CN108807233A - The workbench and clamping method of bonding are solved after sheet product bonding - Google Patents

Abstract

The invention discloses a workbench for debonding after bonded sheet products, which includes a carrier, and is characterized in that: the carrier is provided with a reference plane and at least one suction cup group, when the product is placed on the carrier The suction cup set touches the product before the reference surface and is attracted to the back of the product. The suction cup set drives the product attracted to the suction cup set to move toward the position of the reference surface until the back of the product abuts against the reference surface. The suction cup can fit the surface of the product very well, even if the surface of the product is warped or the surface accuracy is poor, the suction can be completed very well, and the product can be well fixed and positioned on the carrier through the reference surface. The invention provides a workbench for debonding after bonding thin products, which can clamp products with poor flatness, and thus has strong versatility in the debonding process.

Description

Workbench and clamping method for debonding after bonded sheet products

technical field

The invention relates to the technical field of preparation of related accessories for integrated circuits, in particular to a workbench and a clamping method for unbonding and debonding of sheet products after bonding.

Background technique

Thin sheet products often need to be bonded to a carrier before surface processing, such as thinning, etching, etc., thereby enhancing the strength of the product, reducing or avoiding defects such as product fragmentation, and improving the pass rate of the product. The above-mentioned process is widely used in the semiconductor processing industry, so the definition in the industry is used to call it the product bonding process. Of course, after the surface processing of the bonded product is completed, it is necessary to separate the product from the carrier, and this process is called the debonding process.

The unbonding process is simply to fix the product and the carrier through the stage and the manipulator, and then drive the product and the carrier to debond through the relative distance between the manipulator and the carrier. And because the thickness of the product is often small, the slides are mostly of sheet structure, so the fixing method between the stage and the product or the slide on the stage cannot be fixed by traditional clamping equipment. Most of them use working platforms with holes, that is, through the suction force of the suction holes on the working platform, the sheet products placed on the working platform are attracted to the working platform.

However, the carrier in the above prior art has certain limitations due to its own structural characteristics. In other words, when the flatness of the above-mentioned products or slides is poor, such as products after plastic packaging, it will result in that the product or slides with poor flatness cannot be completely attached to the work surface of the stage. , so there will be air leakage, which will reduce the suction force of the suction hole on the product, which will cause the product to fail to attach to the carrier normally, or cause the product and the carrier to fail due to the small suction force. There is no normal debonding between them.

In addition, it is worth mentioning that when the slide is attached and adsorbed to the stage of the prior art, the surface accuracy of the slide can be improved to improve the adsorption effect, or a thicker slide can be selected to complete the process through a traditional chuck. Clamping, although the above-mentioned processes will increase the processing cost and reduce the production efficiency, the purpose of debonding between the product and the carrier can still be achieved in the case of small batch processing without considering the production cost. However, there is no better solution in the prior art when the product and the carrier need to be bonded and adsorbed. Therefore, this carrier in the prior art can only be aimed at specific products and slides in the actual production process, and its versatility is poor.

Contents of the invention

The present invention aims to solve one of the technical problems in the related art at least to a certain extent: to provide a workbench for debonding after bonding thin products, which can clamp products with poor flatness, so that during the debonding process Strong versatility.

For this reason, an object of the present invention is to propose a workbench for unbonding after bonding of thin products, which includes a stage, and is characterized in that: the stage is provided with a reference plane and at least one suction cup group, when the product When placed on the stage, the suction cup set touches the product before the reference plane and is attracted to the back of the product, and the suction cup set drives the product that is attracted to the suction cup set to move toward the position of the reference plane to the back of the product against the datum. The surface of the product can be well fitted by the suction cup, even if the surface of the product is warped or the surface accuracy is poor, the suction can be completed very well, and the product can be well fixed and positioned on the carrier through the reference surface. Therefore, the debonding process of various products can be completed, and the influence of product surface size and precision on the clamping strength during the debonding process can be reduced or avoided, so that the above-mentioned workbench has good versatility.

