CN115987396A - Programmable Integrated Optical Chip Based on Photonic Wire Bonding - Google Patents

Abstract

The present disclosure provides a programmable integrated optical chip based on photonic wire bonding, including: a substrate; The photonic wire bonding connection; the electronic control module can be connected with any functional device through the gold wire to realize the different functions of the optical chip. The multifunctional device unit includes: a laser module, a modulator module, an amplifier module, a detector module, an optical routing module, an optical filter module, a matrix algorithm module, and a waveguide module, which are integrated on the substrate and passed through the erasable Photonic wire bonding connections.

Description

Programmable Integrated Optical Chip Based on Photonic Wire Bonding

technical field

The disclosure relates to the technical field of integrated optoelectronics/optical programmable chip/opto-photonic wire bonding/optical-optical coupling/optical-optical communication, and in particular to a programmable integrated optical chip based on photon wire bonding.

Background technique

With the increasing prosperity of mobile Internet, cloud computing, and big data, emerging applications such as 5G communication continue to emerge, and the demand for high-speed data transmission is increasingly strong. In backbone networks and next-generation data centers, as electronic chips encounter speed bottlenecks, optoelectronic chips have become the focus of development due to their low power consumption and high bandwidth characteristics. The development of modern communication systems has put forward higher requirements for optical fiber communication systems. Among them, large-scale optoelectronic integration technology has become one of the best solutions. It has obvious advantages in performance, cost, and integration, and has become a research hotspot. Programmable optical chips achieve reconfiguration capabilities through software definition, and are highly versatile and practical. Combining photonic wire bonding technology to realize the construction of optical programmable chips has become an important research topic.

The current chip is divided into two types, one is a monolithic integrated chip, the main functional devices of which have been pre-set, and the other is an integrated chip realized through packaging, which is integrated after gold wire bonding or flip-chip welding. Chip functions cannot be changed. These chips can only achieve a single function, and cannot be changed later. For developers, the time and cost of taping out are very high.

Contents of the invention

(1) Technical problems to be solved

Based on the above problems, the present disclosure provides a programmable integrated optical chip based on photonic wire bonding to alleviate the above technical problems in the prior art.

(2) Technical solution

The disclosure provides a programmable integrated optical chip based on photonic wire bonding, including: a substrate, a multifunctional device unit, and an electric control module.

The multifunctional device unit includes a variety of functional devices, which are integrated on the substrate and can be connected through erasable photonic wire bonding; the electronic control module can be connected to any functional device through gold wires , to realize the different functions of the optical chip.

According to an embodiment of the present disclosure, the multifunctional device unit includes a laser module, a modulator module, an amplifier module, a detector module, an optical routing module, an optical filtering module, a matrix algorithm module, and a waveguide module, which are jointly integrated on the substrate and Connected via erasable photonic wire bonding.

According to an embodiment of the present disclosure, there is at least one functional device of each type.

According to an embodiment of the present disclosure, the material system of the laser is selected from group III-V materials.

According to an embodiment of the present disclosure, the modulator material system is selected from lithium niobate, lithium niobate, group III-V, and silicon-based materials.

According to an embodiment of the present disclosure, the material system of the optical routing, waveguide, optical filtering, and matrix algorithm module is selected from III-V groups, lithium niobate, lithium niobate, silicon base, silicon nitride, and organic matter.

According to the embodiments of the present disclosure, the programmable integrated optical chip can have the same function as at least one of Mach-Zehnder interferometer, micro-ring resonator, optical beam splitter, and optical beam combiner.

According to the embodiments of the present disclosure, by erasing the photoresist of the photonic wire bonding and rewriting it, the connections between various functional devices can be changed to realize different functions of the optical chip.

Description of drawings

FIG. 1 is a schematic diagram of the composition and structure of a programmable integrated optical chip based on photonic wire bonding according to an embodiment of the present disclosure.

FIG. 2 is a schematic diagram of a specific package structure of a programmable integrated optical chip based on photonic wire bonding according to an embodiment of the present disclosure.

[Description of main component symbols of the embodiment of the present disclosure in the accompanying drawings]

1. Substrate; 2. Electronic control module; 3. Laser; 4. Modulator; 5. Amplifier; 6. Detector; 7. Optical routing; 8. Optical filtering; 9. Matrix algorithm module; 10. Waveguide; 11. Gold wire; 12. Photon leads.

