CN115395638B - High formwork gateway hybrid power supply system and method - Google Patents
High formwork gateway hybrid power supply system and method Download PDFInfo
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- CN115395638B CN115395638B CN202211065880.1A CN202211065880A CN115395638B CN 115395638 B CN115395638 B CN 115395638B CN 202211065880 A CN202211065880 A CN 202211065880A CN 115395638 B CN115395638 B CN 115395638B
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- 238000009415 formwork Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 18
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 24
- 239000003990 capacitor Substances 0.000 claims description 48
- 230000009977 dual effect Effects 0.000 claims description 9
- 230000000087 stabilizing effect Effects 0.000 claims description 9
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000012544 monitoring process Methods 0.000 abstract description 5
- 238000004590 computer program Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
- H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
- H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
- H02J9/068—Electronic means for switching from one power supply to another power supply, e.g. to avoid parallel connection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J1/00—Circuit arrangements for DC mains or DC distribution networks
- H02J1/001—Hot plugging or unplugging of load or power modules to or from power distribution networks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J1/00—Circuit arrangements for DC mains or DC distribution networks
- H02J1/08—Three-wire systems; Systems having more than three wires
- H02J1/084—Three-wire systems; Systems having more than three wires for selectively connecting the load or loads to one or several among a plurality of power lines or power sources
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J1/00—Circuit arrangements for DC mains or DC distribution networks
- H02J1/10—Parallel operation of DC sources
- H02J1/109—Scheduling or re-scheduling the operation of the DC sources in a particular order, e.g. connecting or disconnecting the sources in sequential, alternating or in subsets, to meet a given demand
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
- H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
- H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
- H02J9/061—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems for DC powered loads
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2207/00—Indexing scheme relating to details of circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J2207/20—Charging or discharging characterised by the power electronics converter
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y04—INFORMATION OR COMMUNICATION TECHNOLOGIES HAVING AN IMPACT ON OTHER TECHNOLOGY AREAS
- Y04S—SYSTEMS INTEGRATING TECHNOLOGIES RELATED TO POWER NETWORK OPERATION, COMMUNICATION OR INFORMATION TECHNOLOGIES FOR IMPROVING THE ELECTRICAL POWER GENERATION, TRANSMISSION, DISTRIBUTION, MANAGEMENT OR USAGE, i.e. SMART GRIDS
- Y04S20/00—Management or operation of end-user stationary applications or the last stages of power distribution; Controlling, monitoring or operating thereof
- Y04S20/20—End-user application control systems
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Direct Current Feeding And Distribution (AREA)
Abstract
The invention relates to a novel high formwork gateway hybrid power supply system and a method, which are characterized in that an external input VCC-DC wide voltage is divided into two paths for voltage conversion, one path is converted into 4V voltage for power output through a DC-DC power module, the other path is converted into 5V voltage for controlling the switch selection of an MOS tube in a power management ic chip Q2 through a DC-5V power module, and the MOS tube is reversely used at the position, so that the current flow direction of the MOS tube is from a D pole to an S pole. Finally, when the external input VCC-DC wide voltage is not accessed, the power management ic chip outputs through the lithium battery, when the external input VCC-DC wide voltage is accessed, the power management ic chip outputs through the DC-DC power module, so that the hot plug of a DC power supply and the hot plug of the lithium battery can be supported, in addition, the diodes D10 and D11 can assist the starting voltage of the VCC-MIX network of the Q2, and the circuit stability is improved. The invention can perfectly adapt to the operation environment of the high formwork and can stably supply power to the high formwork monitoring circuit.
Description
Technical Field
The invention relates to the technical field of high formwork power supply, in particular to a high formwork gateway hybrid power supply system and method.
