CN115201033B - Integrated testing method for precision placement equipment - Google Patents
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- CN115201033B CN115201033B CN202210665197.5A CN202210665197A CN115201033B CN 115201033 B CN115201033 B CN 115201033B CN 202210665197 A CN202210665197 A CN 202210665197A CN 115201033 B CN115201033 B CN 115201033B
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- 238000012360 testing method Methods 0.000 title claims abstract description 157
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000004458 analytical method Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 9
- 238000010998 test method Methods 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 230000001502 supplementing effect Effects 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000009863 impact test Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/30—Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force, e.g. by falling weight
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/001—Impulsive
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- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
本发明公开一种精密贴装设备一体化测试方法，其包括机械化测试平台以及数据采集系统；机械化测试平台包括测试台和置于测试台上的冲击力测试单元；数据采集系统包括大面阵CMOS相机、高精准显微镜标尺、数据采集卡以及计算机；所述计算机用于对大面阵CMOS相机、高精准显微镜标尺以及数据采集卡采集到的数据进行处理，并执行表面压力与冲击力测试、典型元器件测试分析以及应力分析。本申请通过上述方案，将传统的高精度二次元与动态压力（冲击力)测试仪器合二为一，实现了一台机器同时进行压力测试和位置精度测试，可在技术使用便利性上实现更进一步的突破。The present invention discloses an integrated testing method for precision mounting equipment, which includes a mechanized testing platform and a data acquisition system; the mechanized testing platform includes a test bench and an impact force testing unit placed on the test bench; the data acquisition system includes a large-array CMOS camera, a high-precision microscope scale, a data acquisition card, and a computer; the computer is used to process the data collected by the large-array CMOS camera, the high-precision microscope scale, and the data acquisition card, and perform surface pressure and impact force testing, typical component testing and analysis, and stress analysis. Through the above scheme, the present application combines the traditional high-precision secondary element and dynamic pressure (impact force) testing instruments into one, realizing that one machine can perform pressure testing and position accuracy testing at the same time, which can achieve a further breakthrough in the convenience of technical use.
Description
Technical Field
The invention relates to the technical field of test instruments of precise mounting equipment, in particular to CPK and CMK integrated test equipment and a test method of the precise mounting equipment.
Background
The current electronic products are lighter, the integration pace is faster and faster, electronic components and parts are miniaturized more and more, and the miniaturization and high integration level are in higher requirements on various indexes of precision equipment in the manufacturing process. Manufacturing process controllability and reliability for long-term use of precision equipment (SMT (Surface Mounting Technology, surface mount technology), SIP (SYSTEM IN A PACKAGE, system in package), will seriously affect production efficiency and benefits of enterprises. Such as: as electronic components become smaller and chip density becomes higher, silicon chips and devices become weaker and more sensitive to stress, and precise control of mounting pressure is required in semiconductor and SMT processing. Therefore, there is a wide variety of requirements for inspecting and adjusting the pressure state and pressure accuracy of high-sensitivity micro-pressure equipment in the semiconductor and electronic manufacturing industries, and the requirements are mainly used for inspecting and monitoring the pressure, evaluating the state and evaluating the performance of the precision mounting equipment and adjusting the state of the equipment after maintenance.
At present, for automatic test equipment (Automatic Test Equipment, ATE) of precision equipment, generally general existing equipment, a user inputs a corresponding test sequence into a computer to perform control test, which belongs to semi-automation, and because the existing automatic test equipment is not associated with the precision equipment, the time required for testing is increased, and the efficiency of a production line is affected.
Disclosure of Invention
The following presents a simplified summary of embodiments of the invention in order to provide a basic understanding of some aspects of the invention. It should be understood that the following summary is not an exhaustive overview of the invention. It is not intended to identify key or critical elements of the invention or to delineate the scope of the invention. Its purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.
According to one aspect of the application, the application provides integrated test equipment for precise mounting equipment capable of simultaneously realizing pressure test and position precision test, which comprises a mechanized test platform and a data acquisition system, wherein the mechanized test platform comprises a test bench and an impact force test unit arranged on the test bench, and the data acquisition system comprises a large-area array CMOS camera, a high-precision microscope scale, a data acquisition card and a computer, wherein the computer is used for processing data acquired by the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card and executing surface pressure and impact force test, typical component test analysis and stress analysis. The impact force testing unit realizes pressure testing, the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card realize position precision testing, so that one machine can realize pressure testing and position precision testing simultaneously, testing performance is greatly facilitated, testing time is shortened, and efficiency of a production line is improved.
Further, the impact force testing unit comprises an impact force testing area arranged on the testing table, the upper portion of the impact force testing area is used for placing components to be tested, a pressure sensor array is arranged below the impact force testing area, and the pressure sensor array is in communication connection with the data acquisition card.