Detailed ways

The present disclosure provides a programmable integrated optical chip based on photonic wire bonding. The different functions of the chip are controlled by an electronic control module to achieve linking through photon wire bonding. The resist is cleaned, and the photon lead is removed when the chip function is changed, and a new functional module is constructed again, so that a low coupling loss, programmable and controllable optical logic processing chip can be realized through a single function chip and a photon lead, which can improve the performance of the device. At the same time, the efficiency of optoelectronic integration is increased.

In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

In an embodiment of the present disclosure, a programmable integrated optical chip based on photonic wire bonding is provided. As shown in FIG. 1 and FIG. 2, the programmable integrated optical chip based on photonic wire bonding includes:

Substrate;

A multifunctional device unit, including multiple functional devices, which are integrated on the substrate and can be connected by erasable photonic wire bonding;

The electronic control module can be connected with any functional device through gold wires to realize different functions of the optical chip.

The multifunctional device unit includes: a laser module, a modulator module, an amplifier module, a detector module, an optical routing module, an optical filtering module, a matrix algorithm module, and a waveguide module, which are integrated on the substrate and passed through the erasable Photonic wire bonding connections.

The laser module includes at least one laser 3, the modulator module includes at least one modulator 4, the amplifier module includes at least one amplifier 5, the detector module includes at least one detector 6, the optical routing module includes at least one optical routing 7, and the optical filtering module includes At least one optical filter 8, the matrix algorithm module includes at least one matrix algorithm module 9, and the waveguide module includes at least one waveguide 10. The above-mentioned devices are all on the same substrate 1 , and the electronic control module 2 controls different functional devices to be connected through photonic leads 12 .

Among them, photonic wire bonding, also known as free-form surface optical waveguide three-dimensional nano-printing technology, can perform optical free coupling between photonic chips, and use high-energy pulsed beams to make multi-photon polymerization at specific positions of the photoresist. Three-dimensional polymer waveguide, the size of the polymer waveguide is designed according to the size of the light field of the optical chip, and then the transmission of the light field from chip to chip is realized. It has low optical loss, high degree of freedom, and can be reconfigured. The photonic chip is coupled and packaged into a whole module. Chips with different functions and different material systems are preset on the substrate, and the electronic control module is used to control the photonic leads to connect different chips together to form the functional module required by the developer. When developing When the operator needs to change the function, the photoresist of the photon lead can be erased and rewritten.

The material composition of the programmable integrated optical chip based on photonic wire bonding can include a variety of material systems. Among them, the material system of the laser is III-V group; the modulator material is lithium niobate and lithium niobate film, III-V group, silicon base; the detector material system is III-V group and silicon base; The material system of waveguide, optical filtering, and matrix algorithm modules is III-V group, lithium niobate and lithium niobate thin film, silicon base, silicon nitride, organic matter. The functions of each chip can be lasers, modulators, amplifiers, detectors, optical routing, optical filtering, matrix algorithm modules, waveguides, Mach-Zehnder interferometers, microring resonators, optical beam splitters, and optical beam combiners.

According to the embodiment of the present disclosure, lasers, modulators, amplifiers, detectors, optical routing, optical filtering, matrix algorithm modules, and waveguides may have one or more devices.

According to the embodiment of the present disclosure, by erasing the photoresist of the photonic wire bonding and rewriting it, the connection between various functional devices can be changed to realize different functions of the optical chip, for example, to realize the Herzeng function of a Del interferometer, microring resonator, optical beam splitter, or optical beam combiner.

So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that, in the accompanying drawings or in the text of the specification, implementations that are not shown or described are forms known to those of ordinary skill in the art, and are not described in detail. In addition, the above definitions of each element and method are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and those skilled in the art can easily modify or replace them.

Based on the above description, those skilled in the art should have a clear understanding of the programmable integrated optical chip based on photonic wire bonding of the present disclosure.

