CN116093717B - Semiconductor pumping solid optical fiber laser - Google Patents
Semiconductor pumping solid optical fiber laserInfo
- Publication number
- CN116093717B CN116093717B CN202211642313.8A CN202211642313A CN116093717B CN 116093717 B CN116093717 B CN 116093717B CN 202211642313 A CN202211642313 A CN 202211642313A CN 116093717 B CN116093717 B CN 116093717B
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- heat dissipation
- fixedly connected
- shell
- mounting barrel
- buffer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
- H01S3/06704—Housings; Packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lasers (AREA)
Abstract
本发明公开了一种半导体抽运固体光纤激光器，涉及光纤激光器技术领域；改善拆卸激光器检查光纤是否老化损坏，较为麻烦复杂，外界对其产生的冲击及震动可能导致光纤激光器内部元件的损坏的问题，而本发明包括第一壳体和设置在第一壳体一侧的第二壳体，所述第一壳体与第二壳体之间通过拆卸机构连接，所述第一壳体的内部设置有第一安装桶，所述第一安装桶的一侧设置有第二安装桶；本发明通过第一壳体和第二壳体的设置，使第一壳体和第二壳体可以相互分离，通过第一壳体和第二壳体之间的空隙观察透明连接环内部的掺杂光纤是否老化损坏，不需要将掺杂光纤拆出观察，操作简单方便，节省一定量的劳动力。
This invention discloses a semiconductor-pumped solid-state fiber laser, relating to the field of fiber laser technology. It addresses the problem of the cumbersome and complex process of disassembling a laser to inspect for fiber optic aging or damage, where external impacts and vibrations can damage internal components. The invention comprises a first housing and a second housing disposed on one side of the first housing, connected by a disassembly mechanism. The first housing contains a first mounting container, and a second mounting container is disposed on one side of the first mounting container. The first and second housings are separated, allowing observation of the doped fiber inside the transparent connecting ring for aging or damage without removing the doped fiber. This simplifies operation, saves labor, and is convenient.
Description
Technical Field
The invention relates to the technical field of fiber lasers, in particular to a semiconductor pumping solid fiber laser.
Background
A laser, a device capable of emitting laser light. Lasers can be classified into a gas laser, a solid-state laser, a semiconductor laser, and a dye laser 4 according to working media. Free electron lasers have been developed recently, high-power lasers are usually pulsed output, and fiber lasers consist of three basic elements, namely a pump source, a gain medium and a resonant cavity. The pump source generally adopts a high-power semiconductor laser, the gain medium is rare earth doped optical fiber or common nonlinear optical fiber, the resonant cavity can be various linear resonant cavities formed by optical feedback elements such as fiber gratings and the like, and various annular resonant cavities can also be formed by couplers. The pump light is coupled into the gain fiber through a proper optical system, the gain fiber forms particle number inversion or nonlinear gain after absorbing the pump light and generates spontaneous emission, and the generated spontaneous emission light finally forms stable laser output after undergoing laser amplification and mode selection of the resonant cavity.
At present, the doped optical fiber of the medium-high power optical fiber laser generates laser under the action of pumping light, but simultaneously generates a large amount of heat, the heat can cause the temperature of the optical fiber to rise, long-time use causes aging of outer polymers of optical fiber communication, most of the optical fiber is inspected to be aged and damaged by disassembling the laser at present, but the disassembly is troublesome and complex, a certain amount of labor force is wasted, and in the use process of the optical fiber laser, the impact and vibration generated by the outside on the optical fiber laser can cause the damage of internal elements of the optical fiber laser, so that the service life of the device is influenced.
In view of the above, the inventors propose a semiconductor pump solid-state fiber laser for solving the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a semiconductor pumping solid fiber laser, which aims to solve the problem that the damage of internal elements of the fiber laser can be caused by the impact and vibration generated by the outside to the fiber laser when the fiber is detached to check whether the fiber is aged or damaged.
