CN115401314A - A kind of processing equipment and processing method of metal mask plate - Google Patents

Abstract

The invention discloses a metal mask processing equipment and processing method, wherein the processing equipment includes: a light source assembly for emitting a laser beam, the single pulse energy of the laser beam is greater than or equal to 200uJ, and the pulse width range is 400-800fs, The wavelength is 1030nm; the beam shaping component is located on the transmission path of the laser beam, and is used to shape the laser beam to form a shaped laser beam; the processing component is located on the transmission path of the shaped laser beam, and is used to adjust the direction of the shaped laser beam. And output the shaped laser beam to the metal mask to be processed to form a preset mask pattern on the metal mask to be processed, the thickness of the metal mask is in the range of 0.05-1mm. The embodiment of the present invention solves the problems that the traditional optical fiber laser cutting reticle equipment is prone to burnt edges, curling and deformation, and the like. Improved edge quality of reticle processing.

Description

A kind of processing equipment and processing method of metal mask plate

technical field

The invention relates to the technical field of laser cutting, in particular to a metal mask processing equipment and processing method.

Background technique

In the field of photovoltaic solar energy, photovoltaic silicon wafers need to be evaporated and printed with various film layers on the surface. In this kind of production process, a large number of masks are used. The production of the metal mask can be CNC processing, electro-etching processing, laser cutting, etc. Among them, laser cutting is widely used because of its high efficiency and flexibility.

However, the existing problem is that the current lasers in the industry usually use fiber lasers, which can only cut masks with a thickness of about 0.2mm. For the current pursuit of thinner and more precise reticles in the industry, for example, the use of fiber laser cutting is prone to black edges, curling and deformation, which cannot meet the processing requirements, resulting in the unusable reticles.

Contents of the invention

The invention provides a metal mask plate processing equipment and a processing method to realize the cutting of a thin mask plate and improve the cutting quality of the edge of the mask plate.

According to an aspect of the present invention, a metal mask processing equipment is provided, which includes:

The light source component is used to emit the laser beam, the single pulse energy of the laser beam is greater than or equal to 200uJ, the pulse width range is 400-800fs, and the wavelength is 1030nm;

The beam shaping component is located on the transmission path of the laser beam and is used to shape the laser beam to form a shaped laser beam;

The processing component is located on the transmission path of the shaped laser beam, and is used to adjust the direction of the shaped laser beam, and emit the shaped laser beam to the metal mask to be processed, so as to form a preset mask pattern on the metal mask to be processed, the metal mask The thickness of the stencil is in the range of 0.05-1mm.

According to an embodiment of the present invention, the metal mask processing equipment, wherein the processing component includes a vibrating mirror, a field mirror and a first controller;

The galvanometer is located on the path of the shaped laser beam transmission;

The field lens is located on the side of the galvanometer adjacent to the metal mask to be processed;

The first controller is connected with the vibrating mirror, and is used for controlling the angle of the vibrating mirror based on the preset mask pattern, so as to adjust the incident position of the shaped laser beam on the reticle to be processed.

According to an embodiment of the present invention, the metal mask processing equipment, wherein the processing component further includes an image acquisition unit, a translation stage, and a second controller, and the image acquisition unit and the translation platform are respectively connected to the second controller;

The image acquisition unit is used to collect images of the metal mask to be processed, the translation stage is used to carry the metal mask to be processed, and the second controller is used to control the displacement of the translation table according to the image of the metal mask to be processed and the processing range of the processing components.

According to an embodiment of the present invention, in the metal reticle processing equipment, the beam shaping component includes a beam expander, which is located on the beam propagation path between the light source component and the processing component, and is used to collimate the laser beam.

According to an embodiment of the present invention, in the metal reticle processing equipment, the beam shaping component further includes a mirror group, including at least one mirror, and the mirror group is located on the beam propagation path between the beam expander and the processing component On, and/or, the mirror group is located on the beam propagation path between the light source assembly and the beam expander.