Further, the pressure sensor array includes one or more highly sensitive dynamic pressure sensors.
As a possible scheme, the impact force testing area is designed to be 80mm, 600 tiny components to be tested can be mounted on the impact force testing area, impact testing is carried out on the components to be tested in the area through impact equipment, the pressure of the pressure sensor array collector is transmitted to a computer for processing through the data acquisition card, and an impact force testing report is generated. The pressure sensor array may be provided with one or more pressure sensors.
Furthermore, the data acquisition card is realized by adopting a 4-8 channel digital-to-analog acquisition card, and the 4-8 channel digital-to-analog acquisition card is a high-speed digital-to-analog acquisition card with the frequency of more than 1000 HZ.
Further, the large area array CMOS camera satisfies 5000 ten thousand-1 hundred million pixels.
Furthermore, the integrated testing equipment of the precise mounting equipment comprises the following testing method,
Step 1: testing the surface pressure and impact force of the components to be tested of the single module; executing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating corresponding result parameters;
Step 2: CPK and CMK of the size and position precision of the components to be tested in the step 1 are calculated, but the measurement of the same layer with a high-precision microscope scale is carried out by adopting a static measurement mode through a large-area array CMOS camera;
step 3: the test of the single module is completed; and a test report of the single module is sent out and stored, and whether the test report meets the requirements is checked;
step 4: repeating the processes from step 1 to step 3 until all other modules are tested.
Further, the step1 specifically includes the following steps:
Process 1: the chip mounter to be tested adjusts the state (suggesting a new mounting head, a new suction nozzle, a flatness adjustment OK of the track, a new Feeder);
Process 2: making a preset test requirement execution program: the mounting procedure is that the graphics are triangle or rectangle, the mounting times are 25 devices with the suction nozzle number, and the devices are sequentially mounted; in the mounting process, material throwing and material supplementing are not allowed; the device height setting is consistent with the feeding material to be tested;
process 3: and (3) patch data adjustment: feeding by a chip mounter, wherein the thickness of a device is consistent with the program setting; placing the testing instrument in the PCB track; adjusting the height of the suction nozzle according to the size of the testing instrument, so that the height from the suction nozzle to a testing area of the testing instrument is the same as the height from the suction nozzle to the PCB board during normal operation (the thickness of the PCB board on the chip mounter is set to be 2 MM); inputting the number of suction nozzles and the mounting times, which are the same as the setting of the chip mounter (such as NXT H24, the number of suction nozzles input 24, the mounting times test input 600, loosening D3, the number of suction nozzles input 16, the mounting times test input 400;
process 4: starting software, starting to record data, and starting the chip mounter to work; after the chip mounter is finished, the tester stores pressure data.
Further, the step 2 of calculating the CPK and the CMK of the size and the position accuracy of the component to be measured specifically includes the following steps: carrying the test instrument to a three-coordinate test instrument center, and measuring the precision of the equipment by using three-dimensional equipment or third party detection equipment: 0.001-0.003mm, and the values were measured and recorded. Performing Minitab Capability Sixpack operation; cpk ∈ 1.33, and the result was acceptable.
According to the scheme, the traditional high-precision secondary element and dynamic pressure (impact force) testing instrument are combined into one, so that the pressure test and the position precision test are simultaneously carried out by one machine, and further breakthrough in technical use convenience can be realized. Meanwhile, the newly designed instrument is small and exquisite, convenient to move and execute, and good in software interface, and the time for testing the project by an enterprise is greatly shortened. In summary, the integrated CPK and CMK tester for the precise mounting equipment developed by the application is precise equipment for checking the state of high-sensitivity/micro-pressure equipment, and can be widely applied to the fields of semiconductors, SMT patches, solar equipment manufacturing, precise device packaging, military industry and the like.
Detailed Description
Embodiments of the present invention are described below. In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The field developed by the application is the intelligent equipment field which is a major breakthrough in China, and the technical market is monopoly of Germany and Japanese enterprises for nearly 50 years. The successful development of the integrated test equipment plays a positive role in the promotion of the industry in China, and the project can output a standardized test method and a test instrument on the standardization of acceptance indexes of the equipment and the standardization of equipment maintenance. The standard and the test instrument generated by the application can also be used as training instruments and systems of various professional institutions.
The instrument developed at present integrates various means such as photoelectricity, vision, impact force, pressure and the like, and can fill the blank in the current field in China. In the field to which the present application relates, the leading of global technology is CETIQ instruments in germany, whose company developed instrument model FMB-04 was designated for use by equipment manufacturers. But cannot be widely popularized due to expensive price and inconvenient service. The instrument is only used for surface pressure test, and has no XYQ precision measurement and calibration.
