CN115241105B - Integrated circuit production and processing equipment for computer - Google Patents
Integrated circuit production and processing equipment for computer Download PDFInfo
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- CN115241105B CN115241105B CN202210861913.7A CN202210861913A CN115241105B CN 115241105 B CN115241105 B CN 115241105B CN 202210861913 A CN202210861913 A CN 202210861913A CN 115241105 B CN115241105 B CN 115241105B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000012545 processing Methods 0.000 title claims abstract description 17
- 238000011068 loading method Methods 0.000 claims abstract description 113
- 238000007789 sealing Methods 0.000 claims abstract description 49
- 238000005303 weighing Methods 0.000 claims abstract description 38
- 239000011261 inert gas Substances 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 11
- 238000003860 storage Methods 0.000 claims abstract description 5
- 238000000926 separation method Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 65
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
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- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
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- 230000005484 gravity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses integrated circuit production and processing equipment for a computer, which comprises a carrier seat, wherein an inflatable seat is fixedly arranged on the carrier seat and is connected to an inert gas storage tank in the carrier seat through a conveying pipe, a loading seat is fixedly arranged on the inflatable seat, a separated loading part and a sealing part are arranged in the loading seat, positioning and fixing of round crystals are carried out through the separated loading part, sealing of a loading seat space is carried out through the sealing part, a starting switch of the sealing part is positioned below the separated loading part, the height of the starting switch is adjusted through an adjusting structure on the carrier seat, and the bottom of the separated loading part is provided with a balanced weighing structure; the integrated circuit production and processing equipment is used for safely transferring the wafer, can realize the effects of automatic sealing and inert gas protection after a certain amount of wafer is loaded, and can automatically adjust the loading capacity according to actual production requirements.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to integrated circuit production and processing equipment for a computer.
Background
As integrated circuits are applied, new developments in computers, i.e., miniaturization of computers, are emerging. The development of integrated circuits is benefited from the development of semiconductor industry, which belongs to micro-electronic devices, and is a circuit with specific functions, wherein a certain number of common electronic elements, such as resistors, capacitors, transistors and the like, and connecting wires between the elements are integrated together through a semiconductor process.
The main carrier of the integrated circuit is a wafer, and the common integrated circuit preparation flow is as follows: wafer fabrication, deposition, lithography, etching, ion implantation, thermal processing, chemical mechanical polishing, wafer inspection, wafer probe testing, packaging, and finished product testing. It is seen that the fabrication process of integrated circuits begins with wafer fabrication and that frequent wafer transfers are required during the process.
At present, most wafers are loaded by using a wafer carrier (FOUP), so that the convenience in transportation is improved and the cleanliness is maintained, and some inert gas is introduced into the wafer carrier, so that the possibility of oxidization in storage is reduced. However, the conventional wafer carrier mechanism is difficult to coordinate the filling time of inert gas, manual intervention is usually required, the carrier mechanism is manually closed, and an inflation switch is opened, so that the working efficiency is low. Moreover, the closed structure of the manual opening and closing carrier is easy to have air leakage points, so that inert gas is leaked.
Disclosure of Invention
The invention aims to provide integrated circuit production and processing equipment for a computer, so as to achieve the purposes of automatically sealing and protecting a wafer and controlling sealing time, and solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an integrated circuit production and processing equipment for computer, includes the carrier seat, fixed mounting has the seat of aerifing on the carrier seat, and aerifys the seat and pass through the conveyer pipe and connect on the inert gas storage tank in the carrier seat, fixed mounting has the loading seat on the seat of aerifing, be provided with separation loading part and closure part on the loading seat, carry out the location of circle crystal fixedly through separation loading part, and carry out the sealing in loading seat space through closure part, closure part's start switch is located separation loading part's below, and start switch's height is adjusted through the regulation structure on the carrier seat, separation loading part's bottom sets up to balance weighing structure, changes balance weighing structure and start switch's contact position through adjusting start switch's height, reaches the effect of closure part self-sealing loading seat behind the ration loading wafer.
