CN115397128A - A white ink solder mask pattern processing equipment and method - Google Patents

Abstract

The invention discloses a white ink solder resist pattern processing equipment and method. The equipment includes: a light source assembly for lasers with an output wavelength range of 1030±5nm to 1070n±5nm or 515±5nm to 532±5nm, a repetition rate greater than or equal to 1000KHz, a single pulse energy greater than 10uJ, and a pulse width range of 0.5‑20ns Beam; the beam shaping component, located on the propagation path of the laser beam, is used to shape the laser beam to form a shaped laser beam; the processing component, located on the transmission path of the shaped laser beam, is used to adjust the direction of the shaped laser beam and emit The laser beam is shaped to the white ink solder resist layer on the printed circuit board to be processed, so as to form a preset solder resist pattern on the white ink solder resist layer, and decompose the white ink in the corresponding area of the preset solder resist pattern. Compared with the traditional exposure and development process, the embodiment of the present invention has a shorter process, only needs silk screen printing ink, pre-baking, and laser removal; it is environmentally friendly, free of organic diluent precipitation; good in precision; and low in cost.

Description

A white ink solder mask pattern processing equipment and method

technical field

The invention relates to the technical field of printed circuit board processing, in particular to a white ink solder resist pattern processing equipment and method.

Background technique

The basic components of a printed circuit board are pads, vias, solder mask, and text printing. The function of the solder mask layer is to prevent parts that should not be soldered from being connected by solder. The role of the solder mask in controlling solder defects during the reflow soldering process is important.

Printed circuit boards in the Mini-LED, Micro-LED, and IC substrate industries use solder resist layers made by traditional exposure and development processes. For the presence of white ink on printed circuit boards, most of them are currently removed by chemical means. The general process is screen printing solder resist ink, pre-baking, film exposure or LDI exposure, and chemical reagent development. This process has many, long and complex processes; a large amount of organic irritating solvents are volatilized during the process, and the environment is harsh; the ink needs special developing additives, and the cost is high; the exposure and development process is also the process of graphic transfer, and there are multiple process errors. Accumulation, so it is not suitable for high-precision occasions.

Contents of the invention

The invention provides a white ink solder resist pattern processing equipment and method to solve the problems of high dimensional accuracy, high efficiency, and low-cost mass production process of solder resist ink forming of industrial electronic circuit boards.

According to one aspect of the present invention, a kind of white ink solder mask pattern processing equipment is provided, comprising:

The light source component is used to emit the laser beam, the wavelength range of the laser beam is 1030±5nm to 1070n±5nm or 515±5nm to 532±5nm, the repetition frequency is greater than or equal to 1000KHz, the single pulse energy is greater than 10uJ, and the pulse width range is 0.5- 20ns;

The beam shaping component is located on the propagation path of the laser beam and is used to shape the laser beam to form a shaped laser beam;

The processing component is located on the transmission path of the shaped laser beam, and is used to adjust the direction of the shaped laser beam, and emit the shaped laser beam to the white ink solder resist layer on the printed circuit board to be processed, so as to form a pre-set on the white ink solder resist layer. Set the solder resist pattern, and decompose the white ink in the corresponding area of the preset solder resist pattern.

According to one embodiment of the invention, the processing assembly includes:

a field lens, a controller and at least one galvanometer;

Among them, the field lens is located on the side of the galvanometer adjacent to the printed circuit board to be processed;

The controller is connected with the vibrating mirror, and is used for adjusting the angle of the vibrating mirror based on the preset solder resist pattern, so as to adjust the position where the shaped laser beam is incident on the white ink solder resist layer.

According to one embodiment of the invention, the processing assembly includes:

a field lens, a controller and at least one rotating prism;

Wherein, the field lens is located on one side of the rotating prism adjacent to the printed circuit board to be processed;

The controller is connected with the rotating prism, and is used for adjusting the rotation angle of the rotating prism based on the preset solder resist pattern, so as to adjust the incident position of the shaped laser beam on the white ink solder resist layer.

According to an embodiment of the present invention, the processing assembly also includes an image acquisition unit and a displacement platform, which are respectively connected to the controller;

Wherein, the image acquisition unit is used for collecting the image of the printed circuit board to be processed, the displacement table is used for carrying the printed circuit board to be processed, and the controller is used for controlling the displacement of the displacement table based on the image of the printed circuit board to be processed.

