CN115790838A - Photon power supply measuring module based on HTCC and large light spot testing system - Google Patents

Abstract

The invention belongs to the technical field of photoelectric measurement, and provides a photon power supply measuring module based on HTCC (high-speed coherent coupling), which comprises a photon power supply, a processor unit, a wireless transmitting module and a wired interface module. The photon power supply measuring module adopts an HTCC packaging laser battery structure, has high heat conductivity and high temperature resistance, and can adapt to wide working laser power density range; the selective transmission film is provided, so that wavelength selection can be performed, and the influence of other stray light can be eliminated; the invention measures the laser intensity based on the photoelectric conversion characteristic of the laser battery, measures the temperature of the photon power supply by utilizing the thermistor on the back of the HTCC ceramic substrate, and has high measurement accuracy. The large light spot testing system adopts a distributed array formed by a plurality of photon power supply measuring modules, can flexibly arrange the size of the measuring array, meets the requirements of different measuring resolutions, and can measure the area of a light spot within a measuring range of dozens of meters to hundred meters.

Description

A photon power measurement module and large spot test system based on HTCC

technical field

The invention belongs to the technical field of photoelectric measurement, and in particular relates to an HTCC-based photon power measurement module and a large-spot test system.

Background technique

In recent years, with the rapid development of optoelectronic technology, laser technology has become more and more widely used in various aspects such as laser communication, laser wireless energy transmission, laser countermeasures, and laser radar. Laser transmission characteristics are the key to the effect of laser applications, especially laser spot characteristics become one of the evaluation factors for long-distance transmission laser application systems.

Due to the good directivity of the laser, the divergence angle of the laser beam is very small. Under most laboratory application conditions, the laser spot size is very small, and the laser spot can be measured by using the detector imaging method.

However, with the development of high-power laser technology, the demand for high-power and large-size laser spot measurement has increased significantly. The laser spot for long-distance transmission generally has the characteristics of large size. In some applications that have significant requirements for laser light intensity, such as laser wireless energy transmission and laser countermeasures, the laser beam also has a high power density. Among the existing laser spot testing methods, the spot ablation method has low measurement accuracy and uncertain measurement time. In the detector imaging method, the receiving aperture of the detector has a limit on the diameter of the laser spot. The thermal imaging method requires strict calibration of the image. , the use is relatively limited.

In order to realize the detection of large light spots, a series of large light spot measurement methods based on photoelectric conversion or thermoelectric conversion photodetector arrays and thermistor arrays have been developed, but the photodetectors have power saturation and are not suitable for high-power laser measurements. Utilizing the thermoelectric conversion characteristics of the thermistor, there are problems such as low measurement accuracy and easy errors.

Therefore, it is necessary to study a photoelectric module that can be applied to a large-size high-power laser spot detection device and method to solve the shortcomings of the existing optical detection module and laser spot measurement technology when testing large-size high-power laser spot.

Contents of the invention

In order to solve the problems in the background technology, the present invention provides a photon power measurement module based on HTCC, which includes a photon power supply, a processor unit, a wireless transmission module and a wired interface module, wherein the photon power supply includes a selective permeable film, a laser Cells, HTCC ceramic substrates, signal acquisition circuit boards, and heat sinks; laser cells are electrically connected to HTCC ceramic substrates; HTCC ceramic substrates are welded to signal acquisition circuit boards; Chip connection to realize heat dissipation of the photon power supply; the processor unit converts the electrical signal of the photon power supply into a light intensity signal, and sends it out through the wireless transmitting module or the wired interface module.

In a preferred solution, a mounting hole is provided on the back of the HTCC ceramic substrate, and a thermistor and a bypass diode are mounted in the mounting hole, which are used for temperature monitoring of the laser cell and fault short circuit isolation.

In a preferred solution, the wired interface module in the photon power measurement module implements information transmission with the receiving device through a serial port.

In a preferred solution, the HTCC ceramic substrate is soldered to the signal acquisition circuit board in a ball grid array package.

In a preferred solution, the laser cell is electrically connected to the HTCC ceramic substrate through gold wire bonding.

In a preferred solution, the signal acquisition circuit board is connected to the heat sink through GD414 silicone rubber.

In a preferred solution, the wireless transmitting module is composed of a programmable radio frequency module and an antenna, and is used for programming the light intensity signal and wirelessly sending the data to the receiving device.

A large spot test system, which includes several HTCC-based photon power measurement modules and receiving equipment, the HTCC-based photon power measurement modules are arranged in a spaced array, and each photon power measurement module sends the measured light intensity signal to The receiving device performs data processing.

