CN115371731B - Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device - Google Patents
Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device Download PDFInfo
- Publication number
- CN115371731B CN115371731B CN202210987947.0A CN202210987947A CN115371731B CN 115371731 B CN115371731 B CN 115371731B CN 202210987947 A CN202210987947 A CN 202210987947A CN 115371731 B CN115371731 B CN 115371731B
- Authority
- CN
- China
- Prior art keywords
- calibration
- signals
- signal
- parameter sensor
- parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
- G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
本发明属于传感器领域，公开了一种多参数传感器、多参数传感器信号解耦方法及解耦装置，包括：获取多参数传感器的电学信号；根据多参数传感器的电学信号，从预设的若干标定信号中，选取与多参数传感器的电学信号最相似的n个标定信号；根据选取的n个标定信号，得到多参数传感器的物理信号。基于查表法的基本原理，首先根据未知工况下的电学信号，选择与未知工况相相似的标定工况，然后依据多种物理信号同时施加时多参数传感器相应地输出唯一一组电学信号的传感特性，以这些最相似的n个标定信号为基础，实现多参数传感器的电学信号的解耦，能够有效提升多参数传感器对复杂物理信号的解耦测量精度，并扩展多参数传感器的工作范围。
The present invention belongs to the field of sensors, and discloses a multi-parameter sensor, a multi-parameter sensor signal decoupling method and a decoupling device, including: obtaining an electrical signal of the multi-parameter sensor; selecting n calibration signals that are most similar to the electrical signal of the multi-parameter sensor from a plurality of preset calibration signals according to the electrical signal of the multi-parameter sensor; obtaining a physical signal of the multi-parameter sensor according to the selected n calibration signals. Based on the basic principle of the table lookup method, firstly, according to the electrical signal under the unknown working condition, a calibration working condition similar to the unknown working condition is selected, and then, according to the sensing characteristics of the multi-parameter sensor outputting a unique set of electrical signals when multiple physical signals are applied simultaneously, the decoupling of the electrical signal of the multi-parameter sensor is realized based on these n most similar calibration signals, which can effectively improve the decoupling measurement accuracy of the multi-parameter sensor for complex physical signals and expand the working range of the multi-parameter sensor.
Description
Technical Field
The invention belongs to the field of sensors, and relates to a multi-parameter sensor, a multi-parameter sensor signal decoupling method and a decoupling device.
Background
At present, a multi-parameter sensor with multiple monitoring functions becomes a research hot spot in the sensing field, which orderly integrates elements with different sensing functions on the same flexible array, converts a stimulus signal into an electrical signal, and realizes real-time identification and measurement of an applied complex physical signal. Therefore, the multi-parameter sensor has great application market and development prospect in the fields of man-machine interaction, health monitoring and intelligent robots.
In practical measurement, the measurement accuracy of a multi-parameter sensor on a complex physical signal is currently the focus of attention. When different physical signals are applied to the multi-parameter sensor at the same time, the different physical signals are in fact in a coupled state, and the signals in the coupled state tend to cause signal drift in the electrical signals of the multi-parameter sensor. In principle, the signal drift occurs because the sensing element of the multiparameter sensor receives the interfering stimulus of the other signals in the coupled stimulus. For example, the stresses acting on the multiparameter sensor by the external environment may have a non-negligible effect on the measurement signal of the resistive temperature sensor. The signal drift caused by the coupling stimulus often affects the decoupling measurement precision and the working range of the multi-parameter sensor on complex signals. Therefore, how to process signal interference and maintain the accuracy of decoupling stimulus in the coupling state of a plurality of different physical signals is a problem to be solved at present.
Disclosure of Invention
The present invention is directed to overcoming the drawbacks of the prior art and providing a multi-parameter sensor, a multi-parameter sensor signal decoupling method and a decoupling device.
In order to achieve the purpose, the invention is realized by adopting the following technical scheme:
In a first aspect of the present invention, a method for decoupling a signal of a multi-parameter sensor is provided, including:
Acquiring an electrical signal of a multi-parameter sensor; according to the electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals; wherein n is a preset constant; and obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals.
Optionally, the selecting, according to the electrical signal of the multi-parameter sensor, n calibration signals most similar to the electrical signal of the multi-parameter sensor from the preset calibration signals includes: acquiring calibration electrical signals of all calibration signals; acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal; according to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal, selecting n calibration signals according to the sequence from small to large of the distance, and obtaining n calibration signals which are most similar to the electrical signal of the multi-parameter sensor.
Optionally, the acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal includes: the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal is obtained by:
Wherein d i is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the ith calibration signal, alpha t is the adjustment coefficient of the t parameter in the electrical signal of the multi-parameter sensor, Is the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor; the non-dimensional value of the T parameter in the calibration electrical signal of the i calibration signal is obtained, and T is the total number of parameters.