Preferably, the separation loading part comprises loading sheets arranged in a loading seat, a bottom plate is fixedly connected to the loading sheets, a bottom bracket is slidably arranged on the bottom plate, a rotating arm is rotatably arranged on the bottom bracket, a limiting clamp is fixedly arranged on the rotating arm, a supporting spring is fixedly connected to the bottom bracket, and the supporting spring is connected to the balance weighing structure.
Preferably, the loading sheets are arranged at equal intervals, a limiting space is formed between adjacent loading sheets for loading the wafer, the bottom plate is arranged at the bottom of the loading sheets, the bottom support is slidably arranged in the through groove of the bottom plate, the rotating arms are arranged at two sides of the bottom support, and the limiting clamps are arranged at the ends of the rotating arms.
Preferably, the balance weighing structure comprises a balance spring fixedly connected to the bottom of the loading seat, and the balance spring is provided with at least four balance springs for balancing and supporting the weighing plate, and the support springs are connected to the top surface of the weighing plate.
Preferably, the bottom of the loading seat is slidably provided with a ramp plate, a return spring is fixedly connected to the ramp plate, the starting switch is supported through the ramp plate, and the height of the starting switch depends on the horizontal position of the ramp plate.
Preferably, the adjusting structure comprises a bracket fixedly arranged on the carrying seat, an adjusting rod is slidably arranged on the bracket, a control handle is fixedly connected to the adjusting rod, a scale and a positioning groove are arranged on the adjusting rod, and the adjusting rod is positioned through a positioning piece on the bracket.
Preferably, the rack is fixedly installed on the adjusting rod, the rack is meshed with the gear, the gear is coaxially connected with the winding disc, the gear and the mounting shaft of the winding disc are rotatably installed on the inflation seat, the driving rope is arranged on the winding disc, and the driving rope is fixedly connected to the ramp plate.
Preferably, the sealing part comprises a top cover and a front baffle cover which are arranged on the loading seat through a driving shaft, the loading seat is provided with a sealing strip in sealing connection with the top cover, the front baffle cover is provided with a sealing sleeve in sealing connection with the loading seat, and the driving shafts of the top cover and the front baffle cover are controlled through a starting switch.
Preferably, the top cover is fixedly provided with an absorbing part, the front baffle cover is provided with a sleeve, the absorbing part adopts an electromagnetic block, the sleeve adopts a magnetic part to carry out self-absorption connection of the top cover and the absorbing part, the absorbing part is controlled by an inductor, the top cover is provided with a baffle strip, the front baffle cover is connected with the baffle strip through a connecting sleeve, the connecting sleeve is provided with an inflatable strip, the inflatable strip is connected with an air bag through a pipeline, the top cover is provided with a pressing plate to extrude the air bag, and the air bag is an elastic air bag.
Compared with the prior art, the invention has the beneficial effects that:
1. the integrated circuit production and processing equipment is used for safely transferring the wafer, can realize the effects of automatic sealing and inert gas protection after a certain amount of wafer is loaded, can autonomously adjust the loading capacity according to actual production requirements, determine the sealing and protection time, improve the wafer transportation efficiency and effectively prevent inert gas leakage;
2. according to the invention, the loading seat is mainly used for positioning and fixing the wafer through separating the loading parts, an independent loading space can be formed, the wafer is prevented from shaking and collision, the bottom of the loading piece is provided with the movable collet, the limiting clamps on the loading piece can be automatically clamped on the wafer from two sides to prevent the wafer from rotating accidentally, meanwhile, the weight of the wafer can act on the collet and then be transferred to the balance weighing structure for weight accumulation, when the number of the wafer reaches a certain degree, the balance weighing structure triggers the starting switch, the balance weighing structure can balance the weight of the wafer, and in the process of gradually increasing the wafer, the weighing plate gradually moves downwards until the weighing plate is in contact connection with the starting switch for triggering the sealing part;
