CN116156038B - Electronic equipment - Google Patents

Abstract

An embodiment of the present application provides an electronic device. Electronic equipment includes batteries, covers, and shock-absorbing components. The cover is arranged on one side of the battery. Shock-absorbing components include shock-absorbing pads and pressure control valves. At least part of the shock absorbing pad is disposed between the battery and the cover. The shock-absorbing pad includes a first accommodation cavity and a shock-absorbing medium. There is a shock-absorbing medium in the first accommodation cavity. The pressure control valve is installed on the shock absorbing pad. The pressure control valve is configured to be openable in response to the pressure in the first accommodation chamber reaching a pressure threshold. The electronic device provided by the embodiments of the present application can help reduce the possibility that the pressure in the internal space of the electronic device changes, causing the cover to resonate.

Description

Electronic equipment

Technical field

The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device.

Background technique

With the explosive growth of electronic devices such as smartphones or tablets, the applications of electronic devices are becoming more and more widespread. Electronic devices are usually equipped with speakers. Speakers are transducer devices that can convert electrical signals into acoustic signals. The speaker can be a dynamic sounding unit. The speaker includes a diaphragm, a front cavity and a rear cavity. The diaphragm can vibrate and produce sound. One side of the diaphragm is the corresponding front cavity, and the other side is the corresponding rear cavity. With the thinner and lighter design of electronic devices and the requirements for high-quality speakers, speakers usually adopt an open cavity design, that is, the rear cavity of the speaker is not a closed structure, but is connected to the internal space of the electronic device. However, when the diaphragm of the speaker vibrates, the pressure in the internal space of the electronic device will change, causing resonance in the housing or display screen of the electronic device. When the user holds the electronic device in his hand, he can clearly feel the vibration, which affects the satisfaction of the electronic device usage experience.

Contents of the invention

Embodiments of the present application provide an electronic device, which can help reduce the possibility that the pressure in the internal space of the electronic device changes, causing the cover to resonate.

This application provides an electronic device, which includes a battery, a cover and a shock-absorbing component.

The cover is arranged on one side of the battery. Shock-absorbing components include shock-absorbing pads and pressure control valves. At least part of the shock-absorbing pad is disposed between the battery and the cover. The shock-absorbing pad includes a first accommodation cavity and a shock-absorbing medium. There is a shock-absorbing medium in the first accommodation cavity. The pressure control valve is installed on the shock absorbing pad. The pressure control valve is configured to be openable in response to the pressure in the first accommodation chamber reaching a pressure threshold.

The electronic device in the embodiment of the present application includes a battery, a cover, and a shock-absorbing component. The shock-absorbing pad in the shock-absorbing assembly may be disposed between the battery and the cover of the battery. The cover can be connected to the middle frame. The battery provides support to the shock pad, which provides support to the cover. When the speaker in the electronic device is in working condition, causing the diaphragm to vibrate, since the shock absorbing pad can provide greater support for the cover, when the pressure in the internal space of the electronic device changes, the cover also Not prone to vibration. The method of arranging a shock-absorbing pad between the battery and the cover of the battery is conducive to reducing the possibility that the pressure in the internal space of the electronic device changes, causing the cover to resonate, and improves the satisfaction of the use experience of the electronic device.

In a possible implementation, a pressure control valve is provided on the side wall of the shock absorbing pad.

The pressure control valve is configured to be openable in response to the pressure in the first accommodation chamber reaching a pressure threshold. When the shock-absorbing pad is squeezed and the pressure in the first accommodation chamber increases and reaches the pressure threshold, the pressure control valve can be opened so that the damping medium in the first accommodation chamber can be discharged through the pressure control valve to achieve leakage. pressure. When the pressure in the first accommodation chamber drops below the pressure threshold, the pressure control valve may be closed. Therefore, the pressure of the first receiving cavity of the shock-absorbing pad can remain relatively stable, so that the shock-absorbing pad remains stable against the supporting force acting on the back cover.

In a possible implementation, the pressure control valve is a one-way valve.

When the pressure in the first accommodation chamber reaches a predetermined pressure threshold, the pressure control valve can be automatically opened to reduce the pressure in the first accommodation chamber. When the pressure in the first accommodation chamber drops below a predetermined pressure threshold, the pressure control valve can be automatically closed to maintain the current pressure in the first accommodation chamber.

In a possible implementation, the shock-absorbing medium is gas.

When the pressure in the first accommodation chamber reaches a predetermined pressure threshold, the pressure control valve can be opened to release part of the shock-absorbing medium in the first accommodation chamber and reduce the pressure in the first accommodation chamber. Since the shock-absorbing medium is a gas, after the shock-absorbing medium is discharged into the internal space of the electronic device, the shock-absorbing medium will not contaminate the components in the electronic device (such as motherboards or electronic devices, etc.) or cause corrosion to the components in the electronic device. .

In a possible implementation, the first accommodation chamber includes a first chamber and a second chamber. Two or more first chambers are arranged at intervals. Each first chamber is connected through the second chamber.

The arrangement of the first accommodation chamber including a plurality of first chambers is conducive to improving the overall strength of the shock absorbing pad, making the shock absorbing pad less prone to local collapse, and reducing the impact of the shock absorbing pad due to local collapse of the shock absorbing pad. The possibility of deviation in the support effect of the back cover. Each first chamber is connected through the second chamber. During the process of filling the shock-absorbing pad with the shock-absorbing medium, the shock-absorbing medium can enter each first chamber through the second chamber, so that there is no need to fill each first chamber with the shock-absorbing medium separately. Conducive to improving work efficiency. In addition, since each first chamber and the second chamber are connected, the position of the pressure control valve can be flexibly selected. At the same time, only one pressure control valve can be provided to achieve the pressure relief function, and there is no need to correspond to each first chamber. Each chamber is equipped with a separate pressure control valve.

