CN115366304A - Hot melt adhesive filling method and filling device - Google Patents
Hot melt adhesive filling method and filling device Download PDFInfo
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- CN115366304A CN115366304A CN202211054999.9A CN202211054999A CN115366304A CN 115366304 A CN115366304 A CN 115366304A CN 202211054999 A CN202211054999 A CN 202211054999A CN 115366304 A CN115366304 A CN 115366304A
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- melt adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/44—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2023/00—Tubular articles
- B29L2023/22—Tubes or pipes, i.e. rigid
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- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明属于高分子材料加工技术领域,具体涉及一种热熔胶灌装方法及灌装装置。在灌装时先给胶管预热使胶管先受热膨胀,保证热熔胶灌装时不会因为遇冷降温导致粘度变大,且预先加热的胶管受热膨胀,在后续降温时会有更大的收缩率以匹配热熔胶的降温收缩防止热熔胶由于收缩过大与胶管脱离,匀速降温可以减少热熔胶在降温过程中体积收缩,进一步降低脱管的风险;提高了热熔胶的生产良率,降低生产成本,降低运输、存储的条件。
The invention belongs to the technical field of polymer material processing, and in particular relates to a hot melt adhesive filling method and a filling device. When filling, preheat the rubber hose first so that the rubber hose is heated and expanded first, so as to ensure that the viscosity of the hot melt adhesive will not increase due to cooling and cooling during filling, and the pre-heated rubber hose will expand when heated, and there will be a greater increase in the subsequent cooling. Shrinkage to match the cooling shrinkage of the hot melt adhesive to prevent the hot melt adhesive from detaching from the hose due to excessive shrinkage. Uniform cooling can reduce the volume shrinkage of the hot melt adhesive during the cooling process, further reducing the risk of detachment; improving the production of hot melt adhesive Yield, reduce production cost, reduce transportation and storage conditions.
Description
技术领域technical field
本发明属于高分子材料加工技术领域,具体涉及一种热熔胶灌装方法及灌装装置。The invention belongs to the technical field of polymer material processing, and in particular relates to a hot melt adhesive filling method and a filling device.
背景技术Background technique
传统高初强热熔胶由于加入过多的结晶组分和热塑性组分提高初始粘接力,这些组分的引入会提高热熔胶的整体Tg,在灌装中极易造成脱壁的现象,将高Tg组分在快速降温经历玻璃化转变温度时产生的内应力削弱,可以减少脱壁现象的出现。现有的工艺通过将灌装好的热熔胶放置在保温腔体内,利用热熔胶本身的放热提高腔体内环境温度并于保温结构共同作用降低环境的降温速率,同时将保温腔放置恒温箱中进一步延缓环境温度的下降,此类工艺存在以下几点问题:保温腔内不同位置得温度不一致,内部中心位置的热熔胶收到四周的热辐射,边缘位置只能接收到内部向外的热辐射,总体呈现中心位置温度偏高、四周温度偏低,温度由内向外递减,外部的降温速度偏快容易脱壁;通过热辐射+保温腔+恒温环境延缓体系的降温,所消耗的时间偏长,通常需要1~2天,耗时长,生产效率低;长时间的热辐射会导致热熔胶部分不耐热的组分发生老化,以及加速可反应性组分发生反应,影响热熔胶的性能。Due to the addition of too many crystalline components and thermoplastic components to traditional high-strength hot-melt adhesives to improve the initial adhesion, the introduction of these components will increase the overall Tg of the hot-melt adhesive, which can easily cause wall detachment during filling , weakening the internal stress generated when the high Tg component undergoes glass transition temperature during rapid cooling can reduce the occurrence of detachment. The existing technology puts the filled hot melt adhesive in the insulation cavity, uses the heat release of the hot melt adhesive itself to increase the ambient temperature in the cavity, and cooperates with the insulation structure to reduce the cooling rate of the environment. At the same time, the insulation cavity is placed at a constant temperature The box further delays the decline of the ambient temperature. This type of process has the following problems: the temperature of different positions in the insulation chamber is inconsistent, the hot melt adhesive at the center of the interior receives the heat radiation from the surroundings, and the edge position can only receive the heat from the inside to the outside. The heat radiation, the overall temperature in the center is high, the surrounding temperature is low, the temperature decreases from the inside to the outside, and the external cooling speed is too fast and easy to fall off the wall; through thermal radiation + heat preservation cavity + constant temperature environment to delay the cooling of the system, the consumed The time is too long, usually 1 to 2 days, which takes a long time and the production efficiency is low; long-term heat radiation will cause the aging of the heat-resistant components of the hot melt adhesive, and accelerate the reaction of the reactive components, affecting the thermal properties of the melt.
