CN116062758A - A boron, phosphorus impurity adsorption device - Google Patents
A boron, phosphorus impurity adsorption device Download PDFInfo
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- CN116062758A CN116062758A CN202211362439.XA CN202211362439A CN116062758A CN 116062758 A CN116062758 A CN 116062758A CN 202211362439 A CN202211362439 A CN 202211362439A CN 116062758 A CN116062758 A CN 116062758A
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- 239000012535 impurity Substances 0.000 title claims abstract description 111
- 229910052796 boron Inorganic materials 0.000 title claims abstract description 76
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 68
- 239000011574 phosphorus Substances 0.000 title claims abstract description 67
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 48
- 238000011049 filling Methods 0.000 claims abstract description 92
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- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
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- KCWYOFZQRFCIIE-UHFFFAOYSA-N ethylsilane Chemical compound CC[SiH3] KCWYOFZQRFCIIE-UHFFFAOYSA-N 0.000 description 1
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- 150000002431 hydrogen Chemical class 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/08—Compounds containing halogen
- C01B33/107—Halogenated silanes
- C01B33/10778—Purification
- C01B33/10794—Purification by forming addition compounds or complexes, the reactant being possibly contained in an adsorbent
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/03—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition of silicon halides or halosilanes or reduction thereof with hydrogen as the only reducing agent
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Separation Of Gases By Adsorption (AREA)
Abstract
本发明涉及一种硼、磷杂质吸附装置,该吸附装置包括:筒体,所述筒体内设置有挡板;第一填充腔、第二填充腔,所述第一填充腔以及所述第二填充腔设置于所述筒体内且分别位于所述挡板的两端;其中,所述第一填充腔填充有用于去除硼杂质的第一吸附剂,所述第二填充腔填充有用于去除磷杂质的第二吸附剂。本技术方案的硼、磷杂质吸附装置通过在筒体内设置分隔的第一填充腔、第二填充腔,第一填充腔、第二填充腔分别填充有用于去除硼杂质的第一吸附剂、用于去除磷杂质的第二吸附剂,使本装置可同时对气体中的硼、磷杂质吸附去除,增加了装置的除杂种类,使装置的适用范围更广。
The present invention relates to a boron and phosphorus impurity adsorption device. The adsorption device comprises: a cylinder, a baffle is arranged inside the cylinder; a first filling chamber, a second filling chamber, the first filling chamber and the second The filling chambers are arranged in the cylinder and are respectively located at both ends of the baffle; wherein, the first filling chamber is filled with a first adsorbent for removing boron impurities, and the second filling chamber is filled with an adsorbent for removing phosphorus impurities. Secondary adsorbent for impurities. The boron and phosphorus impurity adsorption device of this technical solution is provided with a separated first filling cavity and a second filling cavity in the cylinder, and the first filling cavity and the second filling cavity are respectively filled with the first adsorbent for removing boron impurities, The second adsorbent for removing phosphorus impurities enables the device to adsorb and remove boron and phosphorus impurities in the gas at the same time, increasing the types of impurities removed by the device and making the device applicable to a wider range.
Description
技术领域technical field
本发明涉及多晶硅技术领域,具体涉及一种硼、磷杂质吸附装置。The invention relates to the technical field of polysilicon, in particular to a boron and phosphorus impurity adsorption device.
背景技术Background technique
氯硅烷作为生产多晶硅的原料,在进入还原炉与氢气反应制得多晶硅之前要经过严格的提纯过程,初始原料氯硅烷中杂质种类和含量较多,经过初步精馏提纯得到氯硅烷的精制料中。但氯硅烷精制料的提纯主要是除去其中的B、P化合物杂质,对于氯硅烷精制料中难以除去的硼、磷杂质,主要以PCl3、BCl3、PCl5等多种形式存在。Chlorosilane is used as a raw material for the production of polysilicon. Before it enters the reduction furnace and reacts with hydrogen to produce polysilicon, it must undergo a strict purification process. The initial raw material chlorosilane contains many types and contents of impurities. . However, the purification of chlorosilane refined materials is mainly to remove the B and P compound impurities. For the boron and phosphorus impurities that are difficult to remove in chlorosilane refined materials, they mainly exist in various forms such as PCl 3 , BCl 3 , and PCl 5 .
