CN116092986B - A high-precision wafer chemical liquid etching device - Google Patents

Abstract

The invention belongs to the technical field of wafer etching, and particularly relates to a high-precision wafer chemical liquid etching device, which structurally comprises a first positioning driver; the second positioning driver is fixedly connected with the output shaft of the first positioning driver; the first rotary driver is fixedly connected with the output shaft of the second positioning driver; the invention has the advantages that the etching liquid is uniformly sprayed out of the linear through holes, the whole impact force and the contact quantity are uniform, and the efficiency and the precision are high; the etching reactant can be directly removed and cannot be retained at the wafer main body; the grooves at the top ends of the groove plates form a liquid retaining space, so that the wafer main body can be soaked in etching liquid, the utilization rate is improved, and the etching efficiency is further improved; the cleaning liquid is sprayed upwards at the spray head to clean the wafer main body, so that excessive etching is reduced, the precision is improved, and the structure is simple and convenient; the spray washing mode is adopted, so that the strength is high, the efficiency is high, and the etching reactant is further ensured to be washed out.

Description

A high-precision wafer chemical liquid etching device

technical field

The invention belongs to the technical field of wafer etching, in particular to a high-precision wafer chemical liquid etching device.

Background technique

The principle of photolithography is generally to cover a layer of highly photosensitive photoresist on the surface of the wafer, and then irradiate the surface of the wafer with light (usually ultraviolet light, deep ultraviolet light, extreme ultraviolet light) The photoresist reacts when the light hits it;

After the photolithography is completed, it is necessary to etch the part of the wafer that is not protected by the photoresist, and finally wash off the remaining photoresist to realize the construction process of the semiconductor device on the wafer surface;

In order to remove the unnecessary covering layer on the surface of the wafer (that is, the above-mentioned etching operation), the spraying method is that a nozzle sprays the liquid into the center of the wafer, and the centrifugal force formed by the high-speed rotation of the wafer driven by the platform, Distribute the chemical liquid to every part of the wafer surface, and the chemical liquid sputtered around the wafer will be recovered and recovered by the circular chemical liquid recovery chamber, such as: (application number: CN201780027089.2, used for Wafer outline of etching system), (application number: CN201721343049.2, a rotary etching device and wet etching machine);

However, this method will cause uneven etching rate, because the chemical liquid flows radially from the position of the wafer opposite the ejection end to the surroundings through centrifugal force, and the impact force (such as: spray type and immersion type) The difference in etching method) also affects the etching rate, but the accuracy is not high; and the etching solution during etching is directly thrown out by centrifugation, and the utilization rate is low; and after the etching is completed, the etching surface of the wafer It will continue to react due to the residual etching solution, which will affect the accuracy;

For this reason, it is urgent to propose a chemical liquid etching device for the main body of the wafer that can greatly improve the etching efficiency and precision.

Contents of the invention

(1) Technical problems to be solved

In order to overcome the shortcomings of the existing technology, a high-precision wafer chemical liquid etching device is proposed to solve the problems raised by the above-mentioned background technology.

(2) Technical solutions

The present invention is realized through the following technical solutions: the present invention proposes a high-precision wafer chemical liquid etching device, comprising:

The first adjustment driver for driving displacement left and right;

A second position adjustment driver for height adjustment up and down, which is fixedly connected with the output shaft of the first position adjustment driver;

A first rotary driver for providing a rotary drive function, which is fixedly connected to the output shaft of the second positioning driver;

a rotary chuck fixedly connected to the output shaft of the first rotary driver;

The wafer body is fixed on the outer side of the rotary chuck, and the etching surface of the wafer body faces downward;

A first liquid tank for containing etching liquid, which is arranged under the wafer body and extends into the first liquid tank;

The first leg for support is fixed on the outside of the first liquid tank;

A liquid flushing mechanism for impact etching the wafer body, which is fixedly connected to the first liquid tank;

A cleaning mechanism for cleaning the residual etching solution of the wafer body, which is fixed on the outside of the first liquid tank;