Optionally, the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor is obtained by the following formula:
Wherein, R tx is the t parameter in the electrical signal of the multi-parameter sensor, R tmin is the minimum value of the t parameter in the calibration electrical signal of each calibration signal, and R tmax is the maximum value of the t parameter in the calibration electrical signal of each calibration signal.
The dimensionless value of the t parameter in the calibrated electrical signal of the i-th calibrated signal is obtained by the following formula:
Wherein R ti is the t parameter in the calibration electrical signal of the i calibration signal.
Optionally, the obtaining the physical signal of the multi-parameter sensor according to the selected n calibration signals includes: and acquiring the calibration physical signals of the n selected calibration signals, and carrying out interpolation processing on the calibration physical signals of the n calibration signals to obtain the physical signals of the multi-parameter sensor.
Optionally, the interpolating the calibration physical signals of the n calibration signals includes: interpolation processing is carried out on the calibration physical signals of the n calibration signals through the following steps:
Wherein, T tx is the T parameter in the physical signal of the multi-parameter sensor, d f is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the f calibration signal, and T ti is the T parameter in the calibration physical signal of the i calibration signal.
Optionally, the method further comprises: acquiring a verification physical signal and a verification electrical signal of the multi-parameter sensor; according to the verification electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the verification electrical signals of the multi-parameter sensor from a plurality of preset calibration signals, and obtaining physical signals corresponding to the verification electrical signals of the multi-parameter sensor according to the n selected calibration signals; when the error between the physical signals of the multi-parameter sensor and the physical signals corresponding to the electrical signals of the multi-parameter sensor is larger than the error threshold, generating a new calibration signal according to the physical signals of the multi-parameter sensor and the electrical signals of the multi-parameter sensor, and supplementing the new calibration signal to a plurality of preset calibration signals.
In a second aspect of the present invention, there is provided a multi-parameter sensor signal decoupling apparatus comprising:
The acquisition module is used for acquiring the electrical signals of the multi-parameter sensor; the selecting module is used for selecting n calibration signals which are most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals according to the electrical signals of the multi-parameter sensor; wherein n is a preset constant; and the decoupling module is used for obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals.
Optionally, the selecting module is specifically configured to: acquiring calibration electrical signals of all calibration signals; acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal; according to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal, selecting n calibration signals according to the sequence from small to large of the distance, and obtaining n calibration signals which are most similar to the electrical signal of the multi-parameter sensor.
Optionally, the decoupling module is specifically configured to: and acquiring the calibration physical signals of the n selected calibration signals, and carrying out interpolation processing on the calibration physical signals of the n calibration signals to obtain the physical signals of the multi-parameter sensor.
In a third aspect of the present invention, a multiparameter sensor is provided, comprising a flexible substrate and the multiparameter sensor signal decoupling device described above; the flexible substrate is provided with a temperature sensing unit, a deformation sensing unit and a pressure sensing unit in a partitioning mode; the multi-parameter sensor signal decoupling device is connected with the temperature sensing unit, the deformation sensing unit and the pressure sensing unit, and the temperature sensing unit, the deformation sensing unit and the pressure sensing unit are all used for generating an electrical signal under the triggering of an external physical signal and transmitting the electrical signal to the multi-parameter sensor signal decoupling device.
Compared with the prior art, the invention has the following beneficial effects:
The invention relates to a signal decoupling method of a multi-parameter sensor, which is based on the basic principle of a table look-up method, firstly, according to an electrical signal under an unknown working condition, a calibration working condition similar to the unknown working condition is selected, namely, through presetting a plurality of calibration signals, then based on the electrical signal of the multi-parameter sensor, n calibration signals which are most similar to the electrical signal of the multi-parameter sensor are selected from the preset plurality of calibration signals, then, according to the sensing characteristics of a unique set of electrical signals correspondingly output by the multi-parameter sensor when a plurality of physical signals are applied simultaneously, the decoupling of the electrical signals of the multi-parameter sensor is realized on the basis of the n most similar calibration signals, the electrical signals are converted into corresponding physical signals, the decoupling measurement of a plurality of complex physical signals is realized, the decoupling measurement precision of the multi-parameter sensor to the complex physical signals can be effectively improved, and the working range of the multi-parameter sensor is expanded.
Drawings
Fig. 1 is a flowchart of a multi-parameter sensor signal decoupling method according to an embodiment of the present invention.
Fig. 2 is a block diagram of a multi-parameter sensor signal decoupling device according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a multi-parameter sensor according to an embodiment of the invention.
