CN115555976A - Full-automatic metallographic grinding and polishing machine - Google Patents

Abstract

The invention relates to the technical field of grinding and polishing equipment, in particular to a full-automatic metallographic grinding and polishing machine which comprises a rack, a feeding mechanism, a photographing positioning mechanism, a grinding and polishing mechanism and a control system, wherein the feeding mechanism comprises a tray assembly, a plurality of chuck assemblies and a transverse moving assembly for driving the chuck assemblies to move along the X-axis direction and the Y-axis direction, the transverse moving assembly is arranged on the rack, and the chuck assemblies are arranged above the tray assembly and are in sliding connection with the transverse moving assembly; the photographing positioning mechanism comprises a perspective photographing component and a CCD photographing component, and the perspective photographing component and the CCD photographing component are arranged behind the tray component side by side. According to the invention, the feeding mechanism, the photographing positioning mechanism and the grinding and polishing mechanism are arranged, so that the automatic grinding and polishing of the PCB slices are realized, the labor intensity of workers is reduced, the grinding efficiency is improved, meanwhile, the perspective photographing assembly and the CCD photographing assembly are arranged on the photographing positioning mechanism, the requirements of simultaneously photographing blind holes, buried holes and through holes of the PCB slices are met, and the equipment investment cost is reduced.

Description

A fully automatic metallographic grinding and polishing machine

technical field

The invention relates to the technical field of grinding and polishing equipment, in particular to a fully automatic metallographic grinding and polishing machine.

Background technique

Sectional analysis technology, also known as sectioning or metallographic sectioning, microsectioning (English name: Cross-section, X-section), is a method to check the internal conditions and welding conditions of electronic components, circuit boards or mechanical components by observing the cross-sectional structure of samples. means of analysis. PCB slice analysis is a sample preparation method in which PCB slices are wrapped and sealed with a special transparent liquid resin, and then ground and polished. The testing process includes sampling, sealing, grinding, polishing, micro-etching and observation. Through these steps, Expose the internal structure or defects of the PCB slice, so as to observe the morphology and structure of the cross-section of the PCB slice, and determine the quality of the product by comparing and analyzing the microscopic morphology/structural information (plating layer, bonding surface, etc.) and product quality requirements. It provides an effective basis for the next step of parameter adjustment, defect avoidance, and quality improvement.

At present, when the operator inspects the product structure of the PCB in the laboratory, he mainly uses a grinding and polishing machine to calibrate the detection positions of multiple PCB slices of the same batch (usually the best detection position is the center of the hole on the PCB slice). Position), and then control the grinding and polishing machine to grind the cross section until it reaches the center of the hole, stop grinding and polish and clean it, and then proceed to the next detection process. However, the existing grinding and polishing machines have the following disadvantages in the processing of PCB slices. First, only one PCB slice can be grabbed at a time. For multiple PCB slices to be inspected, the processing continuity is poor and the work efficiency is low. Second, due to the detection of PCB slices needs, sometimes it is necessary to grind and observe the cross-sectional structure of blind holes, buried holes and through holes on the PCB slice at the same time, and the existing grinding and polishing machines only have the function of blind hole, buried hole detection or through hole detection alone, which cannot meet simultaneous The demand for testing requires a lot of equipment investment and time-consuming testing. Third, because the PCB slices are embedded manually when they are sealed, the angle deviation of the PCB slices may occur after sealing. The existing grinding and polishing machines cannot adjust the angle of the inclined PCB slices. , resulting in inaccurate positions of the center of the holes exposed after grinding and polishing, which affects the judgment of the results.

Therefore, there is an urgent need for a fully automatic metallographic grinding and polishing machine that can solve the above problems in the industry.

