CN115440686B - Copper sheet and bonding structure - Google Patents
Copper sheet and bonding structure Download PDFInfo
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- CN115440686B CN115440686B CN202211395568.9A CN202211395568A CN115440686B CN 115440686 B CN115440686 B CN 115440686B CN 202211395568 A CN202211395568 A CN 202211395568A CN 115440686 B CN115440686 B CN 115440686B
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- connecting part
- frame
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- 229910052802 copper Inorganic materials 0.000 title claims abstract description 83
- 239000010949 copper Substances 0.000 title claims abstract description 83
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 8
- 150000001879 copper Chemical class 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a copper sheet and a bonding sheet structure, relating to the field of packaging and manufacturing of semiconductor power devices, wherein the copper sheet comprises: the fin, be equipped with the first connecting portion of S utmost point and the second connecting portion of S utmost point on the bottom surface, the S utmost point picks up the portion, locate fin top one end, the S utmost point is picked up and is equipped with a step 4,G utmost point between portion and the fin and picks up the portion, it is connected through connecting portion to pass through with one side that the S utmost point picked up the portion, the G utmost point picked up a portion one end and is equipped with G utmost point connecting portion, G utmost point connecting portion bottom surface is equipped with bellied chip and connects the face, the G utmost point picked up the portion and is equipped with frame G utmost point connecting portion 9 with the other end that G utmost point connecting portion are relative, the bonding die structure includes: the copper sheet is connected with the chip and the frame. The invention can realize double-sided heat dissipation of the bottom and the top of the device, and adjust the heat dissipation area of the top of the device, thereby adapting to meet different heat dissipation requirements, greatly improving the UPH value of product production and manufacturing and saving time and cost by using copper sheet structures for S poles and G poles of the device.
Description
Technical Field
The invention relates to the field of packaging and manufacturing of semiconductor power devices, in particular to a copper sheet and a bonding sheet structure.
Background
Bonding wires of the existing semiconductor power device are generally gold wires, copper wires and aluminum wires, and the gold wires have good conduction efficiency but higher cost; copper wires are easy to oxidize, and have the risks of craters and poor tension, and the wire diameter of 18 mu m has a large defect; the diameter of the aluminum wire is thick, the arc height is difficult to control, and the electric conductivity and the heat conductivity are poor. The bonding wire process has the disadvantages that the heat dissipation of a device is poor under the condition of high power, the device is seriously heated, and the reliability of the device is greatly influenced. Manufacturing using the bonding wire process typically requires bonding multiple bonding wires, resulting in a lower number of wire outputs Per Hour (Unit Per Hour, UPH) during bonding wire production. The top of the device is not provided with a radiating fin and a radiating function, so that a larger power device cannot meet the radiating requirement, and the device is less in installation adaptation scenes.
Disclosure of Invention
The embodiment of the invention provides a copper sheet, which can solve the problems in the prior art.
An embodiment of the present invention provides a copper sheet, including:
the bottom surface of the radiating fin is provided with an S-pole first connecting part and an S-pole second connecting part;
the S-pole picking part is arranged at one end of the top of the radiating fin, and a step 4 is arranged between the S-pole picking part and the radiating fin;
the G utmost point picks up the portion, passes through connecting portion with one side of S utmost point pickup portion and is connected, and G utmost point pickup portion one end is equipped with G utmost point connecting portion, and G utmost point connecting portion bottom surface is equipped with bellied chip and connects the face, and the other end relative with G utmost point connecting portion that the G utmost point picked up the portion is equipped with frame G utmost point connecting portion 9.
Furthermore, the first S-pole connecting portion and the second S-pole connecting portion comprise two rectangular bosses with the same height, a groove is formed between the two rectangular bosses, and chamfers are arranged on the periphery of the bottom of each rectangular boss.
Furthermore, two ends of one side surface of the radiating fin, which is far away from the S-pole picking part, are respectively provided with a first fillet and a second fillet.
Furthermore, a semi-waist-shaped through hole is formed in one side face, away from the radiating fin, of the S-pole picking part;
the top surface of the S pole picking part is provided with a plane.
Furthermore, one side of the S-pole pickup part, which is opposite to the connecting part, is fixedly connected with the copper sheet frame through a first connecting rib.
Furthermore, one side of the G pole picking part, which is opposite to the connecting part, is fixedly connected with the copper sheet frame through a second connecting rib;
the top surface of the G pole pick-up part is provided with a plane.
Furthermore, the area of the chip connecting surface of the bulge on the bottom surface of the G pole connecting part is set according to the size of the G pole area of the chip.
Further, the position of the step between the heat sink and the S-pole pickup portion is set according to the size of the area of the heat sink.
Further, the connecting portion includes a narrow connecting rib having the same thickness as the G-pole pickup portion and the S-pole pickup portion.
Further, the end, far away from the step, of the S-pole pickup part is provided with a first frame connecting part fillet and a second frame connecting part fillet.
The invention also provides a bonding sheet structure, which comprises the copper sheet, a chip and a frame;
the S pole area of the chip is connected with the S pole first connecting part and the S pole second connecting part through solder paste;
the S pole first connecting part and the S pole second connecting part are connected with the bottom of the radiating fin;
the radiating fin is connected with the S-pole pickup part;
the frame connecting surface of the lower surface of the S pole picking part is connected with the S pole tube foot of the frame through solder paste;
the G electrode area of the chip is connected with the chip connecting surface through solder paste;
the chip connecting surface is connected with the chip G pole connecting part;
the G pole connecting part is connected with the G pole picking part;
the G pole picking part is connected with the G pole connecting part of the frame, and the lower surface of the G pole connecting part of the frame is connected with the G pole of the frame through solder paste.
The embodiment of the invention provides a copper sheet and a bonding sheet structure, and compared with the prior art, the copper sheet and the bonding sheet structure have the following beneficial effects:
according to the invention, through the specific S-pole radiating fin position structure of the copper sheet, the top radiating of the device can be realized, and the radiating area of the top of the device can be adjusted, so that the radiating and different radiating requirements under higher conditions are met in an adaptive manner, and the adaptive scene of device installation is increased; by a clip copper sheet bonding mode, the over-current capability of the device is improved, the internal resistance is reduced, and the electrical parameters and the reliability of the device are improved; and the S pole and the G pole all use copper sheet structures (full clip copper sheets), so that the UPH value of product production and manufacturing is greatly improved, and the time cost is saved.
Drawings
Fig. 1 is a schematic front structural view of a copper sheet according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a back side structure of a copper sheet according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an internal structure of a copper sheet before and after grinding in a PDFN5 × 6 package type product according to an embodiment of the present invention, wherein fig. 3 (a) shows a schematic diagram of an internal structure of a product before grinding after plastic packaging is completed, and fig. 3 (b) shows a schematic diagram of an internal structure of a product after grinding after plastic packaging is completed;
fig. 4 is a schematic diagram illustrating an appearance of a copper sheet before and after being polished in a PDFN5 x 6 package type product according to an embodiment of the present invention;
fig. 5 is a schematic view of a bonding structure of a copper sheet according to an embodiment of the present invention.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The present specification provides method steps as described in the examples or flowcharts, but more or fewer steps may be included based on routine or non-invasive labor. In practice, the circuit or server product may be executed sequentially or in parallel (e.g., in the context of parallel processors or multi-threaded processing) according to the embodiments or methods shown in the figures.
Fig. 1 is a schematic front structure diagram of a copper sheet according to an embodiment of the present invention.
As shown in fig. 1, a copper sheet, comprising:
the heat radiating fin comprises a heat radiating fin 1, wherein an S-pole first connecting part 2-1 and an S-pole second connecting part 2-2 are arranged on the bottom surface of the heat radiating fin;
the S-pole picking part 10 is arranged at one end of the top of the radiating fin 1, and a step 4 is arranged between the S-pole picking part 10 and the radiating fin 1;
the G pole picking part 16 is connected with one side of the S pole picking part 10 through a connecting part 7, one end of the G pole picking part 16 is provided with a G pole connecting part 6,G, the bottom surface of the G pole connecting part 6 is provided with a raised chip connecting surface 14, and the other end of the G pole picking part 16, which is opposite to the G pole connecting part 6, is provided with a frame G pole connecting part 9.
In the embodiment provided by the invention, the copper sheet outline structure comprises an S-pole copper sheet and a G-pole copper sheet. The S pole includes: the lower surface of one end of a copper sheet radiating fin 1 is provided with two protruding S-pole first connecting parts 2-1 and S-pole second connecting parts 2-2 which are used as chip connecting parts and connected with the S pole of a chip, the other end of the radiating fin 1 is provided with a downward step 4, the step 4 is used as a connecting part of an S-pole copper sheet and a frame, and the right side of the step 4 of the platform is connected with a G-pole copper sheet part; the G utmost point copper piece includes: the G pole connecting part 6 is connected with a G pole of the chip, the bottom surfaces of the G pole picking part 16 and the frame G pole connecting part 6,G pole connecting part 6 are provided with a raised chip connecting surface 14, and the other end of the G pole picking part 16, which is opposite to the G pole connecting part 6, is provided with a frame G pole connecting part 9.
Fig. 2 is a schematic view of a back surface structure of a copper sheet according to an embodiment of the present invention.
As shown in fig. 2, a raised chip connection surface 14 is arranged on the bottom surface of the G-pole connection portion 6, a frame connection surface 15 is arranged on the back surface of the S-pole pickup portion 10, the S-pole first connection portion 2-1,S is arranged on the lower surface of the top heat sink, one surface of the S-pole first connection portion 2-1 is connected with the heat sink, and the other surface is connected with the chip through solder paste; the S pole second connecting part 2-2,S pole second connecting part 2-2 is arranged on the lower surface of the top radiating fin, one surface of the S pole second connecting part 2-2 is connected with the radiating fin, and the other surface of the S pole second connecting part is connected with the chip through solder paste.
Fig. 3 is a schematic diagram of the internal structure of a copper sheet before and after grinding in a PDFN5 x 6 package type product according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of the appearance of a copper sheet before and after grinding in a PDFN5 x 6 package type product according to an embodiment of the present invention.
As shown in fig. 3 and 4, after the plastic package of the product is completed, the upper surface of the product is ground through a grinding process until the copper sheet heat sink 1 is exposed by grinding, and the heat of the device is dissipated through the bottom and the top of the device. Better heat dissipation effect is obtained, and better reliability is provided.
In summary, the S-pole pickup part 10 is configured as a plane, and in the production process, the position can provide an area for picking up the copper sheet, and the suction nozzle sucks the position to provide suction force to pick up the copper sheet for sheet bonding; the G-pole picking part 16 is simultaneously arranged to be a plane, in the production process, the position can provide a copper sheet picking area, the suction nozzle adsorbs the position to provide suction force, and the copper sheet is picked to be bonded; the S-pole copper sheet part and the G-pole copper sheet part are connected through the connecting part 7 to provide a full clip copper sheet structure, in the production process, the sheet sticking equipment firstly punches the copper sheet, cuts off the connecting part 7 to separate the S-pole copper sheet part and the G-pole copper sheet part into two parts, and the equipment suction nozzle simultaneously sucks the S-pole copper sheet part and the G-pole copper sheet part to stick the sheets, so that the UPH can be greatly improved, and the time cost is saved; the chip G pole connecting part 6 protrudes downwards and is provided with a chip connecting surface 14, wherein the chip connecting surface can be automatically adjusted according to the area of the chip G pole, and can also be provided with a salient point which is connected with the chip through solder paste; the process of replacing bonding wires by the copper sheet is adopted, the S-pole copper sheet and the G-pole copper sheet are bonded, and due to the large sectional areas of the S-pole copper sheet and the G-pole copper sheet, good through-flow capacity and smaller internal resistance can be provided for devices.
In a possible embodiment, the S-pole first connecting portion 2-1 and the S-pole second connecting portion 2-2 comprise two rectangular bosses with the same height, a groove 3 is formed between the two rectangular bosses, and a chamfer is formed around the bottom of each rectangular boss.
In the embodiment provided by the invention, the first chip S-pole connecting part 2-1 and the second chip S-pole connecting part 2-2 are arranged on the top radiating fin 1, and the first chip S-pole connecting part 2-1 and the second chip S-pole connecting part 2-2 are rounded at the periphery of a chip connecting plane, so that the smooth contact surface with the chip is ensured, and the chip is not damaged mechanically.
In one possible embodiment, both ends of one side of the heat sink 1 away from the S-pole pickup 10 are respectively provided with a first fillet 5-1 and a second fillet 5-2.
In the embodiment provided by the invention, the tail end of the top of the radiating fin 1 is provided with a radiating fin first round angle 5-1 and a radiating fin second round angle 5-2, and the radiating fin first round angle 5-1 and the radiating fin second round angle 5-2 are arranged on the top radiating fin 1, so that the round angles can facilitate the production and the manufacture of copper sheets. Meanwhile, the round corners are embodied at the positions of the radiating fins at the top, so that the product is more attractive in appearance.
In a possible embodiment, the side of the S-pole pickup part 10 away from the heat sink 1 is provided with a half-kidney-shaped through hole 11; the top surface of the S-pole pickup 10 is provided with a plane.
In the embodiment provided by the invention, a semi-waist-shaped through hole 11 is arranged at the center of the end of the S-pole picking part 10, a first waist-hole fillet 12-1 and a second waist-hole fillet 12-2 are arranged at the positions of the waist-shaped holes, the semi-waist-shaped through hole 11 is arranged at the S-pole picking part, a copper sheet is easy to drift in the production process, and after the semi-waist-shaped through hole is arranged, the drift can be reduced in the tin paste waist-shaped hole in the sheet sticking process.
In one possible embodiment, the side of the S-pole pickup part 10 opposite to the connecting part 7 is fixedly connected with the copper sheet frame through the first connecting rib 8-2.
In the embodiment provided by the invention, the first connecting rib 8-2 is arranged on the left side of the copper sheet pickup area and is connected with the frame of the copper sheet through the first connecting rib 8-2.
In a possible embodiment, the side of the G pole picking-up part 16 opposite to the connecting part 7 is fixedly connected with the copper sheet frame through a second connecting rib 8-1, and the top surface of the G pole picking-up part 16 is provided with a plane.
In the embodiment provided by the invention, the second connecting rib 8-1 is arranged on the right side of the G pole copper sheet and is connected with the frame of the copper sheet through the second connecting rib 8-1. The top surface of the G pole picking part 16 is provided with a plane, the position can provide a region for picking up the copper sheet in the production process, the suction nozzle sucks the position to provide suction, and the copper sheet is picked up to be bonded.
In one possible embodiment, the area of the raised chip connection surface 14 on the bottom surface of the G-pole connection part 6 is set according to the size of the area of the G-pole of the chip.
In the embodiment of the present invention, the G-pole connecting portion 6 of the chip protrudes downward to form the chip connecting surface 14, which can be adjusted by itself according to the area of the G-pole of the chip, or can be formed as a bump to be connected to the chip through solder paste.
In one possible embodiment, the position of the step 4 between the heat sink 1 and the S-pole pickup 10 is set according to the area size of the heat sink 1.
In the embodiment provided by the invention, the step 4 is arranged at the end of the top radiating fin 1, and the area of the top radiating fin 1 can be changed by moving the position of the step 4.
In one possible embodiment, the connecting portion 7 includes a narrow connecting rib having the same thickness as the G-pole pickup portion 16 and the S-pole pickup portion 10.
In the embodiment provided by the invention, a narrow connecting rib with the same thickness is extended to the right of the S-pole pickup part to serve as the connecting part 7, the copper sheet of the G-pole pickup part is arranged on the right of the connecting part, the S-pole copper sheet part and the G-pole copper sheet part are connected through the connecting part 7, and a full clip copper sheet structure is provided.
In one possible embodiment, a first frame connecting part fillet 13-1 and a second frame connecting part fillet 13-2 are arranged at the end of the S-pole pick-up part 10 far away from the step 4.
In the embodiment provided by the invention, the frame connecting part first round angle 13-1 and the frame connecting part second round angle 13-2 are arranged to be smoother and easier to be attached when being connected with the frame.
The invention also provides a bonding sheet structure, which comprises the copper sheet, a chip and a frame;
the S pole area of the chip is connected with the S pole first connecting part 2-1 and the S pole second connecting part 2-2 through solder paste;
the S pole first connecting part 2-1 and the S pole second connecting part 2-2 are connected with the bottom of the radiating fin 1;
the heat sink 1 is connected with the S pole pick-up part 10;
the frame connecting surface 15 of the lower surface of the S pole picking part 10 is connected with the S pole tube foot of the frame through solder paste;
the G pole area of the chip is connected with the chip connecting surface 14 through solder paste;
the chip connection surface 14 is connected to the chip G-pole connection portion 6;
the G pole connecting part 6 is connected with the G pole picking part 16;
the G-pole pickup portion 16 is connected to the frame G-pole connection portion 9, and the lower surface of the frame G-pole connection portion 9 is connected to the G-pole of the frame by solder paste.
In the embodiment provided by the invention, the chip S pole area is connected with the chip S pole first connecting part 2-1 and the chip S pole second connecting part 2-2 through tin paste, the chip S pole first connecting part 2-1 and the chip S pole second connecting part 2-2 are connected with the top radiating fin 1, the top radiating fin 1 is connected with the S pole picking part 10, and the lower surface of the S pole picking part 10 serving as a frame connecting surface 15 is connected with the frame S pole tube foot through the tin paste. Whereby the chip south pole forms an electrical path to the frame pin south pole.
The chip G pole region is connected with the chip connecting face 14 through solder paste, the chip connecting face 14 is connected with the chip G pole connecting portion 6, and the G pole connecting portion 6 is connected with the G pole picking portion 16. The G-pole pickup portion 16 is connected to the frame G-pole connection portion 9, and the lower surface of the frame G-pole connection portion 9 is connected to the frame G-pole by solder paste. Thus, an electrical path is formed from the G pole of the chip to the G pole of the frame pin.
Fig. 5 is a schematic view of a bonding structure of a copper sheet according to an embodiment of the present invention.
As shown in fig. 5, the chip is connected to the copper sheet and the frame respectively, the chip is located in the middle, the copper sheet is located at the top, and the frame is located at the bottom.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the circuit embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (8)
1. A copper sheet, comprising:
the heat radiating fin (1) is provided with an S-pole first connecting part (2-1) and an S-pole second connecting part (2-2) on the bottom surface;
the S-pole picking part (10) is arranged at one end of the top of the radiating fin (1), and a step (4) is arranged between the S-pole picking part (10) and the radiating fin (1);
the G-pole picking part (16) is connected with one side of the S-pole picking part (10) through a connecting part (7), one end of the G-pole picking part (16) is provided with a G-pole connecting part (6), the bottom surface of the G-pole connecting part (6) is provided with a convex chip connecting surface (14), and the other end, opposite to the G-pole connecting part (6), of the G-pole picking part (16) is provided with a frame G-pole connecting part (9);
the S-pole first connecting part (2-1) and the S-pole second connecting part (2-2) comprise two rectangular bosses with the same height, a groove (3) is arranged between the two rectangular bosses, and the periphery of the bottom of each rectangular boss is provided with a chamfer;
one side surface, far away from the radiating fin (1), of the S-pole picking portion (10) is provided with a semi-waist-shaped through hole (11), and the top surface of the S-pole picking portion (10) is provided with a plane.
2. Copper sheet according to claim 1, wherein the heat sink (1) is provided with a first fillet (5-1) and a second fillet (5-2) at both ends of a side facing away from the S-pole pickup (10).
3. The copper sheet according to claim 1, wherein the side of the S-pole pickup portion (10) opposite to the connecting portion (7) is fixedly connected to the strip frame where the copper sheet is located through a first connecting rib (8-2).
4. The copper sheet according to claim 1, wherein the side of the G-pole pick-up portion (16) opposite to the connecting portion (7) is fixedly connected with the strip frame where the copper sheet is located through a second connecting rib (8-1);
the top surface of the G pole pick-up part (16) is provided with a plane.
5. Copper sheet according to claim 1, wherein the raised chip connection surface (14) area of the bottom surface of the G-pole connection portion (6) is set according to the size of the G-pole area of the chip.
6. Copper sheet according to claim 1, wherein the position of said step (4) between said heat sink (1) and said S-pole pickup (10) is set according to the area size of the heat sink (1).
7. Copper sheet according to claim 1, characterised in that said connection portion (7) comprises a narrow connecting rib, said narrow connecting rib
The connecting ribs are the same in thickness as the G-pole pick-up part (16) and the S-pole pick-up part (10).
8. A bonding sheet structure, wherein the bonding sheet structure comprises the copper sheet of any one of claims 1 to 7, and the bonding sheet structure further comprises a chip and a frame;
the S pole area of the chip is connected with the S pole first connecting part (2-1) and the S pole second connecting part (2-2) through solder paste;
the S pole first connecting part (2-1), the S pole second connecting part (2-2) and the bottom of the radiating fin (1) are connected;
the heat radiating fin (1) is connected with the S-pole pickup part (10);
the frame connecting surface (15) of the lower surface of the S-pole picking part (10) is connected with the S-pole tube foot of the frame through solder paste;
the G pole area of the chip is connected with the chip connecting surface (14) through solder paste;
the chip connecting surface (14) is connected with the chip G pole connecting part (6);
the G pole connecting part (6) is connected with a G pole picking part (16);
the G pole picking-up part (16) is connected with a frame G pole connecting part (9), and the lower surface of the frame G pole connecting part (9) is connected with the G pole of the frame through solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211395568.9A CN115440686B (en) | 2022-11-09 | 2022-11-09 | Copper sheet and bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211395568.9A CN115440686B (en) | 2022-11-09 | 2022-11-09 | Copper sheet and bonding structure |
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| Publication Number | Publication Date |
|---|---|
| CN115440686A CN115440686A (en) | 2022-12-06 |
| CN115440686B true CN115440686B (en) | 2023-03-10 |
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| CN202211395568.9A Active CN115440686B (en) | 2022-11-09 | 2022-11-09 | Copper sheet and bonding structure |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9245831B1 (en) * | 2014-11-05 | 2016-01-26 | Alpha And Omega Semiconductor (Cayman) Ltd. | Top-exposed semiconductor package and the manufacturing method |
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