CN115232594B - 一种低熔点聚氨酯热熔胶 - Google Patents
一种低熔点聚氨酯热熔胶 Download PDFInfo
- Publication number
- CN115232594B CN115232594B CN202210944876.6A CN202210944876A CN115232594B CN 115232594 B CN115232594 B CN 115232594B CN 202210944876 A CN202210944876 A CN 202210944876A CN 115232594 B CN115232594 B CN 115232594B
- Authority
- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- melting
- low
- polyurethane hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004831 Hot glue Substances 0.000 title claims abstract description 69
- 239000004814 polyurethane Substances 0.000 title claims abstract description 57
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 57
- 229920005906 polyester polyol Polymers 0.000 claims abstract description 44
- 229920001400 block copolymer Polymers 0.000 claims abstract description 37
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 36
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 36
- 239000004970 Chain extender Substances 0.000 claims abstract description 35
- 239000002994 raw material Substances 0.000 claims abstract description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 98
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 40
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 31
- 150000004985 diamines Chemical class 0.000 claims description 28
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 27
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 27
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 24
- 238000002844 melting Methods 0.000 claims description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 10
- -1 pentylene diamine Chemical class 0.000 claims description 9
- 239000001361 adipic acid Substances 0.000 claims description 7
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 claims description 6
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 6
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 6
- 229940051250 hexylene glycol Drugs 0.000 claims description 6
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims description 6
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 4
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 claims description 3
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 3
- 238000006068 polycondensation reaction Methods 0.000 claims 1
- 239000004753 textile Substances 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000011084 recovery Methods 0.000 abstract description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 20