According to an embodiment of the present invention, in the metal reticle processing equipment, the frequency range of the laser beam is 100-200KHz, and the power range is 20-40W.

In order to achieve the above-mentioned purpose, the embodiment of the second aspect of the present invention proposes a method for processing a metal mask, which is realized based on the metal mask processing equipment mentioned above,

These include:

Adjust the direction of the shaped laser beam with a preset mask pattern;

Control the shaped laser beam to be incident at different incident angles and scan the metal reticle to be processed to form a preset mask pattern scanning path on the metal reticle to be processed;

Perform the above steps multiple times to cut the area surrounded by the preset mask pattern, form a hollow mask pattern on the metal mask to be processed, and complete the processing.

According to an embodiment of the present invention, the processing assembly further includes an image acquisition unit and a translation stage, and before adjusting the direction of the shaped laser beam with a preset mask pattern, it also includes:

Obtain an image of the metal mask to be processed;

According to the image of the metal mask to be processed and the processing range of the processing components, the area of the metal mask to be processed is divided;

The movement of the translation stage is controlled to control an unprocessed area in the reticle to be processed to enter the processing range of the processing component.

According to an embodiment of the present invention, after the processing component finishes processing an unprocessed area, it further includes:

Control the movement of the translation stage, and control the next unprocessed area in the mask to be processed to enter the processing range of the processing component;

performing the steps of the metal mask processing method;

Repeat the above steps in turn until all unprocessed areas are processed.

According to an embodiment of the present invention, after the processing component finishes processing an unprocessed area, controlling the movement of the translation stage, and controlling the next unprocessed area in the reticle to be processed to enter the processing range of the processing component also includes:

Obtain an image of the hollowed-out area in the processed area;

Obtain the coordinates of the hollowed-out area according to the image of the hollowed-out area;

Judging whether the coordinates of the hollowed out area are consistent with the coordinates of the preset mask pattern, if not, obtaining the deviation between the coordinates of the hollowed out area and the coordinates of the preset mask pattern;

And correct the coordinates of the translation stage and/or the preset mask pattern according to the deviation.

The technical solution of the embodiment of the present invention uses a femtosecond laser to cooperate with a high-speed vibrating mirror to realize the cutting of a thinner mask, which solves the problems of blackened edges, sawtooth, warping, and residues that occur during fiber laser cutting, and improves the mask quality. Stencil processing edge quality and processing efficiency.

It should be understood that the content described in this section is not intended to identify key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will be easily understood from the following description.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a schematic block diagram of a processing device for a metal mask according to an embodiment of the present invention;

Fig. 2 is a cutting effect diagram in the prior art;

Fig. 3 is the cutting effect figure among the present embodiment;

FIG. 4 is a schematic structural diagram of processing components of a metal mask processing device according to an embodiment of the present invention;

5 is a schematic structural diagram of a beam shaping component of a metal mask processing device according to an embodiment of the present invention;

FIG. 6 is a flowchart of a metal mask processing method proposed by an embodiment of the present invention;

FIG. 7 is a flowchart of a metal mask processing method proposed by an embodiment of the present invention;

FIG. 8 is a flowchart of a metal mask processing method proposed by an embodiment of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

FIG. 1 is a schematic block diagram of a metal mask processing equipment according to an embodiment of the present invention. As shown in FIG. 1 , the metal mask processing equipment includes: a light source assembly 101 , a beam shaping assembly 102 and a processing assembly 103 .

The light source assembly 101 is used to emit a laser beam, the single pulse energy of the laser beam is greater than or equal to 200uJ, the pulse width range is 400-800fs, and the wavelength is 1030nm;

Wherein, the light source assembly 101 is a hardware device that emits a laser beam, preferably, it may be a femtosecond laser.

The beam shaping component 102 is located on the transmission path of the laser beam, and (as shown in FIG. 1 ) is used to shape the laser beam to form a shaped laser beam.

Wherein, shaping the laser beam may be understood as changing the beam diameter or emitting the beam, which is not limited in the embodiment of the present invention.