Contents of the invention

The purpose of the present invention is to provide a fully automatic metallographic grinding and polishing machine. In order to achieve the above object, the present invention adopts the following technical scheme, a fully automatic metallographic grinding and polishing machine, including a frame feeding mechanism, a photographing and positioning mechanism, a grinding and polishing mechanism and a control system, a feeding mechanism, a photographing and positioning mechanism, a grinding The polishing mechanism is arranged on the working table on the frame in turn, and the feeding mechanism, the camera positioning mechanism, and the grinding and polishing mechanism are all electrically connected to the control system, wherein:

The feeding mechanism includes a tray assembly, a plurality of chuck assemblies, and a traverse assembly that drives the chuck assemblies to move along the X-axis and Y-axis directions. The traverse assembly is arranged on the frame, and the chuck assemblies are arranged above the tray assembly and Sliding connection of traversing components;

The chuck assembly includes a jaw cylinder for clamping PCB slices, an angle compensation assembly that drives the jaw cylinder to rotate angularly, and a lifting assembly connected to the input end of the angle compensation assembly, and the jaw cylinder is connected to the output end of the angle compensation assembly ;

The photographing positioning mechanism includes a perspective photographing assembly and a CCD photographing assembly, and the perspective photographing assembly and the CCD photographing assembly are arranged side by side behind the tray assembly.

Further, the photographing positioning mechanism also includes a photographing bottom plate fixedly connected to the frame, a slide groove is provided at the front end of the photographing bottom plate, and the tray assembly is slidably arranged in the slide groove.

Further, the tray assembly includes a material feeding positioning frame, a tray detachably installed in the positioning frame, and a first air cylinder that drives the feeding positioning frame to slide in the chute.

Further, the tray assembly also includes a tray limiter arranged on the front end of the feeding positioning frame, a second air cylinder is connected to the tray limiter, and the second air cylinder drives the tray limiter to rotate upwards and lock it in the feeding positioning frame tray.

Further, the traverse assembly includes an X-axis sliding module and a Y-axis sliding module, the Y-axis sliding module is fixedly connected to the frame, and the X-axis sliding module is slidingly connected to the Y-axis sliding module.

Further, the chuck assembly also includes a chuck bracket connected to the X-axis sliding module, and the lifting assembly is arranged on the chuck bracket.

Further, the angle compensation assembly includes a first rotating member and a second rotating member perpendicular to each other, and a second motor and a third motor respectively driving the rotation of the first rotating member and the second rotating member, the first rotating member and the lifting The components are connected, the second rotating member is connected with the first rotating member, and the jaw cylinder is connected with the output end of the second rotating member.

Further, the grinding and polishing mechanism includes a water receiving tray and a grinding and polishing assembly arranged in the water receiving tray, and a first motor for driving the grinding and polishing assembly to perform grinding and polishing is provided on the lower part of the water receiving tray.

Further, the grinding and polishing mechanism also includes a cleaning assembly, the cleaning assembly includes a cleaning water tank fixedly connected to one end of the water receiving tray, and air nozzles and water flow nozzles are symmetrically arranged in the cleaning water tank.

Further, the perspective photographing unit is an X-ray photographing unit or an ultrasonic photographing unit.

Compared with the prior art, the present invention has the following beneficial effects:

(1) The present invention realizes full automatic grinding and polishing of PCB slices by setting a feeding mechanism, a camera positioning mechanism, and a grinding and polishing mechanism, which reduces the labor intensity of employees and improves grinding efficiency. The camera module and the CCD camera module meet the demand for taking pictures of blind holes, buried holes and through holes of PCB slices at the same time, and reduce equipment investment costs.

(2) By arranging a plurality of chuck assemblies, the present invention can grasp multiple PCB slices for grinding and polishing at one time, effectively improving the feeding efficiency of the PCB slices.

(3) In the present invention, by setting the angle compensation component, the position of the fixed PCB slice can be adjusted in conjunction with the imaging information of the camera positioning mechanism, and then input into the grinding and polishing mechanism for grinding and polishing, which ensures the accuracy of the grinding and polishing position of the PCB slice.