3. according to the invention, the height of the starting switch can be controlled by moving the ramp plate, so that the limit number of the wafers in the loading seat is changed, the contact between the weighing plate and the starting switch accords with the human expectation, after a certain amount of wafers are loaded, the starting switch is opened, the loading seat is further closed through the closing part, the inert gas is conveniently filled into the loading seat by the inflating seat, the position of the ramp plate is controlled by the adjusting structure, and the adjustment is very convenient;
4. the sealing part of the invention can automatically seal the loading seat, the top cover and the front baffle cover are driven to rotate by the driving shaft, the top cover firstly covers the top of the loading seat to finish sealing, then the front baffle cover covers the front surface of the loading seat and is connected with the top cover to finish sealing, the front baffle cover and the top cover also have self-priming function, when the sensor detects that the front baffle cover is close to the top cover, the sensor can electrify the adsorption part to generate magnetic attraction force to act on the suite, the front baffle cover is tightly adsorbed on the top cover, the air bag on the front baffle cover can be compressed by the pressing plate, and gas is sent into the inflatable strip, so that the inflatable strip is inflated, the gap between the connecting sleeve and the baffle strip is eliminated, and a better sealing effect is achieved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a first schematic view of the present invention in an open state;
FIG. 3 is a second schematic view of the present invention in an open state;
FIG. 4 is a schematic view of a loader seat structure according to the present invention;
FIG. 5 is a second schematic view of the loader seat structure of the present invention;
FIG. 6 is a schematic view of the loading state of the present invention;
FIG. 7 is a schematic view of a spacing structure of the present invention;
FIG. 8 is a schematic view of a loading structure of the present invention;
FIG. 9 is a schematic view of an adjustment structure of the present invention;
fig. 10 is a schematic view of a closure structure of the present invention.
In the figure: carrier 1, inflation seat 2, delivery tube 3, carrier 4, loading piece 5, bottom plate 6, shoe 7, rotating arm 8, stopper 9, supporting spring 10, weighing plate 11, balance spring 12, return spring 13, ramp plate 14, start switch 15, bracket 16, adjusting lever 17, control handle 18, scale 19, positioning groove 20, positioning piece 21, rack 22, gear 23, take-up reel 24, drive rope 25, top cover 26, front cover 27, sealing strip 28, sealing sleeve 29, adsorbing piece 30, sleeve 31, inductor 32, barrier 33, connecting sleeve 34, air-expanding strip 35, air bag 36, and pressing plate 37.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, under the precondition of no conflict, new embodiments can be formed by any combination of the embodiments or technical features described below, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 10, the present invention provides a technical solution: the utility model provides an integrated circuit production and processing equipment for computer, including carrier seat 1, fixed mounting has on carrier seat 1 to aerify seat 2, and aerify seat 2 and pass through conveyer pipe 3 and connect on the inert gas storage tank in carrier seat 1, fixedly mounting has on aerify seat 2 to load seat 4, be provided with separation loading part and closure part in the loading seat 4, carry out the location of wafer through separation loading part and fix, and carry out the sealing in loading seat 4 space through closure part, closure part's start switch 15 is located separation loading part's below, and start switch 15's height is adjusted through the regulation structure on carrier seat 1, separation loading part's bottom sets up to balance weighing structure, change balance weighing structure and start switch 15's contact position through adjusting start switch 15's height, reach quantitative loading wafer back closure part self-sealing loading seat 4's effect.