The processing component 103 is located on the transmission path of the shaped laser beam, and (as shown in FIG. 1 ) is used to adjust the direction of the shaped laser beam, and emit the shaped laser beam to the metal reticle to be processed, so as to form on the metal reticle to be processed. The mask pattern is preset, and the thickness range of the metal mask plate is 0.05-1mm.

Specifically, the light source component 101 emits a laser beam with a single pulse energy greater than or equal to 200uJ, a pulse width in the range of 400-800fs, and a wavelength of 1030nm. The laser beam passes through the beam shaping component 102 on the propagation path and is shaped to form a shaped laser beam. , passes through the processing component 103 on the propagation path, is adjusted in direction and emits to the metal reticle to be processed with a thickness ranging from 0.05 to 1 mm, and finally forms a preset mask pattern on the metal reticle to be processed.

Optionally, the metal mask processing equipment, wherein the frequency range of the laser beam is 100-200KHz, and the power range is 20-40W. When the laser with the above parameters cuts the metal mask to be processed with a thickness range of 0.05-1mm, the single pulse energy is large, the pulse width is small, and there is no blackening and residue on the edge of the metal mask. Fig. 2 is a cutting effect diagram in the prior art, and Fig. 3 is a cutting effect diagram in this embodiment, as shown in Fig. 2 and Fig. 3, the cutting effect in Fig. 3 is obviously neater than that in Fig. 2, and almost No scorching.

In the technical solution of the embodiment of the present invention, by using femtosecond laser and high-speed vibrating mirror to process the metal mask, it solves the situation that fiber laser cutting is prone to edge blackening, curling and deformation, etc., which cannot meet the processing requirements, resulting in the final failure of the mask. The use of the problem realizes the cutting of the thinner reticle and improves the cutting quality of the edge of the reticle.

FIG. 4 is a schematic structural diagram of a processing assembly of a metal reticle processing device according to an embodiment of the present invention. As shown in FIG. 4 , the processing assembly 103 further includes a vibrating mirror 104 , a field lens 105 and a first controller 106 . The vibrating mirror 104 is located on the transmission path of the shaped laser beam; the field mirror 105 is located on the side of the vibrating mirror 104 adjacent to the metal reticle 120 to be processed; the first controller 106 is connected to the vibrating mirror 104 for controlling the laser beam based on a preset mask pattern The angle of the vibrating mirror 104 is used to adjust the incident position of the shaped laser beam on the reticle 120 to be processed.

Exemplarily, if the preset graphic shape is a horizontal line, the first controller 106 can control and adjust the angle of the vibrating mirror 104, for example, it can be adjusted from 30° to 60°, so that the shaped laser beam passing through the vibrating mirror 104 The light beam moves from one point to another, forming a pattern of horizontal lines on the reticle 120 to be processed.

It can be understood that, in the first controller 106 , corresponding graphics corresponding to corresponding swing angles of the vibrating mirror 104 may be pre-stored. When a certain pattern needs to be formed on the metal reticle 120 to be processed, the first controller 106 correspondingly controls the swing angle of the vibrating mirror 104 to form the pattern by changing the incident position on the metal reticle 120 to be processed. . Wherein, the preset pattern may be a rectangle, a prism, a circle, etc., which may be determined according to the pattern requirements of the metal mask 120 to be processed, which is not specifically limited in the present invention.

As shown in FIG. 4 , the processing assembly 103 further includes an image acquisition unit 107 , a translation stage 108 , and a second controller 109 . The image acquisition unit 107 and the translation stage 108 are respectively connected with the second controller 109;

The image acquisition unit 107 is used to collect the image of the metal reticle 120 to be processed, the displacement table 108 is used to carry the metal reticle 120 to be processed, and the second controller 109 is used to The processing range controls the displacement of the translation stage 108 .

Wherein, the first controller 106 and the second controller 109 can be set separately and independently, or can be integrated into one controller. The integration in one controller 200 is taken as an example below for illustration.