Wherein: 1-a temperature sensing unit; 2-a deformation sensing unit; 3-a pressure sensing unit; 4-flexible substrate.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "comprises" and "comprising," along with any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus. Furthermore, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As described in the background, when different physical signals are applied to the multiparameter sensor at the same time, the different physical signals are in fact in a coupled state, and the signals in such a coupled state tend to cause signal drift in the electrical signals of the multiparameter sensor. In principle, the signal drift occurs because the sensing element of the multiparameter sensor receives the interfering stimulus of the other signals in the coupled stimulus. The signal drift caused by the coupling stimulus often affects the decoupling measurement precision and the working range of the multi-parameter sensor on complex signals. Therefore, how to process signal interference and maintain the accuracy of decoupling stimulus in the coupling state of a plurality of different physical signals is a problem to be solved at present.
In order to improve the above problems, an embodiment of the present invention provides a method for decoupling signals of a multi-parameter sensor, including obtaining electrical signals of the multi-parameter sensor; according to the electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals; and obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals. Based on the basic principle of a table look-up method, firstly, according to the electrical signals under the unknown working conditions, the calibration working conditions similar to the unknown working conditions are selected, then, according to the sensing characteristics of a unique set of electrical signals correspondingly output by the multi-parameter sensor when a plurality of physical signals are applied simultaneously, the decoupling of the electrical signals of the multi-parameter sensor is realized on the basis of the n most similar calibration signals, the decoupling measurement precision of the multi-parameter sensor to complex physical signals can be effectively improved, and the working range of the multi-parameter sensor is expanded. The invention is described in further detail below with reference to the attached drawing figures:
referring to fig. 1, in an embodiment of the present invention, a method for decoupling signals of a multi-parameter sensor is provided, which can solve measurement interference caused by coupled signals and improve accuracy of decoupling measurement of the multi-parameter sensor.
Specifically, the multi-parameter sensor signal decoupling method comprises the following steps:
s1: an electrical signal of the multi-parameter sensor is acquired.
S2: according to the electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals; wherein n is a preset constant.
S3: and obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals.
The electrical signal of the multi-parameter sensor refers to an output signal of each sensing element in the multi-parameter sensor, such as a resistance signal of a resistance type temperature sensing element, a capacitance signal of a capacitance type deformation sensing element, a resistance signal of the resistance type deformation sensing element, and the like. The physical signals of the multi-parameter sensor refer to external working condition signals such as temperature signals, deformation signals, pressure signals and the like applied to each sensing element in the multi-parameter sensor.
Specifically, the calibration signal is obtained by applying a determined physical signal to the multi-parameter sensor, obtaining an electrical signal of the multi-parameter sensor, taking the determined physical signal as a calibration physical signal, taking the obtained electrical signal of the multi-parameter sensor as a calibration electrical signal, and combining the calibration physical signal and the calibration electrical signal.
In summary, the signal decoupling method of the multi-parameter sensor of the invention is based on the basic principle of a table look-up method, firstly, according to the electrical signals under unknown working conditions, a calibration working condition similar to the unknown working conditions is selected, namely, through presetting a plurality of calibration signals, then based on the electrical signals of the multi-parameter sensor, n calibration signals which are most similar to the electrical signals of the multi-parameter sensor are selected from the preset plurality of calibration signals, then, according to the sensing characteristics of a single group of electrical signals correspondingly output by the multi-parameter sensor when a plurality of physical signals are applied simultaneously, based on the n calibration signals which are most similar, the decoupling of the electrical signals of the multi-parameter sensor is realized, the electrical signals are converted into corresponding physical signals, the decoupling measurement of a plurality of complex physical signals is realized, the decoupling measurement precision of the multi-parameter sensor to the complex physical signals can be effectively improved, and the working range of the multi-parameter sensor is expanded.
In one possible implementation manner, the selecting, according to the electrical signal of the multi-parameter sensor, the n calibration signals most similar to the electrical signal of the multi-parameter sensor from the preset calibration signals includes: acquiring calibration electrical signals of all calibration signals; acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal; according to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal, selecting n calibration signals according to the sequence from small to large of the distance, and obtaining n calibration signals which are most similar to the electrical signal of the multi-parameter sensor.
In particular, since the calibration signal involves a plurality of variables, in order to avoid the problem that it is difficult to accurately judge in the process of comparing the electrical signal of the multi-parameter sensor with a plurality of calibration signals, the similarity of the electrical signal of the multi-parameter sensor and the calibration electrical signal of the calibration signal can be determined according to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal.
In one possible embodiment, the acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal comprises: the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal is obtained by:
Wherein d i is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the ith calibration signal, alpha t is the adjustment coefficient of the t parameter in the electrical signal of the multi-parameter sensor, Is the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor; the non-dimensional value of the T parameter in the calibration electrical signal of the i calibration signal is obtained, and T is the total number of parameters.
Optionally, the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor is obtained by:
Wherein, R tx is the t parameter in the electrical signal of the multi-parameter sensor, R tmin is the minimum value of the t parameter in the calibration electrical signal of each calibration signal, and R tmax is the maximum value of the t parameter in the calibration electrical signal of each calibration signal.