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-butanediol Substances OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 12
- 238000005406 washing Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 7
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229940043375 1,5-pentanediol Drugs 0.000 description 4
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229940015975 1,2-hexanediol Drugs 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FHKSXSQHXQEMOK-UHFFFAOYSA-N hexane-1,2-diol Chemical group CCCCC(O)CO FHKSXSQHXQEMOK-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical class CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- WPEOOEIAIFABQP-UHFFFAOYSA-N hexanedioic acid;hexane-1,6-diol Chemical compound OCCCCCCO.OC(=O)CCCCC(O)=O WPEOOEIAIFABQP-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000747 poly(lactic acid) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004626 polylactic acid Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
- C08G18/3228—Polyamines acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4063—Mixtures of compounds of group C08G18/62 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6204—Polymers of olefins
- C08G18/6208—Hydrogenated polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6633—Compounds of group C08G18/42
- C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/6648—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3225 or C08G18/3271 and/or polyamines of C08G18/38
- C08G18/6651—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3225 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3225 or polyamines of C08G18/38
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
本发明提供一种低熔点聚氨酯热熔胶,该低熔点聚氨酯热熔胶包括以下原料组分:多异氰酸酯20~25重量份;聚酯多元醇65‑75重量份;扩链剂2~4重量份;所述的低熔点聚氨酯热熔胶还包括2~6重量份的嵌段共聚物。本发明的聚氨酯热熔胶仍保持了优良的剥离强度和耐水洗性,显著延长了产品的使用寿命;通过进一步引入少量的嵌段共聚物与各组分原料的协同配合,有效提高了热熔胶的弹性回复率,可适用于高弹纺织品的贴合。
Description
技术领域
本发明涉及一种热熔胶,具体涉及一种低熔点聚氨酯热熔胶。
背景技术
热熔胶是以热塑性材料为主要成分,利用其可加热熔融及冷却固化成型的特性来实现粘合作用。与其他胶粘剂相比,热熔胶不含溶剂,合成方便,固化时间短,粘接范围广,存储运输方便及不污染环境,近年来发展尤为迅速。可作为热熔胶热塑性材料主要有:乙烯-醋酸乙烯酯共聚物(EVA)、聚酰胺(PA)、聚烯烃、聚乳酸、热塑性聚氨酯(TPU)等。其中,TPU常温状态为固态没有粘性,保存方便,而由于含有大量的氨基甲酸酯基,在加热熔融并冷却过程中分子间的氢键可以重新形成,从而实现基材的牢固粘结,因此,TPU热熔胶的市场需求逐年增加。
目前,TPU热熔胶已广泛应用于鞋材、纺织品、医疗用品、箱包等领域。对于一些特殊纺织品来说,例如运动面料、内衣材料等高弹性材料,既要求热熔胶可在较低温度粘合且具有较强的粘接强度,又要求具备优异的回弹性和优良的耐水洗性能。然而,现有的TPU热熔胶若具备较低的软化温度,但粘结强度以及回弹性普遍不高;若提高粘结强度其软化温度、回弹性及耐水洗又难以满足需求,因而限制了在一些特殊纺织品领域的应用。
发明内容
技术问题:针对现有技术的不足,本发明的目的是提供一种低熔点聚氨酯热熔胶,在具有低硬度、低熔点的前提下,还具备优异的回弹性、粘结强度和耐水洗性能,尤其适用于高弹性纺织品的粘接。
技术方案:本发明的一种低熔点聚氨酯热熔胶包括以下原料组分:
多异氰酸酯 20~25重量份;
聚酯多元醇 65-75重量份;
