CN116083853A - Polypropylene metallized film and processing technology thereof - Google Patents
Polypropylene metallized film and processing technology thereof Download PDFInfo
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- CN116083853A CN116083853A CN202211594429.9A CN202211594429A CN116083853A CN 116083853 A CN116083853 A CN 116083853A CN 202211594429 A CN202211594429 A CN 202211594429A CN 116083853 A CN116083853 A CN 116083853A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/10—Homopolymers or copolymers of propene
- C08J2323/12—Polypropene
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
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- Mechanical Engineering (AREA)
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- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a polypropylene metallized film and a processing technology thereof, wherein the processing technology of the polypropylene metallized film comprises the following steps: immersing the polypropylene film in an oxidant solution for oxidation pretreatment, immersing the polypropylene film in a metal oxide precursor solution, taking out the polypropylene film, and performing damp-heat treatment to obtain a surface-modified polypropylene film; and forming a metal layer on the modified surface of the surface-modified polypropylene film to obtain the polypropylene metallized film. According to the polypropylene metallized film and the processing technology thereof, the metal layer is formed on the polypropylene film after the surface modification of the polypropylene film, so that the adhesiveness and the compactness of the metal layer on the polypropylene film are greatly improved, the problem of poor binding force between a Zn metal film and the polypropylene film is solved, and the oxidation of Al is prevented, so that the excessively rapid capacity decay of a pure Al metal film capacitor under high pressure is avoided.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a polypropylene metallized film and a processing technology thereof.
Background
The metallized film capacitor is formed by using a material such as a polypropylene film or a polyester film as a medium, attaching Zn and/or Al to the film surface by vacuum deposition to form an electrode, and winding or laminating the electrode.
The most successful commercial metallized film for capacitor at present uses biaxially oriented polypropylene film as base film and Al as vapor plating metal layer, because its adhesive force is relatively good, the process is easy to control, and the surface of Al is oxidized to generate compact Al 2 O 3 The inner layer is prevented from being oxidized continuously, so that the Al-plated metallized film is widely applied. However, the corresponding capacitor works under the condition of high alternating voltage and high current, especially at the edge part with high electric field strength, al 2 O 3 Resulting in a rapid increase in capacitor capacity loss. Although the metal film of Zn instead of Al is made into a capacitor, the capacity loss and the loss are negligible, but the adhesion is poor, the manufacturing process is not easy to control, and the capacitor is easier to oxidize. If the bonding strength and the compactness between the polypropylene film and the Al and/or Zn metal coating can be improved, and the oxidation of Al and/or Zn is prevented, not only can the capacity loss and the loss be avoided, but also the service life of the capacitor can be effectively prolonged.
Disclosure of Invention
Based on the technical problems in the background technology, the invention provides the polypropylene metallized film and the processing technology thereof, and the metal layer is formed on the polypropylene metallized film after the surface modification of the polypropylene film, so that the adhesiveness and the compactness of the metal layer on the polypropylene film are greatly improved, the problem of poor bonding force between a Zn metal film and the polypropylene film is solved, and the oxidation of Al is prevented, so that the excessively rapid attenuation of the capacity of a pure Al metal film capacitor under high pressure is avoided.
The invention provides a processing technology of a polypropylene metallized film, which comprises the following steps:
s1, immersing a polypropylene film in an oxidant solution for oxidation pretreatment, immersing the polypropylene film in a metal oxide precursor solution, taking out the polypropylene film, and performing damp-heat treatment to obtain a surface-modified polypropylene film;
s2, forming a metal layer on the modified surface of the surface-modified polypropylene film to obtain the polypropylene metallized film.
Preferably, in step S1, the polypropylene film is a biaxially oriented polypropylene film, and the thickness thereof is preferably 3-20 μm.
Preferably, in the step S1, the oxidant solution is potassium permanganate solution with the concentration of 0.1-0.3mol/L.
Preferably, in step S1, the temperature of the oxidation pretreatment is 60-80 ℃ and the time is 3-6h.
Preferably, in step S1, the metal oxide precursor solution is SiO 2 、Al 2 O 3 Or TiO 2 At least one of the precursor solutions;
preferably, the metal oxide precursor solution is an alcoholic solution of ethyl orthosilicate, aluminum isopropoxide or tetrabutyl titanate.
Preferably, in step S1, the temperature of the wet heat treatment is 90-120 ℃ and the relative humidity is 75-95%.
Preferably, in step S2, the metal layer is at least one of an Al layer or a Zn layer.
Preferably, in step S2, the metal layer is formed by vacuum evaporation or sputtering.