In order to solve the technical problems, the invention adopts the following technical scheme: comprises a first shell and a second shell arranged on one side of the first shell, wherein the first shell and the second shell are connected through a disassembly mechanism, a first mounting barrel is arranged in the first shell, a second mounting barrel is arranged on one side of the first mounting barrel, the first mounting barrel and the second mounting barrel are fixedly connected through a transparent connecting ring, the transparent connecting ring can be made of acrylic and glass, a buffer mechanism is arranged in the first shell and the second shell, a heat dissipation mechanism is arranged on one side of the second shell, a pump source is fixedly connected to the inner surface of the first mounting barrel, a dichroic mirror is arranged at one end of the pump source, a focusing collimating mirror is fixedly connected to the inner surface of the second mounting barrel, doped optical fibers are arranged between the dichroic mirror and the focusing collimating mirror, one side of the first shell is communicated with an output tube, one end of the output tube is fixedly connected with a protective lens, one side of the second mounting barrel and one side of the first mounting barrel are fixedly connected with damping filling pads, the damping filling pads increase the transverse buffering capacity of the device and simultaneously increase the stability of the device, the first shell and the second shell can be mutually separated through the arrangement of the first shell and the second shell, whether the doped optical fiber inside the transparent connecting ring is aged or not is damaged or not is observed through a gap between the first shell and the second shell, the doped optical fiber is not required to be detached and observed, the operation is simple and convenient, a certain amount of labor force is saved, the doped optical fiber comprises an outer cladding, the inner surface of the outer cladding is fixedly connected with an inner cladding, the inner surface of the inner cladding is fixedly connected with a doped fiber core, the outer cladding is made of polymer, the inner cladding is made of glass.
Preferably, the dismounting mechanism comprises a first dismounting ring, the internal surface of first dismounting ring and the fixed surface of first casing are connected, one side of first dismounting ring is provided with the second and dismantles the ring, the internal surface of second dismounting ring and the fixed surface of second casing are connected, one side fixedly connected with dismantles the pin pole of first dismounting ring, the quantity of dismantling the pin pole is provided with a plurality of, and first dismounting ring is used for installing dismantles the pin pole, dismantles the pin pole and is used for inserting the second and dismantles in the ring to carry out spacing to the second dismantles the ring, the dismantlement pinhole with dismantlement pin pole looks adaptation is seted up to one side of second dismantlement ring, the surface of second casing runs through and sliding connection has the dismantlement spring pole, the quantity of dismantlement spring pole is provided with a plurality of, the surface cover of dismantlement spring pole is equipped with the dismantlement spring, the outer surface of dismantlement pin pole has been seted up with the dismantlement spring hole with dismantlement spring pole looks adaptation, dismantles the spring pole inserts and dismantles the spring hole, thereby carries out spacing to dismantlement pin pole, makes first casing and second casing fixed connection, and promotes dismantlement pin pole looks remote from first and dismantlement pin pole, thereby moves the first housing, and dismantles the pin pole, and moves away from the first spacer pin, and dismantles the first pin, and moves away from the first spacer pin.
Preferably, the buffer gear includes the buffer slide, the buffer slide has all been seted up to the internal surface of first casing and second casing, buffer slide's internal surface and buffer slide's surface sliding connection, buffer slide's surface rotates and is connected with the buffer gangbar, and the buffer slide is used for installing buffer gangbar and buffer spring, and the buffer gangbar is used for supporting first installation bucket and second installation bucket, buffer gangbar's one end is connected with the surface rotation of first installation bucket and second installation bucket respectively, buffer slide's internal surface fixedly connected with buffer spring, buffer spring's one end and buffer slide's surface fixed connection, through buffer gear's setting, receive the impact force to first installation bucket and second installation bucket and cushion, reduce the possibility that first installation bucket and second installation bucket internal element received the damage, increase device's life.