发明内容Contents of the invention
有鉴于此,本发明提出一种热熔胶灌装方法及灌装装置,在灌装时先给胶管预热使胶管先受热膨胀,保证热熔胶灌装时不会因为遇冷降温导致粘度变大,且预先加热的胶管受热膨胀,在后续降温时会有更大的收缩率以匹配热熔胶的降温收缩防止热熔胶由于收缩过大与胶管脱离,匀速降温可以减少热熔胶在降温过程中体积收缩,进一步降低脱管的风险;提高了热熔胶的生产良率,降低生产成本,降低运输、存储的条件。In view of this, the present invention proposes a hot-melt adhesive filling method and a filling device. When filling, the rubber hose is preheated first so that the rubber hose is heated and expanded first, so as to ensure that the hot-melt adhesive will not cause viscosity loss due to cooling and cooling during filling. Larger, and the pre-heated rubber hose will expand when heated, and will have a greater shrinkage rate during subsequent cooling to match the cooling shrinkage of the hot melt adhesive to prevent the hot melt adhesive from detaching from the hose due to excessive shrinkage. Uniform cooling can reduce the hot melt adhesive. The volume shrinks during the cooling process, which further reduces the risk of detachment; improves the production yield of hot melt adhesives, reduces production costs, and reduces transportation and storage conditions.
为了实现上述技术目的,本发明所采用的具体技术方案为:In order to realize above-mentioned technical purpose, the concrete technical scheme that the present invention adopts is:
一种热熔胶灌装方法,包括以下步骤:A hot melt adhesive filling method, comprising the following steps:
S101:预热用于灌装所述热熔胶的胶管;S101: preheating the hose used for filling the hot melt adhesive;
S102:向预热后的所述胶管中灌装热熔胶;S102: filling hot melt adhesive into the preheated rubber tube;
S103:将灌装热熔胶后的所述胶管临时保温;S103: Temporarily insulate the rubber hose filled with hot melt adhesive;
S104:重复所述S101-S103继续灌装并保温下一个胶管至灌装并保温的胶管达到目标数量;S104: Repeat S101-S103 to continue filling and insulate the next rubber hose until the filled and insulated rubber hose reaches the target quantity;
S105:待目标数量的胶管灌装完成后将临时保温中的各所述胶管放至降温设备中匀速降温至室温。S105: After the target quantity of rubber hoses are filled, put each of the rubber hoses in the temporary heat preservation into the cooling device to cool down to room temperature at a uniform speed.
进一步的,所述胶管的预热温度高于热熔胶在灌装前的温度。Further, the preheating temperature of the rubber tube is higher than the temperature of the hot melt adhesive before filling.
进一步的,所述胶管的预热温度高于热熔胶在灌装前的温度5~10℃。Further, the preheating temperature of the rubber hose is 5-10° C. higher than the temperature of the hot melt adhesive before filling.
进一步的,所述热熔胶在灌装前的温度为80~150℃。Further, the temperature of the hot melt adhesive before filling is 80-150°C.
进一步的,所述胶管匀速降温至室温的降温速度为10~20℃/Hour。Further, the cooling rate of the rubber hose to room temperature at a uniform speed is 10-20° C./Hour.
进一步的,所述降温设备为烘箱。Further, the cooling device is an oven.