According to an example of the present invention, the suction cup set includes several vacuum suction nozzles made of elastic material, one end of the vacuum suction nozzle along its own length direction is installed on the stage, and the other end of the vacuum suction nozzle is provided with Opening for fitting to the back of the product. The vacuum nozzle can not only absorb the product well, but also the vacuum nozzle will shrink along its own length during the adsorption process, so it can drive the product to fit well on the reference surface, that is, the suction of the product is completed synchronously and positioning process.

According to an example of the present invention, a working platform is provided on the carrier platform, and the suction cup set and the reference surface are both located on the working platform of the carrier platform. There is an independent working surface on the stage to facilitate the setting of the suction cup group and the reference surface.

According to an example of the present invention, accommodating grooves are provided at positions corresponding to the vacuum suction nozzles on the working table of the carrier, and each vacuum suction nozzle is respectively installed in the respective corresponding accommodating grooves, and each vacuum suction nozzle The openings of the mouth are all exposed outside the accommodating tank.

According to an example of the present invention, a lift mechanism is provided inside the carrier, and the end of each vacuum nozzle away from the opening is installed on the movable end of the lift mechanism, and the movable end of the lift mechanism drives all the vacuum nozzles along the container. The slot depth direction of the slot is moved so that the opening of the vacuum nozzle is exposed outside the accommodating slot or accommodated in the accommodating slot. The movement of the vacuum nozzle can be realized through the additional lifting mechanism, so it can drive the product to fit well on the datum surface. The situation where the product is damaged due to excessive impact force also avoids the problem that the product positioning is not firm due to insufficient moving distance. In addition, when the platform is idle, all the vacuum nozzles can be accommodated in the storage tank through the lifting mechanism, which can prevent dust and avoid the inconvenience caused by manual removal of the vacuum nozzles.

According to an example of the present invention, there are multiple sets of suction cups, and all the suction cups are arranged at intervals along the circumference of the reference plane, and a number of small holes arranged at intervals are provided on the reference plane, and the carrier is provided with a The air in the small hole is connected to the suction pipe, and the air in the small hole is drawn away through the suction pipe, so that the product close to the reference surface or attached to the reference surface forms a mutual attraction force between the reference surface and the reference surface. When the flatness of the back of the product is poor, the suction cup set can be used to cooperate with the suction of the small hole on the stage to achieve the effect of product positioning. When the flatness of the back of the product is good, the suction cup set can be directly passed through the stage. The small holes on the carrier are sucked together, and the operation is simple and convenient. Therefore, the above-mentioned structure enables the carrier to complete the selection of various positioning methods for a variety of products, and its versatility is strong.

According to an example of the present invention, all the vacuum suction nozzles are evenly distributed on the stage, and the reference plane extends to between any two adjacent vacuum suction nozzles.

The purpose of the present invention is to solve another technical problem in the related art at least to a certain extent: to provide a clamping method for sheet products, which can be used for sheet products with different surface dimensions and precision based on the above-mentioned structure of the workbench. Clamping and positioning, so the clamping process is simple and efficient, and has strong versatility.

For this reason, another object of the present invention is to propose a clamping method for sheet products, which includes the above-mentioned workbench, and is characterized in that it includes the following steps:

S1. Place the product to be debonded on the carrier, and the suction cup set on the carrier lifts the product, so that the product is suspended above the carrier;

S2. The sucker group is sucked together with the back of the product;

S3. Synchronously with step S2 or after step S2, the suction cup set drives the product attracted to the suction cup set to move toward the position of the carrier, so that the back of the product abuts against the reference surface on the carrier.

Preferably, said step S3 refers to that after step S2 is completed, the lifting mechanism in the stage drives the suction cup group to drive the product connected to the suction cup group to move toward the position of the stage, so that the back of the product is in contact with the carrier. The datum surface on the stage is against.