Aiming at the surface pressure test and the XYQ position precision test, the working scheme in the prior art is to test in an A workshop, and the impact force precision is kept at a good state; then the test board is taken to the workshop B again, the position accuracy is measured, the time required for testing is increased, and the efficiency of the production line is affected.
The integrated tester mainly aims to finish pressure test and position precision test of the precise mounting equipment in the semiconductor and SMT industries in a high-speed working state, on one hand, finish impact force test of devices and substrates, and on the other hand, measure and evaluate the precision of position coordinates, so that a complete running state report of the precise mounting equipment is output at one time, the stress and the precision of the precise mounting equipment are both in a controllable state, and the reliability and the precision of mounting are ensured.
Specifically, the invention provides integrated testing equipment for precise mounting equipment, which can simultaneously realize pressure testing and position accuracy testing, and comprises a mechanized testing platform and a data acquisition system.
The mechanized test platform comprises a test bench and an impact force test unit arranged on the test bench. The impact force testing unit comprises an impact force testing area arranged on the testing table, the upper part of the impact force testing area is used for placing components to be tested, a pressure sensor array is arranged below the impact force testing area, and the pressure sensor array is in communication connection with the data acquisition card. Of course, the impact force testing unit further comprises impact equipment for performing impact force testing on the component to be tested placed at the upper part of the impact force testing area. Wherein the pressure sensor array comprises one or more highly sensitive dynamic pressure sensors.
The data acquisition system comprises a large-area-array CMOS camera, a high-precision microscope scale, a data acquisition card and a computer, wherein the computer is used for processing data acquired by the large-area-array CMOS camera, the high-precision microscope scale and the data acquisition card and executing surface pressure and impact force tests, typical component test analysis and stress analysis. The impact force testing unit realizes pressure testing, the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card realize position precision testing, so that one machine can realize pressure testing and position precision testing simultaneously, testing performance is greatly facilitated, testing time is shortened, and efficiency of a production line is improved.
As a feasible scheme, the impact force testing area is designed to be 80mm, 600 tiny components to be tested can be mounted on the impact force testing area, impact testing is carried out on the components to be tested in the area through impact equipment, the pressure of the pressure sensor array collector is transmitted to a computer for processing through a data acquisition card, and an impact force testing report is generated. The pressure sensor array may be provided with one or more pressure sensors.
In the embodiment, the data acquisition card is realized by a 4-8 channel digital-analog acquisition card, and the 4-8 channel digital-analog acquisition card is a high-speed digital-analog acquisition card with the frequency of more than 1000 HZ. The large area array CMOS camera satisfies 5000 ten thousand-1 hundred million pixels.
The invention also provides a testing method of the integrated testing equipment of the precise mounting equipment, which comprises the following steps:
step 1: testing the surface pressure and impact force of the components to be tested of the single module; executing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating corresponding result parameters;
Step 2: CPK and CMK of the size and position precision of the components to be tested in the step 1 are calculated, but the measurement of the same layer with a high-precision microscope scale is carried out by adopting a static measurement mode through a large-area array CMOS camera;
Step 3: the test of the single module is completed; and a test report of the single module is sent out and stored, and whether the test report meets the requirements is checked; the time spent for a single module is about 3.5-6 hours;
step 4: repeating the processes from step 1 to step 3 until all other modules are tested.
Specifically, in a single module test, all the tests can be performed, or a random selection test can be performed, and when the random selection test is performed, a plurality of parts of the same type are divided into a plurality of groups of parts; after the surface mounting equipment finishes the mounting of a plurality of parts, at least one part in each group of parts is selected for testing.
The step 1 specifically comprises the following steps:
Process 1: the chip mounter to be tested adjusts the state (suggesting a new mounting head, a new suction nozzle, a flatness adjustment OK of the track, a new Feeder);
Process 2: making a preset test requirement execution program: the mounting procedure is that the graphics are triangle or rectangle, the mounting times are 25 devices with the suction nozzle number, and the devices are sequentially mounted; in the mounting process, material throwing and material supplementing are not allowed; the device height setting is consistent with the feeding material to be tested;
process 3: and (3) patch data adjustment: feeding by a chip mounter, wherein the thickness of a device is consistent with the program setting; placing the testing instrument in the PCB track; adjusting the height of the suction nozzle according to the size of the testing instrument, so that the height from the suction nozzle to a testing area of the testing instrument is the same as the height from the suction nozzle to the PCB board during normal operation (the thickness of the PCB board on the chip mounter is set to be 2 MM); inputting the number of suction nozzles and the mounting times, which are the same as the setting of the chip mounter (such as NXT H24, the number of suction nozzles input 24, the mounting times test input 600, loosening D3, the number of suction nozzles input 16, the mounting times test input 400;
Process 4: starting software, starting to record data, and starting the chip mounter to work; after the surface mounting of the surface mounting machine is finished, the tester stores pressure data;
And step 2, calculating CPK and CMK of the size and position precision of the component to be measured specifically comprises the following steps: carrying the test instrument to a three-coordinate test instrument center, and measuring the precision of the equipment by using three-dimensional equipment or third party detection equipment: 0.001-0.003mm, and the values were measured and recorded. Performing Minitab Capability Sixpack operation; cpk ∈ 1.33, and the result was acceptable.
