CN115332140A - A large warped substrate carrying device - Google Patents

Abstract

The invention discloses a large-warpage substrate bearing device which comprises an adapter, wherein an adsorption treatment structure is arranged at the upper end of the adapter; the adsorption treatment structure includes: the device comprises a lifting plate, a lifting mechanism, a plurality of ejector rods, a fixed support, a lifting support, a plurality of ejector blocks, a plurality of soft suckers, a soft rubber ring, an air extraction assembly, a plurality of springs and a bearing processing assembly; the invention relates to the technical field of substrate detection equipment, in particular to an adsorption treatment structure, which adopts an adsorption treatment structure, through the matching of a lifting soft sucker and a soft rubber ring and the matching of a vacuum air passage, an object to be detected can be adsorbed on the surface of a supporting table, a warped substrate (wafer) is absorbed, the requirement of high-precision detection is met, and the whole surface to be detected of the absorbed and leveled substrate is positioned on a horizontal plane, so that the wafer leveling state required by detection is met.

Description

A large warpage substrate carrying device

technical field

The invention relates to the technical field of substrate or wafer detection equipment, in particular to a large warpage substrate carrying device.

Background technique

When the current wafer inspection equipment detects the substrate (wafer), some of the substrates to be tested will be seriously warped, and the general carrying device cannot absorb the warped substrate, so that the inspection equipment cannot detect this For this type of substrate, because the uneven adsorption will lead to unclear optical imaging, the substrate cannot be detected. In view of this, this case came into being after in-depth research on the above problems.

Contents of the invention

In order to achieve the above objectives, the present invention is achieved through the following technical solutions: a large warpage substrate carrying device, including an adapter seat, the upper end of the adapter seat is provided with an adsorption treatment structure;

The adsorption processing structure includes: a lifting plate, a lifting mechanism, a plurality of ejector rods, a fixed bracket, a lifting bracket, a plurality of top blocks, a plurality of soft suction cups, an air extraction component, a plurality of springs and a bearing processing component;

The lifting plate is movably set on the outer wall of the adapter seat, a plurality of the lifting mechanisms are respectively installed on both sides of the lower end of the lifting plate, a plurality of the ejector rods are installed on the upper end of the lifting plate, and the fixed The bracket is fixedly installed in the upper wall of the adapter seat, the lifting bracket is movably embedded in the fixed bracket, a plurality of the top blocks are installed on the lower wall of the lifting bracket, and a plurality of the soft The suction cup is installed on the upper end of the lifting bracket, the air extraction assembly is installed in the adapter seat, and is respectively connected with a plurality of the soft suction cups, and a plurality of the springs (9) are set in the soft suction cups. On the suction cup (8), the bearing processing assembly is installed on the upper end of the fixing bracket and connected with the air extraction assembly.

Preferably, the exhaust assembly includes: vacuum exhaust pipes, several universal joints, several vacuum air pipes and several control valves;

The vacuum suction pipe is installed in the adapter seat, several universal joints are respectively connected to the vacuum suction pipes, one end of several vacuum air pipes is respectively connected to several universal joints, and several control valves They are respectively installed on several vacuum air pipes.

Preferably, the bearing processing assembly includes: a bearing plate, a plurality of through holes, a plurality of annular grooves, a plurality of soft rubber rings, a cavity, a common adsorption area of 8 inches and 12 inches, and a 12-inch adsorption area;

The carrying plate is installed on the upper end of the fixed bracket, and the lower wall is connected to the other end of the vacuum tube, a plurality of through holes are opened on the carrying plate, and a plurality of annular grooves are opened in the On the upper wall of the carrier plate, a plurality of the soft rubber rings are respectively embedded in a plurality of the annular grooves, the cavity is opened in the carrier plate, and the 8-inch and 12-inch shared adsorption area is set on the At the center of the upper end of the carrier plate, the 12-inch adsorption area is set outside the upper end of the carrier plate, and the 8-inch and 12-inch common adsorption area and the lower end of the 12-inch adsorption area are both connected to the cavity.

Preferably, the positions of the plurality of through holes correspond to the positions of the plurality of soft suction cups.

Preferably, grooves corresponding to the fixing brackets are provided on the lower wall of the carrying tray.

Preferably, the plurality of ejector pins correspond to the positions of the plurality of ejector blocks.