In summary, the present disclosure provides a programmable integrated optical chip based on photonic wire bonding, the structure includes: substrate, electronic control module, laser, modulator, amplifier, detector, optical routing, optical filtering, matrix Algorithm modules, waveguides, gold wires, and photonic leads realize integrated programmable optical chips. Through the way of photonic wire bonding, the optical connection between different devices can be realized, and can be eliminated, avoiding the alignment adjustment of the traditional optical coupling scheme, saving the lens required for beam shaping, and the preparation is simple and fast, which can realize heterogeneous Integration of heterogeneous chips and construction of programmable chips.

The programmable optical chip and packaging structure based on photonic wire bonding can effectively improve the integration of the chip, and at the same time build a multifunctional chip module to realize the construction and erasing of the programmable multifunctional processing optical chip, and at the same time use photonic wire bonding to realize The optical programmable logic array increases the integration degree of optical coupling, reduces the loss of optical coupling, and reduces the chip volume. It is helpful to realize low-loss coupling of large-scale photonic integrated chips and construct optical programmable logic array chips.

It should also be noted that the above are different embodiments provided by the present disclosure. These embodiments are used to illustrate the technical content of the present disclosure, rather than to limit the protection scope of the present disclosure. A feature of one embodiment can be applied to other embodiments through appropriate modification, replacement, combination, and separation.

It should be noted that, unless otherwise specified herein, having “a” element is not limited to having a single element, but may include one or more elements.

In addition, in this article, unless otherwise specified, ordinal numbers such as "first" and "second" are only used to distinguish multiple components with the same name, and do not indicate that there is a hierarchy, level, execution sequence, or process sequence. A "first" element and a "second" element may appear together in the same component, or may appear separately in different components. The presence of an element with a higher ordinal number does not necessarily indicate the presence of another element with a lower ordinal number.

In this paper, unless otherwise specified, the so-called feature A "or" (or) or "and/or" (and/or) feature B means that nail exists alone, B exists alone, or A and B exist simultaneously ; The so-called feature A "and" (and) or "and" (and) or "and" (and) feature B means that nail and B exist at the same time; the so-called "includes", "includes", "has", " Contains" means including but not limited to.

In addition, in this article, the so-called "upper", "lower", "left", "right", "front", "rear", or "between" and other terms are only used to describe the distance between a plurality of elements. relative position, and can be generalized in interpretation to include cases of translation, rotation, or mirroring. In addition, herein, unless otherwise specified, "an element is on another element" or similar expressions do not necessarily mean that the element contacts the other element.

In addition, unless specifically described or steps that must occur sequentially, the order of the above steps is not limited to that listed above and may be changed or rearranged according to the desired design. Moreover, the above-mentioned embodiments can be mixed and matched with each other or with other embodiments based on design and reliability considerations, that is, technical features in different embodiments can be freely combined to form more embodiments.

The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present disclosure in detail. It should be understood that the above descriptions are only specific embodiments of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included within the protection scope of the present disclosure.

Claims (8)

1. A programmable integrated optical chip based on photonic wire bonding, comprising: Substrate; A multifunctional device unit, including multiple functional devices, which are integrated on the substrate and can be connected by erasable photonic wire bonding; The electronic control module can be connected with any functional device through gold wires to realize different functions of the optical chip. 2. The programmable integrated optical chip according to claim 1, said multifunctional device unit comprising: a laser module, a modulator module, an amplifier module, a detector module, an optical routing module, an optical filtering module, a matrix algorithm module, a waveguide Modules are co-integrated on the substrate and connected by erasable photonic wire bonding. 3. The programmable integrated optical chip according to claim 2, the number of each functional device is at least one. 4. The programmable integrated optical chip according to claim 2, the material system of the laser is selected from group III-V materials. 5. The programmable integrated optical chip according to claim 2, wherein the modulator material system is selected from lithium niobate, lithium niobate, III-V groups, and silicon-based materials. 6. The programmable integrated optical chip according to claim 2, said optical routing, waveguide, optical filtering, and matrix algorithm module material system are selected from group III-V, lithium niobate, lithium niobate, silicon-based, nitrided Silicon, organic matter. 7. The programmable integrated optical chip according to claim 1, capable of having the same function as at least one of a Mach-Zehnder interferometer, a microring resonator, an optical beam splitter, and an optical beam combiner. 8. The programmable integrated optical chip according to claim 1, by rewriting the photoresist of the photonic wire bonding after erasing, the connection between various functional devices can be changed to realize optical Different functions of the chip.

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