The liquid flushing mechanism includes a second groove plate with a groove at the top, overflow outlets are provided on the outside of the second groove plate and multiple groups are provided, and a second groove plate is fixed between the outside of the second groove plate and the inside of the first liquid tank. A support rod, the bottom end of the second slot plate is provided with a linear through hole and it communicates with the groove, the bottom end of the linear through hole is provided with an expansion plate, the inner side of the expansion plate is provided with a plate cavity and its connection is arranged in the linear through hole At the bottom of the hole, the expansion plate is provided with multiple groups and the shape formed at the top of the plate cavity is the same as that of the linear through hole. The other end of the first header is connected and fixed to one end of the first header, and the other end of the first header is fixed to the first automatic regulating valve. The linear through hole is located directly under the wafer body, and the length of the linear through hole is not less than the diameter of the wafer body;

The cleaning mechanism includes a second liquid tank, the bottom of the second liquid tank is fixed with a second leg, the middle part of the inner side of the second liquid tank is provided with a mounting plate, and a second support rod is fixed between the outer side of the mounting plate and the inner side of the second liquid tank , the top of the mounting plate is fixed with a nozzle and its outlet is facing upwards. The nozzles are provided in multiple groups and are fixedly connected to one end of the second distribution pipe respectively. One end of the second distribution pipe connected to the nozzle runs through the top and bottom ends of the installation board. , the other ends of the multiple sets of second distribution pipes connected to multiple sets of nozzles are uniformly fixed on the top of the second header, and the bottom end of the second header is fixed with a second automatic regulating valve, and the multiple sets of nozzles are evenly distributed on the top of the mounting plate, and the liquid surfaces of the ejection surfaces of multiple groups of nozzles are adjacent to each other closely and not less than the area of the bottom of the wafer body. The wafer body extends into the second liquid tank and is located directly above the mounting plate. The outer side of the second liquid tank is fixedly connected with the first liquid tank.

Further, the first positioning driver includes a first slot plate with the notch facing downwards, a threaded rod is provided inside the first slot plate, and the left and right ends of the threaded rod pass through the inner and outer sides of the first slot plate and the first slot plate The bearing is connected to the threaded rod in rotation. The inner side of the first slot plate is provided with a slider and its opposite ends are threaded through by the threaded rod. The rod end is fixedly connected with the output shaft of the second rotary driver, the outside of the second rotary driver is fixedly equipped with a fixed plate and it is fixed on the outside of the first slot plate, the slider is exposed outside the first slot plate, and the outside of the slider is connected to the second slot plate. The positioning driver is fixedly connected.

Further, the bottom ends of the first liquid tank and the second liquid tank are respectively provided with drain pipes which communicate with the interior of the first liquid tank and the second liquid tank respectively.

Further, there are multiple sets of the first leg and the second leg, and they are uniformly fixed on the bottom ends of the first liquid tank and the second leg respectively.

Further, the wafer body protrudes into the groove.

Further, the outer ends of the first automatic regulating valve and the second automatic regulating valve are respectively connected to suction pipes, and extraction equipment is connected between the suction pipes.

Further, the plurality of sets of first branch pipes are evenly distributed on the top of the first header.

Further, the inner space of the plate cavity of the expansion plate decreases gradually from top to bottom.

(3) Beneficial effects

Compared with the prior art, the present invention has the following beneficial effects:

By fixing the second positioning driver at the bottom of the first positioning driver and its bottom output shaft is fixed to the first rotary driver, the output shaft at the bottom of the first rotary driver is fixed to the rotary chuck, and the rotation is carried out through the bottom of the rotary chuck. The wafer body is clamped stably, and the wafer body is moved down and placed into the groove at the top of the second slot plate and close to the bottom of the groove, while the outer end of the first automatic regulating valve is connected to the suction pipe, and the extraction equipment is connected between the suction pipes , the suction pipe extracts the etching solution from the outside, and evenly divides it into the plate cavity of the expansion plate through the first shunt pipe, and sprays it evenly at the linear through hole, and at the same time, it is filled with the wafer driven by the first rotary driver in a diameter manner. Main body, the overall impact force and contact amount are the same, and the efficiency and precision are high; and the etching surface of the wafer main body is facing downward, and the etching reactant can directly come out without staying at the wafer main body; according to the above, the second groove The groove on the top of the plate forms a liquid retention space, so that the main body of the wafer can be immersed in the etching solution, which improves the utilization rate and further improves the etching efficiency; the overflow port provides excess etching solution discharge;

The cleaned wafer body is driven by the first position adjustment driver to move the wafer body to the right above the second liquid tank, and then move down to the nozzle, and the external cleaning liquid (such as; deionized water) is removed by the extraction device and the suction pipe. Extraction, sequentially through the second automatic regulating valve, the second header, and the second shunt pipe are sprayed upward at the nozzle to clean the wafer body, reduce excessive etching, improve precision, and have a simple structure; the spray cleaning method is adopted, and the strength is strong , high efficiency and further ensure the elution of etching reactants.