Further preferably, said step S3 includes the following steps:

S31. The lifting mechanism in the carrier drives the sucker group to drive the product connected to the sucker group to move toward the position of the carrier;

S32. The small hole on the stage blows air towards the back of the product, so that a buffer layer is formed between the back of the product close to the reference plane and the stage, the air pressure in the small hole is greater than the external atmospheric pressure, and the buffer The force exerted by the layer on the product is less than the pulling force of the suction cup group on the product;

S33. The lifting mechanism pulls the product through the suction cup group until the back of the product is attached to the reference surface;

S34, extracting the air in the small hole, so that a mutual suction force is formed between the small hole and the back of the product, and the air pressure in the small hole is lower than the external atmospheric pressure.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

The above technical solution has the following advantages or beneficial effects: firstly, the product can be well sucked in through the suction cup group exposed in whole or in part on the reference surface, and can drive the product to be pressed tightly on the reference surface, so it has strong versatility; secondly, The axial movement of the suction cup group can be realized through the lifting mechanism, which can not only adjust the spacing and pressing force in the process of pressing the product on the reference surface, but also hide the suction cup group when the workbench is idle to achieve the effect of dust prevention. Finally, through the four corners of the suction cup set to cooperate with a number of small holes in the middle position, the product can be selected only through the small hole or with the suction cup set according to the surface size and precision of the product itself, so it can be used for different products. Provide the optimal clamping method, and its versatility is strong.

Description of drawings

Fig. 1 is a structural schematic diagram of a workbench used for debonding after bonding of thin sheet products according to the present invention.

Fig. 2 is a schematic diagram of another structure of the present invention.

Fig. 3 is a schematic side view of the workbench in Fig. 2 in a working state.

Among them, 1. Carrier, 2. Datum plane, 2.1. Small hole, 3. Suction cup set, 3.1. Vacuum nozzle, 3.2. Opening, 4. Product, 4.1. Back side, 5. Accommodating tank.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

A workbench according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

Product 4 below refers to the whole formed after bonding the chip product to be debonded and the carrier without a clear explanation. The so-called debonding refers to the process of separating the chip product and the carrier after bonding. For example, when the wafer is bonded on the carrier for processing, it is necessary to separate the wafer from the carrier. This process is the debonding process of the wafer, and so on. The debonding of the sheet product in this article can be broadly understood as Two sheet objects are separated. Further, the product may be a sheet-shaped product made of materials such as wafers, glass, metal sheets, engineering plastics, or synthetic materials formed by combining multiple materials.

Embodiment one:

The present invention provides a workbench for debonding after bonded sheet products, which includes a carrier 1 as shown in Figure 1, and the carrier 1 is placed in a horizontal direction as shown in the figure, and it is characterized in that: the carrier A reference plane 2 and at least one suction cup set 3 are provided on the stage 1. When the product 4 is placed on the platform 1 from top to bottom in the vertical direction, the suction cup set 3 touches the product 4 before the reference plane 2 and is in contact with the product. 4.1 suction on the back side of 4, in other words, when the product 4 is placed vertically from top to bottom, it first touches the part of the suction cup group 3 above the carrier 1, and when the suction cup group 3 suctions the product, the The suction cup set 3 drives the product 4 attracted to the suction cup set 3 to move toward the position of the reference plane 2 until the back side 4.1 of the product 4 abuts against the reference plane 2 .

The aforementioned sucker group 3 driving the product 4 may mean that the sucker group 3 draws air so that the sucker group 3 and the back side 4.1 of the product 4 are sucked together to drive the product 4 down synchronously due to the shrinkage of the sucker group 3, or it may refer to the suction cup After the suction connection between the group 3 and the product 4, the additional driving mechanism drives the suction cup group 3 and the product 4 connected to the suction cup group 3 to move, so as to achieve the purpose of driving the product 4.

