CN115290440A - Surface pressure and position precision test-based surface mounting equipment test method - Google Patents
Surface pressure and position precision test-based surface mounting equipment test method Download PDFInfo
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- CN115290440A CN115290440A CN202210665206.0A CN202210665206A CN115290440A CN 115290440 A CN115290440 A CN 115290440A CN 202210665206 A CN202210665206 A CN 202210665206A CN 115290440 A CN115290440 A CN 115290440A
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- 238000012360 testing method Methods 0.000 title claims abstract description 183
- 238000010998 test method Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000001502 supplementing effect Effects 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000009863 impact test Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/30—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight
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Abstract
The invention discloses a surface pressure and position precision test-based surface mounting equipment test method, which comprises the following steps: step 1: building a test platform, wherein the test platform comprises an impact force test and a position test; and 2, step: performing an impact force test: testing the surface pressure and the impact force of the component to be tested of a single module; and 3, step 3: and (3) executing position test: performing position test on the component to be tested after the impact force test is performed, and calculating the CPK and CMK of the size and the position precision of the component to be tested; and 4, step 4: completing the test of a single module; and issuing and storing the test report of the single module, and checking whether the test report meets the requirements; and 5: and (5) repeating the processes of the step (2) to the step (4) until all other modules complete the test. Through the scheme, the high-precision quadratic element dynamic pressure testing device integrates the traditional high-precision quadratic element dynamic pressure testing instrument into a whole, realizes simultaneous pressure testing and position precision testing of one machine, and further breaks through the technical use convenience.
Description
Technical Field
The invention relates to the technical field of testing instruments of precision mounting equipment, in particular to a CPK (continuous phase plating) and CMK (constant current clock) integrated testing method of precision mounting equipment based on surface pressure and position precision testing.
Background
The current electronic product is towards lightweight, and the step that integrates is faster and faster, and electronic components and spare part is more and more miniaturized, and each item index of miniaturized and the high integration to the manufacturing process's precision equipment has proposed higher requirement. The controllability of the manufacturing process and the reliability of the long-term use of the precision Mounting Technology (SMT) and System In a Package (SIP) semiconductor will seriously affect the production efficiency and the efficiency of the enterprise. Such as: with the increasing miniaturization of electronic components and higher chip density, silicon chips and devices are increasingly fragile and sensitive to stress, and the mounting pressure needs to be accurately and precisely controlled in the processing of semiconductors and SMT. Therefore, the pressure state and pressure precision of high-sensitivity/micro-pressure equipment are required to be inspected and adjusted widely in the semiconductor and electronic manufacturing industry, and the method is mainly used for pressure inspection, state monitoring and performance evaluation of precision mounting equipment and state adjustment after maintenance of the equipment.
At present, automatic Test Equipment (ATE) for precision Equipment generally is general existing Equipment, a user inputs a corresponding Test sequence into a computer for control testing, and the method belongs to semi-automation.
Disclosure of Invention
The following presents a simplified summary of embodiments of the invention in order to provide a basic understanding of some aspects of the invention. It should be understood that the following summary is not an exhaustive overview of the invention. It is not intended to determine the key or critical elements of the present invention, nor is it intended to limit the scope of the present invention. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.
According to an aspect of the present application, the present invention provides a method of testing a mounter based on surface pressure and position accuracy tests, including:
step 1: building a test platform, wherein the test platform comprises an impact force test and a position test;
and 2, step: performing an impact force test: testing the surface pressure and the impact force of the component to be tested of a single module;
and step 3: and (3) executing position test: performing position test on the component to be tested after the impact force test is performed, and calculating the CPK and CMK of the size and the position precision of the component to be tested;
and 4, step 4: completing the test of a single module; and issuing and storing the test report of the single module, and checking whether the test report meets the requirements;
and 5: and (4) repeating the processes of the step (2) to the step (4) until all other modules complete the test.
Further, in the step 2, the performing of the impact force test specifically includes performing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating a corresponding result parameter.
Further, in the step 3, the CPK and CMK of the size and the position accuracy of the component to be measured are calculated by using a large-area array CMOS camera to perform measurement on the same layer as the high-precision microscope scale in a static measurement mode.
Wherein, the step 2 specifically comprises the following processes:
process 1: adjusting the state of a chip mounter to be tested;
and (2) a process: making a preset test requirement execution program: the mounting program graph is in a triangular shape or a rectangular shape, and the mounting times are 25 devices counted by suction nozzles, and the devices are sequentially mounted; in the mounting process, material throwing and supplementing are not allowed; the height setting of the device is consistent with the feeding material to be tested;
and (3) a process: adjusting the patch data: feeding by a chip mounter, and paying attention to the fact that the thickness of a device is consistent with the program setting; placing a test instrument into the PCB track; adjusting the height of the suction nozzle according to the size of the test instrument to ensure that the height from the suction nozzle to a test area of the test instrument is the same as the height from the suction nozzle to a PCB (printed circuit board) during normal work; inputting the number of suction nozzles and the mounting times, wherein the number of the suction nozzles and the mounting times are the same as the arrangement of the chip mounter;
and 4, process: starting software, starting to record data, and starting to work by the chip mounter; and after the chip mounting of the chip mounter is finished, the tester stores pressure data.