The image acquisition unit 107 may be a hardware device configured in the processing component 103, for example, it may be a CCD system or a CMOS system.

Specifically, after the image acquisition unit 107 acquires the image of the metal reticle 120 to be processed, the controller 200 can locate the XY boundary of the reticle according to the image, and compare it with the finished product sample pre-stored in the controller 200 to determine the processing path . Exemplarily, the metal reticle 120 to be processed can be divided into a checkerboard shape, for example, there are first, second, ..., N areas, and each area can be in the processing assembly 103 when it is processed by the processing assembly 103 (field lens 105) within the processing range.

Exemplarily, the controller 200 controls the displacement stage 108 to move, the first area is located within the processing range of the processing assembly 103, the controller 200 can adjust the angle of the vibrating mirror 104 to form a preset mask pattern in the first area, and the image The acquisition unit 107 acquires the image of the metal reticle 120 to be processed. When the mask pattern in the first area is not exactly the same as the preset mask pattern, the controller 200 controls the translation stage 108 to keep still. When the mask pattern in the first area When the mold pattern is the same as the preset mask pattern, the processing is completed. At this time, the controller 200 controls the displacement table 108 to move the second area into the processing range of the field lens 105 according to the current processing situation, and then proceeds to process, and so on until the last area is processed. Finish.

It should be noted that a processing area may only include one mask pattern, or may include a part of a mask pattern, or may include multiple mask patterns, that is, the number of mask patterns in a processing area and the processing range is related to the size of the graph itself.

According to the technical solution of this embodiment, by adding a translation stage 108 , a controller 200 and an image acquisition unit 107 to the processing assembly 103 , the processing of the metal reticle 120 to be processed larger than the processing range is realized.

FIG. 5 is a schematic structural diagram of a beam shaping component of a processing equipment for a metal mask according to an embodiment of the present invention. As shown in FIG. On the propagation path, it is used to expand and collimate the laser beam.

The beam shaping assembly 102 also includes a mirror group 111, including at least one mirror, the mirror group 111 is located on the beam propagation path between the beam expander 110 and the processing assembly 103, and/or the mirror group 111 is located in the light source assembly 101 to the beam propagation path between the beam expanders 110.

Specifically, when the mirror group 111 is located on the beam propagation path between the beam expander 110 and the processing assembly 103, and the mirror group 111 is located on the beam propagation path between the light source assembly 101 and the beam expander 110, as shown in FIG. 5, the reflector group 111 includes a first reflector 1111 and a second reflector 1112. After the laser beam is emitted from the light source assembly 101, it is reflected into the beam expander 110 by the first reflector 1111, changing the laser beam The diameter and the emission divergence angle make it a shaped laser beam, which is beneficial to the improvement of the processing accuracy of the processing assembly 103. After being emitted from the beam expander 110, it is reflected into the processing assembly 103 through the second reflector 1112, and passes through the first reflection. The setting of the mirror 1111 and the second reflecting mirror 1112 changes the propagation direction of the optical path of the whole device, makes the arrangement of various components in the whole device more concentrated, and reduces the volume of the whole device.

In other embodiments, at least one reflective mirror may be provided between the light source assembly 101 and the beam expander 110 , or at least one reflective mirror may be provided between the beam expander 110 and the processing assembly 103 according to actual needs. The present invention does not specifically limit this, and the main purpose is to realize the miniaturization of the overall equipment.

FIG. 6 is a flow chart of a metal mask processing method proposed by an embodiment of the present invention. The method is implemented based on the aforementioned metal mask processing equipment. As shown in FIG. 6 , the processing method includes the following steps:

S110, adjusting the direction of the shaped laser beam with a preset mask pattern.

Wherein, the preset mask pattern can be understood as an image shape preset in the first controller according to actual processing requirements, which is not limited in the embodiment of the present invention. Shaping a laser beam can be understood as a laser beam that changes the beam diameter or emission divergence.