The back 4.1 of the above-mentioned product 4 refers to the lower end surface facing the carrier 1, as shown in Figure 3, the bottom surface along the vertical direction is the back 4.1 of the product 4, taking the wafer as an example, if the wafer is on the On the top, the back side 4.1 of the product 4 refers to the end surface of the wafer away from the carrier, if the carrier is down and the wafer is on the top, then the back side 4.1 of the product 4 refers to the lower end surface of the carrier away from the wafer.

Embodiment two:

The structure is basically the same as that of Embodiment 1, the difference is that the suction cup set 3 includes several vacuum suction nozzles 3.1 made of elastic material, and one end of the vacuum suction nozzles 3.1 along its own length direction is installed on the carrier 1 , the other end of the vacuum nozzle 3.1 is provided with an opening 3.2, which is used to attach to the back side 4.1 of the product 4. As mentioned above, when the vacuum suction nozzle 3.1 made of elastic material is used for the suction cup group 3, specifically, the corrugated suction nozzle can be used, and the suction force between the vacuum suction nozzle 3.1 and the back side 4.1 of the product 4 increases, At the same time, it also drives the product 4 to move downward along the thickness direction of the carrier 1 in FIG. 1 until the back of the product 4 is attached to the upper surface of the carrier 1. Then until the back surface 4.1 of the product 4 is attached to the reference surface 2 of the carrier 1 .

Embodiment three:

The structure is basically the same as that of the second embodiment, the difference is that: the stage 1 is provided with a worktable, and the suction cup set 3 and the reference plane 2 are both located on the worktable of the stage 1 . As shown in FIG. 1 , the working table is the upper end surface of the carrier 1 , and the entire working table is used as the reference plane 2 as a whole. Certainly, the reference plane 2 may be an additional reference plate or a reference block independently provided on the worktable, or may be the upper end surface of the cutting platform 1 so that part of the worktable serves as the reference plane 2 .

Embodiment four:

The structure is substantially the same as that of Embodiment 3, and the difference is that: on the working surface of the carrier 1, accommodating grooves 5 are provided at positions corresponding to the vacuum suction nozzles 3.1, and each vacuum suction nozzle 3.1 is installed on the respective vacuum suction nozzles 3.1. The openings 3.2 of the vacuum suction nozzles 3.1 are exposed outside the corresponding accommodating groove 5.

Embodiment five:

The structure is substantially the same as that of Embodiment 4, the difference being that a lifting mechanism is provided inside the carrier platform 1, and the end of each vacuum suction nozzle 3.1 away from the opening 3.2 is installed on the movable end of the lifting mechanism, and the lifting mechanism's The movable end drives all the vacuum nozzles 3.1 to move along the groove depth direction of the accommodating groove 5, so that the opening 3.2 of the vacuum nozzles 3.1 is exposed outside the accommodating groove 5 or accommodated in the accommodating groove 5. The lifting mechanism can be a cylinder arranged in the carrier, and the movable end of the piston rod of the cylinder extends into the corresponding accommodating groove and is fixedly connected with the vacuum suction nozzle 3.1, thereby driving the cylinder located in the accommodating groove 5 through the reciprocating motion of the cylinder. The inner vacuum nozzle 3.1 moves up and down along the groove depth direction of the accommodating groove.

The above-mentioned lifting mechanism can achieve three purposes. First, as mentioned above, the vacuum suction nozzle 3.1 and the product 4 connected to the vacuum suction nozzle 3.1 are driven by the lifting mechanism to move, so that the back side 4.1 of the product 4 is aligned with the reference surface. 2 fit and in a fixed static state. Second, in the debugging stage, the position of each vacuum suction nozzle 3.1 can be adjusted through the lifting mechanism, so that when the vacuum suction nozzle 3.1 attracts the product 4 and drives the product 4 to move synchronously towards the reference plane 2, it is avoided The large impact force causes the product 4 to break or is too far away so that there is a gap between the product 4 and the reference surface 2 and cannot be fitted and fixed normally. Third, when the equipment is in an idle state, all the vacuum suction nozzles 3.1 can be stored in the storage tank 5 through the lifting mechanism, and it is only necessary to put a dust cover or a dust cover on the carrier 1. Therefore, not only the dustproof effect is good, but also the vacuum nozzle 3.1 will not be damaged.

