CN115719914A - A device capable of increasing the exposure power and exposure frequency of a laser - Google Patents

Abstract

The present disclosure provides a device capable of increasing the exposure power and exposure frequency of a laser, including: at least two processors, at least a part of the output pins of each processor are respectively connected to the corresponding laser; each of the processors An external voltage VDD is connected, and several lasers are commonly connected to an operating voltage VCC; the external voltage VDD outputs laser power to the corresponding laser together with the operating voltage VCC through the corresponding pin of the processor. The invention can improve the exposure power and exposure frequency of the laser of the laser imaging device, and improves the working efficiency.

Description

A device capable of increasing the exposure power and exposure frequency of a laser

technical field

The present disclosure relates to the technical field of laser direct imaging, in particular to a device capable of increasing the exposure power and exposure frequency of a laser.

Background technique

Referring to Fig. 1, the laser direct imaging device includes a processor 001. In addition to controlling various signal processing and operation control of the laser direct imaging device, the processor 001 is also responsible for providing a number of lasers (such as No. 01 to No. 1 on the right side of Fig. 1) No. 16 laser) provides power supply. Various function pins are set on the processor 001, and various function pins are connected with various signal lines to send various sending and receiving instructions of the processor to each sub-module of the laser direct imaging device, and to receive signals from each sub-module information sent. In order to maximize the performance of processor 001, all output pins of processor 001 are connected to corresponding lasers through data lines. For example, processor 001 in Figure 1 has 16 output pins outo0-outo15, each The output pins are connected to the No. 01-No. 16 lasers on the right one by one, that is, the performance of the processor 001 is maximized. Although this can improve the use efficiency of the processor 001, the following defects will occur: (1), the exposure power of each laser is low, take Figure 1 as an example: if the processor 001 controls 16 lasers to emit light together, each laser The laser can only receive the VCC operating voltage and the output voltage from a single processor. The exposure power of a single laser is low, and it is not easy to penetrate the thicker photosensitive coating on the screen (not shown). (2) The exposure frequency interval of the laser is relatively long. Referring to Figure 2, the processor 001 controls the pulse signal to move sequentially from left to right in Figure 2, so that the 16 lasers emit light sequentially from top to bottom. As can be seen from Figure 2, from the time point T/2 when the first laser 01 starts to expose to the time point 31T/2 when the 16th laser starts to expose, the intermediate interval is 15T, where T is the processor The pulse signal period, that is to say, within a time period T, the processor sends out a pulse signal once, and the pulse signal exposes a laser. It is understandable that the more the number of lasers, the less power each laser gets on average, which greatly reduces the exposure power of a single laser; at the same time, from the first laser to the last laser The longer the interval between lights, the longer the interval between two consecutive exposures of each laser.

Contents of the invention

A technical problem to be solved in the present disclosure is: how to increase the exposure power and light output frequency of the laser.

In order to solve the above technical problems, an embodiment of the present disclosure provides a device capable of increasing the exposure power and exposure frequency of a laser, including: at least two processors, at least a part of the output pins of each processor are respectively connected to the corresponding laser ; Each of the processors is connected to an external voltage VDD, and several of the lasers are commonly connected to an operating voltage VCC;

The external voltage VDD outputs the laser power to the corresponding laser together with the working voltage VCC through the corresponding pin of the processor;

Wherein, the total power received by a single laser from the external voltage VDD and the working voltage VCC cannot exceed the maximum power it can bear; part of it.

Further: one of the pins of the processor is also connected to a current-limiting resistor, and the current-limiting resistor is grounded; the current-limiting resistor is used to control the output power of the processor to the corresponding laser through the output pin .

Further, the at least two processors are of the same specification.

Further, the model of the processor is TLC5923RHS.

Further: the external voltage VDD is 5v.

Further, the processor also includes a SIN pin.

Further, the processor also includes an EN pin.

Further, the processor also includes a PWPD pin.

The disclosure provides a device capable of increasing the exposure power and exposure frequency of a laser. By using at least two processors, each processor supplies power to the laser through pins. Therefore, in theory, the more processors there are , the greater the output power of electric energy provided to a single laser; at the same time, the number of lasers is set to be less than the maximum number of lasers that can be connected to the output pin of the processor. Based on this design, the exposure power of a single laser is increased, and the exposure frequency is also increased. Therefore, the present disclosure utilizes multiple processors and relatively few lasers to achieve the technical effect of increasing the exposure power and exposure frequency of a single laser.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present disclosure. For those skilled in the art, other drawings can also be obtained according to these drawings without creative work.