Further, the step 3 of calculating the CPK and the CMK of the size and the position accuracy of the component to be measured specifically includes the following steps: the testing instrument is conveyed to the center of the three-coordinate testing instrument, and the precision of the equipment is measured by using three-dimensional equipment or third-party detection equipment: 0.001-0.003mm, and the values were measured and recorded. Using Minitab Capability Sixpack to calculate; cpk ≧ 1.33, the result is qualified.
Further, test platform includes impact force test and position test, and is specific, test platform includes mechanized test platform and data acquisition system, mechanized test platform includes the testboard, arranges the impact force test unit on the testboard in, data acquisition system includes big area-array CMOS camera, high accurate microscope scale, data acquisition card and computer, the computer is used for handling the data that big area-array CMOS camera, high accurate microscope scale and data acquisition card gathered to carry out surface pressure and impact force test, typical components and parts test analysis and stress analysis.
Furthermore, the impact force test unit comprises an impact force test area arranged on the test board, the upper part of the impact force test area is used for placing components to be tested, a pressure sensor array is arranged below the impact force test area, and the pressure sensor array is in communication connection with the data acquisition card.
Further, the pressure sensor array includes one or more highly sensitive dynamic pressure sensors.
Furthermore, the data acquisition card is realized by adopting a 4-8 channel digital-analog acquisition card, and the 4-8 channel digital-analog acquisition card is a high-speed digital-analog acquisition card with the HZ larger than 1000.
Further, the large-area array CMOS camera meets 5000-1 million pixels.
This application unites two into one traditional high accuracy quadratic element and dynamic pressure (impact force) tester through above-mentioned scheme, has realized that a machine carries out pressure test and position accuracy test simultaneously, can realize further breakthrough on technical use convenience. Meanwhile, the newly designed instrument is small and exquisite, convenient to move and execute, good in software interface and capable of greatly shortening the time of testing the project by an enterprise. In summary, the integrated tester for the precision surface mounting equipment CPK and CMK developed by the application is precision equipment for checking the state of high-sensitivity/micro-pressure equipment, and can be widely applied to the fields of semiconductors, SMT (surface mount technology) patches, solar equipment manufacturing, precision device packaging, military industry and the like.
Detailed Description
The following describes embodiments of the present invention. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The field developed by the application is the field of intelligent manufacturing equipment which is a key breakthrough in China at present, and the technical market monopolizes Germany and Japanese enterprises for nearly 50 years. The successful development of the integrated test equipment plays a positive role in promoting the industry of China, and the project can output a standardized test method and a standardized test instrument on the standardization of acceptance indexes of the equipment and the standardization of equipment maintenance. The standard and the test instrument generated by the application can also be used as a training instrument and a system of each professional college.
The instrument developed at present integrates various means such as photoelectricity, vision, impact force, pressure and the like, and can fill the blank in the domestic current field. In the field to which the present application relates, the leading world technology is the CETIQ instrument in Germany, whose company developed the instrument model FMB-04 specified for use by the equipment manufacturer. But the price is expensive and the service is inconvenient, so the method cannot be popularized in a large scale. The instrument is only used for surface pressure test and does not have XYQ precision measurement and calibration.
Aiming at the surface pressure test and the XYQ position precision test, the operation scheme in the prior art is to test in a workshop A, so that the impact force precision is kept at the current state; then, the test board is taken to the workshop B again to measure the position accuracy, so that the time required by the test is increased, and the efficiency of the production line is influenced.
The application develops precision pastes dress equipment CPK (Process Capability Index), CMK (CMK, machine Capability Index), the integration tester, the main objective is to accomplish the pressure test and the position accuracy test of the precision of pasting dress equipment under high-speed operating condition of semiconductor and SMT trade, accomplish the impact force test to device and base plate on the one hand, on the other hand measures the aassessment to the precision of position coordinate simultaneously, thereby the running state report of once only exporting complete precision and pasting dress equipment, ensure precision and paste dress equipment's stress, the precision is in controllable state, guarantee to paste dress reliability and precision.
Specifically, the invention provides a precision mounting equipment integrated test device capable of simultaneously realizing pressure test and position precision test, which comprises a mechanized test platform and a data acquisition system.