In one possible implementation, two or more first chambers are evenly distributed, thereby ensuring that the support force provided by the shock-absorbing pad to the back cover is relatively balanced and ensuring that the shock-absorbing pad has a good supporting effect.

In one possible implementation, at least one of the battery and the cover is connected to a shock-absorbing pad, so that the shock-absorbing pad in the assembled electronic device can keep its position relatively stable and not prone to deflection.

In a possible implementation, the material of the shock-absorbing pad is plastic or rubber.

In a possible implementation, the shock-absorbing component further includes an elastic expansion body. The elastic expansion body has a second accommodation cavity. The shock-absorbing pad is connected to the elastic expansion body, and the first accommodation cavity is connected to the second accommodation cavity. There is a shock-absorbing medium in the first accommodation cavity and the second accommodation cavity.

In the embodiment of the present application, the shock-absorbing pad is connected to the elastic expansion body. When the cover is pressed, the pressing force exerted by the cover on the shock-absorbing pad will increase. The volume of the first accommodation cavity of the shock-absorbing pad is relatively reduced, and the pressure increases. However, since the first accommodation cavity and the second accommodation cavity are connected, the shock-absorbing medium in the first accommodation cavity can enter the second accommodation cavity. . After the pressure in the second accommodation cavity increases, the elastic expansion body will expand, thereby stabilizing the pressure in the first accommodation cavity and the second accommodation cavity, so that the pressure in the first accommodation cavity does not exceed the pressure threshold, ensuring the pressure The control valve will not open due to external pressure on the cover. After the pressing force acting on the cover disappears, the cover itself can rebound and return to its original state, while the pressure in the first receiving cavity of the shock-absorbing pad is relatively reduced. At this time, the elastic expansion body can shrink and deform, so that the third The shock-absorbing medium in the second accommodating cavity flows back into the first accommodating cavity to ensure that the pressure in the first accommodating cavity can be restored to the initial pressure, effectively reducing the pressure of the shock-absorbing pad on the cover and reducing the support force of the cover. Reduce the possibility of affecting the vibration-absorbing effect of the shock-absorbing pad on the cover.

In a possible implementation, the electronic device further includes a limiting member. The limiting part is arranged on the side of the cover facing the battery. At least part of the elastic expansion body is arranged between the limiting part and the covering part.

The limiting member can constrain the elastic expansion body, thereby controlling the expansion degree of the elastic expansion body, which is beneficial to reducing the possibility that the elastic expansion body's free expansion deformation will cause the elastic expansion body itself to become too large, thereby reducing the risk of the elastic expansion body being too large. After the expansion body expands, it may become too large and squeeze other structural parts in the electronic device, or the elastic expansion body may be punctured by other structural parts.

In a possible implementation, the shock absorbing assembly further includes a communication tube. The shock-absorbing pad and the elastic expansion body are respectively connected to the communication tubes. The first accommodation chamber is connected with the second accommodation chamber through a communication tube.

The communication tube itself can have a smaller size, so that the communication tube can be disposed in a relatively narrow area, so that the elastic expansion body can be selectively disposed in a larger space and communicate with the shock-absorbing pad through the communication tube.

In a possible implementation, the communication tube is a flexible structure.

The communication tube can be freely bent to easily bypass structural components in the electronic device, which is beneficial to reducing the difficulty of arranging the communication tube in the electronic device.

In a possible implementation, along the thickness direction of the battery, the front projection of the elastic expansion body is located outside the front projection of the battery. When the battery expands, the battery will not squeeze the elastic expansion body.

In a possible implementation, the elastic expansion body is connected to the cover, so that the elastic expansion body in the assembled electronic device can maintain its position relatively stable and is not prone to deflection, thereby reducing the occurrence of elastic expansion bodies during the deformation process. The position deviation may cause other structural parts to puncture or scratch the elastic expansion body.

In a possible implementation, the electronic device further includes a middle frame. The middle frame has a receiving space. The battery and shock-absorbing components are both located in the storage space. The cover is connected to the middle frame.

In a possible implementation, the cover is a back cover or a display screen.

Description of drawings

Figure 1 is a schematic structural diagram of an electronic device provided by this application;

Figure 2 is a schematic diagram of a partially exploded structure of the electronic device provided by this application;

Figure 3 is a partial cross-sectional structural schematic diagram of the electronic device provided by this application;

Figure 4 is a partial cross-sectional structural schematic diagram of the shock-absorbing assembly provided by this application;

Figure 5 is a partial cross-sectional structural schematic diagram of the shock-absorbing assembly provided by this application;

Figure 6 is a partial structural schematic diagram of the electronic device provided by this application;

Figure 7 is a partial cross-sectional structural schematic diagram of the shock-absorbing pad provided by this application;

Figure 8 is a partial cross-sectional structural schematic diagram of the electronic device provided by the present application;

Figure 9 is a partial cross-sectional structural schematic diagram of the electronic device provided by the present application;

Figure 10 is a partial cross-sectional structural schematic diagram of the electronic device provided by the present application;

Figure 11 is a partial structural schematic diagram of the electronic device provided by this application;

Figure 12 is a partial structural schematic diagram of the electronic device provided by this application;

Figure 13 is a partial cross-sectional structural schematic diagram of the electronic device provided by the present application.

Reference signs:

10. Electronic equipment;

20. Display screen;

30. Shell; 31. Middle frame; 32. Back cover;

40. Motherboard;

50. Electronic devices;

60. Battery;

70. Speaker; 71. Diaphragm; 72. Rear cavity;

80. Shock absorbing components;

81. Shock absorbing pad; 811. First accommodation cavity; 811a, first chamber; 811b, second chamber; 812, side wall;

82. Pressure control valve; 821. Valve body; 822. Valve disc;

83. Elastic expansion body; 831. Second accommodation cavity;

84. Connecting pipe;

90. Limiting parts;

X, width direction;

Y, length direction;

Z, thickness direction.

