CN115410791A - Inductance device - Google Patents

Abstract

An inductance device includes a first wiring, a second wiring and a capacitor. The first routing includes a first sub-routing and a second sub-routing. The first sub-wire and the second sub-wire are wound together on the first side of the inductance device to form a plurality of first coils, and are wound together on the second side of the inductance device to form a plurality of second coils. The second sub-wire is coupled to the first node. The second routing includes a third sub-routing and a fourth sub-routing. The third sub-wire and the fourth sub-wire are wound together to form a plurality of third coils on the first side of the inductance device, and are wound together to form a plurality of fourth coils on the second side of the inductance device. The fourth sub-wire is coupled to the second node. The capacitor is coupled between the first node and the second node.

Description

Inductive device

technical field

The present disclosure relates to an electronic device, and more particularly to an inductive device.

Background technique

Radio frequency (RF) devices will generate double-frequency harmonics (harmonic), triple-frequency harmonics, etc. during operation, and the above-mentioned harmonics will have adverse effects on other circuits. For example, the double-frequency harmonic of a 2.4GHz circuit will generate a 5GHz signal and then affect the 5GHz circuit.

Generally, the way to solve the influence of the above-mentioned harmonics on the circuit is to set a filter outside the circuit to filter out the above-mentioned harmonics. However, the filter provided outside the circuit will affect the performance of the circuit itself and generate additional costs.

Contents of the invention

A technical implementation of the present disclosure relates to an inductance device, which includes a first wiring, a second wiring and a capacitor. The first routing includes a first sub-routing and a second sub-routing. The first sub-wire and the second sub-wire are wound together to form a plurality of first coils on the first side of the inductance device, and are wound together to form a plurality of second coils on the second side of the inductance device. The second sub-wire is coupled to the first node. The second routing includes a third sub-routing and a fourth sub-routing. The third sub-wire and the fourth sub-wire are wound together on the first side of the inductance device to form a plurality of third coils, and are wound together to form a plurality of fourth coils on the second side of the inductance device. The fourth sub-wire is coupled to the second node. The capacitor is coupled between the first node and the second node.

Therefore, according to the technical content of the present disclosure, the capacitance in the inductance device shown in the embodiment of the present disclosure can form a low-frequency filtering function, so that the low-frequency signal induced by the inductance device can hardly pass through and the high-frequency signal can almost pass directly. . For low-frequency signals, such as the main operating frequency of 2.4GHz, the folded inductor passing through the inductance device cancels the induction signal of the main operating frequency due to the opposite direction of the current, so the folded inductor structure will not affect The characteristics of the operating frequency of the main inductor and the induction of 2.4GHz signals, and if the central inductor structure has high-frequency signals, such as 2 times the harmonic 5GHz, because the high-frequency signal capacitor is turned on, the high-frequency signal is transmitted by the winding inductor The structure forms a surrounding inductance through the capacitance, and then the inductance structure advocated in the present disclosure induces a 5 GHz harmonic signal corresponding to ten times higher than 2.4 GHz.

The user then applies the 5GHz signal to the circuit, such as amplifying the signal and then canceling the 5GHz harmonic of the operating frequency, and the application of the amplifying circuit can be optimized and adjusted by a familiar circuit designer. In this way, adverse effects on the 5GHz circuit can be reduced. Moreover, since the filter is disposed in the inductance device in the present disclosure, there is no need to dispose the filter outside the inductance device, thereby avoiding the external filter from affecting the performance of the circuit itself or increasing additional costs.

In addition, through the configuration of the inductance device of the present disclosure, the 2-fold harmonic can be improved by up to 20 dB. Moreover, due to the designs of the first coil to the fourth coil of the inductance device of the present disclosure, the structure of the present disclosure is more symmetrical.

Description of drawings

In order to make the above and other objects, features, advantages and embodiments of the present disclosure more comprehensible, the accompanying drawings are described as follows:

FIG. 1 is a schematic diagram of an inductance device according to an embodiment of the disclosure.

FIG. 2 is a partial structural diagram of the inductance device shown in FIG. 1 according to an embodiment of the present disclosure.

FIG. 3A is a schematic structural diagram of a first coil of the inductance device shown in FIG. 2 according to an embodiment of the present disclosure.

FIG. 3B is a schematic structural diagram of a first coil of the inductance device shown in FIG. 2 according to an embodiment of the present disclosure.