According to one embodiment of the present invention, the beam shaping assembly includes:

The lens group is located on the propagation path of the light beam between the light source component and the processing component, and is used for collimating and focusing the laser beam;

The reflecting mirror group includes: at least one reflecting mirror, located on the beam propagation path between the light source assembly and the lens assembly, and/or, located on the beam propagation path between the lens assembly and the processing assembly.

According to another aspect of the present invention, a method for processing white ink solder resist patterns is provided, which is realized based on white ink solder resist pattern processing equipment. The processing method includes the following steps:

Controlling the white ink solder mask of the printed circuit board to be processed is located on the focal plane of the processed component;

Generate processing paths according to preset solder mask graphics;

According to the processing path, the processing components are adjusted to adjust the incident position of the shaped laser beam on the white ink solder mask layer, and a preset solder mask pattern is formed on the white ink solder mask layer, and the white ink in the corresponding area of the preset solder mask pattern is decomposed, Finish processing.

According to an embodiment of the present invention, wherein the processing assembly includes an image acquisition unit and a displacement stage, before controlling the white ink solder mask layer of the printed circuit board to be processed to be located on the focal plane of the processing assembly, it also includes:

Obtain the image of the printed circuit board to be processed;

dividing the area of the printed circuit board to be processed according to the image of the printed circuit board to be processed;

The movement of the displacement stage is controlled, and an unprocessed area in the printed circuit board to be processed is controlled to be within the processing range of the processing component.

According to an embodiment of the present invention, after the processing component completes the processing of the unprocessed area, it further includes:

Control the movement of the displacement table, and control the next unprocessed area in the printed circuit board to be processed to be within the processing range of the processing component;

The steps of performing the white ink solder mask pattern processing method;

Repeat the above steps in turn until all unprocessed areas are processed.

According to an embodiment of the present invention, generating the processing path according to the preset solder mask pattern includes:

Generate the outer contour processing path according to the preset solder mask graphics, and generate the decomposed scanning path according to the outer contour processing path;

Or, generate a serpentine processing path according to the preset solder mask pattern.

According to the white ink solder resist pattern processing equipment and method proposed in the embodiment of the present invention, the equipment includes: a light source assembly for emitting a laser beam, and the wavelength range of the laser beam is 1030±5nm to 1070n±5nm or 515±5nm to 532nm ±5nm, repetition frequency greater than or equal to 1000KHz, single pulse energy greater than 10uJ, pulse width range of 0.5-20ns; beam shaping component, located on the propagation path of the laser beam, used to shape the laser beam to form a shaped laser beam; processing The component is located on the transmission path of the shaped laser beam, used to adjust the direction of the shaped laser beam, and emit the shaped laser beam to the white ink solder resist layer on the printed circuit board to be processed, so as to form a preset on the white ink solder resist layer Solder resist graphics, and decompose the white ink in the corresponding area of the preset solder resist graphics, which solves the problem of low cost and low efficiency of solder resist ink forming for industrial electronic circuit boards, and achieves high precision, low cost and good effect.

It should be understood that the content described in this section is not intended to identify key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will be easily understood from the following description.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a schematic block diagram of a white ink solder mask pattern processing device proposed by an embodiment of the present invention;

Fig. 2 is a schematic structural view of processing components in a white ink solder resist pattern processing equipment proposed by an embodiment of the present invention;

3 is a schematic structural view of processing components in another white ink solder resist pattern processing equipment proposed by an embodiment of the present invention;

Fig. 4 is a schematic structural view of processing components in another white ink solder resist pattern processing equipment proposed by an embodiment of the present invention;

Fig. 5 is a schematic structural diagram of a beam shaping component in a white ink solder resist pattern processing device proposed by an embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a beam shaping component in another white ink solder resist pattern processing device proposed by an embodiment of the present invention;

7 is a flow chart of a white ink solder mask pattern processing method proposed by an embodiment of the present invention;

8 is a flow chart of a white ink solder mask pattern processing method proposed by an embodiment of the present invention;

9 is a schematic diagram of a processing path of a white ink solder resist pattern processing method proposed by an embodiment of the present invention;

10 is a schematic diagram of an overall processing path of a white ink solder resist pattern processing method proposed by an embodiment of the present invention.