FIG. 1 is a circuit diagram in which 16 output pins of a processor 001 disclosed in an embodiment of the disclosure are connected to 16 lasers;

Fig. 2 is the pulse signal diagram of exposing 16 lasers;

Figure 3 is a connection diagram of modules connected to 4 lasers when there are two processors;

Figure 4 is a connection diagram of modules connected to 4 lasers when there are three processors;

Figure 5 is a pulse signal diagram when there are 4 lasers;

Figure 6 is a circuit diagram for connecting with 4 lasers when there are 3 processors;

Detailed ways

Embodiments of the present disclosure will be further described in detail below in conjunction with the accompanying drawings and embodiments. The detailed description and accompanying drawings of the following embodiments are used to illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms, and is not limited to the specific embodiments disclosed herein. Rather, it includes all technical solutions falling within the scope of the claims.

These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that unless specifically stated otherwise, the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be interpreted as illustrative only and not as limiting.

It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "plurality" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inside" The orientation or positional relationship indicated by , "outside" and so on are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this disclosure. When the absolute position of the described object changes, the relative position relationship may also change accordingly.

Referring to Fig. 3, Fig. 3 is a connection diagram of modules connected to 4 lasers when there are two processors. The structure of the first processor in Fig. 3, the second processor and the third processor in Fig. 4 are exactly the same as the processor 001 in Fig. 1, and the first processor and the second processor in Fig. 3 and Fig. 4 The processor and the third processor in Fig. 4 also have 16 pins, but only 7 pins are schematically drawn in Fig. 3 and Fig. 4, which are respectively the first pin to the seventh pin, and the remaining nine pins are pins are not shown.

In Fig. 3, the first pin of the first processor and the first pin of the second processor are respectively connected with the first laser, and the second pin of the first processor is connected with the second pin of the second processor respectively Connect with the second laser, the third pin of the first processor and the third pin of the second processor are respectively connected with the third laser, the fourth pin of the first processor is connected with the fourth pin of the second processor The pins are respectively connected with the fourth laser. It can be understood that in FIG. 3, the external voltage VDD input to the first processor and the external voltage VDD input to the second processor are both output from their respective first pins and then input to the first laser. Therefore, the second The power obtained by a laser is greater than the power output only by the external voltage VDD of the first processor to the first laser, thereby increasing the exposure power of a single laser. It should be noted that, in FIG. 3 , the laser power received by the first laser is not only from the external voltage VDD of the first processor and the external voltage VDD of the second processor, but also partly comes from its own operating voltage VCC. It can be understood that, theoretically, the more the number of processor blocks, the greater the laser power (also can be understood as current and voltage power) received by the first laser, and the greater the output optical power of the laser.

Similarly, in Fig. 3, since the second laser, the third laser and the fourth laser all have the same specifications as the first laser, the exposure powers obtained by the second laser, the third laser and the fourth laser are also higher than those in Fig. 1 Among them, only the output power of the operating voltage of the processor 001 (equal to the first processor) to the first laser is large.

In Figure 4, the output pins corresponding to the three processors are respectively connected to the corresponding lasers. It can be understood that the laser power obtained by each laser is greater than that obtained by each laser in Figure 3 .

Referring to Fig. 3 and Fig. 4, it can be understood that, compared with Fig. 1, since there are only 4 lasers participating in the exposure (actually, each processor can connect up to 16 lasers), compared with the 16 lasers in Fig. 1 There are 12 less. Therefore, using the same pulse signal to control the exposure of 4 lasers, the time required for 4 lasers to complete the exposure is 4T. According to the relevant knowledge of the pulse signal, it can be known that the time interval between two consecutive exposures of each laser is 4T, see Figure 5, compared with Figure 1 and Figure 2, the exposure frequency has been significantly increased compared to the time interval of each laser being exposed twice in succession at 16T. It should be noted that the number of lasers is only exemplary, and the number of lasers can be increased under the premise that each processor can be connected with up to 16 lasers. It can be understood that, the more the number of lasers, the longer the time interval between two consecutive exposures of each laser. For example, assuming that the number of lasers is 8, the time for the processor to expose the 8 lasers is 8T, and the time interval between two consecutive exposures of each laser is also 8T.

It should be noted that, regardless of the final number of processor blocks, the total power received by a single laser from the external voltage VDD of the processor and its own operating voltage VCC cannot exceed the maximum power that the laser can withstand, so as to avoid Cause damage to the laser, so the number of processors is not infinitely increasing in that sense. Referring to FIG. 1 , on one of the pins 29 of the processor 001 , a current limiting resistor R19 is also connected, and the other end of the current limiting resistor R19 is grounded. The current-limiting resistor R19 is used to adjust the voltage (current) supplied by the processor to the laser, so as to ensure that even if the corresponding pins of several processors supply power to the corresponding laser, the total power received by the corresponding laser cannot exceed the laser energy. The maximum power that can be tolerated. Referring to Fig. 6, the boxes numbered 01 to 04 in the right half of Fig. 6 represent the first laser, the second laser, the third laser and the fourth laser, and each of the four lasers receives a part of the voltage source The other part comes from the external voltage VDD provided by each processor.