The dimensionless value of the t parameter in the calibrated electrical signal of the i-th calibrated signal is obtained by the following formula:
Wherein R ti is the t parameter in the calibration electrical signal of the i calibration signal.
Specifically, in this embodiment, the coupling condition of the multi-parameter sensor is that the temperature signal T 1x, the deformation signal T 2x, and the pressure signal T 3x are applied simultaneously, and the sensing element of the multi-parameter sensor adopts a resistive temperature sensing element, a capacitive deformation sensing element, and a resistive deformation sensing element.
When the temperature signal T 1x, the deformation signal T 2x and the pressure signal T 3x are simultaneously applied to the multi-parameter sensor, the electrical signals of the sensing units of the multi-parameter sensor are changed, so as to obtain a group of electrical signals of the multi-parameter sensor, including a resistance signal R 1x of the resistive temperature sensing element, a capacitance signal R 2x of the capacitive deformation sensing element and a resistance signal R 3x of the resistive deformation sensing element.
It is noted that, in order to further improve the accuracy of the decoupling, the calibration electrical signal of the calibration signal and the electrical signal of the multi-parameter sensor are dimensionless:
firstly, realizing dimensionless calibration of the calibration electrical signal of the calibration signal through the following steps:
Wherein R 1i、R2i and R 3i are the resistance signal of the resistance type temperature sensing element, the capacitance signal of the capacitance type deformation sensing element and the resistance signal of the resistance type deformation sensing element of the calibration electrical signal of the ith calibration signal respectively, AndThe non-dimensionalized signals of R 1i、R2i and R 3i are respectively, R 1max and R 1min are respectively the maximum value and the minimum value of the resistance signal of the resistance type temperature sensing element in the calibration electrical signals of the calibration signals, R 2max and R 2min are respectively the maximum value and the minimum value of the capacitance signal of the capacitance type deformation sensing element in the calibration electrical signals of the calibration signals, and R 3max and R 3min are respectively the maximum value and the minimum value of the resistance signal of the resistance type deformation sensing element in the calibration electrical signals of the calibration signals.
Dimensionless of the electrical signal of the multi-parameter sensor is achieved by:
Wherein, AndThe nondimensionalized signals of R 1x、R2x and R 3x, respectively.
After dimensionless, comparing the electrical signals of the multi-parameter sensor with the calibration electrical signals of the calibration signals one by one, and in the embodiment, calculating the distance between the electrical signals of the multi-parameter sensor and the calibration electrical signals of the calibration signals by the following formula:
α1+α2+α3＝1
where the constants α 1,α2 and α 3 are adjustment coefficients, determined by the sensitivity of the electrical signal to stimulus.
In one possible implementation manner, the obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals includes: and acquiring the calibration physical signals of the n selected calibration signals, and carrying out interpolation processing on the calibration physical signals of the n calibration signals to obtain the physical signals of the multi-parameter sensor.
Specifically, n calibration signals closest to the electrical signals of the measurement working conditions are selected for interpolation, and the calibration working conditions corresponding to the n calibration signals are distributed around the measurement working conditions, so that the accuracy of signal decoupling of the multi-parameter sensor is effectively guaranteed.
Optionally, the interpolating the calibration physical signals of the n calibration signals includes:
interpolation processing is carried out on the calibration physical signals of the n calibration signals through the following steps:
Wherein, T tx is the T parameter in the physical signal of the multi-parameter sensor, d f is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the f calibration signal, and T ti is the T parameter in the calibration physical signal of the i calibration signal.
Specifically, in this embodiment, 8 calibration signals are selected, and the 8 calibration signals are used as a basis for judging the current coupling condition, so that interpolation processing of the calibration physical signals of the 8 calibration signals is implemented by the following formula:
D＝d2d3d4d5d6d7d8+d1d3d4d5d6d7d8+d1d2d4d5d6d7d8+d1d2d3d5d6d7d8+......d1d2d3d4d6d7d8+d1d2d3d4d5d7d8+d1d2d3d4d5d6d8+d1d2d3d4d5d6d7
Wherein d 1、d2、d3、d4、d5、d6、d7 and d 8 are the distances between the electrical signals of the multi-parameter sensor and the calibration electrical signals of the 1 st to 8 th calibration signals, T 11 to T 81 are temperature signals in the calibration physical signals of the 1 st to 8 th calibration signals, T 12 to T 82 are deformation signals in the calibration physical signals of the 1 st to 8 th calibration signals, and T 13 to T 83 are pressure signals in the calibration physical signals of the 1 st to 8 th calibration signals, respectively.
Thus, the physical signals of the multi-parameter sensor are obtained according to the selected 8 calibration physical signals, namely, the decoupling of the electrical signals of the multi-parameter sensor is realized.