The invention provides a large warpage substrate carrying device. It has the following beneficial effects: the adsorption treatment structure adopted in this case can absorb the object to be tested on the surface of the support table through the cooperation of the lifting soft suction cup and the soft rubber ring and the cooperation of the vacuum air channel, and absorb the warped substrate (wafer), to meet the requirements of high-precision detection, the entire surface to be tested of the substrate after sucking is located on a horizontal plane, which meets the flat state of the wafer required for detection.

Description of drawings

FIG. 1 is a front view three-dimensional structural schematic diagram of a large warpage substrate carrying device according to the present invention.

Fig. 2 is a schematic diagram of a partial three-dimensional structure of a large warpage substrate carrying device according to the present invention.

FIG. 3 is a schematic bottom view of the carrying and processing component of a large warpage substrate carrying device according to the present invention.

Fig. 4 is a top structural schematic diagram of a carrying processing component of a large warpage substrate carrying device according to the present invention.

Fig. 5 is a schematic diagram of a front view structure of a large warpage substrate carrying device according to the present invention.

Fig. 6 is a schematic cross-sectional structure diagram of a carrying processing component of a large warpage substrate carrying device according to the present invention.

In the figure: 1. Adapter seat, 2. Lifting plate, 3. Lifting mechanism, 4. Ejector rod, 5. Fixed bracket, 6. Lifting bracket, 7. Top block, 8. Soft suction cup, 9. Spring, 10 , vacuum exhaust pipe, 11, universal joint, 12, vacuum air pipe, 13, control valve, 14, carrying plate, 15, through hole, 16, annular groove, 17, soft rubber ring, 18, cavity, 19, 8-inch and 12-inch shared adsorption area, 20 and 12-inch adsorption area.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Example

As shown in Figure 1-6, a large warpage substrate carrying device includes an adapter seat 1, characterized in that the upper end of the adapter seat 1 is provided with an adsorption treatment structure;

The adsorption treatment structure includes: lifting plate 2, multiple lifting mechanisms 3, multiple ejector rods 4, fixed bracket 5, lifting bracket 6, multiple top blocks 7, multiple soft suction cups 8, air extraction components, multiple springs 9 and bearer processing components;

The adsorption treatment structure includes: lifting plate 2, multiple lifting mechanisms 3, multiple ejector rods 4, fixed bracket 5, lifting bracket 6, multiple top blocks 7, multiple soft suction cups 8, air extraction components, multiple springs 9 and bearer processing components;

Lifting plate 2 is movable on the outer wall of adapter seat 1, multiple lifting mechanisms 3 are respectively installed on both sides of the lower end of lifting plate 2, multiple ejector rods 4 are installed on the upper end of lifting plate 2, and fixed bracket 5 is fixedly installed on the adapter seat 1. In the upper wall, the lifting bracket 6 is movably embedded in the fixed bracket 5. A plurality of top blocks 7 are installed on the lower wall of the lifting bracket 6. A plurality of soft suction cups 8 are installed on the upper end of the lifting bracket 6. The air extraction component is installed on the In the adapter seat 1, and respectively connected with a plurality of soft suction cups 8, a plurality of said springs (9) are all sleeved on the said soft suction cups (8), and the bearing processing assembly is installed on the upper end of the fixed bracket 5, and is connected with Extraction assembly connection.

It should be noted that, when in use, the elevating mechanism 3 is first driven to work, and the elevating plate 2 is pushed to move upwards, and the elevating bracket 6 and A plurality of soft suction cups 8 moves upward until the plurality of soft suction cups 8 rise to the highest point, and then the substrate to be processed is placed on the upper end of the plurality of soft suction cups 8, and then the suction assembly and the plurality of soft suction cups 8 Cooperate, the substrate is adsorbed on the upper ends of multiple soft suction cups 8, and the substrate will shrink by 2-4mm when adsorbing the substrate. Using this shrinkage effect to perform the first warping treatment on the warped wafer, the degree of warping can be reduced. Lower, after a plurality of soft suction cups 8 suck the substrate, the lifting bracket 6 will descend under the action of the lifting mechanism 3 and the spring 9, and the substrate will be close to the soft rubber ring 17 driven by the plurality of soft suction cups 8 , the contact area between the soft rubber ring 17 and the substrate is in a closed state, and at the same time, each soft suction cup 8 tightly pulls the substrate to stick to the carrier disk 14, and the peripheral substrate part of the soft suction cup 8 and the circular ring passing through the hole on the carrier surface The surface is fully fitted to form a closed state, so that the 12-inch area of the substrate and the 8-inch-12-inch common area form a sealed vacuum, and then further vacuumize, the vacuum below the substrate will tightly adsorb the substrate to the carrier plate 14, soft The rubber ring 17 is completely pressed into the annular groove of the annular groove in the carrier plate 14. So far, the substrate is completely absorbed and flattened, and the flatness of the substrate is almost the same as that of the carrier plate 14. The adsorption process of the substrate.