扩链剂 2~4重量份;
所述的低熔点聚氨酯热熔胶还包括2~6重量份的嵌段共聚物。
所述的多异氰酸酯选自二苯基甲烷二异氰酸酯MDI、甲苯二异氰酸酯TDI、萘二异氰酸酯NDI、苯二亚甲基二异氰酸酯XDI、异佛尔酮二异氰酸酯IPDI、六亚甲基二异氰酸酯HDI或二环己基甲烷二异氰酸酯HMDI中的一种及以上。
所述的聚酯多元醇为通过脂肪族二元酸与脂肪族二元醇缩聚得到主分子链含有酯键链末端为羟基封端的数均分子量在700~1500g/mol的聚酯型多元醇。
所述的脂肪族二元酸为丁二酸、戊二酸、己二酸或庚二酸中的一种及以上。
所述的脂肪族二元醇为乙二醇、丙二醇、戊二醇、己二醇或丁二醇中的两种及以上。
所述的扩链剂为C2~C8的二元醇和C4~C8的二元胺的混合物,其中,二元醇与二元胺的摩尔比为1:3~3:1。
所述的二元醇为乙二醇、丙二醇、己二醇或丁二醇中的一种及以上。
所述的二元胺为戊二胺、丁二胺、己二胺、庚二胺、辛二胺中的一种及以上。
所述的嵌段共聚物为线性苯乙烯-乙烯-丁二烯-苯乙烯嵌段共聚物,其中,苯乙烯的质量含量为30%以上;所述的嵌段共聚物的邵氏硬度为70~85A。
本发明的低熔点聚氨酯热熔胶的制备方法为,将多异氰酸酯,聚酯多元醇,扩链剂熔融状态下混合后反应,进一步加入嵌段共聚物继续反应得到;混合后反应可采用间歇釜式反应或者连续螺杆挤出反应;可在制备所述的低熔点聚氨酯热熔胶添加本领域公知助剂,例如,抗氧剂、紫外吸收剂、抗水解剂等;上述制备过程可在催化剂存在下反应,以加快反应速率。
有益效果:本发明的一种低熔点聚氨酯热熔胶中,混合型扩链剂与聚酯多元醇的配合可有效降低热熔胶的熔点和硬度,便于后续的贴合,热熔胶的贴合温度可控制在130-150℃,此外,本发明的聚氨酯热熔胶仍保持了优良的剥离强度和耐水洗性,显著延长了产品的使用寿命;通过进一步引入少量的嵌段共聚物与各组分原料的协同配合,有效提高了热熔胶的弹性回复率,可适用于高弹纺织品的贴合。
具体实施方式
本发明的低熔点聚氨酯热熔胶包括以下原料组分:
多异氰酸酯 20~25重量份;
聚酯多元醇 65-75重量份;
扩链剂 2~4重量份;
低熔点聚氨酯热熔胶还包括2~6重量份的嵌段共聚物;更优选的,包括3~5重量份的嵌段共聚物;
所述的多异氰酸酯选自二苯基甲烷二异氰酸酯MDI,甲苯二异氰酸酯TDI,萘二异氰酸酯NDI,苯二亚甲基二异氰酸酯XDI,异佛尔酮二异氰酸酯IPDI,六亚甲基二异氰酸酯HDI,二环己基甲烷二异氰酸酯HMDI中的一种及以上;
在本发明的一些实施方案中,多异氰酸酯优选芳香族多异氰酸酯,尤其优选MDI、TDI;
作为示例的,MDI包括2,4'-MDI、4,4'-MDI中的一种及以上,TDI包括2,4-TDI和2,6-TDI;
所述的聚酯多元醇通过脂肪族二元酸与脂肪族二元醇缩聚得到主分子链含有酯键链末端为羟基封端的数均分子量在700~1500g/mol的聚酯型多元醇;
脂肪族二元酸为丁二酸,戊二酸,己二酸,庚二酸中的一种及以上;
脂肪族二元醇为乙二醇,丙二醇,戊二醇,己二醇,丁二醇中的两种及以上。
优选的,脂肪族二元醇为乙二醇,丙二醇,己二醇,丁二醇中的两种;
在本发明的一些实施方案中,脂肪族二元醇为乙二醇和丙二醇的组合,或者乙二醇和己二醇的组合,或乙二醇和丁二醇的组合,或丁二醇和己二醇的组合,优选的,两种二元醇的摩尔比为1:2~2:1,更优选的,摩尔比为1:1.5~1.5:1;
优选的,本发明实例采用的聚酯多元醇不含有支链结构;
所述的扩链剂为C2~C8的二元醇和C4~C8的二元胺混合物,二元醇与二元胺的摩尔比为1:3~3:1。
所述的二元醇为乙二醇、丙二醇、己二醇、丁二醇中的一种及以上;
所述的二元胺为戊二胺、丁二胺、己二胺、庚二胺、辛二胺中的一种及以上;
进一步的,所述的二元醇和所述的二元胺不含有支链结构;
所述的嵌段共聚物为线性苯乙烯-乙烯-丁二烯-苯乙烯嵌段共聚物SEBS,其中,苯乙烯的质量含量为30%以上;所述的嵌段共聚物的邵氏硬度为70~85A;
本发明的低熔点聚氨酯热熔胶的制备方法包括将多异氰酸酯,聚酯多元醇,扩链剂在熔融状态下混合后反应,进一步加入嵌段共聚物继续反应得到;可采用间歇釜式反应或者连续螺杆挤出反应;可在制备所述的低熔点聚氨酯热熔胶添加本领域公知助剂,例如,抗氧剂、紫外吸收剂、抗水解剂等;上述制备过程可在催化剂存在下反应,以加快反应速率,催化剂种类和添加量没有特殊要求,采用本领域常用催化剂种类和加入量即可。
本发明实例的低熔点聚氨酯热熔胶采用连续螺杆挤出反应的制备方法,具体步骤如下:
(1)多异氰酸酯、扩链剂分别在50~60℃保温,聚酯多元醇在90~110℃保温;
(2)将步骤1保温的多异氰酸酯、扩链剂、聚酯多元醇经过混合进料系统加入到双螺杆反应器中进行反应,然后添加嵌段共聚物到继续反应,最后将反应产物经过水下切粒干燥得到低熔点聚氨酯热熔胶。
为加快多异氰酸酯、扩链剂、聚酯多元醇的反应速率,本发明实例中还添加了催化剂,作为示例的,催化可采用辛酸亚锡、二月桂酸二丁基锡,添加量可控制在0.05-0.5%,以获得的低熔点聚氨酯热熔胶的质量为基准。
以下结合实例对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。
实施例1
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,4-丁二醇酯二醇(1,2-乙二醇:1,4-丁二醇的摩尔比为1:1),扩链剂为1,4-丁二醇和1,5-戊二胺(二元醇:二元胺的摩尔比为1.70:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例2
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,6-己二醇-1,4-丁二醇酯二醇(1,6-己二醇:1,4-丁二醇的摩尔比为1:1),扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为1.79:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例3
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,2-乙二醇和1,5-戊二胺(二元醇:二元胺的摩尔比为2.91:1),嵌段共聚物为线性SEBS(巴陵石化YH-501,苯乙烯的质量含量大于等于30%,邵氏硬度为72A)。
实施例4
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为0.36:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例5
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸1,5-戊二醇-1,2-乙二醇酯二醇(1,5-戊二醇:1,2-乙二醇的摩尔比为1:1),扩链剂为乙二醇和1,6-己二胺(二元醇:二元胺的摩尔比为2.09:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例6
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,6-己二醇-1,4-丁二醇酯二醇(1,6-己二醇:1,4-丁二醇的摩尔比为1:1),扩链剂为1,6-己二醇,嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例7
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,6-己二醇-1,4-丁二醇酯二醇(1,6-己二醇:1,4-丁二醇的摩尔比为1:1),扩链剂为1,6-己二胺,嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例8
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,2-乙二醇和1,5-戊二胺(二元醇:二元胺的摩尔比为2.91:1),嵌段共聚物为线性SEBS(台橡6014,苯乙烯的质量含量小于30%,邵氏硬度为69A)。
实施例9
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,2-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为0.36:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例10
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,6-己二醇和1,2-己二胺(二元醇:二元胺的摩尔比为0.36:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例11
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,2-己二醇酯二醇(1,2-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为0.36:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例12
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,2-乙二醇-1,6-己二醇酯二醇(1,6-己二醇:1,2-乙二醇的摩尔比为2:1),扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为0.36:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例13
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸1,5-戊二醇-1,2-乙二醇酯二醇(1,5-戊二醇:1,2-乙二醇的摩尔比为1:1),扩链剂为乙二醇和1,6-己二胺(二元醇:二元胺的摩尔比为2.09:1),嵌段共聚物为线性SEBS(巴陵石化YH-503,苯乙烯的质量含量大于等于30%,邵氏硬度为75A)。
实施例14
低熔点聚氨酯热熔胶包括以下原料组分:
多异氰酸酯 20.1重量份;
聚酯多元醇 75重量份;
扩链剂 2.5重量份;
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸1,5-戊二醇-1,2-乙二醇酯二醇(1,5-戊二醇:1,2-乙二醇的摩尔比为1:1),扩链剂为乙二醇和1,6-己二胺(二元醇:二元胺的摩尔比为2.09:1)。
实施例15
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸1,5-戊二醇-1,2-乙二醇酯二醇(1,5-戊二醇:1,2-乙二醇的摩尔比为1:1),扩链剂为乙二醇和1,6-己二胺(二元醇:二元胺的摩尔比为2.09:1),嵌段共聚物为线性SEPS(氢化苯乙烯-异戊二烯嵌段共聚物)。
实施例16
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,6-己二醇-1,4-丁二醇酯二醇(1,6-己二醇:1,4-丁二醇的摩尔比为6:1),扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为1.79:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例17
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,6-己二醇酯二醇,扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为1.79:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例18
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为聚1,6-己二酸-1,4-丁二醇酯二醇,扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为1.79:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
实施例19
低熔点聚氨酯热熔胶包括以下原料组分:
其中,多异氰酸酯为MDI,聚酯多元醇为摩尔比为1:1的聚1,6-己二酸-1,4-丁二醇酯二醇和聚1,6-己二酸1,6-己二醇酯二醇,扩链剂为1,6-己二醇和1,6-己二胺(二元醇:二元胺的摩尔比为1.79:1),嵌段共聚物为线性SEBS(台橡6151,苯乙烯的质量含量大于等于30%,邵氏硬度为76A)。
上述实施例1~19均采用14节双螺杆进行连续挤出反应制备:
(1)多异氰酸酯、扩链剂分别在50~60℃保温,聚酯多元醇在90~110℃保温;
(2)将步骤1保温的多异氰酸酯、扩链剂、聚酯多元醇分经过混合进料系统以250-300kg/h的添加速率,加入到双螺杆中;然后通过失重式喂料机,在第10节螺杆加入嵌段共聚物,将反应得到的聚合物经水下切粒干燥得到低熔点聚氨酯热熔胶。
将制备的实施例1~19低熔点聚氨酯热熔胶进行如下性能测试:
回弹率:将实施例1-19通过单螺杆挤出机生产成薄膜,该膜厚为0.05mm,待用。
测试薄膜的回弹性方法如下:将上述厚度0.05mm的薄膜,制成宽10mm×长50mm的薄膜,在100mm/min的拉伸速度下,拉伸到原来长度的三倍,即150mm的长度,保持该长度30min,释放薄膜承受的应力,12小时后测试长度为L:
(2)熔点:采用DSC差示扫描对聚氨酯热熔胶进行测试熔点温度。
(3)剥离强度:将聚氨酯热熔胶采用流延机淋膜至基布上,并通过贴合机于另一块基布进行热贴合得到样品,在23℃的恒温箱中放置12小时,将样品裁成宽度为25mm的样条,采用拉伸速率为100mm/min,剥离角度为180°,测试结果为3个平行样条的平均值得到剥离强度。
(4)耐水洗性:将贴合样品与3-5kg的布料或衣物混合放置洗衣机中,并加入5-10g的洗衣粉,在60℃温度下机洗45min,循环洗涤5次,将水洗后的贴合样品放置在50℃烘箱中进行干燥处理,然后将试样置于23℃恒温干燥8个小时后,裁成样条后进行剥离强度测试,得到水洗后剥离强度,计算水洗后的剥离强度与原剥离强度的比值得到耐水洗性。
性能测试结果如下:
--*:水洗后样品开胶,无法测试水洗后的剥离强度。
从上述性能测试结果可以明确看出,本发明的低熔点聚氨酯热熔胶的具备优异的回弹率和较低的熔点,其剥离强度和耐水洗性都十分优良。相较于聚醚型聚氨酯热熔胶,由于聚醚型聚氨酯粘度偏大,因此,本行业中很少使用聚醚型聚氨酯做热熔胶。相较于常规的聚酯型聚氨酯热熔胶,虽然都是采用聚酯多元醇为主要原料,但同样体系下,本发明产品熔点更低,使得贴合温度低,低温激活的状态下,剥离强度高;实施例17-19可以也可以看出,采用不同聚酯型聚氨酯热熔胶熔点偏高,剥离强度偏低,耐水性也偏差。
Claims (9)
1.一种低熔点聚氨酯热熔胶,其特征在于该低熔点聚氨酯热熔胶包括以下原料组分:
多异氰酸酯 20~25重量份;
聚酯多元醇 65-75重量份;
扩链剂 2~4重量份;
嵌段共聚物 2~5重量份;
所述的扩链剂为C2~C8的二元醇和C4~C8的二元胺的混合物,所述的二元醇和所述的二元胺不含有支链结构;
所述的嵌段共聚物为线性苯乙烯-乙烯-丁二烯-苯乙烯嵌段共聚物,其中,苯乙烯的质量含量为30%以上。
2.根据权利要求1所述的低熔点聚氨酯热熔胶,其特征在于,所述的多异氰酸酯选自二苯基甲烷二异氰酸酯MDI、甲苯二异氰酸酯TDI、萘二异氰酸酯NDI、苯二亚甲基二异氰酸酯XDI、异佛尔酮二异氰酸酯IPDI、六亚甲基二异氰酸酯HDI或二环己基甲烷二异氰酸酯HMDI中的一种及以上。
3. 根据权利要求1所述的低熔点聚氨酯热熔胶,其特征在于,所述的聚酯多元醇为通过脂肪族二元酸与脂肪族二元醇缩聚得到主分子链含有酯键链末端为羟基封端的数均分子量在700~1500 g/mol的聚酯型多元醇。
4.根据权利要求3所述的低熔点聚氨酯热熔胶,其特征在于,所述的脂肪族二元酸为丁二酸、戊二酸、己二酸或庚二酸中的一种及以上。
5.根据权利要求3所述的低熔点聚氨酯热熔胶,其特征在于,所述的脂肪族二元醇为乙二醇、丙二醇、戊二醇、己二醇或丁二醇中的两种及以上。
6.根据权利要求1所述的低熔点聚氨酯热熔胶,其特征在于,所述的二元醇与二元胺的摩尔比为1:3~3:1。
7.根据权利要求6所述的低熔点聚氨酯热熔胶,其特征在于,所述的二元醇为乙二醇、丙二醇、己二醇或丁二醇中的一种及以上。
8.根据权利要求6所述的低熔点聚氨酯热熔胶,其特征在于,所述的二元胺为戊二胺、丁二胺、己二胺、庚二胺、辛二胺中的一种及以上。
9.根据权利要求1所述的低熔点聚氨酯热熔胶,其特征在于,所述的嵌段共聚物的邵氏硬度为70~85A。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210944876.6A CN115232594B (zh) | 2022-08-08 | 2022-08-08 | 一种低熔点聚氨酯热熔胶 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210944876.6A CN115232594B (zh) | 2022-08-08 | 2022-08-08 | 一种低熔点聚氨酯热熔胶 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115232594A CN115232594A (zh) | 2022-10-25 |
CN115232594B true CN115232594B (zh) | 2023-09-01 |
Family
ID=83678766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210944876.6A Active CN115232594B (zh) | 2022-08-08 | 2022-08-08 | 一种低熔点聚氨酯热熔胶 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115232594B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105505280A (zh) * | 2015-12-31 | 2016-04-20 | 山东一诺威聚氨酯股份有限公司 | Tpu热熔胶及其制备方法 |
CN112521901A (zh) * | 2020-12-25 | 2021-03-19 | 东莞宏石功能材料科技有限公司 | 一种兼具低温贴合和高粘结强度的热塑性聚氨酯热熔胶及其制备方法 |
-
2022
- 2022-08-08 CN CN202210944876.6A patent/CN115232594B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105505280A (zh) * | 2015-12-31 | 2016-04-20 | 山东一诺威聚氨酯股份有限公司 | Tpu热熔胶及其制备方法 |
CN112521901A (zh) * | 2020-12-25 | 2021-03-19 | 东莞宏石功能材料科技有限公司 | 一种兼具低温贴合和高粘结强度的热塑性聚氨酯热熔胶及其制备方法 |
Non-Patent Citations (1)
Title |
---|
李广宇 等.《胶粘与密封新技术》.国防工业出版社,2006,(第1版),第142、146页. * |
Also Published As
Publication number | Publication date |
---|---|
CN115232594A (zh) | 2022-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3963656A (en) | Thermoplastic polyurethanes and a two-stage process for their preparation | |
KR100218208B1 (ko) | 습기경화성 우레탄 실란트 조성물 | |
EP3841177B1 (en) | Moisture curable polyurethane adhesive composition | |
JP3733170B2 (ja) | ポリウレタン樹脂 | |
WO2009123905A1 (en) | High heat resistant adhesive and sealant compositions | |
US4551518A (en) | Process for production of polyurethane | |
CN110885550B (zh) | 一种有机硅改性热塑性聚氨酯弹性体及其制备方法 | |
CN113980230B (zh) | 耐湿热型热塑性聚氨酯弹性体材料及其制备方法 | |
JPS6126612A (ja) | 耐加水分解性の良好なポリウレタンの製法 | |
US20220356383A1 (en) | Reactive Hot Melt Adhesive Composition and Use Thereof | |
EP3268407B1 (en) | Crystalline thermoplastic polyurethane composition for hot-melt adhesives | |
US6022939A (en) | Thermoplastic polyurethanes with improved melt flow | |
DE4428458A1 (de) | Cycloaliphatische thermoplastische Polyurethanelastomere | |
CN102093528A (zh) | 一种混合型聚醚-聚酯聚氨酯/环氧阻尼复合材料制备方法 | |
CN115232594B (zh) | 一种低熔点聚氨酯热熔胶 | |
CN101654503B (zh) | 高耐热线形聚氨酯树脂的合成方法 | |
US20230323173A1 (en) | Oil resistant adhesive composition | |
CN115011300A (zh) | 一种耐高温聚氨酯热熔胶及其制备方法 | |
CN113861369A (zh) | 低熔点高粘性高强度热塑性聚氨酯弹性体材料及其制备方法 | |
JPH0649166A (ja) | ポリウレタンの製造法 | |
KR101820918B1 (ko) | 핫멜트 접착제용 열가소성 폴리우레탄-우레아 수지 | |
CN110885660A (zh) | 一种用于低表面能材料的聚氨酯热熔胶及其制备方法 | |
CN118085794B (zh) | 一种热塑性聚氨酯热熔胶及其制备方法 | |
JPH0377810B2 (zh) | ||
CN115725044B (zh) | 一种热塑性聚氨酯弹性体及其制备方法和应用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |