CN111765704A

CN111765704A - Air-cooled refrigerating system and semiconductor refrigerator

Info

Publication number: CN111765704A
Application number: CN202010656669.1A
Authority: CN
Inventors: 程春明; 张新星
Original assignee: Changhong Meiling Co Ltd
Current assignee: Changhong Meiling Co Ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2020-10-13

Abstract

The invention discloses an air cooling refrigeration system and a semiconductor refrigerator, and relates to the technical field of refrigerators. The invention comprises a heat exchange system, an air duct system and a box body outer barrel; the outer barrel of the box body comprises the back of the outer barrel of the box body; the heat exchange system comprises a refrigeration module and a heat dissipation module; a semiconductor module is arranged between the refrigeration module and the heat dissipation module; the air duct system comprises a box inner barrel and a box inner middle frame; the outer barrel and the inner barrel of the box body are connected through the middle frame in the box body; the inner middle frame of the box is filled with heat insulation materials; the refrigeration module and the semiconductor module are arranged inside the middle frame in the box; the heat dissipation module is arranged on the outer side of the back of the outer barrel of the box body; the refrigeration module comprises a refrigeration block and a refrigeration fan; the refrigeration module is arranged in the middle frame in the box. The invention realizes forced convection in the refrigerator through the air duct system by adding the return air channel structure in the refrigerator, and solves the problems of unsatisfactory refrigeration effect, low overall efficiency and especially low refrigeration speed of the existing semiconductor refrigerator.

Description

Air-cooled refrigerating system and semiconductor refrigerator

Technical Field

The invention belongs to the technical field of refrigerators, and particularly relates to an air cooling refrigeration system and a semiconductor refrigerator.

Background

The refrigerating principle of the semiconductor refrigerator is completely different from that of a common compressor refrigerator, and when a semiconductor chip is electrified, the refrigerating/heating is realized by utilizing the difference of the kinetic energy levels of charge carriers in two materials. The semiconductor refrigerator utilizes the Peltier effect, has low power consumption, small volume, light weight and easy carrying because of no devices such as a compressor, but the semiconductor refrigerator also has the problems of small refrigerating capacity, large heat dissipation capacity, poor refrigerating speed and refrigerating effect, and is difficult to solve all the time.

Most semiconductor refrigerators in the market at present generally install semiconductor chip at incasement suitable position, utilize the cold face absorption incasement heat of chip to refrigerate, the hot face of opposite side comes the heat dissipation, in order to increase heat exchange efficiency, increases fan forced circulation at the hot face side. Because the surface area of the cold surface is not large, the cold energy is transferred mainly in a conduction mode, the refrigerating speed is slow, the efficiency is low, and the refrigerating effect is not ideal. There has been no good technical solution in the industry to address such problems. How to solve the refrigeration effect of the existing semiconductor refrigerator, improve the efficiency of the whole machine, in particular to the problem of slow refrigeration speed, and become the technical problem which needs to be solved urgently in the industry.

Disclosure of Invention

The invention aims to provide an air-cooled refrigerating system and a semiconductor refrigerator, which realize forced convection by adding an air return channel structure in the refrigerator and an air duct system in the refrigerator, and solve the problems of unsatisfactory refrigerating effect, low overall efficiency and especially low refrigerating speed of the conventional semiconductor refrigerator.

In order to solve the technical problems, the invention is realized by the following technical scheme:

the invention relates to an air-cooled refrigerating system, which comprises a heat exchange system, an air duct system and a box body outer barrel; the outer barrel of the box body comprises a back of the outer barrel of the box body;

the heat exchange system comprises a refrigeration module and a heat dissipation module; a semiconductor module is arranged between the refrigeration module and the heat dissipation module to play a role in heat exchange;

the air duct system comprises a box inner barrel and a box inner middle frame; the outer barrel and the inner barrel of the box body are connected through an inner middle frame of the box body; the inner middle frame of the box is filled with a heat insulation material;

the refrigeration module and the semiconductor module are arranged inside the middle frame in the box; the heat dissipation module is arranged on the outer side of the back of the outer barrel of the box body.

Further, the refrigeration module comprises a refrigeration block and a refrigeration fan; the refrigeration module is arranged in the middle frame in the box;

the heat dissipation module comprises a heat dissipation block and a heat dissipation fan;

the semiconductor module is composed of a semiconductor chip module and is powered by direct current provided by the control board; the semiconductor chip module comprises a refrigerating end and a radiating end;

the semiconductor module is fixed in the card seat; the refrigerating end is tightly matched with the refrigerating block; the heat dissipation end is tightly matched with the heat dissipation block; the positions of the refrigerating end and the heat dissipation end can be interchanged.

Furthermore, an air supply outlet is formed in one side, close to the refrigeration module, of the inner barrel in the box body; the air supply outlet is positioned at the front end of the refrigeration module; an air return port A and an air return port B are symmetrically arranged on two sides of the air supply port respectively;

the air supply outlet comprises a plurality of regular or irregular holes A; the air return opening A comprises a plurality of regular or irregular holes B; the air return opening B comprises a plurality of regular or irregular holes C.

Further, the refrigeration block comprises a refrigeration block rear side and a refrigeration block front side;

the rear side of the refrigeration block is of a plane structure and is matched with the refrigeration end; rib protrusions A are arrayed on the front side of the refrigerating block, so that the surface refrigerating area is increased; rib grooves are formed between the adjacent rib bulges A; the direction of the rib groove is the same as the gravity direction.

Further, the refrigeration block is fixed with the clamping seat; the refrigerating fan is fixed with the clamping seat through a fan cover of the refrigerating fan, and the cold energy of the refrigerating block is blown into the box through the air supply outlet;

the lower part of the refrigeration block is arranged below the refrigeration block; and the lower part of the refrigeration block is provided with a plurality of through transverse grooves.

Further, the heat slug includes a heat slug front side and a heat slug rear side;

rib protrusions B are arrayed on the front side of the heat dissipation block; the heat radiation fan is fixed with the clamping seat through a fan cover of the heat radiation fan;

the rear side of the heat dissipation block is of a plane structure and is matched with the heat dissipation end in the card seat; the rear side of the heat dissipation block is fixed with the clamping seat through a screw A.

Further, a box body outer barrel stud is arranged on the outer surface of the box body outer barrel; the heat dissipation block is fixed with an outer barrel stud of the box body through a screw B;

the heat dissipation block is made of a material with high thermal conductivity; the radiating block is any one of aluminum, copper or iron.

Furthermore, the inner box middle frame is arranged between the inner box barrel and the outer box barrel of the box body, and a cavity channel is formed;

the inner middle frame of the box integrally forms a rectangular channel; the heat exchange system is positioned in the cavity channel; the cavity channel comprises a channel front side and a channel back side;

the edges of the front sides of the channels are provided with channel flanges and are assembled with the outer barrel of the box body; the back sides of the channels are symmetrically provided with wind pipe structures; the air pipe structure and the inner barrel of the box body are assembled to form an air return channel; and the pair of air return channels are respectively matched with the air return inlet A and the air return inlet B.

Further, the section of the air pipe structure is rectangular or semicircular; air pipe flanges are arranged on the periphery of the air pipe structure; the surface of the air pipe flanging is provided with a positioning hole; a pair of positioning columns are arranged on the outer side surface of the inner barrel in the box body; the air pipe structure is assembled with the positioning column through the positioning hole.

A semiconductor refrigerator comprising an air-cooled refrigeration system as claimed in any one of claims 1 to 9.

The invention has the following beneficial effects:

1. according to the invention, the air return channel structure is added in the refrigerator, the refrigeration block and the refrigeration fan are matched at the refrigeration end of the semiconductor chip module, and the heat dissipation block and the heat dissipation fan are matched at the heat dissipation end of the semiconductor chip module, so that the heat exchange efficiency is obviously improved, and the refrigeration speed is obviously accelerated.

2. The forced convection is realized in the refrigerator through the air duct system; outside the refrigerator box, the heat is forcibly discharged through the hot surface, the heat is dissipated, the heat exchange efficiency is obviously improved, the refrigerating speed is obviously accelerated, the temperature difference in the refrigerator box is obviously reduced, the temperature gradient is uniform, articles are stored more effectively, and the storage shelf life is prolonged.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic view of an air-cooled refrigeration system according to the present invention;

FIG. 2 is a schematic top view of FIG. 1;

FIG. 3 is a front view of FIG. 1;

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is an enlarged view of a portion of FIG. 4 at B;

FIG. 6 is a schematic view of the installation of the refrigeration module and the heat dissipation module;

FIG. 7 is a side view of FIG. 6;

FIG. 8 is a schematic view of the refrigeration fan of FIG. 6 with the refrigeration fan removed;

FIG. 9 is a schematic view of the outer barrel of the case;

FIG. 10 is a schematic cross-sectional view taken at C-C of FIG. 9;

FIG. 11 is a schematic cross-sectional view taken at D-D of FIG. 9;

FIG. 12 is a schematic front view of the air duct configuration;

FIG. 13 is a schematic cross-sectional view taken at E-E of FIG. 12;

FIG. 14 is a schematic structural view of an air duct structure;

FIG. 15 is a schematic view of the structure of the inner tub in the case;

in the drawings, the components represented by the respective reference numerals are listed below:

1-heat exchange system, 2-air duct system, 3-outer box barrel, 11-refrigeration module, 12-heat dissipation module, 13-semiconductor module, 21-inner box barrel, 22-inner box frame, 31-outer box barrel back, 32-outer box barrel stud, 111-refrigeration block, 112-refrigeration fan, 121-heat dissipation block, 122-radiation fan, 130-semiconductor chip module, 131-cassette, 200-return air channel, 211-air outlet, 212-return air inlet A, 213-return air inlet B, 214-positioning column, 220-cavity channel, 221-channel front side, 222-channel back side, 1111-refrigeration block back side, 1112-refrigeration block front side, 1113-refrigeration block lower part, 1121-refrigeration fan cover, 1113-rib protrusion lower part, 1211-heat dissipation block front side, 1212-heat dissipation block rear side, 1213-bolt B, 1221-heat dissipation fan housing, 1301-refrigeration end, 1302-heat dissipation end, 2111-hole A, 2121-hole B, 2131-hole C, 2211-channel flanging, 2221-air pipe structure, 11121-rib protrusion A, 11122-rib groove, 11131-through transverse groove, 12111-rib protrusion B, 12121-bolt A, 22211-air pipe flanging and 22212-positioning hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention relates to an air-cooled refrigeration system and a semiconductor refrigerator, which comprises a heat exchange system 1, an air duct system 2 and a box outer barrel 3; the box outer barrel 3 comprises a box outer barrel back 31; the heat exchange system 1 comprises a refrigeration module 11 and a heat dissipation module 12; a semiconductor module 13 is arranged between the refrigeration module 11 and the heat dissipation module 12 and plays a role in heat exchange; the air duct system 2 comprises a box inner barrel 21 and a box inner middle frame 22; the outer tank body barrel 3 is connected with the inner tank body barrel 21 through an inner tank middle frame 22; the inner box middle frame 22 is filled with heat insulation materials; the refrigeration module 11 and the semiconductor module 13 are arranged inside the box inner middle frame 22; the heat dissipation module 12 is disposed outside the casing outer barrel back 31.

Preferably, as shown in fig. 1-5, the refrigeration module 11 comprises a refrigeration block 111 and a refrigeration fan 112; the refrigeration module 11 is arranged in the box inner middle frame 22; the heat dissipation module 12 includes a heat dissipation block 121 and a heat dissipation fan 122; the semiconductor module 13 is composed of a semiconductor chip module 130 and is powered by direct current supplied from the control board; the semiconductor chip module 130 includes a cooling terminal 1301 and a heat dissipation terminal 1302; the semiconductor module 13 is fixed in the card holder 131; the refrigeration end 1301 is tightly matched with the refrigeration block 111; the heat dissipating end 1302 is closely fitted to the heat dissipating block 121; the positions of the refrigerating end 1301 and the radiating end 1302 can be exchanged, the refrigerating effect is realized by the semiconductor refrigeration, the heating effect can be realized in a reverse exchange mode, the positions of the refrigerating end 1301 and the radiating end 1302 are exchanged, the storage in the box can be heated, and the cold and hot switching can be conveniently realized according to the needs.

Preferably, as shown in fig. 2-5, an air supply outlet 211 is arranged on one side of the inner tub 21 of the box body, which is close to the refrigeration module 11; the air supply outlet 211 is positioned at the front end of the refrigeration module 11; an air return inlet A212 and an air return inlet B213 are symmetrically arranged on two sides of the air supply outlet 211 respectively; the air supply outlet 211 comprises a plurality of regular or irregular holes A2111; the air return opening A212 comprises a plurality of regular or irregular holes B2121, and the number, the structure and the size of the holes A2111 are determined according to the shape and the refrigeration effect; the air return opening B213 comprises a plurality of regular or irregular holes C2131; the number, structure and size of the holes B2121 and the holes C2131 are determined according to the modeling and the refrigeration effect.