现行国内大部分多晶硅生产企业通常是采用精馏的方式去除杂质,大概的工艺流程为初分-粗馏-精馏的形式多塔耦合的方式分离纯化三氯氢硅,粗分塔将三氯氢硅和四氯氢硅基本分开,可以去除杂质的大部分,使其降到较低的浓度。另外有些企业通过添加有机物(芳香醛类、固体碱等)作为精馏助剂,将杂质转化为高沸物,通过多级精馏方式分离四氯化硅中的杂质,达到高效去除如铜、铁、锰等金属杂质。但硼、磷化合物杂质的沸点等性质与四氯化硅、SiHCl3近似,分离系数小,与SiHCl3相对挥发度接近于1.0,且与氯硅烷体系沸点十分接近,因此很难通过单纯精馏的方法除去。因此需要继续用络合吸附等方法来除硼、磷等杂质。At present, most polysilicon production enterprises in China usually use rectification to remove impurities. The general process flow is primary fractionation-crude distillation-rectification and multi-column coupling to separate and purify trichlorosilane. Hydrogen silicon and tetrachlorosilane are basically separated, which can remove most of the impurities and bring them down to lower concentrations. In addition, some enterprises convert impurities into high boiling substances by adding organic matter (aromatic aldehydes, solid alkali, etc.) as rectification aids, and separate impurities in silicon tetrachloride through multi-stage rectification to achieve efficient removal such as copper, Iron, manganese and other metal impurities. However, the properties such as the boiling point of boron and phosphorus compound impurities are similar to those of silicon tetrachloride and SiHCl 3 , the separation coefficient is small, the relative volatility with SiHCl 3 is close to 1.0, and the boiling point of the chlorosilane system is very close, so it is difficult to pass simple rectification method to remove. Therefore, it is necessary to continue to use methods such as complex adsorption to remove impurities such as boron and phosphorus.
中国专利CN202110038842.6公开了一种基于超细氮化物转化-净化冶金硅中杂质硼的方法,将粒度为纳米级的氮化物粉末加入硅熔体中,纳米级氮化物粉末对硅中杂质硼进行吸附、氮化处理,之后将反应后的上述硅熔体进行电磁净化处理,进而将电磁净化后得到的周围富含氮化物颗粒的多晶硅进行分离处理;使用的氮化物为纳米级粉末,具有比较面积大的优异特性,可以有效吸附B杂质并实现B杂质的氮化,形成氮化物颗粒;电磁净化可将氮化物颗粒富集到硅熔体周围,从而实现氮化物和硅熔体的有效分离,即实现硅中去除硼杂质。Chinese patent CN202110038842.6 discloses a method based on ultra-fine nitride conversion-purification of impurity boron in metallurgical silicon. The nitride powder with a particle size of nanometer is added to the silicon melt. Adsorption and nitriding treatment are carried out, and then the above-mentioned silicon melt after the reaction is subjected to electromagnetic purification treatment, and then the polycrystalline silicon rich in nitride particles obtained after electromagnetic purification is separated; the nitrides used are nano-scale powders with The excellent characteristics of relatively large area can effectively adsorb B impurities and realize the nitriding of B impurities to form nitride particles; electromagnetic purification can enrich nitride particles around the silicon melt, so as to realize the effective separation of nitride and silicon melt Separation, that is, the removal of boron impurities from silicon.
上述专利涉及到的冶金硅中杂质硼的方法,此做法通过吸附B杂质并实现B杂质的氮化,形成氮化物颗粒后分离,实现硅中去除硼杂质。但是该方法通过单一的络合吸附剂而对硼杂质进行吸附,其只能达到单一的除硼效果。The above-mentioned patent involves the method of metallurgical boron impurity in silicon. This method realizes the removal of boron impurity in silicon by adsorbing B impurity and realizing the nitriding of B impurity, forming nitride particles and separating them. However, this method uses a single complex adsorbent to adsorb boron impurities, which can only achieve a single boron removal effect.