Specifically, according to the needs of actual processing conditions, the mask pattern can be set in the first controller in advance. The femtosecond laser emits a laser beam, which is shaped by a beam shaping component to form a shaped laser beam. The first controller acquires the position where the reticle to be processed needs to be cut according to the preset mask pattern, and adjusts the outgoing direction of the shaped laser beam through the processing component.

S120. Control the shaped laser beam to be incident at different incident angles and scan the metal reticle to be processed, so as to form a preset mask pattern scanning path on the metal reticle to be processed.

Wherein, the metal reticle to be processed can be understood as an unprocessed reticle. The preset mask pattern scanning path can be understood as a path formed by laser scanning according to the shape of the preset mask pattern.

Specifically, the first controller sends corresponding instructions to the processing components according to the shape of the preset mask pattern, controls the operation of the motor connected to the vibrating mirror, and adjusts the direction of the shaped laser beam so that the shaped laser beam is incident on the scanning target from different angles. The metal mask is processed, and a preset mask pattern scanning path is formed on the metal mask to be processed.

Exemplarily, if the preset graphic shape is a horizontal line, the first controller can control and adjust the angle of the vibrating mirror, for example, it can be adjusted from 30° to 60°, so that the shaped laser beam passing through the vibrating mirror changes from one The point moves to another point to form a horizontal line graphic shape on the mask plate to be processed.

It can be understood that, in the first controller, corresponding graphs corresponding to corresponding oscillating angles of the vibrating mirrors may be prestored. When a certain pattern needs to be formed on the metal mask to be processed, the first controller correspondingly controls the swing angle of the vibrating mirror to form the pattern by changing the incident position on the metal mask to be processed.

S130 , performing the above steps multiple times, cutting the area surrounded by the preset mask pattern, forming a hollow mask pattern on the metal mask to be processed, and completing the processing.

Wherein, the hollowed-out mask pattern can be understood as a preset mask pattern engraved by laser on the reticle after the processing is completed.

Specifically, on the scanning path of the preset mask pattern formed on the metal mask to be processed, the path is repeatedly used to scan and cut the path until the area surrounded by the preset mask pattern is separated from the metal mask. A hollow mask pattern is formed on the stencil.

In the embodiment of the present invention, by using a femtosecond laser and a high-speed vibrating mirror to process the metal mask, it solves the problem that the fiber laser cutting is prone to edge blackening, curling and deformation, etc., which cannot meet the processing requirements, resulting in the mask being unusable in the end. The problem of cutting the thinner reticle is realized, and the cutting quality of the edge of the reticle is improved.

Fig. 7 is a flow chart of a method for processing a metal reticle proposed by an embodiment of the present invention. The method is implemented based on the processing equipment for a metal reticle as described above. On the basis of the above, the processing component also includes an image acquisition unit and a displacement The platform, as shown in Figure 7, also includes the following steps before adjusting the direction of the shaped laser beam with a preset mask pattern:

S210. Acquiring an image of the metal mask to be processed.

Wherein, the acquisition method may be taking a photo.

S220. Divide regions of the metal mask to be processed according to the image of the metal mask to be processed and the processing range of the processing components.

Specifically, after the image acquisition unit acquires the image of the metal reticle to be processed, the second controller can locate the XY boundary of the reticle according to the image, and compare it with the finished product sample pre-stored in the second controller to determine the processing path . Exemplarily, the metal mask to be processed can be divided into checkerboard shapes, for example, there are first, second, ..., N areas, and each area can be in the processing assembly (field mirror) when it is processed by the processing assembly. ) within the processing range.

S230. Control the displacement stage to move, so as to control an unprocessed area in the mask plate to be processed to enter the processing range of the processing component.

Specifically, after the metal mask to be processed is divided into regions, according to the information of the divided region to be processed, the second controller controls the displacement stage to move the metal mask to be processed in a region into the processing range. The region is processed through steps S110-S130, and after the processing is completed, step S240 is executed.