Detailed ways

In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

Fig. 1 is a schematic block diagram of a white ink solder resist pattern processing device provided by Embodiment 1 of the present invention. As shown in Fig. 1, the white ink solder resist pattern processing device 100 includes:

The light source assembly 101 is used to emit a laser beam, the wavelength range of the laser beam is 1030±5nm to 1070n±5nm or 515±5nm to 532±5nm, the repetition frequency is greater than or equal to 1000KHz, the single pulse energy is greater than 10uJ, and the pulse width range is 0.5 -20ns;

The beam shaping component 102 is located on the propagation path of the laser beam and is used to shape the laser beam to form a shaped laser beam;

The processing component 103 is located on the transmission path of the shaped laser beam, and is used to adjust the direction of the shaped laser beam, and emit the shaped laser beam to the white ink solder resist layer on the printed circuit board to be processed, so as to form on the white ink solder resist layer. Preset the solder resist pattern, and decompose the white ink in the corresponding area of the preset solder resist pattern.

Wherein, the light source assembly 101 can be specifically understood as a device for generating laser beams, where the device can be a high repetition frequency short pulse infrared or green laser, etc., which is not limited in the embodiment of the present invention. The beam shaping component 102 can be specifically understood as an optical element that performs operations such as focusing and reflecting the laser beam, wherein the optical element can be a lens group, a mirror, and the like. The processing component 103 can be specifically understood as various devices for changing the direction of the shaped laser beam, where the devices can be field mirrors, controllers, rotating prisms, and the like.

Specifically, the light source component 101 emits a laser beam according to pre-set parameters, passes through the beam shaping component 102 to obtain the required shaped laser beam, and then the shaped laser beam passes through the processing component 103 to complete the operation of changing the direction.

Exemplarily, if the processing component 103 needs to form a rectangular preset solder resist pattern on the white ink solder resist layer on the printed circuit board to be processed, the processing component 103 can adjust the outgoing direction of the beam shaping component 102 according to the rectangular preset solder resist pattern , such as first hitting a vertex of the rectangular preset solder resist pattern with the shaped laser beam, then dots along the border of the rectangle horizontally or vertically, and finally changing the direction of the shaped laser beam and then moving along the other corners of the rectangular preset solder resist pattern. The boundary is always scanned and dotted, so that the area surrounded by the rectangular preset solder mask pattern is separated from the entire white ink solder mask layer, and finally the area surrounded by the rectangular preset solder mask pattern is scanned and dotted by controlling the direction of the shaped laser beam. to break it down.

It can be understood that the coordinates of a certain point on the preset solder resist pattern and the corresponding processing path can be set in advance in the processing component 103, and the coordinates are the same as the coordinates of a certain point on the white ink solder resist layer that needs to form the preset solder resist pattern Consistent, so that the shaped laser beam takes the coordinates of the point of the preset solder resist pattern as the starting point, and dots the white ink solder resist layer according to the corresponding processing path of the preset solder resist pattern.

In other embodiments, the preset solder resist pattern may also be in the shape of a circle, a square, a prism, etc., which are not listed here.

It should be noted that since the wavelength range of the laser beam is 1030±5nm to 1070n±5nm or 515±5nm to 532±5nm, the repetition frequency is greater than or equal to 1000KHz, the single pulse energy is greater than 10uJ, and the pulse width range is 0.5-20ns. Parameter laser beam can thermally shock the white ink layer through processing pulses with high peak power, so that the solder resist layer and the substrate are peeled off. In addition, the laser beam in this wavelength range can decompose the white ink layer. Therefore, the formation of the preset solder resist pattern on the white ink layer only requires silk screen printing ink, pre-baking, and laser removal. It does not need to be precipitated by organic diluents, is environmentally friendly, and does not need to be cleaned in subsequent processes, saving steps. . Among them, in the process of processing, the thickness of the solder resist is less than 30um, and the removal efficiency is greater than 5cm ² /min, which is higher than that of the low-speed laser for removing solder resist ink.

In this embodiment, as shown in FIG. 2 , which is a schematic structural diagram of a processing assembly, the processing assembly 103 includes: a field lens 104 , a controller 105 and at least one vibrating mirror 106 .

The field lens 104 is located on the side of the vibrating mirror 106 adjacent to the printed circuit board 107 to be processed;

The controller 105 is connected with the vibrating mirror 106, and is used for adjusting the angle of the vibrating mirror 106 based on the preset solder resist pattern, so as to adjust the incident position of the shaped laser beam on the white ink solder resist layer.

Wherein, the field lens 104 can be specifically understood as an optical element working on the image plane of the objective lens. The vibrating mirror 106 can be specifically understood as an optical element composed of an X-Y optical scanning head, an electronic driving amplifier and optical mirrors. Specifically, the controller 105 can be understood as a device that controls the vibrating mirror 106 based on the pre-set solder mask pattern, and the device can be an industrial computer or the like.