此外,中国专利CN202111143137.9公开了一种低污染高纯度电子级多晶硅提纯方法,通过在第一精馏塔与第二精馏塔之间设置4A分子筛吸附柱,能够将其中大部分的乙烯去除,同时将小部分未去除的乙烯转化为乙基硅烷,并通过第二精馏塔一并去除,减少了后续需要设置的精馏塔,降低了生产成本与能耗,后续通过分子筛混合组合填充吸附柱对后续的氢化物以及有机大分子类物质进行彻底去除。In addition, Chinese patent CN202111143137.9 discloses a low-pollution, high-purity electronic-grade polysilicon purification method. By installing a 4A molecular sieve adsorption column between the first rectification tower and the second rectification tower, most of the ethylene can be removed. At the same time, a small part of the unremoved ethylene is converted into ethyl silane, which is removed through the second rectification tower, which reduces the need for subsequent rectification towers, reduces production costs and energy consumption, and is subsequently filled by molecular sieve mixing and combination The adsorption column completely removes subsequent hydrides and organic macromolecules.
同样地,上述专利涉及到的低污染高纯度电子级多晶硅提纯方法通过分子筛混合组合填充吸附柱对后续的氢化物以及有机大分子类物质进行彻底去除。该方法通过单一的络合吸附剂从而实现氢杂质吸附,其也只能达到单一的除杂效果。Similarly, the low-pollution, high-purity electronic-grade polysilicon purification method involved in the above-mentioned patent completely removes subsequent hydrides and organic macromolecular substances through molecular sieve mixing and packing adsorption columns. This method realizes hydrogen impurity adsorption through a single complexed adsorbent, which can only achieve a single impurity removal effect.
综上所述,目前现有的络合吸附都是通过单一的络合吸附剂装填在固定床装置内,从而实现吸附杂质,其只能达到单一的除硼或者除磷的效果。To sum up, at present, the existing complex adsorption is packed in a fixed bed device through a single complex adsorbent, so as to realize the adsorption of impurities, which can only achieve a single boron or phosphorus removal effect.
发明内容Contents of the invention
本发明的目的是提出一种硼、磷杂质吸附装置,旨在解决现有的络合吸附装置仅能单独去除硼杂质或磷杂质,产品除杂效果单一的技术问题。The purpose of the present invention is to propose a boron and phosphorus impurity adsorption device, aiming to solve the technical problem that the existing complex adsorption device can only remove boron impurities or phosphorus impurities alone, and the product has a single effect of removing impurities.
为实现上述目的,本发明提出一种硼、磷杂质吸附装置,包括:In order to achieve the above object, the present invention proposes a boron, phosphorus impurity adsorption device, comprising:
筒体,所述筒体内设置有挡板;A cylinder, the cylinder is provided with a baffle;
第一填充腔、第二填充腔,所述第一填充腔以及所述第二填充腔设置于所述筒体内且分别位于所述挡板的两端;其中,A first filling cavity and a second filling cavity, the first filling cavity and the second filling cavity are arranged in the cylinder and are respectively located at both ends of the baffle; wherein,
所述第一填充腔填充有用于去除硼杂质的第一吸附剂,所述第二填充腔填充有用于去除磷杂质的第二吸附剂。The first filling chamber is filled with a first adsorbent for removing boron impurities, and the second filling chamber is filled with a second adsorbent for removing phosphorus impurities.
作为本发明的进一步改进:所述第一吸附剂包括改性树脂。As a further improvement of the present invention: the first adsorbent includes a modified resin.
作为本发明的进一步改进:所述改性树脂负载有特定羟基功能原子基团能与硼杂质目标形成配位化合物。As a further improvement of the present invention: the modified resin is loaded with specific hydroxyl functional atomic groups capable of forming coordination compounds with boron impurity targets.