The mechanical testing platform comprises a testing platform and an impact testing unit arranged on the testing platform. The impact force testing unit comprises an impact force testing area arranged on the testing platform, the upper part of the impact force testing area is used for placing a component to be tested, a pressure sensor array is arranged below the impact force testing area, and the pressure sensor array is in communication connection with the data acquisition card. Of course, the impact force test unit further comprises an impact device for performing impact force test on the component to be tested placed on the upper portion of the impact force test area. Wherein the pressure sensor array comprises one or more high-sensitivity dynamic pressure sensors.
The data acquisition system comprises a large-area array CMOS camera, a high-precision microscope scale, a data acquisition card and a computer, wherein the computer is used for processing data acquired by the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card and executing surface pressure and impact force tests, typical component test analysis and stress analysis. The impact force testing unit realizes pressure testing, and the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card realize position precision testing, so that the pressure testing and the position precision testing can be realized by one machine, the testing performance is greatly facilitated, the testing time is shortened, and the efficiency of a production line is improved.
As a feasible scheme, the impact force test area is designed to be 80 × 80mm, 600 tiny components to be tested can be mounted on the impact force test area, impact testing is performed on the components to be tested in the area through impact equipment, the pressure of the pressure sensor array collector is sent to a computer through a data acquisition card for processing, and an impact force test report is generated. The pressure sensor array may be provided with one or more pressure sensors.
In this embodiment, the data acquisition card is implemented by a 4-8 channel digital-analog acquisition card, and the 4-8 channel digital-analog acquisition card is a high-speed digital-analog acquisition card with a height greater than 1000 HZ. Large area array CMOS cameras meet 5000-1 million pixels.
The invention also provides an integrated test method of the precision mounting equipment, which comprises the following steps:
step 1: testing the surface pressure and the impact force of the component to be tested of a single module; executing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating corresponding result parameters;
and 2, step: calculating the CPK and CMK of the size and position precision of the component to be measured in the step 1 by adopting 2.5 dimension measurement;
and 3, step 3: completing the test of a single module; and issuing and storing the test report of the single module, and checking whether the test report meets the requirements; the time of a single module is about 3.5-6 hours;
and 4, step 4: and (4) repeating the processes of the step 1 to the step 3 until all other modules complete the test.
Specifically, in the single module test, all tests can be performed, and a random selection test can also be performed, wherein when the random selection test is performed, a plurality of parts of the same type are divided into a plurality of groups of parts; after the surface mounting equipment finishes mounting of a plurality of parts, at least one part is selected from each group of parts for testing.
Wherein, the step 1 specifically comprises the following processes:
process 1: the chip mounter to be tested adjusts the state (suggesting a new mounting head, a new suction nozzle, flatness adjustment OK of the rail, new Feeder);
and (2) a process: making a preset test requirement execution program: the mounting program graph is in a triangular shape or a rectangular shape, and the mounting times are 25 devices counted by suction nozzles, and the devices are sequentially mounted; in the mounting process, material throwing and supplementing are not allowed; the height setting of the device is consistent with the feeding to be tested;
and 3, process: adjusting the patch data: feeding by a chip mounter, and paying attention to the fact that the thickness of a device is consistent with the program setting; placing a test instrument into the PCB track; adjusting the height of the suction nozzle according to the size of the test instrument to ensure that the height from the suction nozzle to the test area of the test instrument is the same as the height from the suction nozzle to a PCB (the thickness of the PCB on the chip mounter is set to be 2 MM) during normal work; inputting the number of suction nozzles and the mounting times, which are the same as the setting of the chip mounter (such as NXT H24, the number of suction nozzles input 24, the mounting times test input 600, loose D3, the number of suction nozzles input 16, the mounting times test input 400;
and 4, process: starting software, starting to record data, and starting to work the chip mounter at the same time; after the chip mounter finishes chip mounting, the tester stores pressure data;
step 2, calculating the CPK and CMK of the size and position precision of the component to be measured specifically comprises the following processes: the testing instrument is conveyed to the center of the three-coordinate testing instrument, and the precision of the equipment is measured by using three-dimensional equipment or third-party detection equipment: 0.001-0.003mm, and the values were measured and recorded. Using Minitab Capability Sixpack to calculate; cpk ≧ 1.33, the result is qualified.
The application is an integrated innovation, and combines a traditional high-precision quadratic element and a dynamic pressure (impact force) testing instrument into a whole. Further breakthroughs in the ease of use of the technology are expected to be realized. Meanwhile, the newly designed instrument is small and exquisite, convenient to move and execute, and good in software interface, and time for an enterprise to test the project is greatly shortened. The test time for a single device is expected to be reduced from the 24 hour time consumed by conventional foreign devices to 15 minutes.
In addition, the method of the present invention is not limited to be performed in the time sequence described in the specification, and may be performed in other time sequences, in parallel, or independently. Therefore, the order of execution of the methods described in this specification does not limit the technical scope of the present invention.