Embodiment six:

The structure is substantially the same as that of Embodiment 5, the difference is that there are multiple suction cup groups 3, and all the suction cup groups 3 are arranged at intervals along the circumference of the reference plane 2, specifically, the suction cups shown in Figure 1 There are four groups 3, and the carrier 1 is square, so that each suction cup group 3 is respectively arranged at the corner position of the carrier 1, and the reference surface 2 is provided with a number of small holes 2.1 arranged at intervals, and all The small holes 2.1 are densely distributed in the central position of the reference plane 2. As shown in FIG. The carrier platform 1 is provided with suction pipes communicating with each small hole 2.1, and the air in the small holes 2.1 is extracted through the suction pipe, so that the product 4 close to the reference surface 2 or attached to the reference surface 2 A mutual suction force is formed with the reference plane 2 . One end of the suction pipe communicates with an external vacuum pump, and the air in the small hole 2.1 is drawn out by the vacuum pump, thereby making the product 4 close to the reference plane 2, that is, the upper end surface of the carrier 1 in FIG. The suction generated by vacuuming in the small holes is formed between the upper end surfaces of the table 1 to achieve the purpose of attracting the product 4 .

As preferably, a single suction cup group 3 includes three large vacuum suction nozzles 3.1 of the same structural size and a small vacuum suction nozzle 3.1 with a structural size smaller than the large vacuum suction nozzle 3.1, that is, the opening diameter of the large vacuum suction nozzle 3.1 is greater than that of the small vacuum suction nozzle 3.1 opening diameter.

Embodiment seven:

The structure is generally the same as that of Embodiment 6, the difference is that: as shown in Figure 2, the shown carrier 1 is a circular carrier, so the above-mentioned suction cup group 3 can be understood as a single one, and the suction cup group 3 includes several all For the same or partially identical vacuum nozzles, such as soft corrugated nozzles, all the vacuum nozzles 3.1 are evenly distributed on the stage 1, and there is a gap between any two adjacent vacuum nozzles 3.1. In FIG. 2 , there is no additional reference plane 2 , so the upper end surface of the stage 1 is the reference plane 2 , and thus the reference plane 2 extends to between any two adjacent vacuum suction nozzles 3 . 1 . In other words, the upper end surface of the stage 1 serves as the reference plane 2, and a plurality of accommodation grooves 5 arranged at intervals are evenly distributed on the reference plane 2, and each accommodation groove 5 is respectively provided with a vacuum suction nozzle 3.1. Preferably, a plurality of reference blocks are provided on the platform 1, and the reference blocks are fixedly connected to the platform 1 and located between any two adjacent vacuum nozzles 3.1 along the horizontal direction.

Of course, the carrier 1 is provided with a gas pipe, and one end of the gas pipe communicates with the small hole 2.1 on the carrier 1 and the vacuum nozzle 3.1 through the cooperation of a single or multiple valves such as a reversing valve or a switch valve. The other end communicates with the vacuum pump or through an external pipeline.

A clamping method for sheet products, including the above-mentioned workbench, is characterized in that it includes the following steps:

S1. Place the product 4 to be debonded on the carrier 1, and the suction cup group 3 on the carrier 1 lifts the product 4, so that the product 4 is suspended above the carrier 1;

S2. The sucker group 3 is sucked together with the back side 4.1 of the product 4;

S3. Synchronously with step S2 or after step S2, the suction cup group 3 drives the product 4 sucked on the suction cup group 3 to move toward the position of the carrier 1, so that the back 4.1 of the product 4 is in contact with the carrier 1 The datum surface 2 abuts against the product 4 resting on the platform 1 .