Preferably, the heat dissipation mechanism comprises a heat dissipation installation frame, one side of the heat dissipation installation frame is fixedly connected with one side of the second shell, the inner surface of the heat dissipation installation frame is fixedly connected with a heat dissipation baffle plate, the inner surface of the heat dissipation installation frame is fixedly connected with a heat dissipation air pump which is positioned in the heat dissipation baffle plate, the heat dissipation installation frame is used for installing the heat dissipation baffle plate and the heat dissipation air pump, the heat dissipation air pump provides power for the flowing of gas, the heat dissipation baffle plate is used for storing cold air between the heat dissipation baffle plate and the heat dissipation installation frame, the inner surface of the heat dissipation installation frame is fixedly connected with a heat dissipation first annular pipe, the air outlet end of the heat dissipation air pump is communicated with the outer surface of the heat dissipation first annular pipe, the inner surface of the heat dissipation installation frame is fixedly connected with a heat dissipation second annular pipe which is positioned on the periphery of the heat dissipation first annular pipe, the first annular tube and the second annular tube are communicated through a first connecting tube, the first annular tube is used for refrigerating air in the first annular tube, the second annular tube increases the time for air to stay between the heat radiating partition plate and the heat radiating installation frame, the first connecting tube is opposite to the air outlet end of the heat radiating air pump, the circulation distance of air is increased, the inner surface of the first installation barrel is fixedly connected with a heat radiating annular frame, the inner surface of the heat radiating annular frame is provided with heat radiating air nozzles, the number of the heat radiating air nozzles is provided with a plurality of, one side of the heat radiating annular frame is communicated with a second heat radiating connecting tube, one end of the second heat radiating connecting tube penetrates through the first installation barrel and extends to the inside of the second shell, the annular heat radiating frame is used for installing a heat radiating air nozzle, cold air sprayed by the heat radiating air nozzle is used for radiating a pump source, the second heat radiating connecting tube is used for connecting a heat radiating metal hose, one end of the second heat dissipation connecting pipe is communicated with the outer surface of the second heat dissipation annular pipe through a heat dissipation metal hose, a cooling plate is fixedly installed on one side of the heat dissipation installation frame through a groove, an air inlet hole is formed in one side of the heat dissipation installation frame, when the first shell and the second shell are far away, the second shell drives the heat dissipation installation frame to be far away from the first installation barrel, the heat dissipation metal hose compensates the distance between the heat dissipation installation frame and the first installation barrel, normal operation of the device is guaranteed, and through the arrangement of a heat dissipation mechanism, cooling and heat dissipation are conducted on the pump source through external Zhou Chuiru cold air of the heat dissipation air tap to the pump source, and the service life of the device is prolonged.
Compared with the prior art, the invention has the beneficial effects that:
1. Through the arrangement of the first shell and the second shell, the first shell and the second shell can be separated from each other, whether the doped optical fiber in the transparent connecting ring is aged or not is observed through a gap between the first shell and the second shell, the doped optical fiber does not need to be detached for observation, the operation is simple and convenient, and a certain amount of labor force is saved;
2. The impact force received by the first mounting barrel and the second mounting barrel is buffered through the arrangement of the buffer mechanism, the possibility that the internal elements of the first mounting barrel and the second mounting barrel are damaged is reduced, and the service life of the device is prolonged;
3. Through the setting of cooling mechanism, through the outer Zhou Chuiru cold wind of heat dissipation air cock to the pump source to cool down the heat dissipation to the pump source, increase the life of device.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic view of the internal structure of the first housing of the present invention.
Fig. 3 is a schematic view showing the internal structure of the first mounting barrel of the present invention.
FIG. 4 is a schematic diagram of a doped core according to the present invention.
Fig. 5 is a schematic structural view of the second housing of the present invention.
Fig. 6 is a schematic structural view of a buffer linkage rod according to the present invention.
Fig. 7 is a schematic structural diagram of a heat dissipation mounting frame according to the present invention.
Fig. 8 is a schematic structural view of a cooling fin according to the present invention.
Fig. 9 is a schematic structural view of the dismounting mechanism of the present invention.