Description of drawings

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Fig. 1 is the overall structure schematic diagram of full-automatic metallographic grinding and polishing machine of the present invention;

Fig. 2 is the internal structure schematic diagram of full-automatic metallographic grinding and polishing machine of the present invention;

Fig. 3 is a schematic diagram of the arrangement structure of the tray assembly and the photographing positioning mechanism of the automatic metallographic grinding and polishing machine of the present invention;

Fig. 4 is the structural representation of the grinding and polishing mechanism of the automatic metallographic grinding and polishing machine of the present invention;

Fig. 5 is a schematic diagram of the explosive structure of the grinding and polishing mechanism of the automatic metallographic grinding and polishing machine of the present invention;

Fig. 6 is a schematic structural view of the tray assembly of the automatic metallographic grinding and polishing machine of the present invention;

Fig. 7 is a schematic structural diagram of the chuck assembly of the automatic metallographic grinding and polishing machine of the present invention;

Fig. 8 is a schematic structural diagram of the angle compensation assembly of the automatic metallographic grinding and polishing machine of the present invention;

Among them, 1-frame, 2-feeding mechanism, 21-tray assembly, 210-feed positioning frame, 211-tray, 2110-tray plate, 2111-fixture, 2112-tray bottom plate, 212-first cylinder, 213-Pallet limiter, 214-Second cylinder, 22-Clamp assembly, 220-Jaw cylinder, 221-Angle compensation assembly, 2210-First rotating part, 2211-Second rotating part, 2212-Second motor , 2213-third motor, 222-lifting assembly, 2220-fourth motor, 2221-screw module, 2222-vertical slide rail, 223-collet bracket, 23-transverse assembly, 230-X-axis sliding Module, 231-Y-axis sliding module, 24-tool setting instrument, 3-photograph positioning mechanism, 31-perspective camera component, 32-CCD camera component, 33-photograph base plate, 330-chute, 4-grinding and polishing Mechanism, 41-water tray, 42-grinding and polishing assembly, 420-coarse grinding disc, 421-medium grinding disc, 422-fine grinding disc, 423-polishing disc, 43-first motor, 44-cleaning component, 440- Cleaning water tank, 441-air nozzle, 442-water flow nozzle, 5-control system.

detailed description

The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments. Apparently, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the present invention, the orientation words used such as "up, down, left, right, top, bottom" usually refer to the directions shown in the drawings, or to the parts themselves, unless stated otherwise. In the vertical, vertical or gravitational direction; similarly, for the convenience of understanding and description, "inner and outer" refer to the inner and outer relative to the outline of each part itself, but the above-mentioned orientation words are not used to limit this invention.

As shown in Figures 1 to 8, the present invention provides a fully automatic metallographic grinding and polishing machine, including a frame 1, a feeding mechanism 2, a photographing and positioning mechanism 3, a grinding and polishing mechanism 4 and a control system 5, and the feeding mechanism 2. The photographing and positioning mechanism 3 and the grinding and polishing mechanism 4 are sequentially arranged on the working table of the frame 1. The feeding mechanism 2, the photographing and positioning mechanism 3, and the grinding and polishing mechanism 4 are all electrically connected to the control system 5, wherein: the feeding mechanism 2 It includes a tray assembly 21, a plurality of chuck assemblies 22, and a traverse assembly 23 that drives the chuck assemblies 22 to move along the X-axis and Y-axis directions. The traverse assembly 23 is arranged on the frame 1, and the chuck assemblies 22 are arranged on the tray assembly. 21 and is slidingly connected with the traverse assembly 23; in this embodiment, the tray assembly 21 has two groups, one group is used to place the PCB slices to be processed, and the other group is an empty plate, which is used to place the processed PCB slices; The head assembly 22 is also provided with two groups. The chuck assembly 22 includes a jaw cylinder 220 for clamping PCB slices, an angle compensation assembly 221 that drives the jaw cylinder 220 to rotate angularly, and is connected to the input end of the angle compensation assembly 221. The lifting assembly 222, the jaw cylinder 220 is connected to the output end of the angle compensation assembly 221; two sets of chuck assemblies 22 can realize the effect of grabbing two PCB slices at a time, and those skilled in the art can also set according to actual needs The number of collet assemblies 22.

Specifically, as shown in Fig. 2 to Fig. 3, in the present embodiment, the photographing positioning mechanism 3 includes a perspective photographing assembly 31 and a CCD photographing assembly 32, and the perspective photographing assembly 31 and the CCD photographing assembly 32 are arranged side by side behind the tray assembly 21. The photographing assembly 31 is an X-ray photographing assembly or an ultrasonic photographing assembly. Preferably, the X-ray photographing assembly is selected in this embodiment. Since the X-ray photographing assembly 31 adopts X-ray photographing and has a transmission function, it is used to obtain the blind hole of the PCB slice. or the image information of the buried hole; the CCD camera assembly 32 selects a CCD industrial camera with good color reproduction, stable image and high resolution to obtain the through-hole image information of the PCB slice. The purpose of taking pictures of blind holes, buried holes and through holes on the PCB at the same time on one device greatly improves the processing efficiency and saves equipment investment costs.

In the present invention, the operator first puts the PCB slices to be processed into a group of tray assemblies 21, and then controls the movement of the traverse assembly 23 through the control system 5, driving the jaw cylinder 220 of the chuck assembly 22 connected to it to move to Place the PCB slices to be processed on the tray assembly 21, and control the lifting assembly 222 to move downwards to drive the gripper cylinder 220 to clamp the PCB slices on the tray assembly 21, and then move the clamped PCB slices to the camera position Mechanism 3 takes pictures, and transmits the PCB slice image information to the control system 5. Finally, the control system 5 calculates the grinding position coordinates and the grinding amount of the PCB slice according to the PCB slice image information, and issues a command to the angle compensation component 221. After correcting the position of the PCB slice picked up by the jaw cylinder through angle rotation, it is transported to the grinding and polishing mechanism 4 for grinding and polishing. After the processing is completed, the chuck assembly 22 puts the processed PCB slice into another set of trays On the component 21, continue to repeat the last operation until the grinding and polishing of all PCB slices to be processed is completed, and the operation ends. The full-automatic metallographic grinding and polishing machine meets the requirements of simultaneous grinding and polishing of multiple PCB slices, and has good processing continuity and high processing efficiency. At the same time, the control system 5 calculates the rotation angle and The processing volume and processing precision ensure that the center position of the hole exposed by the ground and polished PCB slice is accurate, and the grinding and polishing quality is good.

Specifically, as shown in FIGS. 2-3 , in this embodiment, the photographing positioning mechanism 3 also includes a photographing base plate 33 fixedly connected to the frame 1. The front end of the photographing base plate 33 is provided with a chute 330, and the two sets of tray assemblies 21 slide Set in the chute 330. The present invention provides a tray assembly 21 that can slide back and forth along the chute 330 on the camera bottom plate 33, so that the operator can easily put the PCB slices in or out from the port of the grinding and polishing machine, and the structure is simple and practical.

Specifically, as shown in Fig. 2-Fig. 3 and Fig. 6, the tray assembly 21 in this embodiment includes a feeding positioning frame 210, a tray 211 detachably installed in the positioning frame 210, and a driving feeding positioning frame 210 in the chute. The first cylinder 212 that slides in 330, the front side of the feeding positioning frame 210 is provided with a U-shaped groove that matches the shape of the tray 211, and the tray 211 can be inserted into the U-shaped groove smoothly, ensuring that the PCB slices do not move during the movement process. Shaking will occur so as not to affect subsequent processing. In this embodiment, the tray 211 includes a tray plate 2110, a jig 2111 and a tray bottom plate 2112. The tray plate 2110 is provided with a plurality of through holes matching the jig 2111. The tray bottom plate 2112 is arranged under the tray plate 2110 and fixed thereto. connection, the tray bottom plate 2112 is provided with a drainage hole smaller than the through hole on the tray plate 2110, and the drainage hole is used to discharge the waste liquid generated during the grinding and polishing process. Place the PCB slice in the holding tank of the jig 2111 and seal it with transparent glue. Preferably, in order to ensure that the PCB slice is photographed clearly, the jig 2111 is made of transparent material, and the jig 2111 that seals the PCB slice is inserted into the through hole , and then insert the tray plate 2110 together with the tray bottom plate 2112 into the material feeding positioning frame 210 .

Specifically, as shown in FIG. 6, the tray assembly 21 in this embodiment also includes a tray stopper 213 arranged on the front end of the feeding positioning frame 210. The tray stopper 213 is connected with a second cylinder 214, and the second cylinder 214 drives the tray limiter 213 to rotate upwards to lock the tray 211 located in the feeding positioning frame 210. At this time, the tray 211 is fixed on all sides, which further ensures the stability of the PCB slice during the feeding process.

Specifically, as shown in FIG. 2 , in this embodiment, the traverse assembly 23 includes an X-axis sliding module 230 and a Y-axis sliding module 231. The Y-axis sliding module 231 is fixedly connected to the frame 1, and the X-axis The sliding module 230 is slidingly connected with the Y-axis sliding module 231, and the Y-axis sliding module 231 is provided with a first sliding member (not shown) connected with the X-axis sliding module 230 and a driving second A first drive motor that slides the slider along the Y-axis direction, and the X-axis sliding module 230 is provided with a second slider (not shown in the figure) and a second drive motor that drives the second slider to slide along the X-axis direction , the chuck assembly 22 is connected to the second slider, and the X-axis sliding module 230 is connected to the first slider. The control system 5 controls the first drive motor and the second drive motor, and then controls the motor on the chuck assembly 22. The PCB slices are moved to above the corresponding processing stations along the X-axis and Y-axis respectively.

Specifically, as shown in FIG. 2 , FIG. 7 and FIG. 8 , the chuck assembly 22 in this embodiment includes a chuck bracket 223 slidingly connected with the X-axis sliding module 23 , and the lifting assembly 222 is arranged on the chuck bracket 223 In this embodiment, the lifting assembly 222 includes a fourth motor 2220 arranged on the chuck bracket 223, the output end of the fourth motor 2220 is connected to a screw module 2221 through transmission, and the sliding platform on the screw module 2221 and the angle compensation The assembly 221 is fixedly connected, and the two sides of the chuck bracket 223 are also symmetrically provided with vertical slide rails 2222 that are compatible with the angle compensation assembly 221. The fourth motor 2220 drives the screw module 2221 to rotate, and then drives the angle compensation assembly 221 Moving up and down along the vertical slide rail 2222 realizes the up and down position movement of the jaw cylinder 223 for clamping the PCB slice along the Z-axis direction at each station.

Specifically, as shown in FIG. 3 , a tool setting instrument 24 is also provided between the tray assembly 21 and the camera positioning mechanism 3 in this embodiment. When the jaw cylinder 220 moves above the tool setting instrument 24, the tool setting instrument 24 will The position information of the gripper cylinder 220 is transmitted to the control system 5. At this time, since the position of the tray assembly 21 is known, the control system 5 controls the gripper cylinder 220 to accurately grasp the position in the tray assembly 21 according to the position information of the feedback gripper cylinder 220. Fixture 2111 with PCB slices embedded.

Specifically, as shown in FIGS. 7-8 , the angle compensation assembly 221 in this embodiment includes a first rotating member 2210 and a second rotating member 2211 arranged perpendicular to each other, and drives the first rotating member 2210 and the second rotating member respectively. The second motor 2212 and the third motor 2213 of the rotation of 2211, the first rotating member 2210 is connected with the lifting assembly 222, the second rotating member 2211 is connected with the first rotating member 2210, and the output of the jaw cylinder 220 and the second rotating member 2211 end connection. Since the PCB slice is manually embedded in the holding groove of the jig 2111, there may be an angle deviation when the PCB slice is sealed. The image information of the slice is sent to the control system 5, and the control system 5 analyzes and calculates its position coordinates and deviation angle according to the image information of the PCB slice, and then sends commands to the second motor 2212 and the third motor 2213 to control the first motor 2212 and the third motor 2213 respectively. The rotating part 2210 and the second rotating part 2211 rotate at an angle, and then control the rotation of the jig 2111 on the jaw cylinder 220 connected to it, correct the angle deviation when the PCB slice is sealed, and then enter the grinding and polishing mechanism 4 for grinding and polishing. Improved processing accuracy.

Specifically, as shown in FIGS. 4-5 , the grinding and polishing mechanism 4 in this embodiment includes a water receiving tray 41 and a grinding and polishing assembly 42 arranged in the water receiving tray 41. The bottom of the water receiving tray 41 is provided with a driving grinding The polishing assembly 42 is a first motor 43 for grinding and polishing. In order to ensure the grinding quality, PCB slices need to be sprayed with grinding liquid and polishing liquid during the grinding and polishing process. The water receiving tray 41 is set to collect the sprayed waste liquid and the grinding impurities before discharging, prolonging the service life of the equipment.

Specifically, as shown in Figure 5, the grinding and polishing assembly 42 of this embodiment includes a coarse grinding disc 420, a middle grinding disc 421, a fine grinding disc 422 and a polishing disc 423 respectively driven by four first motors 43. Grinding discs with different surface roughness can gradually grind PCB slices to ensure the quality of grinding.

Specifically, as shown in FIGS. 4-5 , the grinding and polishing mechanism 4 in this embodiment also includes a cleaning assembly 44, and the cleaning assembly 44 includes a cleaning water tank 440 fixedly connected to one end of the water receiving tray 41. The cleaning water tank 440 is symmetrically arranged There are air nozzles 441 and water flow nozzles 442. After grinding and polishing, the PCB slices enter the cleaning assembly 44 again. After water pressure spraying is carried out through the water flow nozzles 442, airflow drying is carried out through the air nozzles 441 to ensure the cleanliness of the PCB slices. , to avoid the impurity produced in the grinding and polishing process from affecting the determination result, the grinding and polishing mechanism 4 also includes an external recovery filter mechanism (not shown in the figure), the recovery filter mechanism is connected with the water receiving tray 41, and the waste produced in the grinding and polishing process The liquid and impurities can be concentrated in the recovery filter mechanism for recovery treatment.

Work process of the present invention is as follows:

(1) The operator inserts the tray 211 with PCB slices and the tray 211 without PCB slices into the feeding positioning frame 210 respectively, starts the control system 5, the second cylinder 214 drives the tray limiter 213 to rotate upwards, and locks Trays 211 located in the feeding positioning frame 210, at this time, two pallets 211 are fixed on all sides;

(2) The control system 5 controls the first cylinder 212 to work, and the two groups of tray assemblies 21 slide along the chute 330 under the action of the first cylinder 212 in a direction close to the photographing positioning mechanism 3;

(3) The control system 5 controls the traverse assembly 23 to drive the two chuck assemblies 22 to move above the tray 211 with PCB slices, and controls the lifting assembly 222 to move downward, so that the two clamping jaw cylinders 220 are respectively clamped and sealed. The jig 2111 of the PCB slice goes to the camera positioning mechanism 3 to take pictures, and then transmits the PCB slice image information to the control system 5;

(4) The control system 5 automatically calculates the position information, grinding amount and angle deviation of the PCB slice located in the jig 2111 according to the PCB slice image information, and controls the first rotating member 2210 and the second rotating member 2212 in the angle compensation assembly 221 to generate an angle After the rotation compensation, the jaw cylinder 220 puts the jig 2111 with the PCB slice solidly sealed into each station of the polishing and grinding mechanism 4 to grind and polish them sequentially;

(5) After the processing is completed, the jaw cylinder 220 puts the ground and polished PCB slicing jig 2111 on the tray 211 without PCB slicing;

(6) Repeat step 1-step 5 until the PCB slices on the tray 211 are all processed, and the two sets of tray assemblies 21 slide out along the chute 330 under the action of the second cylinder 212 to the direction away from the camera positioning mechanism 3 , the operator can take out the tray assembly 21 at this time, and the processing is finished.

It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and/or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and/or combinations thereof.

It should be noted that the terms "first" and "second" in the specification and claims of the present application and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein can be practiced in sequences other than those illustrated or described herein.

The present invention has been further described above with the help of specific embodiments, but it should be understood that the specific description herein should not be construed as limiting the spirit and scope of the present invention. Various modifications made in the embodiments all belong to the protection scope of the present invention.

Claims (10)

1. A full-automatic metallographic grinding and polishing machine, characterized in that, comprises frame (1), feeding mechanism (2), photographing positioning mechanism (3), grinding and polishing mechanism (4) and control system (5), Described feeding mechanism (2), photographing positioning mechanism (3), grinding and polishing mechanism (4) are arranged on the working table of described frame (1) successively, described feeding mechanism (2), photographing positioning mechanism ( 3), the grinding and polishing mechanism (4) is electrically connected with the control system (5), wherein: The feeding mechanism (2) includes a tray assembly (21), a plurality of chuck assemblies (22) and a traverse assembly (23) that drives the chuck assemblies (22) to move along the X-axis and Y-axis directions, the The traversing assembly (23) is arranged on the frame (1), the chuck assembly (22) is arranged above the tray assembly (21) and is slidably connected with the traversing assembly (23); The chuck assembly (22) includes a jaw cylinder (220) for clamping PCB slices, an angle compensation assembly (221) that drives the jaw cylinder (220) to rotate angularly, and is connected with the angle compensation assembly ( The lifting assembly (222) connected to the input end of 221), the jaw cylinder (220) is connected to the output end of the angle compensation assembly (221); The photographing positioning mechanism (3) includes a perspective photographing assembly (31) and a CCD photographing assembly (32), and the perspective photographing assembly (31) and the CCD photographing assembly (32) are arranged side by side on the tray assembly (21) the rear. 2. The full-automatic metallographic grinding and polishing machine according to claim 1, characterized in that, said photographing positioning mechanism (3) also includes a photographing base plate (33) fixedly connected with said frame (1), said The front end of the photographing bottom plate (33) is provided with a chute (330), and the tray assembly (21) is slidably arranged in the chute (330). 3. The full-automatic metallographic grinding and polishing machine according to claim 2, characterized in that, the tray assembly (21) includes a feeding positioning frame (210), a detachably installed in the positioning frame (210) The tray (211) and the first air cylinder (212) that drives the feeding positioning frame (210) to slide in the chute (330). 4. The fully automatic metallographic grinding and polishing machine according to claim 3, characterized in that, the tray assembly (21) also includes a tray stopper (213) arranged on the front end of the feeding positioning frame (210) ), the pallet limiter (213) is connected with a second cylinder (214), and the second cylinder (214) drives the pallet limiter (213) to rotate upwards and lock the positioning frame (210) within said tray (211). 5. The full-automatic metallographic grinding and polishing machine according to claim 1, wherein the traverse assembly (23) comprises an X-axis sliding module (230) and a Y-axis sliding module (231), The Y-axis sliding module (231) is fixedly connected to the frame (1), and the X-axis sliding module (230) is slidingly connected to the Y-axis sliding module (231). 6. The fully automatic metallographic grinding and polishing machine according to claim 5, characterized in that, the chuck assembly (22) also includes a chuck bracket (223) connected to the X-axis sliding module (230), The lifting assembly (222) is arranged on the chuck support (223). 7. The full-automatic metallographic grinding and polishing machine according to claim 1, characterized in that, the angle compensation assembly (221) comprises a first rotating member (2210) and a second rotating member (2211) arranged vertically to each other, And the second motor (2212) and the third motor (2213) that respectively drive the rotation of the first rotating member (2210) and the second rotating member (2211), the first rotating member (2210) and the lifting assembly (222) connected, the second rotating member (2211) is connected to the first rotating member (2210), and the jaw cylinder (220) is connected to the output end of the second rotating member (2211). 8. The full-automatic metallographic grinding and polishing machine according to claim 1, characterized in that, the grinding and polishing mechanism (4) comprises a water receiving tray (41), and a water receiving tray (41) arranged in the Grinding and polishing assembly (42), the lower part of the water receiving tray (41) is provided with a first motor (43) that drives the grinding and polishing assembly (42) to perform grinding and polishing. 9. The full-automatic metallographic grinding and polishing machine according to claim 8, characterized in that, the grinding and polishing mechanism (4) also includes a cleaning assembly (44), and the cleaning assembly (44) includes a One end of the disc (41) is fixedly connected to a cleaning water tank (440), and air nozzles (441) and water flow nozzles (442) are symmetrically arranged in the cleaning water tank (440). 10. The fully automatic metallographic grinding and polishing machine according to claim 1, characterized in that, the perspective photographing assembly (31) is an X-ray photographing assembly or an ultrasonic photographing assembly.

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