As the first embodiment of the clamping method: the suction cup group 3 in the above-mentioned step S2 adopts a vacuum suction nozzle 3.1 that can stretch along its own length direction. In the process of closing, step S3 is completed synchronously, that is, step S3: the suction cup group 3 is a vacuum suction nozzle 3.1, and when the vacuum suction nozzle 3.1 is sucked together with the back 4.1 of the product 4, the vacuum suction nozzle 3.1 moves along its own length Shortened so that the product 4 moves synchronously with the vacuum nozzle 3.1 until the back side 4.1 of the product 4 abuts against the reference surface 2 on the stage 1 .

As a second embodiment of the clamping method: the stage 1 is provided with a lifting mechanism, the suction cup group 3 is installed on the movable end of the lifting mechanism, and when step S2 is completed, the lifting mechanism drives the suction cup group 3 toward The position of the reference surface 2 moves until the suction cup set 3 is stored on the stage 1 and is located in the accommodating groove 5 corresponding to the suction cup set 3. At the same time, the product 4 that is attracted to the suction cup set 3 is also synchronized with the reference surface. The surface 2 is bonded, and the product 4 is statically placed on the carrier 1, so as to achieve the purpose of clamping the product 4.

As the third embodiment of the clamping method: it is generally the same as the second embodiment, the difference is that the step S3 includes the following steps:

S31. The lifting mechanism in the carrier 1 drives the sucker group 3 to drive the product 4 connected to the sucker group 3 to move toward the position of the carrier 1;

S32. The small hole 2.1 on the carrier 1 blows air toward the back 4.1 of the product 4, so that a buffer layer is formed between the back 4.1 of the product 4 close to the reference plane 2 and the carrier 1, and the air pressure in the small hole 2.1 The value is greater than the external atmospheric pressure, and the force exerted by the buffer layer on the product 4 is less than the pulling force of the suction cup group 3 on the product 4;

S33. The lifting mechanism pulls the product 4 through the suction cup set 3 until the back 4.1 of the product 4 is attached to the reference surface 2;

S34, extracting the air in the small hole 2.1, so that a mutual suction force is formed between the small hole 2.1 and the back surface 4.1 of the product 4, and the air pressure in the small hole 2.1 is lower than the external atmospheric pressure.

That is, the small hole 2.1 first blows air toward the product 4 from bottom to top as shown in Figure 3 in step S32, so that the product 4 is decelerated under the influence of the high-speed airflow blown out in the small hole 2.1 when it is close to the reference plane 2, That is, a high-pressure buffer layer is formed between the back 4.1 of the product 4 and the reference surface 2 or the upper end surface of the carrier 1, and then the direction of the airflow in the small hole 2.1 is reversed, so that the air is pumped in the small hole 2.1, so that the static place The suction between the product 4 on the stage 1 and the reference surface 2 is more firm. During this process, the reversing of the airflow in the small hole 2.1 can be realized by the electromagnetic reversing valve, the reversing process is automatically controlled by the controller, and the time node of this reversing can be selected after the product 4 is close to the reference plane 2 At any point in time when the product 4 is attached to the datum plane 2. In other words, when the lifting mechanism drives the suction cup group 3 to drive the product 4 connected to the suction cup group 3 to move toward the position of the carrier 1 and the product 4 touches the buffer layer, the small hole 2.1 can stop blowing. gas. This process can be delayed and controlled by a counter, or can be achieved by detecting changes in air pressure through a pressure sensor.

It should be noted here that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower" , "Front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" , "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In the description of this specification, descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.

Various changes and modifications will no doubt become apparent to those skilled in the art upon reading the foregoing description. Therefore, the appended claims should be considered to cover all changes and modifications within the true intent and scope of the invention. Any and all equivalent scope and content within the scope of the claims should still be deemed to be within the intent and scope of the present invention.