1, A first shell; 2, a second shell, 3, a first mounting barrel, 4, a transparent connecting ring, 5, a second mounting barrel, 6, a pump source, 7, a double-color mirror, 8, a focusing collimating mirror, 9, doped optical fibers, 10, an output pipe, 11, a protective lens, 12, an outer cladding, 13, an inner cladding, 14, a doped core, 15, a damping filling pad, 120, a dismounting mechanism, 121, a first dismounting ring, 122, a second dismounting ring, 123, a dismounting pin rod, 124, a dismounting pin hole, 125, a dismounting spring rod, 126, a dismounting spring, 127, a dismounting spring hole, 130, a buffering mechanism, 131, a buffering sliding block, 132, a buffering sliding groove, 133, a buffering linkage rod, 134, a buffering spring, 140, a radiating mechanism, 141, a radiating mounting frame, 142, a radiating partition plate, 143, a radiating air pump, 144, a radiating first annular pipe, 145, a radiating second annular pipe, 146, a radiating first connecting pipe, 147, a radiating annular frame, 148, a radiating air pump, 149, a radiating second air nozzle, 1410, a metal hose, 1411, a radiating air inlet, a radiating seat, a 1412 and radiating heat sink.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-9, the invention provides a semiconductor pumping solid optical fiber laser, which comprises a first shell 1 and a second shell 2 arranged at one side of the first shell 1, wherein the first shell 1 and the second shell 2 are connected through a disassembly mechanism 120, a first mounting barrel 3 is arranged in the first shell 1, a second mounting barrel 5 is arranged at one side of the first mounting barrel 3, the first mounting barrel 3 and the second mounting barrel 5 are fixedly connected through a transparent connecting ring 4, the transparent connecting ring 4 can be made of acrylic and glass, a buffer mechanism 130 is arranged in the first shell 1 and the second shell 2, a heat dissipation mechanism 140 is arranged at one side of the second shell 2, a pump source 6 is fixedly connected to the inner surface of the first mounting barrel 3, a double-color collimator lens 8 is arranged at one end of the pump source 6, a doped optical fiber 9 is arranged between the double-color collimator lens 7 and the focusing collimator lens 8, an output pipe 10 is communicated at one side of the first shell 1, a protection lens 11 is fixedly connected at one end of the output pipe 10, a buffer mechanism 130 is arranged at one side of the second shell 5, a buffer mechanism 130 is arranged at one side of the second shell 1 and the second shell 2, a buffer mechanism 15 is arranged between the first shell 2 and the first shell 2, a buffer mechanism 15 is arranged at one side of the second shell 2, and the buffer mechanism is not required to be filled with the first shell 2, and the buffer mechanism is not filled with the buffer mechanism is convenient to be filled, and the buffer mechanism is required to be opened, and the buffer mechanism is filled between the first shell and the first shell 2 and the buffer device is required to be connected with the first shell and the buffer device is filled with the buffer device and the first shell 2 and the buffer device is filled with the buffer optical fiber buffer device and the buffer device is 2.
The doped optical fiber 9 comprises an outer cladding layer 12, an inner cladding layer 13 is fixedly connected to the inner surface of the outer cladding layer 12, and a doped fiber core 14 is fixedly connected to the inner surface of the inner cladding layer 13.
By adopting the above technical scheme, the material of the outer cladding 12 is polymer, and the material of the inner cladding 13 is glass.
The disassembly body 120 comprises a first disassembly ring 121, the inner surface of the first disassembly ring 121 is fixedly connected with the outer surface of the first shell 1, a second disassembly ring 122 is arranged on one side of the first disassembly ring 121, the inner surface of the second disassembly ring 122 is fixedly connected with the outer surface of the second shell 2, disassembly pins 123 are fixedly connected with one side of the first disassembly ring 121, and a plurality of disassembly pins 123 are arranged.
Through adopting above-mentioned technical scheme, first dismantlement ring 121 is used for installing dismantlement pin 123, dismantles the pin 123 and is used for inserting in the second dismantlement ring 122 to spacing is dismantled to the second.
One side of the second dismantlement ring 122 is provided with a dismantlement pin hole 124 which is matched with the dismantlement pin rod 123, the outer surface of the second shell 2 penetrates through and is in sliding connection with a dismantlement spring rod 125, the number of the dismantlement spring rods 125 is provided with a plurality of, the outer surface of the dismantlement spring rod 125 is sleeved with a dismantlement spring 126, and the outer surface of the dismantlement pin rod 123 is provided with a dismantlement spring hole 127 which is matched with the dismantlement spring rod 125.
Through adopting above-mentioned technical scheme, dismantle spring bar 125 insert dismantle in spring hole 127 to carry out spacingly to dismantling the round pin pole 123, make first casing 1 and second casing 2 fixed connection, promote to dismantle spring bar 125 and make to dismantle the extension of spring 126, dismantle spring bar 125 and keep away from and dismantle spring hole 127, thereby release the spacing to dismantling round pin pole 123, remove first dismantlement ring 121 and drive and dismantle round pin pole 123 and keep away from dismantling pinhole 124, thereby dismantle ring 121 and the separation of second dismantlement ring 122 with first dismantlement ring 121, remove first casing 1 and second casing 2 and keep away from each other.
The buffer mechanism 130 comprises a buffer slide block 131, the inner surfaces of the first shell 1 and the second shell 2 are respectively provided with a buffer slide groove 132, the inner surfaces of the buffer slide grooves 132 are in sliding connection with the outer surfaces of the buffer slide block 131, and the outer surfaces of the buffer slide block 131 are rotationally connected with a buffer linkage rod 133.