Specifically, the controller 105 is electrically connected to the light source assembly 101, and the controller 105 generates corresponding different instructions according to the shape of the preset solder resist pattern. After passing through the vibrating mirror 106, the outgoing direction is changed, and the outgoing laser beam is incident on the white ink solder resist layer according to the shape of the preset solder resist pattern, and thermally shocks the white ink layer to separate the solder resist layer from the substrate, and the white ink layer Decompose and complete processing.

Exemplarily, the solder resist pattern is preset to be a rectangle. After the controller 105 controls the laser beam to emit the laser beam, the angle of the laser beam is adjusted by controlling the X-Y scanning head of the vibrating mirror 106, so that the laser beam is incident on the printed circuit board 107 to be processed. In this process, the shaping laser beam is firstly hit at a vertex of the preset solder resist pattern, and then the dots are scanned along the other borders of the rectangular preset solder resist pattern, so that the area surrounded by the rectangular pre-solder resist pattern is closely aligned with the entire white ink resist pattern. The welding layer is separated and separated, and the final controller 105 controls the direction of the laser beam shaped by the vibrating mirror 106, scans and spots the area surrounded by the rectangular preset solder mask pattern, decomposes it, and completes the processing.

In one embodiment, multiple vibrating mirrors 106 may be provided to simultaneously process the printed circuit board 107 to be processed, thereby improving processing efficiency.

Optionally, as shown in FIG. 3 , it is another structural schematic diagram of the processing assembly 103 , the processing assembly 103 includes: a field lens 104 , a controller 105 and at least one rotating prism 108 .

The field lens 104 is located on the side of the rotating prism 108 adjacent to the printed circuit board 107 to be processed;

The controller 105 is connected with the rotating prism 108, and is used for adjusting the rotation angle of the rotating prism 108 based on the preset solder resist pattern, so as to adjust the incident position of the shaped laser beam on the white ink solder resist layer.

Wherein, the rotating prism 108 can be specifically understood as an optical element that can adjust the incident angle of the shaped laser beam by changing the angle of the rotating prism 108 .

Specifically, the controller 105 is electrically connected to the light source assembly 101, and the controller 105 generates corresponding different instructions according to the shape of the preset solder mask pattern, and controls the rotation angle of the rotating prism 108 while controlling the laser to emit the laser beam, so that the laser After passing through the rotating prism 108, the outgoing direction is changed, and the outgoing laser beam is incident on the white ink solder resist layer according to the shape of the preset solder resist pattern, and thermally shocks the white ink layer, so that the solder resist layer is separated from the substrate, and the white ink is processed. Decompose and complete processing.

Exemplarily, the solder mask pattern is preset as a rectangle. After the controller 105 controls the laser to emit the laser beam, the angle of the laser beam is adjusted by controlling the rotating prism 108, so that when the laser beam is incident on the printed circuit board 107 to be processed, the The shaped laser beam hits a vertex of the preset solder mask pattern, and then scans and dots along the other borders of the rectangular preset solder mask pattern, so that the area surrounded by the rectangular pre-solder mask pattern is separated from the entire white ink solder mask layer , the final controller 105 controls the direction of the laser beam shaped by the rotating prism 108, scans and marks the area surrounded by the rectangular preset solder resist pattern, decomposes it, and completes the processing.

In one embodiment, multiple rotating prisms 108 may be provided to process the printed circuit board 107 to be processed at the same time, thereby improving processing efficiency.

Optionally, as shown in FIG. 4 , it is another schematic structural view of the processing assembly 103, the processing assembly 103 includes: an image acquisition unit 109 and a translation stage 110, respectively connected to the controller 105;

The image acquisition unit 109 is used to collect images of the printed circuit board 107 to be processed, the translation stage 110 is used to carry the printed circuit board 107 to be processed, and the controller 105 is used to control the displacement of the translation table 110 based on the image of the printed circuit board 107 to be processed.

Wherein, the image acquisition unit 109 can be specifically understood as a device for collecting images of the printed circuit board 107 to be processed at all times, and the translation stage 110 can be specifically understood as a platform for carrying the printed circuit board 107 to be processed controlled by the controller 105 .

Specifically, the image acquisition unit 109 collects the image of the printed circuit board 107 to be processed, and transmits the data back to the controller 105, and the controller 105 judges the state of the printed circuit board 107 to be processed according to the received image, issues corresponding instructions, and responds accordingly The instructions include but are not limited to: continue processing this area or control the translation stage 110 to transfer to the next area.