Preferably, as shown in fig. 2-5, the refrigeration block 111 includes a refrigeration block rear side 1111 and a refrigeration block front side 1112; the rear side 1111 of the refrigeration block is of a planar structure and is matched with the refrigeration end 1301; the front side 1112 of the refrigeration block is provided with rib protrusions A11121 in an array manner, so that the surface refrigeration area is increased; rib grooves 11122 are formed between the adjacent rib protrusions A11121; the direction of the rib groove 11122 is the same as the gravity direction, so that the condensed water is convenient to discharge.

Preferably, as shown in fig. 4 to 6, the refrigeration block 111 is fixed to the card holder 131; the refrigeration fan 112 is fixed with the clamping seat 131 through the refrigeration fan hood 1121, and blows the cold energy of the refrigeration block 111 into the box through the air supply outlet 211; the lower part 1113 of the refrigeration block is arranged below the refrigeration block 111; the lower part 1113 of the refrigeration block is provided with a plurality of through transverse grooves 11131, which is convenient for recovering return air from two sides of the return air inlet A212 and the return air inlet B213; the refrigeration block 111 is made of a material with high thermal conductivity; the heat dissipation block 121 is any one or more of aluminum, copper or iron.

Preferably, as shown in FIGS. 6-8, heatslug 121 includes a heatslug front side 1211 and a heatslug back side 1212; the rib protrusions B12111 are arranged on the front side 1211 of the radiating block to increase the surface radiating area; the heat dissipation fan 122 is fixed with the card seat 131 through the heat dissipation fan wind cover 1221, and blows the heat of the heat dissipation block 121 to the outside of the box; the rear side 1212 of the heat dissipation block is a planar structure and is matched with the heat dissipation end 1302 in the card seat 131; the rear side 1212 of the heat slug is fixed to the socket 131 by a screw a 12121.

Preferably, as shown in fig. 9, a cabinet outer barrel stud 32 is arranged on the outer surface of the cabinet outer barrel 3; the heat dissipation block 121 is fixed with the outer barrel stud 32 of the box body through a screw B1213; the heat dissipation block 121 is made of a material having high thermal conductivity; the heat dissipation block 121 is any one or more of aluminum, copper or iron.

Preferably, as shown in fig. 10-11, the inner frame 22 is installed between the inner tub 21 and the outer tub 3 and forms a cavity passage 220; the box inner middle frame 22 integrally presents a rectangular channel; the heat exchange system 1 is positioned in the cavity channel 220; the cavity channel 220 includes a channel front side 221 and a channel back side 222; the edges of the channel front side 221 are provided with channel flanges 2211 and are assembled with the outer barrel 3 of the box body; air duct structures 2221 are symmetrically arranged on the channel back side 222; the air pipe structure 2221 and the box inner barrel 21 are assembled to form an air return channel 200; a pair of return air channels 200 are mated with return air inlet a212 and return air inlet B213, respectively.

Preferably, as shown in FIGS. 13-15, the air duct structure 2221 is rectangular or semi-circular in cross-section; air duct flanges 22211 are arranged around the air duct structure 2221; the surface of the air duct flange 22211 is provided with a positioning hole 22212; a pair of positioning columns 214 are arranged on the outer side surface of the inner barrel 21 of the box body; air duct structure 2221 is assembled with positioning post 214 through positioning hole 22212.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An air cooling refrigeration system comprises a heat exchange system (1) and a wind channel system (2); the method is characterized in that: the device also comprises a box body outer barrel (3); the box body outer barrel (3) comprises a box body outer barrel back (31);

the heat exchange system (1) comprises a refrigeration module (11) and a heat dissipation module (12); a semiconductor module (13) is arranged between the refrigeration module (11) and the heat dissipation module (12);

the air duct system (2) comprises a box body inner barrel (21) and a box body inner middle frame (22); the outer tank body barrel (3) is connected with the inner tank body barrel (21) through an inner tank body middle frame (22); the inner box middle frame (22) is filled with heat insulation materials;

the refrigeration module (11) and the semiconductor module (13) are arranged inside the middle frame (22) in the box; the heat dissipation module (12) is arranged on the outer side of the back (31) of the outer barrel of the box body.