FIG. 4 is a schematic diagram of an inductance device according to an embodiment of the disclosure.

FIG. 5 is a partial structural diagram of the inductance device shown in FIG. 4 according to an embodiment of the present disclosure.

FIG. 6A is a schematic diagram of a first coil structure of the inductance device shown in FIG. 5 according to an embodiment of the present disclosure.

FIG. 6B is a schematic diagram of a first coil structure of the inductance device shown in FIG. 5 according to an embodiment of the present disclosure.

Symbol Description

1000, 1000A: Inductive device

1100, 1100A: the first trace

1110, 1120, 1110A, 1120A: sub-traces

1200, 1200A: Second trace

1210, 1220, 1210A, 1220A: sub-traces

1300, 1300A: connector

1400, 1400A: first coil

1410～1440, 1410A～1440A: sub-coil

1500, 1500A: second coil

1510～1540, 1510A～1540A: sub-coil

1600, 1600A: the third coil

1610～1640, 1610A～1640A: sub-coil

1700, 1700A: fourth coil

1710～1740, 1710A～1740A: sub-coil

A～H: connection point

C1: capacitance

N1: the first node

N2: second node

Detailed ways

FIG. 1 is a schematic diagram illustrating an inductive device 1000 according to an embodiment of the disclosure. As shown in the figure, the inductor device 1000 includes a first wire 1100 , a second wire 1200 and a capacitor C. As shown in FIG. Furthermore, the first wire 1100 includes a first sub-wire 1110 and a second sub-wire 1120 . The lower ends of the first sub-route 1110 and the second sub-route 1120 are coupled to the first node N1 in the figure. In addition, the first sub-wires 1110 and the second sub-wires 1120 are wound together on the first side (such as the lower side) of the inductance device 1000 to form a plurality of first coils 1400, and are commonly wound on the second side (such as the upper side) of the inductance device. A plurality of second coils 1500 are wound.

In addition, the second wire 1200 includes a third sub-wire 1210 and a fourth sub-wire 1220 . The third sub-route 1210 and the fourth sub-route 1220 are coupled to the second node N2 at the lower ends in the figure. In addition, the third sub-wire 1210 and the fourth sub-wire 1220 are wound together to form a plurality of third coils 1600 on the first side (such as the upper side) of the inductive device 1000, and are wound on the second side (such as the upper side) of the inductive device 1000. A plurality of fourth coils 1700 are wound together. Furthermore, the capacitor C is coupled between the first node N1 and the second node N2.

In one embodiment, both the first sub-wire 1110 and the second sub-wire 1120 include a first end and a second end. As shown in the figure, the second end (lower end) of the first sub-trace 1110 and the second end (lower end) of the second sub-trace 1120 are coupled to the first node N1. For example, the first end of the first sub-route 1110 is located on the upper side in the figure, and the first sub-route 1110 is wound to the left in the figure, and then, the first sub-route 1110 is wound down along the left side, and then Or, after going around to the lower left side in the figure, and then around to the node N1 on the lower side in the figure, the second end of the first sub-wire 1110 is finally coupled to the node N1. At the node N1, the second end of the second sub-route 1120 is coupled to the node N1, the second sub-route 1120 winds to the left in the figure, and then the second sub-route 1120 winds upward along the left side, and then Or, after going around to the upper left side in the figure, it goes around to the connecting piece 1300 on the upper side in the figure, and then goes around to the first end of the second sub-wire 1120 on the upper side. It can be seen from the above structural configuration that the first sub-trace 1110 and the second sub-trace 1120 form a folded inductor.

In addition, both the third sub-wire 1210 and the fourth sub-wire 1220 include a first end and a second end. As shown in the figure, the second end (lower end) of the third sub-trace 1210 and the second end (lower end) of the fourth sub-trace 1220 are coupled to the second node N2. For example, the first end of the third sub-route 1210 is located on the upper side in the figure, and the third sub-route 1210 is wound to the right side in the figure, and then, the third sub-route 1210 is wound down along the right side, and then Or, after going around to the lower right side in the figure, and then around to the node N2 on the lower side in the figure, the second end of the third sub-route 1210 is finally coupled to the node N2. At the node N2, the second end of the fourth sub-route 1220 is coupled to the node N2, the fourth sub-route 1220 is wound to the right in the figure, and then the fourth sub-route 1220 is wound upward along the right side, and then Or, after going around to the upper right side in the figure, then around to the upper connecting piece 1300 in the figure, and around to the first end of the fourth sub-wire 1220 on the upper side. Likewise, it can be known from the above structural configuration that the third sub-trace 1210 and the fourth sub-trace 1220 form a meandering inductance structure. In one embodiment, the first end of the third sub-trace 1210 is coupled to the first end of the first sub-trace 1110 through the connector 1300 .