Through adopting above-mentioned technical scheme, buffering slider 131 is used for installing buffering gangbar 133 and buffer spring 134, and buffering gangbar 133 is used for supporting first installation bucket 3 and second installation bucket 5.
One end of the buffer linkage rod 133 is respectively connected with the outer surfaces of the first mounting barrel 3 and the second mounting barrel 5 in a rotating way, the buffer spring 134 is fixedly connected with the inner surface of the buffer sliding groove 132, and one end of the buffer spring 134 is fixedly connected with the outer surface of the buffer sliding block 131.
Through adopting above-mentioned technical scheme, through buffer gear 130's setting, cushion the impact that first barreled barrel 3 and second barreled barrel 5 received, reduce the possibility that first barreled barrel 3 and second barreled barrel 5 inner element received the damage, increase the life of device.
The heat dissipation mechanism 140 includes a heat dissipation mounting frame 141, one side of the heat dissipation mounting frame 141 is fixedly connected with one side of the second housing 2, the inner surface of the heat dissipation mounting frame 141 is fixedly connected with a heat dissipation partition plate 142, and the inner surface of the heat dissipation mounting frame 141 is fixedly connected with a heat dissipation air pump 143 inside the heat dissipation partition plate 142.
Through adopting above-mentioned technical scheme, the heat dissipation mounting frame 141 is used for installing heat dissipation baffle 142 and heat dissipation air pump 143, and heat dissipation air pump 143 is the flow power of gas, and the cold air between heat dissipation baffle 142 and the heat dissipation mounting frame 141 is used for storing to the heat dissipation baffle 142.
The inside surface of the heat dissipation installation frame 141 and the outside fixedly connected with heat dissipation first annular pipe 144 that is located the heat dissipation baffle 142, the end of giving vent to anger of heat dissipation air pump 143 communicates with the surface of heat dissipation first annular pipe 144, the inside surface of heat dissipation installation frame 141 and the periphery fixedly connected with heat dissipation second annular pipe 145 that is located the heat dissipation first annular pipe 144, communicate through heat dissipation first connecting pipe 146 between heat dissipation first annular pipe 144 and the heat dissipation second annular pipe 145.
Through adopting above-mentioned technical scheme, the first annular pipe 144 of heat dissipation is used for the air in the first annular pipe 144 of refrigeration heat dissipation, and the second annular pipe 145 of heat dissipation increases the time that the air stayed between heat dissipation baffle 142 and heat dissipation installing frame 141, and the first connecting pipe 146 of heat dissipation sets up with the end of giving vent to anger of heat dissipation air pump 143 in opposite, increases the circulation distance of air.
The inner surface fixedly connected with heat dissipation annular frame 147 of first mounting barrel 3, the inner surface of heat dissipation annular frame 147 is provided with heat dissipation air cock 148, and the quantity of heat dissipation air cock 148 is provided with a plurality of, and the one side intercommunication of heat dissipation annular frame 147 has heat dissipation second connecting pipe 149, and the one end of heat dissipation second connecting pipe 149 runs through first mounting barrel 3 and extends to the inside of second casing 2.
By adopting the above technical scheme, the heat dissipation annular frame 147 is used for installing the heat dissipation air cock 148, and the cold air of heat dissipation air cock 148 spun is used for dispelling the heat to the pump source 6, and the heat dissipation second connecting pipe 149 is used for connecting heat dissipation metal collapsible tube 1410.
One end of the heat dissipation second connecting pipe 149 is communicated with the outer surface of the heat dissipation second annular pipe 145 through a heat dissipation metal hose 1410, a cooling plate 1411 is fixedly installed on one side of the heat dissipation installation frame 141 through a groove, and an air inlet 1412 is formed on one side of the heat dissipation installation frame 141.
Through adopting above-mentioned technical scheme, when first casing 1 and second casing 2 keep away from, second casing 2 drives the heat dissipation installing frame 141 and keeps away from first installation bucket 3, and the distance between heat dissipation metal collapsible tube 1410 compensation heat dissipation installing frame 141 and the first installation bucket 3 guarantees the normal operating of device, through the setting of cooling mechanism 140, through the outer Zhou Chuiru cold wind of heat dissipation air cock 148 to pump source 6 to cool down and dispel the heat to pump source 6, increase the life of device.