Description of drawings

Other characteristics, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

Fig. 1 is a structural representation of the present invention;

In the figure: the first position adjustment driver-1, the second position adjustment driver-2, the first rotation driver-3, the rotation chuck-4, the wafer main body-5, the first liquid tank-6, the first leg-7 , flushing mechanism-8, cleaning mechanism-9, first trough plate-11, threaded rod-12, slider-13, guide bar-14, second rotary driver-15, solid plate-16, second trough plate -81, overflow port-82, first support rod-83, linear through hole-84, expansion plate-85, first shunt pipe-86, first header-87, first automatic regulating valve-88, The second liquid tank-91, the second leg-92, the installation plate-93, the second support rod-94, the nozzle-95, the second shunt pipe-96, the second header-97, the second automatic regulating valve-98 .

Detailed ways

Please refer to Fig. 1, the present invention provides a kind of high-precision wafer chemical liquid etching device: comprising,

The first positioning driver 1 for driving displacement left and right, (as shown in the figure): the first positioning driver 1 includes a first groove plate 11 with the notch facing downward;

The inner side of the first slot plate 11 is provided with a threaded rod 12, the left and right ends of the threaded rod 12 run through the inside and outside sides of the first slot plate 11 and the first slot plate 11 is rotatably connected with the threaded rod 12 by bearings, providing the threaded rod 12 in the first slot The inner side of the board 11 is rotated and installed;

The inside of the first slot plate 11 is provided with a slide block 13 and its opposite ends are threaded through by a threaded rod 12. The inside of the first slot plate 11 is fixed with a guide bar 14 and is slidably connected with the outside of the slide block 13. Under the action of the thread, Under the limit action of the guide bar 14, the rotation of the threaded rod 12 can drive the slider 13 to move left and right;

One rod end of the threaded rod 12 is fixedly connected with the output shaft of the second rotary driver 15 (such as: motor, etc.), and the second rotary driver 15 is equipped with a fixed plate 16 and is fixed on the outside of the first slot plate 11 to provide A drive source for the rotation of the threaded rod 12;

The slider 13 is exposed on the outside of the first slot plate 11, and the outside of the slider 13 is fixedly connected with the second position adjustment driver 2, so as to drive the left and right displacement of the second position adjustment driver 2;

The second positioning driver 2 (such as: air cylinder, electric push rod, hydraulic cylinder, etc.) used for vertical height adjustment, the direction end of its output shaft is fixedly connected with the output shaft of the first positioning driver 1;

The direction end of the output shaft of the first rotary driver 3 (such as: a motor, etc.) used to provide the rotary drive function is fixedly connected to the output shaft of the second positioning driver 2;

The rotary chuck 4 used to fix the wafer has its jaw facing down, and its top end is fixedly connected with the output shaft of the first rotary driver 3;

Wafer body 5, which is fixed on the outside of spin chuck 4, wherein the etching surface of wafer body 5 faces downward;

The first liquid tank 6 for containing etching liquid is arranged below the wafer main body 5 and extends into the inside of the first liquid tank 6, wherein the bottom end of the first liquid tank 6 is provided with a drain pipe and its It communicates with the inside of the first liquid tank 6 to discharge the etching liquid;

The first leg 7 for support is fixed on the outside of the first liquid tank 6, wherein the first leg 7 is provided in multiple groups and is evenly fixed on the bottom end of the first liquid tank 6;

A liquid flushing mechanism 8 for impact etching the wafer body 5, which is fixedly connected to the first liquid tank 6;

A cleaning mechanism 9 for cleaning the residual etching solution of the wafer body 5, which is fixed on the outside of the first liquid tank 6;

Please refer to FIG. 1 , the liquid flushing mechanism 8 includes a second groove plate 81 with a groove at the top;

The outer side of the second slot plate 81 is provided with an overflow port 82 and it is provided with multiple groups, wherein the overflow ports 82 of multiple groups are arranged at uniform positions, and the aperture sizes can be different;