The integrated circuit production and processing equipment is mainly used for safely transferring the wafer, can realize the effects of automatically sealing and protecting inert gas after a certain amount of wafer is loaded, can automatically adjust the loading capacity according to actual production requirements, determines the sealing and protecting time, improves the wafer transportation efficiency, and effectively prevents inert gas leakage;
the separated loading part comprises loading sheets 5 which are arranged and installed in a loading seat 4, a bottom plate 6 is fixedly connected to the loading sheets 5, a bottom bracket 7 is slidably installed on the bottom plate 6, a rotating arm 8 is rotatably installed on the bottom bracket 7, a limiting clamp 9 is fixedly installed on the rotating arm 8, a supporting spring 10 is fixedly connected to the bottom bracket 7, and the supporting spring 10 is connected to a balance weighing structure;
the loading seat 4 is mainly used for positioning and fixing the wafer by separating the loading parts, and can form an independent loading space to prevent the wafer from shaking and collision;
the loading sheets 5 are arranged at equal intervals, a limiting space is formed between the adjacent loading sheets 5 for loading the wafer, the bottom plate 6 is arranged at the bottom of the loading sheets 5, the bottom support 7 is slidably arranged in the through groove of the bottom plate 6, the rotating arms 8 are arranged at two sides of the bottom support 7, and the limiting clamps 9 are arranged at the end parts of the rotating arms 8;
the wafer is placed between the two loading sheets 5, the two loading sheets 5 are separated, the bottom of each loading sheet 5 is provided with a movable bottom support 7, the bottom of each loading sheet is pressed on each bottom support 7 after the wafer is loaded, so that when the bottom support 7 moves downwards, the rotating arms 8 on the bottom supports 7 are pressed by the bottom plates 6 to rotate, the limiting clamps 9 on the rotating arms can be clamped on the wafer from two sides, accidental rotation of the wafer is prevented, meanwhile, the weight of the wafer can act on the bottom support 7 and then is transferred to the balance weighing structure to accumulate the weight, and when the number of the wafer reaches a certain degree, the balance weighing structure triggers the starting switch 15;
the balance weighing structure comprises balance springs 12 fixedly connected to the bottom of the loading seat 4, at least four balance springs 12 are arranged, balance supporting of the weighing plate 11 is performed, and the supporting springs 10 are connected to the top surface of the weighing plate 11;
the balance weighing structure can balance the gravity of the wafer, and in the process of gradually increasing the wafer, the weighing plate 11 gradually moves downwards until the weighing plate 11 is in contact connection with the starting switch 15, so as to trigger the sealing part;
the bottom of the loading seat 4 is slidably provided with a ramp plate 14, the ramp plate 14 is fixedly connected with a return spring 13, a start switch 15 is supported by the ramp plate 14, and the height of the start switch 15 depends on the horizontal position of the ramp plate 14;
according to actual needs, the height of the starting switch 15 can be controlled by moving the ramp plate 14, so that the limit number of the wafers in the loading seat 4 is changed, the contact between the weighing plate 11 and the starting switch 15 accords with the artificial expectation, after a certain amount of wafers are loaded, the starting switch 15 is opened, the loading seat 4 is further closed through the closing part, and the inert gas is conveniently filled into the loading seat 4 by the inflating seat 2;
the adjusting structure comprises a bracket 16 fixedly arranged on the carrying seat 1, an adjusting rod 17 is slidably arranged on the bracket 16, a control handle 18 is fixedly connected to the adjusting rod 17, a scale 19 and a positioning groove 20 are arranged on the adjusting rod 17, and the adjusting rod 17 is positioned through a positioning piece 21 on the bracket 16;
the position of the ramp plate 14 is controlled by an adjusting structure, the control position of the adjusting structure is positioned at the rear part of the carrier seat 1 and is positioned at the pushing position of the carrier seat 1, and the adjusting structure can be controlled more conveniently while the carrier seat 1 is moved;
a rack 22 is fixedly arranged on the adjusting rod 17, the rack 22 is meshed with a gear 23, the gear 23 is coaxially connected with a winding disc 24, the gear 23 and the mounting shaft of the winding disc 24 are rotatably arranged on the inflatable seat 2, a driving rope 25 is arranged on the winding disc 24, and the driving rope 25 is fixedly connected on the ramp plate 14;