FIG. 2 is a partial structural diagram of the inductance device 1000 shown in FIG. 1 according to an embodiment of the present disclosure. As shown, FIG. 2 shows the first coil 1400 of the inductive device 1000 . In order to make the structure of the first coil 1400 in FIG. 2 easy to understand, please refer to FIG. 3A and FIG. 3B . FIG. 3A and FIG. 3B show a first coil of the inductance device shown in FIG. Schematic diagram of the structure of 1400.

Please refer to FIG. 3A and FIG. 3B together, the first coil 1400 includes a first sub-coil 1410 and a second sub-coil 1420 . The first sub-coil 1410 is located on the first layer, and the second sub-coil 1420 is located on the second layer. Please refer to FIG. 2 , the second sub-coil 1420 is stacked on the first sub-coil 1410 .

Please refer to FIG. 3A and FIG. 3B together, the first coil 1400 further includes a third sub-coil 1430 and a fourth sub-coil 1440 . The third sub-coil 1430 is located on the first layer, and the fourth sub-coil 1440 is located on the second layer. Please refer to FIG. 2 , the fourth sub-coil 1440 is stacked on the third sub-coil 1430 .

In one embodiment, the first sub-coil 1410 is located on the outer circle of the first coil 1400 , and the second sub-coil 1420 is located on the outer circle of the first coil 1400 . The first sub-coil 1410 is coupled to the second sub-coil 1420 . For example, the first sub-coil 1410 and the second sub-coil 1420 are coupled at point A.

In one embodiment, the third sub-coil 1430 is located at the inner circle of the first coil 1400 , and the fourth sub-coil 1440 is located at the inner circle of the first coil 1400 . The third sub-coil 1430 is coupled to the fourth sub-coil 1440 . For example, the third sub-coil 1430 and the fourth sub-coil 1440 are coupled at point B.

Referring to FIG. 3A , the second sub-coil 1420 and the fourth sub-coil 1440 are located on the same layer, and the fourth sub-coil 1440 is disposed inside the second sub-coil 1420 . Referring to FIG. 3B , the first sub-coil 1410 and the third sub-coil 1430 are located on the same layer, and the third sub-coil 1430 is disposed inside the first sub-coil 1410 .

It should be noted that the configuration of the second coil 1500 is similar to that of the first coil 1400 . Please refer to FIG. 1 , the second coil 1500 includes a fifth sub-coil 1510 and a sixth sub-coil 1520 . The fifth sub-coil 1510 is located on the first layer, and the sixth sub-coil 1520 is located on the second layer. The sixth sub-coil 1520 is stacked on the fifth sub-coil 1510 .

In addition, the second coil 1500 includes a seventh sub-coil 1530 and an eighth sub-coil 1540 . The seventh sub-coil 1530 is located on the first layer, and the eighth sub-coil 1540 is located on the second layer. The eighth sub-coil 1540 is stacked on the seventh sub-coil 1530 .

In one embodiment, the fifth sub-coil 1510 is located on the outer circle of the second coil 1500 , and the sixth sub-coil 1520 is located on the outer circle of the second coil 1500 . The fifth sub-coil 1510 is coupled to the sixth sub-coil 1520 . For example, the fifth sub-coil 1510 and the sixth sub-coil 1520 are coupled at point C.

In one embodiment, the seventh sub-coil 1530 is located at the inner circle of the second coil 1500 , and the eighth sub-coil 1540 is located at the inner circle of the second coil 1500 . The seventh sub-coil 1530 is coupled to the eighth sub-coil 1540 . For example, the seventh sub-coil 1530 and the eighth sub-coil 1540 are coupled at point D.

In one embodiment, the fifth sub-coil 1510 and the seventh sub-coil 1530 are located on the same layer, and the seventh sub-coil 1530 is disposed inside the fifth sub-coil 1510 . In addition, the sixth sub-coil 1520 and the eighth sub-coil 1540 are located on the same layer, and the eighth sub-coil 1540 is disposed inside the sixth sub-coil 1520 .