Wherein, the controller 105 can correspondingly obtain the coordinates of each point on the printed circuit board 107 to be processed according to the received image, and compare the coordinates of the pre-stored preset solder resist pattern with the coordinates of each point on the printed circuit board 107 to be processed Correspondingly, furthermore, the controller 105 can control the displacement of the translation stage 110 through the coordinates of each point.

Exemplarily, if there is only one preset solder resist pattern within the processing range of the field lens 104, and the preset solder resist pattern is a rectangle, the image collected by the image acquisition unit 109 is that the edges of the rectangle have all been dotted, but the enclosed If the processing is not completed inside the area, the controller 105 will send an instruction to order the translation stage 110 to continue to remain still and wait for the complete processing in the rectangular area before performing the corresponding displacement operation; if within the processing range of the field mirror 104, there are multiple presets For the solder resist pattern, after the current preset solder resist pattern is processed, the translation stage 110 continues to remain still, and waits for all the preset solder resist patterns within the processing range to be processed before moving the translation stage 110 . If the area of the printed circuit board 107 to be processed is too large, that is, the preset solder resist pattern is not within the processing range of the field lens, the image collected by the image acquisition unit 109 shows that the shaping laser beam cannot complete the processing of the entire preset solder resist pattern, and the control The controller 105 will issue an instruction to control the displacement table 110 to perform a displacement operation so that the shaped laser beam can be processed to all areas of the pattern, and when the image collected by the image acquisition unit 109 is the preset solder resist pattern and the processing has been completed, the controller 105 An instruction will be issued to control the translation stage 110 to transfer the next printed circuit board 107 to be processed to the processing position.

In this embodiment, as shown in FIG. 5 , it is a schematic structural view of the beam shaping assembly 102, the beam shaping assembly 102 includes: a lens group 111, located on the propagation path of the light beam between the light source assembly 101 and the processing assembly 103 , for collimating and focusing the laser beam; the beam shaping assembly 102 also includes: a reflector group, including: at least one reflector 112, located on the beam propagation path between the light source assembly 101 and the lens group assembly, and/or located at the lens On the beam propagation path between the group 111 and the processing assembly 103 .

Wherein, the lens group 111 can specifically be understood as an optical mirror group composed of several lenses for collimating and focusing the laser beam, which can conduct, expand and homogenize the laser beam or shape the spot shape by using DOE. The reflective mirror 112 can be specifically understood as an optical lens that reflects the laser beam, and can change the direction of the laser beam so that the laser beam can enter the vibrating mirror 106 or the rotating prism 108 .

Specifically, the controller 105 controls the laser beam to exit from the light source assembly 101, and then passes through the lens group 111. The lens group 111 conducts, expands, homogenizes the laser beam, or uses DOE to shape the spot shape, and then enters the reflector In 112 , the laser beam is reflected by the mirror 112 , and then enters the vibrating mirror 106 or the rotating prism 108 , and finally enters the printed circuit board 107 to be processed to process the white ink solder resist layer.

Exemplarily, the laser beam is emitted vertically downward through the light source assembly 101, and is transmitted through the lens group 111, beam expanded, homogenized or shaped by DOE to achieve the parameters of the laser beam required by this embodiment. On the reflector 112, after being reflected by the reflector 112, the laser beam becomes horizontally transmitted, then incident on the galvanometer 106 or the rotating prism 108, and finally incident on the printed circuit board 107 to be processed. for processing.

Optionally, as shown in FIG. 6 , it is another structural schematic diagram of the beam shaping assembly 102, the beam shaping assembly 102 includes: a lens group 111, located on the propagation path of the light beam between the light source assembly 101 and the processing assembly 103, For collimating and focusing the laser beam; the beam shaping assembly 102 also includes: a reflector group, including: two reflectors, respectively a reflector 112 and a reflector 113, both located in the beam propagation between the lens group 111 and the processing assembly 103 on the path.

It can be seen from FIG. 6 that, on the basis of FIG. 5 , a mirror 113 is added. After the mirror 113 is added, the angle at which the laser beam enters the processing assembly 103 can be adjusted. Meanwhile, in other embodiments, the reflecting mirror can also be located between the light source assembly 101 and the lens group 111, or between the lens group 111 and the processing assembly 103, or both between the light source assembly 101 and the lens group 111 and the lens A reflection mirror is added between the group 111 and the processing assembly 103, so that the space occupied by the whole device is smaller by adding the mirror, and the size of the whole device is reduced.