本发明还提出一种用于完成上述热熔胶灌装方法的一种热熔胶灌装装置,包括:The present invention also proposes a hot melt adhesive filling device for completing the above hot melt adhesive filling method, comprising:
支架;bracket;
多个加热保温套,均安装在所述支架上,开设有胶管腔,所述胶管腔的底部开设有进胶口;A plurality of heating insulation sleeves are all installed on the bracket, and a rubber tube cavity is opened, and a glue inlet is opened at the bottom of the rubber tube cavity;
灌装装置,用于基于所述进胶口向所述胶管腔内的所述胶管内灌装所述热熔胶。The filling device is used for filling the hot melt adhesive into the glue tube in the glue tube cavity based on the glue inlet.
各所述加热保温套可旋转安装在所述支架上。Each of the heating insulation jackets is rotatably mounted on the bracket.
进一步的,所述灌装装置包括进胶流道和开闭阀门;所述进胶流道的外部设有保温装置;所述开闭阀门用于开闭所述进胶流道。Further, the filling device includes a glue feeding channel and an opening and closing valve; the outside of the glue feeding channel is provided with a heat preservation device; the opening and closing valve is used to open and close the glue feeding channel.
进一步的,所述胶管处于所述胶管腔内时,所述胶管的侧面与所述加热保温套的间距为1-2mm。Further, when the rubber tube is in the cavity of the rubber tube, the distance between the side of the rubber tube and the heating insulation jacket is 1-2 mm.
采用上述技术方案,本发明还能够带来以下有益效果:By adopting the above technical solution, the present invention can also bring the following beneficial effects:
本发明胶管温度略高于热熔胶温度进一步降低了与胶管接触热熔胶的粘度,提高了热熔胶的流动性;The temperature of the rubber hose in the present invention is slightly higher than the temperature of the hot melt adhesive, which further reduces the viscosity of the hot melt adhesive in contact with the rubber hose and improves the fluidity of the hot melt adhesive;
本发明采用批次灌装、批次冷却的技术手段,能够降低生产成本节约生产时间。The invention adopts the technical means of batch filling and batch cooling, which can reduce production cost and save production time.
附图说明Description of drawings
为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.
图1为本发明具体实施方式中热熔胶灌装方法的流程示意图;Fig. 1 is the schematic flow sheet of hot melt adhesive filling method in the specific embodiment of the present invention;
图2为本发明具体实施方式中热熔胶灌装装置的结构示意图;Fig. 2 is the structural representation of hot-melt glue filling device in the specific embodiment of the present invention;
其中:1、进胶流道;2、开闭阀门;3、加热保温套;4、胶管;5、支架;6、光电传感器;7、胶管腔。Among them: 1. Adhesive flow channel; 2. Opening and closing valve; 3. Heating insulation cover; 4. Rubber hose; 5. Bracket; 6. Photoelectric sensor; 7. Rubber hose cavity.
具体实施方式Detailed ways
下面结合附图对本发明实施例进行详细描述。Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
以下通过特定的具体实例说明本发明的实施方式,本领域技术人员可由本说明书所揭露的内容轻易地了解本发明的其他优点与功效。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。本发明还可以通过另外不同的具体实施方式加以实施或应用,本说明书中的各项细节也可以基于不同观点与应用,在没有背离本发明的精神下进行各种修饰或改变。需说明的是,在不冲突的情况下,以下实施例及实施例中的特征可以相互组合。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
要说明的是,下文描述在所附权利要求书的范围内的实施例的各种方面。应显而易见,本文中所描述的方面可体现于广泛多种形式中,且本文中所描述的任何特定结构及/或功能仅为说明性的。基于本发明,所属领域的技术人员应了解,本文中所描述的一个方面可与任何其它方面独立地实施,且可以各种方式组合这些方面中的两者或两者以上。举例来说,可使用本文中所阐述的任何数目个方面来实施设备及/或实践方法。另外,可使用除了本文中所阐述的方面中的一或多者之外的其它结构及/或功能性实施此设备及/或实践此方法。It is noted that the following describes various aspects of the embodiments that are within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is illustrative only. Based on the present disclosure, a person skilled in the art should appreciate that an aspect described herein may be implemented independently of any other aspect and that two or more of these aspects may be combined in various ways. For example, any number of the aspects set forth herein can be used to implement an apparatus and/or practice a method. In addition, such an apparatus may be implemented and/or such a method practiced using other structure and/or functionality than one or more of the aspects set forth herein.