While the present invention has been disclosed by the description of the specific embodiments thereof, it should be understood that all of the embodiments and examples described above are intended to be illustrative and not restrictive. Various modifications, improvements and equivalents of the invention may be devised by those skilled in the art within the spirit and scope of the appended claims. Such modifications, improvements and equivalents are also intended to be included within the scope of the present invention.
Claims (10)
1. A surface pressure and position precision test-based surface mounting equipment test method is characterized by comprising the following steps: the method comprises the following steps:
step 1: building a test platform, wherein the test platform comprises an impact force test and a position test;
step 2: performing an impact force test: testing the surface pressure and impact force of the component to be tested of the single module;
and step 3: performing a position test: performing position test on the component to be tested after the impact force test is performed, and calculating the CPK and CMK of the size and the position precision of the component to be tested;
and 4, step 4: completing the test of a single module; and issuing and storing the test report of the single module, and checking whether the test report meets the requirements;
and 5: and (4) repeating the processes of the step (2) to the step (4) until all other modules complete the test.
2. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 1, characterized in that: in the step 2, the impact force test is specifically executed by executing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating corresponding result parameters.
3. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 1, characterized in that: in the step 3, the CPK and CMK of the size and position accuracy of the component to be measured are calculated by using a large-area array CMOS camera to perform measurement on the same layer as the high-precision microscope scale in a static measurement mode.
4. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 1, characterized in that: the step 2 specifically comprises the following processes:
process 1: adjusting the state of a chip mounter to be tested;
and (2) a process: making a preset test requirement execution program: the mounting program graph is in a triangular shape or a rectangular shape, and the mounting times are 25 devices counted by suction nozzles, and the devices are sequentially mounted; in the mounting process, material throwing and material supplementing are not allowed; the height setting of the device is consistent with the feeding to be tested;
and 3, process: adjusting the patch data: feeding by a chip mounter, and paying attention to the fact that the thickness of a device is consistent with the program setting; placing a test instrument into the PCB track; adjusting the height of the suction nozzle according to the size of the test instrument, so that the height from the suction nozzle to a test area of the test instrument is the same as the height from the suction nozzle to a PCB (printed circuit board) during normal work; inputting the number of suction nozzles and the mounting times, wherein the number of the suction nozzles and the mounting times are the same as the arrangement of the chip mounter;
and 4, process 4: starting software, starting to record data, and starting to work by the chip mounter; and after the chip mounting of the chip mounter is finished, the tester stores pressure data.
5. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 1, characterized in that: the step 3 of calculating the CPK and the CMK of the size and the position accuracy of the component to be measured specifically comprises the following processes: the testing instrument is conveyed to the center of the three-coordinate testing instrument, and the precision of the equipment is measured by using three-dimensional equipment or third-party detection equipment: 0.001-0.003mm, and the values were measured and recorded. Using Minitab Capability Sixpack to calculate; cpk ≧ 1.33, the result was acceptable.
6. A mounting equipment testing method based on surface pressure and position accuracy test according to claim 1, characterized in that: the testing platform includes impact force test and position test, and is concrete, testing platform includes mechanized testing platform and data acquisition system, mechanized testing platform includes the testboard, arranges the impact force test unit on the testboard in, data acquisition system includes big area-array CMOS camera, high accurate microscope scale, data acquisition card and computer, the computer is used for handling the data that big area-array CMOS camera, high accurate microscope scale and data acquisition card gathered to carry out surface pressure and impact force test, typical components and parts test analysis and stress analysis.
7. A mounting equipment testing method based on surface pressure and position accuracy test according to claim 6, characterized in that: the impact force testing unit comprises an impact force testing area arranged on the testing platform, the upper part of the impact force testing area is used for placing components to be tested, a pressure sensor array is arranged below the impact force testing area, and the pressure sensor array is in communication connection with the data acquisition card.
8. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 7, characterized in that: the pressure sensor array includes one or more highly sensitive dynamic pressure sensors.
9. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 6, characterized in that: the data acquisition card is realized by adopting a 4-8 channel digital-analog acquisition card, and the 4-8 channel digital-analog acquisition card is a high-speed digital-analog acquisition card with the HZ larger than 1000.
10. A mounting apparatus testing method based on surface pressure and position accuracy test according to claim 6, characterized in that: the large-area CMOS camera meets 5000-1 hundred million pixels.
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| CN115695621A (en) * | 2022-12-29 | 2023-02-03 | 昆山市恒达精密机械工业有限公司 | Quality detection and evaluation method and system for mobile phone shell processing |
| CN115695621B (en) * | 2022-12-29 | 2023-05-23 | 昆山市恒达精密机械工业有限公司 | Quality detection and evaluation method and system for mobile phone shell processing |
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