When the doped optical fiber 9 needs to be penetrated and aged, pushing the dismounting spring rod 125 to extend the dismounting spring 126, enabling the dismounting spring rod 125 to be far away from the dismounting spring hole 127, so that the limit on the dismounting pin rod 123 is relieved, moving the first dismounting ring 121 to drive the dismounting pin rod 123 to be far away from the dismounting pin hole 124, separating the first dismounting ring 121 from the second dismounting ring 122, moving the first shell 1 and the second shell 2 to be far away from each other, and observing whether the doped optical fiber 9 in the transparent connecting ring 4 is aged and damaged through a gap between the first shell 1 and the second shell 2;
When the pump source 6 needs to radiate heat, the cooling fin 1411 is started to cool the air between the heat radiation mounting frame 141 and the heat radiation partition plate 142, the heat radiation air pump 143 is started to spray outside air through the air inlet 1412, the heat radiation first annular pipe 144, the heat radiation first connecting pipe 146, the heat radiation second annular pipe 145, the heat radiation metal hose 1410, the heat radiation second connecting pipe 149, the heat radiation annular frame 147 and the heat radiation air tap 148 in sequence, and the cold air between the heat radiation mounting frame 141 and the heat radiation partition plate 142 cools the air in the heat radiation first annular pipe 144 and the heat radiation second annular pipe 145, so that the heat radiation air tap 148 sprays cold air to radiate the periphery of the pump source 6;
when the first shell 1 and the second shell 2 are impacted by the outside, the first shell 1 and the second shell 2 drive the buffer sliding groove 132 to enable the buffer sliding block 131 to move, the buffer sliding block 131 drives the buffer linkage rod 133 to rotate, the buffer linkage rod 133 rotates to drive the buffer sliding block 131 to move along the buffer sliding groove 132, the buffer sliding block 131 moves to squeeze the buffer spring 134 to enable the buffer spring 134 to shrink, so that impact force is buffered, the pump source 6 and the doped optical fiber 9 in the transparent connecting ring 4 and the second mounting barrel 5 are protected, and the possibility of damage to the device is reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (6)
1. The semiconductor pumping solid optical fiber laser comprises a first shell (1) and a second shell (2) arranged on one side of the first shell (1), and is characterized in that the first shell (1) and the second shell (2) are connected through a detaching mechanism (120), a first mounting barrel (3) is arranged in the first shell (1), a second mounting barrel (5) is arranged on one side of the first mounting barrel (3), the first mounting barrel (3) and the second mounting barrel (5) are fixedly connected through a transparent connecting ring (4), a buffer mechanism (130) is arranged in each of the first shell (1) and the second shell (2), a heat dissipation mechanism (140) is arranged on one side of the second shell (2), a pump source (6) is fixedly connected to the inner surface of the first mounting barrel (3), a dichroic mirror (7) is arranged at one end of the pump source (6), a focusing collimating mirror (8) is fixedly connected to the inner surface of the second mounting barrel (3), a focusing mirror (7) is fixedly connected to the inner surface of the second mounting barrel, a protecting lens (10) is fixedly connected to one end of the first collimating mirror (10), one side of the second mounting barrel (5) and one side of the first mounting barrel (3) are fixedly connected with damping filling pads (15);
The dismounting mechanism (120) comprises a first dismounting ring (121), the inner surface of the first dismounting ring (121) is fixedly connected with the outer surface of the first shell (1), one side of the first dismounting ring (121) is provided with a second dismounting ring (122), the inner surface of the second dismounting ring (122) is fixedly connected with the outer surface of the second shell (2), one side of the first dismounting ring (121) is fixedly connected with dismounting pins (123), and the number of the dismounting pins (123) is a plurality of;
One side of the second disassembly ring (122) is provided with a disassembly pin hole (124) matched with a disassembly pin rod (123), the outer surface of the second shell (2) penetrates through and is connected with disassembly spring rods (125) in a sliding manner, the number of the disassembly spring rods (125) is provided with a plurality of disassembly springs (126), the outer surface of each disassembly spring rod (125) is sleeved with a disassembly spring (126), and the outer surface of each disassembly pin rod (123) is provided with a disassembly spring hole (127) matched with each disassembly spring rod (125);
the buffer mechanism (130) comprises a buffer slide block (131), buffer slide grooves (132) are formed in the inner surfaces of the first shell (1) and the second shell (2), the inner surfaces of the buffer slide grooves (132) are in sliding connection with the outer surfaces of the buffer slide block (131), and buffer linkage rods (133) are rotatably connected to the outer surfaces of the buffer slide block (131);
One end of the buffering linkage rod (133) is respectively connected with the outer surfaces of the first mounting barrel (3) and the second mounting barrel (5) in a rotating mode, a buffering spring (134) is fixedly connected to the inner surface of the buffering sliding groove (132), and one end of the buffering spring (134) is fixedly connected with the outer surface of the buffering sliding block (131).