还需要说明的是,以下实施例中所提供的图示仅以示意方式说明本发明的基本构想,图示中仅显示与本发明中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制,其实际实施时各组件的型态、数量及比例可为一种随意的改变,且其组件布局型态也可能更为复杂。It should also be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may also be more complicated.
另外,在以下描述中,提供具体细节是为了便于透彻理解实例。然而,所属领域的技术人员将理解,可在没有这些特定细节的情况下实践所述方面。Additionally, in the following description, specific details are provided to facilitate a thorough understanding of examples. However, it will be understood by those skilled in the art that the described aspects may be practiced without these specific details.
在本发明的一个实施例中,提出一种热熔胶灌装方法,如图1所示,包括以下步骤:In one embodiment of the present invention, propose a kind of hot melt adhesive filling method, as shown in Figure 1, comprise the following steps:
S101:预热用于灌装热熔胶的胶管4;S101: preheating the
S102:向预热后的胶管4中灌装热熔胶;S102: filling hot melt adhesive into the
S103:将灌装热熔胶后的胶管4临时保温;S103: Temporarily insulate the
S104:重复S101-S103继续灌装并保温下一个胶管4至灌装并保温的胶管4达到目标数量;S104: Repeat S101-S103 to continue filling and insulated the
S105:待目标数量的胶管4灌装完成后将临时保温中的各胶管4放至降温设备中匀速降温至室温。S105: After the target quantity of
在本实施例中,预热装置采用加热压盘或其他加热装置;临时保温的装置为可以预热和/或加热的可以容纳胶管4的装置,包括多组。当目标数量的胶管4完成灌装保温后一起放入降温设备中,降温设备采用可加热设备,需保证能够为所有胶管4设置相应的冷却速度。In this embodiment, the preheating device adopts a heating platen or other heating devices; the temporary heat preservation device is a device that can preheat and/or heat and can accommodate the
在本实施例中,胶管4的预热温度高于热熔胶在灌装前的温度。In this embodiment, the preheating temperature of the
在本实施例中,胶管4的预热温度高于热熔胶在灌装前的温度5~10℃。In this embodiment, the preheating temperature of the
在本实施例中,热熔胶在灌装前的温度为80~150℃。当热熔胶为PUR热熔胶时,在灌装前的温度设置为80~100℃。In this embodiment, the temperature of the hot melt adhesive before filling is 80-150°C. When the hot melt adhesive is PUR hot melt adhesive, the temperature before filling is set to 80-100°C.
在本实施例中,胶管4匀速降温至室温的降温速度为10~20℃/Hour。In this embodiment, the cooling rate of the
在本实施例中,降温设备为烘箱。In this embodiment, the cooling device is an oven.
本实施例在灌装前先给胶管4预热(预热温度比热熔胶的加热温度高5~10℃),使胶管4先受热膨胀,高温热熔胶(80~150℃,非反应型热熔胶根据具体配方可以控制温度在100~150℃,PUR热熔胶控制在80~100℃)通过胶管4胶嘴处从下向上注入胶管4时不会因为遇冷降温导致粘度变大——对管壁的浸润性变差,同时由于胶管4温度略高于热熔胶温度进一步降低了与胶管4接触热熔胶的粘度,提高了热熔胶的流动性,提升了热熔胶对胶管4管壁的浸润,将灌装好的热熔胶置于石棉、气凝胶以及耐高温泡棉等保温材料保温,待一批次灌装完将胶管4转移至试管架中并放入高温(80~150℃)烘箱中匀速降温(以10~20℃/Hour的速度降温,降温至25℃,PUR热熔胶需要低湿的环境),预先加热的胶管4可以提高热熔胶对管壁的浸润性(高温下热熔胶粘度低,流动性好,浸润性好)更为重要的是预先加热的胶管4受热膨胀,在后续降温时会有更大的收缩率以匹配热熔胶的降温收缩防止热熔胶由于收缩过大与胶管4脱离--在冷却过程中胶管4始终会与热熔胶紧密接触(胶管4受热膨胀后冷却产生的收缩远大于热熔胶从液体冷却至膏体或者半固体所产生的收缩),匀速降温可以减少热熔胶在降温过程中体积收缩,进一步降低脱管的风险,在-10℃储存也未发生脱管现象,且冷却时间基本在10-15小时内,提高了热熔胶的生产良率,降低生产成本,降低运输、存储的条件。In this embodiment, the
