| CN115633884A (en) * | 2022-10-20 | 2023-01-24 | 深圳市虎一科技有限公司 | Food cooking equipment and refrigeration assembly thereof |
-
2023
- 2023-04-12 CN CN202310413090.6A patent/CN116182470B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
| WO2015144080A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Refrigerator |
| CN107300282A (en) * | 2017-06-30 | 2017-10-27 | 青岛海尔特种电冰箱有限公司 | Refrigerating device |
| KR20210010058A (en) * | 2019-07-19 | 2021-01-27 | 엘지전자 주식회사 | Refrigerator installed at an entrance of the place |
| CN111765704A (en) * | 2020-07-09 | 2020-10-13 | 长虹美菱股份有限公司 | Air-cooled refrigerating system and semiconductor refrigerator |
| CN115633884A (en) * | 2022-10-20 | 2023-01-24 | 深圳市虎一科技有限公司 | Food cooking equipment and refrigeration assembly thereof |
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| Publication number | Publication date |
|---|---|
| CN116182470B (en) | 2024-08-02 |
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