The application is an integrated innovation, and combines the traditional high-precision two-dimensional element and a dynamic pressure (impact force) testing instrument. Further breakthroughs in technical ease of use are expected. Meanwhile, the newly designed instrument is small and exquisite, convenient to move and execute, and good in software interface, and the time for testing the project by an enterprise is greatly shortened. It is expected that the test time of a single piece of equipment will be reduced from 24 hours for conventional foreign equipment to 15 minutes.
It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components.
While the invention has been disclosed in the context of specific embodiments, it should be understood that all embodiments and examples described above are illustrative rather than limiting. Various modifications, improvements, or equivalents of the invention may occur to persons skilled in the art and are within the spirit and scope of the following claims. Such modifications, improvements, or equivalents are intended to be included within the scope of this invention.
Claims (5)
1. The integrated testing method for the precise mounting equipment is characterized by comprising the following steps of: the integrated testing method of the precise mounting equipment is applied to integrated testing equipment of the precise mounting equipment, and the integrated testing equipment of the precise mounting equipment comprises a mechanized testing platform and a data acquisition system;
The mechanical test platform comprises a test table and an impact force test unit arranged on the test table;
The data acquisition system comprises a large area array CMOS camera, a high-precision microscope scale, a data acquisition card and a computer; the computer is used for processing the data acquired by the large-area array CMOS camera, the high-precision microscope scale and the data acquisition card, and executing surface pressure and impact force test, typical component test analysis and stress analysis;
The impact force testing unit comprises an impact force testing area arranged on the testing table, the upper part of the impact force testing area is used for placing components to be tested, a pressure sensor array is arranged below the impact force testing area, and the pressure sensor array is in communication connection with the data acquisition card;
the integrated test method of the precise mounting equipment comprises the following steps:
Step 1: testing the surface pressure and impact force of the components to be tested of the single module; executing a program according to a preset test requirement through a data acquisition card and a pressure sensor array, and calculating corresponding result parameters; the step 1 specifically comprises the following steps:
Process 1: the chip mounter to be tested is adjusted to be in good state;
Process 2: making a preset test requirement execution program: the mounting procedure is that the graphics are triangle or rectangle, the mounting times are 25 devices with the suction nozzle number, and the devices are sequentially mounted; in the mounting process, material throwing and material supplementing are not allowed; the device height setting is consistent with the feeding material to be tested;
Process 3: and (3) patch data adjustment: feeding by a chip mounter, wherein the thickness of a device is consistent with the program setting; placing the testing instrument in the PCB track; adjusting the height of the suction nozzle according to the size of the testing instrument, so that the height from the suction nozzle to a testing area of the testing instrument is the same as the height from the suction nozzle to the PCB during normal operation; the number of suction nozzles and the mounting times are input, the device is arranged the same as a chip mounter;
Process 4: starting software, starting to record data, and starting the chip mounter to work; after the surface mounting of the surface mounting machine is finished, the tester stores pressure data;
Step 2: CPK and CMK calculation of the size and position precision of the components to be detected in the step 1 are carried out on the same layer of measurement with a high-precision microscope scale by adopting a static measurement mode through a large-area array CMOS camera;
step 3: the test of the single module is completed; and a test report of the single module is sent out and stored, and whether the test report meets the requirements is checked;
step 4: repeating the processes from step 1 to step 3 until all other modules are tested.
2. The integrated test method for precise mounting equipment according to claim 1, wherein: the pressure sensor array includes one or more high sensitivity dynamic pressure sensors.
3. The integrated test method for precise mounting equipment according to claim 1, wherein: the data acquisition card is realized by adopting a 4-8 channel digital-analog acquisition card.
4. The integrated test method for precise mounting equipment according to claim 1, wherein: the large area array CMOS camera satisfies 5000 ten thousand-1 hundred million pixels.
5. The integrated test method for precise mounting equipment according to claim 1, wherein: the step 2 of calculating the CPK and the CMK of the size and the position precision of the component to be measured specifically comprises the following steps: carrying the test instrument to a three-coordinate test instrument center, and measuring the precision of the equipment by using three-dimensional equipment or third party detection equipment: 0.001-0.003mm, and the values were measured and recorded.
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