CN115604637B - MEMS microphone and electronic equipment - Google Patents
MEMS microphone and electronic equipment Download PDFInfo
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- CN115604637B CN115604637B CN202211609323.1A CN202211609323A CN115604637B CN 115604637 B CN115604637 B CN 115604637B CN 202211609323 A CN202211609323 A CN 202211609323A CN 115604637 B CN115604637 B CN 115604637B
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
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Abstract
The invention provides an MEMS microphone and electronic equipment, wherein the MEMS microphone comprises a first acoustic component, a second acoustic component and a third acoustic component, wherein the first acoustic component is used for receiving an externally input sound wave signal and converting the sound wave signal into a capacitance change signal to be output; a second acoustic component for converting the capacitance change signal output by the first acoustic component into an electric signal and outputting the electric signal; a conditioning circuit comprising a filter circuit and a switching component for controlling whether the filter circuit is in an operative state or in an inoperative state; when the filter circuit is in a working state, the filter circuit is used for filtering out high-frequency signals in the electric signals output by the second acoustic component. The filter circuit is controlled to be in a working state by the switch component, and the frequency fluctuation at a high frequency can be adjusted to filter unnecessary frequency interference signals.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to an MEMS microphone and electronic equipment.
Background
In recent years, micro-Electro-Mechanical-System (MEMS) silicon microphones integrated based on MEMS technology have been increasingly applied to electronic products such as earphones, mobile phones, and computers. A general structure of such an electronic product is a package of a MEMS microphone formed by a substrate and a housing, and a MEMS chip and an ASIC (Application specific integrated Circuit) chip are mounted on the substrate inside the microphone.
The electrode terminals of the ASIC chip are respectively a ground terminal (GND), an output terminal (Vout) and a power terminal (Vdd), a DC signal is input through the power terminal Vdd, and the DC signal is converted into an AC signal at the output terminal Vout and is output. However, since the output process is interfered by frequency, a sharp rise and then attenuation are generated at the high frequency of the corresponding frequency response curve, and the frequency response curve with large fluctuation can greatly influence the product performance.
Disclosure of Invention
The invention provides an MEMS microphone and electronic equipment, which are used for solving the problem that the product performance is reduced due to the fact that signal output of an ASIC chip is interfered by high frequency in the prior art.
In a first aspect, the present invention provides a MEMS microphone comprising:
a first acoustic member having a first electrode and a second electrode for receiving an externally input acoustic wave signal and converting the acoustic wave signal into a capacitance change signal to be output;
a second acoustic member having an input terminal, a driving voltage terminal, a power supply terminal, a ground terminal, and an output terminal, the input terminal of the second acoustic member being electrically connected to the first electrode of the first acoustic member, the driving voltage terminal of the second acoustic member being electrically connected to the second electrode of the first acoustic member, and the second acoustic member being configured to convert a capacitance change signal output from the first acoustic member into an electrical signal and output the electrical signal;
the regulating circuit comprises a filter circuit and a switch assembly, one end of the filter circuit, which is connected with the switch assembly in series, is electrically connected with the grounding end of the second acoustic component, the other end of the filter circuit is electrically connected with the output end of the second acoustic component, and the switch assembly is used for controlling whether the filter circuit is in a working state or a non-working state: when the filter circuit is in a working state, the filter circuit is used for filtering out high-frequency signals in the electric signals output by the second acoustic component.
In an embodiment of the invention, the switch assembly includes at least two pads, and the at least two pads include a first pad and a second pad, and the first pad and the second pad are used for controlling whether the filter circuit is in an operating state or a non-operating state.
In an embodiment of the invention, the filter circuit comprises at least one reactive element comprising at least one capacitor, or at least one inductor, or a combination of at least one capacitor and at least one inductor.
In an embodiment of the present invention, the MEMS microphone further includes:
a substrate having a first surface and a second surface opposite the first surface, the first acoustic component being located on the first surface of the substrate, a second acoustic component being located on the first surface of the substrate and electrically connected to the first acoustic component;
a package housing that is located on a first surface of the substrate and forms an internal space and an external space with the MEMS microphone, the first acoustic component, the second acoustic component, and the adjustment circuit being located in the internal space;
the substrate is provided with a first surface and a second surface, wherein the substrate is provided with a sound hole in the thickness direction, or the substrate is provided with a sound hole in any position on the packaging shell and in the thickness direction, the sound hole penetrates through the inner space and the outer space.
In an embodiment of the invention, if the sound hole is disposed on the substrate, the ground terminals of the second acoustic component include a first ground terminal and a second ground terminal, one end of the filter circuit is electrically connected to the output terminal of the second acoustic component, and the other end of the filter circuit is electrically connected to the second ground terminal, the second acoustic component is electrically connected to the first ground terminal through a metal wire, the first pad is electrically connected to the first ground terminal, the second pad is electrically connected to the second ground terminal, and when the first pad and the second pad are connected, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
In an embodiment of the present invention, the first pad and the second pad are both disposed on the second surface of the substrate, the first pad and the second pad are in an annular off state, and the first pad and the second pad are both disposed around the acoustic hole, the annular off portion is an insulating portion, and the first pad and the second pad are communicated with each other in a predetermined manner.
In an embodiment of the present invention, the first pad is located on the second surface of the substrate and disposed around the acoustic hole, a ring of insulating portion is disposed outside the second pad, a part or all of the second pad is disposed on the surface of the first pad, and the first pad and the second pad are communicated with each other in a predetermined manner.
In an embodiment of the present invention, the first pad is located on the second surface of the substrate, the first pad is disposed around the acoustic hole, the second pad includes a third pad and a fourth pad, both the inside and the outside of the third pad are insulating portions, the third pad and the fourth pad are disposed at an interval through the insulating portions, and part or all of the third pad and the fourth pad are disposed on the surface of the first pad, and the third pad and the fourth pad are communicated with each other by a preset method, so that the first pad and the second pad are communicated with each other.
In an embodiment of the invention, the MEMS microphone further includes a ground connection terminal and an output pad, the ground connection terminal is located on the first surface of the substrate and electrically connected to the package housing, the output pad is located on the second surface of the substrate and electrically connected to the output terminal of the second acoustic component, and the first pad is electrically connected to the first ground terminal through the ground connection terminal.
In an embodiment of the invention, if the sound hole is disposed on the package housing, the ground terminals of the second acoustic component include a first ground terminal and a second ground terminal, one end of the filter circuit is electrically connected to the output terminal of the second acoustic component, the other end of the filter circuit is electrically connected to the first ground terminal, the second acoustic component is electrically connected to the second ground terminal through a metal wire, the first pad is electrically connected to the first ground terminal, the second pad is electrically connected to the second ground terminal, and when the first pad and the second pad are connected, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
In an embodiment of the invention, if the acoustic hole is disposed on the substrate, the MEMS microphone further includes a ground pad, the ground pad is located on the second surface of the substrate and disposed around the acoustic hole, the ground terminal of the second acoustic component is electrically connected to the ground pad, the output terminal of the second acoustic component includes a first output terminal and a second output terminal, one end of the filter circuit is electrically connected to the ground terminal of the second acoustic component, the other end of the filter circuit is electrically connected to the first output terminal, the first pad is electrically connected to the first output terminal, the second pad is electrically connected to the second output terminal, and when the first pad and the second pad are communicated, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
In an embodiment of the present invention, the first pad and the second pad are both disposed on the second surface of the substrate and are in a disconnected state, the disconnected portion is an insulating portion, and the first pad and the second pad are enabled to be connected in a predetermined manner.
In an embodiment of the invention, the filter circuit is located on the first surface of the substrate, or embedded in the substrate, or integrated in the second acoustic component.
In an embodiment of the present invention, a capacitive reactance range of the capacitor is 33nf to 200nf.
In an embodiment of the invention, the first acoustic component is a MEMS chip and the second acoustic component is an ASIC chip.
In a second aspect, the present invention also provides an electronic device comprising the MEMS microphone of the second aspect.
The invention provides an MEMS microphone and electronic equipment, wherein a regulating circuit is provided, the regulating circuit comprises a filter circuit and a switch component, and the switch component can control the filter circuit to be in a working state or a non-working state; when the switch part controls the filter circuit to be in a working state, the frequency fluctuation at a high frequency can be adjusted to filter out unnecessary frequency interference signals.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic circuit diagram of a MEMS microphone provided by the present invention;
fig. 2 is a schematic cross-sectional view of a MEMS microphone according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of a first structure of the bottom surface of the MEMS microphone based on FIG. 2;
FIG. 4 is a schematic diagram of a second structure of the bottom surface of the MEMS microphone based on FIG. 2;
FIG. 5 is a schematic diagram of a third structure of the bottom surface of the MEMS microphone based on FIG. 2;
FIG. 6 is a bottom fourth schematic view of the MEMS microphone of FIG. 2;
fig. 7 is a schematic cross-sectional view of a MEMS microphone according to a second embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of a MEMS microphone provided in accordance with a third embodiment of the present invention;
fig. 9 is a schematic bottom structure diagram of the MEMS microphone based on fig. 8.
[ reference numerals ]
10: a MEMS microphone; 100: a first acoustic member; 110 a second acoustic component; 120: a regulating circuit;
121: a filter circuit; 122: a switch assembly;
401: a substrate; 4011: a first surface;
4012: a second surface; 402: a first pad; 403: a second pad;
4031: a third pad; 4032: a fourth pad; 404: a package housing;
405: a sound hole; 406: a metal wire; 407: an output end;
4071: a first output terminal; 4072: a second output terminal; 408: a ground terminal;
4081: a first ground terminal; 4082: a second ground terminal; 409: a ground pad;
410: an output pad; 411: a ground connection end;
501: a protective layer; 601: an insulating section.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," and the like in the description and in the claims, and in the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that the embodiments described herein may be practiced otherwise than as specifically illustrated or described herein.
The technical terms to which the present invention relates are described below:
the microphone is a pressure sensor for finally converting a sound pressure signal into an electric signal, the small-sized microphone manufactured by using a micro electro mechanical system technology is called as an MEMS (micro electro mechanical system) microphone or a micro microphone, the MEMS microphone mainly comprises a substrate, a vibrating diaphragm and a back plate, a gap is arranged between the vibrating diaphragm and the back plate, the vibrating diaphragm can be deformed due to the change of air pressure, and the capacitance value between the vibrating diaphragm and the back plate is changed so as to be converted into the electric signal to be output.
A PCB (printed circuit Board, also called a substrate) is a support for electronic components and is also a carrier for electrically interconnecting electronic components.
The SMT (surface mounted Technology, abbreviated as SMT) surface mounting Technology mainly uses a mounter to mount some micro-miniature parts onto a PCB, and the production process includes: positioning a PCB, printing solder paste, mounting by a mounter, passing through a reflow furnace and performing manufacturing inspection.
In order to solve the problem that the performance of a product is reduced due to the fact that a signal output of an ASIC chip of an MEMS microphone is interfered by high frequency in the prior art, the invention provides the MEMS microphone and electronic equipment, a regulating circuit is provided, the regulating circuit comprises a filter circuit and a switch component, and the switch component can control the filter circuit to be in a working state or a non-working state; when the switch part controls the filter circuit to be in a working state, the frequency fluctuation at a high frequency can be adjusted to filter out unnecessary frequency interference signals.
The MEMS microphone and electronic device of the present invention are described below in conjunction with fig. 1-9.
Referring to fig. 1, fig. 1 is a circuit schematic diagram of a MEMS microphone according to the present invention. A MEMS microphone 10 includes a first acoustic component 100, a second acoustic component 110, and conditioning circuitry 120.
Illustratively, the first acoustic member 100, which has a first electrode Out and a second electrode Vbias, receives an acoustic wave signal inputted from the outside and converts the acoustic wave signal into a capacitance change signal to be outputted, may be a MEMS chip.
Specifically, the first acoustic component 100 is composed of an elastic diaphragm, a rigid perforated back electrode, and a substrate, the elastic diaphragm and the rigid perforated back electrode are configured to sense a sound pressure change through the elastic diaphragm, and convert a sound signal into a capacitance change signal for output.
Illustratively, the second acoustic component 110 includes an input terminal Vin, a driving voltage terminal Bias, a power terminal Vdd, a ground terminal GND, and an output terminal Vout. The second acoustic member is used to convert the capacitance variation signal output from the first acoustic member 100 into an electrical signal and output, and the second acoustic member 110 may be an ASIC chip.
Specifically, the input terminal of the second acoustic element 110 is connected to the first electrode Out of the first acoustic element 100, the driving voltage terminal Bias is connected to the second electrode Vbias of the first acoustic element 100 to supply a Bias voltage to the second acoustic element 110, and the power supply terminal Vdd, the ground terminal GND, and the output terminal Vout are connected to an external circuit. For example to an external circuit applied to the headphone product.
Illustratively, the adjusting circuit 120 includes a filter circuit 121 and a switch element 122, and one end of the filter circuit 121 and the switch element 122 connected in series is electrically connected to the ground GND of the second acoustic component 110, and the other end is electrically connected to the output terminal Vout of the second acoustic component 110. The switch component 122 is used to control whether the filter circuit 121 is in an operating state or in a non-operating state: when the filter circuit 121 is in an operating state, the filter circuit 121 is configured to filter a high-frequency signal in the electrical signals output by the second acoustic component 110, for example, the high-frequency signal with a frequency higher than 10kHz is filtered, so that a frequency response curve of the high-frequency signal is prevented from generating large fluctuation, unnecessary frequency interference is effectively filtered, and product performance is improved.
In some embodiments of the present invention, the switch assembly 122 may be formed of at least two pads, for example, the at least two pads include a first pad and a second pad, and the first pad and the second pad are used for controlling whether the filter circuit is in an operating state or a non-operating state.
In some embodiments of the present invention, the filter circuit 121 comprises at least one reactive element comprising at least one capacitor, or at least one inductor, or a combination of at least one capacitor and at least one inductor.
It should be noted that, since the first acoustic component 100 and the second acoustic component 110 both belong to low power consumption chips and have small driving capability, the filter circuit 121 shown in fig. 1 may include a capacitor, and the capacitive reactance of the capacitor is not suitable to be too small, so that the capacitive reactance range is set between 33nf and 200nf in the present invention, so as to better filter out unnecessary frequency interference.
In summary, because the frequency response curve of the conventional MEMS microphone generates a sharp rise and then attenuates at a high frequency, the MEMS microphone of the present invention adds a regulating circuit, the regulating circuit is composed of a filter circuit and a switch component, and the switch component controls the operating state of the filter circuit, so that the filter circuit can filter the high frequency signal output by the second acoustic component, and the frequency response curve output by the second acoustic component does not generate a sharp rise and then attenuate curve, thereby improving the product performance of the MEMS microphone of the present invention.
The following description is directed to the switch component 122 in the above-mentioned adjusting circuit and the specific structure of the MEMS microphone according to the present invention.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view of a MEMS microphone according to a first embodiment of the invention.
In some embodiments of the present invention, a MEMS microphone 10, in addition to comprising the first acoustic component 100, the second acoustic component 110, and the conditioning circuitry 120 described above, further comprises a substrate 401 and a package housing 404.
Specifically, the substrate 401 has a first surface 4011 and a second surface 4012 opposite to the first surface 4011, and the substrate 401 is provided with the acoustic hole 405 penetrating the first surface 4011 and the second surface 4012 in the thickness direction. The first acoustic member 100 is located on the first surface 4011 of the substrate 401, and the second acoustic member 110 is located on the first surface 4011 of the substrate 401 and is electrically connected to the first acoustic member 100 by a metal wire 406 (e.g., gold wire).
Specifically, the package housing 404 is located on the first surface 4011 of the substrate 401 and forms an internal space and an external space with the MEMS microphone 10, where the first acoustic component 100, the second acoustic component 110, and the adjusting circuit 120 are located.
Note that fig. 2 shows that the sound hole 405 is provided in the substrate 401, and actually the sound hole 405 may be provided at any position on the package housing 404 and may penetrate the internal space and the external space in the thickness direction. Therefore, the position of the sound hole 405 is not limited in the present invention, and may be determined according to actual requirements.
Illustratively, the conditioning circuit 120 shown in fig. 2 includes a filter circuit 121 and a switching component 122. The switch assembly 122 includes a first pad 402 and a second pad 403, the first pad 402 and the second pad 403 being used to control whether the filter circuit 121 is in an operating state or in a non-operating state. When the filter circuit 121 is in an operating state, the filter circuit 121 can adjust frequency fluctuations at high frequencies to filter out unnecessary frequency interference signals.
That is, the connection and disconnection of the first pad 402 and the second pad 403 corresponds to one switch assembly 122, and the connection of the first pad 402 and the second pad 403 can be controlled in a predetermined manner, so that the filter circuit 121 can be in an operating state, and when the filter circuit 121 is in the operating state, the problem of frequency interference of a high-frequency signal portion output by the second acoustic component 110 can be solved, and a high-frequency filtering function can be realized.
The acoustic hole 405 shown in fig. 2 is provided on the substrate 401, the ground GND of the second acoustic component 110 includes a first ground 4081 and a second ground 4082, one end of the filter circuit 121 is electrically connected to the output terminal 407 of the second acoustic component 110 (fig. 2 shows that the second acoustic component 110 is electrically connected to the output terminal 407 through the metal wire 406), the other end is electrically connected to the second ground 4082, the second acoustic component 110 is electrically connected to the first acoustic component 100 through the metal wire 406, the first pad 402 is electrically connected to the ground connection terminal 411, the ground connection terminal 411 is connected to the first ground 4081, and the second pad 403 is electrically connected to the second ground 4082. When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state; when the first pad 402 and the second pad 403 are not turned on, the filter circuit 121 is in a non-operating state.
In some embodiments of the present invention, the MEMS microphone 10 further includes a ground connection terminal 411 and an output pad 410, the ground connection terminal 411 being located on the first surface 4011 of the substrate 401 and electrically connected to the package housing 404. The output pad 410 is located on the second surface 4012 of the substrate 401 and is electrically connected to the output terminal 407 of the second acoustic component 110. Thus, the first pad 402 may be electrically connected to the first ground terminal 4081 through the ground connection terminal 411.
It should be noted that the positional relationship among the first pad 402, the second pad 403, and the filter circuit 121 is not limited to the one shown in fig. 2, for example, the filter circuit 121 may be disposed between the first pad 402 and the second pad 403, and the positional relationship among the filter circuit 121, the second ground terminal 4082, and the output terminal 407 is not limited to the one shown in fig. 2, for example, the filter circuit may be connected by a wire.
In some embodiments of the present invention, the filter circuit 121 shown in fig. 2 is disposed on the first surface 4011 of the substrate 401, but the filter circuit 121 may be embedded in the substrate 401 or integrated in the second acoustic component 110 to save space on the substrate. Therefore, the position of the filter circuit 121 is not limited in the present invention.
As can be seen from fig. 2, the first pad 402 is electrically connected to the first ground terminal 4081 through the ground connection terminal 411 to serve as a first ground terminal of the second acoustic component 110, the second pad 403 is electrically connected to the second ground terminal 4082, but the second ground terminal 4082 is not electrically connected to the second acoustic component 110, so that the first pad 402 is not electrically connected to the second pad 403 because the first ground terminal 4081 and the second ground terminal 4082 are not electrically connected. The filter circuit 121 is in the non-operating state at this time. When the first pad 402 and the second pad 403 can be connected (for example, the first pad 402 and the second pad 403 can be connected by a metal wire) in a predetermined manner, so that the first ground terminal 4081 and the second ground terminal 4082 are connected to a ground terminal GND, the filter circuit 121 can be in an operating state. When the filter circuit 121 is in an operating state, frequency fluctuations at high frequencies can be adjusted to filter out unwanted frequency interference signals.
In some embodiments of the present invention, when the packaged MEMS microphone is applied to an electronic product and SMT surface mount technology is performed at a client, the MEMS microphone is attached to a large board of the client, and the first pad 402 and the second pad 403 are connected by filling conductive material (e.g., solder) so that the first ground terminal 4081 and the second ground terminal 4082 are grounded and combined into one ground terminal GND, and the filter circuit 121 is in an operating state.
It should be noted that, the first pad 402 and the second pad 403 are connected through a certain preset manner, and the present invention is not limited to the conductive material filling manner, and may also adopt other manners, for example, when the first pad 402 and the second pad 403 are in an open state, the first pad 402 and the second pad 403 may be directly electrically connected through a testing device, and the performance of the filter circuit 121 between the two is directly tested under the condition that the circuit of the internal second acoustic component 110 is not affected, and particularly, when the MEMS microphone 10 fails, each component may be analyzed and screened in a targeted manner to analyze the failure cause thereof.
Therefore, the MEMS microphone shown in fig. 2 not only can effectively solve the problem of frequency interference of the high frequency part and can realize the function of high frequency filtering, but also can simplify the manufacturing process and improve the product performance by using the arrangement of the first bonding pad and the second bonding pad.
Further, in some embodiments of the present invention, based on the MEMS microphone structure shown in fig. 2, the present invention provides the following four different MEMS microphone structures to provide four different frequency response curves.
The first structure is as follows:
referring to fig. 3, fig. 3 is a schematic diagram of a first structure of a bottom surface of the MEMS microphone based on fig. 2, where the first bonding pad 402 and the second bonding pad 403 shown in fig. 3 are located on the second surface 4012 of the substrate 401, and the second surface 4012 of the substrate 401 is covered with an ink protection layer 501.
As shown in fig. 3, the first pad 402 and the second pad 403 are both disposed around the acoustic hole 405, and the first pad 402 and the second pad 403 are in a ring-shaped broken state, that is, the pad 502 may be cut into two parts, namely, the first pad 402 and the second pad 403, and the ring-shaped broken part is the insulating portion 601. Since the first pad 402 and the second pad 403 are incomplete pads that are disconnected by the insulating portion 601, the first pad 402 and the second pad 403 are not connected, and the filter circuit 121 cannot operate.
As can be seen from fig. 2, the second pad 403 is electrically connected to the second ground terminal 4082, the first pad 402 is electrically connected to the first ground terminal 4081, one end of the filter circuit 121 is electrically connected to the output terminal Vout407 of the second acoustic component 110, and the other end of the filter circuit 121 is electrically connected to the first ground terminal 4081, so that the first pad 402 and the second pad 403 can be connected in a predetermined manner. That is, the first ground terminal 4081 and the second ground terminal 4082 shown in fig. 2 may be combined into one ground terminal (GND) in a predetermined manner, and the filter circuit 121 is in an operating state.
For example, when SMT surface mount technology is performed at a client, the insulation 601 may be filled with a conductive substance (e.g., solder) to form a complete pad such that the first pad 402 and the second pad 403 are in communication.
It can be seen that the connection and disconnection of the first pad 402 and the second pad 403 shown in fig. 3 correspond to a switch assembly 122, and the connection and disconnection of the first pad 402 and the second pad 403 can be controlled in a predetermined manner. When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state, and the filter circuit 121 is in the operating state, so that the problem of frequency interference of the high-frequency signal part output by the second acoustic component 110 can be solved, and a high-frequency filtering function is realized.
The second structure is as follows:
referring to fig. 4, fig. 4 is a schematic diagram of a second structure of the bottom surface of the MEMS microphone based on fig. 2, where fig. 4 shows that the first bonding pad 402 and the second bonding pad 403 are located on the second surface 4012 of the substrate 401, and the surface of the substrate 401 is covered with an ink protection layer 501.
As shown in fig. 4, the first pad 402 is located on the second surface 4012 of the substrate 401 and disposed around the acoustic hole 405, a ring of insulating portion 601 is disposed outside the second pad 403, a portion of the second pad 403 is disposed on the surface of the first pad 402, that is, the second pad 403 is partially disposed within the ring shape of the first pad 402, and the first pad 402 and the second pad 403 are not communicated due to the presence of the insulating portion 601.
Fig. 4 is a diagram corresponding to a method of controlling connection and disconnection of the switch assembly 122 by separately providing a small pad (i.e., the second pad 403) on the first pad 402, and by using the first pad 402 and the second pad 403 together.
As can be seen from fig. 2, the second pad 403 is electrically connected to the second ground terminal 4082, the first pad 402 is electrically connected to the first ground terminal 4081, one end of the filter circuit 121 is electrically connected to the output terminal Vout407 of the second acoustic component 110, and the other end of the filter circuit 121 is electrically connected to the second ground terminal 4082, so that the first pad 402 and the second pad 403 can be connected in a predetermined manner. That is, the first ground terminal 4081 and the second ground terminal 4082 shown in fig. 2 may be combined into one ground terminal (GND) by a predetermined manner, and the filter circuit 121 starts to operate.
For example, when SMT surface mount technology is performed at a customer site, the insulation 601 may be filled with a conductive substance (e.g., solder) to form a complete pad such that the first pad 402 and the second pad 403 are in communication.
It can be seen that the connection and disconnection of the first pad 402 and the second pad 403 shown in fig. 4 is equivalent to one switch assembly 122, and the connection and disconnection of the first pad 402 and the second pad 403 can be controlled in a preset manner. When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state, and the filter circuit 121 is in the operating state, so that the problem of frequency interference of the high-frequency signal part output by the second acoustic component 110 can be solved, and a high-frequency filtering function is realized.
A third structure:
as another alternative to fig. 4, as shown in fig. 5, all of the second pads 403 may be disposed on the surface of the first pads 402, that is, all of the second pads 403 are disposed in the ring shape of the first pads 402, and the first pads 402 and the second pads 403 are not in communication due to the presence of the insulating portion 601.
Similarly, the connection and disconnection of the first pad 402 and the second pad 403 shown in fig. 5 corresponds to a switch assembly 122, and the connection and disconnection of the first pad 402 and the second pad 403 can be controlled in a predetermined manner. When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state, and the filter circuit 121 is in the operating state, so that the problem of frequency interference of the high-frequency signal part output by the second acoustic component 110 can be solved, and a high-frequency filtering function is realized.
A fourth configuration:
as shown in fig. 6, the first pads 402 are located on the second surface 4012 of the substrate 401 and the first pads 402 are disposed around the acoustic holes 405. The second bonding pad 403 includes a third bonding pad 4031 and a fourth bonding pad 4032, the inner and outer circles of the third bonding pad 4031 are insulating portions 601, the third bonding pad 4031 and the fourth bonding pad 4032 are spaced by the insulating portions 601, and part or all of the third bonding pad 4031 and the fourth bonding pad 4032 are arranged on the surface of the first bonding pad 402.
As can be seen from fig. 2, the second pad 403 is electrically connected to the second ground terminal 4082, the first pad 402 is electrically connected to the first ground terminal 4081, one end of the filter circuit 121 is electrically connected to the output terminal Vout407 of the second acoustic component 110, and the other end of the filter circuit 121 is electrically connected to the second ground terminal 4082, so that the first pad 402 and the second pad 403 can be connected in a predetermined manner. That is, the first ground terminal 4081 and the second ground terminal 4082 shown in fig. 2 may be combined into one ground terminal (GND) in a predetermined manner, and the filter circuit 121 is in an operating state.
For example, when SMT surface mounting technology is performed at a client, the insulating portion 601 may be filled with a conductive substance (e.g., solder) such that the third and fourth pads 4031 and 4032 communicate, and the third and fourth pads 4031 and 4032 communicate, in turn, such that the first and second pads 402 and 403 communicate.
It can be seen that connection and disconnection of the first pad 402 and the second pad 403 (including the third pad 4031 and the fourth pad 4032) shown in fig. 6 is equivalent to a switch assembly 122, and the third pad 4031 and the fourth pad 4032 can be controlled to be connected and disconnected in a preset manner, and when the third pad 4031 and the fourth pad 4032 are controlled to be connected, the first pad 402 and the second pad 403 are connected, so that the filter circuit 121 is in an operating state, and the filter circuit 121 is in the operating state, so that the problem of frequency interference of a high-frequency signal portion output by the second acoustic component 110 can be solved, and a function of high-frequency filtering is realized.
Referring to fig. 7, fig. 7 is a schematic cross-sectional view of a MEMS microphone according to a second embodiment of the invention. Fig. 7 is mainly different from fig. 2 in that an acoustic hole 405 in fig. 7 is provided at any position on the package housing 404 and penetrates the internal space and the external space of the package housing 404 in the thickness direction, and an acoustic hole 405 in fig. 2 is provided on the substrate 401 and penetrates the first surface 4011 and the second surface 4012 of the substrate 401 in the thickness direction. The connection method of the first pad 402 and the second pad 403 in fig. 7 is also different from that in fig. 2, and will be described in detail below.
In some embodiments of the present invention, a MEMS microphone 10, in addition to comprising the first acoustic component 100, the second acoustic component 11, and the conditioning circuitry 120 described above, further comprises a substrate 401 and a package housing 404.
Specifically, the substrate 401 has a first surface 4011 and a second surface 4012 opposite to the first surface 4011, and the substrate 401 is provided with an acoustic hole 405 penetrating the first surface 4011 and the second surface 4012 in the thickness direction. The first acoustic member 100 is located on the first surface 4011 of the substrate 401, and the second acoustic member 110 is located on the first surface 4011 of the substrate 401 and is electrically connected to the first acoustic member 100 by a metal wire 406 (e.g., gold wire).
Specifically, the package housing 404 is located on the first surface 4011 of the substrate 401 and forms an internal space and an external space with the MEMS microphone 10, and the first acoustic component 100, the second acoustic component 110, and the adjusting circuit 120 are located in the internal space.
Illustratively, the adjusting circuit includes a filter circuit 121 and a switch element 122, one end of the filter circuit 121 and the switch element 122 connected in series is electrically connected to the ground GND of the second acoustic component 110, and the other end is electrically connected to the output terminal Vout of the second acoustic component 110. The switch component 122 is used to control whether the filter circuit 121 is in an operating state or in a non-operating state: when the filter circuit 121 is in an operating state, the filter circuit 121 is configured to filter a high-frequency signal in the electrical signals output by the second acoustic component 110, for example, the high-frequency signal with a frequency higher than 10kHz is filtered, so that a frequency response curve of the high-frequency signal is prevented from generating large fluctuation, unnecessary frequency interference is effectively filtered, and product performance is improved.
In some embodiments of the present invention, the switch assembly 122 includes a first pad 402 and a second pad 403, the first pad 402 and the second pad 403 are used for controlling whether the filter circuit 121 is in an operating state or in a non-operating state.
Illustratively, the ground terminals of the second acoustic component 110 include a first ground terminal 4081 and a second ground terminal 4082, one end of the filter circuit 121 is electrically connected to the output terminal 407 of the second acoustic component 110, the other end is electrically connected to the first ground terminal 4081, the second acoustic component 110 is electrically connected to the second ground terminal 4082 through the metal wire 406, the first pad 402 is electrically connected to the first ground terminal 4081, and the second pad 403 is electrically connected to the second ground terminal 4082. When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state; when the first pad 402 and the second pad 403 are not turned on, the filter circuit 121 is in a non-operating state. When the filter circuit 121 is in an operating state, the filter circuit 121 can adjust frequency fluctuations at high frequencies to filter out unnecessary frequency interference signals.
That is, the connection and disconnection of the first pad 402 and the second pad 403 correspond to one switch component 122, and the connection of the first pad 402 and the second pad 403 can be controlled in a preset manner, that is, the first ground terminal 4081 and the second ground terminal 4082 are grounded and combined into one ground terminal (GND), so that the filter circuit 121 can be in an operating state, and when the filter circuit 121 is in the operating state, the problem of frequency interference of the high-frequency signal part output by the second acoustic component 110 can be solved, and the high-frequency filtering function can be realized.
Referring to fig. 8, fig. 8 is a schematic cross-sectional view of a MEMS microphone according to a third embodiment of the invention. Fig. 8 differs from fig. 2 in that the ground GND shown in fig. 2 includes a first ground 4081 and a second ground 4082, and the output terminal Vout shown in fig. 8 includes a first output terminal 4071 and a second output terminal 4072. Fig. 2 shows that the first and second ground terminals 4081 and 4082 are combined to one ground terminal GND by the connection between the first and second pads 402 and 403, so that the filter circuit 121 is in an operating state. Fig. 8 shows that the first pad 402 and the second pad 403 are connected to combine the first output terminal 4071 and the second output terminal 4072 into an output terminal Vout, so that the filter circuit 121 is in an operating state.
It can be seen that, by providing the first pad 402 and the second pad 403, the first pad 402 and the second pad 403 are connected or disconnected to control whether the filter circuit 121 is in an operating state or a non-operating state, which includes two ways:
the first mode is as follows: as shown in fig. 2 and 7, the ground terminals GND of the second acoustic component 110 include a first ground terminal 4081 and a second ground terminal 4082, and the first ground terminal 4081 and the second ground terminal 4082 are configured to control connection or disconnection of the first pad 402 and the second pad 403, so as to determine whether the first ground terminal 4081 and the second ground terminal 4082 are combined into one ground terminal GND, for example, to control connection of the first pad 402 and the second pad 403, so that the first ground terminal 4081 and the second ground terminal 4082 are combined into one ground terminal GND, so as to enable the filter circuit 121 to be in an operating state.
The second mode is as follows: as shown in fig. 8, the output terminal Vout of the second acoustic component 110 includes a first output terminal 4071 and a second output terminal 4072, and the first pad 402 and the second pad 403 are controlled to be connected or disconnected, so that whether the first output terminal 4071 and the second output terminal 4072 are combined into one output terminal Vout or not is determined, for example, the first pad 402 and the second pad 403 are controlled to be connected, so that the first output terminal 4071 and the second output terminal 4072 are combined into one output terminal Vout, so that the filter circuit 121 is in an operating state.
In some embodiments of the present invention, fig. 8 illustrates a MEMS microphone, where the acoustic port 405 is disposed on the substrate 401, and a MEMS microphone 10 includes the substrate 401 and the package 404, in addition to the first acoustic component 100, the second acoustic component 11, and the adjusting circuit 120 described above. The functions of the same components are referred to above and will not be described in detail.
Illustratively, the MEMS microphone 10 of the present invention further includes a ground pad 409, and the ground pad 409 is located on the second surface 4012 of the substrate 401 and surrounds the acoustic hole 405. The ground GND 408 of the second acoustic component 110 is electrically connected to the ground pad 409, the output terminal 407 of the second acoustic component 110 includes a first output terminal 4071 and a second output terminal 4072, one end of the filter circuit 121 is electrically connected to the ground GND 408 of the second acoustic component 110, the other end is electrically connected to the first output terminal 4071, the first pad 402 is electrically connected to the first output terminal 4071, and the second pad 403 is electrically connected to the second output terminal 4072.
When the first pad 402 and the second pad 403 are connected, the filter circuit 121 is in an operating state; when the first pad 402 and the second pad 403 are not connected, the filter circuit 121 is in a non-operating state. When the filter circuit 121 is in an operating state, the filter circuit 121 can adjust frequency fluctuations at high frequencies to filter out unnecessary frequency interference signals.
It should be noted that the first pad 402 and the second pad 403 can be connected in a predetermined manner, so that the filter circuit 121 can be in an operating state.
Referring to fig. 9, fig. 9 is a schematic bottom structure diagram of the MEMS microphone based on fig. 8. The first pads 402 and the second pads 403 are disposed on the second surface 4012 of the substrate 401. The first pad 402 and the second pad 403 are in a disconnected state, and the disconnected portion is the insulating portion 601.
Note that the first pads 402 and the second pads 403 may be long strips, and are not limited to the circular rings shown in fig. 3 to 6. Therefore, the shapes of the first pad 402 and the second pad 403 are not limited in the present invention, and may be determined according to actual needs.
When the first pad 402 and the second pad 403 can be controlled to be connected in a predetermined manner (for example, the first pad 402 and the second pad 403 can be connected by a metal wire), so that the first output terminal 4071 and the second output terminal 4072 are connected to form an output terminal Vout, the filter circuit 121 can be in an operating state. When the filter circuit 121 is in an operating state, the frequency fluctuation at a high frequency can be adjusted to filter out unnecessary frequency interference signals.
In some embodiments of the present invention, when the packaged MEMS microphone is applied to an electronic product and SMT surface mount technology is performed at a client, the MEMS microphone is attached to a large board of the client, and the first pad 402 and the second pad 403 are connected by filling conductive material (e.g., solder), so that the first output port 4071 and the second output port 4072 are combined into an output port Vout, and the filter circuit 121 is in an operating state.
It can be seen that the connection and disconnection of the first pad 402 and the second pad 403 shown in fig. 9 corresponds to one switch assembly 122, and by controlling the connection of the first pad 402 and the second pad 403, the filter circuit 121 can be in an operating state, and the filter circuit 121 can solve the problem of frequency interference of the high-frequency signal portion output by the second acoustic component 110 and realize a high-frequency filtering function.
In summary, the switch element 122 formed by the first bonding pad 402 and the second bonding pad 403 can control the filter circuit 121 to be in the working state in a predetermined manner. The filter circuit 121 is in an operating state, so that the problem of frequency interference of the high-frequency signal output by the second acoustic component 110 can be solved, and the function of high-frequency filtering is realized.
The embodiment of the present application further provides an electronic device, where the electronic device may include the MEMS microphone structure in any one of the above embodiments, and the structures and functions of similar components are as described above, and are not described herein again.
The electronic device may be, for example, a device with an audio playing function, such as a mobile phone, a sound box, a tablet computer, a television, a notebook computer, a point-and-read machine, and any device that converts a sound signal into an electrical signal or converts an electrical signal into a sound signal, and the embodiment of the present application is not limited to the type of the electronic device.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (15)
1. A MEMS microphone, comprising:
a first acoustic member having a first electrode and a second electrode for receiving an externally input acoustic wave signal and converting the acoustic wave signal into a capacitance change signal to be output;
a second acoustic component having an input terminal, a driving voltage terminal, a power supply terminal, a ground terminal, and an output terminal, wherein the input terminal of the second acoustic component is electrically connected to the first electrode of the first acoustic component, and the driving voltage terminal of the second acoustic component is electrically connected to the second electrode of the first acoustic component, and is configured to convert the capacitance variation signal output by the first acoustic component into an electrical signal for output;
the adjusting circuit comprises a filter circuit and a switch assembly, one end of the filter circuit after being connected with the switch assembly in series is electrically connected with the grounding end of the second acoustic component, the other end of the filter circuit is electrically connected with the output end of the second acoustic component, and the switch assembly is used for controlling whether the filter circuit is in a working state or a non-working state: when the filter circuit is in a working state, the filter circuit is used for filtering out a high-frequency signal in the electric signals output by the second acoustic component;
the switch assembly comprises at least two bonding pads, the at least two bonding pads comprise a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are used for controlling whether the filter circuit is in a working state or a non-working state.
2. The MEMS microphone of claim 1, wherein the filtering circuit comprises at least one reactive element comprising at least one capacitor, or at least one inductor, or a combination of at least one capacitor and at least one inductor.
3. The MEMS microphone of claim 2, further comprising:
a substrate having a first surface and a second surface opposite the first surface, the first acoustic component being located on the first surface of the substrate, a second acoustic component being located on the first surface of the substrate and electrically connected to the first acoustic component;
a package housing that is located on a first surface of the substrate and forms an internal space and an external space with the MEMS microphone, the first acoustic component, the second acoustic component, and the adjustment circuit being located in the internal space;
and the substrate is provided with a sound hole penetrating through the first surface and the second surface in the thickness direction, or the package shell is provided with a sound hole penetrating through the inner space and the outer space in any position in the thickness direction.
4. The MEMS microphone of claim 3, wherein if the acoustic hole is disposed on the substrate, the ground terminals of the second acoustic component include a first ground terminal and a second ground terminal, one end of the filter circuit is electrically connected to the output terminal of the second acoustic component, the other end of the filter circuit is electrically connected to the second ground terminal, the second acoustic component is electrically connected to the first ground terminal through a metal wire, the first pad is electrically connected to the first ground terminal, the second pad is electrically connected to the second ground terminal, and when the first pad and the second pad are connected, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
5. The MEMS microphone of claim 4, wherein the first pad and the second pad are both disposed on the second surface of the substrate, the first pad and the second pad are in an annular off state and both the first pad and the second pad are disposed around the sound hole, the annular off portion is an insulating portion, and the first pad and the second pad are communicated in a predetermined manner.
6. The MEMS microphone of claim 4, wherein the first bonding pad is located on the second surface of the substrate and is disposed around the sound hole, a ring of insulation is disposed outside the second bonding pad, and a part or all of the second bonding pad is disposed on the first bonding pad surface, so that the first bonding pad and the second bonding pad are communicated with each other in a preset manner.
7. The MEMS microphone of claim 4, wherein the first pad is located on the second surface of the substrate and is disposed around the sound hole, the second pad comprises a third pad and a fourth pad, the third pad and the fourth pad are both insulated portions, the third pad and the fourth pad are disposed at intervals through the insulated portions, and part or all of the third pad and the fourth pad are disposed on the surface of the first pad, and the third pad and the fourth pad are communicated with each other in a preset manner, so that the first pad and the second pad are communicated with each other.
8. The MEMS microphone of claim 4, further comprising a ground connection terminal on the first surface of the substrate and electrically connected to the package housing, and an output pad on the second surface of the substrate and electrically connected to the output terminal of the second acoustic member, the first pad being electrically connected to the first ground terminal through the ground connection terminal.
9. The MEMS microphone of claim 3, wherein if the acoustic hole is disposed on the package casing, the ground of the second acoustic component includes a first ground and a second ground, one end of the filter circuit is electrically connected to the output terminal of the second acoustic component, the other end of the filter circuit is electrically connected to the first ground, the second acoustic component is electrically connected to the second ground through a metal wire, the first pad is electrically connected to the first ground, the second pad is electrically connected to the second ground, and when the first pad and the second pad are connected, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
10. The MEMS microphone of claim 3, wherein if the acoustic hole is disposed on the substrate, the MEMS microphone further comprises a ground pad located on the second surface of the substrate and disposed around the acoustic hole, the ground terminal of the second acoustic component is electrically connected to the ground pad, the output terminal of the second acoustic component comprises a first output terminal and a second output terminal, one end of the filter circuit is electrically connected to the ground terminal of the second acoustic component, the other end of the filter circuit is electrically connected to the first output terminal, the first pad is electrically connected to the first output terminal, the second pad is electrically connected to the second output terminal, and when the first pad and the second pad are connected, the filter circuit is in an operating state; when the first bonding pad and the second bonding pad are not communicated, the filter circuit is in a non-working state.
11. The MEMS microphone of claim 10, wherein the first pad and the second pad are both disposed on the second surface of the substrate and are in an open state, the open portion being an insulating portion, the first pad and the second pad being made in a predetermined manner.
12. The MEMS microphone of claim 3, wherein the filter circuit is located on a first surface of the substrate, or embedded within the substrate, or integrated within the second acoustic component.
13. The MEMS microphone of claim 2, wherein the capacitance of the capacitor ranges from 33nf to 200nf.
14. The MEMS microphone of claim 1, wherein the first acoustic component is a MEMS chip and the second acoustic component is an ASIC chip.
15. An electronic device, characterized in that the electronic device comprises a MEMS microphone according to any one of claims 1 to 14.
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| US9824677B2 (en) * | 2011-06-03 | 2017-11-21 | Cirrus Logic, Inc. | Bandlimiting anti-noise in personal audio devices having adaptive noise cancellation (ANC) |
| CN203851292U (en) * | 2014-04-11 | 2014-09-24 | 歌尔声学股份有限公司 | MEMS microphone |
| WO2016032523A1 (en) * | 2014-08-29 | 2016-03-03 | Harman International Industries, Inc. | Auto-calibrating noise canceling headphone |
| US10771889B2 (en) * | 2015-11-20 | 2020-09-08 | Vesper Technologies Inc. | Acoustic filtering |
| US10257616B2 (en) * | 2016-07-22 | 2019-04-09 | Knowles Electronics, Llc | Digital microphone assembly with improved frequency response and noise characteristics |
| CN106658287A (en) * | 2016-11-11 | 2017-05-10 | 北京卓锐微技术有限公司 | Microphone system and amplifying circuit |
| CN106658303A (en) * | 2016-12-01 | 2017-05-10 | 北京卓锐微技术有限公司 | Microphone system and amplifying circuit |
| US11310591B2 (en) * | 2019-05-28 | 2022-04-19 | Apple Inc. | Vented acoustic transducers, and related methods and systems |
| CN210298076U (en) * | 2019-07-08 | 2020-04-10 | 青岛歌尔智能传感器有限公司 | MEMS microphone and electronic equipment |
| JP2022549232A (en) * | 2019-09-19 | 2022-11-24 | 深▲セン▼市韶音科技有限公司 | sound output device |
| CN211089966U (en) * | 2019-10-29 | 2020-07-24 | 深圳市三诺数字科技有限公司 | MEMS microphone and electronic equipment |
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