Background
The high formwork is formwork operation when the formwork height is greater than or equal to 8 m. Because of the specificity and complexity of the working environment, the high formwork monitoring circuit needs to be monitored, and the high formwork monitoring circuit is difficult to supply power in the field environment, particularly DC power is difficult to stabilize at a required voltage value, so that technical barriers are brought to high formwork operation, and how to provide a stable hybrid power supply system suitable for the high formwork operation is a problem which needs to be solved in the market at present.
Disclosure of Invention
In order to solve at least one of the defects existing in the prior art, the invention aims to provide a high-formwork gateway hybrid power supply system and a method.
The invention solves the problems by adopting the following technical scheme: a high formwork gateway hybrid power supply system and method includes:
the DC-5V power supply module comprises a DC-5V power supply sub-circuit established based on a voltage stabilizing chip, wherein the input end of the DC-5V power supply sub-circuit is connected with an external input VCC-DC wide voltage (generally 8-24V wide voltage), and the output end of the DC-5V power supply sub-circuit outputs a 5V power supply;
the DC-DC power supply module comprises a DC-DC power supply sub-circuit established based on a voltage stabilizing constant current chip, wherein the input end of the DC-DC power supply sub-circuit is connected with an external input VCC-DC wide voltage, and the output end of the DC-DC power supply sub-circuit outputs a stable 4V power supply;
the dual power supply switching module comprises a dual power supply switching sub-circuit built based on a power supply management ic chip, wherein the input end of the dual power supply switching sub-circuit is respectively connected with the output end of the DC-5V power supply module, the output end of the DC-DC power supply module and the lithium battery, and is used for outputting through the lithium battery when the external input VCC-DC wide voltage is not accessed, and outputting through the DC-DC power supply module when the external input VCC-DC wide voltage is accessed.
Further, specifically, the voltage stabilizing chip adopted by the DC-5V power supply sub-circuit is a 78L05 chip,
the VIN pin of the 78L05 chip is respectively connected with VCC-DC and one end of a capacitor C8, the other end of the capacitor C8 is respectively connected with the GND pin of the 78L05 chip, one end of a capacitor C9, one end of a resistor R9 and the ground, and the other end of the capacitor C9 and the other end of the resistor R9 are connected with the VOUT pin of the 78L05 chip.
Further, specifically, the voltage-stabilizing constant-current chip adopted by the DC-DC power supply sub-circuit is an LM2596-ADJ chip,
the diode comprises an LM2596-ADJ chip, wherein a VIN pin of the LM2596-ADJ chip is respectively connected with a cathode of the diode D1, an anode of the capacitor C1 and one end of the capacitor C3, the cathode of the diode D1 is connected with VCC-DC, the other ends of the capacitor C1 and the capacitor C3 are jointly connected with an EN pin, a GND pin, an anode of the diode D2, a cathode of the capacitor C5, one end of a cathode capacitor C7 of the capacitor C6 and the ground, the cathode of the diode D2 is respectively connected with an OUT pin of the LM2596-ADJ chip and one end of an inductor L1, the other end of the inductor L1 is respectively connected with one end of a resistor R4, the anode of the capacitor C5, the anode of the capacitor C6, the other end of the capacitor C7 and one end of the capacitor C4, the other end of the resistor R4 and the other end of the capacitor C4 are respectively connected with one end of the FB pin of the LM2596-ADJ chip and one end of the resistor R5, and the other end of the resistor R5 is grounded.