In one possible embodiment, the multi-parameter sensor signal decoupling method further comprises: acquiring a verification physical signal and a verification electrical signal of the multi-parameter sensor; according to the verification electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the verification electrical signals of the multi-parameter sensor from a plurality of preset calibration signals, and obtaining physical signals corresponding to the verification electrical signals of the multi-parameter sensor according to the n selected calibration signals; when the error between the physical signals of the multi-parameter sensor and the physical signals corresponding to the electrical signals of the multi-parameter sensor is larger than the error threshold, generating a new calibration signal according to the physical signals of the multi-parameter sensor and the electrical signals of the multi-parameter sensor, and supplementing the new calibration signal to a plurality of preset calibration signals.
Specifically, in order to prevent the accuracy of the decoupling measurement of the multi-parameter sensor from decaying over time, the reliability of a number of calibration signals preset is verified by applying a verification electrical signal that determines the verification coupling condition. In the verification process, the verification coupling working condition with large error is generalized and supplemented to a plurality of preset calibration signals, so that the real-time updating and dynamic correction of the calibration signals are realized, and the decoupling precision of the multi-parameter sensor in practical application is improved.
The following are device embodiments of the present invention that may be used to perform method embodiments of the present invention. For details not disclosed in the apparatus embodiments, please refer to the method embodiments of the present invention.
Referring to fig. 2, in still another embodiment of the present invention, a multi-parameter sensor signal decoupling device is provided, which can be used to implement the above-mentioned multi-parameter sensor signal decoupling method, and specifically, the multi-parameter sensor signal decoupling device includes an acquisition module, a selection module, and a decoupling module.
The acquisition module is used for acquiring the electrical signals of the multi-parameter sensor; the selecting module is used for selecting n calibration signals which are most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals according to the electrical signals of the multi-parameter sensor; wherein n is a preset constant; the decoupling module is used for obtaining physical signals of the multi-parameter sensor according to the selected n calibration signals.
In one possible implementation manner, the selecting module is specifically configured to: acquiring calibration electrical signals of all calibration signals; acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal; according to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal, selecting n calibration signals according to the sequence from small to large of the distance, and obtaining n calibration signals which are most similar to the electrical signal of the multi-parameter sensor.
In one possible embodiment, the acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal comprises: the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal is obtained by:
Wherein d i is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the ith calibration signal, alpha t is the adjustment coefficient of the t parameter in the electrical signal of the multi-parameter sensor, Is the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor; the non-dimensional value of the T parameter in the calibration electrical signal of the i calibration signal is obtained, and T is the total number of parameters.
In one possible embodiment, the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor is obtained by:
Wherein, R tx is the t parameter in the electrical signal of the multi-parameter sensor, R tmin is the minimum value of the t parameter in the calibration electrical signal of each calibration signal, and R tmax is the maximum value of the t parameter in the calibration electrical signal of each calibration signal.
The dimensionless value of the t parameter in the calibrated electrical signal of the i-th calibrated signal is obtained by the following formula:
Wherein R ti is the t parameter in the calibration electrical signal of the i calibration signal.
In one possible implementation manner, the decoupling module is specifically configured to: and acquiring the calibration physical signals of the n selected calibration signals, and carrying out interpolation processing on the calibration physical signals of the n calibration signals to obtain the physical signals of the multi-parameter sensor.
In one possible implementation manner, the interpolating the calibration physical signals of the n calibration signals includes: interpolation processing is carried out on the calibration physical signals of the n calibration signals through the following steps:
Wherein, T tx is the T parameter in the physical signal of the multi-parameter sensor, d f is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the f calibration signal, and T ti is the T parameter in the calibration physical signal of the i calibration signal.
In a possible implementation manner, the system further comprises an updating module, wherein the updating module is used for acquiring the verification physical signal and the verification electrical signal of the multi-parameter sensor; according to the verification electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the verification electrical signals of the multi-parameter sensor from a plurality of preset calibration signals, and obtaining physical signals corresponding to the verification electrical signals of the multi-parameter sensor according to the n selected calibration signals; when the error between the physical signals of the multi-parameter sensor and the physical signals corresponding to the electrical signals of the multi-parameter sensor is larger than the error threshold, generating a new calibration signal according to the physical signals of the multi-parameter sensor and the electrical signals of the multi-parameter sensor, and supplementing the new calibration signal to a plurality of preset calibration signals.
All relevant contents of each step involved in the foregoing embodiment of the multi-parameter sensor signal decoupling method may be cited in the functional description of the functional module corresponding to the multi-parameter sensor signal decoupling device in the embodiment of the present invention, which is not repeated herein.
The division of the modules in the embodiments of the present invention is schematically only one logic function division, and there may be another division manner in actual implementation, and in addition, each functional module in each embodiment of the present invention may be integrated in one processor, or may exist separately and physically, or two or more modules may be integrated in one module. The integrated modules may be implemented in hardware or in software functional modules.