The invention also provides a polypropylene metallized film which is prepared by the processing technology.
The invention also provides a metallized film capacitor which comprises the polypropylene metallized film.
In the invention, the polypropylene film is immersed into the oxidant solution for oxidation pretreatment, and the strong oxidizing property of the oxidant is utilized to carry out surface modification on the polypropylene film, so that polar groups such as hydroxyl (-OH), carboxyl (-COOH) and the like are generated on the surface of the polypropylene film, thereby enhancing the interface bonding capability with the metal oxide precursor solution; then, when the polypropylene film is immersed in the metal oxide precursor solution and subjected to damp-heat treatment, polar groups such as hydroxyl (-OH), carboxyl (-COOH) and the like generated on the surface of the polypropylene film can ensure that the metal oxide precursor solution is hydrolyzed into metal oxide particles on the surface of the polypropylene film, so that a network-like nano porous layer is formed; and then evaporating or sputtering the modified surface of the polypropylene film, and because the network-shaped nano porous layer has gaps, the deposition growth of metal atoms can be improved to a larger specific surface area, so that the polypropylene film and the metal layer are combined more tightly, and the formation of a compact metal layer is facilitated.
Compared with the prior art that a metal layer is simply formed on the surface of a polypropylene film, the invention effectively improves the bonding strength and the compactness between the polypropylene film and the metal layer, and greatly improves the antioxidation capability of the obtained metal layer, and the obtained metallized film not only can prevent Al from oxidizing so as to avoid the excessively rapid decay of the capacity of a pure Al metal film capacitor under high pressure, but also can effectively improve the service life of the metallized film capacitor.
Detailed Description
The technical scheme of the present invention will be described in detail by means of specific examples, which should be explicitly set forth for illustration, but should not be construed as limiting the scope of the present invention.
Example 1
The processing technology of the polypropylene metallized film comprises the following steps:
s1, immersing a biaxially oriented polypropylene film (with the thickness of 8 mu m) in a sulfuric acid aqueous solution of potassium permanganate (with the concentration of potassium permanganate being 0.2mol/L and the concentration of sulfuric acid being 0.2 mol/L), treating for 5 hours in a water bath at 60 ℃, taking out the polypropylene film, cleaning the polypropylene film by using an oxalic acid solution (with the concentration of oxalic acid being 0.1 mol/L), cleaning the polypropylene film by using deionized water until the surface is cleaned, and drying the polypropylene film in an oven at 80 ℃ to obtain a pretreated polypropylene film;
immersing the pretreated polypropylene film in an ethanol solution containing ethyl orthosilicate (the volume ratio of the ethyl orthosilicate to the ethanol is 1:3), taking out the polypropylene film after immersing for 0.5h, aging for 10h at room temperature, placing the polypropylene film in a high-low temperature alternating wet heat box, carrying out wet heat treatment for 2h at the temperature of 110 ℃ and the relative humidity of 80%, taking out and drying to obtain the polypropylene film with the surface modified;
s2, fixing the surface-modified polypropylene film in a vacuum coating machine, taking the modified surface of the surface-modified polypropylene film as a plating surface to deposit an Al metal layer, wherein the wire feeding speed of Al is 400mm/min, the temperature of an Al evaporation boat is 630 ℃, al is changed into Al vapor from Al melt, and the aluminum metal layer (with the thickness of 0.2 mu m) is formed on the modified surface of the polypropylene film by cooling, so that the polypropylene metallized film is obtained.
Example 2
The processing technology of the polypropylene metallized film comprises the following steps:
s1, immersing a biaxially oriented polypropylene film (with the thickness of 8 mu m) in a sulfuric acid aqueous solution of potassium permanganate (with the concentration of potassium permanganate being 0.2mol/L and the concentration of sulfuric acid being 0.2 mol/L), treating for 5 hours in a water bath at 60 ℃, taking out the polypropylene film, cleaning the polypropylene film by using an oxalic acid solution (with the concentration of oxalic acid being 0.1 mol/L), cleaning the polypropylene film by using deionized water until the surface is cleaned, and drying the polypropylene film in an oven at 80 ℃ to obtain a pretreated polypropylene film;
immersing the pretreated polypropylene film in an ethanol solution containing ethyl orthosilicate (the volume ratio of the ethyl orthosilicate to the ethanol is 1:3), taking out the polypropylene film after immersing for 0.5h, aging for 10h at room temperature, placing the polypropylene film in a high-low temperature alternating wet heat box, carrying out wet heat treatment for 2h at the temperature of 110 ℃ and the relative humidity of 80%, taking out and drying to obtain the polypropylene film with the surface modified;
s2, fixing the surface-modified polypropylene film in a vacuum coating machine, taking the modified surface of the surface-modified polypropylene film as a plating surface to deposit Al and Zn metal layers, wherein the wire feeding speed of Al is 420mm/min, the temperature of an Al evaporation boat is 650 ℃, the temperature of a Zn evaporation boat is 680 ℃, al and Zn are respectively changed into Al vapor and Zn vapor from Al and Zn melt, and further cooling the modified surface of the polypropylene film to form an aluminum zinc metal layer (the thickness is 0.1 mu m), thus obtaining the polypropylene metallized film.
Example 3
The processing technology of the polypropylene metallized film comprises the following steps:
s1, immersing a biaxially oriented polypropylene film (with the thickness of 8 mu m) in a sulfuric acid aqueous solution of potassium permanganate (with the concentration of potassium permanganate being 0.2mol/L and the concentration of sulfuric acid being 0.2 mol/L), treating for 5 hours in a water bath at 60 ℃, taking out the polypropylene film, cleaning the polypropylene film by using an oxalic acid solution (with the concentration of oxalic acid being 0.1 mol/L), cleaning the polypropylene film by using deionized water until the surface is cleaned, and drying the polypropylene film in an oven at 80 ℃ to obtain a pretreated polypropylene film;
immersing the pretreated polypropylene film in an ethanol solution (the volume ratio of tetraethoxysilane to ethanol is 1:3) dissolved with tetrabutyl titanate for 0.5h, taking out the polypropylene film, aging for 10h at room temperature, placing the polypropylene film in a high-low temperature exchange wet heat box, carrying out wet heat treatment for 2h at the temperature of 100 ℃ and the relative humidity of 80%, taking out and drying to obtain the polypropylene film with the surface modified;
s2, fixing the surface-modified polypropylene film in a vacuum coating machine, taking the modified surface of the surface-modified polypropylene film as a plating surface to deposit an Al metal layer, wherein the wire feeding speed of Al is 400mm/min, the temperature of an Al evaporation boat is 630 ℃, al is changed into Al vapor from Al melt, and the aluminum metal layer (with the thickness of 0.2 mu m) is formed on the modified surface of the polypropylene film by cooling, so that the polypropylene metallized film is obtained.
Comparative example 1
A polypropylene metallized film comprises the following processing technology:
and (3) carrying out corona discharge treatment on the biaxially oriented polypropylene film (with the thickness of 8 mu m), then placing the biaxially oriented polypropylene film in a vacuum coating machine for fixing, taking the modified surface of the polypropylene film subjected to the corona treatment as a plating surface for plating an Al metal layer, wherein the wire feeding speed of Al is 400mm/min, the temperature of an Al evaporation boat is 630 ℃, al is changed into Al vapor from Al melt, and then cooling the modified surface of the polypropylene film to form an aluminum metal layer (with the thickness of 0.2 mu m), thus obtaining the polypropylene metallized film.
Comparative example 2
A polypropylene metallized film comprises the following processing technology:
and (3) carrying out corona discharge treatment on the biaxially oriented polypropylene film (with the thickness of 8 mu m), then placing the biaxially oriented polypropylene film in a vacuum coating machine for fixing, taking the modified surface of the polypropylene film subjected to the corona treatment as a plating surface for plating Al and Zn metal layers by evaporation, wherein the wire feeding speed of Al is 420mm/min, the temperature of an Al evaporation boat is 650 ℃, the temperature of a Zn evaporation boat is 680 ℃, al and Zn are respectively changed into Al vapor and Zn vapor from Al and Zn melt, and further, the modified surface of the polypropylene film is cooled to form an aluminum zinc metal layer (with the thickness of 0.1 mu m), thus obtaining the polypropylene metallized film.
The polypropylene metallized films obtained in examples 1-3 and comparative examples 1-2 were tested for sheet resistance change under a hot and humid environment (temperature 80 ℃ C., relative humidity 80%) to evaluate oxidation resistance of the polypropylene metallized films and service life of the corresponding metallized film capacitors.
Table 1 law of sheet resistance change of the polypropylene metallized films of examples and comparative examples
From table 1 above, compared with the comparative example, the polypropylene metallized film in the example has significantly reduced change of the sheet resistance in the high temperature and high humidity environment, and the bonding strength and the compactness between the polypropylene metallized film and the metal layer in the example are significantly improved, which can effectively prevent the corrosion of the metal film by the medium such as water, oxygen, etc., and improve the service life of the metallized film capacitor.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (10)
1. The processing technology of the polypropylene metallized film is characterized by comprising the following steps:
s1, immersing a polypropylene film in an oxidant solution for oxidation pretreatment, immersing the polypropylene film in a metal oxide precursor solution, taking out the polypropylene film, and performing damp-heat treatment to obtain a surface-modified polypropylene film;
s2, forming a metal layer on the modified surface of the surface-modified polypropylene film to obtain the polypropylene metallized film.
2. The process for producing a metallized polypropylene film according to claim 1, wherein in step S1, the polypropylene film is biaxially oriented polypropylene film having a thickness of preferably 3 to 20 μm.
3. The process for producing a metallized polypropylene film according to any one of claims 1 to 2, wherein in step S1, the oxidizing agent solution is a potassium permanganate solution having a concentration of 0.1 to 0.3mol/L.
4. A process for the production of metallized polypropylene films according to claim 3, wherein in step S1, the temperature of the oxidation pretreatment is 60-80 ℃ for 3-6 hours.
5. The process for producing a metallized polypropylene film according to any one of claims 1 to 4, wherein in step S1, the metal oxide precursor solution is SiO 2 、Al 2 O 3 Or TiO 2 At least one of the precursor solutions;
preferably, the metal oxide precursor solution is an alcoholic solution of ethyl orthosilicate, aluminum isopropoxide or tetrabutyl titanate.
6. The process for producing a metallized polypropylene film according to any one of claims 1 to 5, wherein in step S1, the wet heat treatment is carried out at a temperature of 90 to 120 ℃ and a relative humidity of 75 to 95%.
7. The process for producing a metallized polypropylene film according to any one of claims 1 to 6, wherein in step S2, the metal layer is at least one of Al or Zn layer.
8. The process of claim 7, wherein in step S2, the metal layer is formed by vacuum evaporation or sputtering.
9. A polypropylene metallized film prepared by the process of any one of claims 1-8.
10. A metallized film capacitor comprising the polypropylene metallized film of claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211594429.9A CN116083853B (en) | 2022-12-13 | 2022-12-13 | Polypropylene metallized film and processing technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211594429.9A CN116083853B (en) | 2022-12-13 | 2022-12-13 | Polypropylene metallized film and processing technology thereof |
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| CN116083853B CN116083853B (en) | 2024-09-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118667211A (en) * | 2024-08-21 | 2024-09-20 | 宁波大东南万象科技有限公司 | Copper-zinc polypropylene film, preparation method and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB953663A (en) * | 1961-03-13 | 1964-03-25 | Ici Ltd | Improvements in or relating to laminates |
| DE4023619A1 (en) * | 1990-07-25 | 1991-09-19 | Daimler Benz Ag | Metallising electrically insulating substrate surface - by first impregnating with oxidant and gas phase deposition of conductive polymer, esp. used for fibre material |
| CN102418090A (en) * | 2011-11-07 | 2012-04-18 | 深圳市欣天科技有限公司 | Surface metallization preparation method of resin-based composite material capable of being molded by die pressing |
| CN105869890A (en) * | 2016-05-23 | 2016-08-17 | 郑州航空工业管理学院 | Evaporation technology of metallized polypropylene film dielectric capacitor |
| CN112201389A (en) * | 2020-09-30 | 2021-01-08 | 浙江长宇新材料有限公司 | Conductive film replacing aluminum foil and preparation method thereof |
-
2022
- 2022-12-13 CN CN202211594429.9A patent/CN116083853B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB953663A (en) * | 1961-03-13 | 1964-03-25 | Ici Ltd | Improvements in or relating to laminates |
| DE4023619A1 (en) * | 1990-07-25 | 1991-09-19 | Daimler Benz Ag | Metallising electrically insulating substrate surface - by first impregnating with oxidant and gas phase deposition of conductive polymer, esp. used for fibre material |
| CN102418090A (en) * | 2011-11-07 | 2012-04-18 | 深圳市欣天科技有限公司 | Surface metallization preparation method of resin-based composite material capable of being molded by die pressing |
| CN105869890A (en) * | 2016-05-23 | 2016-08-17 | 郑州航空工业管理学院 | Evaporation technology of metallized polypropylene film dielectric capacitor |
| CN112201389A (en) * | 2020-09-30 | 2021-01-08 | 浙江长宇新材料有限公司 | Conductive film replacing aluminum foil and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118667211A (en) * | 2024-08-21 | 2024-09-20 | 宁波大东南万象科技有限公司 | Copper-zinc polypropylene film, preparation method and application |
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