Further, in particular, the dual power switching sub-circuit includes,
the D1 pin of the power management ic chip Q2 is connected with the output end of the DC-DC power module, the D2 pin of the power management ic chip Q2 is connected with the lithium battery, the S2 pin of the power management ic chip Q2 is connected with the VCC-MIX network, the G2 pin of the power management ic chip Q2 is connected with the output end of the DC-5V power module, the S1 pin of the power management ic chip Q2 is connected with the VCC-MIX network, and the G1 pin of the power management ic chip Q2 is connected with the EN pin of the LM2596-ADJ chip;
a diode D10 is arranged between the output end of the DC-DC power supply module and VCC-MIX, the positive electrode of the diode D10 is connected with the output end of the DC-DC power supply module, the negative electrode of the diode D10 is connected with VCC-MIX, a diode D11 is arranged between the lithium battery and VCC-MIX, the positive electrode of the diode D11 is connected with the lithium battery, and the negative electrode of the diode D11 is connected with VCC-MIX;
the output end of the DC-5V power supply module is connected with one end of a resistor R7, the other end of the resistor R7 is respectively connected with one end of a resistor R8 and a base electrode of a triode Q3, a collector electrode of the triode Q3 is respectively connected with one end of the EN pin and one end of a resistor R6, the other end of the resistor R6 is connected with VCC-MIX, and an emitter electrode of the triode Q3 is respectively connected with the other end of the resistor R8 and the ground.
Further, specifically, the power management ic chip Q2 employs an IRF7314 chip.
The invention also provides a high formwork gateway hybrid power supply method which is applied to the high formwork gateway hybrid power supply system and comprises,
when the external input VCC-DC wide voltage is not accessed, namely the VCC-DC is 0V, the power supply flow of the circuit is as follows:
110, outputting VCC-4V at the moment of the DC-DC power supply sub-circuit to be in a 0V step;
step 120, the VCC-BAT is connected with a lithium battery, so that a voltage with a first value exists;
step 130, because of the diode D11, the voltage VCC-MIX is present, because of the voltage drop of D11, assuming that the voltage drop is a second value, the voltage VCC-MIX should be a third value, which is obtained by subtracting the second value from the first value;
step 140, since the DC-5V power sub-circuit presents a step of pulling down to 0V when the external input is not connected, in combination with step 130, the S2 and G2 poles of Q2 generate a voltage difference;
step 150, because of the existence of the voltage difference, D2 and S2 of Q2 are in a conducting state, at this time, the current is not passed through the diode any more, but is directly transferred through the MOS transistor inside the chip IRF7314, and the current flows from the D pole to the S pole of the MOS transistor;
when the external input VCC-DC wide voltage is pressed, the power supply flow of the circuit is as follows:
step 210, the DC-5V power supply sub-circuit presents an output voltage DC-5V, which is used to control the voltage of the level;
step 220, the output voltage VCC-4V exists in the DC-DC power supply sub-circuit and is used for outputting main power supply power;
step 230, when DC-5V is equal to 5V, the voltage difference between S2 and G2 of the chip Q2 is approximately equal to zero, and D2 and S2 are in a non-conductive state; because Q3 is in a saturated state, the collector and the emitter of Q3 are mutually communicated, and VCC-4V-EN is considered to be pulled down to 0V at the moment;
step 240, when VCC-4V-EN is pulled down to 0V, diode D10 is in on state; since the start-up speed of the DC-5V power supply sub-circuit is higher than that of the DC-DC power supply sub-circuit, VCC-4V does not actually supply VCC-MIX at this time, and the VCC-MIX is supplied by VCC-BAT at this time;
step 250, after the start of the DC-DC power sub-circuit is completed, the D1 and S1 of the chip Q2 are in a conductive state due to the potential difference between the S1 and G1 of the chip Q2, and at this time, the system power supply is completely switched to VCC-4V power for output.
Further, in particular, the workflow of the DC-DC power supply sub-circuit comprises,
the wide voltage of VCC-DC is input, the voltage is isolated and input through a diode D1 and then enters a chip LM2596-ADJ through a pin VIN, the chip LM2596-ADJ outputs rectangular waves at a pin VOUT, the rectangular waves are converted into direct current of constant voltage through an AC-DC circuit consisting of L1, C5, C6 and D2, the voltage at the output pin VOUT is judged to be 4V through the voltage at a feedback pin FB by the chip LM2596-ADJ, when the chip judges that the output voltage is lower than 4V, the duty ratio of the output rectangular waves is increased, otherwise, the duty ratio of the rectangular waves is reduced to achieve the aim of reducing the voltage, the process is repeated for a plurality of times, and finally the voltage at the pin VOUT is stabilized at 4V.
