CN221141924U - Metal electroplating device for semiconductor device production - Google Patents

Abstract

The utility model discloses a metal electroplating device for semiconductor device production, which comprises an electroplating bath and a carrier for carrying a wafer; the electroplating bath is characterized in that a spray pipe for carrying out upper surface and lower surface on a wafer on a carrier is arranged in the electroplating bath, an installation seat is arranged in the electroplating bath, two ends of the spray pipe are rotatably connected with the installation seat through bearings, a plurality of spray holes are formed in the spray pipe, a circulating pump for circulating electroplating liquid is also arranged in the electroplating bath, and a liquid outlet end of the circulating pump is connected with one end of the spray pipe through a guide pipe; a swinging mechanism for driving the jet pipe to swing is arranged in the electroplating bath; the utility model carries out the spraying pipe on the upper surface and the lower surface of the wafer on the carrier, and drives the spraying pipe to swing by utilizing the swinging mechanism, thereby uniformly spraying the electroplating solution on the surface of the wafer, and further ensuring that the metal deposition thickness in the wafer is uniform.

Description

Metal electroplating device for semiconductor device production

Technical Field

The utility model relates to the technical field related to semiconductor manufacturing, in particular to a metal electroplating device for semiconductor device production.

Background

Currently, electroplating is a commonly used method for depositing metal films on a substrate during the fabrication of semiconductor devices.

In particular, in the prior packaging technology, copper columns, welding spots and the like are formed on a substrate by electroplating to realize interconnection of chip substrates, and the electroplating has the advantages of simple process, low cost, easiness in mass production and the like. In the mass production of wafer level packages, wafer plating is an important process step in chip fabrication; the existing electroplating equipment has poor metal electroplating effect and poor uniformity of the thickness of the metal deposit in the sheet.

Disclosure of utility model

The utility model provides a metal electroplating device for semiconductor device production, which aims to solve the defects of poor metal electroplating effect and poor uniformity of metal deposition thickness in a sheet of the conventional electroplating equipment in the prior art.

In order to solve the technical problems, the utility model provides the following technical scheme:

The utility model relates to a metal electroplating device for semiconductor device production, which comprises an electroplating bath and a carrier for carrying a wafer; the electroplating bath is characterized in that a spray pipe for carrying out upper surface and lower surface on a wafer on a carrier is arranged in the electroplating bath, an installation seat is arranged in the electroplating bath, two ends of the spray pipe are rotatably connected with the installation seat through bearings, a plurality of spray holes are formed in the spray pipe, a circulating pump for circulating electroplating liquid is also arranged in the electroplating bath, and a liquid outlet end of the circulating pump is connected with one end of the spray pipe through a guide pipe; the electroplating bath is internally provided with a swinging mechanism for driving the spray pipe to swing.

As a preferable technical scheme of the utility model, the swinging mechanism comprises a positioning disc arranged at one end of the jet flow pipe and a telescopic push rod which is arranged on the electroplating bath and does not sink into the electroplating liquid, and a connecting rod is hinged between the telescopic end of the telescopic push rod and the positioning disc.

As a preferable technical scheme of the utility model, a filter cartridge is arranged at the liquid inlet end of the circulating pump.

As a preferable technical scheme of the utility model, the filter cartridge comprises a filter housing with an opening at the upper end, a connecting pipe connected with a liquid inlet end of a circulating pump is arranged at the bottom of the filter housing, a filter cavity is arranged in the filter housing, and a filter screen cylinder is arranged in the filter cavity.

As a preferable technical scheme of the utility model, the inner end and the outer end of the filter screen cylinder are provided with inwards concave containing grooves.

The beneficial effects of the utility model are as follows:

The metal electroplating device for semiconductor device production comprises a spraying pipe which is arranged on the upper surface and the lower surface of a wafer on a carrier in an electroplating bath, and the spraying pipe is driven to swing by a swinging mechanism, so that electroplating liquid is uniformly sprayed on the surface of the wafer, the thickness of metal deposition in the wafer is uniform, the sprayed electroplating liquid has the stirring effect on the liquid of the whole electroplating bath, the consistency of the concentration of the electroplating liquid is ensured, and a good electroplating effect is achieved. The driving mechanism is arranged on one end of the jet flow pipe to position the disc, and a telescopic push rod which is arranged on the electroplating bath and is not immersed into the electroplating liquid is arranged at the telescopic end of the telescopic push rod, and a connecting rod is hinged between the telescopic end of the telescopic push rod and the positioning disc, so that the positioning disc is driven to swing through the connecting rod in the telescopic process of the telescopic push rod, and the jet flow pipe is driven to rotate, so that the swing of the jet flow pipe is realized, and the structure has the characteristics of simple structure and easiness in control.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view showing a structure of a metal plating apparatus for semiconductor device production according to the present utility model;

FIG. 2 is a schematic view showing a structure of a filter cartridge of a metal plating apparatus for semiconductor device production according to the present utility model;

Fig. 3 is a schematic view showing the structure of a filter housing of a metal plating apparatus for semiconductor device production according to the present utility model.

In the figure: 1. plating bath; 2. a jet pipe; 3. a mounting base; 4. a spray orifice; 5. a circulation pump; 6. a conduit; 7. a swinging mechanism; 8. positioning a disc; 9. a telescopic push rod; 10. a connecting rod; 11. a filter cartridge; 12. a filter housing; 13. a connecting pipe; 14. a filter chamber; 15. a filter screen cylinder; 16. a storage groove; 17. and a carrier.

Detailed Description

The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.