It should be noted that the number of reflecting mirrors may be determined according to actual conditions, which are not listed here in this embodiment.

In the technical solution of this embodiment, the light source component 101 emits a laser beam through the mutual cooperation of various components, and the laser beam passes through the beam shaping component 102 and the processing component 103 to complete the processing of the printed circuit board 107 to be processed. The problem of high cost and low efficiency in the formation of solder resist ink for industrial electronic circuit boards is solved, and the beneficial effects of high precision, low cost and good effect are achieved.

Fig. 7 is a flow chart of the white ink solder resist pattern processing method provided by the present invention. As shown in Figure 7, this processing method comprises the following steps:

S101, controlling that the white ink solder resist layer of the printed circuit board to be processed is located on the focal plane of the processing component;

S102. Generate a processing path according to a preset solder mask pattern;

Specifically, the required preset solder mask pattern is set in the controller, and the processing path is generated in the controller through the control of the program.

S103. Control the processing components according to the processing path to adjust the incident position of the shaped laser beam on the white ink solder resist layer, and form a preset solder resist pattern on the white ink solder resist layer, and decompose the white color of the corresponding area of the preset solder resist pattern. Ink, complete processing.

Specifically, the controller controls the processing components according to the generated processing path. After receiving the instruction, the processing components adjust the position where the laser beam is incident on the white solder resist layer, and form a pattern preset in the controller on the white ink solder resist layer. Finally, the solder resist layer is subjected to thermal shock through high peak power processing pulses, so that the solder resist layer is peeled off from the substrate, thereby completing the solder resist molding of the printed circuit board.

Exemplarily, if the control processing component forms a rectangular preset solder resist pattern on the white ink solder resist layer on the printed circuit board to be processed, the processing component can be controlled to adjust the outgoing direction of the beam shaping component according to the rectangular preset solder resist pattern, such as First, the shaped laser beam is hit on a vertex of the rectangular preset solder resist pattern, and then dots are made horizontally or vertically along the rectangular boundary, and finally the direction of the shaped laser beam is changed, and then along the other boundaries of the rectangular preset solder resist pattern. Scanning and dotting, so that the area surrounded by the rectangular preset solder mask pattern is separated from the entire white ink solder mask layer, and finally the area surrounded by the rectangular preset solder mask pattern is scanned and dotted by controlling the direction of the reshaping laser beam. It breaks down.

It can be understood that the coordinates of a certain point on the preset solder resist pattern and the corresponding processing path can be set in advance in the controller, and the coordinates are consistent with the coordinates of a certain point on the white ink solder resist layer that needs to form the preset solder resist pattern , so that the shaped laser beam takes the coordinates of the point of the preset solder resist pattern as the starting point, so as to control the shaped laser beam to dot the white ink solder resist layer according to the corresponding processing path of the preset solder resist pattern.

In this embodiment, as shown in FIG. 7, the processing assembly includes an image acquisition unit and a displacement stage, and before controlling the white ink solder resist layer of the printed circuit board to be processed to be located at the focal plane of the processing assembly, it also includes:

S104, acquiring the image of the printed circuit board to be processed;

Specifically, after the image acquisition unit acquires the image of the printed circuit board to be processed, the image is sent to the controller.

S105. Dividing the area of the printed circuit board to be processed according to the image of the printed circuit board to be processed;

Wherein, the image of the printed circuit board to be processed with a preset solder mask pattern can be pre-stored in the controller. After the controller receives the image of the printed circuit board to be processed collected by the image acquisition unit, it can compare the pre-stored image of the printed circuit board to be processed with a preset solder resist pattern to divide the area of the printed circuit board to be processed. For example, Divide a plurality of processing areas (for example, in the form of a checkerboard area), and divide the processed area and the unfinished area according to the image of the printed circuit board to be processed during the processing.

S106. Control the displacement stage to move, and control an unprocessed area in the printed circuit board to be processed to be within the processing range of the processing component.

Exemplarily, if in the divided processing area, there is only one preset solder resist pattern (rectangular), and all of them are within the processing range of the field mirror, at this time, the image collected by the image acquisition unit is that the edges of the rectangle have all been dotted, However, if the processing is not completed inside the enclosed area, the controller will send an instruction to order the translation stage to continue to remain still, and wait for the complete processing in the rectangular area before performing the corresponding displacement operation, which can be regarded as the processing of the processing area; if If there are multiple preset solder mask patterns within the processing range of the field lens in the divided processing area, after the current preset solder mask pattern is processed, the translation stage will continue to remain still and wait for all the preset solder mask patterns within the processing range to be processed. After the graphics are all processed, and then the moving stage is moved, it can be considered that the processing area has been processed.