作为本发明的进一步改进:所述改性树脂采用以2-羟基乙胺基-2,3-丙二醇或亚胺二亚丙基乙二醇作为硼选择性吸附官能团,将其引入到甲基丙烯酸甲酯或三羟甲基丙烷三甲基丙烯酸酯上,制备成硼选择性有机树脂。As a further improvement of the present invention: the modified resin uses 2-hydroxyethylamino-2,3-propanediol or iminodipropylene glycol as boron selective adsorption functional group, which is introduced into methacrylic acid Methyl ester or trimethylolpropane trimethacrylate to prepare boron-selective organic resins.
作为本发明的进一步改进:所述改性树脂的活性浓度≥3.3eq/L,所述改性树脂的荷载为500kg/m3。As a further improvement of the present invention: the active concentration of the modified resin is ≥3.3eq/L, and the load of the modified resin is 500kg/m 3 .
作为本发明的进一步改进:所述第一吸附剂包括活性炭、硅酸盐、氧化物、分子筛、硼选择性吸附官能团负载、修饰改性硅胶、活性炭其中的一种或多种。As a further improvement of the present invention: the first adsorbent includes one or more of activated carbon, silicate, oxide, molecular sieve, boron selective adsorption functional group loading, modified silica gel, and activated carbon.
作为本发明的进一步改进:所述第二吸附剂包括硅胶与活性沸石。As a further improvement of the present invention: the second adsorbent includes silica gel and active zeolite.
作为本发明的进一步改进:所述硅胶与所述活性沸石总容量体积比例范围为5:1-1:3。As a further improvement of the present invention: the volume ratio of the total capacity of the silica gel to the active zeolite ranges from 5:1 to 1:3.
作为本发明的进一步改进:所述硅胶负载有CuCl2金属盐。As a further improvement of the present invention: the silica gel is loaded with CuCl 2 metal salt.
作为本发明的进一步改进:所述活性沸石采用金属离子负载的ZSM-5型沸石。As a further improvement of the present invention: the active zeolite adopts ZSM-5 type zeolite loaded with metal ions.
作为本发明的进一步改进:所述筒体设置有进料口、出料口,所述进料口位于所述筒体接近所述第一填充腔的一端,所述出料口位于所述筒体接近所述第二填充腔的另一端。As a further improvement of the present invention: the cylinder is provided with an inlet and an outlet, the inlet is located at the end of the cylinder close to the first filling chamber, and the outlet is located at the end of the cylinder The other end of the body is close to the second filling cavity.
作为本发明的进一步改进:所述筒体连接有多个填料导管,所述多个填料导管分别与所述第一填充腔、所述第二填充腔连通。As a further improvement of the present invention: the barrel is connected with a plurality of filling conduits, and the plurality of filling conduits communicate with the first filling cavity and the second filling cavity respectively.
作为本发明的进一步改进:所述筒体连接有测量管,所述测量管与所述第一填充腔和/或所述第二填充腔连通。As a further improvement of the present invention: the barrel is connected with a measuring tube, and the measuring tube communicates with the first filling cavity and/or the second filling cavity.
作为本发明的进一步改进:所述筒体上设置有吊耳,所述吊耳连接于所述筒体的外表面。As a further improvement of the present invention: the cylinder body is provided with lifting lugs, and the lifting lugs are connected to the outer surface of the cylinder body.
作为本发明的进一步改进:所述挡板设置有用于透气的筛孔。As a further improvement of the present invention: the baffle is provided with mesh holes for ventilation.
相对于现有技术,本发明具有以下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
本技术方案的硼、磷杂质吸附装置通过在筒体内设置分隔的第一填充腔、第二填充腔,第一填充腔、第二填充腔分别填充有用于去除硼杂质的第一吸附剂、用于去除磷杂质的第二吸附剂,使本装置可同时对气体中的硼、磷杂质吸附去除,增加了装置的除杂种类,使装置的适用范围更广。The boron and phosphorus impurity adsorption device of this technical solution is provided with a separated first filling cavity and a second filling cavity in the cylinder, and the first filling cavity and the second filling cavity are respectively filled with the first adsorbent for removing boron impurities, The second adsorbent for removing phosphorus impurities enables the device to adsorb and remove boron and phosphorus impurities in the gas at the same time, increasing the types of impurities removed by the device and making the device more applicable.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative effort.