Referring to fig. 3, in still another embodiment of the present invention, a multi-parameter sensor is provided, which includes a flexible substrate 4, and the above multi-parameter sensor signal decoupling device, where the flexible substrate 4 is provided with a temperature sensing unit 1, a deformation sensing unit 2, and a pressure sensing unit 3 in a partitioned manner, the multi-parameter sensor signal decoupling device is connected to the temperature sensing unit 1, the deformation sensing unit 2, and the pressure sensing unit 3, and the temperature sensing unit 1, the deformation sensing unit 2, and the pressure sensing unit 3 are all configured to generate an electrical signal under the triggering of an external physical signal, and send to the multi-parameter sensor signal decoupling device.
In one possible embodiment, the flexible substrate 4 is in a T-shaped structure and may be made of flexible materials such as polydimethylsiloxane, ecoflex, drogan Skin, and copolyester resin materials. The temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 are arranged on the flexible substrate 4 in a partitioning mode, wherein the temperature sensing unit 1 and the deformation sensing unit 2 are arranged on the top edge of one side surface of the flexible substrate 4 in parallel, the pressure sensing unit 3 is arranged on the bottom edge of one side surface of the flexible substrate 4, and the temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 are located on the same side surface of the flexible substrate 4. The temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 are arranged in a serpentine shape, and are all composed of conductive metal which can be in a liquid state at room temperature. The temperature sensing unit 1 and the pressure sensing unit 3 can be independently used as resistors to respectively measure temperature and pressure signals, and the deformation sensing unit 2 and the flexible substrate 4 form a micro capacitor to measure deformation signals.
Specifically, the temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 are arranged in a partitioned manner, and may be respectively provided as a resistive temperature sensing element, a capacitive deformation sensing element and a resistive deformation sensing element. Wherein, the resistance type temperature sensing element is used for measuring the temperature signal; the capacitive deformation sensing element is used for detecting deformation signals; the resistance type deformation sensing element is used for detecting a pressure signal. The multi-parameter sensor integrates temperature, deformation and pressure sensing units into a whole, and simultaneously realizes measurement and monitoring of temperature signals, deformation signals and pressure signals through the integrated layout of sensing elements.
The temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 are all used for generating electrical signals under the triggering of external physical signals, wherein the electrical signals comprise a resistance signal of the temperature sensing element 1, a capacitance signal of the deformation sensing element 2 and a resistance signal of the pressure sensing element 3. According to the distribution condition of the sensing units of the multi-parameter sensor, a pressure signal is applied to the pressure sensing unit 3; the deformation signals are respectively applied to the temperature sensing unit 1 and the deformation sensing unit 2; the temperature is simultaneously applied to the temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3. When the temperature signal, the deformation signal and the pressure signal are simultaneously applied to the multi-parameter sensor, the three stimulus signals are coupled and mutually affected. Under the coupling working conditions of the three signals, the deformation signal induces the resistance signal of the temperature sensing element 1 and the capacitance signal of the deformation sensing element 2 to change, and the deformation also affects the change of the resistance signal of the sensing element 3; the pressure signal not only causes the resistance signal of the pressure sensing element 3 to change, but also influences the resistance signal of the sensing element 1 and the capacitance signal of the deformation sensing element 2; the temperature signal acts on the temperature sensing unit 1, the deformation sensing unit 2 and the pressure sensing unit 3 at the same time, the resistance signal of the temperature sensing element 1, the capacitance signal of the deformation sensing element 2 and the resistance signal of the pressure sensing element 3 are changed along with the temperature signal, so that the fluctuation condition of the temperature signal, the deformation signal and the pressure signal can be effectively reflected, and the electric signals of a group of multi-parameter sensors corresponding to the coupling working conditions of temperature, deformation and pressure can be effectively reflected. Under the unknown coupling work, the temperature signal, the deformation signal and the pressure signal are measured according to the output electrical signals.
The resistance signal of the temperature sensing element 1, the capacitance signal of the deformation sensing element 2 and the resistance signal of the pressure sensing element 3 are decoupled by arranging the multi-parameter sensor signal decoupling device, so that accurate measurement of the temperature signal, the deformation signal and the pressure signal is realized.
In yet another embodiment of the present invention, a computer device is provided that includes a processor and a memory for storing a computer program including program instructions, the processor for executing the program instructions stored by the computer storage medium. The Processor may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose Processor, digital signal Processor (DIGITAL SIGNAL Processor, DSP), application Specific Integrated Circuit (ASIC), off-the-shelf Programmable gate array (Field-Programmable GATEARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic, discrete hardware components, etc., which are the computational core and control core of the terminal, adapted to implement one or more instructions, in particular to load and execute one or more instructions in a computer storage medium to implement a corresponding method flow or a corresponding function; the processor provided by the embodiment of the invention can be used for the operation of the multi-parameter sensor signal decoupling method.