A first support rod 83 is fixed between the outside of the second tank plate 81 and the inside of the first liquid tank 6 to provide a stable support for the second tank plate 81. The first support rods 83 are provided with multiple groups and are evenly distributed on the second tank plate 81. The outer side of the slot plate 81;

The bottom end of the second slot plate 81 is provided with a linear through hole 84 and communicates with the groove for spraying liquid to the wafer main body 5;

The bottom end of the linear through hole 84 is provided with an expansion plate 85, the inner side of the expansion plate 85 is provided with a plate cavity and its communication is located at the bottom end of the linear through hole 84, the expansion plate 85 is provided with multiple groups and the shape formed at the top of the plate cavity is the same as that of the expansion plate 85. The linear through-holes 84 are the same to ensure that the ejection volume is uniform as a whole;

The bottom ends of the multiple sets of expansion plates 85 are respectively fixed with a first branch pipe 86, one end of which communicates with the plate cavity, and the other end communicates with one end of the first header 87, wherein the multiple sets of the first A shunt pipe 86 is evenly distributed on the top of the first header 87 to provide a uniform shunt effect;

The first header 87 (as shown in the figure) is fixed (for example, a through opening can be provided, and a sealing member is used to fill the gap after penetration, or welding, bonding, etc.) to penetrate the inner and outer sides of the first liquid tank 6;

The first header 87 can also be directly fixed on the outside of the first liquid tank 6 (not shown), and the first branch pipe 86 is arranged from the outside of the first liquid tank 6 to its top port.

The other end of the first header 87 is fixedly connected with a first automatic regulating valve 88 (pneumatic or electric drain pipe, etc.), which can prevent the etching solution in the groove from flowing back and save resources when closed.

Wherein, the wafer body 5 protrudes into the groove.

Wherein, the outer end of the first automatic regulating valve 88 is connected with a suction pipe, and the suction pipes are connected with extraction equipment (such as a liquid suction pump, etc.), and the suction pipe contacts and extracts the external etching solution.

Wherein, the inner space of the plate cavity of the expansion plate 85 gradually decreases from top to bottom to increase the impact force.

Please refer to FIG. 1, the cleaning mechanism 9 includes a second liquid tank 91 for containing etching liquid;

Wherein, a drain pipe is provided at the bottom of the second liquid tank 91 and communicates with the inside of the second liquid tank 91 to discharge the cleaning liquid;

The bottom end of the second liquid tank 91 is fixed with a second leg 92, wherein the second leg 92 is provided with multiple groups and is evenly fixed at the bottom end of the second leg 92 to improve the support stability;

The middle part of the second liquid tank 91 is provided with a mounting plate 93, and a second support rod 94 is fixed between the outside of the mounting plate 93 and the inboard of the second liquid tank 91, so that the position of the mounting plate 93 is fixed, and the second support rod 94 is provided with Multiple groups and they are evenly distributed on the outside of the mounting plate 93;

The top of the mounting plate 93 is fixed with a nozzle 95 and its outlet is upward, wherein the nozzle 95 is preferably an atomizing nozzle;

The nozzles 95 are provided with multiple groups and are fixedly connected to one end of the second branch pipe 96 respectively, and one end of the second branch pipe 96 connected to the nozzle 95 runs through the top and bottom ends of the mounting plate 93 to provide the connection liquid of the nozzle 95;

The other ends of the multiple sets of second distribution pipes 96 connected to multiple sets of nozzles 95 are evenly fixed on the top of the second header 97 to improve the uniformity of liquid flow;

The bottom end of the second header 97 is fixedly connected with a second automatic regulating valve 98 (such as pneumatic, electric drain pipe, etc.) to prevent backflow;

The second header 97 (as shown in the figure) is fixed (for example, a through opening can be provided, and a sealing member is used to fill the gap or weld, bond, etc.) after penetrating through the inner and outer sides of the first liquid tank 6;

The multiple groups of nozzles 95 are evenly distributed on the top of the mounting plate 93, and the liquid surfaces of the multiple groups of nozzles are adjacent to each other and not less than the area of the bottom of the wafer body 5, and multiple groups of nozzles 95 are set to spray. There is no gap in the range of the liquid surface and the range is not smaller than the area of the bottom end of the wafer body 5;

The wafer main body 5 protrudes into the second liquid tank 91 and is arranged directly above the mounting plate 93 , and the outer side of the second liquid tank 91 is fixedly connected with the first liquid tank 6 .

Wherein, the outer end of the second automatic regulating valve 98 is connected with a suction pipe, and the suction pipes are connected with extraction equipment (such as: a liquid suction pump, etc.), and the suction pipe contacts an external cleaning liquid (such as; deionized water) and extracts it.

It also includes a controller (not shown) connected to electricity, which is connected to the electrical components (the second adjustment driver 2 (when it is an air cylinder or a hydraulic cylinder, it is a liquid supply and air supply equipment), the first rotary driver 3, the second an automatic regulating valve 88, extraction device, second rotary drive 15).

Working principle: firstly, the high-efficiency wafer chemical liquid etching device is taken out and placed in the use position, and the first position adjustment driver 1 is placed at a high position above the first liquid tank 6;

Then, the external power supply is connected by the controller;

Next, the wafer main body 5 is placed on the spin chuck 4, and is driven down by the second positioning driver 2, so that the wafer main body 5 is placed in the groove at the top of the second slot plate 81 and placed near the bottom of the inner wall of the groove. , the suction pipe is placed at the position where the etching solution is extracted from the outside;

Afterwards, start the operation of the extraction equipment, and the etching solution can be extracted from the outside by the suction pipe, and then pass through the first automatic regulating valve 88 and the first header 87 in sequence, and then evenly flow into the plate cavity of the expansion plate 85 through the first shunt pipe 86 , the synchronous upper flow is in the shape of a line, and is evenly ejected at the linear through-hole 84, and ejected to the wafer main body 5, and at the same time, it is covered with the diameter of the wafer main body 5 driven by the first rotary driver. The overall impact force, contact The quantity is the same, the efficiency and precision are high;

According to the above, the etching surface of the wafer main body 5 faces downward, and the etching reactant can directly come out without staying at the wafer main body 5; and the groove at the top of the second groove plate 81 forms a liquid retention space, so that the wafer The etching surface of the main body 5 can be immersed in the etching solution, which improves the utilization rate and further improves the etching efficiency; the overflow port 82 provides the excess etching solution to be discharged to the first liquid tank 6, and is discharged in the drain pipe Etching solution (collecting parts can be set at the discharge position);

Finally, the cleaned wafer main body 5 is moved up to be higher than the first liquid tank 6 through the operation of the second position adjustment driver 2, and then operated by the second rotary driver 15 of the first position adjustment driver 1, which can be achieved by the threaded rod 12 Rotate, and make the slider 13 move left and right under the limit action of the guide bar 14;

Drive the wafer main body 5 to move to the right above the second liquid tank 91, and then move down close to the nozzle 95. The external cleaning liquid (such as; deionized water) is extracted by the extraction equipment and the suction pipe, and then passes through the second automatic adjustment valve 98 in turn. , the second manifold 97, and the second branch pipe 96 are ejected upward at the shower head 95 to clean the wafer body 5, reduce excessive etching, improve precision, and have a simple structure; the spray cleaning method is adopted, which has high strength, high efficiency and further Ensure that the etching reactants are washed out; the drain pipe is used to discharge the cleaning solution (the discharge position can be provided with a collecting part).

The control mode of the present invention is automatically controlled by a controller, and the control circuit of the controller can be realized through simple programming by those skilled in the art. The supply of power also belongs to common knowledge in this field, and the present invention is mainly used to protect mechanical devices , so the present invention will not explain the control method and circuit connection in detail.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and without departing from the spirit or fundamentals of the present invention. The present invention can be implemented in other specific forms without any specific features. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only includes an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (8)

1. A high-precision wafer chemical liquid etching device, characterized in that: comprising, The first position adjustment driver (1) used for driving displacement left and right; The second position adjustment driver (2) used for vertical height adjustment, which is fixedly connected with the output shaft of the first position adjustment driver (1); A first rotary driver (3) for providing a rotary drive function, which is fixedly connected to the output shaft of the second position adjustment driver (2); a rotary chuck (4), which is fixedly connected to the output shaft of the first rotary driver (3); The wafer main body (5), which is fixed on the outside of the rotary chuck (4), and the etching surface of the wafer main body (5) faces downward; A first liquid tank (6) for containing etching liquid, which is arranged under the wafer main body (5) and extends into the first liquid tank (6); The first leg (7) for support is fixed on the outside of the first liquid tank (6); A liquid flushing mechanism (8) for impact etching the wafer body (5), which is fixedly connected to the first liquid tank (6); A cleaning mechanism (9) for cleaning the residual etching solution of the wafer body (5), which is fixed on the outside of the first liquid tank (6); The liquid flushing mechanism (8) includes a second slot plate (81) with a groove on the top, and an overflow port (82) is provided on the outside of the second slot plate (81) and it is provided with multiple groups. The second slot plate ( 81) A first support rod (83) is fixed between the outer side and the inner side of the first liquid tank (6), and the bottom end of the second tank plate (81) is provided with a linear through hole (84) which communicates with the groove , the bottom end of the linear through hole (84) is provided with an expansion plate (85), the inner side of the expansion plate (85) is provided with a plate cavity and its connection is provided at the bottom end of the linear through hole (84), and the expansion plate (85) is provided with There are multiple groups and the shapes formed at the top of the plate cavity are the same as the linear through holes (84). The bottom ends of the expansion plates (85) of the multiple groups are respectively fixed with a first shunt tube (86) and one end of which is connected to the plate. cavity, and the other end is connected with one end of the first header (87), and the other end of the first header (87) is fixed with the first automatic regulating valve (88), and the linear through hole (84) is set on the wafer directly below the main body (5), and the length of the linear through hole (84) is not less than the diameter of the wafer main body (5); The cleaning mechanism (9) includes a second liquid tank (91), a second leg (92) is fixed at the bottom of the second liquid tank (91), and a mounting plate (93) is provided in the middle of the inner side of the second liquid tank (91). A second support rod (94) is fixed between the outside of the installation plate (93) and the inside of the second liquid tank (91), and a spray head (95) is fixed on the top of the installation plate (93) with its outlet facing upwards. The nozzles (95) are provided with multiple groups and are fixedly connected to one end of the second shunt pipe (96) respectively, and one end of the second shunt pipe (96) connected to the nozzle (95) runs through the top and bottom ends of the mounting plate (93). The other ends of the multiple sets of second shunt pipes (96) connected to multiple sets of nozzles (95) are evenly fixed on the top of the second header (97), and the bottom end of the second header (97) is fixed with the second automatic adjustment Valve (98), the plurality of groups of nozzles (95) are evenly distributed on the top of the mounting plate (93), and the liquid levels of the ejection surfaces of the plurality of groups of nozzles are all adjacent to each other and not smaller than the bottom of the wafer body (5) The wafer body (5) extends into the inner side of the second liquid tank (91) and is arranged directly above the mounting plate (93), and the outer side of the second liquid tank (91) is fixedly connected with the first liquid tank (6). 2. A high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the first position adjustment driver (1) includes a first slot plate (11) with the notch facing down, and the first A threaded rod (12) is provided on the inner side of a slot plate (11), and the left and right ends of the threaded rod (12) run through the inner and outer sides of the first slot plate (11) and the first slot plate (11) passes through the bearing and the threaded rod (12) Rotational connection, the inner side of the first slot plate (11) is provided with a slider (13) and its opposite ends are threaded through by threaded rods (12), and the inner side of the first slot plate (11) is fixed with a guide bar (14) and its It is slidingly connected with the outside of the slider (13), and one rod end of the threaded rod (12) is fixedly connected with the output shaft of the second rotary driver (15). It is fixed on the outside of the first slot plate (11), the slider (13) is exposed outside the first slot plate (11), and the outside of the slider (13) is fixedly connected with the second position adjustment driver (2). 3. A high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the bottom ends of the first liquid tank (6) and the second liquid tank (91) are respectively provided with drain pipes and They communicate with the inside of the first liquid tank (6) and the second liquid tank (91) respectively. 4. A high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the first leg (7) and the second leg (92) are respectively provided with multiple groups and are fixed evenly At the bottom of the first liquid tank (6) and the second leg (92). 5. The high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the wafer body (5) protrudes into the inner side of the groove. 6. A high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the outer ends of the first automatic regulating valve (88) and the second automatic regulating valve (98) are respectively connected to suction pipes, The extraction equipment is connected between the suction tubes. 7. The high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the multiple sets of first shunt tubes (86) are evenly distributed on the top of the first manifold (87). 8. The high-precision wafer chemical liquid etching device according to claim 1, characterized in that: the inner space of the plate cavity of the expansion plate (85) gradually decreases from top to bottom.

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