If there is an incomplete preset solder resist pattern in the divided processing area, that is, the processing range of the field lens cannot accommodate a preset solder resist pattern, that is, the image collected by the image acquisition unit shows that the shaped laser beam cannot complete the entire preset solder resist pattern. For the processing of welding graphics, it still depends on the completion of processing in this processing area, and then moves to the next unprocessed area.

In another embodiment, the processing area may only be the area with a preset solder resist pattern as the processing area, and the processing of this area is considered to be completed after the processing of a preset solder resist pattern is completed.

Exemplarily, if the processing range of the field lens cannot accommodate a preset solder resist pattern, the controller will issue an instruction to control the displacement stage to perform a displacement operation, so that the shaped laser beam can be processed to all areas of the pattern, and when the image is collected The image collected by the unit is the preset solder mask pattern that has been processed, and the controller will issue an instruction to control the displacement table to transfer the next printed circuit board to be processed to the processing position, that is, to move to the next preset solder mask Graphics are processed. If the processing range of the field lens can accommodate the next preset solder mask pattern, the processing of the preset solder mask pattern is deemed to be completed. And move the stage to the next unprocessed solder mask pattern.

In this embodiment, as shown in FIG. 8, after the processing component finishes processing the unprocessed area, it also includes:

S107. Control the displacement stage to move, and control the next unprocessed area in the printed circuit board to be processed to be within the processing range of the processing component;

S108, the step of executing the white ink solder mask pattern processing method;

S109, repeating the above steps in sequence until all unprocessed areas are processed.

That is to say, the movement of the stage is controlled so that the divided unprocessed area is located within the processing range of the processed component, wherein the divided area may be a checkerboard area, or an area where a solder mask pattern is located. When the processing of this area is completed, control the displacement stage to move the next unprocessed area within the processing range of the processing component. Then process the decoration ink solder resist layer through the corresponding processing path to form a solder resist pattern until all unprocessed areas are processed, and the processing of the printed circuit board to be processed is completed.

In the above embodiment, generating the processing path according to the preset solder resist pattern includes: generating the outer contour processing path according to the preset pattern, and generating a decomposed scanning path according to the outer contour processing path, or generating serpentine processing according to the preset solder resist pattern path.

That is to say, as shown in Figure 9, the outer contour of the figure can be processed first, so that the area surrounded by the processed figure is separated from the ink layer, and then the area surrounded by the outer contour is decomposed, such as horizontal zigzag scanning or vertical zigzag scanning , or zigzag scanning, etc. Alternatively, the area surrounded by the processed graphics can be decomposed directly by horizontal zigzag scanning, vertical zigzag scanning, or snake zigzag scanning, to finally form the outline of the processing graphics. Optionally, as shown in FIG. 9 , when the printed circuit board to be processed is circular, it can be processed according to the path shown in FIG. 9 .

In one embodiment, as shown in FIG. 10 , after the printed circuit board to be processed is divided into checkerboard areas, each processing area can be processed by moving the displacement stage through the path as shown in FIG. 10 .

To sum up, according to the white ink solder mask pattern processing equipment and method proposed in the embodiments of the present invention, the equipment includes: a light source assembly for emitting a laser beam, and the wavelength range of the laser beam is 1030±5nm to 1070n±5nm or 515±5nm to 532±5nm, the repetition frequency is greater than or equal to 1000KHz, the single pulse energy is greater than 10uJ, and the pulse width range is 0.5-20ns; the beam shaping component is located on the propagation path of the laser beam and is used to shape the laser beam to form Shaping laser beam; the processing component is located on the transmission path of the shaping laser beam, used to adjust the direction of the shaping laser beam, and emit the shaping laser beam to the white ink solder resist layer on the printed circuit board to be processed, so that the white ink solder resist The preset solder mask pattern is formed on the layer, and the white ink in the corresponding area of the preset solder mask pattern is decomposed, which solves the problem of high cost and low efficiency in the formation of industrial electronic circuit board solder mask ink, and achieves high precision, low cost and good effect. beneficial effect.

It should be understood that steps may be reordered, added or deleted using the various forms of flow shown above. For example, each step described in the present invention may be executed in parallel, sequentially, or in a different order, as long as the desired result of the technical solution of the present invention can be achieved, there is no limitation herein.