It can be seen from Fig. 6 that the third pins of the three processors are all connected to the first laser (box numbered 01), therefore, the three processors all provide the output current voltage VDD to the first laser. Similarly, the fourth pins of the three processors are all connected to the second laser (box numbered 02), therefore, the three processors provide the output external voltage VDD to the second laser. The sixth pins of the three processors are all connected to the third laser (box numbered 03), and the three processors provide the output external voltage VDD to the second laser. The 7th pins of the three processors are all connected to the fourth laser (box numbered 04), and the three processors all provide the external voltage VDD to the second laser.

In addition, the processor shown in FIG. 1 and FIG. 6 also includes a SIN pin for controlling the pulse signal as shown in FIG. 2 and FIG. 5 .

Further, the processor shown in FIG. 1 and FIG. 6 also includes an EN pin, and the processor starts to work when the EN pin is activated. Therefore, the EN pin guarantees the normal operation of the processor.

Further, the processor shown in Figure 1 and Figure 6 also includes a PWPD pin, the function of which is to prevent the input external voltage VDD from being powered down, and the backup power supply can be connected to the processor through the PWPD pin to ensure Processor works fine.

Further, the model of the processor in this application is preferably TLC5923RHS.

Preferably, the external voltage VDD in this application is 5V.

It should be noted that the processors, the first processor, the second processor, and the third processor in this application are all processors of the same specification.

The disclosure provides a device capable of increasing the exposure power and exposure frequency of a laser. By using at least two processors, each processor outputs laser power to the corresponding laser through a corresponding pin. Therefore, in theory, the processing The more blocks of lasers, the greater the output power of electrical energy provided to a single laser; at the same time, the number of lasers is set to be less than the maximum number of lasers that can be connected to the output pin of the processor. Based on this design, the exposure power of a single laser is increased, and the exposure frequency is also increased. Therefore, the present disclosure utilizes multiple processors and relatively few lasers to achieve the technical effect of increasing the exposure power and exposure frequency of a single laser.

In addition, "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. Words like "comprising" or "comprising" mean that the elements preceding the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

It should also be noted that, in the description of the present disclosure, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be interpreted in a broad sense, for example, it may be a fixed connection or a flexible connection. Disassembled connection, or integral connection; it can be directly connected or indirectly connected through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present disclosure according to specific situations. When it is described that a specific device is located between a first device and a second device, there may or may not be an intervening device between the specific device and the first device or the second device.

All terms used in the present disclosure have the same meaning as understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, general-purpose dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in idealized or extremely formalized meanings, unless explicitly stated herein Defined like this.

Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, techniques, methods and devices should be considered part of the description.

So far, the embodiments of the present disclosure have been described in detail. Certain details known in the art have not been described in order to avoid obscuring the concept of the present disclosure. Based on the above description, those skilled in the art can fully understand how to implement the technical solutions disclosed herein.

Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are for illustration only, rather than limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be equivalently replaced without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims (8)

1. A device capable of improving the exposure power and exposure frequency of a laser, characterized in that it comprises: at least two processors, at least a part of the output pins of each processor are respectively connected to the corresponding laser; each of the The processors are all connected to an external voltage VDD, and several lasers are commonly connected to an operating voltage VCC; The external voltage VDD outputs the laser power to the corresponding laser together with the working voltage VCC through the corresponding pin of the processor; Wherein, the total power received by a single laser from the external voltage VDD and the working voltage VCC cannot exceed the maximum power it can bear; part of it. 2. The device according to claim 1, wherein one of the pins of the processor is also connected to a current-limiting resistor, and the current-limiting resistor is grounded; the current-limiting resistor is used to control the processor Output power to the corresponding laser through the output pin. 3. The device according to claim 1, wherein the at least two processors are of the same specification. 4. The device according to any one of claims 1 to 3, wherein the model of the processor is TLC5923RHS. 5. The device according to claim 4, wherein the external voltage VDD is 5v. 6. The apparatus of claim 4, wherein the processor further comprises a SIN pin. 7. The apparatus of claim 4, wherein the processor further comprises an EN pin. 8. The apparatus of claim 4, wherein the processor further comprises a PWPD pin.

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