S240. Control the movement of the displacement stage, and control the next unprocessed area in the mask plate to be processed to enter the processing range of the processing component.

S250. Adjust the direction of the shaped laser beam with a preset mask pattern.

S260. Control the shaped laser beam to be incident at different incident angles and scan the metal reticle to be processed, so as to form a preset mask pattern scanning path on the metal reticle to be processed.

S270, performing the above steps multiple times, cutting the area surrounded by the preset mask pattern, forming a hollow mask pattern on the metal mask to be processed, and completing the processing.

S280. Repeat the above steps in sequence until all unprocessed areas are processed.

Exemplarily, the controller controls the displacement stage to move, the first area is located within the processing range of the processing assembly, the controller can adjust the angle of the vibrating mirror to form a preset mask pattern in the first area, and the image acquisition unit collects the image to be processed For the image of the metal mask plate, when the mask pattern in the first area is not exactly the same as the preset mask pattern, the controller controls the displacement stage to keep still, and when the mask pattern in the first area is the same as the preset mask pattern At the same time, the processing is completed. At this time, the controller controls the displacement table to move the second area into the processing range of the field mirror according to the current processing situation, and so on until the processing of the last area is completed.

The embodiments of the present invention process the reticle by using the translation stage and the image acquisition unit, and by adding the translation platform, the second controller and the image acquisition unit to the processing assembly, the processing of the metal reticle to be processed that is larger than the processing range is realized.

FIG. 8 is a flow chart of a method for processing a metal reticle proposed by an embodiment of the present invention. The method is implemented based on the above-mentioned metal reticle processing equipment. As shown in Figure 8, after the processing component completes the processing of an unprocessed area, control the movement of the translation stage, and control the next unprocessed area in the mask to be processed before entering the processing range of the processing component:

S310. The processing component finishes processing an unprocessed area.

S320. Obtain an image of the hollowed-out area in the processed area.

S330. Acquire the coordinates of the hollowed-out area according to the image of the hollowed-out area.

S340. Determine whether the coordinates of the hollowed-out area are consistent with the coordinates of the preset mask pattern, and if not, acquire the deviation between the coordinates of the hollowed-out area and the coordinates of the preset mask pattern.

S350, and correct the coordinates of the translation stage and/or the preset mask pattern according to the deviation.

S360. Control the movement of the translation stage, so as to control an unprocessed area in the mask plate to be processed to enter the processing range of the processing component.

Specifically, after the processing component completes the processing of an unprocessed area, the image acquisition unit collects the image of the hollowed out area of the area, analyzes and obtains the coordinates of the hollowed out area and records them. Compare the coordinates of the hollowed-out area with the coordinates of the preset mask graphics to determine whether the two areas are consistent. If they are inconsistent, it means that the processing path of the processing area has deviations. Obtain the deviation value between the two coordinates and record it. According to The offset value corrects the coordinates of the translation stage and/or the preset mask pattern to correct for offset. Therefore, after the second controller controls the displacement stage to move, and controls an unprocessed area in the mask plate to be processed to enter the processing range of the processing assembly, the processing assembly can perform precise processing.

In the technical solution of the embodiment of the present invention, the coordinates of the hollowed-out area in the processed area are obtained by the image acquisition unit, and compared with the coordinates of the preset mask pattern, the deviation is corrected, and the processing accuracy is improved.

It should be understood that steps may be reordered, added or deleted using the various forms of flow shown above. For example, each step described in the present invention may be executed in parallel, sequentially, or in a different order, as long as the desired result of the technical solution of the present invention can be achieved, there is no limitation herein.

The above specific implementation methods do not constitute a limitation to the protection scope of the present invention. It should be apparent to those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made depending on design requirements and other factors. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A processing apparatus for metal mask blanks, comprising:

the light source component is used for emitting laser beams, the single pulse energy of the laser beams is more than or equal to 200uJ, the pulse width range is 400-800fs, and the wavelength is 1030nm;

the beam shaping component is positioned on a transmission path of the laser beam and is used for shaping the laser beam to form a shaped laser beam;

and the processing assembly is positioned on a transmission path of the shaped laser beam and is used for adjusting the direction of the shaped laser beam and emitting the shaped laser beam to the metal mask plate to be processed so as to form a preset mask pattern on the metal mask plate to be processed, and the thickness range of the metal mask plate is 0.05-1mm.

2. The metal reticle fabrication apparatus of claim 1, wherein the processing assembly comprises a galvanometer, a field lens, and a first controller;

the galvanometer is positioned on a transmission path of the shaped laser beam;

the field lens is positioned at one side of the vibrating lens close to the metal mask plate to be processed;

the first controller is connected with the galvanometer and used for controlling the angle of the galvanometer based on the preset mask pattern so as to adjust the position of the shaped laser beam incident on the mask plate to be processed.

3. The metal mask plate processing equipment according to claim 1 or 2, wherein the processing assembly further comprises an image acquisition unit, a displacement table and a second controller, and the image acquisition unit and the displacement table are respectively connected with the second controller;

the image acquisition unit is used for acquiring an image of the metal mask plate to be processed, the displacement table is used for bearing the metal mask plate to be processed, and the second controller is used for controlling the displacement of the displacement table according to the image of the metal mask plate to be processed and the processing range of the processing assembly.

4. The metal mask machining apparatus of claim 1, wherein the beam shaping assembly comprises a beam expander positioned in a beam propagation path between the light source assembly and the machining assembly to collimate the laser beam.

5. The metal mask machining apparatus of claim 4, wherein the beam shaping assembly further comprises a mirror group comprising at least one mirror, the mirror group being located in a beam propagation path between the beam expander and the machining assembly, and/or the mirror group being located in a beam propagation path between the light source assembly and the beam expander.

6. The metal mask processing apparatus of claim 1, wherein the laser beam has a frequency in the range of 100-200KHz and a power in the range of 20-40W.

7. A processing method of a metal mask, which is realized based on the processing equipment of the metal mask as claimed in any one of claims 1 to 6, and comprises the following steps:

adjusting the direction of the shaped laser beam with a preset mask pattern;

controlling the shaped laser beam to be incident at different incidence angles and scanning the metal mask plate to be processed so as to form a preset mask pattern scanning path on the metal mask plate to be processed;

and performing the steps for multiple times, cutting the area enclosed by the preset mask pattern, and forming a hollow mask pattern on the metal mask plate to be processed to finish processing.

8. The method of claim 7, wherein the processing assembly further comprises an image capture unit and a displacement stage, and further comprises, prior to adjusting the direction of the shaped laser beam with a predetermined mask pattern:

acquiring an image of the metal mask to be processed;

dividing the metal mask plate to be processed into areas according to the image of the metal mask plate to be processed and the processing range of the processing assembly;

and controlling the displacement table to move so as to control a non-processing area in the mask plate to be processed to enter a processing range of the processing assembly.

9. The method of processing a metal reticle of claim 8, further comprising, after the processing assembly completes processing the one unprocessed region:

controlling the displacement table to move, and controlling the next unprocessed area in the mask plate to be processed to enter the processing range of the processing assembly;

a step of performing the machining method according to claim 7;

and sequentially circulating the steps until all the unprocessed areas are processed.

10. The method of claim 9, wherein after the machining assembly completes machining the one unmachined area, the displacement stage is controlled to move, and before controlling a next unmachined area in the mask to be machined to enter a machining range of the machining assembly, the method further comprises:

acquiring an image of a hollow area in a processed area;

acquiring coordinates of the hollowed-out area according to the image of the hollowed-out area;

judging whether the coordinates of the hollowed-out area are consistent with the coordinates of the preset mask graph or not, and if not, acquiring the deviation between the coordinates of the hollowed-out area and the coordinates of the preset mask graph;

and correcting the coordinates of the displacement table and/or the preset mask pattern according to the deviation.

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