In a preferred solution, the several HTCC-based photon power measurement modules are arranged in a "meter" shape or a rectangle.

In the preferred solution, several HTCC-based photon power measurement modules use ZigBee wireless network for communication.

The beneficial effects achieved by the present invention are:

First, the photon power measurement module of the present invention adopts a HTCC packaged laser battery structure, which has high thermal conductivity, high temperature resistance, and can adapt to a wide range of working laser power density; it has a selective permeable film, which can perform wavelength selection and eliminate other miscellaneous The influence of astigmatism; integrated data acquisition, AD conversion, wireless/wired transceiver functions.

Second, the photon power measurement module of the present invention measures the laser intensity based on the photoelectric conversion characteristics of the laser battery, uses the thermistor on the back of the HTCC ceramic substrate to measure the temperature of the photon power supply, and corrects the conversion characteristics of the photoelectric conversion characteristics of the laser battery at different temperatures, Improve the measurement accuracy of the photon power measurement module.

Third, a large-spot test system of the present invention uses several photon power supply measurement modules to form a distributed array, which can flexibly layout the size of the measurement array. By selecting the array spacing, it can meet the requirements of different measurement resolutions, and the measurement spot area can reach Measuring range from tens of meters to hundreds of meters.

Fourth, the ZigBee wireless network can be used for communication between each photon power measurement module. The complexity is low, the network can be organized by the network coordinator, the adaptability is good, and the network capacity is large. In theory, there can be tens of thousands of nodes. Adapt to the application of a large number of nodes.

Description of drawings

Fig. 1 is the structural representation of the photon power measurement module based on HTCC of the present invention;

Fig. 2 is a structural schematic diagram of a photon power supply;

Figure 3 is a schematic diagram of the layout of the HTCC ceramic substrate;

Figure 4 is a schematic diagram of the layout of the large spot test system.

Labels in the figure:

1. Photon power supply; 2. Selective transmissive membrane; 3. Laser cell; 4. HTCC ceramic substrate; 5. Signal acquisition circuit; 6. Heat sink; 7. Processor unit; 8. Wireless transmission module; 9. A wired interface module; 10, a thermistor; 11, a bypass diode.

Detailed ways

The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. In addition, the configurations of the structures described in the following embodiments are only examples, and the present invention is not limited to the following All other implementations obtained by persons of ordinary skill in the art without creative efforts for the structures described in the implementations of the above-mentioned implementations fall within the scope of protection of the present invention.

Referring to Figures 1-4, a photon power measurement module based on HTCC includes a photon power source 1, a processor unit 7, a wireless transmission module 8 and a wired interface module 9, wherein the photon power source 1 includes a selective permeable film 2, a laser Battery sheet 3, HTCC ceramic substrate 4, signal acquisition circuit board 5, heat sink 6; laser battery sheet 3 is electrically connected to HTCC ceramic substrate 4; HTCC ceramic substrate 4 is welded on signal acquisition circuit 5 board; signal acquisition circuit 5 board adopts aluminum substrate, and connected to the heat sink 6 through silicon rubber to realize the heat dissipation of the photon power supply 1; the processor unit 7 converts the electrical signal of the photon power supply 1 into a light intensity signal, and sends it through the wireless transmitting module 8 or the wired interface module 9 go out.

When the photon power measurement module is working, the laser light is irradiated on the photon power source 1, and the wavelength selection and power attenuation of the laser are carried out through the selective permeable membrane 2. The laser cell 3 and the HTCC ceramic substrate 4 are physically connected by organic/polymeric material bonding. , the electrical connection is realized by gold wire thermocompression ultrasonic bonding, the signal acquisition circuit 5 is used to realize the collection of the photoelectric conversion current signal of the laser cell 3 , and the heat sink 6 realizes the heat dissipation of the photon power supply 1 . At the same time, the bypass diode 11 and thermosensitive electronics are packaged on the back of the HTCC ceramic substrate 4 by wire bonding or pasting, the temperature of the photon power supply 1 is measured by the thermistor 10, and the bypass diode 11 realizes the failure of the laser cell 3 When the short circuit connection. The processor unit 7 is used to process the electrical signal converted by the photon power supply 1, and the wireless transmission module 8 and the wired interface module 9 are used for wireless/wired transmission of collected data.