In the specific implementation process, the exhaust assembly includes: a vacuum exhaust pipe 10, several universal joints 11, several vacuum air pipes 12 and several control valves 13;

The vacuum suction pipe 10 is installed in the adapter seat 1, several universal joints 11 are respectively connected to the vacuum suction pipe 10, one end of several vacuum air pipes 12 is respectively connected to several universal joints 11, and several control valves 13 are respectively installed on several vacuum air pipes 12 superior.

It should be noted that the vacuum air circuit is divided into 4 channels, which are 3 soft suction cups on the inner side, 8 channels and 1 vacuum channel, 3 soft suction cups on the outer side, 8 channels and 1 vacuum channel, and 19 air channels in the 8-inch and 12-inch shared adsorption area. 1 way of vacuum, 20 air channels in the 12-inch adsorption area lead to 1 way of vacuum. The gas entering from the vacuum pumping pipe 10 is divided into 4 ways through several universal joints 11. The mass suction cup 8, 8 inches and 12 inches share the adsorption area 19 and the 12 inch adsorption area 20 are connected separately, and the gas path is controlled separately by several control valves 13 provided.

In the specific implementation process, the bearing processing assembly includes: a bearing plate 14, a plurality of through holes 15, a plurality of annular grooves 16, a plurality of soft rubber rings 17, a cavity 18, a common adsorption area 19 of 8 inches and 12 inches, and a 12 inches Adsorption zone 20;

Carrying plate 14 is installed on fixed bracket 5 upper ends, and lower wall surface is connected with vacuum air pipe 12 other ends, and a plurality of through holes 15 are all opened on carrying plate 14, and a plurality of annular grooves 16 are all opened in carrying plate 14 upper wall places, many A soft rubber ring 17 is respectively embedded in a plurality of annular grooves 16, a cavity 18 is opened in the carrier plate 14, an 8-inch and 12-inch common adsorption area 19 is arranged at the center of the upper end of the carrier plate 14, and a 12-inch adsorption area 20 is provided. On the outer side of the upper end of the carrier plate 14, the 8-inch and 12-inch common adsorption area 19 and the lower end of the 12-inch adsorption area 20 are all communicated with the cavity 18.

It should be noted that the 8-inch and 12-inch common adsorption area 19 and the 12-inch adsorption area 20 are communicated with a plurality of vacuum tubes 12 through the cavity 18. When in use, the downward force of the spring 9 is close to a plurality of soft suction cups 8 position, so that the substrate area on a plurality of soft suction cups 8 can be close to the carrier plate 14, just tightly covering 6 through holes 15, so as not to allow the vacuum to leak and play the role of sealing, 8 inches 12 below the substrate Under the negative pressure effect of 19 inches of common adsorption areas 19 and 12 inches of adsorption areas 20, substrate can be further absorbed, until soft rubber ring 17 is pressed in the annular groove 16 on soft rubber ring 17 limits, substrate and The bearing surface is fully fitted, and like this, an airtight negative pressure (vacuum) gas field formed by a soft rubber ring 17, a bearing disc 14 and a plurality of soft suction cups 8 will be formed below the substrate, and the flatness of the substrate is closely related to the bearing surface. The flatness of the disk 14 is almost the same, so that the adsorption process of the warped substrate is realized. The height of the two kinds of annular grooves 16 is the height of the adsorption surface. Surface is divided into 8 inches of 12 inches shared adsorption area 19 and 12 inches of adsorption area 20, and the grooved annular surface is to allow vacuum to pass in the soft rubber ring 17 grooves, and the vacuum in the groove also enters adsorption to substrate, and soft rubber Rubber ring 17 is pressed in the groove.

In a specific implementation process, the positions of the plurality of through holes 15 correspond to the positions of the plurality of soft suction cups 8 .

In a specific implementation process, a groove corresponding to the fixing bracket 5 is provided on the lower wall of the carrying tray 14 .

In a specific implementation process, the positions of the plurality of ejector pins 4 correspond to the positions of the plurality of ejector blocks 7 .