In yet another embodiment of the present invention, a storage medium, specifically a Memory of a computer readable storage medium, is provided, where the Memory is used to store a program and data. It is understood that the computer readable storage medium herein may include both built-in storage media in a computer device and extended storage media supported by the computer device. The computer-readable storage medium provides a storage space storing an operating system of the terminal. Also stored in the memory space are one or more instructions, which may be one or more computer programs, including program code, adapted to be loaded and executed by the processor. The computer readable storage medium herein may be a high-speed RAM memory or a non-volatile memory (non-volatile memory), such as at least one magnetic disk memory. One or more instructions stored in a computer-readable storage medium may be loaded and executed by a processor to implement the corresponding steps of the method for decoupling multi-parameter sensor signals in the above-described embodiments.
It will be appreciated by those skilled in the art that embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media including, but not limited to, magnetic disk storage, CD-ROM, optical storage, and the like, having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus systems, and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Finally, it should be noted that: the above embodiments are only for illustrating the technical aspects of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the above embodiments, it should be understood by those of ordinary skill in the art that: modifications and equivalents may be made to the specific embodiments of the invention without departing from the spirit and scope of the invention, which is intended to be covered by the claims.
Claims (5)
1. A method of decoupling a multi-parameter sensor signal, comprising:
Acquiring an electrical signal of a multi-parameter sensor;
According to the electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals; wherein n is a preset constant;
obtaining physical signals of the multi-parameter sensor according to the selected n calibration signals;
According to the electrical signals of the multi-parameter sensor, selecting n calibration signals which are most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals comprises the following steps:
Acquiring calibration electrical signals of all calibration signals;
Acquiring the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal;
According to the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal, selecting n calibration signals according to the sequence from small to large of the distance, and obtaining n calibration signals which are most similar to the electrical signal of the multi-parameter sensor;
the obtaining the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal comprises the following steps:
the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of each calibration signal is obtained by:
Wherein d i is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the ith calibration signal, alpha t is the adjustment coefficient of the t parameter in the electrical signal of the multi-parameter sensor, Is the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor; the non-dimensional value of the T parameter in the calibrated electrical signal of the i calibration signal is taken as the non-dimensional value, and T is the total number of parameters;
the dimensionless value of the t-th parameter in the electrical signal of the multi-parameter sensor is obtained by the following formula:
Wherein R tx is the t parameter in the electrical signal of the multi-parameter sensor, R tmin is the minimum value of the t parameter in the calibration electrical signal of each calibration signal, and R tmax is the maximum value of the t parameter in the calibration electrical signal of each calibration signal;
the dimensionless value of the t parameter in the calibrated electrical signal of the i-th calibrated signal is obtained by the following formula:
wherein R ti is the t parameter in the calibration electrical signal of the i calibration signal;
The obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals comprises the following steps:
And acquiring the calibration physical signals of the n selected calibration signals, and carrying out interpolation processing on the calibration physical signals of the n calibration signals to obtain the physical signals of the multi-parameter sensor.
2. The method for decoupling a multi-parameter sensor signal as recited in claim 1, wherein interpolating the nominal physical signals of the n nominal signals comprises:
interpolation processing is carried out on the calibration physical signals of the n calibration signals through the following steps:
Wherein, T tx is the T parameter in the physical signal of the multi-parameter sensor, d f is the distance between the electrical signal of the multi-parameter sensor and the calibration electrical signal of the f calibration signal, and T ti is the T parameter in the calibration physical signal of the i calibration signal.
3. The multi-parameter sensor signal decoupling method of claim 1, further comprising:
acquiring a verification physical signal and a verification electrical signal of the multi-parameter sensor;
According to the verification electrical signals of the multi-parameter sensor, selecting n calibration signals which are the most similar to the verification electrical signals of the multi-parameter sensor from a plurality of preset calibration signals, and obtaining physical signals corresponding to the verification electrical signals of the multi-parameter sensor according to the n selected calibration signals;
When the error between the physical signals of the multi-parameter sensor and the physical signals corresponding to the electrical signals of the multi-parameter sensor is larger than the error threshold, generating a new calibration signal according to the physical signals of the multi-parameter sensor and the electrical signals of the multi-parameter sensor, and supplementing the new calibration signal to a plurality of preset calibration signals.
4. A multiparameter sensor signal decoupling device based on the multiparameter sensor signal decoupling method of claim 1, comprising:
The acquisition module is used for acquiring the electrical signals of the multi-parameter sensor;
the selecting module is used for selecting n calibration signals which are most similar to the electrical signals of the multi-parameter sensor from a plurality of preset calibration signals according to the electrical signals of the multi-parameter sensor; wherein n is a preset constant;
And the decoupling module is used for obtaining the physical signals of the multi-parameter sensor according to the selected n calibration signals.