Detailed ways

The electronic device in the embodiment of the present application may be called user equipment (UE) or terminal (terminal), etc., for example, the electronic device may be a tablet computer (portable android device, PAD), personal digital assistant (personal digital assistant, PDA), handheld devices with wireless communication functions, computing devices, vehicle-mounted devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, industrial control (industrial control) Wireless terminals, wireless terminals in self-driving, wireless terminals in remote medical, wireless terminals in smart grid, wireless terminals in transportation safety, smart city ), wireless terminals in smart homes, and other mobile terminals or fixed terminals. In the embodiments of this application, there is no specific limitation on the form of the terminal device.

In the embodiment of the present application, FIG. 1 schematically shows the structure of the electronic device 10 . Referring to FIG. 1 , the electronic device 10 is a handheld device with a wireless communication function as an example for description. The handheld device with wireless communication function may be a mobile phone, for example.

FIG. 2 schematically shows a partially exploded structure of the electronic device 10 . FIG. 3 schematically shows a partial cross-sectional structure of the electronic device 10 . Referring to FIGS. 1 to 3 , the electronic device 10 according to the embodiment of the present application includes a display screen 20 , a housing 30 , a motherboard 40 and an electronic device 50 .

The display screen 20 has a display area for displaying image information. The display screen 20 is installed on the housing 30, and the display area of the display screen 20 is exposed to facilitate presenting image information to the user. For example, the display screen 20 may include a light-transmitting cover plate, a screen body and a back plate. The light-transmitting cover is arranged on the light-emitting side of the screen body. The material of the light-transmitting cover can be glass or plastic. The screen is used to display image information. The backplane is arranged on the backlight side of the screen body. The motherboard 40 is connected to the casing 30 and is located inside the display screen 20 , so that the motherboard 40 is not easily observed by the user outside the electronic device 10 .

The electronic device 50 is provided on the motherboard 40 . The main board 40 may be a printed circuit board (PCB). The electronic device 50 is welded to the motherboard 40 through a welding process. The electronic device 50 includes, but is not limited to, a central processing unit (Central Processing Unit, CPU), an intelligent algorithm chip, or a power management chip (Power Management IC, PMIC). Since the internal space of the electronic device 10 is relatively small, the electronic device 50 is highly integrated on the motherboard 40 to fully reduce the volume of the motherboard 40 and reduce the space occupation rate of the motherboard 40 .

Taking the electronic device 10 including a display screen 20 as an example, the housing 30 includes a middle frame 31 and a back cover 32 . The display screen 20 is arranged on the middle frame 31 . The middle frame 31 has a receiving space. The mainboard 40 can be disposed in the receiving space. The back cover 32 is connected to the middle frame 31 . The display screen 20 and the back cover 32 are respectively disposed on opposite sides of the middle frame 31 . Along the thickness direction of the electronic device 10 , the middle frame 31 is located between the display screen 20 and the back cover 32 .

Electronic device 10 also includes battery 60 . The back cover 32 is located on one side of the battery 60 . The back cover 32 is a covering member that can cover the battery 60 on one side of the battery 60 to shield the battery 60 . On the outside of the electronic device 10, the back cover 32 is visible, but the battery 60 is not easily visible. Battery 60 is a structural component that can convert chemical energy into electrical energy. The battery 60 is used to provide electric energy to the electronic device 10 to ensure the normal operation of the electronic device 10 . For example, the battery 60 can provide electric energy to the display screen 20 so that the display screen 20 can display image information or complete corresponding operation instructions, or the battery 60 can provide electric energy to the mainboard 40 to ensure that the electronic devices 50 on the mainboard 40 work normally. Illustratively, battery 60 may be a lithium-ion battery, such as a lithium iron phosphate battery. Battery 60 includes positive and negative tabs of opposite polarity. For example, the battery 60 may be disposed in the receiving space of the middle frame 31 .

Electronic device 10 also includes speaker 70 . The speaker 70 is a transducer device that can convert electrical signals into acoustic signals. The speaker 70 may be a moving coil speaker 70 or a moving magnet speaker 70, which is not specifically limited in this application. The speaker 70 includes a diaphragm 71 , a front cavity disposed on one side of the diaphragm 71 , and a rear cavity 72 disposed on the other side of the diaphragm 71 . The housing 30 of the electronic device 10 may be provided with a sound outlet. For example, the sound outlet may be provided on the front cover or the middle frame 31 of the electronic device 10 . The front cavity of the speaker 70 is arranged facing the sound outlet. The speaker 70 vibrates the diaphragm 71 to generate sound. The sound waves generated by the vibration of the diaphragm 71 can be propagated to the outside of the electronic device 10 through the front cavity and the sound outlet of the housing 30 to be listened to by the user.

The rear cavity 72 of the speaker 70 is connected with the internal space of the electronic device 10 , so that the rear cavity 72 of the speaker 70 has an open design. When the diaphragm 71 of the speaker 70 vibrates, the volume of the back cavity 72 will change, so the pressure in the internal space of the electronic device 10 will also change, which will cause the back cover 32 as the cover to vibrate. When the back cover 32 vibrates, on the one hand, it will have a negative impact on the connection stability of the components on the electronic device 10; on the other hand, when the user uses the electronic device 10, there may be situations where the electronic device 10 will feel an obvious vibration, which will affect the electronic device 10. Device 10 experience.

In the electronic device 10 provided by the embodiment of the present application, a shock-absorbing assembly 80 is provided between the battery 60 and the back cover 32 as a cover. The shock-absorbing assembly 80 can support and buffer the vibration of the back cover 32 , which is beneficial to reducing the possibility of resonance of the back cover 32 as a cover caused by pressure changes in the internal space of the electronic device 10 , and improving the use of the electronic device 10 Experience satisfaction.

The electronic device 10 in the embodiment of the present application also includes a shock absorbing component 80 . For example, both the battery 60 and the shock-absorbing assembly 80 can be disposed in the receiving space of the middle frame 31 . The shock-absorbing assembly 80 of the embodiment of the present application includes a shock-absorbing pad 81 . At least part of the shock-absorbing pad 81 is disposed between the battery 60 and the back cover 32 as a cover. Along the thickness direction Z of the battery 60, the battery 60 and the back cover 32 are located on both sides of the shock absorbing pad 81 respectively. The thickness direction of the electronic device 10 is the same as the thickness direction Z of the battery 60 . The shock-absorbing pad 81 can provide good supporting force for the back cover 32 . Therefore, when the internal space pressure of the electronic device 10 changes, the shock-absorbing pad 81 can effectively suppress the vibration of the back cover 32 and reduce the vibration sensation of the back cover 32 . The shock absorbing pad 81 includes a first accommodation cavity 811 and a shock absorbing medium. The first accommodation cavity 811 contains a shock-absorbing medium.

The damping assembly 80 also includes a pressure control valve 82 . The pressure control valve 82 is provided on the shock absorbing pad 81 . The outlet of the pressure control valve 82 may be connected to the internal space of the electronic device 10 . The pressure control valve 82 is configured to be openable in response to the pressure in the first accommodation chamber 811 reaching a pressure threshold. When the shock absorbing pad 81 is squeezed so that the pressure in the first receiving chamber 811 increases and reaches the pressure threshold, the pressure control valve 82 can be opened so that the shock absorbing medium in the first receiving chamber 811 can pass through the pressure control valve. 82 is discharged to achieve pressure relief. When the pressure in the first accommodation chamber 811 drops below the pressure threshold, the pressure control valve 82 may be closed. Therefore, the pressure of the first receiving cavity 811 of the shock absorbing pad 81 can remain relatively stable, so that the shock absorbing pad 81 remains stable against the supporting force acting on the back cover 32 .

The electronic device 10 in the embodiment of the present application includes a battery 60, a cover and a shock-absorbing component 80. The shock absorbing pad 81 in the shock absorbing assembly 80 may be disposed between the battery 60 and the cover of the battery 60 . The cover can be connected to the middle frame 31 . The battery 60 can provide support for the shock-absorbing pad 81, and the shock-absorbing pad 81 can provide support for the cover. When the speaker 70 in the electronic device 10 is in a working state and the diaphragm 71 vibrates, since the shock-absorbing pad 81 can provide a large supporting force for the cover, when the pressure in the internal space of the electronic device 10 changes, The cover is also less likely to vibrate. The method of arranging the shock-absorbing pad 81 between the battery 60 and the cover of the battery 60 is helpful to reduce the possibility that the pressure in the internal space of the electronic device 10 changes, causing the cover to resonate, and improves the satisfactory use experience of the electronic device 10 Spend.

In the related art, shock-absorbing foam may be provided between the battery 60 and the cover of the battery 60 . The battery 60 and the cover of the battery 60 press the shock-absorbing foam against each other to provide support to the cover through the shock-absorbing foam, thereby conducive to buffering the vibration of the cover. However, the battery 60 of the electronic device 10 may expand during long-term use. If the supporting rebound force of the shock-absorbing foam in the initial state is large, that is, when the shock-absorbing foam is squeezed flatter, after the battery 60 expands, the force of the shock-absorbing foam acting on the cover will increase, thus There is a possibility that the shock-absorbing foam will push up the cover, causing the cover to bulge in a direction away from the battery 60 . Therefore, the supporting rebound force of the initial state of the shock-absorbing foam usually needs to be reserved, so that after the battery 60 expands, the shock-absorbing foam can be further squeezed to reduce its thickness, so as to reduce the impact of the battery 60 after the battery 60 expands. Possibility of shock-absorbing foam lifting coverings. However, since a margin needs to be reserved for the support rebound force of the shock-absorbing foam in the initial state, the supporting force provided by the shock-absorbing foam to the cover is relatively small, so the shock-absorbing foam cannot fully buffer the vibration of the cover.

In the embodiment of the present application, the shock absorbing pad 81 in the shock absorbing assembly 80 is connected to the pressure control valve 82 . The greater the pressure of the first receiving cavity 811 of the shock-absorbing pad 81, the greater the supporting force the shock-absorbing pad 81 can provide to the cover. In the initial state, the pressure of the first receiving cavity 811 of the shock absorbing pad 81 can be maintained in a relatively large state, so that the shock absorbing pad 81 can provide a large supporting force for the cover to effectively buffer the vibration of the cover. When the battery 60 of the electronic device 10 expands during long-term use, the expanded battery 60 and the cover will exert greater squeezing force on the shock-absorbing pad 81 , causing the pressure in the first accommodation chamber 811 to increase. big. When the pressure of the first accommodation chamber 811 of the shock absorbing pad 81 reaches the pressure threshold, the pressure control valve 82 may be opened to release pressure in the first accommodation chamber 811 . When the pressure of the first receiving chamber 811 of the shock absorbing pad 81 drops below the pressure threshold, the pressure control valve 82 may be closed. Therefore, for the shock-absorbing pad 81 in the initial state or the shock-absorbing pad 81 after the battery 60 has expanded, the pressure of the first accommodation cavity 811 can remain relatively stable, so that the shock-absorbing pad 81 maintains the support force acting on the cover. Stability ensures that the shock-absorbing pad 81 can effectively buffer the vibration of the cover, and can also effectively reduce the possibility that the shock-absorbing pad 81 will lift the cover after the battery 60 expands.

During long-term use of the battery 60 of the electronic device 10, the expansion degree of the battery 60 usually gradually increases. Therefore, accordingly, the pressure control valve 82 can be in an open state intermittently to ensure that the pressure of the first accommodation chamber 811 is maintained. relatively stable state.

Shock pad 81 has side walls 812 . The side wall 812 of the shock absorbing pad 81 is provided with a pressure control valve 82 . The side wall 812 of the shock absorbing pad 81 faces the internal space of the electronic device 10 , so that the pressure control valve 82 is less likely to interfere with other structural components.

In some examples, along the thickness direction Z of the battery 60 , the orthographic projection of the battery 60 may be located within the orthographic projection of the shock absorbing pad 81 . For example, a portion of shock pad 81 may extend beyond battery 60 .

In some examples, along the thickness direction Z of the battery 60 , the orthographic projection of the battery 60 may coincide with the orthographic projection of the shock absorbing pad 81 .

In some examples, along the thickness direction Z of the battery 60 , the orthographic projection of the battery 60 may partially coincide with the orthographic projection of the shock absorbing pad 81 . The pressure control valve 82 can be located between the back cover 32 and the battery 60, so that the pressure control valve 82 is not likely to collide with or positionally interfere with the structural parts around the battery 60, which is beneficial to reducing the risk of the pressure control valve 82 being collided or damaged during the assembly process. possibility.

Pressure control valve 82 may be a one-way valve. When the pressure in the first accommodation chamber 811 reaches a predetermined pressure threshold, the pressure control valve 82 can be automatically opened to reduce the pressure of the first accommodation chamber 811 . When the pressure in the first accommodation chamber 811 drops below a predetermined pressure threshold, the pressure control valve 82 can be automatically closed to maintain the current pressure in the first accommodation chamber 811 .

Illustratively, pressure control valve 82 may be a mechanical one-way valve. The pressure control valve 82 can be opened or closed according to the pressure change in the first accommodation chamber 811. Therefore, there is no need to set up an additional control unit to control the pressure control valve 82 to open or close, which is beneficial to reducing the number of parts used and saving money. The internal space of the electronic device 10 .

By way of example, FIG. 4 schematically shows a partial structure of the shock absorbing assembly 80 . As shown in FIG. 4 , the pressure control valve 82 includes a valve body 821 and a valve disc 822 . A plurality of valve flaps 822 are provided in the valve body 821 . When the pressure in the first accommodation chamber 811 does not exceed the opening pressure threshold of the valve flaps 822, the plurality of valve flaps 822 are in a closed state. FIG. 5 schematically shows a partial structure of the shock absorbing assembly 80 . Referring to FIG. 5 , when the pressure in the first accommodation chamber 811 exceeds the opening pressure threshold of the valve flaps 822 , the plurality of valve flaps 822 deform and are in an open state. When the pressure in the first accommodation chamber 811 drops and is lower than the opening pressure threshold of the valve flaps 822, the plurality of valve flaps 822 return to the initial state under the action of their own elastic restoring force and are in the closed state.

The shock-absorbing medium in the shock-absorbing pad 81 may be gas. A predetermined amount of gas is filled into the first accommodation cavity 811 of the shock absorbing pad 81 so that the first accommodation cavity 811 maintains a predetermined pressure. When the battery 60 expands, the battery 60 exerts a squeezing force on the shock absorbing pad 81 so that the volume of the first accommodation chamber 811 becomes smaller and the pressure in the first accommodation chamber 811 increases. When the pressure in the first accommodation chamber 811 reaches a predetermined pressure threshold, the pressure control valve 82 can be opened to release part of the shock-absorbing medium in the first accommodation chamber 811 and reduce the pressure of the first accommodation chamber 811 . Since the damping medium is a gas, after the damping medium is discharged into the internal space of the electronic device 10 , the damping medium will not contaminate the components in the electronic device 10 (such as the motherboard 40 or the electronic device 50 , etc.) or cause any damage to the electronic device 10 parts causing corrosion.

In some examples, the shock-absorbing medium in shock-absorbing pad 81 may be air.

FIG. 6 schematically shows a partial structure of the electronic device 10 . FIG. 7 schematically shows a partial cross-sectional structure of the shock absorbing pad 81 . FIG. 8 schematically shows a partial cross-sectional structure of the electronic device 10 . Referring to FIG. 6 , FIG. 7 and FIG. 8 , the first receiving cavity 811 of the shock absorbing pad 81 may include a first cavity 811 a and a second cavity 811 b. Two or more first chambers 811a are arranged at intervals. The arrangement of the first accommodation cavity 811 including a plurality of first cavities 811a is conducive to improving the overall strength of the shock-absorbing pad 81, making the shock-absorbing pad 81 less prone to local collapse, and reducing the risk of local collapse of the shock-absorbing pad 81. This may cause deviation in the supporting effect of the shock absorbing pad 81 on the back cover 32 . Each of the first chambers 811a is connected to each other through the second chamber 811b. During the process of filling the shock-absorbing pad 81 with the shock-absorbing medium, the shock-absorbing medium can enter each first chamber 811a through the second chamber 811b, so that there is no need to separately fill each first chamber 811a with the shock-absorbing medium. operation, which is conducive to improving work efficiency. In addition, since each first chamber 811a and the second chamber 811b are connected, the position of the pressure control valve 82 can be flexibly selected. At the same time, only one pressure control valve 82 can be provided to achieve the pressure relief function, and there is no need to correspond to each A pressure control valve 82 is provided separately for each first chamber 811a.

In some examples, the areas on the shock absorbing pad 81 corresponding to the first chamber 811 a and the second chamber 811 b can provide supporting force for the back cover 32 , and along the thickness direction Z of the battery 60 , the shock absorbing pad 81 is located on There may be a gap between the area between two adjacent first chambers 811a and the back cover 32 .

In some examples, the number of the second chambers 811b may be one or more than two, which is not specifically limited in this application.