The invention has the beneficial effects that: the utility model provides a high formwork gateway hybrid power supply system and method, the wide voltage of external input VCC-DC divides two ways to carry out voltage conversion, and one way is through DC-DC power module conversion to 4V voltage for carrying out power output, and another way is through DC-5V power module conversion to 5V voltage and is used for controlling the switching selection of the inside MOS pipe of power management ic chip Q2, uses the MOS pipe in reverse here, makes the electric current flow direction of MOS pipe follow the D utmost point to the S utmost point. Finally, when the external input VCC-DC wide voltage is not accessed, the power management ic chip outputs through the lithium battery, when the external input VCC-DC wide voltage is accessed, the power management ic chip outputs through the DC-DC power module, so that the hot plug of a DC power supply and the hot plug of the lithium battery can be supported, in addition, the diodes D10 and D11 can assist the starting voltage of the VCC-MIX network of the Q2, and the circuit stability is improved. The invention can perfectly adapt to the operation environment of the high formwork and can stably supply power to the high formwork monitoring circuit.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings described are only some embodiments of the invention, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
FIG. 1 is a schematic diagram of a DC-5V power supply sub-circuit of a high formwork gateway hybrid power supply system of the present invention;
FIG. 2 is a schematic diagram of a DC-DC power sub-circuit of a high formwork gateway hybrid power supply system according to the present invention;
fig. 3 is a schematic structural diagram of a dual-power switching sub-circuit of the high-formwork gateway hybrid power supply system of the present invention.
Detailed Description
The conception, specific structure, and technical effects produced by the present invention will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, features, and effects of the present invention. It is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present invention based on the embodiments of the present invention. In addition, all connection relationships mentioned herein are not directly connected by single finger elements, but rather, a preferred circuit structure may be formed by adding or subtracting connection elements depending on the specific implementation. The technical features in the invention can be interactively combined on the premise of no contradiction and conflict.
Embodiment 1, a high formwork gateway hybrid power supply system and method, comprising:
the DC-5V power supply module comprises a DC-5V power supply sub-circuit established based on a voltage stabilizing chip, wherein the input end of the DC-5V power supply sub-circuit is connected with an external input VCC-DC wide voltage (generally 8-24V wide voltage), and the output end of the DC-5V power supply sub-circuit outputs a 5V power supply;
the DC-DC power supply module comprises a DC-DC power supply sub-circuit established based on a voltage stabilizing constant current chip, wherein the input end of the DC-DC power supply sub-circuit is connected with an external input VCC-DC wide voltage, and the output end of the DC-DC power supply sub-circuit outputs a stable 4V power supply;
the dual power supply switching module comprises a dual power supply switching sub-circuit built based on a power supply management ic chip, wherein the input end of the dual power supply switching sub-circuit is respectively connected with the output end of the DC-5V power supply module, the output end of the DC-DC power supply module and the lithium battery, and is used for outputting through the lithium battery when the external input VCC-DC wide voltage is not accessed, and outputting through the DC-DC power supply module when the external input VCC-DC wide voltage is accessed.
In the preferred embodiment, the external input VCC-DC wide voltage is divided into two paths for voltage conversion, one path is converted into 4V voltage for power output through a DC-DC power module, the other path is converted into 5V voltage for controlling the switch selection of an MOS tube in the power management ic chip Q2 through a DC-5V power module, the MOS tube is reversely used at the position, the current flow direction of the MOS tube is from the D pole to the S pole, and in order to ensure that the voltage is as stable as about 4V as possible, the diode is not used for direct rectification because the voltage drop of the diode is larger when the current is large. Finally, when the external input VCC-DC wide voltage is not accessed, the power management ic chip outputs through the lithium battery, when the external input VCC-DC wide voltage is accessed, the power management ic chip outputs through the DC-DC power module, so that the hot plug of a DC power supply and the hot plug of the lithium battery can be supported, in addition, the diodes D10 and D11 can assist the starting voltage of the VCC-MIX network of the Q2, and the circuit stability is improved. The invention can perfectly adapt to the operation environment of the high formwork and can stably supply power to the high formwork monitoring circuit.
