CN115616260B - Thin film probe card assembly - Google Patents
Thin film probe card assembly Download PDFInfo
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- CN115616260B CN115616260B CN202211174413.2A CN202211174413A CN115616260B CN 115616260 B CN115616260 B CN 115616260B CN 202211174413 A CN202211174413 A CN 202211174413A CN 115616260 B CN115616260 B CN 115616260B
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- 239000000523 sample Substances 0.000 title claims abstract description 100
- 239000010409 thin film Substances 0.000 title claims description 26
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 25
- 238000012360 testing method Methods 0.000 claims description 21
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- -1 polyoxymethylene Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 5
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The embodiment of the specification provides a film probe card assembly, including probe head, film and welt, the probe head includes support piece, and support piece is fixed in to the first face of film, and a plurality of filling holes have been seted up to the second face of film, fills to have flexible material in the filling hole, and the welt welds in the second face of film, is equipped with the cantilever structure that forms through the cutting with filling hole corresponding quantity, and cantilever structure's free end is located the perpendicular projection area in filling hole, and cantilever structure's free end has the probe in the one side welding in filling hole opposite to, and the probe is used for forming mechanical contact and electrical contact with the wafer that awaits measuring. By the cooperation of the cantilever structure and the flexible material in the filling hole, when the probe slides to puncture the oxide layer, the sliding direction and the sliding distance of the probe are controllable, and proper pressure is provided, so that the stable and effective contact is ensured to be formed by effectively puncturing the oxide layer.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a thin film probe card assembly.
Background
When testing unpackaged chips on a semiconductor wafer, a probe card is generally used to perform a test process, and as the semiconductor chips are miniaturized and integrated, the operating frequency of the chips is continuously increased, and high-frequency wafer-level testing is often performed by using a thin film probe card. When the thin film probe card is tested, the probe tip slides to puncture the natural oxide layer of the chip test pad to form contact with the test point, so that the sliding direction and the puncture force of the probe need to be reliable when the probe performs sliding action, and the chip is prevented from being damaged or bad contact is avoided, so that the pressure enough to puncture the oxide layer needs to be provided, the proper strength and the proper flexibility are also needed, and the effective contact can be ensured while the sliding direction is controlled.
Disclosure of Invention
In view of this, the embodiments of the present disclosure provide a thin film probe card assembly, which can ensure that the probe tip generates appropriate sliding during testing, the sliding direction is controllable, and appropriate pressure can be provided, so as to ensure that the oxide layer is effectively pierced to form stable and effective contact.
The embodiment of the specification provides the following technical scheme:
a thin film probe card assembly comprising:
a probe head comprising a support;
the first surface of the film is fixed on the supporting piece, the second surface of the film is provided with a plurality of filling holes, and flexible materials are filled in the filling holes;
the lining plate is welded on the second surface of the film, cantilever structures which are formed by cutting and correspond to the filling holes in number are arranged, the free ends of the cantilever structures are located in the vertical projection area of the filling holes, probes are welded on the surface, opposite to the filling holes, of the free ends of the cantilever structures, and the probes are used for forming mechanical contact and electrical contact with a wafer to be tested.
In the above scheme, a plurality of cantilever structures are formed by cutting the lining plate, the probes are welded at the free ends of the cantilever structures, and the free ends of the cantilever structures are abutted against the filling holes filled with the flexible material at the opposite sides of the welding positions of the probes. When in test, the probe is limited by the cantilever structure and pushed by the test point on the chip, and moves upwards along the swinging path of the cantilever structure, the cantilever structure has enough strength to limit the swinging path of the free end of the cantilever structure, so that the probe is prevented from deflecting or twisting in the horizontal direction, and the swinging action slides in the horizontal direction to puncture the oxide layer to form mechanical contact and electrical contact with the point to be tested; the free end is subjected to a reaction force provided by the flexible material after swinging upwards, so that the swinging position is limited, a proper contact force is provided, and effective contact is ensured.
The invention also provides a scheme that the adjacent cantilever structures are parallel or perpendicular to each other;
and/or, the shapes and sizes of the adjacent cantilever structures are the same.
The invention also provides a scheme, wherein the cantilever structure is C-shaped or U-shaped.
The invention also provides a scheme that the cantilever structure comprises a first straight line segment, an arc segment and a second straight line segment, wherein the first straight line segment is parallel to the second straight line segment, and the arc segment is an arc with the radius of 1-3 mm.
The invention also provides a scheme that the lengths of the first straight line segment and the second straight line segment are the same and are 2-4 mm.
The invention also provides a scheme, wherein the filling hole comprises a conical hole and a cylindrical hole.
The invention also provides a scheme that the round diameter of the filling hole towards the free end side of the cantilever structure is 0.5-2 mm.
The present invention also provides an aspect, the flexible material comprising polyimide, polyoxymethylene resin, polyurethane, nylon, and combinations thereof.
The invention also provides a scheme that the filling holes penetrate through the film.
The invention also provides a scheme, the probe head further comprises a flexible layer, a first surface of the flexible layer is fixedly connected with the supporting piece, and a second surface of the flexible layer is fixedly connected with the first surface of the film.
Compared with the prior art, the beneficial effects that above-mentioned at least one technical scheme that this description embodiment adopted can reach include at least: according to the thin film probe card assembly provided by the invention, the cantilever structure is matched with the flexible material, so that the deformation direction of the probe is restrained on the premise of ensuring the flexibility of the probe, and the contact stability of the probe is improved; the cantilever structure provides enough strength to avoid deflection or torsion of the probe in the horizontal direction, and the stability of the probe during sliding is maintained in the process of puncturing the oxide layer, so that the sliding direction and the sliding distance of the probe are controllable; by adjusting the material combination or the proportion of the flexible materials in the filling holes, proper flexibility and vertical supporting strength are provided, and stable and effective contact between the probe and the test point is ensured; the structural design of the film and the lining plate can also improve the durability of the probe card and prolong the service life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic side cross-sectional view of a thin film probe card assembly in one embodiment of the invention;
FIG. 2 is a schematic side cross-sectional view of a thin film probe card assembly in a probe head position in accordance with one embodiment of the invention;
FIG. 3 is an enlarged schematic side cross-sectional view of the location of the backing plate and probe in one embodiment of the invention;
FIG. 4 is a schematic top view of a liner in one embodiment of the invention;
FIG. 5 is a schematic bottom view of the liner and fill hole engagement in one embodiment of the invention;
wherein, 1, PCB board, 2, mounting bracket, 31, third fastening screw, 32, second fastening screw, 4, ZIF connector, 5, probe head, 511, regulating plate, 512, support piece, 52, backplate, 53, film, 54, probe, 55, glue layer, 56, flexible layer, 561, first fastening screw, 571, filling hole, 572, welt, 573, cantilever structure, 574, first straight line section, 575, circular arc section, 576, second straight line section, 58, baffle.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the description of the present specification, it should be understood that terms such as "upper", "lower", "inner", "outer", and the like in the exemplary embodiments of the present specification are used for describing the terms such as "first", "second", "third", and the like in the angles shown in the drawings, and should not be construed as limiting the exemplary embodiments of the present specification.
Currently, the communication industry and the consumer electronics industry develop rapidly, and the market puts higher requirements on the related performance of semiconductor products, so that the development progress of miniaturization and integration of semiconductor devices is greatly promoted. Among them, functional testing is one of the important processes for chip fabrication in the production of radio frequency chips (RadioFrequency, RF), particularly high frequency RF chips. When testing unpackaged chips on a semiconductor wafer, a thin film probe card is mostly adopted, and transmission lines of test signals are arranged on an elastic thin film in an array mode or an array mode, so that parasitic capacitance and parasitic inductance are reduced, a signal path is shortened, impedance matching degree is improved, and the method has the advantages of low crosstalk, high reliability, small damage to chips and the like, and is widely applied to wafer-level high-frequency test and analysis.
When the thin film probe card is tested, the probe at the tail end of the probe card slides under the thrust of the surface and punctures the natural oxide layer on the surface of the chip to be contacted with metal, so that the following problems need to be solved when the probe card is designed: the tip of the probe needs to provide a certain pressure to puncture the natural oxide layer of the chip test pad; the probe needs sufficient stability when puncturing the oxide layer to ensure the sliding path and direction; the probe head needs to have certain flexibility so as to ensure that all probes can be contacted with the chip test pad; the substrate on which the probes are mounted needs to have sufficient strength to reduce the contact failure caused by deformation due to the reaction force on the probes during testing.
In order to solve the above problems, the inventors improve the soldering lining plate and the film mechanism of the probe and propose a film probe card assembly. Firstly, arranging a plurality of cutting grooves on a lining plate, so that each cutting groove can form a cantilever structure, and a probe is welded on one surface of the cantilever structure facing to a chip to be tested; secondly, the one side of welt back to the chip that awaits measuring connects the film, sets up the filling hole in the position of the free end of corresponding cantilever structure on the film, wherein it has flexible material to pack, through such structural design, when the test, cantilever structure can control the ascending swing direction of probe, prevent that the probe from taking place the beat or torsion when the swing, the cantilever structure receives the reaction force of flexible material in the filling hole after upwards swinging to make the probe slip direction and slip distance when the slip of oxide layer surface controllable, and can make probe and chip form effectual contact through the elastic force of flexible material.
The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.
The thin film probe card assembly as shown in fig. 1 to 5 includes:
a probe head 5, the probe head 5 comprising a support 512;
a film 53, wherein a first surface of the film 53 is fixed to the support 512, a second surface of the film 53 is provided with a plurality of filling holes 571, and the filling holes 571 are filled with a flexible material;
a backing plate 572, the backing plate 572 is welded to the second surface of the film 53, a number of cantilever structures 573 formed by cutting corresponding to the filling holes 571 are provided, the free ends of the cantilever structures 573 are located in the vertical projection area of the filling holes 571, probes 54 are welded to the surface of the free ends of the cantilever structures 573 opposite to the filling holes 571, and the probes 54 are used for making mechanical contact and electrical contact with a wafer to be tested.
Specifically, the film probe card assembly is suitable for signal testing of integrated circuit structures, including but not limited to unpackaged chip testing on a wafer, and comprises a PCB board 1, a mounting frame 2, a ZIF connector 4 and a probe head 5. The PCB board 1 is usually a multilayer epoxy circuit board, on which a plurality of ZIF connectors 4 are distributed, and a signal trace and a power trace are contained in the PCB board, and a plurality of electronic components are soldered on the surface of the PCB board, and are structurally connected with a tester through the ZIF connectors 4, so that signal transmission is realized. The PCB1 is fixed to the mounting frame 2 by a third fastening screw 31; the central position of the PCB1 is hollowed and provided with a hollow structure, the second fastening screw 32 sequentially penetrates through the back plate 52, the adjusting plate 511 and the partition plate 58 to fix the probe head 5 in the hollow structure of the PCB1, and the first fastening screw 561 fixes the back plate 52 on the adjusting plate 511.
The adjusting plate 511 is provided with a supporting member 512 protruding toward the chip to be tested, and the supporting member 512 is made of ABS,4J29, etc., and is adhered and fixed to the adjusting plate 511. The supporting member 512 is covered with a film 53, that is, a first surface of the film 53 facing the supporting member 512 is fixedly connected with the supporting member 512, the material of the film 53 is usually polyimide, a second surface of the film 53 facing the chip to be tested is welded with a lining board 572, the probe 54 is welded on the lining board 572, a plurality of filling holes 571 are formed in the second surface of the film 53, and flexible materials are filled in the filling holes 571. The backing plate 572 is formed with a number of deformation grooves corresponding to the filling holes 571 by cutting to form cantilever structures 573, and free ends of the cantilever structures 573 are located in the vertical projection area of the filling holes 571. When wafer level testing is performed, each probe contacts the chip surface, and under the action of the pushing force, the free end of the cantilever structure 573 swings upwards into the filling hole 571, and pushes against the chip surface reversely under the action of the elastic force of the flexible material filled therein and slides, and the action completes the sliding penetration action on the oxide layer on the chip surface and forms mechanical contact and electrical contact with the metal material in the chip.
In the above scheme, the cantilever structure 573 can limit the swinging direction of the probe 54, prevent the probe from deflecting or twisting during swinging, restrict the deformation direction of the probe, improve the contact stability of the probe, provide the acting force of puncturing the oxide layer through the flexible material, and ensure the effective contact with the chip after puncturing.
In some embodiments, as shown in fig. 4 and 5, adjacent cantilever structures 573 are parallel or perpendicular to each other. It should be noted that the adjacent cantilever structures 573 may form other angles.
In some embodiments, as shown in fig. 4 and 5, the cantilever structures 573 are identical in shape and size.
In some embodiments, cantilever structure 573 is C-shaped.
In some embodiments, as shown in fig. 4 and 5, the cantilever structure 573 is U-shaped.
Specifically, the cantilever structure 573 includes a first straight line segment 574, a circular arc segment 575, and a second straight line segment 576, the first straight line segment 574 being parallel to the second straight line segment 576, the curved line segment 575 being a circular arc having a radius of 1-3 mm. Preferably, the first straight line segment 574 and the second straight line segment 576 are the same length and both have a length in the range of 2-4 mm.
It should be noted that the shape of the cantilever structure 573 is not limited to the C-shape or the U-shape in the above embodiment, and may include other regular shapes or irregular shapes.
In the above-described scheme, the deformation force of the probe is adjusted by adjusting the shape and/or arm length (distance between the free end and the fixed end of the cantilever structure) of the cantilever structure 573, so that the probe head structure has wider applicability.
In some embodiments, the shape of the filling hole 571 includes a tapered hole, a cylindrical hole. The tapered holes include a forward tapered hole (the circular radius of the tapered hole toward the liner 572 is larger than the circular radius of the word sense toward the support 512) and an inverse tapered hole (the circular radius of the tapered hole toward the liner 572 is smaller than the circular radius of the word sense toward the support 512). Preferably, the circular diameter of the filling hole 571 toward the free end side of the cantilever structure 573 is 0.5 to 2mm.
In the scheme, the deformation force of the probe is regulated by regulating the shape and/or the pore size of the filling hole, so that the probe head structure has wider applicability.
In some embodiments, the flexible material includes polyimide, polyoxymethylene, polyurethane, nylon, and combinations thereof.
In the scheme, the contact force between the probe and the chip to be tested is regulated by regulating the type and/or the proportion of the flexible material, so that the probe head structure has wider applicability.
In some embodiments, the fill hole 571 passes through the membrane 53.
In some embodiments, the probe head 5 further comprises a flexible layer 56, in particular, a first side of the flexible layer 56 is adhesively secured to a side of the support 512 facing the probes 54 by the glue layer 55, and a second side of the flexible layer 56 is adhesively secured to a first side of the membrane 53. By adding a flexible layer 56 between the support 512 and the membrane 53, backing 572, fine tuning in the vertical direction is achieved to enable the probes 54 to make more stable mechanical and electrical contact.
In some embodiments, the first fastening screw 561 penetrates the back plate 52 and the adjusting plate 511 in sequence to be screwed to the separator 58, and the pressure welding effect of the film 53 and the PCB1 is adjusted by adjusting the first fastening screw 561.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment focuses on differences from other embodiments.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A thin film probe card assembly, comprising:
a probe head comprising a support;
the first surface of the film is fixed on the supporting piece, the second surface of the film is provided with a plurality of filling holes, and flexible materials are filled in the filling holes;
the substrate is welded on the second surface of the film, cantilever structures which are formed by cutting and correspond to the filling holes are arranged, the free ends of the cantilever structures are located in the vertical projection area of the filling holes, probes are welded on the surface of the filling holes, which is opposite to the free ends of the cantilever structures, when wafer-level testing is carried out, the probes contact the surface of a chip, the free ends of the cantilever structures swing upwards under the action of thrust, enter the filling holes and reversely push the surface of the chip to slide under the action of the elastic force of the flexible materials filled in the filling holes, the action completes the sliding and puncturing action of oxide layers on the surface of the chip and forms mechanical contact and electrical contact with the metal materials in the chip, and the cantilever structures can limit the swinging direction of the probes and prevent the probes from swinging or twisting when swinging so as to restrict the deformation direction of the probes.
2. The thin film probe card assembly of claim 1, wherein adjacent cantilever structures are parallel or perpendicular to each other;
and/or, the shapes and sizes of the adjacent cantilever structures are the same.
3. The thin film probe card assembly of claim 1, wherein the cantilever structure is C-shaped or U-shaped.
4. The thin film probe card assembly of claim 3, wherein the cantilever structure comprises a first straight line segment, an arc segment and a second straight line segment, the first straight line segment being parallel to the second straight line segment, the arc segment being an arc having a radius of 1-3 mm.
5. The thin film probe card assembly of claim 4, wherein the first straight line segment and the second straight line segment are the same length and each is 2-4 mm.
6. The thin film probe card assembly of claim 1 wherein the fill hole comprises a tapered hole, a cylindrical hole.
7. The thin film probe card assembly of claim 6, wherein the filling hole has a circular diameter of 0.5-2 mm toward the free end side of the cantilever structure.
8. The thin film probe card assembly of claim 1 wherein the flexible material comprises polyimide, polyoxymethylene, polyurethane, nylon, and combinations thereof.
9. The thin film probe card assembly of claim 1, wherein the fill hole extends through the thin film.
10. The thin film probe card assembly of claim 1 wherein the probe head further comprises a flexible layer, a first face of the flexible layer fixedly attached to the support member, and a second face of the flexible layer fixedly attached to the first face of the thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211174413.2A CN115616260B (en) | 2022-09-26 | 2022-09-26 | Thin film probe card assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211174413.2A CN115616260B (en) | 2022-09-26 | 2022-09-26 | Thin film probe card assembly |
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| CN115616260A CN115616260A (en) | 2023-01-17 |
| CN115616260B true CN115616260B (en) | 2024-02-23 |
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| CN202211174413.2A Active CN115616260B (en) | 2022-09-26 | 2022-09-26 | Thin film probe card assembly |
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| TW202223407A (en) * | 2020-12-09 | 2022-06-16 | 義大利商探針科技公司 | Contact probe for probe heads of electronic devices and corresponding probe head |
| CN114200278A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
| CN114200279A (en) * | 2021-11-29 | 2022-03-18 | 强一半导体（苏州）有限公司 | Film probe card and probe head thereof |
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| CN115616260A (en) | 2023-01-17 |
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