during adjustment, the control handle 18 moves the adjusting rod 17 to drive the rack 22 on the adjusting rod to move, so that the gear 23 rotates to drive the rolling disc 24 to rotate, and the rolling disc 24 can pull the driving rope 25 to drive the ramp plate 14 to move, thereby achieving the effect of adjusting the height of the starting switch 15;
the sealing part comprises a top cover 26 and a front baffle cover 27 which are arranged on the loading seat 4 through a driving shaft, the loading seat 4 is provided with a sealing strip 28 which is in sealing connection with the top cover 26, the front baffle cover 27 is provided with a sealing sleeve 29 which is in sealing connection with the loading seat 4, and the driving shafts of the top cover 26 and the front baffle cover 27 are controlled through a starting switch 15;
when the start switch 15 is opened, the closing part can be started, the top cover 26 and the front baffle cover 27 are driven to rotate by the driving shaft, the top cover 26 firstly covers the top of the loading seat 4 to finish sealing, and then the front baffle cover 27 covers the front surface of the loading seat 4 and is connected with the top cover 26 to finish sealing;
the absorbing piece 30 is fixedly arranged on the top cover 26, the sleeve piece 31 is arranged on the front baffle cover 27, the absorbing piece 30 adopts an electromagnetic block, the sleeve piece 31 adopts a magnetic piece to carry out self-absorption connection of the top cover 26 and the absorbing piece 30, the absorbing piece 30 is controlled by the sensor 32, the baffle strip 33 is arranged on the top cover 26, the front baffle cover 27 is connected with the baffle strip 33 by the connecting sleeve 34, the air expansion strip 35 is arranged in the connecting sleeve 34, the air expansion strip 35 is connected with the air bag 36 by a pipeline, the top cover 26 is provided with the pressing plate 37 to extrude the air bag 36, and the air bag 36 is an elastic air bag;
the front baffle cover 27 and the top cover 26 also have self-priming functions, when the sensor 32 detects that the front baffle cover 27 is close to the top cover 26, the adsorbing piece 30 can be electrified to generate magnetic attraction to act on the sleeve 31, the front baffle cover 27 is tightly adsorbed on the top cover 26, the air bag 36 on the front baffle cover 27 can be compressed by the pressing plate 37, and air is fed into the inflatable strip 35, so that the inflatable strip 35 is inflated, a gap between the connecting sleeve 34 and the baffle strip 33 is eliminated, and a better sealing effect is achieved;
the invention is used when in use: firstly, the integrated circuit production and processing equipment is mainly used for safely transferring wafer wafers, can realize the effects of automatic sealing and inert gas protection after a certain amount of wafer wafers are loaded, can autonomously adjust the loading capacity according to actual production requirements, determine the sealing and protecting time, improve the wafer transportation efficiency, effectively prevent inert gas leakage, and the loading seat 4 is mainly used for positioning and fixing the wafer wafers by separating the loading part, can form independent loading space and prevent the wafer wafers from shaking and collision, places the wafer wafers between two loading sheets 5, separates the two loading sheets 5 by the loading sheets 5, and is provided with a movable bottom bracket 7 at the bottom of the loading sheet 5, the bottom of the wafer wafers is pressed on the bottom bracket 7 after being loaded, so that the bottom bracket 7 moves downwards and simultaneously a rotating arm 8 on the bottom bracket 7 receives the extrusion of a bottom plate 6 to rotate, the limiting clamps 9 can clamp the wafer from two sides to prevent the wafer from rotating accidentally, meanwhile, the weight of the wafer can act on the base 7 and then be transferred to the balance weighing structure to accumulate the weight, when the number of the wafer reaches a certain degree, the balance weighing structure triggers the starting switch 15, the balance weighing structure can balance the weight of the wafer, in the process of gradually increasing the wafer, the weighing plate 11 gradually moves downwards until the weighing plate 11 is in contact connection with the starting switch 15 to trigger the sealing part, and according to actual needs, the height of the starting switch 15 can be controlled by moving the ramp plate 14 to change the limiting number of the wafer in the loading seat 4, so that the contact of the weighing plate 11 and the starting switch 15 accords with the human expectation, after a certain amount of wafer is loaded, the starting switch 15 is opened, the loading seat 4 is further sealed through the sealing part, inert gas is conveniently inflated into the loading seat 4 through the inflation seat 2, the position of the ramp plate 14 is controlled through the adjusting structure, during adjustment, the adjusting rod 17 is moved through the control handle 18, the rack 22 on the adjusting rod is driven to move, the gear 23 is driven to rotate, the rolling disc 24 is driven to rotate, the driving rope 25 can be pulled by the rolling disc 24, thereby the ramp plate 14 is driven to move, the effect of adjusting the height of the starting switch 15 is achieved, after the starting switch 15 is opened, the sealing part can be started, the top cover 26 and the front baffle cover 27 are driven to rotate through the driving shaft, the top cover 26 is firstly covered on the top of the loading seat 4 to finish sealing, then the front baffle cover 27 and the top cover 26 are connected with the top cover 26 to finish sealing, when the sensor 32 detects that the front baffle cover 27 is close to the top cover 26, the magnetic attraction force is generated on the sleeve 31, the front baffle cover 27 is adsorbed on the top cover 26, the air bag 36 on the front baffle cover 27 can be further compressed to be better than the air bag 37 on the top cover 27, and the expansion strips 35 can be better removed, and the expansion strips 35 are compressed, and the expansion strips are further removed, and the expansion strips are better 33 are inflated, and the expansion strips are expanded.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but various modifications can be made by those skilled in the art without inventive effort from the above concepts, and all modifications are within the scope of the present invention.
Claims (4)
1. The utility model provides an integrated circuit production and processing equipment for computer, includes carrier seat (1), fixed mounting has on carrier seat (1) to aerify seat (2), and aerify seat (2) and connect on the inert gas storage tank in carrier seat (1) through conveyer pipe (3), fixed mounting has on aerify seat (2) and load seat (4), its characterized in that: the device is characterized in that a separated loading part and a closed part are arranged in the loading seat (4), the separated loading part is used for positioning and fixing the wafer, the closed part is used for sealing the space of the loading seat (4), a starting switch (15) of the closed part is positioned below the separated loading part, the height of the starting switch (15) is adjusted through an adjusting structure on the loading seat (1), the bottom of the separated loading part is provided with a balanced weighing structure, the contact position between the balanced weighing structure and the starting switch (15) is changed by adjusting the height of the starting switch (15), and the effect of automatically closing the loading seat (4) by the closed part after quantitatively loading the wafer is achieved;
the separation loading part comprises loading sheets (5) which are arranged and installed in a loading seat (4), a bottom plate (6) is fixedly connected to the loading sheets (5), a bottom bracket (7) is slidably installed on the bottom plate (6), a rotating arm (8) is rotatably installed on the bottom bracket (7), a limiting clamp (9) is fixedly installed on the rotating arm (8), a supporting spring (10) is fixedly connected to the bottom bracket (7), and the supporting spring (10) is connected to a balance weighing structure;
the balance weighing structure comprises balance springs (12) fixedly connected to the bottom of a loading seat (4), at least four balance springs (12) are arranged to balance and support a weighing plate (11), the support springs (10) are connected to the top surface of the weighing plate (11), a ramp plate (14) is slidably arranged at the bottom of the loading seat (4), a reset spring (13) is fixedly connected to the ramp plate (14), the starting switch (15) is supported through the ramp plate (14), and the height of the starting switch (15) depends on the horizontal position of the ramp plate (14);
the utility model provides an adjusting structure is including support (16) of fixed mounting on carrier (1), and slidable mounting has regulation pole (17) on support (16), fixedly connected with control handle (18) on adjusting pole (17), and be provided with scale (19) and constant head tank (20) on adjusting pole (17), carry out the location of adjusting pole (17) through setting element (21) on support (16), fixed mounting has rack (22) on adjusting pole (17), and rack (22) meshing is on gear (23), gear (23) coaxial coupling has rolling dish (24), and the installation axle rotation of gear (23) and rolling dish (24) is installed on inflatable seat (2), be provided with drive rope (25) on rolling dish (24), and drive rope (25) fixed connection is on ramp board (14).