5. A multiparameter sensor characterized in that it comprises a flexible substrate (4) and a multiparameter sensor signal decoupling device according to claim 4;
The flexible substrate (4) is provided with a temperature sensing unit (1), a deformation sensing unit (2) and a pressure sensing unit (3) in a partitioning mode; the multi-parameter sensor signal decoupling device is connected with the temperature sensing unit (1), the deformation sensing unit (2) and the pressure sensing unit (3), and the temperature sensing unit (1), the deformation sensing unit (2) and the pressure sensing unit (3) are all used for generating an electrical signal under the triggering of an external physical signal and transmitting the electrical signal to the multi-parameter sensor signal decoupling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210987947.0A CN115371731B (en) | 2022-08-17 | 2022-08-17 | Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210987947.0A CN115371731B (en) | 2022-08-17 | 2022-08-17 | Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115371731A CN115371731A (en) | 2022-11-22 |
| CN115371731B true CN115371731B (en) | 2024-11-12 |
Family
ID=84065956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210987947.0A Active CN115371731B (en) | 2022-08-17 | 2022-08-17 | Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115371731B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110426064A (en) * | 2019-07-18 | 2019-11-08 | 东南大学 | Wireless sourceless sensor and wireless and passive method for sensing |
| CN111272334A (en) * | 2020-02-18 | 2020-06-12 | 金陵科技学院 | Particle swarm optimization BP neural network-based multidimensional force sensor calibration decoupling method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014010671A1 (en) * | 2014-05-23 | 2015-12-17 | Gerd Reime | Method for determining at least one physical parameter by means of a sensor unit |
| US11092583B2 (en) * | 2019-06-19 | 2021-08-17 | Aromatix, Inc. | Machine learning stabilization of gas sensor output |
| CN110567492A (en) * | 2019-09-03 | 2019-12-13 | 兰州交通大学 | System-level calibration method for low-cost MEMS inertial sensors |
| CN111735487B (en) * | 2020-05-18 | 2023-01-10 | 清华大学深圳国际研究生院 | Sensor, sensor calibration method and device, and storage medium |
| CN112834067A (en) * | 2020-12-31 | 2021-05-25 | 南方科技大学 | Method, device, mobile terminal and medium for obtaining ambient temperature by mobile terminal |
| CN113376404B (en) * | 2021-05-19 | 2022-11-18 | 中寰卫星导航通信有限公司 | Calibration verification system, device, method and storage medium |
| CN114707399B (en) * | 2022-03-01 | 2024-09-20 | 浙江大学 | Decoupling method of six-dimensional force sensor |
-
2022
- 2022-08-17 CN CN202210987947.0A patent/CN115371731B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110426064A (en) * | 2019-07-18 | 2019-11-08 | 东南大学 | Wireless sourceless sensor and wireless and passive method for sensing |
| CN111272334A (en) * | 2020-02-18 | 2020-06-12 | 金陵科技学院 | Particle swarm optimization BP neural network-based multidimensional force sensor calibration decoupling method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115371731A (en) | 2022-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2019053035A5 (en) | ||
| RU2138781C1 (en) | Transducer with improved compensation | |
| KR101483309B1 (en) | Sensor processing method | |
| US8476910B2 (en) | Capacitive sensor having calibration mechanism and capacitive sensing method | |
| JP2007206079A (en) | Method and system for determining temperature of object | |
| JP5900536B2 (en) | Sensor signal detection device | |
| US8874387B2 (en) | Air flow measurement device and air flow correction method | |
| JPH11507136A (en) | Calibration method of radiation thermometer | |
| WO2008086271A1 (en) | Temperature sensor bow compensation | |
| CN107621279A (en) | Data processing method, sensing data calibration method and device | |
| US11268867B2 (en) | Strain gauge structure for a sensor | |
| US8650460B2 (en) | Electronic apparatus, method of correcting detection data, and sensor unit | |
| CN115371731B (en) | Multi-parameter sensor, multi-parameter sensor signal decoupling method and decoupling device | |
| TW201224476A (en) | Method of identifying a current transformer situated about a conductor, and associated metering device | |
| CN114509599B (en) | Current measurement method, apparatus, device and computer readable storage medium | |
| CN115639410A (en) | Capacitance detection method and capacitance detection device | |
| Ivanovich et al. | Model of the spatial conversion characteristics for graduation of the microprocessor-based sensor's with indemnification of influence destabilizing factors | |
| US9109956B2 (en) | Temperature measurement circuit and temperature measurement method | |
| US9710121B2 (en) | Position determination techniques in resistive touch screen applications | |
| KR102365419B1 (en) | Method for calibration of gas sencsor, computer-readable computer program | |
| JPH11295175A (en) | Signal processing circuit for sensor | |
| KR101229571B1 (en) | Sensor callibration system and method | |
| CN114111846B (en) | Compensation method and device suitable for Hall sensor and storage medium | |
| CN112816752B (en) | Temperature compensation method and equipment for capacitive mutual inductor | |
| CN116940817A (en) | Method and system for determining junction temperature of power semiconductor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |