Detailed Description
The technical solutions of the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the present application, fall within the scope of protection of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The signal processing method, the signal processing device and the mobile device provided by the embodiment of the application are described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.
The embodiment of the application firstly provides a signal processing method, which can be applied to mobile devices such as mobile phones, tablet computers, notebook computers, wearable intelligent devices (such as intelligent watches), augmented reality (augmented reality, AR)/Virtual Reality (VR) devices, vehicle-mounted devices and the like which can communicate by adopting an MIPI interface, and the embodiment of the application is not limited in any way.
The MIPI interface may be employed between circuit elements in a mobile device to communicate with peripherals. The two circuit elements communicating through the MIPI interface may be referred to as a first integrated circuit unit (INTEGRATED CIRCUIT, IC), a second integrated circuit unit, respectively. As shown in fig. 1 (a), the mobile device 100 includes therein a first integrated circuit unit 10 and a second integrated circuit unit 20. The first integrated circuit unit 10 and the second integrated circuit unit 20 each have at least one MIPI interface, interface 101 and interface 201, respectively. The interface 101 on the first integrated circuit unit 10 is connected with the interface 201 of the second integrated circuit unit 20, and data transmission and reception are realized through the connected MIPI interface.
By way of example, the first integrated circuit unit or the second integrated circuit unit that communicates using the MIPI interface may be a Central Processing Unit (CPU), a stand-alone display chip, an image processing chip, a display screen, or the like, which is not particularly limited in this embodiment. In an actual application scenario, as shown in fig. 2, the mobile device 100 may specifically include a processor (CPU) 21, a camera 22, a camera 23, a stand-alone display card 24, and a display screen 25. The independent graphics card 24 is an IC chip added to the mobile device for image enhancement or framing, simply referred to as a single-display IC. The CPU 21 can exchange data with the cameras 22 and 23 through CSI interfaces (CAMERA SERIAL INTERFACE, CSI) for the cameras in MIPI, and can exchange data with the unique IC 24 and the display screen 25 through DSI interfaces (DISPLAY SERIAL INTERFACE, DSI) for the display modules in MIPI. The single-display IC 24 can be used for image enhancement and frame insertion, so that the dynamic range of video image quality is improved, the image quality is enabled to be inserted from original 60fps to 120fps, and the effects of night scene photographing, clearer video recording and the like are achieved. For example, the first integrated circuit unit may be the CPU 21, and the second integrated circuit unit may be the display screen 25, so that the CPU 21 may send an instruction through its MIPI interface connected to the display screen 25, communicate with the display screen 25, and control the display screen to display.
When the mobile device is to be lit, the CPU 21 may send a signal to the unique IC 24 via the MIPI interface, and the unique IC 24 may trigger the display 25 to be lit. After the MIPI signal sent from the CPU 21 is attenuated by the loss of the trace and the unique display IC 24, if the amplitude is smaller than the amplitude standard required by the display screen, the display screen 25 cannot display normally.
In the embodiment of the present application, an integrated circuit unit/chip may be added to the mobile device, and the integrated circuit unit may be referred to as an enhanced circuit unit, an enhanced IC, an enhanced chip, or the like, and the embodiment is not limited thereto. As shown in fig. 1 (b), a first integrated circuit unit 10, a second integrated circuit unit 20, and an enhanced circuit unit 30 may be included in a mobile device 200, and the enhanced circuit unit 30 may perform a signal processing method in an embodiment of the present application. For example, an enhancing circuit unit 30 may be added between the unique display IC 24 and the display screen 25 to enhance the MIPI signal between the unique display IC and the display screen, so as to avoid the problem that the display screen cannot display normally due to signal attenuation.
Based on this, the mobile device provided in the embodiment of the present application may include at least three integrated circuit units, as shown in fig. 1 (b). The first integrated circuit unit 10 and the second integrated circuit unit 20 each include at least one MIPI interface, and are connected to different MIPI interfaces of the enhancement circuit unit 30 (hereinafter referred to as enhancement IC) through MIPI interfaces. The enhanced IC includes at least two MIPI interfaces, such as interface 301 and sum interface 302. Wherein interface 301 interfaces with interface 101 in first integrated circuit unit 10 and interface 302 interfaces with interface 202 in second integrated circuit unit 20. The enhancement circuit unit 30 is operative to implement the signal processing method provided in this embodiment.
Fig. 3 shows a flowchart of a signal processing method according to an embodiment of the present application. As shown in fig. 3, the signal processing method includes the steps of:
And 10, receiving a first signal sent by a first integrated circuit unit, and determining the minimum input voltage when the target sequence is read from the first signal, wherein the first signal is a signal of a mobile industry processor interface MIPI.
The first integrated circuit unit may be, for example, a CPU, a unique IC, or the like. The first integrated circuit unit includes an MIPI interface therein, the MIPI interface being coupled to the boost IC, and the first signal transmitted by the first integrated circuit unit is received by the boost IC via the MIPI interface. The first signal is a signal generated in a specific sequence for calibrating the voltage of the boost IC. The specific sequence is used as a target sequence, a target sequence such as 010101 can be preset, and when the second integrated circuit unit needs to be triggered, the first integrated circuit unit can generate a corresponding electric signal, namely a first signal, according to the target sequence and send the first signal out through the MIPI interface.
The first signal may be, for example, a signal transmitted by the first integrated circuit unit at a highest frequency in the frequency range of the MIPI. The higher the frequency of the signal, the greater the attenuation, and in the case where the frequency of the first signal is the highest frequency, the minimum input voltage to the boost IC may be determined, thereby ensuring that the boost IC is able to receive any MIPI signal of the first integrated circuit unit.
After receiving the first signal through the MIPI interface, the enhancement IC reads the sequence of the first signal and then detects whether the read sequence is a target sequence. If the read sequence is the target sequence, the enhancement IC marks the input voltage at that time as the minimum input voltage. The first integrated circuit unit, the enhancement IC, and the second integrated circuit unit are initialized by powering up according to a default configuration, that is, the input voltage and the output voltage of the enhancement IC may be default values, for example, 1V, which is not particularly limited in this embodiment.
If the correct target sequence cannot be read from the first signal at the default input voltage, the boost IC may increase the input voltage, e.g., by 50mV, 100mV, etc., with each increase detecting the sequence of the first signal until the correct target sequence can be read. The input voltage at the time when the target sequence of the first signal is read is determined as the minimum input voltage. Determining the input voltage at the correct sequence of the MIPI signals read to the first integrated circuit unit as the minimum input voltage of the boost IC ensures that it is able to match the MIPI signal at the highest voltage of the first integrated circuit unit, thereby ensuring that the MIPI signal of the first integrated circuit unit can be correctly received subsequently.
For example, the boost IC may obtain the amplitude of the first signal when the first signal is received, and increase the input voltage based on the amplitude of the first signal. For example, the input voltage of the boost IC may be increased by K times the amplitude of the first signal, or a specific value may be added thereto, which may be empirically set. After increasing the input voltage of the boost IC on the basis of the amplitude of the first signal, the sequence of the first signal may be detected again, and if the correct target sequence is not yet read after increasing the input voltage, a step, i.e. a first step, is determined, based on which the increase of the input voltage is continued. The first step may be a value of 10mV, 20mV, 30mV, or the like, which is not limited in this embodiment. The boost IC may cyclically increase the input voltage on the basis of the first step, detect a sequence of first signals each time the input voltage is increased until the correct target sequence is read, and then take the input voltage at that time as the minimum input voltage of the boost IC.
Fig. 4 shows a flow chart for determining a minimum input voltage. The boost IC may determine the minimum input voltage after receiving the first signal according to the procedure shown in fig. 4. Specifically, in step 31, the amplitude a of the first signal is detected. In step 32, it is determined whether the amplitude A is within a reference voltage range, typically a reference voltage range of 40mV to 1.2V for MIPI. If the amplitude a is within the MIPI reference voltage range, step 33 is performed. The boost IC may ignore the first signal if amplitude a is not within the MIPI reference voltage range, awaiting the next receipt. That is, the boost IC may determine whether amplitude A is greater than or equal to 40mV, if amplitude A is greater than or equal to 40mV, then the first signal meets the MIPI interface criteria. Then, in step 33, the input voltage Vin is increased according to the amplitude a. The input voltage to the boost IC may be increased by, for example, 100mV based on amplitude a, with the increased input voltage vin=a+100 mV. In addition, the input voltage may be increased in other manners, for example, 10mV, 50mV, etc. based on the amplitude a, which is not particularly limited in this embodiment.
Next, in step 34, it is detected whether the target sequence is read. If the target sequence is not read after increasing the voltage, step 35 is performed, and if the target sequence is read, step 36 is performed. In step 36, the input voltage Vin at this time is set to the minimum input voltage. That is, the input voltage of the boost IC in normal operation needs to be greater than or equal to the minimum input voltage. Referring to fig. 4, in step 35, the input voltage is increased, vin=vin+20mv, and then the process proceeds to step 34. The result of the first step is the increased input voltage Vin based on the current input voltage Vin. The first step may be 20mV, i.e. the input voltage vin=vin+20 mV after increasing. After increasing the input voltage Vin in step 35, the process goes to step 34 to loop until the target sequence is read. The final input voltage Vin is determined as the minimum input voltage of the boost IC.
Next, step 20, in case of a minimum input voltage, sends a second signal to the second integrated circuit unit based on the target sequence and detects the amplitude of the second signal received by the second integrated circuit unit.
The enhancement IC may regenerate the signal of the corresponding waveform, i.e., the second signal, according to the target sequence and send it to the second integrated circuit unit. The enhancement IC is also connected to the second integrated circuit unit via the MIPI interface, so that the second signal is also a signal sent via the MIPI interface. A feedback circuit may be provided between the enhancement IC and the second integrated circuit unit, through which feedback circuit the amplitude of the second signal received by the second integrated circuit unit is detected.
And 30, determining the minimum output voltage according to the amplitude of the second signal received by the second integrated circuit unit.
The amplitude of the second signal needs to match the standard amplitude of the second integrated circuit unit, and if the amplitude of the second signal is smaller than the standard amplitude of the second integrated circuit unit, the second signal cannot be read correctly by the second integrated circuit unit. The output voltage of the second integrated circuit unit may be a default value, e.g. 1V, etc., at power-up initialization. The boost IC may determine whether the amplitude of the second signal detected by the feedback is less than the standard amplitude of the second integrated circuit unit, and increase the output voltage in case it is determined that the amplitude of the second signal is less than the standard amplitude of the second integrated circuit unit. If the amplitude of the second signal is not less than the standard amplitude of the second signal, the current output voltage is determined as the minimum output voltage. The voltage which can be received by the second integrated circuit unit is determined to be the minimum output voltage, so that the MIPI signal sent by the enhancement IC can meet the requirement of the second integrated circuit unit, and the second integrated circuit unit can be ensured to normally receive the MIPI signal.
For example, the boost IC may be stepped up based on a predetermined step as the output voltage is increased. This step serves as the second step. Specifically, as shown in fig. 5, the process of increasing the output voltage includes:
Step 41, generating a second signal of the target sequence. The enhancement IC may generate a second signal according to the target sequence at the default output voltage Vout, where the generated second signal is sent out through the MIPI interface with the second integrated circuit unit, and reaches the second integrated circuit unit through attenuation of the routing loss. And 42, acquiring the amplitude C of a second signal of the second integrated circuit unit through a feedback circuit. Step 43, calculating the difference Z between the amplitude C and the standard amplitude S of the second integrated circuit unit, i.e. z=c-S. Step 44, judging whether Z is smaller than 0, if Z is larger than or equal to 0, executing step 46, and if Z is smaller than 0, executing step 45, and entering a loop, as shown in FIG. 5. Step 45, adjusting the output voltage in such a way that vout=vout+z×k. Wherein K is the second step, and ZxK is the current increasing amplitude of the output voltage Vout, and ZxK is increased on the basis of the current output voltage Vout, so as to obtain the regulated output voltage Vout. Increasing the present output voltage by a factor of the second step may linearly increase the output voltage such that the output voltage is in a linear relationship with the second signal, thereby enhancing the second signal. Then, the process goes to step 41 again, the second signal is outputted again with the increased output voltage, and the loop is sequentially repeated until the amplitude C of the second signal is greater than or equal to the standard amplitude S in step 44, and the loop is exited. In step 46, the output voltage Vout is recorded as the minimum output voltage. And the final output voltage is the minimum output voltage after the cycle is finished. After determining the minimum output voltage, the output voltage of the boost IC may be set to be greater than or greater than the minimum output voltage, that is, the output voltage of the boost IC under normal operation may take on a value in a range greater than or equal to the minimum output voltage.
Step 40, receiving the MIPI signal sent by the first integrated circuit unit under the condition of the minimum input voltage and the minimum output voltage, and sending the MIPI signal to the second integrated circuit unit again.
The input voltage of the enhancement IC needs to be above the minimum input voltage, the output voltage needs to be above the minimum output voltage, and the enhancement IC can be reset according to the range and then work normally. The enhancement IC can receive the MIPI signal of the first integrated circuit unit and transmit the enhanced MIPI signal to the second integrated circuit unit, so that the MIPI signal is ensured to be normally transmitted between the first integrated circuit unit and the second integrated circuit unit, and the problem of signal attenuation is avoided.
Next, the signal processing method and the mobile device of the present embodiment will be described using the first integrated circuit unit as a single-display IC and the second integrated circuit unit as a screen. Fig. 6 shows a circuit schematic of the mobile device. As shown in fig. 6, the mobile device includes a unique IC 51, an enhanced IC 52, and a display screen LCM 53. Wherein the enhanced IC 52 includes two sets of MIPI interfaces. The MIPI interface consists of a set of differential clocks and 1 to 3 sets of differential data, the number of sets of differential data employed being determined based on the amount of data transferred. Taking a group of differential data as an example, the first MIPI interface, which is a group of MIPI interfaces of the enhanced IC, includes a pin a1, a pin a2, a pin a3, and a pin a4, which are respectively connected to pins of the MIPI interface in the unique IC 51. The pins a1 and a2 are a group of differential data. The other group of MIPI interfaces, namely the second MIPI interface, comprises a pin b1, a pin b2, a pin b3 and a pin b4 which are respectively connected with pins of the MIPI interface 531 in the display screen LCM 53. Wherein, the pins b1 and b2 are a group of differential data. The MIPI signal is a differential signal, from which the amplitude of the signal can be determined.
Further, the enhancement IC 52 includes a detection circuit 54 and a feedback circuit 55. The detection circuit 54 interfaces with a set of differential data pins in the MIPI interface of the unique IC for detecting the amplitude of the MIPI signal. The feedback circuit 55 interfaces with a set of differential data pins in the MIPI interface of the display screen for detecting the amplitude of the MIPI signal at the display screen LCM 53.
For example, when the CPU receives an event that a key is touched to illuminate the screen in a standby or power-off condition, the CPU may send a calibration signal, i.e., a first signal, to the unique IC 51 at the highest frequency used on the MIPI interface. The unique IC 51 sends the first signal to the boost IC 52 for receipt by the MIPI interface 521 of the boost IC 52, while the boost IC detects the amplitude of the first signal through the detection circuit 54. The minimum input voltage is determined based on the amplitude of the first signal. The enhancement IC 52 then regenerates the second signal to send out through MIPI interface 522, through trace loss (simply referred to as line loss) to LCM 53. At the same time, boost IC 52 detects the amplitude of the second signal via feedback circuit 55 in front of LCM 53, and determines the minimum output voltage based on the amplitude of the second signal. The first signal is identical to the sequence of the second signal. After determining the minimum input voltage and the minimum output voltage, the CPU may send a command for lighting the screen to the single-display IC 51, so that the single-display IC 51 controls the screen LCM 53 to light the screen, and perform normal display.
It should be understood that, in the above embodiment, the signal processing method is performed by setting the enhanced IC before the single-display IC and the screen, and the signal processing method provided in the present embodiment may also be applied to a CPU and a camera, a CPU and a single-display IC, or a CPU and other peripheral devices such as a CPU and a screen, which is not limited in any way.
Further, in the signal processing method provided by the embodiment of the present application, the execution body may be a signal processing device. Next, a signal processing apparatus according to an embodiment of the present application will be described by taking a signal processing method performed in the signal processing apparatus as an example.
As shown in fig. 7, the signal processing apparatus 60 provided in the embodiment of the present application may include a first receiving module 61, a first transmitting module 62, a first processing module 63, and a second processing module 64. Specifically, the first receiving module 61 is configured to receive a first signal sent by a first integrated circuit unit, determine a minimum input voltage when a target sequence is read from the first signal, where the first signal is a signal of a mobile industry processor interface MIPI, the first sending module 62 is configured to send a second signal to a second integrated circuit unit based on the target sequence and detect an amplitude of the second signal received by the second integrated circuit unit under the condition of the minimum input voltage, the first processing module 63 is configured to determine a minimum output voltage according to the amplitude of the second signal received by the second integrated circuit unit, and the second processing module 64 is configured to receive the MIPI signal sent by the first integrated circuit unit under the condition of the minimum input voltage and the minimum output voltage, and resend the MIPI signal to the second integrated circuit unit.
According to the signal processing device provided by the embodiment, the input voltage is adjusted by receiving the signal of the first integrated circuit unit, and the output voltage is adjusted by sending the signal to the second integrated circuit unit, so that the input voltage and the output voltage can be respectively matched with the first integrated circuit unit and the second integrated circuit unit, the correct transmission of the signal can be ensured, and the effectiveness of signal transmission is improved. And the amplitude of the signal can be improved by increasing the output voltage, so that the abnormal problem caused by loss of the signal in the transmission process is avoided, and the normal operation of the second integrated circuit unit is ensured.
In an exemplary embodiment, the first receiving module 61 may specifically include a first detecting unit configured to receive the first signal, detect whether the target sequence of the first signal is read, and increase the input voltage if the target sequence of the first signal is not read, and a first determining unit configured to determine the input voltage when the target sequence of the first signal is read as the minimum input voltage.
In an exemplary embodiment, the first detecting unit may include a first acquiring unit configured to acquire an amplitude of the first signal when the first signal is received, and a first increasing unit configured to increase the input voltage based on the amplitude of the first signal.
In an exemplary embodiment, the first receiving module 61 may further specifically include a second increasing unit, configured to determine a first step, and continue to increase the input voltage based on the first step, if the target sequence is not read after the input voltage is increased.
In an exemplary embodiment, the first processing module 63 may specifically include a third increasing unit configured to determine whether the amplitude of the second signal is smaller than the standard amplitude of the second integrated circuit unit, and increase the output voltage if the amplitude of the second signal is smaller than the standard amplitude, and a second determining unit configured to determine the output voltage as the minimum output voltage if the amplitude of the second signal is not smaller than the standard amplitude.
In an exemplary embodiment, the third increasing unit is specifically configured to determine a difference between the amplitude of the second signal and the standard amplitude and to increase the output voltage based on the difference.
In an exemplary embodiment, the first signal is a signal transmitted by the first integrated circuit unit based on a highest frequency within a target frequency range, wherein the target frequency range is a frequency range of the MIPI between the first integrated circuit unit and the second integrated circuit unit.
The signal processing device in the embodiment of the application can be a mobile device or a component in the mobile device, such as an integrated circuit or a chip. The mobile device may be a terminal or may be other devices than a terminal. The Mobile device may be a Mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a Mobile internet appliance (Mobile INTERNET DEVICE, MID), an augmented reality (augmented reality, AR)/Virtual Reality (VR) device, a robot, a wearable device, an ultra-Mobile personal computer, a UMPC, a netbook or a personal digital assistant (personal DIGITAL ASSISTANT, PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a Television (TV), a teller machine, a self-service machine, etc., which are not particularly limited in the embodiments of the present application.
The signal processing device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an ios operating system, or other possible operating systems, and the embodiment of the present application is not limited specifically.
The signal processing device provided in the embodiment of the present application can implement each process implemented by the embodiments of the methods in fig. 1 to 6, and in order to avoid repetition, a description is omitted here.
Optionally, as shown in fig. 8, an embodiment of the present application further provides a mobile device 700, including a processor 701 and a memory 702. The memory 702 stores a program or an instruction that can be executed on the processor 701, where the program or the instruction implements the steps of the signal processing method embodiment described above when executed by the processor 701, and the same technical effects can be achieved, and for avoiding repetition, a detailed description is omitted herein.
It should be noted that, the mobile device in the embodiment of the present application includes the mobile device and the non-mobile device described above.
Fig. 9 is a schematic hardware structure of a mobile device implementing an embodiment of the present application.
The mobile device 800 includes, but is not limited to, a radio frequency unit 801, a network module 8102, an audio output unit 803, an input unit 804, a sensor 805, a display unit 806, a user input unit 807, an interface unit 808, a memory 809, and components such as a processor 810, enhancement circuitry 811, and enhancement circuitry 812.
Those skilled in the art will appreciate that the mobile device 800 may also include a power source (e.g., a battery) for powering the various components, which may be logically connected to the processor 810 by a power management system so as to perform functions such as managing charging, discharging, and power consumption by the power management system. The mobile device structure shown in fig. 9 does not constitute a limitation of the mobile device, and the mobile device may include more or less components than illustrated, or may combine certain components, or may be arranged in different components, which are not described in detail herein.
The enhancement unit 811 is configured to receive a first signal sent by a first integrated circuit unit, determine a minimum input voltage when a target sequence is read from the first signal, where the first signal is a signal of a mobile industry processor interface MIPI, send a second signal to a second integrated circuit unit based on the target sequence under the condition of the minimum input voltage, detect an amplitude of the second signal received by the second integrated circuit unit, determine a minimum output voltage according to the amplitude of the second signal received by the second integrated circuit unit, receive the MIPI signal sent by the first integrated circuit unit under the condition of the minimum input voltage and the minimum output voltage, and resend the MIPI signal to the second integrated circuit unit. The first integrated circuit unit is a processor 810, and the second integrated circuit unit is a display unit 806.
The enhancement unit 811 is the enhancement IC described above. It should be appreciated that an enhancement unit may also be provided at other peripherals of the mobile device 800, such as an enhancement unit 811 may also be provided before the processor and input unit 804 for enhancing the MIPI signal of the processor, etc.
The input unit 804 may include a graphics processor (Graphics Processing Unit, GPU) 1041 and a microphone 8042, and the graphics processor 8041 processes image data of still pictures or video obtained by an image capturing apparatus (e.g., a camera) in a video capturing mode or an image capturing mode. The display unit 806 may include a display panel 8061, and the display panel 8061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 807 includes at least one of a touch panel 8071 and other input devices 8072. Touch panel 8071, also referred to as a touch screen. The touch panel 8071 may include two parts, a touch detection device and a touch controller. Other input devices 8072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and so forth, which are not described in detail herein.
The memory 809 can be used to store software programs as well as various data. The memory 809 may mainly include a first storage area storing programs or instructions and a second storage area storing data, wherein the first storage area may store an operating system, application programs or instructions (such as a sound playing function, an image playing function, etc.) required for at least one function, and the like. Further, the memory 809 may include volatile memory or nonvolatile memory, or the memory 809 may include both volatile and nonvolatile memory. The nonvolatile Memory may be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable EPROM (EEPROM), or a flash Memory. The volatile memory may be random access memory (Random Access Memory, RAM), static random access memory (STATIC RAM, SRAM), dynamic random access memory (DYNAMIC RAM, DRAM), synchronous Dynamic Random Access Memory (SDRAM), double data rate Synchronous dynamic random access memory (Double DATA RATE SDRAM, DDRSDRAM), enhanced Synchronous dynamic random access memory (ENHANCED SDRAM, ESDRAM), synchronous link dynamic random access memory (SYNCH LINK DRAM, SLDRAM), and Direct random access memory (DRRAM). Memory 809 in embodiments of the application includes, but is not limited to, these and any other suitable types of memory.
Processor 810 may include one or more processing units, and optionally, processor 810 integrates an application processor that primarily processes operations involving an operating system, user interface, application program, etc., and a modem processor that primarily processes wireless communication signals, such as a baseband processor. It will be appreciated that the modem processor described above may not be integrated into the processor 810.
The embodiment of the application also provides a readable storage medium, on which a program or an instruction is stored, which when executed by a processor, implements each process of the above signal processing method embodiment, and can achieve the same technical effects, and in order to avoid repetition, a detailed description is omitted here.
Wherein the processor is a processor in the mobile device described in the foregoing embodiment. The readable storage medium includes computer readable storage medium such as computer readable memory ROM, random access memory RAM, magnetic or optical disk, etc.
The embodiment of the application further provides a chip, which comprises a processor and a communication interface, wherein the communication interface is coupled with the processor, and the processor is used for running programs or instructions to realize the processes of the signal processing method embodiment, and can achieve the same technical effects, so that repetition is avoided, and the description is omitted here.
It should be understood that the chips referred to in the embodiments of the present application may also be referred to as system-on-chip chips, chip systems, or system-on-chip chips, etc.
Embodiments of the present application provide a computer program product stored in a storage medium, where the program product is executed by at least one processor to implement the respective processes of the signal processing method embodiments described above, and achieve the same technical effects, and for avoiding repetition, a detailed description is omitted herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art in the form of a computer software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal (which may be a mobile phone, a computer, a server, or a network device, etc.) to perform the method according to the embodiments of the present application.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.