2. The integrated circuit production and processing apparatus for a computer according to claim 1, wherein: the loading pieces (5) are arranged at equal intervals, a limiting space is formed between every two adjacent loading pieces (5) for loading the wafer, the bottom plate (6) is arranged at the bottom of the loading piece (5), the bottom support (7) is slidably arranged in the through groove of the bottom plate (6), the rotating arms (8) are arranged on two sides of the bottom support (7), and the limiting clamps (9) are arranged at the end parts of the rotating arms (8).
3. The integrated circuit production and processing apparatus for a computer according to claim 1, wherein: the sealing part comprises a top cover (26) and a front blocking cover (27), wherein the top cover (26) and the front blocking cover (27) are arranged on the loading seat (4) through a driving shaft, the loading seat (4) is provided with a sealing strip (28) in sealing connection with the top cover (26), the front blocking cover (27) is provided with a sealing sleeve (29) in sealing connection with the loading seat (4), and the driving shafts of the top cover (26) and the front blocking cover (27) are controlled through a starting switch (15).
4. A computer integrated circuit production and processing apparatus according to claim 3, wherein: the utility model discloses a novel air conditioner is characterized in that an absorbing part (30) is fixedly installed on a top cover (26), a sleeve member (31) is arranged on a front retaining cover (27), an electromagnetic block is adopted by the absorbing part (30), a magnetic part is adopted by the sleeve member (31), self-absorption connection of the top cover (26) and the absorbing part (30) is carried out, the absorbing part (30) is controlled through an inductor (32), a retaining strip (33) is arranged on the top cover (26), the front retaining cover (27) is connected with the retaining strip (33) through a connecting sleeve (34), an air expansion strip (35) is arranged in the connecting sleeve (34), an air bag (36) is connected with the air bag (35) through a pipeline, a pressing plate (37) is arranged on the top cover (26) to extrude the air bag (36), and the air bag (36) is an elastic air bag.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210861913.7A CN115241105B (en) | 2022-07-21 | 2022-07-21 | Integrated circuit production and processing equipment for computer |
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| CN202210861913.7A CN115241105B (en) | 2022-07-21 | 2022-07-21 | Integrated circuit production and processing equipment for computer |
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| CN115241105A CN115241105A (en) | 2022-10-25 |
| CN115241105B true CN115241105B (en) | 2023-05-16 |
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| CN110491812A (en) * | 2019-09-25 | 2019-11-22 | 沈阳芯达半导体设备有限公司 | A kind of high-cleanness, high semiconductor crystal wafer automatic loading device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH11238777A (en) * | 1998-02-23 | 1999-08-31 | Mitsubishi Electric Corp | Cassette carrier and cassette carrier system provided therewith |
| DE10213885B4 (en) * | 2002-03-27 | 2006-10-12 | Infineon Technologies Ag | Plant for processing a semiconductor wafer and method for operating such a plant |
| JP3925918B2 (en) * | 2002-09-30 | 2007-06-06 | 正 上村 | FOUP gas replacement device |
| JP4845916B2 (en) * | 2008-03-27 | 2011-12-28 | 信越ポリマー株式会社 | Semiconductor wafer mapping method |
| JP6268425B2 (en) * | 2013-07-16 | 2018-01-31 | シンフォニアテクノロジー株式会社 | EFEM, load port, wafer transfer method |
| CN106384724B (en) * | 2016-11-23 | 2023-06-13 | 北京元创中联科技有限公司 | Automatic wafer loading equipment |
| KR102359048B1 (en) * | 2017-09-01 | 2022-02-08 | 가부시키가이샤 코쿠사이 엘렉트릭 | Substrate processing apparatus, semiconductor device manufacturing method and program |
| CN211198267U (en) * | 2019-11-16 | 2020-08-07 | 湖南中智信息科技有限公司 | Monitoring device for elevator |
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| CN110491812A (en) * | 2019-09-25 | 2019-11-22 | 沈阳芯达半导体设备有限公司 | A kind of high-cleanness, high semiconductor crystal wafer automatic loading device |
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