Referring to fig. 1, as a preferred embodiment of the present invention, specifically, the voltage stabilizing chip used in the DC-5V power supply sub-circuit is a 78L05 chip,
the VIN pin of the 78L05 chip is respectively connected with VCC-DC and one end of a capacitor C8, the other end of the capacitor C8 is respectively connected with the GND pin of the 78L05 chip, one end of a capacitor C9, one end of a resistor R9 and the ground, and the other end of the capacitor C9 and the other end of the resistor R9 are connected with the VOUT pin of the 78L05 chip.
Referring to fig. 2, as a preferred embodiment of the present invention, specifically, the voltage-stabilizing constant current chip adopted by the DC-DC power supply sub-circuit is an LM2596-ADJ chip,
the diode comprises an LM2596-ADJ chip, wherein a VIN pin of the LM2596-ADJ chip is respectively connected with a cathode of the diode D1, an anode of the capacitor C1 and one end of the capacitor C3, the cathode of the diode D1 is connected with VCC-DC, the other ends of the capacitor C1 and the capacitor C3 are jointly connected with an EN pin, a GND pin, an anode of the diode D2, a cathode of the capacitor C5, one end of a cathode capacitor C7 of the capacitor C6 and the ground, the cathode of the diode D2 is respectively connected with an OUT pin of the LM2596-ADJ chip and one end of an inductor L1, the other end of the inductor L1 is respectively connected with one end of a resistor R4, the anode of the capacitor C5, the anode of the capacitor C6, the other end of the capacitor C7 and one end of the capacitor C4, the other end of the resistor R4 and the other end of the capacitor C4 are respectively connected with one end of the FB pin of the LM2596-ADJ chip and one end of the resistor R5, and the other end of the resistor R5 is grounded.
Referring to fig. 3, as a preferred embodiment of the present invention, in particular, the dual power switching sub-circuit includes,
the D1 pin of the power management ic chip Q2 is connected with the output end of the DC-DC power module, the D2 pin of the power management ic chip Q2 is connected with the lithium battery, the S2 pin of the power management ic chip Q2 is connected with the VCC-MIX network, the G2 pin of the power management ic chip Q2 is connected with the output end of the DC-5V power module, the S1 pin of the power management ic chip Q2 is connected with the VCC-MIX network, and the G1 pin of the power management ic chip Q2 is connected with the EN pin of the LM2596-ADJ chip;
a diode D10 is arranged between the output end of the DC-DC power supply module and VCC-MIX, the positive electrode of the diode D10 is connected with the output end of the DC-DC power supply module, the negative electrode of the diode D10 is connected with VCC-MIX, a diode D11 is arranged between the lithium battery and VCC-MIX, the positive electrode of the diode D11 is connected with the lithium battery, and the negative electrode of the diode D11 is connected with VCC-MIX;
the output end of the DC-5V power supply module is connected with one end of a resistor R7, the other end of the resistor R7 is respectively connected with one end of a resistor R8 and a base electrode of a triode Q3, a collector electrode of the triode Q3 is respectively connected with one end of the EN pin and one end of a resistor R6, the other end of the resistor R6 is connected with VCC-MIX, and an emitter electrode of the triode Q3 is respectively connected with the other end of the resistor R8 and the ground.
As a preferred embodiment of the present invention, specifically, the power management ic chip Q2 employs an IRF7314 chip.
The embodiment 2 also provides a high formwork gateway hybrid power supply method which is applied to the high formwork gateway hybrid power supply system and comprises the following steps of,
when the external input VCC-DC wide voltage is not accessed, namely the VCC-DC is 0V, the power supply flow of the circuit is as follows:
110, outputting VCC-4V at the moment of the DC-DC power supply sub-circuit to be in a 0V step;
step 120, the voltage of the first value, in this embodiment 3.8-4.2V, exists at VCC-BAT due to the connection of the lithium battery;
step 130, the voltage VCC-MIX is present due to the diode D11, and the voltage drop is 3.4V-4V in this embodiment, assuming that the voltage drop is 0.2-0.4V in this embodiment due to the voltage drop of D11, and the voltage VCC-MIX should be a third value obtained by subtracting the second value from the first value;
step 140, since the DC-5V power sub-circuit presents a step of pulling down to 0V when the external input is not connected, in combination with step 130, the S2 and G2 poles of Q2 generate a voltage difference;
step 150, because of the existence of the voltage difference, D2 and S2 of Q2 are in a conducting state, and at this time, the current is not passed through the diode any more, but is directly transmitted through the MOS tube inside the chip IRF 7314;
when the external input VCC-DC wide voltage is pressed, the power supply flow of the circuit is as follows:
step 210, the DC-5V power supply sub-circuit presents an output voltage DC-5V, which is used to control the voltage of the level;
step 220, the output voltage VCC-4V exists in the DC-DC power supply sub-circuit and is used for outputting main power supply power;
step 230, when DC-5V is equal to 5V, the voltage difference between S2 and G2 of the chip Q2 is approximately equal to zero, and D2 and S2 are in a non-conductive state; because Q3 is in a saturated state, the collector and the emitter of Q3 are mutually communicated, and VCC-4V-EN is considered to be pulled down to 0V at the moment;
step 240, when VCC-4V-EN is pulled down to 0V, diode D10 is in on state; since the start-up speed of the DC-5V power supply sub-circuit is higher than that of the DC-DC power supply sub-circuit, VCC-4V does not actually supply VCC-MIX at this time, and the VCC-MIX is supplied by VCC-BAT at this time;
step 250, after the start of the DC-DC power sub-circuit is completed, the D1 and S1 of the chip Q2 are in a conductive state due to the potential difference between the S1 and G1 of the chip Q2, and at this time, the system power supply is completely switched to VCC-4V power for output.
As a preferred embodiment of the present invention, in particular, the workflow of the DC-DC power supply sub-circuit includes,
the wide voltage of VCC-DC is input, the voltage is isolated and input through a diode D1 and then enters a chip LM2596-ADJ through a pin VIN, the chip LM2596-ADJ outputs rectangular waves at a pin VOUT, the rectangular waves are converted into direct current of constant voltage through an AC-DC circuit consisting of L1, C5, C6 and D2, the voltage at the output pin VOUT is judged to be 4V through the voltage at a feedback pin FB by the chip LM2596-ADJ, when the chip judges that the output voltage is lower than 4V, the duty ratio of the output rectangular waves is increased, otherwise, the duty ratio of the rectangular waves is reduced to achieve the aim of reducing the voltage, the process is repeated for a plurality of times, and finally the voltage at the pin VOUT is stabilized at 4V.
The modules described as separate components may or may not be physically separate, and components shown as modules may or may not be physical modules, i.e., may be located in one place, or may be distributed over a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist alone physically, or two or more modules may be integrated into one module. The integrated modules may be implemented in hardware or in software functional modules.
The integrated modules, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on this understanding, the present invention may implement all or part of the flow of the method of the above embodiment, or may be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when the computer program is executed by a processor, the computer program may implement the steps of each of the method embodiments described above. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth.
While the present invention has been described in considerable detail and with particularity with respect to several described embodiments, it is not intended to be limited to any such detail or embodiments or any particular embodiment, but is to be construed as providing broad interpretation of such claims by reference to the appended claims in view of the prior art so as to effectively encompass the intended scope of the invention. Furthermore, the foregoing description of the invention has been presented in its embodiments contemplated by the inventors for the purpose of providing a useful description, and for the purposes of providing a non-essential modification of the invention that may not be presently contemplated, may represent an equivalent modification of the invention.
The present invention is not limited to the above embodiments, but is merely preferred embodiments of the present invention, and the present invention should be construed as being limited to the above embodiments as long as the technical effects of the present invention are achieved by the same means. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the invention.
Claims (2)
1. The utility model provides a high formwork gateway hybrid power supply method which is characterized in that is applied to a high formwork gateway hybrid power supply system, wherein, high formwork gateway hybrid power supply system includes:
the DC-5V power supply module comprises a DC-5V power supply sub-circuit established based on a voltage stabilizing chip, wherein the input end of the DC-5V power supply sub-circuit is connected with an external input VCC-DC wide voltage, and the output end of the DC-5V power supply sub-circuit outputs a 5V power supply;
the DC-DC power supply module comprises a DC-DC power supply sub-circuit established based on a voltage stabilizing constant current chip, wherein the input end of the DC-DC power supply sub-circuit is connected with an external input VCC-DC wide voltage, and the output end of the DC-DC power supply sub-circuit outputs a stable 4V power supply;
the dual-power switching module comprises a dual-power switching sub-circuit established based on a power management ic chip, wherein the input end of the dual-power switching sub-circuit is respectively connected with the output end of the DC-5V power module, the output end of the DC-DC power module and the lithium battery, and is used for outputting through the lithium battery when the external input VCC-DC wide voltage is not accessed and outputting through the DC-DC power module when the external input VCC-DC wide voltage is accessed;
specifically, the voltage stabilizing chip adopted by the DC-5V power supply sub-circuit is a 78L05 chip,
the VIN pin of the 78L05 chip is respectively connected with VCC-DC and one end of a capacitor C8, the other end of the capacitor C8 is respectively connected with the GND pin of the 78L05 chip, one end of a capacitor C9, one end of a resistor R9 and the ground, and the other end of the capacitor C9 and the other end of the resistor R9 are connected with the VOUT pin of the 78L05 chip;
specifically, the voltage-stabilizing constant-current chip adopted by the DC-DC power supply sub-circuit is an LM2596-ADJ chip,
the VIN pin of the LM2596-ADJ chip is respectively connected with the cathode of the diode D1, the anode of the capacitor C1 and one end of the capacitor C3, the anode of the diode D1 is connected with VCC-DC, the cathode of the capacitor C1 and the other end of the capacitor C3 are commonly connected with the EN pin, the GND pin, the anode of the diode D2, the cathode of the capacitor C5, one end of the cathode capacitor C7 of the capacitor C6 and the ground of the LM2596-ADJ chip, the cathode of the diode D2 is respectively connected with the OUT pin of the LM2596-ADJ chip and one end of the inductor L1, the other end of the inductor L1 is respectively connected with one end of the resistor R4, the anode of the capacitor C5, the anode of the capacitor C6, the other end of the capacitor C7 and one end of the capacitor C4, the other end of the resistor R4 and the other end of the capacitor C4 are respectively connected with the FB pin of the LM2596-ADJ chip and one end of the resistor R5, and the other end of the resistor R5 is grounded;
in particular, the dual power switching sub-circuit comprises,
the D1 pin of the power management ic chip Q2 is connected with the output end of the DC-DC power module, the D2 pin of the power management ic chip Q2 is connected with the lithium battery, the S2 pin of the power management ic chip Q2 is connected with the VCC-MIX network, the G2 pin of the power management ic chip Q2 is connected with the output end of the DC-5V power module, the S1 pin of the power management ic chip Q2 is connected with the VCC-MIX network, and the G1 pin of the power management ic chip Q2 is connected with the EN pin of the LM2596-ADJ chip;
a diode D10 is arranged between the output end of the DC-DC power supply module and VCC-MIX, the positive electrode of the diode D10 is connected with the output end of the DC-DC power supply module, the negative electrode of the diode D10 is connected with VCC-MIX, a diode D11 is arranged between the lithium battery and VCC-MIX, the positive electrode of the diode D11 is connected with the lithium battery, and the negative electrode of the diode D11 is connected with VCC-MIX;
the circuit between the output end of the DC-5V power supply module and the EN pin and VCC-MIX is that the output end of the DC-5V power supply module is connected with one end of a resistor R7, the other end of the resistor R7 is respectively connected with one end of a resistor R8 and the base electrode of a triode Q3, the collector electrode of the triode Q3 is respectively connected with the EN pin and one end of a resistor R6, the other end of the resistor R6 is connected with VCC-MIX, and the emitter electrode of the triode Q3 is respectively connected with the other end of the resistor R8 and the ground;
specifically, the power management ic chip Q2 adopts an IRF7314 chip;
the high formwork gateway hybrid power supply method comprises,
when the external input VCC-DC wide voltage is not accessed, namely the VCC-DC is 0V, the power supply flow of the circuit is as follows:
110, outputting VCC-4V at the moment of the DC-DC power supply sub-circuit to be in a 0V step;
step 120, the VCC-BAT is connected with a lithium battery, so that a voltage with a first value exists;
step 130, because of the diode D11, the voltage VCC-MIX is present, because of the voltage drop of D11, assuming that the voltage drop is a second value, the voltage VCC-MIX should be a third value, which is obtained by subtracting the second value from the first value;
step 140, since the DC-5V power sub-circuit presents a step of pulling down to 0V when the external input is not connected, in combination with step 130, the S2 and G2 poles of Q2 generate a voltage difference;
step 150, because of the existence of the voltage difference, D2 and S2 of Q2 are in a conducting state, at this time, the current is not passed through the diode any more, but is directly transferred through the MOS transistor inside the chip IRF7314, and the current flows from the D pole to the S pole of the MOS transistor;
when the external input VCC-DC wide voltage is pressed, the power supply flow of the circuit is as follows:
step 210, the DC-5V power supply sub-circuit presents an output voltage DC-5V, which is used to control the voltage of the level;
step 220, the output voltage VCC-4V exists in the DC-DC power supply sub-circuit and is used for outputting main power supply power;
step 230, when DC-5V is equal to 5V, the voltage difference between S2 and G2 of the chip Q2 is approximately equal to zero, and D2 and S2 are in a non-conductive state; because Q3 is in a saturated state, the collector and the emitter of Q3 are mutually communicated, and VCC-4V-EN is considered to be pulled down to 0V at the moment;
step 240, when VCC-4V-EN is pulled down to 0V, diode D10 is in on state; since the start-up speed of the DC-5V power supply sub-circuit is higher than that of the DC-DC power supply sub-circuit, VCC-4V does not actually supply VCC-MIX at this time, and the VCC-MIX is supplied by VCC-BAT at this time;
step 250, after the start of the DC-DC power sub-circuit is completed, the D1 and S1 of the chip Q2 are in a conductive state due to the potential difference between the S1 and G1 of the chip Q2, and at this time, the system power supply is completely switched to VCC-4V power for output.
2. The method of claim 1, wherein the workflow of the DC-DC power sub-circuit comprises,
the wide voltage of VCC-DC is input, the voltage is isolated and input through a diode D1 and then enters a chip LM2596-ADJ through a pin VIN, the chip LM2596-ADJ outputs rectangular waves at a pin VOUT, the rectangular waves are converted into direct current of constant voltage through an AC-DC circuit consisting of L1, C5, C6 and D2, the voltage at the output pin VOUT is judged to be 4V through the voltage at a feedback pin FB by the chip LM2596-ADJ, when the chip judges that the output voltage is lower than 4V, the duty ratio of the output rectangular waves is increased, otherwise, the duty ratio of the rectangular waves is reduced to achieve the aim of reducing the voltage, the process is repeated for a plurality of times, and finally the voltage at the pin VOUT is stabilized at 4V.
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