In some examples, the first chamber 811a is strip-shaped. Each first chamber 811a may be arranged parallel to each other. The second chamber 811b may be disposed at the end of the first chamber 811a, or may be disposed in the middle area of the first chamber 811a along its length direction, which is not specifically limited in this application.

In some examples, more than two first cavities 811a may be evenly distributed, thereby ensuring that the support force provided by the shock absorbing pad 81 to the back cover 32 is relatively balanced and ensuring that the shock absorbing pad 81 has a good supporting effect. For example, more than two first chambers 811a may be evenly distributed in a matrix.

At least one of the battery 60 and the back shell as a cover can be connected to the shock absorbing pad 81 so that the shock absorbing pad 81 in the assembled electronic device 10 can maintain its position relatively stable and is not prone to deflection.

In some examples, the back shell is connected to the shock absorbing pad 81 . The shock-absorbing pad 81 is filled with a predetermined amount of shock-absorbing medium in advance. Then, the shock-absorbing pad 81 with the shock-absorbing medium is connected to the back case, so that the shock-absorbing pad 81 is fixed at a predetermined position of the back case. Then connect the back shell to the middle frame 31. After the assembly is completed, the back shell and the battery 60 can squeeze the shock absorbing pad 81 together. For example, the shock absorbing pad 81 may be bonded to the back shell. For example, adhesive tape or double-sided tape is used to bond the shock-absorbing pad 81 to the back shell.

For example, when the electronic device 10 needs to be repaired or inspected, the back shell and the middle frame 31 can be separated. The back shell can be removed together with the shock absorbing pad 81 . Since the shock-absorbing pad 81 and the battery 60 are in a non-fixed connection state, there is no situation where the battery 60 pulls the shock-absorbing pad 81 during the removal of the back case, thereby avoiding the impact of the battery 60 on the shock-absorbing pad 81 When the back shell is removed due to pulling force, the shock-absorbing pad 81 will be torn or damaged, which will help reduce the difficulty of disassembly.

In some examples, battery 60 is connected to shock pad 81 . The shock-absorbing pad 81 is filled with a predetermined amount of shock-absorbing medium in advance. Then, the shock-absorbing pad 81 with the shock-absorbing medium is connected to the battery 60 so that the shock-absorbing pad 81 is fixed at a predetermined position of the battery 60 . Then connect the back shell to the middle frame 31. After the assembly is completed, the back shell and the battery 60 can squeeze the shock absorbing pad 81 together. For example, the shock absorbing pad 81 may be bonded to the battery 60 . For example, adhesive tape or double-sided tape is used to bond the shock-absorbing pad 81 to the battery 60 .

For example, when the electronic device 10 needs to be repaired or inspected, the back shell and the middle frame 31 can be separated. The back shell can be removed separately. Since the shock-absorbing pad 81 and the back shell are in a non-fixed connection state, during the process of removing the back shell, the back shell does not pull the shock-absorbing pad 81 , thereby avoiding the impact of the back shell on the shock-absorbing pad 81 When the back shell is removed due to pulling force, the shock-absorbing pad 81 will be torn or damaged, which will help reduce the difficulty of disassembly.

In some examples, the back shell and the battery 60 are both connected to the shock absorbing pad 81 , which is beneficial to improving the connection strength between the back shell, the battery 60 and the shock absorbing pad 81 , so that both the back shell and the battery 60 can support the shock absorbing pad 81 A constraint is formed to reduce the possibility of positional deviation of the shock absorbing pad 81 .

The shock absorbing pad 81 itself is a deformable structural member. When the shock absorbing pad 81 is subjected to an external force, the shock absorbing pad 81 may be deformed to reduce the volume of the first accommodation cavity 811 . After the external force disappears, the shock absorbing pad 81 can return to the initial state, so that the volume of the first accommodation cavity 811 returns to the initial state.

In some examples, the material of the shock absorbing pad 81 may be plastic or rubber. Illustratively, the shock absorbing pad 81 may include two sheets arranged in a stack. After the two sheets are processed using a hot pressing process, the first chamber 811a and the second chamber 811b can be formed on the shock absorbing pad 81 .

FIG. 9 schematically shows a partial cross-sectional structure of the electronic device 10 . As shown in FIG. 9 , the shock absorbing assembly 80 also includes an elastic expansion body 83 . The elastic expansion body 83 has a second accommodation cavity 831 . The shock absorbing pad 81 is connected to the elastic expansion body 83 , and the first accommodation cavity 811 is connected to the second accommodation cavity 831 . There is a damping medium in the first accommodation cavity 811 and the second accommodation cavity 831 . The elastic expansion body 83 is a structural member with deformability. When the internal pressure of the elastic expansion body 83 increases, the elastic expansion body 83 may expand and deform to increase the volume of the second accommodation cavity 831 . When the internal pressure of the elastic expansion body 83 decreases, the elastic expansion body 83 may shrink and deform to reduce the volume of the second accommodation cavity 831 .

Since the cover located on one side of the battery 60 is an appearance structural member, that is, the cover can be observed from the outside of the electronic device 10 , there is a possibility that the cover may be pressed by the outside during use of the electronic device 10 . After the cover is pressed, the cover will be depressed toward the battery 60 , so that the pressing force exerted by the cover on the shock-absorbing pad 81 will increase.

If the pressure in the first receiving cavity 811 of the shock absorbing pad 81 increases because the cover is pressed and causes the pressure control valve 82 to open to release pressure, the cover itself can return after the pressing force acting on the cover disappears. The spring returns to the initial state, but the pressure in the first receiving cavity 811 of the shock-absorbing pad 81 is relatively reduced and cannot return to the initial pressure, resulting in a reduction in the pressure of the shock-absorbing pad 81 on the cover, and the support force on the cover. Reduced, affecting the effect of the shock-absorbing pad 81 in buffering the vibration of the cover.

In the embodiment of the present application, the shock absorbing pad 81 is connected to the elastic expansion body 83 . When the cover is pressed, the pressing force exerted by the cover on the shock-absorbing pad 81 will increase. The volume of the first accommodating cavity 811 of the shock absorbing pad 81 is relatively reduced, and the pressure increases. However, since the first accommodating cavity 811 and the second accommodating cavity 831 are connected, the shock absorbing medium in the first accommodating cavity 811 can enter. inside the second accommodation cavity 831. After the pressure in the second accommodation cavity 831 increases, the elastic expansion body 83 will expand, thereby stabilizing the pressure in the first accommodation cavity 811 and the second accommodation cavity 831, so that the pressure in the first accommodation cavity 811 can be maintained. When the pressure threshold is exceeded, it is ensured that the pressure control valve 82 will not open due to external pressure on the cover. After the pressing force acting on the cover disappears, the cover itself can rebound and return to the initial state, while the pressure in the first receiving cavity 811 of the shock absorbing pad 81 is relatively reduced. At this time, the elastic expansion body 83 can shrink and deform. , causing the shock-absorbing medium in the second accommodating cavity 831 to flow back into the first accommodating cavity 811 to ensure that the pressure in the first accommodating cavity 811 can be restored to the initial pressure, effectively reducing the pressure of the shock-absorbing pad 81 on the cover. , the supporting force for the cover is reduced, which may affect the effect of the shock-absorbing pad 81 on buffering the vibration of the cover.

During the expansion of the battery 60 , the battery 60 squeezes the shock absorbing pad 81 to reduce the volume of the first receiving cavity 811 of the shock absorbing pad 81 . The shock-absorbing medium in the first accommodation cavity 811 can enter the second accommodation cavity 831 so that the pressure in the first accommodation cavity 811 does not exceed the pressure threshold and can ensure sufficient support for the cover. When the battery 60 expands to a predetermined degree, the elastic expansion body 83 itself expands and deforms to a predetermined degree, so that the pressure in the first accommodation chamber 811 and the second accommodation chamber 831 reaches the pressure threshold, so that the pressure control valve 82 can open to release pressure.

In some examples, FIG. 10 schematically shows a partial cross-sectional structure of electronic device 10 . As shown in FIG. 10 , the electronic device 10 further includes a limiting member 90 . The limiting member 90 is disposed on the side of the cover facing the battery 60 . At least part of the elastic expansion body 83 is disposed between the limiting member 90 and the covering member. The limiting member 90 can constrain the elastic expansion body 83 , thereby controlling the expansion degree of the elastic expansion body 83 , which is beneficial to reducing the possibility that the elastic expansion body 83 will expand and deform freely, causing the elastic expansion body 83 to have an excessive volume. , thereby reducing the possibility that the elastic expansion body 83 will be too large after expansion and may squeeze other structural components in the electronic device 10 or the elastic expansion body 83 may be punctured by other structural components.

For example, the entire elastic expansion body 83 may be disposed between the limiting member 90 and the covering member.

For example, the limiting member 90 is detachably connected to the back cover 32 .

For example, the limiting member 90 and the back cover 32 may be an integrally formed structure. During the assembly process, the elastic expansion body 83 can be installed into the space formed between the limiting member 90 and the back cover 32 .

By way of example, the material of the elastic expansion body 83 may include but is not limited to rubber.

By way of example, battery 60 may have a rectangular structure. An elastic expansion body 83 may be provided on at least one side of the opposite sides of the shock absorbing pad 81 . FIG. 11 schematically shows a partial structure of the electronic device 10 . As shown in FIG. 11 , along the length direction Y of the battery 60 , an elastic expansion body 83 may be provided on one side of the shock absorbing pad 81 . Alternatively, at least one of the opposite sides of the shock absorbing pad 81 may be provided with an elastic expansion body 83 . FIG. 12 schematically shows a partial structure of the electronic device 10 . Referring to FIG. 12 , along the width direction X of the battery 60 , elastic expansion bodies 83 may be respectively provided on opposite sides of the shock absorbing pad 81 .

For example, the number of elastic expansion bodies 83 may be one or more than two, which is not specifically limited in this application.

Along the thickness direction Z of the battery 60 , the orthographic projection of the elastic expansion body 83 is located outside the orthographic projection of the battery 60 . When the battery 60 expands, the battery 60 will not squeeze the elastic expansion body 83 .

The elastic expansion body 83 can be connected to the cover, so that the elastic expansion body 83 in the electronic device 10 after completion of assembly can keep its position relatively stable and is not prone to deviation, thereby reducing the risk of position deviation of the elastic expansion body 83 during the deformation process. This may cause other structural components to puncture or scratch the elastic expansion body 83 .

In some examples, the shock-absorbing pad 81 and the elastic expansion body 83 may be pre-filled with a predetermined amount of shock-absorbing medium. Then, the shock-absorbing pad 81 and the elastic expansion body 83 with the shock-absorbing medium are respectively connected to the cover, so that the shock-absorbing pad 81 and the elastic expansion body 83 are respectively fixed at predetermined positions of the cover. Then the cover part is connected to the middle frame 31. After the assembly is completed, the cover part and the battery 60 can squeeze the shock absorbing pad 81 together. By way of example, the elastic expansion body 83 may be bonded to the cover. For example, adhesive glue or double-sided tape is used to bond the elastic expansion body 83 to the cover.

The shock absorbing assembly 80 also includes a communication tube 84 . The shock absorbing pad 81 and the elastic expansion body 83 are connected to the communication tube 84 respectively. The first accommodation chamber 811 of the shock absorbing pad 81 is connected with the second accommodation chamber 831 of the elastic expansion body 83 through the communication tube 84 , so that the first accommodation chamber 811 and the second accommodation chamber 831 can realize the flow of damping medium through the communication tube 84 . The communication tube 84 itself can have a smaller size, so that the communication tube 84 can be disposed in a relatively narrow area, so that the elastic expansion body 83 can be selectively disposed in a larger space and communicate with the shock-absorbing pad 81 through the communication tube 84 .

In some examples, one elastic expansion body 83 may be provided with one communication tube 84 or two or more communication tubes 84, which is not specifically limited in this application.

In some examples, communication tube 84 is a flexible structure. The communication tube 84 can be freely bent to easily bypass structural components in the electronic device 10 , which is beneficial to reducing the difficulty of arranging the communication tube 84 in the electronic device 10 . For example, the material of the communication tube 84 may be rubber.

In some implementable ways, FIG. 13 schematically shows a partial cross-sectional structure of the electronic device 10 . As shown in FIG. 13 , the electronic device 10 may include two display screens 20 . Both display screens 20 can be used to display image information. Along the thickness direction Z of the battery 60, the two display screens 20 may be arranged at intervals. The battery 60 is disposed between the two display screens 20 . One display screen 20 is located on one side of the battery 60 , and the other display screen 20 is separated from the battery 60 by a middle frame 31 . The main difference from the embodiment in which the cover is the back cover 32 is that the cover can be the display screen 20 located on one side of the battery 60 . In the related art, when the diaphragm 71 of the speaker 70 vibrates, the display screen 20 as the cover will vibrate. When the display screen 20 vibrates, on the one hand, it will have a negative impact on the connection stability of the components on the electronic device 10; on the other hand, when the user uses the electronic device 10, there may be situations where the electronic device 10 feels obvious vibration, which affects the electronic device 10. Device 10 experience. The shock-absorbing pad 81 in the shock-absorbing assembly 80 of the embodiment of the present application may be disposed between the display screen 20 as a cover and the battery 60 . The shock-absorbing pad 81 can provide good support for the display screen 20 as the cover, so that when the display screen 20 as the cover vibrates, the shock-absorbing pad 81 can effectively suppress the vibration of the display screen 20 as the cover. The vibration feeling of the display screen 20 as a cover is reduced.

In the description of the embodiments of this application, it should be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. Indirect connection through an intermediary can be the internal connection between two elements or the interaction between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of this application can be understood according to specific circumstances.

The embodiments of the present application do not indicate or imply that the devices or components mentioned must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of this application, "plurality" means two or more, unless otherwise precisely and specifically specified.

The terms "first", "second", "third", "fourth", etc. (if present) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects, and It is not necessary to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the application described herein can be practiced in sequences other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus that encompasses a series of steps or units and need not be limited to those explicitly listed. Those steps or elements may instead include other steps or elements not expressly listed or inherent to the process, method, product or apparatus.

The term "plurality" as used herein means two or more. The term "and/or" in this article is just an association relationship that describes related objects, indicating that three relationships can exist. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and they exist alone. B these three situations. In addition, the character "/" in this article generally indicates that the related objects before and after are an "or" relationship; in the formula, the character "/" indicates that the related objects before and after are a "division" relationship.

It can be understood that the various numerical numbers involved in the embodiments of the present application are only for convenience of description and are not used to limit the scope of the embodiments of the present application.

It can be understood that in the embodiments of the present application, the size of the sequence numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its functions and internal logic, and should not be used in the implementation of the present application. The implementation of the examples does not constitute any limitations.

Claims (15)

1. An electronic device, comprising:

a battery;

a cover member provided on one side of the battery;

the damping assembly comprises a damping pad and a pressure control valve, at least part of the damping pad is arranged between the battery and the covering part, the damping pad comprises a first accommodating cavity and damping medium, the damping medium is arranged in the first accommodating cavity, the pressure control valve is arranged on the damping pad, and the pressure control valve is used for responding to the pressure in the first accommodating cavity to reach a pressure threshold value and can be opened;

The damping assembly further comprises an elastic expansion body, the elastic expansion body is provided with a second containing cavity, the damping pad is connected with the elastic expansion body, the first containing cavity is communicated with the second containing cavity, and the damping medium is arranged in the first containing cavity and the second containing cavity.

2. The electronic device of claim 1, wherein a sidewall of the shock pad is provided with the pressure control valve.

3. The electronic device of claim 1, wherein the pressure control valve is a one-way valve.

4. The electronic device of claim 1, wherein the shock absorbing medium is a gas.

5. The electronic device of claim 1, wherein the first housing cavity comprises a first chamber and a second chamber, wherein more than two of the first chambers are disposed at intervals, and each of the first chambers is in communication with the second chamber.

6. The electronic device of claim 5, wherein more than two of the first chambers are evenly distributed.

7. The electronic device of claim 1, wherein at least one of the battery and the cover is connected to the shock pad.

8. The electronic device of claim 1, wherein the shock pad is made of plastic or rubber.

9. The electronic device of any one of claims 1-8, further comprising a stop disposed on a side of the cover facing the battery, at least a portion of the elastic expansion body disposed between the stop and the cover.

10. The electronic device according to any one of claims 1 to 8, wherein the shock absorbing assembly further includes a communication pipe to which the shock absorbing pad and the elastic expansion body are connected, respectively, and the first accommodation chamber is communicated with the second accommodation chamber through the communication pipe.

11. The electronic device of claim 10, wherein the communication tube is a flexible structure.

12. The electronic device according to any one of claims 1 to 8, wherein an orthographic projection of the elastic expansion body is located outside of an orthographic projection of the battery in a thickness direction of the battery.

13. The electronic device of any one of claims 1-8, wherein the elastomeric expansion body is coupled to the cover.

14. The electronic device of any one of claims 1-8, further comprising a center having a receiving space, wherein the battery and the shock absorbing assembly are both disposed within the receiving space, and wherein the cover is coupled to the center.

15. The electronic device of any one of claims 1-8, wherein the cover is a back cover or a display screen.