2. A semiconductor pump solid state fiber laser according to claim 1, wherein the doped fiber (9) comprises an outer cladding (12), an inner cladding (13) is fixedly connected to an inner surface of the outer cladding (12), and a doped fiber core (14) is fixedly connected to an inner surface of the inner cladding (13).
3. A semiconductor pumping solid fiber laser according to claim 1, wherein the heat dissipation mechanism (140) comprises a heat dissipation mounting frame (141), one side of the heat dissipation mounting frame (141) is fixedly connected with one side of the second housing (2), the inner surface of the heat dissipation mounting frame (141) is fixedly connected with a heat dissipation partition plate (142), and the inner surface of the heat dissipation mounting frame (141) is fixedly connected with a heat dissipation air pump (143) located inside the heat dissipation partition plate (142).
4. A semiconductor pumping solid fiber laser according to claim 3, wherein the inner surface of the heat dissipation mounting frame (141) is fixedly connected with a heat dissipation first annular tube (144) outside the heat dissipation partition plate (142), the air outlet end of the heat dissipation air pump (143) is communicated with the outer surface of the heat dissipation first annular tube (144), the inner surface of the heat dissipation mounting frame (141) is fixedly connected with a heat dissipation second annular tube (145) outside the heat dissipation first annular tube (144), and the heat dissipation first annular tube (144) is communicated with the heat dissipation second annular tube (145) through a heat dissipation first connecting tube (146).
5. The semiconductor pumping solid fiber laser according to claim 4, wherein the inner surface of the first mounting barrel (3) is fixedly connected with a heat dissipation annular frame (147), the inner surface of the heat dissipation annular frame (147) is provided with heat dissipation air nozzles (148), the number of the heat dissipation air nozzles (148) is several, one side of the heat dissipation annular frame (147) is communicated with a heat dissipation second connecting pipe (149), and one end of the heat dissipation second connecting pipe (149) penetrates through the first mounting barrel (3) and extends to the inside of the second housing (2).
6. The semiconductor pumping solid fiber laser according to claim 5, wherein one end of the heat dissipation second connection pipe (149) is communicated with the outer surface of the heat dissipation second annular pipe (145) through a heat dissipation metal hose (1410), a cooling plate (1411) is fixedly installed on one side of the heat dissipation installation frame (141) through a slot, and an air inlet hole (1412) is formed on one side of the heat dissipation installation frame (141).
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| KR20180002149A (en) * | 2016-06-29 | 2018-01-08 | 케이넷(주) | Microtube connecter |
| CN217883438U (en) * | 2022-07-28 | 2022-11-22 | 武汉华创通科技股份有限公司 | Make things convenient for optic fibre transceiver of dismouting |
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| TWM282168U (en) * | 2005-05-13 | 2005-12-01 | Yu-Tsz He | Connector of optical fiber cable |
| WO2008137710A1 (en) * | 2007-05-03 | 2008-11-13 | University Of Washington | High resolution optical coherence tomography based imaging for intraluminal and interstitial use implemented with a reduced form factor |
| CN102168951B (en) * | 2010-12-22 | 2013-01-30 | 大连理工大学 | Detachable rigid-to-flexible optical fiber sensor and its layout method |
| CN217930777U (en) * | 2022-07-14 | 2022-11-29 | 上海精吉通讯技术有限公司 | A signal detection device for manufacturing optical communication equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180002149A (en) * | 2016-06-29 | 2018-01-08 | 케이넷(주) | Microtube connecter |
| CN217883438U (en) * | 2022-07-28 | 2022-11-22 | 武汉华创通科技股份有限公司 | Make things convenient for optic fibre transceiver of dismouting |
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