In a specific implementation process, the spring 9 can be replaced by other lowering mechanisms.

In the specific implementation process, the spring 9 and the soft rubber ring 17 are requisite components in this patent, and the spring will be as close as possible to the soft sucker 8.

In the specific implementation process, the function of the spring 9 is to allow the suction cup 8 to suck the substrate and drive it to move downward together.

In the specific implementation process, the soft suction cup 8 for 12 inches, the shared soft suction cup 8 for 8 inches and 12 inches, the common adsorption area 19 for 8 inches and 12 inches, and the adsorption area 20 for 12 inches need separate pressure control.

During specific implementation, the spring 9 and the soft suction cup 8 can be increased or decreased according to actual conditions.

In a specific implementation process, the vacuum exhaust pipe 10 may be a vent groove processed inside the metal structure.

In a specific implementation process, the edge of the hole through which the soft suction cup 8 passes through the upper surface of the carrier plate 14 has a circular surface for sealing the vacuum.

In the specific implementation process, the plurality of springs respectively correspond to the soft suction cups, and are close to or coincident with the center line.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. any such actual relationship or order exists between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or apparatus. without further restrictions. The phrase "the inclusion of an element defined by ... does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising said element".

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents.

Claims (5)

1. A large-warpage substrate bearing device comprises an adapter (1), and is characterized in that an adsorption treatment structure is arranged at the upper end of the adapter (1);

the adsorption treatment structure includes: the device comprises a lifting plate (2), a lifting mechanism (3), a plurality of ejector rods (4), a fixed support (5), a lifting support (6), a plurality of ejector blocks (7), a plurality of soft suckers (8), an air extraction assembly, a plurality of springs (9), a soft rubber ring and a bearing processing assembly;

the lifting plate (2) is movably sleeved at the outer wall of the adapter (1), the lifting mechanism (3) is respectively installed at the lower end of the lifting plate (2), the ejector rods (4) are all installed at the upper end of the lifting plate (2), the fixed support (5) is fixedly installed in the upper wall surface of the adapter (1), the lifting support (6) is movably embedded in the fixed support (5), the ejector blocks (7) are all installed at the lower wall surface of the lifting support (6), the soft suckers (8) are installed at the upper end of the lifting support (6), the air exhaust component is installed in the adapter (1) and is respectively connected with the soft suckers (8), the springs (9) respectively correspond to the soft suckers and are all sleeved below the soft suckers (8), and the bearing processing component is installed at the upper end of the fixed support (5) and is connected with the air exhaust component;

the bearing processing assembly comprises: a carrier tray (14), a plurality of through holes (15), a plurality of annular grooves (16), a plurality of soft rubber rings (17), a cavity (18), an 8-inch and 12-inch common adsorption zone (19) and a 12-inch adsorption zone (20);

the bearing plate (14) is installed at the upper end of the fixed support (5), the lower wall surface of the bearing plate is connected with the other end of the vacuum air pipe (12), the through holes (15) are formed in the bearing plate (14), the annular grooves (16) are formed in the upper wall surface of the bearing plate (14), the soft rubber rings (17) are embedded in the annular grooves (16), the cavity (18) is formed in the bearing plate (14), the 8-inch 12-inch common adsorption area (19) is arranged in the center of the upper end of the bearing plate (14), the 12-inch adsorption area (20) is arranged on the outer side of the upper end of the bearing plate (14), and the lower ends of the 8-inch 12-inch common adsorption area (19) and the 12-inch adsorption area (20) are communicated with the cavity (18).

2. The apparatus of claim 1, wherein the pumping assembly comprises: the vacuum air extraction pipe (10), a plurality of universal joints (11), a plurality of vacuum air pipes (12) and a plurality of control valves (13);

the vacuum extraction pipe (10) is installed in the adapter (1), the universal joints (11) are connected with the vacuum extraction pipe (10) respectively, one ends of the vacuum air pipes (12) are connected with the universal joints (11) respectively, and the control valves (13) are installed on the vacuum air pipes (12) respectively.

3. A substrate carrier with large warp according to claim 1 wherein a plurality of said through holes (15) are located corresponding to a plurality of said soft suction cups (8).

4. The carrying device for the substrate with large warpage as claimed in claim 1, wherein the lower wall surface of the carrying tray (14) is provided with a groove corresponding to the fixing bracket (5).

5. A large warp substrate carrier device according to claim 1, wherein a plurality of said lift pins (4) correspond in position to a plurality of said lift blocks (7).

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