在一个实施例中,基于同样的发明构思,本发明提出用于完成上述热熔胶灌装方法的一种热熔胶灌装装置,包括:In one embodiment, based on the same inventive concept, the present invention proposes a hot melt adhesive filling device for completing the above hot melt adhesive filling method, including:
支架5;
多个加热保温套3,均安装在支架5上,开设有胶管腔7,胶管腔7的底部开设有进胶口;A plurality of
灌装装置,用于基于进胶口向胶管腔7内的胶管4内灌装热熔胶。The filling device is used for filling hot melt glue into the
在本实施例中,各加热保温套3可旋转安装在支架5上。In this embodiment, each heating and
在本实施例中,胶管4处于胶管腔7内时,胶管4的侧面与加热保温套3的间距为1-2mm。In this embodiment, when the
在本实施例中,灌装装置包括进胶流道1和开闭阀门2;进胶流道1的外部设有保温装置;开闭阀门2用于开闭进胶流道1。In this embodiment, the filling device includes a glue feeding channel 1 and an opening and closing valve 2; an insulation device is provided outside the glue feeding channel 1;
在一个实施例中,进胶流道1的末端设置有螺纹,胶管4的底部可基于螺纹连连接胶流道1的末端进而实现与外部环境隔绝的热熔胶灌装。本实施例的进胶流道基于一个底座固定在每个加热保温套3旋转后可以到达的位置,每一个胶管4到达后均能够基于螺纹固定在底座处实现逐一灌装。In one embodiment, the end of the glue inlet flow channel 1 is provided with threads, and the bottom of the
本实施例进胶流道1末端的螺纹设置方式可采用在进胶流道1的末端直接设置螺纹。In this embodiment, the thread setting method at the end of the glue inlet flow channel 1 can be directly provided with threads at the end of the glue inlet flow channel 1 .
实施例1:生产好的非反应型热熔胶利用130℃的压盘热熔后通过管道抽至灌装装置中,先用1-2kg热熔胶清洗灌装流道,待包括进胶流道1的所有流道清洗干净后将胶管4放入已加热至140℃的加热保温套3中,胶嘴部分与管道出胶口旋紧,光电传感器6对准胶管4的规定位置-识别胶管4的灌胶量,灌胶,热熔胶液面高出加热保温套3的加热保护范围,光电传感器6识别到液面位置,停止灌胶,快速取出胶管4并封装好带芯头塞与尾塞放入保温腔体内,待一批灌装完成后转移至试管架中并放入已加热至130℃的烘箱内,设置15℃/Hour的降温速率,待冷却至25℃后取出并包装好。Example 1: The produced non-reactive hot-melt adhesive is hot-melted with a pressure plate at 130°C and then pumped into the filling device through a pipeline. First, 1-2kg of hot-melt adhesive is used to clean the filling flow channel, and the glue inlet flow is included After cleaning all the channels of channel 1, put the
实施例2:生产好的PUR热熔胶利用90℃的压盘热熔后通过管道抽至处于真空手套箱的灌装装置中,先用1-2kg热熔胶清洗灌装流道,待包括进胶流道1的所有流道清洗干净后将胶管4放入已加热至110℃的加热保温套3中,胶嘴部分与管道出胶口旋紧,光电传感器6对准胶管4的规定位置-识别胶管4灌胶量,灌胶,热熔胶液面高出加热保温套3的加热保护范围,光电传感器6识别到液面位置,停止灌胶,快速取出胶管4并封装好带芯头塞塞与尾塞放入保温腔体内,待一批灌装完成后后转移至试管架中并放入已加热至90℃的真空干燥烘箱内,设置10℃/Hour的降温速率并开启真空干燥,待冷却至25℃后取出并包装好。Example 2: The produced PUR hot-melt adhesive is hot-melted with a pressure plate at 90°C and pumped through the pipeline to the filling device in the vacuum glove box. First, clean the filling flow channel with 1-2kg of hot-melt adhesive. After cleaning all the flow channels of the glue inlet channel 1, put the
表1为采用上述两个实施例与其他对比例进行热熔胶灌装的测试结果:Table 1 is the test result of hot melt adhesive filling using the above two embodiments and other comparative examples:
表1Table 1
实施例与对比例的工艺区别:The technological difference of embodiment and comparative example:
实施例1与对比例1-2之间的区别在于对比例1-2采用不预热胶管4,仅保温并匀速降温的灌装工艺;The difference between embodiment 1 and comparative example 1-2 is that comparative example 1-2 adopts the filling process of not preheating
实施例1与对比例1-3之间的区别在于对比例1-3采用预热胶管4,保温腔体保温;The difference between embodiment 1 and comparative examples 1-3 is that comparative examples 1-3 adopts preheating
实施例2与对比例2-2之间的区别在于对比例2-2采用不预热胶管4,仅保温并匀速降温的灌装工艺;The difference between embodiment 2 and comparative example 2-2 is that comparative example 2-2 adopts the filling process of not preheating
实施例1与对比例2-3之间的区别在于对比例2-3采用预热胶管4,保温腔体保温;The difference between embodiment 1 and comparative example 2-3 is that comparative example 2-3 adopts preheating
上述实施例与对比例所采用的测试方法如下:The test method adopted in above-mentioned embodiment and comparative example is as follows:
(1)粘接强度测试(1) Adhesive strength test
测试方法:将热熔胶点胶机的加热套管加热至120℃,将热熔胶放入加热套管中加热10-20min,使之完全熔融。使用合适的点胶针头以及点胶路径参数,在被粘接基材上点胶,再与另一被粘基材压合,压合厚度通过Spacer控制(0.1mm-0.2mm),最后使用万能试验机测试10min后的粘接强度。Test method: Heat the heating sleeve of the hot melt adhesive dispenser to 120°C, put the hot melt adhesive into the heating sleeve and heat for 10-20 minutes to make it completely melt. Use the appropriate dispensing needle and dispensing path parameters to dispense glue on the substrate to be bonded, and then press it with another substrate to be bonded. The thickness of the laminate is controlled by Spacer (0.1mm-0.2mm), and finally use the universal The testing machine tested the bonding strength after 10 minutes.
测试结果:粘接强度测试的测试结果示于表1。由表1可知,本发明所制备的热熔胶的10min的初始强度均大于1MPa,可见本发明的热熔胶均是合格产品,属于高初强的热熔胶。Test results: The test results of the adhesive strength test are shown in Table 1. As can be seen from Table 1, the 10min initial strength of the hot-melt adhesive prepared by the present invention is greater than 1MPa. It can be seen that the hot-melt adhesive of the present invention is a qualified product and belongs to the hot-melt adhesive with high initial strength.
(1)脱壁率测试(1) Detachment rate test
测试方法:用铝箔袋封装热熔胶分别在0℃保存30Days和-10℃保存3d后,撕掉铝箔袋,观察并清点有脱壁现象的热熔胶数量,计算脱壁率。计算方法为:有脱壁现象的热熔胶的只数/总只数*100%。Test method: Seal the hot melt adhesive in an aluminum foil bag, store at 0°C for 30 days and -10°C for 3 days, tear off the aluminum foil bag, observe and count the number of hot melt adhesives with detachment, and calculate the detachment rate. The calculation method is: the number of hot melt adhesives with wall separation/total number*100%.
测试结果:通过给胶管4预热,匀速降温的工艺共同作用可使高初强的热熔胶的脱壁率大大降低,且单一使用其中某一种工艺均不能达到两者协同作用的效果,可见本发明的灌装工艺均是稳定的,可以满足高初强热熔胶不脱壁的需求。Test results: By preheating the
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以权利要求的保护范围为准。The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
Claims (10)
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