It should be noted that the configuration of the third coil 1600 is similar to that of the first coil 1400 . Please refer to FIG. 1 , the third coil 1600 includes a ninth sub-coil 1610 and a tenth sub-coil 1620 . The ninth sub-coil 1610 is located on the first layer, and the tenth sub-coil 1620 is located on the second layer. The tenth sub-coil 1620 is stacked on the ninth sub-coil 1610 .

In addition, the third coil 1600 includes an eleventh sub-coil 1630 and a twelfth sub-coil 1640 . The eleventh sub-coil 1630 is located on the first layer, and the twelfth sub-coil 1640 is located on the second layer. The twelfth sub-coil 1640 is stacked on the eleventh sub-coil 1630 .

In one embodiment, the ninth sub-coil 1610 is located on the outer circle of the third coil 1600 , and the tenth sub-coil 1620 is located on the outer circle of the third coil 1600 . The ninth sub-coil 1610 is coupled to the tenth sub-coil 1620 . For example, the ninth sub-coil 1610 and the tenth sub-coil 1620 are coupled at point E.

In one embodiment, the eleventh sub-coil 1630 is located at the inner circle of the third coil 1600 , and the twelfth sub-coil 1640 is located at the inner circle of the third coil 1600 . The eleventh sub-coil 1630 is coupled to the twelfth sub-coil 1640 . For example, the eleventh sub-coil 1630 and the twelfth sub-coil 1640 are coupled at point F.

In one embodiment, the ninth sub-coil 1610 and the eleventh sub-coil 1630 are located on the same layer, and the eleventh sub-coil 1630 is disposed inside the ninth sub-coil 1610 . In addition, the tenth sub-coil 1620 and the twelfth sub-coil 1640 are located on the same layer, and the twelfth sub-coil 1640 is disposed inside the tenth sub-coil 1620 .

It should be noted that the configuration of the fourth coil 1700 is similar to that of the first coil 1400 . Please refer to FIG. 1 , the fourth coil 1700 includes a thirteenth sub-coil 1710 and a fourteenth sub-coil 1720 . The thirteenth sub-coil 1710 is located on the first layer, and the fourteenth sub-coil 1720 is located on the second layer. The fourteenth sub-coil 1720 is stacked on the thirteenth sub-coil 1710 .

In addition, the fourth coil 1700 further includes a fifteenth sub-coil 1730 and a sixteenth sub-coil 1740 . The fifteenth sub-coil 1730 is located on the first layer, and the sixteenth sub-coil 1740 is located on the second layer. The sixteenth sub-coil 1740 is stacked on the fifteenth sub-coil 1730 .

In one embodiment, the thirteenth sub-coil 1710 is located on the outer circle of the fourth coil 1700 , and the fourteenth sub-coil 1720 is located on the outer circle of the fourth coil 1700 . The thirteenth sub-coil 1710 is coupled to the fourteenth sub-coil 1720 . For example, the thirteenth sub-coil 1710 and the fourteenth sub-coil 1720 are coupled at point G.

In one embodiment, the fifteenth sub-coil 1730 is located at the inner circle of the fourth coil 1700 , and the sixteenth sub-coil 1740 is located at the inner circle of the fourth coil 1700 . The fifteenth sub-coil 1730 is coupled to the sixteenth sub-coil 1740 . For example, the fifteenth sub-coil 1730 and the sixteenth sub-coil 1740 are coupled at point H.

In one embodiment, the thirteenth sub-coil 1710 and the fifteenth sub-coil 1730 are located on the same layer, and the fifteenth sub-coil 1730 is disposed inside the thirteenth sub-coil 1710 . In addition, the fourteenth sub-coil 1720 and the sixteenth sub-coil 1740 are located on the same layer, and the sixteenth sub-coil 1740 is disposed inside the fourteenth sub-coil 1720 .

In one embodiment, the shape of the central structure of the inductive device 1000 may be an octagon, and the first coil 1400 to the fourth coil 1700 may be disposed at the upper left, lower left, upper right and lower right corners of the central structure of the octagon. However, the present disclosure is not limited to the structure shown in FIG. 1 , and in other embodiments, the shape of the inductor device 1000 can also be other suitable shapes, depending on actual needs. In another embodiment, the above-mentioned first layer may be a metal layer, such as Metal 7. In addition, the above-mentioned second layer may be a redistribution layer (Redistribution Layer, RDL). It should be noted that the present disclosure is not limited to the structures shown in FIG. 1 , FIG. 2 , FIG. 3A and FIG. 3B , which are only used to exemplarily show one of the implementations of the present disclosure.

FIG. 4 is a schematic diagram of an inductance device 1000A according to an embodiment of the disclosure. It should be noted that the difference between the inductive device 1000A in FIG. 4 and the inductive device 1000 in FIG. 1 lies in the arrangement of the first coil 1400A to the fourth coil 1700A, which will be described in detail later.

FIG. 5 is a partial structural diagram of an inductance device 1000A as shown in FIG. 4 according to an embodiment of the present disclosure. As shown, FIG. 5 shows the first coil 1400A of the inductive device 1000A. To make the structure of the first coil 1400A in FIG. 5 easy to understand, please refer to FIG. 6A and FIG. 6B . FIG. 6A and FIG. 6B show a first coil of an inductance device as shown in FIG. 5 according to an embodiment of the disclosure. Schematic diagram of the structure of 1400A.

Please refer to FIG. 6A and FIG. 6B together, the first coil 1400A includes a first sub-coil 1410A and a second sub-coil 1420A. The first sub-coil 1410A is located on the first layer, and the second sub-coil 1420A is located on the second layer. Referring to FIG. 5 , the second sub-coil 1420A is stacked on the first sub-coil 1410A.

Please refer to FIG. 6A and FIG. 6B together, the first coil 1400A further includes a third sub-coil 1430A and a fourth sub-coil 1440A. The third sub-coil 1430A is located on the first layer, and the fourth sub-coil 1440A is located on the second layer. Referring to FIG. 5 , the fourth sub-coil 1440A is stacked on the third sub-coil 1430A.

In one embodiment, the first sub-coil 1410A is located on the outer circle of the first coil 1400 , and the second sub-coil 1420A is located on the inner circle of the first coil 1400 . The first sub-coil 1410A is coupled to the second sub-coil 1420A. For example, the first sub-coil 1410A and the second sub-coil 1420A are coupled at point A.

In one embodiment, the third sub-coil 1430A is located at the inner circle of the first coil 1400A, and the fourth sub-coil 1440A is located at the outer circle of the first coil 1400A. The third sub-coil 1430A is coupled to the fourth sub-coil 1440A. For example, the third sub-coil 1430A and the fourth sub-coil 1440A are coupled at point B.

Referring to FIG. 6A , the second sub-coil 1420A and the fourth sub-coil 1440A are located on the same layer, and the second sub-coil 1420A is disposed inside the fourth sub-coil 1440A. Referring to FIG. 6B , the first sub-coil 1410A and the third sub-coil 1430A are located on the same layer, and the third sub-coil 1430A is disposed inside the first sub-coil 1410A. Based on the above structural configuration of the present disclosure, when the first sub-coil 1410A on the outer circle detours to point A, it will be connected to the second sub-coil 1420A on the inner circle. ) to make the structure of the present disclosure more symmetrical.

It should be noted that the configuration of the second coil 1500A is similar to that of the first coil 1400A. Referring to FIG. 4 , the second coil 1500A includes a fifth sub-coil 1510A and a sixth sub-coil 1520A. The fifth sub-coil 1510A is located on the first layer, and the sixth sub-coil 1520A is located on the second layer. The sixth sub-coil 1520A is stacked on the fifth sub-coil 1510A.

In addition, the second coil 1500A includes a seventh sub-coil 1530A and an eighth sub-coil 1540A. The seventh sub-coil 1530A is located on the first layer, and the eighth sub-coil 1540A is located on the second layer. The eighth sub-coil 1540A is stacked on the seventh sub-coil 1530A.

In one embodiment, the fifth sub-coil 1510A is located on the outer circle of the second coil 1500A, and the sixth sub-coil 1520A is located on the outer circle of the second coil 1500A. The fifth sub-coil 1510A is coupled to the sixth sub-coil 1520A. For example, the fifth sub-coil 1510A and the sixth sub-coil 1520A are coupled at point C.

In one embodiment, the seventh sub-coil 1530A is located at the inner circle of the second coil 1500A, and the eighth sub-coil 1540A is located at the inner circle of the second coil 1500A. The seventh sub-coil 1530A is coupled to the eighth sub-coil 1540A. For example, the seventh sub-coil 1530A and the eighth sub-coil 1540A are coupled at point D.

In one embodiment, the fifth sub-coil 1510A and the seventh sub-coil 1530A are located on the same layer, and the seventh sub-coil 1530A is disposed inside the fifth sub-coil 1510A. In addition, the sixth sub-coil 1520A and the eighth sub-coil 1540A are located on the same layer, and the sixth sub-coil 1520A is disposed inside the eighth sub-coil 1540A.

It should be noted that the configuration of the third coil 1600A is similar to that of the first coil 1400A. Referring to FIG. 4 , the third coil 1600A includes a ninth sub-coil 1610A and a tenth sub-coil 1620A. The ninth sub-coil 1610A is located on the first layer, and the tenth sub-coil 1620A is located on the second layer. The tenth sub-coil 1620A is stacked on the ninth sub-coil 1610A.

In addition, the third coil 1600A includes an eleventh sub-coil 1630A and a twelfth sub-coil 1640A. The eleventh sub-coil 1630A is located on the first layer, and the twelfth sub-coil 1640A is located on the second layer. The twelfth sub-coil 1640A is stacked on the eleventh sub-coil 1630A.

In one embodiment, the ninth sub-coil 1610A is located on the outer circle of the third coil 1600A, and the tenth sub-coil 1620A is located on the inner circle of the third coil 1600A. The ninth sub-coil 1610A is coupled to the tenth sub-coil 1620A. For example, the ninth sub-coil 1610A and the tenth sub-coil 1620A are coupled at point E.

In one embodiment, the eleventh sub-coil 1630A is located at the inner circle of the third coil 1600A, and the twelfth sub-coil 1640A is located at the outer circle of the third coil 1600A. The eleventh sub-coil 1630A is coupled to the twelfth sub-coil 1640A. For example, the eleventh sub-coil 1630A and the twelfth sub-coil 1640A are coupled at point F.

In one embodiment, the ninth sub-coil 1610A and the eleventh sub-coil 1630A are located on the same layer, and the eleventh sub-coil 1630A is disposed inside the ninth sub-coil 1610A. In addition, the tenth sub-coil 1620A and the twelfth sub-coil 1640A are located on the same layer, and the tenth sub-coil 1620A is disposed inside the twelfth sub-coil 1640A. Based on the above structural configuration of the present disclosure, when the ninth sub-coil 1610A on the outer circle detours to point E, it will be connected to the tenth sub-coil 1620A on the inner circle. ) to make the structure of the present disclosure more symmetrical. The sixth sub-coil 1520A and the eighth sub-coil 1540A also adopt this interleaving coupling manner of inner and outer coils.

It should be noted that the configuration of the fourth coil 1700A is similar to that of the first coil 1400A. Referring to FIG. 4 , the fourth coil 1700A includes a thirteenth sub-coil 1710A and a fourteenth sub-coil 1720A. The thirteenth sub-coil 1710A is located on the first layer, and the fourteenth sub-coil 1720A is located on the second layer. The fourteenth sub-coil 1720A is stacked on the thirteenth sub-coil 1710A.

In addition, the fourth coil 1700A further includes a fifteenth sub-coil 1730A and a sixteenth sub-coil 1740A. The fifteenth sub-coil 1730A is located on the first layer, and the sixteenth sub-coil 1740A is located on the second layer. The sixteenth sub-coil 1740A is stacked on the fifteenth sub-coil 1730A.

In one embodiment, the thirteenth sub-coil 1710A is located on the outer circle of the fourth coil 1700A, and the fourteenth sub-coil 1720A is located on the outer circle of the fourth coil 1700A. The thirteenth sub-coil 1710A is coupled to the fourteenth sub-coil 1720A. For example, the thirteenth sub-coil 1710A and the fourteenth sub-coil 1720A are coupled at point G.

In one embodiment, the fifteenth sub-coil 1730A is located at the inner circle of the fourth coil 1700A, and the sixteenth sub-coil 1740A is located at the inner circle of the fourth coil 1700A. The fifteenth sub-coil 1730A is coupled to the sixteenth sub-coil 1740A. For example, the fifteenth sub-coil 1730A and the sixteenth sub-coil 1740A are coupled at point H.

In one embodiment, the thirteenth sub-coil 1710A and the fifteenth sub-coil 1730A are located on the same layer, and the fifteenth sub-coil 1730A is disposed inside the thirteenth sub-coil 1710A. In addition, the fourteenth sub-coil 1720A and the sixteenth sub-coil 1740A are located on the same layer, and the fourteenth sub-coil 1720A is disposed inside the sixteenth sub-coil 1740A.

It should be noted that the present disclosure is not limited to the structures shown in FIG. 4 , FIG. 5 , FIG. 6A and FIG. 6B , which are only used to exemplarily show one of the implementations of the present disclosure.

It can be known from the above embodiments of the present disclosure that the application of the present disclosure has the following advantages. The inductor device shown in the embodiments of the present disclosure can sense the high-frequency signal of the central inductor, such as the second-order harmonic, and amplify it in an additional circuit to cancel the adverse effect of the original circuit's second-order harmonic. For example, the capacitance passing through the inductive device is mainly used to pass high frequency and block low frequency. In this way, the same inductive device can have two different signal induction methods for high and low frequencies. Furthermore, since the present disclosure arranges the filter in an integrated circuit (IC), there is no need to arrange a filter outside the inductance device, thereby avoiding the influence of the external filter on the performance of the circuit itself and its extra cost.

In addition, through the configuration of the inductance device of the present disclosure, the 2-fold harmonic can be improved by up to 20 dB. Moreover, due to the designs of the first coil to the fourth coil of the inductance device of the present disclosure, the structure of the present disclosure is more symmetrical.

Claims (10)

1. An inductive device comprising: A first trace, including: a first sub-trace; and A second sub-wire, wherein the first sub-wire and the second sub-wire are wound together to form a plurality of first coils on a first side of the inductance device, and are jointly wound on a second side of the inductance device wound into a plurality of second coils, wherein the first sub-wire and the second sub-wire are coupled to a first node; a second trace, including: a third sub-trace; and A fourth sub-wire, wherein the third sub-wire and the fourth sub-wire are wound together to form a plurality of third coils on the first side of the inductance device, and are jointly wound on the second side of the inductance device Winding a plurality of fourth coils, wherein the third sub-wire and the fourth sub-wire are coupled to a second node; and A capacitor is coupled between the first node and the second node. 2. The inductive device of claim 1, wherein, This first subtrace includes: a first end; and a second end; Wherein the second sub-route includes: a first end; and a second end, coupled to the first node with the second end of the first sub-wire; Wherein the third sub-route includes: a first end; and a second end; Wherein the fourth sub-route includes: a first end; and a second end, coupled to the second node with the second end of the third sub-wire; Wherein the inductance device also includes: A connecting piece is coupled to the first end of the first sub-wire and the first end of the third sub-wire. 3. The inductive device of claim 1, wherein the plurality of first coils comprises: a first sub-coil located on a first layer; a second sub-coil located on a second layer and stacked on the first sub-coil; a third sub-coil located on the first layer; and a fourth sub-coil located on the second layer and stacked on the third sub-coil; Wherein the first sub-coil is located on the outer circle of the plurality of first coils, and the second sub-coil is located on the outer circle of the plurality of first coils, wherein the first sub-coil is coupled to the second sub-coil , wherein the third sub-coil is located in the inner circle of the plurality of first coils, and the fourth sub-coil is located in the inner circle of the plurality of first coils, wherein the third sub-coil is coupled to the fourth sub-coil coil. 4. The inductive device of claim 1, wherein said plurality of first coils comprises: a first sub-coil located on a first layer; a second sub-coil located on a second layer and stacked on the first sub-coil; a third sub-coil located on the first layer; and a fourth sub-coil located on the second layer and stacked on the third sub-coil; Wherein the first sub-coil is located on the outer circle of the plurality of first coils, and the second sub-coil is located on the inner circle of the plurality of first coils, wherein the first sub-coil is coupled to the second sub-coil , wherein the third sub-coil is located at the inner circle of the plurality of first coils, and the fourth sub-coil is located at the outer circle of the plurality of first coils, wherein the third sub-coil is coupled to the fourth sub-coil coil. 5. The inductive device of claim 3, wherein said plurality of second coils comprises: a fifth sub-coil located on the first layer; a sixth sub-coil located on the second layer and stacked on the fifth sub-coil; a seventh sub-coil located on the first layer; and an eighth sub-coil located on the second layer and stacked on the seventh sub-coil; Wherein the fifth sub-coil is located on the outer circle of the plurality of second coils, and the sixth sub-coil is located on the outer circle of the plurality of second coils, wherein the fifth sub-coil is coupled to the sixth sub-coil , wherein the seventh sub-coil is located in the inner circle of the plurality of second coils, and the eighth sub-coil is located in the inner circle of the plurality of second coils, wherein the seventh sub-coil is coupled to the eighth sub-coil coil. 6. The inductive device of claim 4, wherein the plurality of second coils comprises: a fifth sub-coil located on the first layer; a sixth sub-coil located on the second layer and stacked on the fifth sub-coil; a seventh sub-coil located on the first layer; and an eighth sub-coil located on the second layer and stacked on the seventh sub-coil; Wherein the fifth sub-coil is located on the outer circle of the plurality of second coils, and the sixth sub-coil is located on the outer circle of the plurality of second coils, wherein the fifth sub-coil is coupled to the sixth sub-coil , wherein the seventh sub-coil is located in the inner circle of the plurality of second coils, and the eighth sub-coil is located in the inner circle of the plurality of second coils, wherein the seventh sub-coil is coupled to the eighth sub-coil coil. 7. The inductive device of claim 5, wherein the plurality of third coils comprises: a ninth sub-coil located on the first layer; a tenth sub-coil located on the second layer and stacked on the ninth sub-coil; an eleventh sub-coil located on the first layer; and a twelfth sub-coil located on the second layer and stacked on the eleventh sub-coil; Wherein the ninth sub-coil is located on the outer circle of the plurality of third coils, and the tenth sub-coil is located on the outer circle of the plurality of third coils, wherein the ninth sub-coil is coupled to the tenth sub-coil , wherein the eleventh sub-coil is located in the inner circle of the plurality of third coils, and the twelfth sub-coil is located in the inner circle of the plurality of third coils, wherein the eleventh sub-coil is coupled to the Twelfth sub-coil. 8. The inductive device of claim 6, wherein said plurality of third coils comprises: a ninth sub-coil located on the first layer; a tenth sub-coil located on the second layer and stacked on the ninth sub-coil; an eleventh sub-coil located on the first layer; and a twelfth sub-coil located on the second layer and stacked on the eleventh sub-coil; Wherein the ninth sub-coil is located on the outer circle of the plurality of third coils, and the tenth sub-coil is located on the inner circle of the plurality of third coils, wherein the ninth sub-coil is coupled to the tenth sub-coil , wherein the eleventh sub-coil is located at the inner circle of the plurality of third coils, and the twelfth sub-coil is located at the outer circle of the plurality of third coils, wherein the eleventh sub-coil is coupled to the Twelfth sub-coil. 9. The inductive device of claim 7, wherein said plurality of fourth coils comprises: a thirteenth sub-coil located on the first layer; and a fourteenth sub-coil located on the second layer and stacked on the thirteenth sub-coil; a fifteenth sub-coil located on the first layer; and a sixteenth sub-coil located on the second layer and stacked on the fifteenth sub-coil; Wherein the thirteenth sub-coil is located on the outer circle of the plurality of fourth coils, and the fourteenth sub-coil is located on the outer circle of the plurality of fourth coils, wherein the thirteenth sub-coil is coupled to the fourth coil Fourteen sub-coils, wherein the fifteenth sub-coil is located in the inner circle of the plurality of fourth coils, and the sixteenth sub-coil is located in the inner circle of the plurality of fourth coils, wherein the fifteenth sub-coil coupled to the sixteenth sub-coil. 10. The inductive device of claim 8, wherein the plurality of fourth coils comprises: a thirteenth sub-coil located on the first layer; and a fourteenth sub-coil located on the second layer and stacked on the thirteenth sub-coil; a fifteenth sub-coil located on the first layer; and a sixteenth sub-coil located on the second layer and stacked on the fifteenth sub-coil; Wherein the thirteenth sub-coil is located on the outer circle of the plurality of fourth coils, and the fourteenth sub-coil is located on the outer circle of the plurality of fourth coils, wherein the thirteenth sub-coil is coupled to the fourth coil Fourteen sub-coils, wherein the fifteenth sub-coil is located in the inner circle of the plurality of fourth coils, and the sixteenth sub-coil is located in the inner circle of the plurality of fourth coils, wherein the fifteenth sub-coil coupled to the sixteenth sub-coil.

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