图1为本申请的硼、磷杂质吸附装置一实施例的结构示意图。FIG. 1 is a schematic structural view of an embodiment of the boron and phosphorus impurity adsorption device of the present application.
附图标号说明:Explanation of reference numbers:
本发明目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization of the purpose of the present invention, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
需要说明,若本发明实施例中有涉及方向性指示(诸如上、下、左、右、前、后……),则该方向性指示仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the relationship between the components in a certain posture. If the specific posture changes, the directional indication will also change accordingly.
另外,若本发明实施例中有涉及“第一”、“第二”等的描述,则该“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,若全文中出现的“和/或”或者“及/或”,其含义包括三个并列的方案,以“A和/或B”为例,包括A方案、或B方案、或A和B同时满足的方案。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。In addition, if there are descriptions involving "first", "second" and so on in the embodiments of the present invention, the descriptions of "first", "second" and so on are only for descriptive purposes, and should not be interpreted as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, if "and/or" or "and/or" appears throughout the text, its meaning includes three parallel plans, taking "A and/or B" as an example, including plan A, or plan B, or A and B is a solution that is satisfied at the same time. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , nor within the scope of protection required by the present invention.
目前现有的络合吸附都是通过单一的络合吸附剂装填在固定床装置从而实现吸附杂质,其只能达到单一的除硼或者除磷的效果。At present, the existing complex adsorption is to pack a single complex adsorbent in a fixed bed device to achieve adsorption of impurities, which can only achieve a single boron or phosphorus removal effect.
本发明的目的是提出一种硼、磷杂质吸附装置,旨在解决现有的络合吸附装置仅能单独去除硼杂质或磷杂质,产品除杂效果单一的技术问题。The purpose of the present invention is to propose a boron and phosphorus impurity adsorption device, aiming to solve the technical problem that the existing complex adsorption device can only remove boron impurities or phosphorus impurities alone, and the product has a single effect of removing impurities.
实施例1Example 1
请参阅图1,本实施例的硼、磷杂质吸附装置包括:Please refer to Fig. 1, the boron, phosphorus impurity adsorption device of the present embodiment comprises:
筒体1,所述筒体1内设置有挡板8;A
第一填充腔21、第二填充腔22,所述第一填充腔21以及所述第二填充腔22设置于所述筒体1内且分别位于所述挡板8的两端;其中,The first filling
所述第一填充腔21填充有用于去除硼杂质的第一吸附剂,所述第二填充腔22填充有用于去除磷杂质的第二吸附剂。The
具体而言,在本实施例中,筒体1呈圆筒结构,其内部设置的挡板8水平放置,并且将筒体1内部分为第一填充腔21、第二填充腔22。由于第一填充腔21填充有用于去除硼杂质的第一吸附剂,第二填充腔22填充有用于去除磷杂质的第二吸附剂,因此当需要净化的氯硅烷气体流入本吸附装置,氯硅烷气体在第一填充腔21、第二填充腔22内分别与第一吸附剂、第二吸附剂接触,发生物理吸附反应,氯硅烷气体内的硼、磷杂质被第一吸附剂、第二吸附剂吸附去除。Specifically, in this embodiment, the
本实施例的硼、磷杂质吸附装置通过在筒体1内设置分隔的第一填充腔21、第二填充腔22,第一填充腔21、第二填充腔22分别填充有用于去除硼杂质的第一吸附剂、用于去除磷杂质的第二吸附剂,使得本装置可同时对氯硅烷气体中的硼、磷杂质吸附去除,增加了装置的除杂种类,使装置的适用范围更广。The boron and phosphorus impurity adsorption device of this embodiment is provided with a separated first filling