The above specific implementation methods do not constitute a limitation to the protection scope of the present invention. It should be apparent to those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made depending on design requirements and other factors. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A white ink resist pattern processing apparatus, comprising:

the light source component is used for emitting laser beams, the wavelength range of the laser beams is 1030 +/-5 nm to 1070n +/-5 nm or 515 +/-5 nm to 532 +/-5 nm, the repetition frequency is greater than or equal to 1000KHz, the single pulse energy is greater than 10uJ, and the pulse width range is 0.5-20ns;

the beam shaping component is positioned on a propagation path of the laser beam and is used for shaping the laser beam to form a shaped laser beam;

and the processing component is positioned on a transmission path of the shaped laser beam and used for adjusting the direction of the shaped laser beam and emitting the shaped laser beam to a white ink solder mask on the printed circuit board to be processed so as to form a preset solder mask pattern on the white ink solder mask and decompose the white ink in a region corresponding to the preset solder mask pattern.

2. The white ink solder resist pattern processing apparatus of claim 1, wherein the processing components include a field lens, a controller, and at least one galvanometer;

the field lens is positioned at one side of the vibrating lens close to the printed circuit board to be processed;

the controller is connected with the vibrating mirror and used for adjusting the angle of the vibrating mirror based on a preset solder resist pattern so as to adjust the position of the shaped laser beam incident to the white ink solder resist layer.

3. The white ink solder resist pattern processing apparatus according to claim 1, wherein the processing components include a field lens, a controller, and at least one rotating prism;

the field lens is positioned on one side of the rotating prism, which is close to the printed circuit board to be processed;

the controller is connected with the rotary prism and used for adjusting the rotation angle of the rotary prism based on a preset solder resist pattern so as to adjust the position of the shaped laser beam incident to the white ink solder resist layer.

4. The white ink solder resist pattern processing apparatus according to claim 2 or 3, wherein the processing component further includes an image acquisition unit and a displacement stage, each connected to the controller;

the image acquisition unit is used for acquiring images of the printed circuit board to be processed, the displacement table is used for bearing the printed circuit board to be processed, and the controller is used for controlling the displacement of the displacement table based on the images of the printed circuit board to be processed.

5. The white ink solder resist pattern processing apparatus of claim 1, wherein the beam shaping assembly includes a lens assembly in a propagation path of the beam between the light source assembly and the processing assembly for collimating and focusing the laser beam.

6. A white ink solder mask pattern processing apparatus according to claim 4, wherein the beam shaping assembly further comprises a set of mirrors, including at least one mirror, located in a beam propagation path between the light source assembly and the lens assembly, and/or located in a beam propagation path between the lens assembly and the processing assembly.

7. A white ink resist pattern processing method realized based on the white ink resist pattern processing apparatus according to any one of claims 1 to 6, the processing method comprising the steps of:

controlling a white ink solder mask layer of the printed circuit board to be processed to be positioned on a focal plane of the processing assembly;

generating a processing path according to a preset solder mask graph;

and controlling the processing assembly to adjust the position of the shaped laser beam incident on the white ink solder mask layer according to the processing path, forming a preset solder mask pattern on the white ink solder mask layer, decomposing the white ink in a region corresponding to the preset solder mask pattern, and finishing processing.

8. The white ink solder resist pattern processing method according to claim 7, wherein the processing assembly includes an image pickup unit and a displacement stage, and before controlling the white ink solder resist layer of the printed wiring board to be processed to be located on the focal plane of the processing assembly, further includes:

acquiring an image of the printed circuit board to be processed;

dividing the printed circuit board to be processed into areas according to the image of the printed circuit board to be processed;

and controlling the displacement table to move, and controlling an unprocessed area in the printed circuit board to be processed to be positioned in the processing range of the processing assembly.

9. The white ink solder resist pattern processing method according to claim 8, further comprising, after the processing of the unprocessed region by the processing component is completed:

controlling the displacement table to move, and controlling the next unprocessed area in the printed circuit board to be processed to be positioned in the processing range of the processing assembly;

a step of performing the machining method according to claim 7;

and sequentially circulating the steps until all the unprocessed areas are processed.

10. The white ink solder resist pattern processing method according to claim 7, wherein generating the processing path according to the preset solder resist pattern includes:

generating an outer contour machining path according to the preset solder resist pattern, and generating a decomposition scanning path according to the outer contour machining path;

or generating a snake-shaped processing path according to the preset solder mask graph.

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