Claims (10)

1. solving the workbench of bonding after a kind of sheet product bonding, it includes microscope carrier (1), it is characterised in that：The microscope carrier (1) Be equipped with reference plane (2) and at least one sucker group (3), when product (4) is placed on microscope carrier (1) the sucker group (3) prior to Reference plane (2) is touched product (4) and is attracted with the back side (4.1) of product (4), and the sucker group (3) drives and is pulled on sucker group (3) product (4) on is moved to the back side (4.1) of the product (4) towards reference plane (2) position and reference plane (2) is supported It leans on.

2. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The sucker group (3) include several vacuum slots (3.1) made of elastic material, the vacuum slot (3.1) is along the one of length direction End is installed on microscope carrier (1), and the other end of the vacuum slot (3.1) is equipped with opening (3.2), for the back side with product (4) (4.1) it is bonded.

3. solving the workbench of bonding after sheet product bonding according to claim 2, it is characterised in that：The microscope carrier (1) it is equipped with a work top, the sucker group (3) and reference plane (2) are respectively positioned on the work top of microscope carrier (1).

4. solving the workbench of bonding after sheet product bonding according to claim 3, it is characterised in that：The microscope carrier (1) it is located at the position corresponding to each vacuum slot (3.1) on work top and is equipped with storage tank (5), each vacuum slot (3.1) It is respectively arranged in corresponding storage tank (5), and the opening (3.2) of each vacuum slot (3.1) is placed on storage tank (5) Outside.

5. solving the workbench of bonding after sheet product bonding according to claim 4, it is characterised in that：The microscope carrier (1) elevating mechanism is equipped in, end of each vacuum slot (3.1) far from opening (3.2) is installed on the movable end of elevating mechanism, The movable end of the elevating mechanism drives whole vacuum slots (3.1) to be moved along the groove depth direction of storage tank (5), so that institute The opening (3.2) for stating vacuum slot (3.1) is placed on storage tank (5) outside or in storage to storage tank (5).

6. solving the workbench of bonding after sheet product bonding as claimed in any of claims 1 to 5, feature exists In：The sucker group (3) is multiple, whole sucker (3) being provided at circumferentially spaced along reference plane (2), on the reference plane (2) Equipped with several spaced apertures (2.1), the air intake duct being connected to each aperture (2.1) is equipped in the microscope carrier (1), it is described small Air in hole (2.1) is detached through air intake duct so that close to reference plane (2) or fit in product (4) in reference plane (2) with Reference plane forms the active force being mutually attracted between (2).

7. solving the workbench of bonding after sheet product bonding as claimed in any of claims 2 to 5, feature exists In：Whole vacuum slots (3.1) are uniformly distributed on microscope carrier (1), and the reference plane (2) extends to two of arbitrary neighborhood Between vacuum slot (3.1).

8. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The microscope carrier (1) it is equipped with a work top, the sucker group (3) and reference plane (2) are respectively positioned on the work top of microscope carrier (1).

9. solving the workbench of bonding after sheet product bonding according to claim 1, it is characterised in that：The microscope carrier (1) it is equipped with corresponding storage tank (5) corresponding to the position of each sucker group (3) on, each sucker group (3) is respectively arranged in respectively right In the storage tank (5) answered, and the sucker group (3) can be along the axial stretching of storage tank (5), so that sucker group (3) is placed on Storage tank (5) outside or is contracted in storage tank (5).

10. the workbench of any one of a kind of clamping method, including the claims 1 to 7 of sheet product, feature exist In：Include the following steps：

S1, it will wait for that the product (4) of solution bonding is placed on microscope carrier (1), and the sucker group (3) on microscope carrier (1) lifts product (4), so that the product (4) is suspended in above microscope carrier (1)；

S2, sucker group (3) and the back side (4.1) of product (4) are attracted；

S3, synchronous with step S2 or the sucker group (3) drives the product (4) being pulled in sucker group (3) upon step s 2 It is moved towards microscope carrier (1) position, so that the back side (4.1) of the product (4) offsets with the reference plane (2) on microscope carrier (1) It leans on.