进一步地,在本实施例中,所述筒体1设置有进料口2、出料口3,所述进料口2位于所述筒体1接近所述第一填充腔21的一端,所述出料口3位于所述筒体1接近所述第二填充腔22的另一端。所述筒体1连接有多个填料导管6,所述多个填料导管6分别与所述第一填充腔21、所述第二填充腔22连通。所述筒体1连接有测量管12,所述测量管12与所述第一填充腔21和/或所述第二填充腔22连通。所述挡板8设置有用于透气的筛孔。Further, in this embodiment, the
具体而言,筒体1设置的进料口2、出料口3分别用于通入氯硅烷气体以及排放氯硅烷气体。出料口3的一侧设置有筛管4,筛管4用于过滤氯硅烷气体中的杂质。出料口3位于筒体1接近第二填充腔22的一端,进料口2位于筒体1接近第一填充腔21的另一端,因此,流入本吸附装置的氯硅烷气体先经过第一填充腔21,氯硅烷气体先与第一吸附剂反应从而去除硼杂质;随后,氯硅烷气体流经挡板8,进入第二填充腔22与第二吸附剂反应,从而去除氯硅烷气体中的磷杂质,最后氯硅烷气体经过出料口3排出装置外。Specifically, the
此外,筒体1连接有填料导管6,填料导管6设置有2件,其分别与第一填充腔21、第二填充腔22连通,与第一填充腔21连通的填料导管6的一端设置有第一填充腔吸附剂添加口9,与第二填充腔22连通的填料导管的一端设置有第二填充腔吸附剂添加口10。因此,操作人员可通过填料导管6将第一吸附剂、第二吸附剂填充进入第一填充腔21、第二填充腔22内。筒体1还连接有测量管12,测量管12与第一填充腔21和所述第二填充腔22连通,操作人员可通过测量管12测量筒体1内部的气压及温度。筒体1的底部还设置有卸料管11,卸料管11用于排放吸附剂,卸料管11内设置有用于开关的卸料管阀门7。In addition, the
另外,筒体1上设置有吊耳5,吊耳5连接于筒体1的外表面,外部设备可通过连接该吊耳5,从而带动本吸附装置移动;而挡板8设置有用于透气的筛孔,挡板8可隔离第一填充腔21、第二填充腔22的吸附剂,但不阻碍氯硅烷气体的通过。In addition, the
进一步地,在本实施例中,所述第一吸附剂包括改性树脂。Further, in this embodiment, the first adsorbent includes a modified resin.
具体而言,改性树脂用于吸附硼杂质,改性树脂负载有特定羟基功能原子基团能与硼杂质目标形成配位化合物。在本实施例中,改性树脂采用以2-羟基乙胺基-2,3-丙二醇或亚胺二亚丙基乙二醇作为硼选择性吸附官能团,将其引入到甲基丙烯酸甲酯或三羟甲基丙烷三甲基丙烯酸酯上,制备成硼选择性有机树脂。改性树脂的活性浓度≥3.3eq/L,改性树脂的荷载为500kg/m3。Specifically, the modified resin is used to adsorb boron impurities, and the modified resin is loaded with specific hydroxyl functional atomic groups that can form coordination compounds with boron impurity targets. In this example, the modified resin uses 2-hydroxyethylamino-2,3-propanediol or iminodipropylene glycol as boron selective adsorption functional groups, which are introduced into methyl methacrylate or Preparation of boron-selective organic resins on trimethylolpropane trimethacrylate. The active concentration of the modified resin is ≥3.3eq/L, and the load of the modified resin is 500kg/m 3 .
值得注意的是,在其他实施例中,所述第一吸附剂还包括活性炭、硅酸盐、氧化物、分子筛、硼选择性吸附官能团负载、修饰改性硅胶、活性炭其中的一种或多种。前述成分均可以对硼杂质进行吸附去除,因此都可以作为第一吸附剂装填进入第一填充腔21。It is worth noting that, in other embodiments, the first adsorbent also includes one or more of activated carbon, silicate, oxide, molecular sieve, boron selective adsorption functional group loading, modified silica gel, activated carbon . The aforementioned components can all adsorb and remove boron impurities, so they can all be filled into the first filling
进一步地,在本实施例中,所述第二吸附剂包括硅胶与活性沸石。所述硅胶与所述活性沸石总容量体积比例范围为5:1-1:3。在本实施例中,硅胶与活性沸石总容量体积比例范围为2:1。其中,硅胶负载具有较强络合磷能力的金属盐,而在本实施例中,该金属盐采用CuCl2金属盐。而活性沸石采用金属离子负载的ZSM-5型沸石,该类型沸石能有效的对硅烷尾气杂质中的磷化氢(PH3)进行选择吸附。Further, in this embodiment, the second adsorbent includes silica gel and active zeolite. The volume ratio of the total capacity of the silica gel to the active zeolite ranges from 5:1 to 1:3. In this embodiment, the volume ratio range of the total volume of silica gel to active zeolite is 2:1. Wherein, the silica gel supports a metal salt with a strong ability to complex phosphorus, and in this embodiment, the metal salt is CuCl2 metal salt. The active zeolite adopts ZSM-5 type zeolite supported by metal ions, which can effectively selectively adsorb phosphine (PH3) in silane tail gas impurities.
值得注意的是,在其他实施例中,所述第二吸附剂还包括活性炭、硅酸盐、氧化物、分子筛其中的一种或多种。前述成分都可以对磷杂质进行吸附去除,因此前述成分都可以作为第二吸附剂装填进入第二填充腔22。It should be noted that, in other embodiments, the second adsorbent further includes one or more of activated carbon, silicate, oxide, and molecular sieve. All the above-mentioned components can adsorb and remove phosphorus impurities, so all the above-mentioned components can be filled into the
本实施例的硼、磷杂质吸附装置在实际应用场景中,工作步骤如下所示:In the actual application scene of the boron and phosphorus impurity adsorption device in this embodiment, the working steps are as follows:
将一股硼杂质含量约8ppbw,磷杂质含量约20ppbw的氯硅烷气体以流量40kg/min通入本硼、磷杂质吸附装置中;Pass a stream of chlorosilane gas with a boron impurity content of about 8ppbw and a phosphorus impurity content of about 20ppbw into the boron and phosphorus impurity adsorption device at a flow rate of 40kg/min;
(1)以吸附硼为主的第一填充腔21装填有负载2-羟基乙胺基-2,3-丙二醇的甲基丙烯酸甲酯树脂。其机理是树脂上的功能原子与目标B离子发生配位反应,形成类似小分子的稳定结构,从而可对氯硅烷气体中的硼杂质进行去除;(1) The
(2)以吸附磷为主的第二填充腔22装填有CuCl2金属盐负载的硅胶,与金属负载的Al203吸附剂(活性沸石),其中硅胶与活性三氧化二铝的吸附剂的装填混合,硅胶与活性沸石总容量体积比例范围为2:1。其中,表面富含羟基的硅胶不仅能有效对硼进行再吸附(Si-OH+BCl3→Si-OBCl2+HCl),同时硅胶负载具有较强络合磷能力的CuCl2金属盐(质量分数为1%),能大大增加对磷杂质的吸附;而改性Al203具体为是金属Pt和Cu离子负载的Al203,使得原始Al203对PH3物理吸附转变为化学吸附(3CuO+2PH3→Cu3P2+3H2O),能有效的对硅烷尾气杂质中的磷化氢(PH3)等P杂质进行选择吸附。(2) The
(3)经过净化提纯之后的氯硅烷气体经过杂质评价装置进行杂质含量评定,TCS中硼平均含量≤1ppbw,磷平均含量≤3ppbw。(3) The purified chlorosilane gas passes through the impurity evaluation device to evaluate the impurity content. The average content of boron in TCS is ≤1ppbw, and the average content of phosphorus is ≤3ppbw.
对比例1Comparative example 1
与实施例1不同的是,本对比例改变步骤(2)中的吸附剂,不装填磷吸附剂,第一填充腔21和第二填充腔22工序均装有相同的负载2-羟基乙胺基-2,3-丙二醇的甲基丙烯酸甲酯树脂,未装填其他吸附剂,其余步骤和参数皆相同。Different from Example 1, this comparative example changes the adsorbent in step (2), does not fill the phosphorus adsorbent, and the first filling
净化的氯硅烷气体经过杂质评价装置进行杂质含量评定,所得TCS中,硼含量≤1.2ppbw,磷含量≤5.2ppbw。The purified chlorosilane gas passes through the impurity evaluation device to evaluate the impurity content. In the obtained TCS, the boron content is ≤1.2ppbw, and the phosphorus content is ≤5.2ppbw.
由此可见,在缺乏磷吸附剂:CuCl2金属盐负载的硅胶,与金属负载的Al203吸附剂(活性沸石)的情况下,氯硅烷气体内的磷杂质未得到过滤及净化。It can be seen that in the absence of phosphorus adsorbents: silica gel supported by CuCl 2 metal salts, and
对比例2Comparative example 2
与实施例1不同的是,本对比例改变步骤(2)中的磷吸附剂为未负载金属盐的硅胶、未负载金属的Al203,其余步骤和参数皆相同。The difference from Example 1 is that in this comparative example, the phosphorus adsorbent in step (2) is changed to silica gel without metal salt and
净化的氯硅烷气体经过杂质评价装置进行杂质含量评定,所得TCS中,硼含量为1.7ppbw,磷含量为6.6ppbw。The purified chlorosilane gas was evaluated by the impurity evaluation device for impurity content. In the obtained TCS, the boron content was 1.7 ppbw, and the phosphorus content was 6.6 ppbw.
由此可见,没有负载CuCl2金属盐的硅胶,没有负载金属的Al203吸附剂的磷吸附剂,相对于负载CuCl2金属盐的硅胶,负载金属的Al203吸附剂的磷吸附剂,前者磷吸收与磷过滤的性能更差,氯硅烷气体内的磷杂质未得到过滤及净化。It can be seen that silica gel without CuCl2 metal salt, phosphorus adsorbent without metal-loaded Al203 adsorbent, phosphorus adsorption of metal- loaded Al203 adsorbent relative to silica gel loaded with CuCl2 metal salt The performance of phosphorus absorption and phosphorus filtration of the former is even worse, and the phosphorus impurities in the chlorosilane gas have not been filtered and purified.
对比例3Comparative example 3
与实施例1不同的是,本对比例改变步骤(2)中,三氯氢硅进入集成一体化装置的顺序,先经过以吸附P主的第二填充腔22,再经过以吸附B为主第一填充腔21,其余步骤和参数皆相同。The difference from Example 1 is that in this comparative example, in step (2), the order in which trichlorosilane enters the integrated device is first passed through the
净化的氯硅烷气体经过杂质评价装置进行杂质含量评定,所得TCS中,硼含量为0.8ppbw,磷含量为2.2ppbw。The purified chlorosilane gas is evaluated by the impurity evaluation device for impurity content. In the obtained TCS, the boron content is 0.8 ppbw, and the phosphorus content is 2.2 ppbw.
由此可见,即使吸附P与吸附B的顺序倒置,本硼、磷杂质吸附装置均可以保持良好的吸附过滤性能,氯硅烷气体内的磷杂质、硼杂质均得到过滤及净化。It can be seen that even if the order of adsorption P and adsorption B is reversed, the boron and phosphorus impurity adsorption device can maintain good adsorption and filtration performance, and the phosphorus impurities and boron impurities in the chlorosilane gas can be filtered and purified.
综上所述,本技术方案的硼、磷杂质吸附装置通过在筒体1内设置分隔的第一填充腔21、第二填充腔22,第一填充腔21、第二填充腔22分别填充有用于去除硼杂质的第一吸附剂、用于去除磷杂质的第二吸附剂,使得本装置可同时对氯硅烷气体中的硼、磷杂质吸附去除,能够发挥吸附络合剂各自最大的优势,避免一种吸附剂除杂效果的短板;此外,本装置极大地的简化了尾气氯硅烷进行后续反复提纯的工艺流程,并有效减少去除杂质所需的能耗,提高整个生产工艺的经济性和高效性。In summary, the boron and phosphorus impurity adsorption device of this technical solution is provided with separated first filling
以上所述仅为本发明的可选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above descriptions are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. Under the inventive concept of the present invention, the equivalent structural transformation made by using the description of the present invention and the contents of the accompanying drawings, or direct/indirect Application in other related technical fields is included in the patent protection scope of the present invention.
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