Example 1:

This embodiment is a specific application example of the HTCC-based photon power measurement module of the present invention. In this embodiment, the photon power supply 1 includes a selective transmission mode with a wavelength of 808nm, a GaAs laser cell 3 , an HTCC ceramic substrate 4 , a signal acquisition circuit 5 and a heat sink 6 . The GaAs laser cell 3 is electrically connected to the HTCC ceramic substrate 4 through gold wire bonding, and the laser cell 3 is attached to the HTCC ceramic substrate 4 with conductive silver glue. Mounting holes are reserved on the back of the HTCC ceramic substrate 4 to mount a thermistor 10 and a bypass diode 11 to realize temperature monitoring and short-circuit isolation of the laser cell 3 . The HTCC ceramic substrate 4 is welded to the signal acquisition circuit 5 board by BGA, and collects the electrical signals of GaAs laser battery conversion and thermistor 10. The signal acquisition circuit 5 adopts an aluminum substrate, and is connected to the heat sink 6 through silicone rubber GD414. The heat dissipation of the photon power supply 1 is realized.

BGA (Ball Grid Array) - ball grid array packaging technology, high-density surface mount packaging technology. On the bottom of the package, the pins are ball-shaped and arranged in a grid-like pattern, hence the name BGA.

The processor unit 7 receives the electrical signal of the photon power supply 1, and then converts it into a light intensity signal and a temperature signal, and performs temperature correction on the light intensity signal according to the temperature signal, and the processed light intensity signal is sent out in a wireless/wired manner,

The wireless transmitting module 8 is composed of a programmable radio frequency module and an antenna, which programs the corrected light intensity signal and wirelessly sends the data to the receiving device; the wired interface module 9 in the photon power measurement module realizes information transmission with the receiving device through a serial port.

Example 2:

This embodiment is a specific application example of a large spot test system of the present invention. As shown in Figure 4, a high power density and large spot test system consists of several HTCC-based photon power measurement module arrays. The module sends the measured light intensity information to the receiving device of the large spot test system, and after data processing, the entire laser spot size and spot energy distribution are obtained.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.

Claims (10)

1. A photon power supply measurement module based on HTCC, characterized in that it comprises a photon power supply (1), a processor unit (7), a wireless transmission module (8) and a wired interface module (9), wherein:

the photon power supply (1) comprises a selective permeation membrane (2), a laser battery piece (3), an HTCC ceramic substrate (4), a signal acquisition circuit (5) board and a radiating fin (6);

the laser battery piece (3) is electrically connected with the HTCC ceramic substrate (4);

the HTCC ceramic substrate (4) is welded on the signal acquisition circuit (5) board;

the signal acquisition circuit (5) board is an aluminum substrate and is connected with the radiating fins (6) through silicon rubber, so that the radiation of the photon power supply (1) is realized;

the processor unit (7) converts the electric signal of the photon power supply (1) into a light intensity signal and sends the light intensity signal out through the wireless transmitting module (8) or the wired interface module (9).

2. The HTCC-based photonic power measurement module of claim 1, wherein: the back of the HTCC ceramic substrate (4) is provided with a mounting hole, and a thermistor (10) and a bypass diode (11) are attached to the mounting hole and used for monitoring the temperature of the laser battery piece (3) and isolating fault short circuit.

3. The HTCC-based photonic power supply measurement module according to claim 1, wherein: and the wired interface module (9) realizes information transmission with the receiving equipment through a serial port.

4. The HTCC-based photonic power supply measurement module according to claim 1, wherein: the HTCC ceramic substrate (4) is welded on a signal acquisition circuit (5) board in a spherical pin grid array packaging mode.

5. The HTCC-based photonic power measurement module of claim 1, wherein: the laser battery piece (3) is electrically connected with the HTCC ceramic substrate (4) in a gold wire bonding mode.

6. The HTCC-based photonic power supply measurement module according to claim 1, wherein: the signal acquisition circuit (5) board is connected with the radiating fin (6) through GD414 silicon rubber.

7. The HTCC-based photonic power supply measurement module according to claim 1, wherein: the wireless transmitting module (8) consists of a programmable radio frequency module and an antenna and is used for programming the light intensity signal and wirelessly transmitting data to the receiving equipment.

8. A big facula test system which characterized in that: the HTCC-based photon power supply measuring module comprises a plurality of HTCC-based photon power supply measuring modules and a receiving device, wherein the HTCC-based photon power supply measuring modules are arranged in a spaced array form, and each photon power supply measuring module sends a measured light intensity signal to the receiving device for data processing.

9. The large spot testing system of claim 8, wherein: the plurality of photon power supply measuring modules based on the HTCC are arranged into a shape like a Chinese character 'mi' or a rectangle.

10. The large spot testing system of claim 8, wherein: and a plurality of photon power supply measuring modules based on HTCC are communicated by adopting a ZigBee wireless network.

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