2. An air-cooled refrigeration system according to claim 1, characterized in that the refrigeration module (11) comprises a refrigeration block (111) and a refrigeration fan (112); the refrigeration module (11) is arranged in the inner middle frame (22) of the box;

the heat dissipation module (12) comprises a heat dissipation block (121) and a heat dissipation fan (122);

the semiconductor module (13) is composed of a semiconductor chip module (130) and is powered by direct current provided by the control board; the semiconductor chip module (130) comprises a refrigerating end (1301) and a heat dissipation end (1302);

the semiconductor module (13) is fixed in the card holder (131); the refrigerating end (1301) is tightly matched with the refrigerating block (111); the heat dissipation end (1302) is tightly matched with the heat dissipation block (121);

the positions of the refrigerating end (1301) and the heat dissipation end (1302) can be interchanged.

3. The air-cooled refrigeration system as claimed in claim 2, wherein a blast outlet (211) is arranged on one side of the inner tank (21) of the box body, which is close to the refrigeration module (11); the air supply outlet (211) is positioned at the front end of the refrigeration module (11); an air return opening A (212) and an air return opening B (213) are symmetrically arranged on two sides of the air supply opening (211) respectively;

the air supply outlet (211) comprises a plurality of regular or irregular holes A (2111); the air return opening A (212) comprises a plurality of regular or irregular holes B (2121); the air return opening B (213) comprises a plurality of regular or irregular holes C (2131).

4. An air-cooled refrigeration system according to claim 2 or 3 wherein the refrigeration block (111) comprises a refrigeration block rear side (1111) and a refrigeration block front side (1112);

the rear side (1111) of the refrigeration block is of a plane structure and is matched with the refrigeration end (1301); the front side (1112) of the refrigeration block is provided with rib protrusions A (11121) in an array; rib grooves (11122) are formed between the adjacent rib protrusions A (11121); the direction of the rib groove (11122) is the same as the gravity direction.

5. An air-cooled refrigeration system according to claim 4, wherein the refrigeration block (111) is fixed to the cassette (131); the refrigeration fan (112) is fixed with the clamping seat (131) through a refrigeration fan hood (1121);

the lower part (1113) of the refrigeration block is arranged below the refrigeration block (111); the lower part (1113) of the refrigeration block is provided with a plurality of through transverse grooves (11131).

6. An air-cooled refrigeration system according to claim 2, 3 or 5, characterized in that the heatslug (121) comprises a heatslug front side (1211) and a heatslug back side (1212);

the front side (1211) of the heat dissipation block is provided with rib protrusions B (12111) in an array; the heat dissipation fan (122) is fixed with the clamping seat (131) through a heat dissipation fan cover (1221);

the rear side (1212) of the heat dissipation block is of a plane structure and is matched with the heat dissipation end (1302) in the card seat (131); the rear side (1212) of the radiating block is fixed with the clamping seat (131) through a screw A (12121).

7. An air-cooled refrigeration system according to claim 6, characterized in that the outer surface of the outer tub (3) is provided with a tub outer stud (32); the heat dissipation block (121) is fixed with a stud (32) of an outer barrel of the box body through a screw B (1213);

the heat dissipation block (121) is made of a material with high thermal conductivity; the heat dissipation block (121) is any one of aluminum, copper or iron.

8. An air-cooled refrigeration system as claimed in claim 1, 2 or 7, wherein said inner box frame (22) is mounted between the inner box tub (21) and the outer box tub (3) and forms a cavity channel (220);

the box inner middle frame (22) is integrally in a rectangular channel; the heat exchange system (1) is positioned in the cavity channel (220); the cavity channel (220) comprises a channel front side (221) and a channel back side (222);

the edges of the front side (221) of the channel are provided with channel flanges (2211) which are assembled with the outer barrel (3) of the box body; the tunnel back sides (222) are symmetrically provided with wind tube structures (2221); the air pipe structure (2221) and the inner barrel (21) of the box body form a return air channel (200) after being assembled.

9. An air-cooled refrigeration system according to claim 8 wherein said air duct structure (2221) is rectangular or semi-circular in cross-section; air pipe flanges (22211) are arranged on the periphery of the air pipe structure (2221); the surface of the air pipe flanging (22211) is provided with a positioning hole (22212);

a pair of positioning columns (214) are arranged on the outer side surface of the inner barrel (21) of the box body; the air pipe structure (2221) is assembled with the positioning column (214) through the positioning hole (22212).

10. A semiconductor refrigerator comprising an air-cooled refrigeration system as claimed in any one of claims 1 to 9.