Examples: as shown in fig. 1, 2 and 3, the metal plating apparatus for semiconductor device production of the present utility model includes a plating tank 1 and a carrier 17 for carrying a wafer; the electroplating bath 1 is internally provided with a jet pipe 2 for carrying out upper surface and lower surface on a wafer on a carrier, an installation seat 3 is arranged in the electroplating bath 1, two ends of the jet pipe 2 are rotatably connected with the installation seat 3 through bearings, the jet pipe 2 is provided with a plurality of jet holes 4, the electroplating bath 1 is internally also provided with a circulating pump 5 for circulating electroplating liquid, and a liquid outlet end of the circulating pump 5 is connected with one end of the jet pipe 2 through a guide pipe 6; the electroplating bath 1 is internally provided with a swinging mechanism 7 for driving the spray pipe 2 to swing. The spraying pipe 2 for carrying out upper surface and lower surface on the wafer on the carrier is arranged in the electroplating bath, and the swinging mechanism 7 is utilized to drive the spraying pipe 2 to swing, so that electroplating liquid is uniformly sprayed on the surface of the wafer, metal deposition thickness in the wafer is uniform, the sprayed electroplating liquid has the effect of stirring the liquid of the whole electroplating bath, consistency of electroplating liquid concentration is ensured, and good electroplating effect is achieved.

The swinging mechanism 7 comprises a positioning disc 8 arranged at one end of the jet flow pipe 2 and a telescopic push rod 9 arranged on the electroplating bath 1 and not immersed in the electroplating liquid, and a connecting rod 10 is hinged between the telescopic end of the telescopic push rod 9 and the positioning disc 8. In the telescopic process of the telescopic push rod 9, the connecting rod 10 drives the positioning disc 8 to swing, and then drives the spray pipe 2 to rotate, so that the swing of the spray pipe 2 is realized, and the structure has the characteristics of simple structure and easy control.

Wherein, the feed liquor end of circulating pump 5 is equipped with cartridge filter 11. To filter impurities in the electroplating liquid in the circulating process

The filter cartridge 11 includes a filter housing 12 with an opening at an upper end, a connecting pipe 13 connected with a liquid inlet end of the circulating pump 5 is disposed at a bottom of the filter housing 12, a filter cavity 14 is disposed in the filter housing 12, and a filter screen cylinder 15 is disposed in the filter cavity. The inside and outside tip of filter screen section of thick bamboo 15 is equipped with the storage tank 16 of inwards concave yield, so in the filtration process, the impurity that filters the production can directly receive in storage tank, and be convenient for follow-up clearance, also can not cause secondary pollution to the plating solution simultaneously.

During operation, the metal electroplating device for semiconductor device production is provided with the spray pipe 2 for carrying out upper surface and lower surface on the wafer on the carrier in the electroplating bath, and the swing mechanism 7 is utilized for driving the spray pipe 2 to swing, so that electroplating liquid is uniformly sprayed on the surface of the wafer, the thickness of metal deposition in the wafer is uniform, the sprayed electroplating liquid plays a role in stirring the liquid of the whole electroplating bath, the consistency of the concentration of the electroplating liquid is ensured, and a good electroplating effect is achieved. The driving mechanism is arranged at one end of the jet pipe 2 to position the disc 8, and a telescopic push rod 9 which is arranged on the electroplating bath and is not immersed in the electroplating liquid is arranged at the telescopic end of the telescopic push rod 9, and a connecting rod 10 is hinged between the telescopic push rod 9 and the positioning disc 8, so that the positioning disc 8 is driven to swing through the connecting rod 10 in the telescopic push rod 9 stretching process, and the jet pipe 2 is driven to rotate, so that the swing of the jet pipe 2 is realized, and the structure has the characteristics of simple structure and easiness in control.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (5)

1. A metal plating apparatus for semiconductor device production, comprising a plating tank (1) and a carrier (17) for carrying a wafer; the method is characterized in that: the electroplating bath is characterized in that a jet pipe (2) for carrying out upper surface and lower surface on a wafer on a carrier is arranged in the electroplating bath (1), an installation seat (3) is arranged in the electroplating bath (1), two ends of the jet pipe (2) are rotationally connected with the installation seat (3) through bearings, a plurality of jet holes (4) are formed in the jet pipe (2), a circulating pump (5) for circulating electroplating liquid is further arranged in the electroplating bath (1), and a liquid outlet end of the circulating pump (5) is connected with one end of the jet pipe (2) through a guide pipe (6); a swinging mechanism (7) for driving the spray pipe (2) to swing is arranged in the electroplating bath (1).

2. A metal plating apparatus for semiconductor device production according to claim 1, wherein the swinging mechanism (7) comprises a positioning disc (8) arranged at one end of the jet pipe (2), and a telescopic push rod (9) arranged on the plating tank (1) and not immersed in the plating solution, and a connecting rod (10) is hinged between the telescopic end of the telescopic push rod (9) and the positioning disc (8).

3. A metal plating apparatus for semiconductor device production according to claim 1, wherein the liquid inlet end of the circulation pump (5) is provided with a filter cartridge (11).

4. A metal plating apparatus for semiconductor device production according to claim 3, wherein the filter cartridge (11) comprises a filter housing (12) with an opening at an upper end, and a connection pipe (13) connected with a liquid inlet end of the circulation pump (5) is provided at a bottom of the filter housing (12), and a filter chamber (14) is provided inside the filter housing (12), and a filter screen cylinder (15) is provided inside the filter chamber.

5. The metal plating apparatus for semiconductor device production according to claim 4, wherein the filter screen cylinder (15) is provided at its inner and outer end portions with an inwardly recessed receiving groove (16).